INTELLIGENT TOOLINGTeam 99.08

Joseph StaleyJeffrey RousheyGlenn GardnerAndrew Graybill

Design Concept ReviewBackground - Mission - ApproachCustomers - Wants - ConstraintsBenchmarkingQuality Metrics - Target ValuesConcept GenerationConcept Selection Schedule - Budget

BackgroundWhat is Metal Foam?

How is it Produced?

Why Use Metal Foam?

Project Summary MissionTo develop a sensor system that will signal the completion of the metal foaming process inside a mold.ApproachBy working together as a team, making use of the customers resources, and performing extensive research we will provide the best possible sensor system design for our problem.

Customers - Wants - Constraints

Customers

Wants

Constraints

Metrics

Chin-Jye Yu, Fraunhofer USA

High % of Successful Foams, System Simplicity / Reliability,

Low Cost

Cost, Operating Temperature,

LabVIEW, Furnace

Dimensions, Surface Defects, Max. temp, Signal Alts., Set-up time, Mold Alts., Life, Cost, Program time

Harald Eifert, Fraunhofer USA

High % of Sucessful Foams, Low Cost

Dimensions, Surface Defects, Cost

Customers - Wants - Constraints

Customers

Wants

Constraints

Metrics

Bernard McGuiness, Lab RA, FRC-DE

Jim Adkins, Lab Coordinator, FRC-DE

High % of Successful Foams, System Simplicity / Reliability

Operating Temperature,

Furnace

Dimensions, Surface Defects, Max. temp, Signal Alts., Set-up time, Mold Alts., Life

Automotive, Aerospace, Building /Construction Industries

High % of Successful Foams, System Simplicity / Reliability, Low Cost

Operating Temperature

Dimensions, Surface Defects, Max. temp, Signal Alts., Set-up time, Mold Alts., Life

System BenchmarkingDie Casting / Injection Moldinggeneral process, sensorsHigh Temperature Monitoringhigh temperature materials (Macor)data acquisitionMaterials Level Monitoringsensors

Functional BenchmarkingElectrical Properties SensorsPiezo-electric TransducerThermocoupleOptical FiberEddy Current Detector

Target Values

Metric

Target Value

Dimensions

3.5 X 3.5 X 0.5

# Surface Defects

0

Sensor System Life

5 years

Maximum Operating Temp.

700 C

# Signal Alterations

0

Programming Time

20 hours

Set-up Time

30 minutes

# Mold Alterations

0

Cost

$2,000

Critical FunctionsSense metal foaming process completionAttenuate/Amplify the sensor output signalChannel signal(s) into data acquisition cardUse LabVIEW software to interpret signals and alert user that the process is complete

Concept GenerationElectrical Circuit CompletionPiezo-Electric Force SensorThermocouple ArrayOptical FiberEddy Current Position Sensor

Concept Selection Method

Metric

Raw Score

SSD Correlation

Weighted Score

Estimated Target Value

Dimensions

4

9.89

39.56

?

# Surface Defects

3

9.89

9.67

No (1)

Sensor Sys. Life

5

13.187

65.935

Yes

Max. Op. Temp.

5

14.286

71.43

Yes

# Signal Alts.

5

9.89

49.45

Yes

Progrmg. Time

5

9.89

49.45

Yes

Set-up Time

4

9.89

39.56

Yes

# Mold Alts.

2

9.89

19.78

No (2)

Cost

5

13.187

65.935

Yes

Total Score

430.77

Concept Selection

Concept

Total Weighted Score

Electrical Circuit Completion

431

Piezo-Electric Force Plate

325

Thermocouple Array

312

Eddy Current Position Sensor

235

Optical Fiber

196

Conductivity Testing at Room Temperature

Conductivity Testing at 700 C

Schedule - Fall 98

Schedule - Spring 99

Estimated Budget

Part

Material Cost

Machining Cost

Approximate Cost

Copper Mold

$5

$495

$500

Ceramic Insulator

$150

$450

$600

Copper Electrode Large

$2

$128

$130

Copper Electrode Small

$2

$128

$130

Copper Wire

$4

$0

$4

Terminal Board

$0

$0

$0

Battery 9V

$0

$0

$0

Computer (CPU)

$0

$0

$0

Total Cost

$1,364

Future DirectionWinter Break - Build ConceptFebruary - Testing and Design IterationsMarch - Cushion PeriodApril - Final Report Preparation