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Interoperability Beyond Design. Sharing Knowledge between Design and Manufacturing Don Cottrell VP Emerging Technologies Si2 Corporation Thomas J. Grebinski SEMI Data Path Task Force Chair SEMI Universal Data Model Working Group Chair. Data-centric IC Designs. - PowerPoint PPT Presentation
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March 25, 2003ISQED- International Symposium on Quality Electronic Design
Interoperability Beyond Design
Sharing Knowledge between Design and Manufacturing
Don Cottrell
VP Emerging Technologies
Si2 Corporation
Thomas J. Grebinski
SEMI Data Path Task Force Chair
SEMI Universal Data Model Working Group Chair
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Data-centric IC Designs
• The IC design community is becoming more data centric.– Overcoming the issues of interoperational
efficiencies.• Common data structures for the entire IC design
data flow.
– Open data structure standards• OpenAccess and Si2• Open-source applications program interface.• Open-source reference data base for all IC
design data.• Free license for anyone to use and
redistribute..
• The realization of common expectations– within an increasingly complex, more intimately
connected and data-intensive design data flow.
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Open-source Reference Data Base and API
• OpenAccess Coalition and Si2– Click-thru internal use license
• Free access to API specification• Free access to reference database binaries
– Signed internal use and distribution license
• Free access to reference database source• Royalty-free redistribution rights (binaries
only)• Rights to distribute modifications to the
reference database (binaries only) that do not alter the API
March 25, 2003ISQED- International Symposium on Quality Electronic Design
OpenAcess Design Data Base and API
Reference DatabaseCores/Cells
GatesTransistors
Physical LayoutOASIS (planned)/GDSII
Standard API.
Commercial EDA ToolsCommercial EDA Tools University ResearchUniversity Research
Th
e r
ealiza
tion
of
com
mon
exp
ecta
tion
s
Internal Proprietary ToolsExternal Design PartnersInternal Proprietary ToolsExternal Design Partners
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Wide range of Functionality
• Design Database– Chips / Blocks / Cells– RTL to Silicon– Digital / Analog– Automated / Custom– Logical / Physical– Batch / Interactive
• Library Database– Design organization– Design management– Access control
• Technology Database
– Foundry Rules– Design Constraints
• Translators– GDS2– OASIS (planned)– LEF– DEF– Verilog (planned)– SPEF (planned)– SPICE (planned)
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Opaque View Beyond IC Design
• The data view beyond IC design is opaque after GDSII and OASIS.– Design intent is not conserved beyond GDSII and
OASIS.• GDSII and OASIS are a geometric encapsulation of
the design.• SEMI P10 and text files fed downstream are another
encapsulation (interpretation) of the design intent.• The basic design data structure has changed
substantially and thus, the design and mask engineering view up and downstream is not immediately accessible and also not clear (unambiguous).
• Different data structures between design and mask manufacturing centers.– Obscures the up and downstream view further.– Need to convert to standard record structures for
mask manufacturing.
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Mask T
ech
nic
al P
lan
nin
g D
ata
Base
Con
vers
ion
to
sta
nd
ard
re
cord
typ
es
Con
vers
ion
to
sta
nd
ard
re
cord
typ
es
IC Design Data Encapsulation for Mask Manufacturing
Ph
ysic
al Layou
t
Cells,
Core
s,
Gate
s,
Tra
nsis
tors
Geom
etr
ic
Sh
ap
es
SEM
I P
10
Text
Files
OA
SIS
GD
SII
Desig
n D
ata
Base
Inte
rnet
File T
ran
sfe
rs
OA
SIS
/GD
SII
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Mask Data Preparation and Storage
OA
SIS
/GD
SII
Mask L
ayou
t D
ata
Mask T
ech
nic
al p
lan
nin
g D
ata
Base
MIC
, M
EB
ES
, Tosh
iba
Hit
ach
i, J
EO
L,
KLA
, etc
.
Data
Fin
ish
ing
Data
Fra
ctu
re
Siz
ing,
Bia
sing,
Siz
ing,
Bia
sing,
Mask L
ayou
t
Fra
me g
enera
tion,
bar
codin
g,
test
str
uct
ure
sFra
me g
enera
tion,
bar
codin
g,
test
str
uct
ure
s
Data Preparation
Layer
Extr
acti
on
s,
Scalin
g,
Sh
rin
kin
gLayer
Extr
acti
on
s,
Scalin
g,
Sh
rin
kin
g
Tonalit
y,
Mir
rori
ng
Tonalit
y,
Mir
rori
ng
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Machine-specific Data Flow
Mask Critical Dimensions
Mask Inspection
Pattern Generation
OA
SIS
/GD
SII
Mask L
ayou
t D
ata
Mask T
ech
nic
al p
lan
nin
g D
ata
Base
MIC
, M
EB
ES
, Tosh
iba
Hit
ach
i, J
EO
L,
KLA
, etc
.Job Queue Data base
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Data Flow and Transformation in a Mask Writer
Wri
ter
Job
Qu
eu
e D
ata
Base
CFR
AC
Extr
acti
on
Ren
deri
ng
CFR
AC
Extr
acti
on
Ren
deri
ng
Mask P
att
ern
Gen
era
tion
FR
AC
Viewers- Integrity Test
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Changes in Structure and Hierarchy of Design and Manufacturing Data
Desig
n D
ata
Base
Enca
psu
lati
on F
ilter
Enca
psu
lati
on F
ilter
Reco
rd T
ypes
Filt
er
Reco
rd T
ypes
Filt
er
Data
pre
para
tion F
ilter
Data
pre
para
tion F
ilter
Tech
nic
al P
lan
nin
g D
ata
Base
Tech
nic
al P
lan
nin
g D
ata
Base
Tech
nic
al P
lan
nin
g D
ata
Base
March 25, 2003ISQED- International Symposium on Quality Electronic Design
The Fracturing of Fractured Mask Layout Data
Wri
ter
Job
Qu
eu
e D
ata
Base
CFR
AC
Extr
acti
on
Ren
deri
ng
FR
AC
CFR
AC
, Extr
act
ion a
nd R
enderi
ng F
ilter
CFR
AC
, Extr
act
ion a
nd R
enderi
ng F
ilter
FR
AC
Tech
nic
al P
lan
nin
g D
ata
Base
Mask P
att
ern
Gen
era
tion
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Design and Manufacturing Interoperability
• IC and mask design intent are lost downstream
– Numerous filters and translations of data drop design and manufacturing hierarchy.
• There is no real time direct data link to what is written on a mask.
• Which gives the IC designer an opaque view of how the design is spatially transformed onto a mask.
– Such a view is a compelling need when non-parasitic biasing and proximity corrections push a design outside acceptable IC design rules.
– Such constraints will increase as the spatial density budget for circuit elements increases.
– Such losses extends “time to market” and increase design and manufacturing costs.
– It will become increasingly important to design at a higher level of abstraction with a real-time view of what is actually writable on a mask or wafer.
– It will also become increasingly important to ensure that any movement of data is as efficient, portable and extensible as possible.
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Finer Data Granularity Expected at the Mask Pattern Generation Level
• Design and manufacturing data granularity continues to increase.
– 100 to 300 Gb files with the expectation that the cost of ownership to write or manufacture a mask does not increase.
– Job Queue and sorting data rates are reaching several hundreds of Mb/second with needed storage capacity in the Terabytes region.
– These types of demands run orthogonal to the necessary reduction of COO and a shorter time to market.
• Greater access to design data– Interconnectivity data will help improve mask layout and
engineering data processing time.• Massive parallel processing
– Sorting is fundamental for efficient massive parallel processing
– Access efficiency features, such cell reference tables and bounding boxes, accelerates transformations, such as sorting
March 25, 2003ISQED- International Symposium on Quality Electronic Design
The SEMI and OpenAccess Universal Data Model (UDM)
Standard API.
IC Design and Mask Technical Planning Data Base
Physical Design Layout
Cells, Cores, Gates, Transistors
Geometric shapes Mask layout
Write-, inspection- and CD measurement-ready data files
IC Design
DRCSimulationVerificationSynthesisEncapsulation
IC Design
DRCSimulationVerificationSynthesisEncapsulation
Mask Manufacturing
CD measurementPattern generationInspectionEncapsulation/SimulationData preparation/AssemblyFracturing/Verification
Mask Manufacturing
CD measurementPattern generationInspectionEncapsulation/SimulationData preparation/AssemblyFracturing/Verification
Hie
rarc
hic
al D
ata
Base
March 25, 2003ISQED- International Symposium on Quality Electronic Design
The SEMI and OpenAcess UDM
• One standard data base and applications program interface (API).– For design and mask manufacturing.– Access to all design and mask manufacturing
data through one common data language.
• Standard semantics for all model objects, attributes and relationships– No ambiguity between or within design and
manufacturing tasks.
• Hierarchy preserved through to mask pattern generation, CD measurements and inspection.– Unified design to manufacturing data flow and
effort.
March 25, 2003ISQED- International Symposium on Quality Electronic Design
The SEMI and OpenAcess UDM
• Full access to design and manufacturing intent up and down the design and manufacturing flow.
• Opens the door to more efficient massive parallel processing at the mask pattern generation level.
– Thread safe and data preparation• multiple threads within an application can operate on data in
parallel without the risk of one thread contaminating the data on another.
• request objects that are within a specified spatial area (e.g. a stripe)
– Query by Region for pattern generation and inspection
• multiple stripes in parallel; multiple executions.• Direct access to mask layout and DRC extraction data by
region of interest during mask inspection and CD measurement operations.
• Unlimited scalability– The model is limited only by the ability to store and
manage the data within the data base.
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Extending the reach of the UDM
.
Universal Data Model
Hie
rarc
hic
al D
ata
Base
Device manufacturing
Process characterizationParasitics development CMP Etch CVD, PECVD, Implant PSM, Lithography, etc.Mask Quality Assessment
Device manufacturing
Process characterizationParasitics development CMP Etch CVD, PECVD, Implant PSM, Lithography, etc.Mask Quality Assessment
IC Design
Mask Manufacturing
IC Design
Mask Manufacturing
Wafer process data
Process Parasitics
Standard API
March 25, 2003ISQED- International Symposium on Quality Electronic Design
UDM Status
• The technology exists today for full implementation– The reference data base and API are already
available and being used today.– Mask and wafer implementations underway
through SEMI, OpenAccess Coalition and Si2.
• It is a community resource– Change-order team in place.– Applicable to design, mask and wafer data
flows.– Applicable to high-speed and volume data
rendering and measurement applications.
• Free-use license– Free-use after release from the OpenAccess
coalition.
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Organizations Involved
• SEMI Data Path Task Force– Tom Grebinski ([email protected])
• Task Force Chair– Applicable site
• www.semi.org• www.si2.org/eda-mask
• SEMI UDM Working Group– Tom Grebinski and Don Cottrell – Working Group Co-chairs
• OpenAccess Coalition and Si2– Scott Peterson, LSI Logic (OAC Chairman)– Steve Schulz- President and CEO, Si2
([email protected])– Applicable sites
• www.openeda.org• www.si2.org /openaccess
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Companies Participating
• Cadence Design• Mentor Graphics• Synopsys• Micronic Laser
Systems• JEOL• KLA-Tencor• Applied Materials• Dai Nippon Printing• Toppan Printing• Photronics• Dupont Photomasks• STMicroelectronics• TSMC USA• Toshiba (NuFlare)• Hitachi• Hewlett-Packard
• International Sematech
• IBM• Infineon• Texas Instruments• Motorola• Philips Semiconductor• JEOL• Alcatel• Intel• AMD• SELETE/JEITA• National
Semiconductor• LSI Logic
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Moving Forward
• Critical Path Items– New members to SEMI Data Path Task
Force and Working Groups– New members to the OpenAcess Coalition
• Implementation of the mask and wafer extensions to the OpenAccess Data base and API.
• Extending and then bridging the responsibilities between design, mask and wafer manufacturing.
– Data-intensive flow integration with OpenAccess and the UDM.
• Pattern generation• Data Preparation• Mask inspection and CD measurement
– Formalize relationship between SEMI, SI2 and OpenAccess Coalition
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Successful Track Record
• Si2 and the OpenAccess Coalition– Open-Source Reference Data Base and API– Source and Binary code made available for the
model and API.• Unprecedented effort and availability
– Released to the public January 1, 2003
• SEMI Data Path Task Force– The development of a replacement for GDSII
called OASISTM.
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Successful Track Record
• OASISTM
– 64-bit Open Artwork System Interchange Standard.
• vs. 16-32 bit
– direct access to cell pointers• GDSII has only sequential access to cell data.
– 10-50 times more compact– Makes use of modality– Can mimic data organization of virtually any
writing or inspection pattern file. – Flexible property mechanism which can be
used to tag figures, arrays, and cells with as much textual and numeric information as needed by downstream processors.
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Successful Track Record
• The creation of the Universal Data Model (UDM)
– Embrace of the technology worldwide and across several industry platforms.
• A recognition of the importance of the link between design and manufacturing by the industry and the media.
– Adoption of the OpenAccess reference data model and API as the basis for the ongoing development of the UDM.
March 25, 2003ISQED- International Symposium on Quality Electronic Design
Adoption of the Technology
• The compelling need– Data granularity of an IC design and the
manufacturing of an IC continues to increase.• Closer integration of the data flow; greater opportunity
to lose design intent at a number of levels.– Greater inability with the tracking and credible use of
design and manufacturing data.
• Greater need for speed with fewer errors.– Massive parallel processes into the tera-pixels per second.
• Greater need for deign intent at the mask data preparation, pattern generation and inspection levels.
• Greater need for manufacturing intent in the design space; cross talk is there ad getting louder.
– Proximity corrections at the manufacturing level render DRC at the design level less effective. The need for a view by design at the mask production level.
• There is no choice