Integrated MS _Micro Electronics Syllabus- Oct 2007-Annexure II

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    Annexure II COURSE SYLLABUS

    Integrated MS Micro Electronics

    FIRST SEMESTER

    SubjectCode

    Subject Name TheoryCredits

    Lab/Tutorial

    Credits

    TotalCredits

    IME 201 Engg. Mathematics-I 03 01 04

    IME 203 Electronic Devices and Components 03 01 04

    IME 205 Network Analysis 03 01 04

    IME 207 Problem Solving Using Computers 03 01 04

    IME 209 Basic Electrical Technology 03 01 04

    TOTAL 15 05 20

    SECOND SEMESTER

    IME 202 Engg. Mathematics-II 03 01 04

    IME 204 Analog Electronic Circuits I 03 01 04IME 206 Electromagnetic Theory 03 01 04

    IME 208 Signals and Systems 03 01 04

    IME 210 Logic Design 03 01 04

    IME 212 Pulse and Digital Circuits 03 01 04

    TOTAL 18 06 24

    THIRD SEMESTER

    IME 301 Linear Algebra and its Applications 03 01 04

    IME 303 Microprocessors and Interfacing 03 01 04

    IME 305 Data Structures and Algorithms 03 01 04

    IME 307 Analog Electronic Circuits II 03 01 04

    IME 309 High Level Digital Design and Testing 03 01 04

    IME 311 Computer Architecture 03 01 04

    TOTAL 18 06 24

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    Annexure II COURSE SYLLABUS

    FOURTH SEMESTER

    IME 302 Linear and Digital Control Systems 03 01 04

    IME 304 Integrated Circuits and Systems 03 01 04

    IME 306 Advanced Logic Synthesis 03 01 04IME 308 Microcontrollers and Embedded Systems 03 01 04

    IME 310 Digital VLSI Design 03 01 04

    IME 312 Communication Systems 03 01 04

    TOTAL 18 06 24

    FIFTH SEMESTER

    IME 401 Foundations of VLSI CAD 03 01 04

    IME 403 Microelectronics Fabrication Technology 03 01 04

    IME 405 Physics of Semiconductor Devices 03 01 04

    IME 407 Digital Signal Processing 03 01 04

    IME 409 Principles of ASIC Design 03 01 04

    IME 411 Introduction to MEMS Technology 03 01 04TOTAL 18 06 24

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    Annexure II COURSE SYLLABUS

    SIXTH SEMESTER

    Subject

    Code Subject Name

    Theory

    Credits

    Lab/

    TutorialCredits

    Total

    Credits

    IME 402 Low Power VLSI Design 03 01 04

    IME 404 RF Microelectronics Chip Design 03 01 04

    IME 406 CMOS Analog Integrated Circuit

    Design03 01 04

    IME 408 Elective-I 03 01 04

    IME 410 Project -- -- 08

    TOTAL 12 04 24

    SEVENTH SEMESTER

    IME 601 Nanomaterials and Nanoelectronics 03 01 04

    IME 603 Mixed signal IC Design 03 01 04IME 605 System on Chip Design 03 01 04

    IME 607 Failure analysis and Design 03 01 04

    IME 609 Elective-II 03 01 04

    TOTAL 15 05 20

    EIGHTH SEMESTER

    Project Work -- -- 20

    TOTAL 20

    Total Number of Credits to Award Degree 180

    IME 408 Elective I:IME 408.1 Embedded System Design

    IME 408.2 Artificial Neural NetworksIME 408.3 Macroelectronics

    IME 609 Elective - II:IME 609.1 Design of Manufacturability and Yield Management

    IME 609.2 Quantum Information Science

    IME 609.3 Optical Integrated CircuitsIME 609.4 Real Time Operating System

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    Annexure II COURSE SYLLABUS

    FIRST SEMESTER

    IME 201 Engg. Mathematics I

    Fourier series, periodic functions. Eulers formulae. Fourier series of odd & even functions and

    function with arbitrary period. Half range expansions.

    Partial differential equations, basic concepts, solutions of equations involving derivatives with

    respect to one variable only. Solution by indicated transformations and separation of variables

    derivation of one dimensional wave equation (Vibrating String) and its solution by using methodof separation of variables. Simple problems. DAlemberts solution of wave equation.

    Derivation of one dimensional heat equation using Gauss divergence theorem and solution of

    one dimensional heat equation. Solution by separation of variables.

    Vector calculus- gradient divergence and curl, their physical meaning and identities. Line,

    surface and volume integrals. Simple problems - Green's theorem, divergence and Stoke'stheorems - simple applications. Curvilinear co-ordinates.

    Functions of complex variables, continuity, differentiability, analyticity, Cauchy-Reimann

    equations and properties of analytic functions. Line integrals in complex plane and basicproperties Cauchys theorem. Cauchys integral formula, derivatives of analytic functions.

    Taylor, Maclaurin and Laurent series. Residue theorem-Evaluation of standard real integralsusing contour integration.

    Conformal mapping, bilinear transformations and its properties. The mappings defined by ez, z2,

    sinz, cosz, logz, z + (1/z).

    Reference Books:

    1. B.S.Grewal, Higher Engineering Mathematics.2. E.Kreyszig, Advanced Engineering Mathematics.

    3. Murray R.Spiegel, Vector Analysis, Schaum Publishing Co.

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    Annexure II COURSE SYLLABUS

    IME 203 Electronic Devices and Components

    Unit I

    1. Semiconductors:

    Energy band theory of solids

    Metals, semiconductors and Insulators

    Extrinsic and Intrinsic semiconductorsF.D.Functions, Density of states in an energy band

    Fermi factor and Fermi level

    Mobility and conductivity effect of temperature on Fermi level

    Law of mass actionHall effect

    Work function of a metal, metal-metal junction

    Contact potentialSemi conductor junction with no-bias, forward bias and reverse bias conditions.

    Depletion width, junction capacitance.

    Junction diodes switching times, rectifier equations.

    2. PN Junction diodes and Transistors

    Application of continuity equation abrupt PN junctionCalculation of charge density at the edge of the depletion region

    Solution of continuity equation for reverse and forward bias

    PN junction, Incremental, resistance of a forward biased PNJunction, Transition capacitance and diffusion capacitance.

    Einstein Equation, PNP and NPN transistors

    Characteristics of current flow across base region of a transistor.

    3. Devices and Characteristics

    PN diode, Zener diode, Photo diode, Tunnel diode, Varactor diode, Light emitting diode

    BJT, Photo transistor, JFET, MOSFET, UJT, SCR, DIAC, TRIAC and LEDs.

    UNIT II

    1. Passive Components:

    Resistors, Capacitors, Inductors and Transformers, types and characteristics2. Integrated Circuits:

    Principles of fabrication of Ics: Thin film, MOS devices, System design

    3. Printed Circuit Technology:

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    Types, design and fabrication, Materials and fabrication process in the manufacture of Electronic

    Equipment, PCB design sequence, Artwork material, Artwork generation, Layout design and

    layout procedure, PCB design aspects of analog, digital and power electronic circuits, soldersand soldering techniques.

    Text Books:

    1. Dekkar A.J: Electrical Engineering, Materials, Prentice Hall, 1977

    2. Croisette D.le: Transistors, Prentice Hall, 19763. Millman J & Halkias: Integrated Electronics McGraw Hill International, 1971

    4. Boylestead and Nashelsky: Electronic Devices and Circuits Theory, PH India

    5. Demmer, G.W.A: modern Electronic Components, Sir Dssac PiHman and Sons Ltd.,

    London, Second Edn.6. Bosshast C.Walter: Printed Circuit Boards Design and Technology, TMH, New Delhi,

    1985.

    IME 205- Network Analysis

    Network Topology: Graph of a network, Concept of a tree and links, incidence matrix, tie-set &cut-set schedules, solution of networks, principles of duality & network transformation.

    Review of loop and node, linearly independent KVL & KCL equations. Methods of analysis of

    DC and AC networks. Network reduction using Y- transformations, Coupled circuits, Locus

    Diagram.Theorems: Superposition, Reciprocity, Thevenins, Nortons Maximum power transfer and

    Millers theorems, Tellegens theorem.

    Resonant Circuits: Series and parallel resonance, frequency response of series and parallel

    circuits, Q-factor, Bandwidth.

    Transient Behavior and Initial Conditions in Networks: Behavior of circuit element under

    switching condition and their representation. Evaluation of initial and final conditions in RL, RCand RLC circuits for AC and DC excitations.

    Laplace Transformation & its Applications: LT from Fourier Transform, Definition &properties of Laplace transforms, Inverse Laplace transform, partial fraction expansion, initial &

    final value theorem, shifting theorem, convolution integral, step, ramp and impulse functions,

    delayed functions, Laplace transform of periodic and non-periodic signals.

    One & Two Port Network Parameters: Driving point admittance & transfer function, pole-

    zero concepts of the network function. Open circuit impedance parameters, short circuit

    admittance parameters, transmission parameters, H-Parameters. Calculation of these parametersfor two port networks.

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    Annexure II COURSE SYLLABUS

    Text Books:

    NETWORK ANALYSIS, M.E. Van Valkenburg: PHINETWORK ANALYSIS AND SYNTHESIS, Franklin F.Kuo: John Wiley

    Reference:

    ELECTRIC CIRCUITS, Joseph Edminister: Schaums Series, McGraw Hill.

    IME 207 Problem Solving Using Computers

    1. Introduction to Computers:

    Block diagram of a computer, computer memories, operating system basics, working withMS-windows environment.

    Algorithms and Flow charts:

    Definitions, symbols of flowcharts, examples of flowcharts and algorithms for a variety ofproblems ranging from the reasonably simple ones such as finding the largest of 3 nos.

    largest of n numbers to relatively complicated problems such as Matrix Operations

    including Matrix.C++ Fundamentals:

    The C++ character set, identifiers and keywords, data types, variables, declarations,

    statements, C++ program structure, Simple I/O operations.

    2. Operators and Expressions:Operator precedence and associativity, arithmetic operators, relational operators, logical

    operators, increment and decrement operators, bitwise operators, assignment operators, type

    conversions.

    3. Flow of Control

    Statements and blocks, branching control, repetition control, break and continue statements.

    4. Derived Data Types:

    1-D arrays, 2-D arrays, strings, structures, pointers (pointers to simple variables, pointers toarrays, basic operation on pointers, pointers to strings), structures & unions, pointers to

    structures and their use.Functions:

    Modular programming, library functions and user defined functions, function declaration,definition and call, parameter passing techniques, function overloading, default arguments,

    inline functions. I/O format specifications.

    Introduction to Object-Oriented Programming:

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    Annexure II COURSE SYLLABUS

    Procedure oriented programming versus object oriented programming, basic concepts ofobject-oriented programming, benefits of object-oriented programming, C++ as object-oriented

    programming language.

    5. Classes and Objects:

    Class declaration, access specifiers, instantiating objects, implementing member functions,nesting member functions, friend functions, this pointer, static members, constructors and

    destructors. Basics of inheritance, operator and function overloading and polymorphism.

    6. Non-Numerical Applications:

    Use of MS-Word and Power point for preparation of documentation and presentation

    material. Introduction to Excel and its application as a non-procedural package. (6 Hrs)

    References:

    1. Object-oriented Programming with C++: - (2nd edition) E Balaguruswamy Tata McGrawHill.

    2. Information Technology Course Kit Vikas Gupta, Dreamtech Press, New Delhi, 2002.

    3. Programming with C++ Herbert Schildt.4. Object-Oriented Programming with Turbo C++ - Robert LaFore, Galgotia Publications,

    2002.

    5. C++ Programming language (3rd Edition) Bjme Stroustrup, Addison Wesley.

    6. Object-Oriented Programming with C++ and VC++ -Dr.N.V.Subba Reddy, 2001.

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    Annexure II COURSE SYLLABUS

    IME 209 Basic Electrical Technology

    DC Circuits: Review of circuit elements, independent sources, source transformation, meshcurrent and node voltage analysis of dc circuits, network reduction techniques, and star-delta &

    delta-star transformations.

    Magnetic Circuits: MMF, magnetic flux, reluctance, flux density, analogy with electric circuits,

    analysis of magnetic circuits, self and mutual inductances, expressions for self and mutual

    induced emfs.

    Single Phase AC Circuits: Representation of sinusoidal voltages and currents, RMS value and

    average value, j-operator, phasors, voltage & current relationship and instantaneous & average

    power in resistor, inductor and capacitor, reactance, impedance, admittance, analysis of circuits,complex power, active and reactive powers, power triangle, power factor, power factor

    improvement.

    Three-Phase AC Circuits: Symmetrical sinusoidal supply systems, voltage, current and power

    relationship in 3 phase balanced star & delta connected loads, analysis of three phase balanced

    star and delta connected circuits, measurement of power in single and three phase balancedloads, two wattmeter method of measurement of power.

    Transformers: Construction and principle of operation of single phase transformer, emf equation,

    turns ratio, mmf balance, no load current, transformer on load, equivalent circuit, O.C & S.C.tests, losses, efficiency and regulation. Auto transformer principle of operation.

    Three Phase Induction Motor: Types, construction, rotating magnetic field, principle of

    operation, slip, rotor induced emf, rotor frequency, rotor reactance, slip ratios, expression for

    torque developed from rotor input, Torque-slip characteristics, starters-star delta starter.

    Single Phase Induction Motor: Principle of operation, capacitor start induction motor,

    applications.

    Stepping Motors: Principle of operation, DC permanent magnet stepping motor, applications.

    References:

    1. Hughes E., Electrical Technology (73), Longman, 1995.

    2. Cotton H., Advanced Electrical Technology, Wheeler, 1983.3. Nagrath & Kothary, Electrical machines (2e), TMH, 1997.

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    Annexure II COURSE SYLLABUS

    Second Semester

    IME 202 Engineering Mathematics II

    Introduction to probability, finite sample spaces, conditional probability and independence,

    Bayes theorem, one dimensional random variable, mean, variance, Chebyshevs inequality.

    Two and higher dimensional random variables, covariance, correlation coefficient, regression,

    least squares principles of curve fitting.

    Distributions: Binomial, Poisson, uniform, normal, gamma, Chi-square and exponential, simple

    problems.

    Fourier Transforms and z-transforms, solution of difference equations using z-transforms -

    Fourier transforms, Fourier sine and cosine transforms, Parsevals identity, convolution theorem,solution of boundary value problems by Fourier Transforms.

    Interpolation and application finite differences Newtons and Lagranges Interpolation

    formulae Inverse interpolation Numerical differentiation Numerical integration

    .Trapezoidal and Simpons rules Difference equations with constant coefficients, solutions.

    Solution of system of Linear equations. Gauss-Jacobi, Gauss Seidal and relaxation methodsEigen value problems - Power method of evaluations of largest Eigen value.

    Reference Books:

    1. P.L.Meyer, Introduction to probability and Statistical Applications , Second Edn.,American Publishing Co., 1979.

    2. S.S.Sastry, Introductory methods of Numerical analysis. 2nd edn., Prentice Hall 1990

    3. Erwin Kreyszig, Advanced Engineering Mathematics, 5th edn., Wiley Eastern, 1985

    4. A.V.Oppenheim & R.W.Schafer, Digital Signal Processing edn.1975, Prentice Hall5. Hogg & Craig, Introduction to Mathematical Statistics, 4th Edn., Macmillan, 1975

    6. S.M.Ross, Introduction to probability and statistics for Engineers and Scientists, Wiley

    International , 19877. K.S.Trivedi, Probability and Statistics, Prentice Hall, 1982

    8. B.S.Grewal, Higher Engg. Mathematics, Khanna Publishers 1989,

    IME 204 Analog Electronic Circuits I

    UNIT-I

    1. Rectifiers and unregulated power supply, zener supply, zener regulator, linear voltage

    regulators, principles of switched mode power supply, Voltage doublers Quadraplers.

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    Annexure II COURSE SYLLABUS

    2. BJT characteristics: (CE and CB) biasing and stabilization of Q-point, self bias, collector

    bias, stability factors. BJT as an amplifier: Graphical analysis (DC and AC load

    line), CE, CB, CC configuration. H-parameter model and analysis, comparison of CE, CB,CC configuration and their applications (using CE model only). Composite transistors

    (darlington pair, cascade connection etc.).

    UNIT II

    3. JFET and MOSFET characteristics: Biasing and stabilization of Q-point, small signal

    analysis, CS, CD and CG configuration.

    4. Transistors at high frequency: Hybrid model, high frequency limitations (f and fT)

    5. Multistage amplifiers: Frequency response characteristics, (Log-magnitude & polar plots), Gainbandwidth product, distortion in amplifiers.

    Text Books:

    J.Millan & C.Halkias, Integrated Electronics: McGraw Hill, 1971.

    References:

    1. Millman & A.Grabel, Microelectronics 2ed. McGraw Hill, 1987.

    2. Boylestead & Nashelsky, Electronic Devices & Circuits Theory, Ed 5 PHI, 1993.

    3. Ludeman, Introduction to Electronic Devices & Circuits, SaundersCollege Pubvlishing, 1990.4.P.M.Chirlian, Analysis & Design of Integrated Electronics, 2nd edition, John Wiley, 1987.

    IME 206 Electromagnetic Theory

    Review of Vector analysis: Cartesian, Cylindrical and Spherical co-ordinate systems.

    Electrostatics: Coulomb's law and its applications; Electric field intensity and Electrostatic potential due

    to point charges, line charge, surface charge and volume charge distribution. Electric flux and electric

    flux density; gauss's law and its applications; Divergence and Gauss divergence theorem, Ohm's law,continuity equations and relaxation time; Capacitance, capacitance of coaxial cable, two-wire

    transmission lines etc; energy and energy density in electrostatic fields; boundary conditions: dielectric-

    dielectric, dielectric-conductor. Poisson's and Laplace's equations: solution to Laplace's equations for

    problems of one dimension.

    Magnetostatics: Magnetic field intensity, Biot-Savart's law; magnetic flux and magnetic flux density;

    Ampere's law and its applications; Stoke's theorem, scalar and vector magnetic potentials; Boundary

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    Annexure II COURSE SYLLABUSconditions; Faraday's laws of electromagnetic induction, motional induction in a conductor; Torque on a

    conductor; Self and Mutual inductance; Energy and energy density in a magnetic field.

    Electromagnetic Waves : Maxwell's equations in integral and point form for free space and material

    media, for sinusoidal time-varying fields; Electric and Magnetic Wave equations and their solutions;

    Uniform plane wave propagation in various media; relation between electric and magnetic fields;characteristics of plane waves in various media; Poyinting vector and complex Poyinting vector theorem,

    instantaneous and average energy in plane waves.

    Reflection of Electromagnetic Waves: Normal incidence of plane waves from dielectric-dielectric and

    dielectric- conductor medium; Transmission and reflection coefficients and Standing wave ratio; Oblique

    incidence of plane waves, Brewsters angle , total reflection. Wave polarization

    Reference Books:

    1. Jr.Hayt and Bucker, Engineering Electromagnetics,, 6th Edition , McGraw Hill.2. Martin A Plonus Applied Electromagnetics, McGraw Hill

    3. John D Kraus, Electromagnetics, 4th Edition, McGraw Hill4. Cheng, Fields, Waves and Electromagnetics, 2nd Edition, Addison Wesley.

    5. Ramo, Whinnery and Duzer, Fields and Waves in Electromagnetic systems,.

    6. Jordan and Balmain, Electromagnetic waves and Radiating systems, EE Edition

    7. Sadiku, Elements of Electro Magnetics , 3rd Edition, Oxford university

    IME 208 Signals and Systems

    Introduction: Definitions, Over view of specific systems, Classification of signals, Basic

    operations on signals, Elementary signals, Systems viewed as interconnections of operations,

    properties of systems.

    Time domain representations for Linear time-invariant systems: Introduction, Convolution:

    Impulse response representation for LTI systems, properties of the impulse responserepresentation for LTI systems, Differential and difference equation representations for LTI

    systems, Block diagram representations.

    Fourier representations for signals: Introduction, Discrete-time periodic signals: The discrete-time fourier series, continuous-time periodic signals: The fourier series, Discrete-time non-

    periodic signals: The discrete-time fourier transform, continuous-time non-periodic signals: The

    fourier transform, properties of Fourier representations.

    Applications of Fourier representations: Introduction, Frequency response of LTI systems,

    Fourier transform representations for periodic signals, convolution and modulation with mixedsignal classes, Fourier transform representation for discrete-time signals, sampling,

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    Annexure II COURSE SYLLABUS

    Reconstruction of continuous-time signals from samples, Discrete-time processing ofcontinuous-time signals.

    Z-Transform: Introduction, The Z-transform, properties of the Region of convergence,Properties of the Z-Transform, Inversion of the Z-Transform, Transform analysis of LTI

    systems, The unilateral Z-Transform.

    Text Book:

    Signals and Systems by Simon Haykin & Barry Van Veen, John Wiley.

    Reference Book:

    Signals and Systems by A.V.Oppenheim & A.S.Willsky, PHI.

    IME 210 Logic Design

    Number Systems and Codes: Positional number systems, Representation of negative

    numbers, Binary arithmetic codes, Binary arithmetic, BCD arithmetic, Excess-3 arithmetic,

    Floating point representation.

    Digital Circuits: Switching algebra & simplification of Boolean expressions. DeMorgans

    Theorem. Implementations of Boolean expressions using logic gates

    Combinational Logic Design: Combinational circuit analysis, Combinational circuit

    synthesis, Minimization methods such as Karnaugh map, VEM and Quine Mcclauskey

    methods. Timing issues, Hazards, Design of Arithmetic circuits. Multiplexers,Demultiplexers, Encoders, Decoders & Comparators, Combinational circuit design using

    MSI and LSI chips.

    Introduction to Sequential Logic: Need for sequential circuits, Binary cell, Latches and

    flip-flops. RS, D , JK ,Master-Slave JK & TFFs.

    Synchronous Sequential Circuit Design

    Synchronous and Asynchronous Counters, Shift registers & Ring counters, (qualitative

    treatment) Fundamentals of Synchronous Sequential circuits, Classification of

    synchronous machines, clocking aspects concerning flip-flops, Timing and triggeringconditions, clock skew. Analysis of Synchronous Sequential circuits, Design of

    synchronous sequential machines. State diagram, State reduction and minimization.

    Minimizing next-state and output decoders. Design of single and multi-mode counters,Sequence detectors Ring counters, Shift registers, and sequence generators.

    Asynchronous Sequential Finite State Machines:

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    Fundamentals of Asynchronous Sequential circuits. Analysis and design of AsynchronousSequential circuits. Fundamental-mode and pulse-mode Circuits. Cycles, Races and Hazards.

    MEV approach to Asynchronous design

    Reference Books:

    1. Ronald J Tocci, Digital Systems: Principles and applications, PHI 19992. M.Morris Mano, Digital Design , Second Edition, PHI 2000.

    3. Fletcher, Engg Approach to Digital Design, PHI 1993.

    4. C.H.Roth, Fundamentals of Logic Design, PWS 1995.5. Zve Kohavi, Switching and Finite Automata Theory.

    6. N.N.Biswas, Logic Design Theory, PHI 1993.

    IME 212 Pulse and Digital Circuits

    Unit-I

    Chapter 2 of Text 1 : Linear Wave Shaping (2.1 to 2.8).

    Chapter 7 of Text 1: Clipping and Comparator Circuits (7.1 , 7.2, 7.7, 7.8,7.10,7.11).Chapter 8 of Text 1: Clamping and Switching Circuits (8.1 to 8.5, 8.7, 8.8, 8.9, 8.13).

    Unit II

    Chapter 10 of Text 1: Bistable Multivibrators (10.1, 10.3 to 10.11, 10.13). (6 hrs)

    Chapter 11 of Text 1: Monostable and Astable Multivibrators (11.1, 11.4, 11.5, 11.9, 11.10,

    11.11, 11.12).Chapter 5 of Text 2: Digital Circuits.

    Chapters 8 and 9 of Text 2: 8.7, 8.8 and 8.9, 9.12 and 9.13.

    UNIT III

    Chapter 14 of Text 1 L: Voltage Time base Generators (14.1 to 14.5, 14.9, 14.11, 14.14,

    14.15). 5 Hrs.Chapter 15 of Text 1: Current Time base Generators. (15.1 to 15.3).

    Introduction to Karnaugh map. Representing the truth tables of simple gates on K-map.

    Texts:

    1. Pulse, Digital and Switching Waveforms, McGraw Hill International Editions, 1965 by

    Jacob Millman and Herbert Taub.2. Microelectronics, McGraw-Hill International Book Co. 1984 by J.Millman.

    Reference:

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    Annexure II COURSE SYLLABUS

    Solid State Pulse Circuits, III Edn. Prentice Hall, 1988 by Bell.

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    Annexure II COURSE SYLLABUS

    Third Semester

    IME 301 Linear Algebra and its Applications

    Matrices and Gaussian Elimination, The geometry of linear equations, Matrix notation and

    Matrix multiplication, Inverse and transposes, Special matrices and applications.

    Vector Spaces and linear equations, Vector spaces and subspaces , Linear Independence Basis,

    and dimension, The four fundamental subspaces , Linear transformations.

    Orthogonality: Perpendicular vectors and orthogonal subspaces , Inner products and projection

    onto lines, Projections and least square approximations, Orthogonal bases, orthogonal matrices

    and Gram-Schmidt orthogonalization., Fast Fourier Transform.

    Eigen values and Eigen vectors,The Diagonal form of matrix , Difference equation and power A k

    , Difference equation and the exponential eAt , Complex matrices , Orthogonality Vs Unitary,Similarity transformations.

    References :

    1. Strang. G. Linear algebra and its applications, Thompson

    IME 303 Microprocessors and interfacing

    UNIT-I

    1. 8086/8088 Architecture and Addressing modes.2. Instructions and assembly language programming.

    3. Assembler and advanced programming

    4. Interrupts of 8086/8088 and DOS interrupt 21 h functions.5. Intel 8086 bus cycles, instruction queue, Read/Write cycle in MIN and MAX mode,

    Reset operation, Wait state, Halt state, Hold state, Lock operation, Interrupt processing.

    6. Interfacing devices: 8205, 8286, 74138, 74244, 74245, 74148, 74373, 8282

    7. Introduction to 8085 CPU architecture register organization, 8085 Instruction set,addressing modes

    8. Instruction cycle, machine cycle, timing diagrams

    9. Programming using 8085 Instruction set10. Hardware Interfacing:

    Interfacing memory; Interfacing I/O memory mapped I/O, and I/O mapped I/O.

    and I/O mapped I/O.

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    Annexure II COURSE SYLLABUS

    11. Interrupts, Introduction to DMA (with reference to 8085 CPU).

    IME 305 Data Structures and Algorithms

    1.0 Introduction

    1.1 Algorithm Specification

    1.2 Performance Analysis

    2.0 Algorithm Analysis Techniques2.1 Analysis of Recursive Programs

    2.2 Solving Recurrence Equations

    2.3 A General Solution for a large class of Recurrences3.0 Elementary data structures

    3.1 Implementation of Lists

    3.2 Stacks3.3 Queues

    4.0 Sorting & Searching Techniques

    4.1 Quick sort, Heap sort, Merge sort

    4.2 Binary search, linear search, fibonacci search

    5.0 Operations on Sets

    5.1 Introduction to Sets5.2 A Linked- List implementation of Sets

    5.3 The Dictionary

    5.4 The Hash Table Data Structure6.0 Trees

    6.1 Basic Terminology

    6.2 Implementation of Trees6.3 Binary Trees

    7.0 Graphs

    7.1 Basic definitions

    7.2 Representation of Graphs7.3 Minimum Cost Spanning Tree

    7.4 Single Source Shortest Paths

    7.5 All-Pairs Shortest Path8.0 Algorithm Design Techniques

    8.1 Divide-and-Conquer Algorithms

    8.2 Dynamic Programming8.3 Greedy Algorithms

    8.4 Backtracking

    9.0 NP-Hard and NP-Complete Problems

    Reference Books

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    Introduction to Algorithms : Thomas H. Cormen, Charles E. Leiserson, Ronald L. Rivest.

    Design & Analysis of Algorithms : Aho, Hopcroft and Ulmann

    Data structures and algorithm analysis in C : Mark Allen Weiss

    Computer Algorithms : Ellis Horowitz, Sartaj Sahni, Sanguthevar Rajasekaran

    IME 307 Analog Electronic Circuits II

    UNIT I

    1. Feedback amplifier: Concept of feedback , Topological classification (Voltage series, Voltage

    shunt, current series, current shunt), effect of feedback on Ri, Ro and Bandwidth of amplifier,

    advantages of negative feedback

    2. Oscillators: Barkhausen Criterion for sustained oscillation, Nyquist criterion for stability ofamplifier, R-C phase shift oscillator, Weinbridge oscillators, RF oscillators (Colpitts tunedcollector /drain oscillators), crystal oscillator and frequency stability.

    3. Large Signal Amplifiers: Classification of amplifiers (Class A, B, AB & C), transformer

    coupled amplifiers, thermal runway push-pull arrangements, theoretical efficiency, distortionanalysis. Complementary & Quasi-complementary push-pull amplifiers.

    UNIT II

    4. Tuned Amplifiers: Parallel resonant circuit, quality factor & Bandwidth, single tuned capacitor

    coupled amplifier, single tuned transformer coupled amplifier, double tuned amplifier, stagger

    tuned amplifier, Neutralization.5. Modulation and Demodulation circuits: Amplitude modulation circuits (Class C amplifiers and

    square law modulation), detection circuits for AM signals, Frequency and phase modulation

    circuits, detection circuits for FM/PM Superhetrodyne receivers

    Test Books:

    1. J.Millman & C.Halkias, Integrated Electronics, McGraw Hill, 19712. Jack Smith, Modern Communication Circuits, McGraw Hill, 1986.

    References:

    1. J.Milman & A.Grabel, Microelectronics, 2ed., McGraw Hill, 1987.

    IME 309 High Level Digital Design & Testing

    A. VHDL:

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    Annexure II COURSE SYLLABUS

    1.0 Introduction to HDL based design2.0 VHDL data types.

    3.0 Operators

    4.0 Behavioral Model5.0 Subprograms

    6.0 Data flow modeling

    7.0 Structural Model

    Generic constants

    Generate statements

    Configuration statements

    B. Verilog:

    1.0 Introduction to Verilog

    2.0 Hierarchical Modeling Concepts3.0 Basic Concepts

    4.0 Modules and Ports

    5.0 Gate-Level Modeling6.0 Data flow Modeling

    7.0 Behavioral Modeling

    8.0 Tasks and Functions9.0 Modeling Techniques

    10.0 Timing and Delays

    11.0 Switch Level Modeling

    C. Testing:

    12.0 Introduction to Digital Testing

    13.0 Fault modeling

    14.0 Fault Simulation

    15.0 Testing for Single stuck faults16.0 Design For Testability (DFT)

    Ad-Hoc DFT

    Scan based designs

    Built-In Self-Test (BIST)

    Reference Books

    Introductory VHDL From Simulation to Synthesis by Sudhakar Yalamanchili, Pearson

    Education, 2001 Verilog HDL by Samir Palnitkar, Pearson Education, 2001.

    Digital Systems Testing and Testable Design by Miron A, Melvin A.B., Arthur D.F.

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    Annexure II COURSE SYLLABUS

    IME 311 Computer Architecture:

    Introduction to Microprocessors and Embedded RISC processors,CPU ArchitectureTypical Microprocessor/Microcontroller Architecture (Registers, ALU, Control Unit)

    Pipelining

    Cache (Instruction Cache, Data Cache, L1, L2, Cache policies)

    Branch prediction,Onchip Timers

    Reset Processing

    DMAInterrupts & Exceptions handling

    Instruction Set

    Programming ModelClock

    Onchip Debugging Support (JTAG, BDM)

    Onchip Components (such as ADC, DAC, PWM, etc.,)

    Floating Point UnitDual/Multi-core processors

    RISC/CISC architecture

    Virtual Memory Management

    Protected Mode

    Memory ProtectionSegmentation & Paging architectures

    Datastructures required (Page tables, TLB, etc.,)

    Memory Devices

    Memory (different Technologies such as RAM, ROM, FLASH, EEPROM, SDRAM,

    SRAM etc.,)

    Memory Controllers,Accessing modes

    I/O & Busses Peripheral Support

    Interchip Connect (I2C, SPI)

    I/O Access schemes

    Peripheral Buses (PCI, ISA)IDE interface

    Case study

    Architecture of PowerPC, 80x86, ARM, MIPS

    References:

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    Annexure II COURSE SYLLABUS1. Computer Organization ,IV Edition,V.C Hamacher,Z.G Vranseic,S.G Zaky,

    McGraw Hill International Edition, Computer Science series 1987-2nd Ed.2. Modern Computer Architecture, M.Raffiquzzaman & Rajan Chandra,Galgotia

    publications, New Delhi 19903. Computer Organization and Architecture , William Stallings ,Pearson

    4. Structured Computer Organization, Andrew Tanenbaum ,McGraw Hill5. Computer Architecture & Parallel Processing, KH Wang & F.A.Briggs

    McGraw Hill, 1984

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    Annexure II COURSE SYLLABUS

    Fourth SemesterIME 302 LINEAR AND DIGITAL CONTROL SYSTEMS.

    1. Block Diagrams and Signal flow graphs : Transfer function, Block Diagram

    Simplification of systems, Signal flow graphs, Gain formula, State diagram,

    Transfer function of discrete data systems (PTF), Zero order hold.

    2. Systems modeling : Modeling of electrical and Mechanical Systems (translational

    & Rotational ), System equations, its electrical equivalent (analogous) networks.

    3. Time Domain Analysis : Stability, Routh Hurwitz criterion, time response for

    Continuous data systems, type and order of systems, Steady state error for linear

    Systems, Unit step response for second order systems, (up to7.5 of text).

    Root locus properties and construction (8.1 to 8.3 of text).

    4. Frequency Domain Analysis : Introduction , second order prototype system

    (9.1 & 9.2 of text), Bode diagram, Gain and Phase margins, Nyquist stability

    criterion.

    5 Compensators and controllers : Proportional, Integral, PI, PD and PID controllers,

    Lead, Lag, Lead-Lag compensators.

    6. State space representation : Stability Analysis, State transition matrix, Eigen values,

    Controllability and observablity (only definitions).

    7. Digital Control systems : Stability and its tests, time response, Mapping between

    s-and Z- plane, Steady state error. (6.6, 6.7 and 7.10 from text).

    Text :

    B.C.KUO, " Automatic Control Systems", 7th Edition, PHI.

    References :

    1.Nagrath and Gopal 'Control system engineering' PHI.

    2.K.Ogata, 'Modern control engineering', 2nd Edition., PHI.

    3.D'azzo and Houpis, 'Linear Control System Analysis and Design' TMH.

    IME 304 Integrated Circuits and Systems

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    Annexure II COURSE SYLLABUSDifferential Amplifier: Analysis of differential amplifier, common mode and differential mode gains,

    CMRR, Emitter-coupled differential amplifier, differential amplifier supplied with a constant current,

    transfer characteristics.

    Operational Amplifier: Basic operational amplifier, ideal operational amplifier, Inverting operationalamplifier, noninverting amplifier, input resistance, current sources, current repeaters, active loads, level

    shifting, output stages, offset error voltages and currents, measurement of operational amplifier

    parameters.

    Linear analog systems: Sign changer, scale changer, phase shifter, summer, integrator differentiator, V

    to I and I to V converters, instrumentation amplifiers, Bridge amplifier, Analysis and Design of Active

    filters, Active resonant band pass filters, Notch filter

    Non linear analog systems: Precision AC/DC converters, peak detector, sample-and-hold systems,

    analog multiplexers and demultiplexers, log and antilog amplifiers, analog multipliers and dividers,

    comparators, Applications of comparators, regenerative comparator, square-wave and triangular-wave

    generators, pulse generator.

    Timers: Basic timer circuit, 555 timer used as astable and negative & positive edge triggered monostablemultivibrators. .

    Data Converters: Basic sampling circuits, Sample and Hold architecture, principles of DAC, DAC

    architecture, ADC architecture, building blocks of data conversion system, precision techniques, testing

    and characterization

    Phaselocked loops: Operating principles of PLL, application of PLL such as frequency multiplication,

    frequency translation, AM and FM detection, FSK demodulation, study of 565 PLL and 566 VCO.

    IC Logic families: Transistor as a switch, Logic families and their characteristics Bipolar logic, TTL

    logic open collector, Totem pole and tri state, CMOS logic, CMOS-TTL interfacing.

    Reference Books:

    1. Jacob Millman , Microelectronics: Digital and Analog Circuits and Systems , McGraw-Hill.

    2. Ramakant A.Gayakwad , Op-Amps and Linear Integrated Circuits , PHI.

    3. Robert F.Coughlin & Fred Driscoll , Operational amplifiers and linear integrated circuits , PHI.4. Jacob , Applications and design with analog integrated circuits , PHI.

    5. Behzad Razavi , Data conversion system Design

    6. Roy and Choudhary Linear ICs

    7. Donald A Neamen , Electronic Circuit Analysis and Design

    IME 306 Advanced Logic Synthesis

    1.0 Introduction to logic synthesis

    2.0 Two-level logic synthesis

    Introduction

    Boolean algebra concepts

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    Annexure II COURSE SYLLABUS

    Minimization using k-map

    Minimization using Tabular method

    Consensus theorem

    Iterative Consensus theorem Recursive computation

    Unate covering problem

    a) Reduction techniqueb) MIS algorithm

    c) Branch and bound algorithm

    3.0 Sequential logic synthesis.

    Introduction

    Basics of FSM concept

    Minimization of completely specified FSMa) Equivalent partition algorithm

    Minimization of Incompletely specified FSM

    a) Compatible tableb) Maximum compatibles

    c) Prime compatibles

    d) Binate covering problem

    FSM traversal algorithms

    a) Depth first search

    b) Breadth first searchc) Shortest path

    State encoding and optimization

    4.0 Multilevel logic synthesis

    Introduction

    Algebraic and Boolean Division

    Kernels and Cokernels

    Algebraic and Boolean resubtitution methods5.0 Technology mapping

    a) Graph covering and Technology mapping

    b) Tree covering by Dynamic programmingc) Decomposition

    d) Delay optimization and Graph covering

    Reference Books

    Logic Synthesis and Verification Algorithms

    Gary D. Hachtel and Fabio Somenzi (Kluwer Academic Publishers)

    Logic Minimization Algorithms For VLSI Synthesis

    Robert K. Brayton ,Gary D. Hachtel, Curtis T. McMullen and Alberto L. Sangiovanni-Vincentelli (Kluwer Academic Publishers)

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    Annexure II COURSE SYLLABUS

    IME 308 Microcontrollers and Embedded Systems

    Introduction to Embedded Control, History and applications : Microcontroller - Difference

    between a microprocessor and a microcontroller, CISC and RISC microcontrollers on embedded control.

    Difference between CISC and RISC controllers, advantages

    RISC architecture code memory ROM, OTP, FLASH, WINDOW, data memory and register file

    concept, Registers, stack organization, I/O lines; Peripherals Timers, ADC EEPROM, UART, PWM,

    IIC, SPI; Glue Logic Reset control, Brownout detectors, RC, LP, XT,HS; Watchdog and pre-scalar.

    PICmicro family in Embedded control 12 bit, 14 bit and 16 bit PIC micro family; PICmicro 16F84

    features- code memory, interrupt vector, Register bank, Register files, TMRO, Port A and Port B, Internal

    EEPROM; Addressing Modes Direct addressing, Indirect addressing, Indexed addressing; Description

    of 35 instruction Byte, Bit, oriented operation, Literal and control operations.

    Program Development Software development tolls for embedded control; Assemblers Assembly file

    formats, Output HEX file format, List file format. Simulators Registers and watch windows, single

    stepping, break points, Hardware development tools for embedded control in circuit Emulator and

    debugger, BITE

    Case study of Embedded Control in AC and DC motor and stepper motor l, Frequency generation

    PWM, temperature Control, Analog to Digital conversion.

    Testing and debugging in embedded control

    Reference Books :

    1. J. B. Peatman , Design with PIC Micro Controller , PHI.

    2. Perdko , PIC Microcontroller , McGrawHill - 2000

    IME 310 Digital VLSI Design

    Introduction:

    VLSI technology trends, performance measures and Moores law

    MOS devices and Circuits:MOS transistors. Study of depletion and enhancement mode operations. Threshold Voltage.

    Body effect and other second order effects. NMOS inverters. CMOS inverters. BiCMOS andGaAs devices and circuits.

    Fabrication of ICs:

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    Lithographic process of MOS and CMOS fabrication. N-well, P-well and twin tub processes.Latch-up in CMOS. SOI process. VLSI Yield and economics.

    MOS Circuit designs & Lay out generation :

    VLSI Circuit Design:Pass transistors and transmission gates. Implementation of Boolean functions and combinational

    circuits using switch logic & gate logic. Pseudo NMOS inverter, Dynamic and clocked CMOS

    inverters. Clocking strategies, single and two phase clocking, Clock distribution. Flip flops, shiftregisters and clocked sequential circuits. Stick diagrams, Design rules and layouts, Scaling of

    MOS circuits.

    Basic circuit concepts and performance estimation :

    Sheet resistance, Standard unit of capacitance. Estimation of delay in NMOS and CMOS

    inverters. Driving of large capacitive loads. Super buffers. Estimation of power. Power

    reduction techniques.

    Sub system design:

    Design description domains and design strategies. Issues in Subsystem design. Design examplessuch as Adders, ALUs, Shifters. Design of sequential circuits.

    Memories:

    Static RAM and Dynamic RAMs, different topologies and performance analysis.

    References:

    1. Pucknell D.A and Eshraghian K, Basic VLSI Design, PHI publication.2. West N and Eshraghian K, Principles of CMOS VLSI Design, Addison Wesley

    Publication.

    3. Tsividis and Yannis, Operation and Modeling of the MOS Transistors, 2nd Edn. OxfordUniversity Press.

    4. Amar Mukherjee, Introduction to NMOS & CMOS VLSI systems Design, PHI

    publication.5. Allen, CMOS Analog Circuit Design, 2nd Edn. Oxford University Press.

    IME 312 Communication Systems

    Fundamentals of Telephone Switching, various tones used, DTMF, Store and Forward, Time division and

    Space division switching basic principles enhanced services.

    History and evolution of radio communication. Examples of wireless communication systems,

    comparison of common wireless communication systems paging systems, cordless systems, DECT,

    cellular systems

    Radar: Principles, range equation, types of Radars, Radar display system, Radar Beacons

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    Annexure II COURSE SYLLABUSSatellite Communication: Brief History of Satellite Communication, orbital aspects, Kepplers Law,

    Space Craft and its subsystem, satellite link design, Multiple access techniques, earth station technology.

    A brief overview of INTELSAT and INMARSAT, application of satellites.

    Overview of optical fibers: Types of optical fibers, numerical aperture, concept of cylindricalwaveguides, optical fibers as cylindrical waveguides, Eigen value equation and its solution as

    propagation constant of guided modes, concept of hybrid modes, Vnumber/parameter, weaklyguiding approximation and linearly polarized modes.

    Attenuation and dispersion in optical fibers: Losses due to scattering and bending, optical

    pulse spreading due to material and waveguide dispersion.

    Optical sources and detectors: Semiconductor LED and Laser diode, heterostructure and double

    heterostructure construction, DFB and DBR Lasers diodes, PIN and APD detectors.

    Optical communication systems: Analog and digital optical communication systems, SNR andBER, link budgeting, link power and rise time budget.

    Fiber measurements: Measurement of fiber parameters such as numerical aperture, bandwidth,

    etc.

    Reference Books:

    1. Thiagarajan Viswanathan, Telecommunication switching systems and networks, Prentice hall of

    India, New Delhi 1992.

    2. Ryder.J.D., Networks, lines and Fields, Second edition EEE, Prentice Hall of India, New Delhi

    1980

    3. Taub and D.T. Schilling, Principles of Communication Systems, Second Edition, McGraw-Hill,

    19864. LEE W.C.Y, Mobile Cellular Telecommunications

    5. Gerd Keiser , Optical Fiber Communication McGraw Hill 1991

    6. John Senior , Optical Fiber Communication, Prentice Hall

    7. R P Khare, Fiber Optics and Opto Electronics, Oxford University

    Fifth Semester

    IME 401 Foundations of VLSI CAD

    Matrices: Linear dependence of vectors, solution of linear equations, bases of vector spaces,

    orthogonality, complementary orthogonal spaces and solution spaces of linear equations.

    Graphs: representation of graphs using matrices; Paths, connectedness; circuits, cutsets, trees;Fundamental circuit and cutset matrices; Voltage and current spaces of a directed graph and their

    complementary orthogonality.

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    Annexure II COURSE SYLLABUS

    Algorithms and data structures: efficient representation of graphs; Elementary graph algorithmsinvolving bfs and dfs trees, such as finding connected and 2- connected components of a graph,

    the minimum spanning tree, shortest path between a pair of vertices in a graph; Data structures

    such as stacks, linked lists and queues, binary trees and heaps. Time and space complexity ofalgorithms.

    References

    K. Hoffman and R.E. Kunze, Linear Algebra, Prentice Hall (India), 1986

    N.Balabanian and T.A. Bickart, Linear Network Theory :Analysis, Properties, Design and

    Synthesis, Matrix Publishers, Inc.,1981.

    T.Cormen, C.Leiserson and R.A.Rivest, Algorithms, MIT Press and McGraw-Hill, 1990.

    IME 403 Microelectronics Fabrication Technology

    Environment for VLSI Technology: Clean room and safety requirements. Wafer cleaning

    processes and wet chemical etching techniques.

    Impurity incorporation: Solid State diffusion modelling and technology; Ion Implantation

    modelling, technology and damage annealing; characterization of Impurity profiles.

    Oxidation : Kinetics of Silicon dioxide growth both for thick, thin and ultrathin films. Oxidation

    technologies in VLSI andULSI; Characterisation of oxide films; High k and low k dielectrics forULSI.

    Lithography: Photolithography, E-beam lithography and newer lithography techniques forVLSI/ULSI; Mask generation.

    Chemical Vapour Deposition techniques : CVD techniques for deposition of polysilicon, silicon

    dioxide, silicon nitride and metal films; Epitaxial growth of silicon; modelling and technology.

    Metal film deposition : Evaporation and sputtering techniques. Failure mechanisms in metalinterconnects; Multi-level metallisation schemes.Plasma and Rapid Thermal Processing:

    PECVD, Plasma etching and RIE techniques; RTP techniques for annealing, growthand

    deposition of various films for use in ULSI.

    Process integration for NMOS, CMOS and Bipolar circuits; Advanced MOS technologies.

    References:

    C.Y. Chang and S.M.Sze (Ed), ULSI Technology, McGraw Hill Companies Inc, 1996.

    S.K. Ghandhi, VLSI Fabrication Principles, John Wiley Inc., New York, 1983.

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    Annexure II COURSE SYLLABUS

    S.M. Sze (Ed), VLSI Technology, 2nd Edition, McGraw Hill, 1988.

    IME 405 Physics of Semiconductor Devices

    Introduction to semiconductor Physics: Review of quantum mechanics, Electrons in periodic

    lattices, E-k diagrams, Quasiparticles in semiconductors, electrons, holes and phonons.

    Boltzmann transport equation and solution in the presence of low electric and magnetic fields -mobility and diffusivity; Carrier statistics; Continuity equation, Poisson's equation and their

    solution; High field effects: velocity saturation, hot carriers and avalanche breakdown.

    Semiconductor junctions: Schottky, homo- and hetero-junction band diagrams and I-V

    characteristics, and small signal switching models; Two terminal and surface states devices

    based on semiconductor junctions.

    MOS structures: Semiconductor surfaces; Theideal and nonideal MOS capacitor band diagramsand CVs; Effects of oxide charges, defects and interface states; Characterization of MOS

    capacitors: HF and LF CVs, avalanche injection; High field effects and breakdown.

    Characterization of semi conductors: Four probe and Hall measurement; CVs for dopant profile

    characterization; Capacitance transients and DLTS.

    References

    J. P. McKelvey, introduction to Solid State and Semiconductor Physics, Harper and Row and

    John Weathe Hill, 1966.E. H. Nicollian and J. R. Brews, MOS Physics and Technology, John Wiley, 1982.

    K. K. Ng, Complete Guide to Semiconductor Devices, McGraw Hill, 1995.

    D.K. Schroder, Seminconductor Material and Device Characterization, John Wiley, 1990.

    S. M. Sze, Physics of Semiconductor Devices, 2nd edition John Wiley, 1981.C. T. Sah, Fundamentals of Solid-State Electronic Devices, Allied Publishers and World

    Scientific, 1991.

    E. F. Y. Waug, Introduction to Solid State Electronics North Holland, 1980.

    IME 407 DIGITAL SIGNAL PROCESSING

    Review: Signals and systems, Time and frequency analysis of signals and systems, Z Transform.

    Discrete Fourier Transform: Frequency domain sampling and reconstruction of discrete timesignals DFT, DFT as a linear transformation, properties of the DFT, use of DFT in linear

    filtering, filtering of long data sequences Efficient computation of the DFT: FFT Algorithms Radix 2 DITFFT and DIFFFT, in-place COMPUTATION. Goertzel Algorithm.

    Implementation of Discrete time Systems: Structures for FIR systems Direct form, cascade

    form, Frequency sampling and lattice structures. Structures for IIR systems Direct form,

    cascade and parallel form, lattice ladder structures.

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    Annexure II COURSE SYLLABUS

    Design of IIR filters: Classical design by impulse invariance, bilinear transformation andmatched Z transform, characteristics and design of commonly used filters butter worth,

    chebyshev and elliptic filters, Spectral transformations, Direct design of IIR filters.

    Design of Digital FIR Filters: General considerations, Linear phase FIR Filters, Symmetric and

    antisymmetric impulse response, Design using windows, frequency sampling design, Optimumdesign, Remez Algorithm.

    Power Spectrum Estimation: Estimation of power spectra from Finite duration of observationof signals. Non-parametric and Parametric methods of power spectrum estimation.

    06 hrs.

    Digital Signal Processors: Architecture, features and instructions of Fixed point and FloatingPoint Processors(TMS320c25 and TMS32030).

    Applications of DSP: Image Processing, Speech processing, Noise cancellation, Bio-MedicalSignal Processing, Communication Signal Processing.

    References:-1. A.V.Oppenheim and R.W.Schafer, Descrete time signal Processing, PHI.

    2. J.G.Proakis and D.G.Manolakis, Introduction to Digital Signal Processing

    3. J.R.Johnson, Introduction to Digital Signal Processing PHI.

    4. Rabiner & Gold, Theory and applications of digital signal processing, PHI.5. Wills J.Tompkins, Biomedical Digital Signal Processing, Prentice-Hall

    6. Texas Instruments DSP Processors (320 family) data hand book.

    IME 409 Principles of ASIC DesignIntroduction to ASICs, Design Methodology Overview, CMOS LogicASIC Library Design, ASIC versus FPGA, Different Design Flows in ASIC / FPGA, Programmable

    ASICs, Programmable ASIC Logic and I/O Cells, Programmable ASIC Interconnect, Full Custom /

    Semi Custom circuit Techniques, Layout of Full Custom, CMOS ICs.

    EDA Tools in ASIC Flow, Low Level Design Entry Vs HDL based design, Logic SynthesisSimulation, System Partitioning, Floor planning and Placement, Layout Compaction Routing,

    Testing and verification, Clock Tree Synthesis

    Algorithms for VLSI design automation Placement, Partitioning, Floor planning and routingalgorithms.DSM Effects, Signal Integrity and interconnect problems, Top seven challenges in ASIC design,

    Design reuse and a quality design approach, Phases of an ASIC project, Case study of Complete

    ASIC design flow in detail with typical example

    Reference Books:

    1. Smith, M.J.S., Application-Specific Integrated Circuits. Addison-Wesley, 1026 p. ISBN 0-

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    Annexure II COURSE SYLLABUS201-50022-1, 1997

    2. Rabaey, J., Digital Integrated Circuits , A Design Perspective, Prentice Hall.

    3. Weste, N. H. E., and K. Eshraghian., Principles of CMOS VLSI Design: A Systems

    Perspective. 2nd ed. Reading, MA: Addison-Wesley, 713 p. ISBN 0-201-53376-6 1993, .

    4.Nigel Horspool and Peter Gorman, The ASIC Handbook Prentice Hall, 2001.5. Sabin H.Gerez , Algorithms for VLSI Design Automation , John Wiley & Sons, 1999.

    6. IEEE Solid state circuits

    7. IEEE Circuits & systems8. IEEE Signal Processing

    IME 411 Introduction to MEMS Technology

    Historical Background: Silicon Pressure sensors, Micromachining, MicroElectroMechanical Systems

    Microfabrication and Micromachining : Integrated Circuit Processes, Bulk Micromachining : IsotropicEtching and Anisotropic Etching, Wafer Bonding, High Aspect-Ratio Processes (LIGA)

    Physical Microsensors : Classification of physical sensors, Integrated, Intelligent, or Smart sensors,

    Sensor Principles and Examples : Thermal sensors, Electrical Sensors, Mechanical Sensors, Chemical and

    Biosensors

    Microactuators : Electromagnetic and Thermal microactuation, Mechanical design of microactuators,Microactuator examples, microvalves, micropumps, micromotors-Microactuator systems : Success

    Stories, Ink-Jet printer heads, Micro-mirror TV Projector

    Surface Micromachining: One or two sacrificial layer processes, Surface micromachining requirements,

    Polysilicon surface micromachining, Other compatible materials, Silicon Dioxide, Silicon Nitride,Piezoelectric materials, Surface Micromachined Systems : Success Stories, Micromotors, Gear trains,

    Mechanisms

    Application Areas: All-mechanical miniature devices, 3-D electromagnetic actuators and sensors,

    RF/Electronics devices, Optical/Photonic devices, Medical devices e.g. DNA-chip, micro-arrays.

    References

    Stephen D. Senturia, "Microsystem Design" by, Kluwer Academic Publishers, 2001.

    Marc Madou, Fundamentals of Microfabrication by, CRC Press, 1997.Gregory Kovacs,

    Micromachined Transducers Sourcebook WCB McGraw-Hill, Boston, 1998.

    M.-H. Bao, Micromechanical Transducers: Pressure sensors, accelrometers, and gyroscopes by

    Elsevier, New York, 2000.

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    Annexure II COURSE SYLLABUS

    Sixth Semester

    IME 402 LOW POWER VLSI DESIGN

    Introduction top Low Power VLSI Design

    Need for low power VLSI Design, Sources of power dissipation on Digital Integrated circuits.

    Physics of power dissipation in CMOS devices. Emerging Low power approaches.Device & Technology Impact on Low Power: Dynamic dissipation in CMOS, Transistor sizing

    & gate oxide thickness, Impact of technology Scaling, Technology & Device innovation

    Power estimation, Simulation Power analysis: SPICE circuit simulators, gate level logicsimulation, capacitive power estimation, static state power, gate level capacitance estimation,

    architecture level analysis, data correlation analysis in DSP systems, Monte Carlo simulation.

    Probabilistic power analysis: Random logic signals, probability & frequency, probabilistic poweranalysis techniques, signal entropy.

    Low Power Design techniquesCircuit level: Power consumption in circuits. Flip Flops & Latches design, high capacitance

    nodes, low power digital cells libraryLogic level: Gate reorganization, signal gating, logic encoding, state machine encoding, pre-

    computation logic

    Low power Architecture & Systems: Power & performance management, switching activityreduction, parallel architecture with voltage reduction, flow graph transformation, low power

    arithmetic components, low power memory design.

    Low power Clock Distribution: Power dissipation in clock distribution, single driver Vsdistributed buffers, Zero skew Vs tolerable skew, chip & package co design of clock network

    Algorithm & architectural level methodologies: Introduction, design flow, Algorithmic levelanalysis & optimization, Architectural level estimation & synthesis.

    Text Books:

    1. Gary K. Yeap, Practical Low Power Digital VLSI Design, KAP, 2002

    2. Rabaey, Pedram, Low power design methodologies Kluwer Academic, 1997

    3. Kaushik Roy, Sharat Prasad, Low-Power CMOS VLSI Circuit Design Wiley, 2000

    IME 404 RF Microelectronics Chip Design

    Introduction to RF and Wireless Technology: Complexity, design and applications. Choice ofTechnology. Basic concepts in RF Design: Nonlinearly and Time Variance, intersymbol

    Interference, random processes and Noise. Definitions of sensitivity and dynamic range,

    conversion Gains and Distortion. Analog and Digital Modulation for RF circuits: Comparison ofvarious techniques for power efficiency. Coherent and Non coherent defection. Mobile RF

    Communication systems and basics of Multiple Access techniques. Receiver and Transmitter

    Architectures and Testing heterodyne, Homodyne, Image-reject, Direct-IF and sub-sampledreceivers. Direct Conversion and two steps transmitters. BJT and MOSFET behavior at RF

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    frequencies Modeling of the transistors and SPICE models. Noise performance and limitation ofdevices. Integrated Parasitic elements at high frequencies and their monolithic implementation.

    Basic blocks in RF systems and their VLSI implementation : Low Noise Amplifiers design in

    various technologies, Design of Mixers at GHz frequency range. Various Mixers, their workingand implementations, Oscillators: Basic topologies VCO and definition of phase noise. Noise-

    Power trade-off. Resonatorless VCO design. Quadrature and single-sideband generators, Radio

    Frequency Synthesizes: PLLS, Various RF synthesizer architectures and frequency dividers,Power Amplifiers design. Linearisation techniques, Design issues in integrated RF filters.

    Reference

    B.Razavi, RF Microelectronics, Prentice-Hall PTR,1998 T.H.Lee.

    Design of CMOS Radio-Frequency Integrated Circuits, Cambridge University Press, 1998.

    IME 406 CMOS Analog Integrated circuit design

    Introduction to analog VLSI and mixed signal issues in CMOS technologies. Basic MOSmodels, SPICE Models and frequency dependent parameters. Basic MNOS/CMOS gain stage,

    cascade and cascode circuits. Frequency response, stabilty and noise issues in amplifiers. CMOS

    analog blocks: Current Sources and Voltage references. Differential amplifier and OPAMPdesign. Frequency Synthesizers and Phased lock-loop. Non-linear analog blocks:

    Comparators,Charge-pump circuits and Multipliers. Data converters. Analog Interconnects.

    Analog Testing and Layout issues. Low Voltage and Low Power Circuits. Introduction to RFElectronics. Basic concepts in RF design

    References

    R.Jacob Baker,H.W.Li, and D.E. Boyce CMOS Circuit Design ,Layout and Simulation, Prentice-

    Hall of India,1998Mohammed Ismail and Terri Faiz Analog VLSI Signal and Information Process, McGraw-Hill

    Book company,1994Paul R. Gray and R.G.Meyer, Analysis and design of Analog Integrated circuits John Wiley and

    sons,USA,(3rd Edition),1993

    B. Razavi, RF Microelectronics, Prentice-Hall PTR,1998

    IME 408 Elective I

    IME 408.1 Embedded System Design

    Introduction to an embedded systems design: Introduction to Embedded system, Embedded

    System Project Management, ESD and Codesign issues in System development Process, Design

    cycle in the development phase for an embedded system, Use of target system or its emulator

    and In-circuit emulator, Use of software tools for development of an ES.

    RTOS & its overview: Real Time Operating System: Task and Task States, tasks and data,

    semaphores and shared Data Operating system Services-Message queues-Timer Function-

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    Events-Memory Management, Interrupt Routines in an RTOS environment, basic design UsingRTOS.

    Microcontroller: Role of processor selection in Embedded System (Microprocessor V/s Micro-controller), 8051 Microcontroller: Architecture, basic assembly language programming concepts,

    Instruction set, Addressing Modes, Logical Operation, Arithmetic Operations, Subroutine,

    Interrupt handling, Timing subroutines, Serial data transmission, Serial data communication

    Embedded system development : Embedded system evolution trends. Round - Robin, robin

    with Interrupts, function-One-Scheduling Architecture, Algorithms. Introduction to-assembler-compiler-cross compilers and Integrated Development Environment (IDE). Object Oriented

    Interfacing, Recursion, Debugging strategies, Simulators.

    Networks for Embedded Systems: The I2C Bus, The CAN bus, SHARC link Ports, Ethernet,Myrinet, Internet, Introduction to Bluetooth: Specification, Core Protocol, Cable replacement

    protocol.IEEE 1149.1 (JTAG) Testability: Boundary Scan Architecture

    References:

    1. Embedded Systems by Raj Kamal, TMH2. The 8051 Microcontroller by K.J. Ayala, Penram International

    3. J B Peatman, Design with PIC Microcontrollers, Prentice Hall

    4. An Embedded Software Primer by David E. Simon, Pearson Education

    5. Designing Embedded Hardware by John Catsoulis, Oreilly6. Embedded System Design by Frank Vahid, Tony Givargis,, John Wiley & Sons, Inc

    7. Building Embedded Linux Systems by Karim Yaghmour, Oreilly

    8. Programming Embedded Systems by Michael Barr, Oreilly9. Real-time systems & software by Alan C. Shaw, John Wiley & sons, Inc.

    IME 408.2 Artificial Neural Networks

    Introduction: Biological neurons and memory: Structure and function of a single neuron;Artificial Neural Networks (ANN); Typical applications of ANNs : Classification, Clustering,

    Vector Quantization, Pattern Recognition, Function Approximation, Forecasting, Control,

    Optimization; Basic Approach of the working of ANN - Training, Learning and Generalization.

    Supervised Learning: Single-layer networks; Perceptron-Linear separability, Training algorithm,

    Limitations; Multi-layer networks-Architecture, Back Propagation Algorithm (BTA) and other

    training algorithms, Applications. Adaptive Multi-layer networks-Architecture, trainingalgorithms; Recurrent Networks; Feed-forward networks; Radial-Basis-Function (RBF)

    networks.

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    Unsupervised Learning: Winner-takes-all networks; Hamming networks; Maxnet; Simplecompetitive learning; Vector-Quantization; Counter propagation networks; Adaptive Resonance

    Theory; Kohonen's Self-organizing Maps; Principal Component Analysis.

    Associated Models: Hopfield Networks, Brain-in-a-Box network; Boltzmann machine.

    Optimization Methods: Hopfield Networks for-TSP, Solution of simultaneous linear equations;Iterated Gradient Descent; Simulated Annealing; Genetic Algorithm.

    References

    K. Mehrotra, C.K. Mohan and Sanjay Ranka, Elements of Artificial Neural Networks, MIT

    Press, 1997 - [Indian Reprint Penram International Publishing (India), 1997]

    Simon Haykin, Neural Networks - A Comprehensive Foundation, Macmillan Publishing Co.,

    New York, 1994.A Cichocki and R. Unbehauen, Neural Networks for Optimization and Signal Processing, John

    Wiley and Sons, 1993.

    J. M. Zurada, Introduction to Artificial Neural Networks, (Indian edition) Jaico Publishers,Mumbai, 1997.

    IME 408.3 Macroelectronics

    Amorphous amd Micro/Nano crystalline semiconductors : Introduction, Growth of

    amorphous and micro /nano crystalline hydrogenated silicon (a-Si:H) and it`s alloys like a-

    SiC:H, a-SiGe:H,etc, Doping in amorphous semiconductors, Physics and electronic properties.Defect desities, Electronic transport , Optoelectronics properties , Contact, Interfaces,

    Multilayers

    Device configuration and Applications : P-I-N devices, Thin film transistors , LEDs ,

    Memory Switches , Novel Processing Technology for Macroelectronics, Amorphous silicon

    Solar cells ,TFT based LCD displays, Passive and Active Matrix displays , Photoreceptors, LargeArea Image Sensor Arrays , Image pick up tubes or Vidicons, High energy Radiation imaging,

    Multilayer Color Detectors, Thin Film Position Sensitive Detectors: From 1D to 3D Applications

    Organic & Polymer Semiconductors devices: Introduction to organic semiconductors,

    Electronics structure, Transport, Optoelectronic properties, Device configurations ,

    Applications: Optoelectronics devices ,Solar cells, Photodiodes, LEDs ,Active Matrix displays ,

    Organic Thin film transistors, Device structure and characteristics , Circuit systems based onorganic devices, Organic Lasers, Other application

    Flat panel Display Technologies : LCD displays , Plasma Displays (PDP), ElectroluminescentDisplays(EL), Electrophoretic Displays (Electronic paper), Field emission displays (FED),

    Introduction to the concept of Flexible Electronics.

    References

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    1.Hydrogenated amorphous silicon , R.A.Street, Cambridge University Press 19912.The Physics and Technology of Amorphous silicon A.Madan & M.P.Shaw, Elsevier Science &

    Technology books 1988.

    3.Technology and Applications of Amorphous Silicon: Technology and Applications ed.Robert A. Street Springer-Verlag New York, LLC Series: Series in Materials Science. 2001

    4.Properties of Amorphous Silicon and Its Alloys, Tim.M..Searle, IEE Publication 1998.

    5.Latest MRS conference proceedings on amorphous and nanocrystalline semiconductors6. Stephen Forrest, Paul Burrows, & Mark Thompson , IEEE Spectrum August 2000 Volume 37

    Number 8 The dawn of Organic Electroncis

    7. Prospects and Applications for Organic Light Emitting Devices," by P.E. Burrows, S.R.Forrest, and M.E. Thompson in Current Opinion in Solid State and Materials Science, Vol. 2,

    pp. 236-243 (1997).

    8. "Ultrathin Organic Films Grown by Organic Molecular Beam Deposition and Related

    Techniques," by S.R. Forrest, Chemical Reviews, Vol. 97, pp. 1793-1896 (1997).9. Additional references Special issues on Conducting polymers and Flat panel displays in

    journals MRS Bulletin, IEEE Proceedings & Electronic Devices and SID Information Display

    magazine.

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    Seventh Semester

    IME 601 Nanomaterials & Nanoelectronics

    I Introduction to nanomaterials & nanotechnology

    1. What is nanotechnology?

    2. History of nanomaterials

    3. Influence on properties by "nano-structure induced effects"

    4. Some present and future applications of nanomaterials

    II Atoms, clusters and nanomaterials

    1. Introduction

    2. What is so important about clusters?

    III Preparation/Synthesis of nanomaterials1. Methods for creating nanostructures

    2. Processes for producing ultrafine powders

    3. Chemical Synthesis4. Physical Synthesis

    5. Biomimetic processes

    IV Properties of materials due to the scaling of size

    1. Mechanical2. Introduction

    3. Property changes dur to nanostructuring

    4. Strengthening and Toughening Mechanisms5. Chemical

    6. Sensors

    7. catalysis

    8. Magnetic9. Magnetic Properties of small atomic clusters

    10. Why interest in nano-scale magnetic materials?

    11. Classifications of magnetic nanomaterial12. Optical

    13. Absorption of light in semiconductor materials

    14. Optical properties of a translucid object

    15. Effective medium theory16. Electronic

    17. Quantum size effect in metal or semiconductor nanoparticles

    18. Quantum Wells, Wires and Dots19. What is Single Electronics?

    V Future applications including bottom-up nanotechnology and microelectronics

    1. The red brick wall in microelectronics

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    2. Future needs of microelectronics industries3. Review of possible bottom up approaches still in research

    4. Self organization

    References:

    Janos H. Fendler:

    Nanoparticles and nanostructured films: preparation, characterization and applications,

    ISBN: 3527294430, Wiley VCH, (1998)

    Kenneth J. Klabunde:

    Nanoscale materials in chemistry, ISBN: 0471383953, Wiley, John & Sons, (2001)

    Zhon Ling Wang:

    Characterization of nanophase materials, ISBN: 3527298371, Wiley-VCH Verlag GmbH

    (2000)

    IME 603 Mixed Signal IC design

    I.Brief review of various building blocks

    II Advanced Continuous Time Filter

    1. Design of MOSFET-C Filter2. Design of Gm-C Filters

    III Sample and Holds, Voltage References and Translinear Circuits

    IV Review of Discrete-Time Signals

    V Advanced switched capacitor circuits

    1. Design of switched capacitor amplifiers and Integrators2. Design of switched capacitor filters

    VI Design of data converters

    1. Nyquist rate AID converters (Flash, interpolating, folding flash, SAR and pipelined

    architectures), Nyquist rate D/A converters (voltage, current and charge mode converters) hybridand segmented converters

    2. Oversampled A/D and D/A converters

    3. Delta-Sigma data converters

    VII Design of PLL's, DLL's and frequency synthesizers

    References

    R. Jacob Baker:CMOS Mixed Signal Circuits Design, Weslly-IEEE 2002

    R. Gregorian and Ternes:Analog MOS integrated circuits for signal processing, JosseyBass,

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    1986.R.Gregorian:Introduction to CMOS OP-AMPs and comparators, John-Wiley, 1999.

    D.Johns and K.Martin:Analog integrated circuit design, John-Wiley, 1997.

    Monolithic Phase-locked loops and clock recovery circuits: Theory and design, IEEE Press,1996.

    IME 605 System on Chip Design

    8085 Architecture, I/O Devices 8355/8755, DMA Controller 8237, 8279 8253 ProgrammablePeripheral Interface 8255 Interrupt System, Digital Interfacing, Multiple Microprocessor

    Systems, 8051 Microcontroller Architecture, 8051 Microcontroller System design

    Architecture of 16/32/ 64 bit Microcontroller, System Architecture, Different aspects of

    architecture design, Macros, CPU Organization, Data Path Design, Memory Organization,Control Design

    System on Chip Design Issues, SOC Design Methodology, Power Considerations, SOC Case

    study, Design Consideration Challenges, Memories, Parameterized Systems-on-a- Chip ,

    System-on-a-chip Peripheral Cores , SOC and interconnect centric Architectures

    IP Core Design issues, IP Core Design Methodology, Reusability and intellectual property, IP

    Core ApplicationsMicro Networks, SoC protocols, OC, VSI, Hardware/Software Co-Design

    Reference Books:

    1. Edwards M.D, Automatic Logic Synthesis Techniques for Digital Systems', Macmillan New

    Electronic series, 1992.

    2. F. Balarin, Hardware-software co-design of embedded systems: Kluwer academic publishers,1997.

    3. J.Rozenblit, K.Buchenrieder: Co-design: Computer-Aided software/hardware engineering,

    Piscataway, NJ; IEEE Press, 1995.4. Myke Predko, Programming and Customizing the 8051 Microcontroller, Tata McGraw Hill,

    ISBN: 0-07-042140-4, 1999.

    5. Barry B.Brey, Intel Microprocessors, Architecture, Programming and Interfacing, Prentice-

    Hall India, ISBN: 81-203-1220-1, 2000.

    IME 607 Failure Analysis And Design

    I Overview of device fabrication

    II Overall View of Failure Analysis of Microelectronic Devices

    1. What is Failure Analysis?

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    IME 609.2 Quantum Information Science

    Finite dimensional vector space, inner-product, complex numbers, linear adjoints, unitary maps,

    projectors, tensor product of Hilbert spaces, bit, qubit, entanglement, no-cloning, quantumcircuits, quantum gates, Shor's algorithm, Grover's algorithm, quantum teleportation, quantumkey-exchange, teleportation and measurement based quantum computing, decoherence, quantum

    error-correction, mixed states, quantum information.

    References

    Gruska, J. (1999) Quantum Computing. McGraw-Hill.

    Nielsen, M. and Chuang, I. L. (2000) Quantum Computation and Quantum Information.Cambridge University Press

    IME 609.3 Optical Integrated Circuits

    Optical Waveguide Modes, Theory of Optical Waveguides,Waveguide Fabrication Techniques,Polymer and Fiber Integrated Optics, Losses in Optical Waveguides, Waveguide Input

    and Output Couplers, Coupling Between Waveguides, Electro-Optic Modulators,

    Acousto-Optic Modulators, Basic Principles of Light Emission in Semiconductors, OpticalAmplifiers, Semiconductor Lasers Heterostructure, Confined-Field Lasers, Distributed Feedback

    Lasers, Direct Modulation of Semiconductor Lasers, Integrated Optical Detectors, Quantum

    Well Devices, Micro-electro-optical-mechanical Devices (MEMs) Optoelectronic Devices in

    Wireless Systems, Application of Integrated Optics and Current Trends

    References

    Integrated Optics: Theory and Technology, R. G. Hunsperger, Springer-Verlag, 5th edition.

    IME 609.4 Real Time Operating Systems

    1.0 Introduction to traditional operating systems.

    2.0 Taxonomy of kernel features, benchmarks and standards.

    3.0 Process and thread management4.0 Real time scheduling algorithms

    4.1 Round Robin, FIFO, Priority based scheduling algorithms.

    4.2 Rate monotonic scheduling

    4.3 Priority inversion and priority ceiling5.0 A periodic tasks and sporadic servers.

    6.0 Inter-process/thread communication and synchronization

    7.0 Using process/thread management and synchronization.

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    8.0 Clocks and Timers.9.0 Memory management

    10.0 Real time asynchronous IO.

    11.0 Interrupt processing and device drivers.12.0 Architecture of two RTOSs - BlueCat Linux(lynuxworks) and

    VXWorks(WindRiver.com)

    Reference Books

    Various web links

    INTEGRITY RTOS (free source)

    (http://www.ghs.com/products/rtos/integrity.html)

    Mini-project To be executed in one month.

    Developing real time application in RTOS environment (using BlueCat Linux and VXWorks).

    This is a group project (two people in a group). Students have to design and implement asolution in the RTOS of their choice.