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2004
Innovationen und Trendsin der Leistungselektronik
Johann W. KolarFrank Schafmeister
Swiss Federal Institute of Technology (ETH) ZurichPower Electronic Systems Laboratory
ETH Zentrum / ETL H22Physikstr. 3, CH-8092 Zurich/Switzerland
2004
Outline
Power Electronics ApplicationsVoltage Regulator ModuleIT Distributed Power Supply Hybrid VehicleMore Electric AircraftDrive SystemsDistributed Generation
Power Semiconductor DevelopmentPower Electronics Research Centers
2004
Carbon Dioxide Concentration and Temperature Evidence from Ice Cores
Average Increase 0.4%/a
2004
Power ElectronicsEvolution
2004
IT DistributedPower Supply
Server-Farm450 MW/1.5kW/m2
99.9999%/<30s/a$1.0 Mio./shutdown
US 15% DigitalEconomy Electricity
Consumption
2004
Voltage Regulator Module
Moore´s Law will Prevail for the Next Decade
1 Billion Transistors15 GHz by 2010
0.8V / 200A250A/ns @ 1% Supply
Voltage Tolerance
Power and Thermal Limitations→ Power Wall
2004
VoltageRegulatorModule
Dynamic Behavior
2004
TraditionalIT Power SystemArchitecture
Linear PostRegulator
2004
IntermediateBus Architecture
2004
Intermediate Bus Architecture
Active Clamp Flyback and Forward Converter
Single-Stage Power Factor Correction
SynchronousRectification
-48V
2004
DC/DC Converter Development Route
2003 - 2008 Thermal Management
is aKey Issue
2004
DC/DC Bus ConverterModule
48V / 12V isolated 200W cont. Output>96% Efficiency3.5MHz (eff.)BGA Surface Mounting
20W/cm3
2004
Power SupplyEnergy Efficiency
10 Billion Power Supplies inUse Woldwide
10% of US Electricity Use30…60% Efficient
2004
Hybrid Car
Series
Parallel
2004
Hybrid Car
Power SystemArchitecture
300…500V High Voltage DC Bus14V Battery
2004
Hybrid CarShare Forecast
Annual World-Wide Car Manufacturing
Forecast of Hybrid Vehicle in US
2004
Hybrid Car
Bidirectional DC/DC Converter Topologies
Isolated
Non-IsolatedBidirectional / Unidirectional
2004
More Electric Car
Waste Heat Recovery
Electro-Thermal Energy Generation
2004
More Electric Car
Technology Gaps
Power Electronics Propulsion System
2004
Increasing Ambient/Junction Temperature and Simultaneously Increasing Reliability Requirements
Packaging Technology with Matched CTEs
More Electric Car
Power ElectronicsMounted to ICE105°C
2004
All-ElectricFuel-Cell Powered Car
Voltage DC Link IGBT Converter Super-Cap in Parallel to Fuel Cell400VDC (250V)40kW (60kW)48kHz Interleaved Switching
2004
More Electric AircraftAir Traffic Growth 4.7%/a
Variable Frequency Power Generation270VDC Power DistributionReplacement of Hydraulic by Electric System
2004
More Electric Aircraft
Power System Architecture
2004
More Electric Aircraft
Starter / GeneratorSystem
2004
More Electric Aircraft
DC/DC Converter
DC/AC ConverterMulti-Cell Concept
2004
More Electric Aircraft
Flight ControlSurface Actuation
EHA Electro-Hydrostatic ActuatorEMA Electro-Mechanical Actuator
2004
More Electric Aircraft
Three-Phase AC/DC Power Conversion withLow Effects on the Aircraft Mains
Unidirectional Three-Level Boost Converter
Unidirectional Buck+Boost Converter
2004
RenewableEnergy
Missing LargeScale EnergyStorage Technology
2004
5% Employing Electronic Speed Control35% Possible Share / 40% Energy Saving Potential (16TWh)400TWh Drives Energy Consumption in the EU60% Energy Saving Potential
Drive Systems60% of Electric Energy Utilized in Germany consumed by Drives
2004
Drive Systems
Electronic InductorUnidirectional Utility Interface
Reduction of Effects on the Mainsη = 99%10kW/dm3
2004
Drive Systems
Bidirectional Utility Interface
Multi-Level Converter Topologies
2004
Drive Systems
Matrix Converter
Conventional Sparse Matrix Converter
2004
Drive Systems
Quasi-Matrix Converter
Active Common-ModeEMI Filtering
2004
Distributed Generationand Storage
Co-Generation65% Combined EfficiencyCustom Power / UPS
Fuel Cell
2004
Fuel Cell Utility Interface
Single-Phase Isolated
Three-PhaseZ-SourceInverter
2004
Fuel Cell Utility Interface
Single-Phase High-Frequency IsolatedDC/AC Matrix Converter
Three-PhaseHigh-Frequency IsolatedMatrix Converter
2004
Power System withFully Integrated Network Control
Self-HealingWide-Area MonitoringPower Flow Controlled Instantaneously using Power Electronic SystemsPremium Power and DC ServicePlug & Play of Distributed Resources
2004
Interface Flow
Line
Flo
w
Thermal
Dynamic
Voltage
SECURErisk = 0
Risk BasedSecurity Contours
Boundary Of Normal Operations
Interface Flow
Line
Flo
w
Thermal
Dynamic
Voltage
SECURErisk = 0
Risk BasedSecurity Contours
Boundary Of Normal Operations
Visualize Critical Information
Displays the Limits of Power Market Activities Imposed by Constraints on the Underlying Power System
Locates System Bottlenecks
Suggests Combinations of Net Power Import and Export
Promotes Integration of System Reliability and Market Efficiency
2004
Roadmap Tree for PowerDelivery Technologies
2004
Future U.S. Energy Distribution
Super Grid ConceptEPRI
3,000,000 MW WorldwideElectric Utility Generation
700,000 MW in the U.S.15,000 MW/a added6,000 MW/a replaced
Efficient Coast-to-Coast Underground Transport of Large Amount of Energy –40…80GW
Simultaneous Delivery ofElectricity and Liquid HydrogenCombined with MAGLEV Systems
2004
Power Semiconductor Evolution
2004
Power MOSFET Revolution
Charge Compensation PrincipleHigh-Doped n-Region / p-Columns
Low On-State Resistance50V VDS Depletion ThresholdSpace Charge Region Extends Across Epi-LayerHigh Breakdown Voltage Capacitive Dynamic Behavior
2004
Evolution of IGBTTechnology
Trench TechnologyField-Stop Concept
600V IGBT3
First IGBT Rated for Tj = 175°C
2004
SiC Power SemiconductorDevices
SiC Rectifier Diode Probe-Tested at600oC
Advantages SiC / Si Bandgap (eV@300K) 2.9 / 1.1Max. Operating Temp. (K) >900/ 425Breakdown Voltage (106V/cm) 4 / 0.3Thermal Conductivity (W/cm.K) 5 / 1.5
2004
SiC Wafer Defects –Micropipes and Screw Dislocation<5/cm2
Low Processing YieldDefect Density Required for 1200V/100A Devices<3/cm2
2002 SiC Wafer Production Capacity94% US Share
High Temperature Packaging Techniques
Compatible Gate Drives and Passives
SiC Power SemiconductorDevices
Challenges
2004
SiC Power SemiconductorDevices
SiC Schottky Diodes 600V 35A1200V 25A 1700V 20A
SiC J-FETs 1200V 5A /10A1800V 3A / 8A
600V SiC Schottky DiodePositive Temp. Coefficient of VF
No Reverse Recovery Current
2004
Si Power SemiconductorDevelopment
Reverse BlockingIGBT
Dual-Gate IGCTMonolithic
BidirectionalSwitch
2004
Future Developments
System Design IntegratedMultidisciplinaryModeling and AnalysisCircuit/Control/ThermalElectromagnetic/Mechanical CAD
Power Density 2kW/dm3 →50kW/dm3
2004
Power Loss Density 100…1000W/cm2
High Ambient Temperature Applications High Junction Temperature WBG DevicesAdvanced Packaging
Forced Liquid Cooling Spray Cooling, Shower Power, Micro Channel Heat Sink
Note: Improved Forced Air Cooling bySynthetic Jets / Acoustic Streaming
Advanced Packaging and Active Cooling Schemes
2004
Power Electronics Research Centers
Pre-CompetitiveECPE Demonstrator Program inCollaboration with University Competence Centers
EuropeanEngineering Center for Power Electronics
Founded in 2003
14 Industry Members
2004
Three-Phase 1-U Power Supply Module
COOLMOS / SiC-DiodesMicro-Channel Heat SinkHigh-Speed DSP-ControlFlat MagneticsHBW & CMR Current Sensing
Specifications 10 kW 3-Φ 480VAC800 VDC500 kHz10 kW/dm3
2004
EMC InputFilter
ElectrolyticCapacitors
N 30%
30%
N 30%PowerCircuit / Cooling
Partitioning of the Converter Volume
Main Share of Passive Components
Increase of Switching Frequency Active EMI Filtering
2004
■ Center for Power ElectronicSystems, USA
■ Consortium of 5 Universities70 Industrial Partners
■ IPEM Approach, Research onFundamental Knowledge/Enabling Technology/EngineeredSystems
Power Electronics Research Centers
■ PERC, Power Electronics Research Center, Japan,coordinated by the National Institute of Advanced Science and Technology
■ Industry-Academia-Government CollaborationResearch
■ Research focused on Ultra-Low-Loss PowerDevice Technology (SiC, GaN)
2004
Future
Power Electronics is the Keyand Enabling Technology for all Kindsof Electric Energy Utilization !
