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Intel® Server System S9200WK Liquid Cooled Rack Reference Design Guide
Guidelines and requirements to design rack and cabinet level solutions with the Intel® Server System S9200WK in a liquid cooled environment. Rev 1.2 February 2020
S9200WK
Intel® Server System S9200WK Liquid Cooled Rack Reference Design Guide
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Document Revision History Date Revision Changes
August 2019 1.0 First release.
December 2019 1.1 • Updated chapter 6 • Added Additional references (Appendix A)
February 2020 1.2 • Updated chapter 6
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Disclaimers Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software, or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at intel.com.
You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade.
Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-4725 or by visiting www.intel.com/design/literature.htm.
Intel and the Intel logo are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others.
© Intel Corporation
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Table of Contents 1. Introduction .................................................................................................................................................................. 9
1.1 Usage disclaimer ............................................................................................................................................................ 10 1.2 Target audience .............................................................................................................................................................. 10
2. Components Overview ............................................................................................................................................ 11 2.1 Rack and Cabinet Configuration .............................................................................................................................. 11 2.2 Facility Power ................................................................................................................................................................... 15 2.3 Configuration Components ....................................................................................................................................... 15 2.4 Server System Configuration Requirements ...................................................................................................... 15
3. Electrical Specifications .......................................................................................................................................... 17 3.1 Overall Power Budget .................................................................................................................................................. 17 3.2 Power Distribution Unit (PDU) Selection .............................................................................................................. 18
3.2.1 EU Standards Compliant PDU .................................................................................................................................. 18 3.2.2 US Standards Compliant PDU .................................................................................................................................. 18
3.3 Power Mapping ............................................................................................................................................................... 19 3.4 4 PDU Reference Design Power Mapping ............................................................................................................ 19 3.5 3 PDU Reference Design Power Mapping ............................................................................................................ 22
4. Management Network Specifications .................................................................................................................. 28 5. Mechanical Specifications ...................................................................................................................................... 32
5.1 Rack Dimensions ............................................................................................................................................................ 32 5.2 PDU ...................................................................................................................................................................................... 32 5.3 Management Switch ...................................................................................................................................................... 32 5.4 Data Switch (Fabric) ....................................................................................................................................................... 32 5.5 Liquid Cooling Manifold .............................................................................................................................................. 32 5.6 Equipment Weight Data .............................................................................................................................................. 33 5.7 Crating ................................................................................................................................................................................. 33
5.7.1 Crate Compliance Guidelines for Shipping ......................................................................................................... 34 5.8 Drawings and CAD ......................................................................................................................................................... 34
6. Thermal Specifications and Requirements ........................................................................................................ 35 6.1 Fluid Network Concept ................................................................................................................................................ 35 6.2 Boundary conditions ..................................................................................................................................................... 35 6.3 Thermal Requirements Based on CDU Selection (End of Row-Based) ................................................... 38
6.3.1 End-of-row CDU ............................................................................................................................................................. 38 6.4 Air cooling recommendations .................................................................................................................................. 38
Appendix A. Glossary ................................................................................................................................................. 40
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List of Figures Figure 1. Rack concept ............................................................................................................................................................................... 9 Figure 2. Cabinet concept ...................................................................................................................................................................... 10 Figure 3. Reference rack layout ........................................................................................................................................................... 12 Figure 4. Reference cabinet layout – front view ........................................................................................................................... 13 Figure 5. Reference cabinet layout – rear view ............................................................................................................................. 14 Figure 6. Power supply layout for 4 PDU design reference..................................................................................................... 20 Figure 7. Power mapping detail for 4 PDU design reference (PDUs 1 and 3) .................................................................. 21 Figure 8. Power mapping detail for 4 PDU design reference (PDUs 2 and 4) .................................................................. 22 Figure 9. Power supply layout for 3 PDU design reference rack ........................................................................................... 23 Figure 10. Power mapping detail (top) for 3 PDU design reference (PDUs 3 and 1) .................................................... 24 Figure 11. Power mapping detail (top) for 3 PDU design reference (PDU 2) ................................................................... 25 Figure 12. Power mapping detail (bottom) for 3 PDU design reference (PDUs 3 and 1) ............................................ 26 Figure 13. Power mapping detail (bottom) for 3 PDU design reference (PDU 2) ........................................................... 27 Figure 14. Network Cable Length Reference Layout .................................................................................................................. 28 Figure 15. Port mapping reference for Intel Omni-Path switches 3 and 4 ....................................................................... 29 Figure 16. Port mapping reference for Ethernet switches 1 and 2 ...................................................................................... 30 Figure 17. Port mapping reference for Intel Omni-Path switches 1 and 2 ....................................................................... 31 Figure 18. Rack level diagram .............................................................................................................................................................. 35 Figure 19. Minimum flow rate per rack ........................................................................................................................................... 36 Figure 20. Minimum flow rate per rack ........................................................................................................................................... 37 Figure 21. Pressure impedance per system .................................................................................................................................. 37
List of Tables Table 1. Facility power requirements ............................................................................................................................................... 15 Table 2. Recommended rack and cabinet configuration components ............................................................................. 15 Table 3. Intel® Server System S9200WK configuration ............................................................................................................ 16 Table 4. Rack power budget ................................................................................................................................................................ 17 Table 5. Cabinet power budget ........................................................................................................................................................... 17 Table 6. EU PDU ........................................................................................................................................................................................ 18 Table 7. US PDU ....................................................................................................................................................................................... 18 Table 8. Typical Intel® Server System S9200WK Configuration ........................................................................................... 19 Table 9. Quantity and type of cables used in the recommended configuration ............................................................ 29 Table 10. EU Compliant PDUs ............................................................................................................................................................. 32 Table 11. US Compliant PDUs ............................................................................................................................................................. 32 Table 12. Management Switch Spec ................................................................................................................................................. 32 Table 13. Management Switch Spec ................................................................................................................................................. 32 Table 14. Liquid cooling manifold features ................................................................................................................................... 33 Table 15. Rack weight estimates ........................................................................................................................................................ 33
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Table 16. Cabinet weight estimates .................................................................................................................................................. 33 Table 17. Equipment used for simulation ...................................................................................................................................... 36 Table 18. End-of-row CDU cooling for systems with 16GB DIMMs ..................................................................................... 38 Table 19. End-of-row CDU cooling for systems with 64GB DIMMs ..................................................................................... 38 Table 20. Product family reference collaterals............................................................................................................................. 39
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1. Introduction
This reference design guide provides an overview of the architecture components, guidelines, and other requirements for designing a rack or cabinet solution with the Intel® Server System S9200WK in a liquid cooled environment.
For the purpose of this guide, the concepts of "Rack", "Cabinet", and "Cluster" are referred to in the following context:
• Rack: A Server system rack configured with liquid cooled 2U 4-compute module systems, Ethernet switches, high speed QSFP switches, Power Distribution Units (PDUs) and a liquid cooling manifold.
Figure 1. Rack concept
• Cabinet: Two racks according to the definition presented in this guide, accompanied by an Air
Handler Unit (AHU) between them.
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Figure 2. Cabinet concept
• Cluster: A group of three or more racks or cabinets according to the definition presented in this guide.
For the rack and cabinet solution described within this guide, Intel has selected Stulz* liquid cooling products. This guide includes information concerning the hardware inside the rack, the power, cooling and network infrastructure, and the physical space it occupies.
1.1 Usage disclaimer This guide includes references to both Intel and non-Intel products but have been tested and are compatible as described. It is the responsibility of the integrator that decides against using the recommended products herein described to consult vendor datasheets and operating parameters to determine the compatibility and viability of a solution for their specific application and operating environment.
Intel Corporation cannot be held responsible for the performance of the resulting IT infrastructure configuration, failure of non-Intel components, or if any components do not operate correctly when used outside of the parameters described within this guide.
1.2 Target audience The information contained in this guide is intended for IT professionals with advanced knowledge of thermal, electrical and compute performance analysis for datacenter IT infrastructure deployments. The terminology used in this guide requires that the reader has experience performing this type of analysis and planning for datacenter IT infrastructure.
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2. Components Overview
This chapter provides an overview of the components installed inside the reference rack and cabinet as well as the power and cooling requirements to be met when designing the reference rack and cabinet configuration.
2.1 Rack and Cabinet Configuration The solution described within this guide is presented in two different configurations: rack and cabinet. The following is a high-level overview of the major components in both configurations:
Rack configuration:
• 24 server systems • 4 – Power distribution units (PDU) • 2 – Ethernet management switches • 4 - Intel® Omni-Path edge switches • 1 - Liquid cooling rack manifold
Cabinet configuration:
• 2 – Racks in accordance with the rack configuration • 1 – Air handler unit (AHU) • 1 – Rack frame for AHU
The following figures show the recommended hardware configuration when populating a rack or cabinet. Figure 3 shows the configuration for a 48U rack with 24 chassis, Ethernet switches and Intel® Omni-Path Edge Switches, enabling an optimal configuration with the shortest cables.
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Figure 3. Reference rack layout
Figure 4 and Figure 5 show the configuration for a cabinet comprised of 2 racks with systems and a cooling rack in between.
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Figure 4. Reference cabinet layout – front view
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Figure 5. Reference cabinet layout – rear view
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2.2 Facility Power The following table lists the requirements for the facility in which the rack or cabinet will be installed:
Table 1. Facility power requirements
Requirement Details
Rack input power 400VAC 3P
Power receptacles IEC 60309 3P+N+E 63A/60A OR Terminal Block
Max input current 63 A
Single Rack power load 127 KW maximum
See Section 3.1 for details on the power budget for rack and cabinet configurations
2.3 Configuration Components The following table lists the recommended components for each rack and cabinet configuration.
Table 2. Recommended rack and cabinet configuration components
Vendor Item Type Description QTY per Rack
QTY per
Cabinet
Chatsworth* Rack Frame 48U 800mm Wide 1457mm Deep Rack - Solid Doors 1 2
Chatsworth* Rack Frame 48U 700mm Wide 1457mm Deep Rack - Solid Doors 0 1
Stulz* Air Handler Cyber Row Cooling for Air in Cabinet 0 1 Intel Server 2U, 4-compute module system 24 48
Enlogic* EU Std certified PDU 400V 3Ph 45.36 KVA 63A 50Hz PDU 4 8
Raritan* US Std certified PDU 400V 3Ph 55.4 KVA 80A 50Hz PDU 4 8
Cisco*
Switch - Base Unit Catalyst 2960 1Gb Network Switch 2 4
Fan Assembly Switch Fan (front to back) 2 4 PSU Redundant PSU 4 8
Intel 100G Switch Intel® Omni-Path Edge Switch 100 Series 48 Port 2 PSU 4 8
CoolIT* Liquid Cooling part
Inlet Vertical Manifolds (Cold Water) 1 2 Outlet Vertical Manifolds (Hot Water) 1 2
Intel QSFP Cables Intel Omni-Path 100G QSFP Cables 96 192 Amphenol* Ethernet Cable CAT6 Cable - Blue 100 200
Bizlink* Power Cable C13-C14 Power Cord 84 168 --- Power Cable C14 - DIN Type 2508 Power Cord 1 2
King Slide* Rail Rack mount rail kit 24 48
Stulz*/CoolIT* Coolant
Distribution Unit (CDU)
Liquid to Liquid Cooling from Rack 0 1
Chatsworth* Rack Frame 48U 700mm Wide 1457mm Deep Rack - Solid Doors 0 1
2.4 Server System Configuration Requirements The rack and cabinet solutions described in this guide are built around the capabilities of the Intel® Server System S9200WK.
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A liquid cooled server system configured with 1U 48C 350W compute modules is recommended for a typical HPC application. However, other configurations can be utilized based on application and workload requirements. For other SKU options, contact your local Intel representative.
The following table lists the recommended configuration for the Intel® Server System S9200WK when selected to be installed in the reference rack or cabinet.
Table 3. Intel® Server System S9200WK configuration
Description Qty. per Node Qty. per System
Intel Server System S9200WK 1
Consisting of:
Intel® Server Chassis FC2000 Liquid-Cooled (2100W) 1
Intel® Compute Module S9200WK 1U Half-Width Liquid-Cooled CPU 48C 350W 4
Memory: DDR4 16GB 2R 2933 RDIMM 24 96
Storage: Intel SSD DC DCP4101 Series, M.2 PCIe Gen3 x4 512GB 22x80mm SSDPEKKA512G801 1 4
Fabric: Intel Omni-Path Host Fabric Interface Adapter 100 Series, 1 Port PCIe x16, Low Profile 100HFA016LS 1 4
2U system Rail kit 2
For more details on each configuration and other specifications, refer to the Intel® Server System S9200WK Technical Product Specification.
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3. Electrical Specifications
This chapter provides information on power budget for the:
• Rack • Air handling unit (AHU) • Cooling distribution unit (CDU) • Power distribution unit (PDU) planning and selection • Power mapping for all equipment • Network switch mapping
3.1 Overall Power Budget Table 5. Cabinet power budget lists the recommended components for each rack and cabinet configuration. The total de-rated power for a rack is 159.6KVA, and the total available power in-rack is 220KW divided into 4 PDUs at 55KW each. The following tables list the estimated power budget for both the rack and cabinet. The values are based on the following assumptions:
• Node configuration: 2 x 350W CPUs, 24 X 14W DIMMs, 2 x 15W PCIE cards • Cluster Configuration: 5 Cabinets = 10 Racks with 24 Servers each, 4 Nodes per Server, 3 end-of-row
CDUs in Parallel • Secondary Fluid: 25% Propylene Glycol Water (PG25) • Connection Points: CBG20 QD at Rack level and SCG06 at Chassis level. • Primary Fluid: ASHRAE W3 (32°C) Water at 360lpm per each end-of-row-based CDU. • 3CDUs recommended for every 960 nodes (10 racks with 24 chassis each) • 4.6lpm per chassis or 1.15lpm per compute module • Server exit temp = 50°C.
Table 4. Rack power budget
Compute Rack Qty. per rack Device Power Aggregate Power Amps @ 240V
1 2U four node server system 24 5225W 125,400W 21.7708333
2 Intel Omni-Path Edge 48-port Switch 4 230W 920W 1
3 Cisco* 2960 Catalyst 1G Network Switch 2 125W 250W 0.54
Total 126,570W
De-rated power 159,625VA
Available power in rack per PDU capacity 4 55,000W 220,000W
Table 5. Cabinet power budget
L11 Cabinet (MDC - 2 x Compute IT Racks + 1 x Cooling Rack) Qty per cabinet Device Power Aggregate Power 1 Compute Rack - 1 (24 x server systems) 2 127000W 254,000W 2 Air Handler (Cooling Rack) 1 6,100W 6,100W
Total 260,100W De-rated power 325,125VA
Cluster level Power consumption
1 Coolant Distribution Unit (CDU CHx750) 3 7500W 22,500W 2 L11 Cabinet 5 260,100W 1,300,500W
Total 1,323,000W
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De-rated power 1,653,750VA
3.2 Power Distribution Unit (PDU) Selection PDU selection is a crucial step in system design. When selecting a PDU, consider both the physical attributes (mechanical dimensions, mounting features, cord length, etc.) and electrical attributes (voltage type, power capacity, circuit breaker counts, etc.).
To power a single rack with 24 x 2U/4-Compute module systems, the PDU must be three-phase 400/415 V rated and have a power capacity range between 38 kVA to 46 kVA with 12 or more circuit breakers/branches. A higher power capacity, three-phase 400 V rated PDU is also acceptable.
With an estimate of the total actual power for all equipment around 127 kW in a single rack, the de-rated power budget for the rack is 159 kVA. A 20% safety margin is added into the rack level power design.
The following table lists the recommended components for each rack and cabinet configuration. Table 6. EU PDU and Table 7. US PDU recommended PDUs for the rack or cabinet configurations
3.2.1 EU Standards Compliant PDU
Table 6. EU PDU
Manufacturer Enlogic* 3 Phase WYE Model # EN 1185
PDU remote management YES (Non-Switched PDU) Power cord length 3.0 m
Plug type & quantity IEC309 563p6 Output receptacle/socket 36 outlets - 24 x C13, 12 x C19
Rated Input voltage 380V - 415V Nominal Input voltage 400V
Input Frequency 50 Hz Input Power Capacity 45.36 kVA
Input current (derated/max) 63A
3.2.2 US Standards Compliant PDU
Table 7. US PDU
Manufacturer Raritan* Model # PX3-5157XU-01V2
PDU remote management YES (Switched PDU) Power cord length N/A
Plug type & quantity Terminal Block Output receptacle/socket 48 x C13 (12A)
Rated Input voltage 380V - 415V Nominal Input voltage 400V
Input Frequency 50/60 Hz Input Power Capacity 52.7 kVA@380V, 57.5kVA@415V
Input current(derated/max) 80A
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3.3 Power Mapping The configuration consists of approximately 84 connections for individual power supply units for servers and switches. The power load must be distributed equally across the PDUs for the entire rack.
When the entire rack is used for a high-performance computing (HPC) application, all nodes consume approximately the same amount of power in a typically loaded configuration. The common redundant power supply units used in the Intel® Server System S9200WK operate at the higher end of their capability by splitting the load equally or accordingly when running at maximum power. Generally, if each system chassis is plugged into three different PDUs, a single PDU failure prevents all systems from running at full power. However, if two or three PSUs within the same system are plugged into one PDU and phases are balanced by evenly loading all PDUs from top to bottom, a single PDU failure affects fewer systems in the rack.
Serviceability of the server rack is improved if the chassis is plugged into power at the same unit level in the rack using the shortest possible power cable routes. The tables in this section show the recommended mapping between power supply modules and power outlets, beginning with the rack and then passing to the different PDUs. The tables are color coded for convenience.
The Intel® S9200WK Server Systems were typically configured for both the 4 PDU and 3 PDU design concepts. The configuration and measured power are shown in Table 8 below.
Table 8. Typical Intel® Server System S9200WK Configuration
Intel® Server System S9200WK Configuration
Calculated Power Consumption
(WAC)
Measured Power Consumption
- typical ambient (WAC)
Measured Power Consumption
- worst ambient (WAC)
+5% guard band
(WAC)
CPUs- 2 x 48C DIMM- 24 x 16GB 2933MTs
Fabric- 1 x OPA 4500W 4000W 4160W 4370W
Note: Deviation from the typical configuration to higher TDP configurations could result in the loss of additional server systems during PDU failures. It will require power budgeting recalculations due to the increased loading of the greater TDP configuration.
3.4 4 PDU Reference Design Power Mapping In the 4 PDU design concept, eight Intel® S9200WK Server Platforms are connected to a single PDU. Each system power supply is connected to a different phase, e.g. PSU1 (phase 1), PSU2 (phase 2), and PSU3 (phase 3). With this distribution, the loading and phases across the PDUs are well balanced and offers the greatest redundancy and uptime during a PDU failure (refer to the 4 PDU configuration images). During a single PDU failure, it is expected that the 3 remaining operational PDUs will provide enough power to the impacted server systems to remain operational without impact to system performance.
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Figure 6. Power supply layout for 4 PDU design reference
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Figure 7. Power mapping detail for 4 PDU design reference (PDUs 1 and 3)
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Figure 8. Power mapping detail for 4 PDU design reference (PDUs 2 and 4)
3.5 3 PDU Reference Design Power Mapping In a 3PDU design, there is an increased risk of losing additional server systems due to the loading and mapping of the PDUs. In this design, both the Ethernet and OPA switches are connected in a redundant fashion across different PDUs. However, for this configuration the switches share power with several server systems, thereby increasing risk of losing the switches during a single PDU failure. This risk is mitigated in the 4 PDU rack design since power to the switches is separate from the server systems.
In theory, during a single PSU failure, the 2 remaining PSUs will support all system loading unless throttling triggers (e.g. OC or OT CLST) or shutdown (e.g. OCP) occurs. The increased current drawn by the remaining PSUs will increase current loading for each PDU and its associated phase. Ideally, loss of a single PSU (and single phase) will increase loading to other 2 phases, thereby reaching the input current OC trigger. Secondly, each PDU circuit breaker is set to 20A which means that as PSU loading increases, the risk for a circuit breaker trip increases as well.
Two power mappings have been considered depending on the availability of the main power lines. Figure 10 and Figure 11 show the power mapping when the power lines come from the top of the reference rack. Figure 12 and Figure 13 show the power mapping when the power lines come from the bottom of the reference rack.
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Figure 9. Power supply layout for 3 PDU design reference rack
U#4847 PSU 1 PSU 2 PSU 34645 PSU 1 PSU 2 PSU 3
4443 PSU 1 PSU 2 PSU 34241 PSU 1 PSU 2 PSU 34039 PSU 1 PSU 2 PSU 33837 PSU 1 PSU 2 PSU 33635 PSU 1 PSU 2 PSU 33433 PSU 1 PSU 2 PSU 33231 PSU 1 PSU 2 PSU 33029 PSU 1 PSU 2 PSU 32827 PSU 1 PSU 2 PSU 32625 PSU 1 PSU 2 PSU 32423 PSU 1 PSU 2 PSU 32221 PSU 1 PSU 2 PSU 32019 PSU 1 PSU 2 PSU 31817 PSU 1 PSU 2 PSU 31615 PSU 1 PSU 2 PSU 31413 PSU 1 PSU 2 PSU 31211 PSU 1 PSU 2 PSU 3109 PSU 1 PSU 2 PSU 387 PSU 1 PSU 2 PSU 365 PSU 1 PSU 2 PSU 343 PSU 1 PSU 2 PSU 321 PSU 1 PSU 2 PSU 3
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Liquid Liquid
Rear View of the Rack
Liquid Liquid
Liquid Liquid
Liquid Liquid
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TOP FEED ORIENTATION
Figure 10. Power mapping detail (top) for 3 PDU design reference (PDUs 3 and 1)
Port type Port # Port # Port type Port type Port # Port # Port type
C19 1 6 C19 C19 1 6 C19C19 2 7 C19 C19 2 7 C19
6.52 C13 3 U47 - PSU1 U47 - PSU3 8 C13 6.52 6.52 C13 3 U43 - PSU1 U43 - PSU3 8 C13 6.52
C13 4 9 C13 C13 4 OPA1-PSU2 9 C13 1.00
6.52 C13 5 U41 - PSU1 U41 - PSU3 10 C13 6.52 6.52 C13 5 U37 - PSU1 U37 - PSU3 10 C13 6.52
13.04 C19 11 16 C19 13.04 13.04 C19 11 16 C19 14.04
C19 12 17 C19 C19 12 17 C196.52 C13 13 U35 - PSU3 U47 - PSU2 18 C13 6.52 6.52 C13 13 U31 - PSU3 U43 - PSU2 18 C13 6.52
C13 14 19 C13 C13 14 19 C136.52 C13 15 U29 - PSU3 U41 - PSU2 20 C13 6.52 6.52 C13 15 U25 - PSU3 U37 - PSU2 20 C13 6.52
13.04 C19 21 26 C19 13.04 13.04 C19 21 26 C19 13.04
C19 22 27 C19 C19 22 27 C196.52 C13 23 U35 - PSU2U35 - PSU1 28 C13 6.52 6.52 C13 23 U31 - PSU2 U31 - PSU1 28 C13 6.52
C13 24 ETH2-PSU2 29 C13 0.54 0.54 C13 24 ETH2-PSU1 ETH1-PSU2 29 C13 0.54
6.52 C13 25 U29 - PSU2U29 - PSU1 30 C13 6.52 6.52 C13 25 U25 - PSU2 U25 - PSU1 30 C13 6.52
13.04 C19 31 36 C19 13.58 13.58 C19 31 36 C19 13.58
C19 32 37 C19 C19 32 37 C196.52 C13 33 U23 - PSU1 U23 - PSU3 38 C13 6.52 6.52 C13 33 U19 - PSU1 U19 - PSU3 38 C13 6.52
C13 34 39 C13 C13 34 39 C136.52 C13 35 U17 - PSU1 U17 - PSU3 40 C13 6.52 6.52 C13 35 U13 - PSU1 U13 - PSU3 40 C13 6.52
13.04 C19 41 46 C19 13.04 13.04 C19 41 46 C19 13.04
C19 42 47 C19 C19 42 47 C196.52 C13 43 U11 - PSU3 U23 - PSU2 48 C13 6.52 6.52 C13 43 U7 - PSU3 U19 - PSU2 48 C13 6.52
C13 44 49 C13 C13 44 OPA2-PSU1 49 C13 1.00
6.52 C13 45 U5 - PSU3 U17 - PSU2 50 C13 6.52 6.52 C13 45 U1 - PSU3 U13 - PSU2 50 C13 6.52
13.04 C19 51 56 C19 13.04 13.04 C19 51 56 C19 14.04
C19 52 57 C19 C19 52 57 C196.52 C13 53 U11 - PSU2U11 - PSU1 58 C13 6.52 6.52 C13 53 U7 - PSU2 U7 - PSU1 58 C13 6.52
C13 54 OPA1-PSU2 59 C13 C13 54 59 C136.52 C13 55 U5 - PSU2 U5 - PSU1 60 C13 6.52 6.52 C13 55 U1 - PSU2 U1 - PSU1 60 C13 6.52
13.04 13.04 13.04 13.04
PDU 3 PDU 152.17 Amp 53.17 Amp52.71 Amp 52.71 Amp52.17 Amp 53.71 Amp
Total Phase Amp per Rack158.52159.60158.60
Phase 2Phase 3
Phase 3 Phase 3
Phase 1
Phase 1 Phase 1Phase 2 Phase 2
Circ
uit 1
2
Circ
uit 1
1
Circ
uit 1
2
Circ
uit 1
1
Circ
uit 8
Circ
uit 7
Circ
uit 8
Circ
uit 7
Circ
uit 1
0
Circ
uit 9
Circ
uit 1
0
Circ
uit 9
Circ
uit 4
Circ
uit 3
Circ
uit 4
Circ
uit 3
Circ
uit 6
Circ
uit 5
Circ
uit 6
Circ
uit 5
Circ
uit 2
Circ
uit 1
Circ
uit 2
Circ
uit 1
PDU1 - TopPDU3 - Top Amp@230V
Amp@230V
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TOP FEED ORIENTATION
Figure 11. Power mapping detail (top) for 3 PDU design reference (PDU 2)
Port type Port # Port # Port type
C19 1 6 C19C19 2 7 C19
6.52 C13 3 U45 - PSU1 U45 - PSU3 8 C13 6.52
1.00 C13 4 OPA1-PSU1 9 C136.52 C13 5 U39 - PSU1 U39 - PSU3 10 C13 6.52
14.04 C19 11 16 C19 13.04
C19 12 17 C196.52 C13 13 U33 - PSU3 U45 - PSU2 18 C13 6.52
C13 14 19 C136.52 C13 15 U27 - PSU3 U39 - PSU2 20 C13 6.52
13.04 C19 21 26 C19 13.04
C19 22 27 C196.52 C13 23 U33 - PSU2 U33 - PSU1 28 C13 6.52
0.54 C13 24 ETH1-PSU1 29 C136.52 C13 25 U27 - PSU2 U27 - PSU1 30 C13 6.52
13.58 C19 31 36 C19 13.04
C19 32 37 C196.52 C13 33 U21 - PSU1 U21 - PSU3 38 C13 6.52
C13 34 39 C136.52 C13 35 U15 - PSU1 U15 - PSU3 40 C13 6.52
13.04 C19 41 46 C19 13.04
C19 42 47 C196.52 C13 43 U9 - PSU3 U21 - PSU2 48 C13 6.52
1.00 C13 44 OPA2-PSU2 49 C136.52 C13 45 U3 - PSU3 U15 - PSU2 50 C13 6.52
14.04 C19 51 56 C19 13.04
C19 52 57 C196.52 C13 53 U9 - PSU2 U9 - PSU1 58 C13 6.52
C13 54 OPA1-PSU1 59 C13 1.00
6.52 C13 55 U3 - PSU2 U3 - PSU1 60 C13 6.52
13.04 14.04
PDU 253.17 Amp54.17 Amp52.71 AmpPhase 3
Phase 1Phase 2
Circ
uit 1
2
Circ
uit 1
1
Circ
uit 8
Circ
uit 7
Circ
uit 1
0
Circ
uit 9
Circ
uit 4
Circ
uit 3
Circ
uit 6
Circ
uit 5
Circ
uit 2
Circ
uit 1
PDU2 - TopAmp@230V
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BOTTOM FEED ORIENTATION
Figure 12. Power mapping detail (bottom) for 3 PDU design reference (PDUs 3 and 1)
Port type Port # Port # Port type Port type Port # Port # Port type6.52 C13 60 U47 - PSU1 U47 - PSU3 55 C13 6.52 6.52 C13 60 U43 - PSU1 U43 - PSU3 55 C13 6.52
C13 59 54 C13 C13 59 OPA1-PSU2 54 C13 1.00
6.52 C13 58 U41 - PSU1 U41 - PSU3 53 C13 6.52 6.52 C13 58 U37 - PSU1 U37 - PSU3 53 C13 6.52
C19 57 52 C19 C19 57 52 C1913.04 C19 56 51 C19 13.04 13.04 C19 56 51 C19 14.04
6.52 C13 50 U35 - PSU3 U47 - PSU2 45 C13 6.52 6.52 C13 50 U31 - PSU3 U43 - PSU2 45 C13 6.52
C13 49 44 C13 C13 49 44 C136.52 C13 48 U29 - PSU3 U41 - PSU2 43 C13 6.52 6.52 C13 48 U25 - PSU3 U37 - PSU2 43 C13 6.52
13.04 C19 47 42 C19 13.04 13.04 C19 47 42 C19 13.04
C19 46 41 C19 C19 46 41 C196.52 C13 40 U35 - PSU2U35 - PSU1 35 C13 6.52 6.52 C13 40 U31 - PSU2 U31 - PSU1 35 C13 6.52
C13 39 ETH2-PSU2 34 C13 0.54 0.54 C13 39 ETH2-PSU1 ETH1-PSU2 34 C13 0.54
6.52 C13 38 U29 - PSU2U29 - PSU1 33 C13 6.52 6.52 C13 38 U25 - PSU2 U25 - PSU1 33 C13 6.52
13.04 C19 37 32 C19 13.58 13.58 C19 37 32 C19 13.58
C19 36 31 C19 C19 36 31 C196.52 C13 30 U23 - PSU1 U23 - PSU3 25 C13 6.52 6.52 C13 30 U19 - PSU1 U19 - PSU3 25 C13 6.52
C13 29 24 C13 C13 29 24 C136.52 C13 28 U17 - PSU1 U17 - PSU3 23 C13 6.52 6.52 C13 28 U13 - PSU1 U13 - PSU3 23 C13 6.52
13.04 C19 27 22 C19 13.04 13.04 C19 27 22 C19 13.04
C19 26 21 C19 C19 26 21 C196.52 C13 20 U11 - PSU3 U23 - PSU2 15 C13 6.52 6.52 C13 20 U7 - PSU3 U19 - PSU2 15 C13 6.52
C13 19 14 C13 C13 19 OPA2-PSU1 14 C13 1.00
6.52 C13 18 U5 - PSU3 U17 - PSU2 13 C13 6.52 6.52 C13 18 U1 - PSU3 U13 - PSU2 13 C13 6.52
13.04 C19 17 12 C19 13.04 13.04 C19 17 12 C19 14.04
C19 16 11 C19 C19 16 11 C196.52 C13 10 U11 - PSU2U11 - PSU1 5 C13 6.52 6.52 C13 10 U7 - PSU2 U7 - PSU1 5 C13 6.52
C13 9 4 C13 C13 9 4 C136.52 C13 8 U5 - PSU2 U5 - PSU1 3 C13 6.52 6.52 C13 8 U1 - PSU2 U1 - PSU1 3 C13 6.52
13.04 C19 7 2 C19 13.04 13.04 C19 7 2 C19 13.04
C19 6 1 C19 C19 6 1 C19
PDU 3 PDU 152.17 Amp 53.71 Amp52.71 Amp 52.71 Amp52.17 Amp 53.17 Amp
Total Phase Amp per Rack158.60158.60158.52
Phase 3 Phase 3
Phase 1Phase 2Phase 3
Phase 1 Phase 1Phase 2 Phase 2
Circ
uit 1
Circ
uit 2
Circ
uit 1
Circ
uit 2
Circ
uit 3
Circ
uit 4
Circ
uit 3
Circ
uit 4
Circ
uit 5
Circ
uit 6
Circ
uit 5
Circ
uit 6
Circ
uit 7
Circ
uit 8
Circ
uit 7
Circ
uit 8
Circ
uit 9
Circ
uit 1
0
Circ
uit 9
Circ
uit 1
0
PDU3 - Bottom PDU1 - Bottom
Circ
uit 1
1
Circ
uit 1
2
Circ
uit 1
1
Circ
uit 1
2
Amp@230V
Amp@230V
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BOTTOM FEED ORIENTATION
Figure 13. Power mapping detail (bottom) for 3 PDU design reference (PDU 2)
Port type Port # Port # Port type6.52 C13 60 U45 - PSU1 U45 - PSU3 55 C13 6.52
1.00 C13 59 OPA1-PSU1 54 C136.52 C13 58 U39 - PSU1 U39 - PSU3 53 C13 6.52
C19 57 52 C1914.04 C19 56 51 C19 13.04
6.52 C13 50 U33 - PSU3 U45 - PSU2 45 C13 6.52
C13 49 44 C136.52 C13 48 U27 - PSU3 U39 - PSU2 43 C13 6.52
13.04 C19 47 42 C19 13.04
C19 46 41 C196.52 C13 40 U33 - PSU2 U33 - PSU1 35 C13 6.52
0.54 C13 39 ETH1-PSU1 34 C136.52 C13 38 U27 - PSU2 U27 - PSU1 33 C13 6.52
13.58 C19 37 32 C19 13.04
C19 36 31 C196.52 C13 30 U21 - PSU1 U21 - PSU3 25 C13 6.52
C13 29 24 C136.52 C13 28 U15 - PSU1 U15 - PSU3 23 C13 6.52
13.04 C19 27 22 C19 13.04
C19 26 21 C196.52 C13 20 U9 - PSU3 U21 - PSU2 15 C13 6.52
1.00 C13 19 OPA2-PSU2 14 C136.52 C13 18 U3 - PSU3 U15 - PSU2 13 C13 6.52
14.04 C19 17 12 C19 13.04
C19 16 11 C196.52 C13 10 U9 - PSU2 U9 - PSU1 5 C13 6.52
C13 9 4 C136.52 C13 8 U3 - PSU2 U3 - PSU1 3 C13 6.52
13.04 C19 7 2 C19 13.04
C19 6 1 C19
PDU 252.71 Amp53.17 Amp53.17 AmpPhase 3
Phase 1Phase 2
Circ
uit 1
Circ
uit 2
Circ
uit 3
Circ
uit 4
Circ
uit 5
Circ
uit 6
Circ
uit 7
Circ
uit 8
Circ
uit 1
2
Circ
uit 9
Circ
uit 1
0
PDU2 - Bottom
Circ
uit 1
1
Amp@230V
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4. Management Network Specifications
This chapter provides recommendations on the network mapping for the reference rack. With the cabinet being comprised of racks, the information for the reference cabinet is covered as well.
All network switches can be mounted on the side of the rack with special cutouts on the rack’s EIA vertical rail. The following figures and tables show the required port mappings for six vertically mounted switches (two Ethernet switches and four Intel® OPA switches), and the cabling layout for the rack as seen from the front. The figures are listed starting from the top of the rack and are color coded for convenience.
Figure 14. Network Cable Length Reference Layout
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Table 9. Quantity and type of cables used in the recommended configuration
Cable Type Length Left Side Right Side
QSFP28 Cables 0.5 m 24 24
1.0 m 24 24
CAT6 Ethernet cables 3 ft 20 29
6 ft 28 28
Figure 15. Port mapping reference for Intel Omni-Path switches 3 and 4
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Figure 16. Port mapping reference for Ethernet switches 1 and 2
51
Upl
ink
52 Ope
nServer
Port #
Server
Port #49 PD
U2
50 Ope
nU
36/S72
2
U48/S96
147
U48
/S95
48
U36
/S71
U35/S70
4
U47/S94
345
U47
/S93
46
U35
/S69
U34/S68
6
U46/S92
543
U46
/S91
44
U34
/S67
U33/S66
8
U45/S90
741
U45
/S89
42
U33
/S65
U32/S64
10
U44/S88
939
U44
/S87
40
U32
/S63
U31/S62
12
U43/S86
1137
U43
/S85
38
U31
/S61
U30/S60
14
U42/S84
1335
U42
/S83
36
U30
/S59
U29/S58
16
U41/S82
1533
U41
/S81
34
U29
/S57
U28/S56
18
U40/S80
1731
U40
/S79
32
U28
/S55
U27/S54
20
U39/S78
1929
U39
/S77
30
U27
/S53
U26/S52
22
U38/S76
2127
U38
/S75
28
U26
/S51
U25/S50
24
U37/S74
2325
U37
/S73
26
U25
/S49
U12/S24
26
U24/S48
2523
U24
/S47
24
U12
/S23
U11/S22
28
U23/S46
2721
U23
/S45
22
U11
/S21
U10/S20
30
U22/S44
2919
U22
/S43
20
U10
/S19
U9/S18
32
U21/S42
3117
U21
/S41
18
U9/
S17 U
8/S16
34
U20/S40
3315
U20
/S39
16
U8/
S15 U
7/S14
36
U19/S38
3513
U19
/S37
14
U7/
S13 U
6/S12
38
U18/S36
3711
U18
/S35
12
U6/
S11 U
5/S10
40
U17/S34
399
U17
/S33
10
U5/
S9U
4/S8
42
U16/S32
417
U16
/S31
8
U4/
S7U
3/S6
44
U15/S30
435
U15
/S29
6
U3/
S5U
2/S4
46
U14/S28
453
U14
/S27
4
U2/
S3U
1/S2
48
U13/S26
471
U13
/S25
2
U1/
S1 AHU
50
PDU1
49Po
rt #
Serv
er
Port
#
Serv
erPDU
3
52
CDU
51
SFP+
Top servers' ethernet cable routing direction
RJ45RJ
45
Top
serv
ers'
ethe
rnet
cab
le ro
utin
g di
rect
ion
Bottom servers' ethernet cable routing
Bott
om se
rver
s' et
hern
et c
able
rout
ing
SFP+
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Figure 17. Port mapping reference for Intel Omni-Path switches 1 and 2
48
Empt
y
32
U2/
SLD3
16
U14
/SLD
27 Server
Port #
Server
Port #
Server
Port #47
Empt
y
31
U1/
SLD1
15
U13
/SLD
25 USB
MG
MT
46
Empt
y
30
U24
/SLD
47
14
Empt
yU
14/SLD28
1
U24/SLD48
17
Empty
3345
Empt
y
29
U23
/SLD
45
13
Empt
yU
13/SLD26
2
U23/SLD46
18
Empty
3444
Empt
y
28
U12
/SLD
23
12
Empt
y Empty
3
U22/SLD44
19
Empty
3543
Empt
y
27
U11
/SLD
21
11
Empt
y Empty
4
U21/SLD42
20
Empty
3642
Empt
y
26
U22
/SLD
43
10
U10
/SLD
19U
12/SLD24
5
U2/SLD4
21
Empty
3741
Empt
y
25
U21
/SLD
41
9
U9/
SLD1
7U
11/SLD22
6
U1/SLD2
22
Empty
3840
Empt
y
24
U8/
SLD1
5
8
Empt
y Empty
7
U10/SLD20
23
Empty
3939
Empt
y
23
U7/
SLD1
3
7
Empt
y Empty
8
U9/SLD18
24
Empty
4038
Empt
y
22
U20
/SLD
39
6
U6/
SLD1
1 U8/SLD16
9
U20/SLD40
25
Empty
4137
Empt
y
21
U19
/SLD
37
5
U5/
SLD9
U7/SLD14
10
U19/SLD38
26
Empty
4236
Empt
y
20
U18
/SLD
35
4
Empt
y Empty
11
U18/SLD36
27
Empty
4335
Empt
y
19
U17
/SLD
33
3
Empt
y Empty
12
U17/SLD34
28
Empty
4434
Empt
y
18
U16
/SLD
31
2
U4/
SLD7
U6/SLD12
13
U16/SLD32
29
Empty
4533
Empt
y
17
U15
/SLD
29
1
U3/
SLD5
U5/SLD10
14
U15/SLD30
30
Empty
46M
GM
T
USB
Empty
15
U4/SLD8
31
Empty
47Po
rt #
Serv
er
Port
#
Serv
er
Port
#
Serv
erEm
pty
16
U3/SLD6
32
Empty
48
QSF
P28 Q
SFP28
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5. Mechanical Specifications
This chapter provides dimensions, weight and other mechanical specifications for some of the mentioned components used in the reference rack and cabinet configurations. Information on crating is also included.
5.1 Rack Dimensions Dimensions for the rack described in this guide are 800mm x 1450mm x 48U.
5.2 PDU The following tables list the mechanical specifications for the EU and US reference Power Distribution Units
Table 10. EU Compliant PDUs
Manufacturer Enlogic* 3 Phase WYE PDU weight 11.5 Kg
PDU dimensions (W x D x L) 59mm x 100mm x 1981mm; 2.3" x 3.9" x 78" PDU mounting Tool-less button
Table 11. US Compliant PDUs
Manufacturer Raritan* PDU weight 11.5 Kg
PDU dimensions (W x D x L) 59mm x 100mm x 1981mm; 2.3" x 3.9" x 78" PDU mounting Tool-less button
5.3 Management Switch The following table lists the Management Switch’s mechanical specifications
Table 12. Management Switch Spec
Manufacturer Cisco Model 2690
Dimensions 17.5in (W) x 16.94 in (D) x 1.75 in (H) Weight 12.9 lbs. (5.8 Kg)
5.4 Data Switch (Fabric) The following table lists the Data Switch’s mechanical specifications
Table 13. Management Switch Spec
Manufacturer Intel Model Intel® Omni-Path Edge Switch 100 Series 48
Dimensions 17.15 in x 17.3 in x 1.72 in Weight 13.64 lb. (6.2 kg)
5.5 Liquid Cooling Manifold The following table lists the features of the recommended liquid cooling manifold for the rack and cabinet configurations:
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Table 14. Liquid cooling manifold features
Feature Description Ports 24 ports 90 degree SCG06 Stäubli* liquid quick disconnects on tubes affixed to barbed fittings on manifolds Feed
Orientation Can be configured for either a top or bottom feed configuration. The bottom feed includes a Shrader* valve on
top of the inlet (cold) manifold. Leak
Mitigation Includes a solenoid on the inlet manifold (cold) and a check valve on output (hot).
Mounting The liquid cooling manifold uses mounting plates provided by CoolIT*. The mounting plates are then affixed to both the inner side of the rack and the manifolds.
5.6 Equipment Weight Data The following tables list the weight estimates for both the rack and cabinet:
Table 15. Rack weight estimates
# Part name Weight in lbs. Qty per Rack Total (lbs.) Total (kg) 1 48U Rack Frame (Solid Doors) 685 1 685 311 2 Server system (2U / 4N) 116 24 2784 1263 3 OPA Edge Switch 15 2 30 14 4 Cisco 2690 Switch 13 2 26 12 5 PDU 20 4 80 36 6 Accessories - Rails, Brackets etc. 100 1 100 45 7 Cables 50 1 50 23 8 Rack manifold 50 2 100 45 Populated compute rack Total 3855 1766
Table 16. Cabinet weight estimates
# Part name Weight in lbs. Qty per Rack Total (lbs.) Total (kg) 1 Populated compute rack 3839 2 7678 3483 2 CyberRow* 792 1 792 359 3 Empty 700mmW 1457mmD Rack 250 1 250 113 Complete L11 Cabinet Total 8720 3955
5.7 Crating All crate materials are approved per SPEC ISTA-2B. The following steps are recommended when crating the server rack:
1. Inspect the rack caster prior to loading the rack into the crate. 2. Inspect the crates before loading the rack, noting any structural defects (per factory quality
specifications).
Note: Crate includes minimum padding material to ensure a tight fit of the rack product.
3. Ensure straps are included to facilitate rack unloading. Metal straps are required for shipping. 4. Place at least 2 tilt and shock indicators inside the crate rear and side panels. 5. Place at least 1 tilt and shock indicator on external side panels. 6. Ensure pallet bolts are secured. 7. Load the rack into crate front side first. 8. Ensure crate locks are secured properly.
Note: Add accelerometers or GPS devices if required.
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5.7.1 Crate Compliance Guidelines for Shipping The crate will comply with certification requirements for overseas shipment and any certification labels required per shipping logistics will be added. Treatment and marking of the pallet must conform to the International Standards for Phytosanitary Measures, Publication no. 15 (ISPM 15) guidelines for regulating wood packaging materials in international trade.
5.8 Drawings and CAD Drawings and CAD files may be supplied upon request and on an as needed basis. Please contact your Intel support representative for details.
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6. Thermal Specifications and Requirements
This chapter provides guidelines and recommendations based on a solution configuration with an end-of-row CDU measured and cooling simulation data for cabinet configurations.
The information presented considers differences in heat produced by system memory, the power requirements presented in Chapter 3, as well as the combination of the liquid coolant flow rate with the ambient temperature. These factors directly impact the number of supported systems per rack, thus affecting the number of supported systems per cabinet.
6.1 Fluid Network Concept The pictorial diagram below shows the basic layout and elements of the fluid system.
Figure 18. Rack level diagram
6.2 Boundary conditions The operation limits of the recommended configuration for rack and cabinet are based on the following assumptions:
• 48U rack with 24, 2U form factor server systems • Direct Liquid Cooling with a Heat Capture Rate (HCR) > 80% • Computer Room Air Conditioning Unit (CRAC) to cool ~15 to 20% of heat for rack configurations • Air Handler Unit (AHU) for cabinet configurations • Fluid: 25% Propylene Glycol Water (PGW) on the secondary loop and water in the primary loop of the
heat exchanger. • Heat generated per memory DIMM: Minimum of 6W and a maximum of 14W • Facilities flow rate for primary fluid loop: 360lpm for an end-of-row CDU. • Server systems fluid exit temperature (Tfluid): below 65°C • Components cooled by Passive Cooling Loop (PCL) are assumed to have 100% heat to fluid.
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The chassis minimum flow rate and maximum inlet temperature numbers are shown in Figure 19 and Figure 20 and must not be exceeded. For example, a combination of 10°C inlet temperature and 1lpm passes but 30C and 1lpm automatically fails.
The following table lists the specific equipment used in testing the thermal requirements:
Table 17. Equipment used for simulation
Part type Vendor Model Quick disconnect for the chassis Staubli* SCG06
Quick disconnect for the rack Staubli* SCG20 End-of-row heat exchanger CoolIT* CHX750
Caution: Configuration for maximum coolant flow rate must not exceed 4.6lpm per chassis or 1.15lpm per compute module. Coolant flow rates above this value can lead to premature wear and corrosion in the chassis plumbing and the liquid cooling loop in the compute modules.
Figure 19. Minimum flow rate per rack
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Figure 20. Minimum flow rate per rack
Figure 21. Pressure impedance per system
Note: Pressure drop from rack manifold quick connects are not included in Figure 21.
y = 0.4619x2 + 2.5706x
0
2
4
6
8
10
12
14
16
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Pres
sure
Dro
p (p
si)
FLowrate (lpm) per system
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6.3 Thermal Requirements Based on CDU Selection (End of Row-Based)
6.3
The tables in this section show the maximum number of chassis that can be cooled using a single end-of-row CDU at different ASHRAE W conditions for facility water.
6.3.1 End-of-row CDU When installed in an ASHRAE compliant facility, the end-of-row CDU (CoolIT* CHx750) can cool between 4 to 8 racks with 24 systems each based on DIMM thermal power and primary fluid supply temperature. The following tables list the details of the required parameters for each DIMM type’s configuration. The values in the tables apply to racks with perforated or solid doors, and cabinet configurations where the AHU is on a separate fluid loop that does not affect the CDU supply temperature. The values are also based on a two pump, redundant CDU configuration, with fault tolerant fail-over in the event of a CDU failure.
Table 18. End-of-row CDU cooling for systems with 16GB DIMMs
Table 19. End-of-row CDU cooling for systems with 64GB DIMMs
6.4 Air cooling recommendations The reference rack and cabinet configurations described assume 84% of the heat generated is captured by the liquid cooling elements. It is recommended to select an adequate air-cooling solution to capture the remaining heat. The following is a list of requirements for air cooling planning:
• Minimum system inlet temperature: 5°C • Maximum system inlet temperature: 35°C • Maximum system exit temperature: 55°C (from nodes into power supplies) • Air flow rate per system:
o Systems with 1U compute modules: 145 cfm o Systems with 2U compute modules: 168 cfm
• 88 cubic feet per minute (cfm) per system = 52m3/hr. (at 35°C ambient temperature) • Maximum supported cfm at 100% fan speed is ~290 per chassis = 171 m3/hr.
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Additional References
For additional information about the Intel® Server System S9200WK Product Family or any of its supported accessories, refer to the following resources available at http://www.intel.com/support.
Table 20. Product family reference collaterals
For this information or software Use this document or software
For in-depth technical information about the product family
Intel® Server System S9200WK Product Family Technical Product Specification Intel® Remote Management Module 4 (Intel® RMM4) and BMC Embedded Web
Console User Guide Intel® Remote Management Module 4 Technical Product Specification Intel® Server System BIOS Setup Utility Guide Intel® Server Platform Specification Update
For system integration and service instructions Intel® Server System S9200WK Product Family Setup and Service Guide
For server configuration guidance and compatibility
Intel® Data Center Blocks Configurator (orderconfigurator.intel.com) Intel® Server System S9200WK Product Family Configuration Guide
For system firmware updates, onboard device drivers, and software
Download Center (https://downloadcenter.intel.com/search?keyword=S9200WK)
For system power budget guidance Intel® Server System S9200WK Product Family Power Budget and Thermal Configuration Tool
For a complete list of supported processors, memory, add-in cards, and peripherals
Intel® Server System S9200WK Product Family support site https://www.intel.com/content/www/us/en/support/products/192334/server-products/server-systems/intel-server-system-s9200wk-family.html
Product warranty Information Warranty Terms and Conditions (https://www.intel.com/content/www/us/en/support/services/000005886.html)
Safety and Regulatory Compliance Information Intel® Server System S9200WK Product Family Technical Product Specification
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Appendix A. Glossary
Term Definition
2U Two rack units (3.5 in.)
AHU Air Handler Unit
Cabinet Two racks with an Air Handler Unit
CDU Cooling distribution unit
Chassis Casing containing the server compute modules and fans/liquid cooling plumbing
Cluster A group of three or more racks or cabinets
CRAC Computer Room Air Conditioning Unit
DIMM Dual inline memory module
HCR Heat Capture Rate
HPC High Performance Computing
PDU Power Distribution Unit
PGW Propylene Glycol Water
PSU Power Supply Unit
Rack A server system rack
TDP Thermal Design Power