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Inkjet Inkjet Printing Printing For For Making Making Fine Fine Conductors Conductors and and Multi Multi - - Layer Layer Electronics Electronics Liisa Hakola, Liisa Hakola, Research Research Scientist Scientist VTT VTT – Technical Technical Research Research Centre Centre of Finland of Finland e|5: e|5: UV & EB UV & EB Technology Technology Expo Expo & Conference Conference April April 24th, 2006 24th, 2006

Inkjet Printing For Making Fine Conductors and MultiLayer ... · Printing Microscale Dynamics in Ink Jet€Printing Publications Applications of High Speed IJ Innovative Development

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InkjetInkjet PrintingPrinting ForFor MakingMaking FineFineConductorsConductors andand MultiMulti­­LayerLayer ElectronicsElectronics

Liisa Hakola,Liisa Hakola, ResearchResearch ScientistScientistVTTVTT ––TechnicalTechnical ResearchResearch CentreCentre of Finlandof Finland

e|5:e|5: UV & EBUV & EB TechnologyTechnology ExpoExpo && ConferenceConferenceAprilApril 24th, 200624th, 2006

April 24th, 2006 Liisa Hakola 2

OutlineOutline

1.1. VTTVTT overviewoverview

2.2. InkjetInkjet technologytechnology

3.3. Inkjet forInkjet for makingmaking printedprinted electronicselectronics

4.4. InkjetInkjet printingprinting conductorsconductors

5.5. InkjetInkjet printingprinting multimulti­­layerlayer electronicselectronics

6.6. SummarySummary

April 24th, 2006 Liisa Hakola 3

VTTVTT ––TechnicalTechnical ResearchResearch CentreCentre of Finlandof Finland

nn Impartial and multidisciplinaryImpartial and multidisciplinaryexpert organisationexpert organisation

nn 2,900 employees2,900 employeesnn Turnover 220 millionTurnover 220 million €€, 5000, 5000

customerscustomersnn Confidential research projects,Confidential research projects,

joint venture projects and strategic,joint venture projects and strategic,selfself­­financed researchfinanced research

STRATEGICRESEARCH

BUSINESSSOLUTIONS

VENTURES

Productiveconsulting services

EXPERTSERVICES

IPR,spin­offs

Newenablingtechnologies

VTT­widesales andmarketing

Research and development

April 24th, 2006 Liisa Hakola 4

DigitalDigital PrintingPrinting ResearchResearch at VTT 1995at VTT 1995­­20072007

PrintableQuality

Indicator

SurfaceProximity

Assay

Sustainpack(EU IP)

1995 1998 2001 2004 2007

Printing ofVariable

Informationon Packages

On Demand Package Printing

Communication in Consumer Packages

ICTApplications

Printable Opticsand Electronics

PRINTO

Functional Inks inInkjet Printing

ManufacturingTechnologies

Based on Inkjet

Dynamic Interactions and ImageQuality in Ink Jet Printing

(EPP­Programme)

Home PrintingFrom Network

Quality Potentialof Digital Photo

Printing

MicroscaleDynamics in

Ink Jet Printing

PublicationsApplications ofHigh Speed IJ

InnovativeDevelopment of

Ink Jet (NI)IntegratingPrinted and

Electronic MediaPRINT ACCESS

MANUFACTURING:

PACKAGING:

PUBLICATION:PRINT

INTERACT

Business fromFunctional

Printing

April 24th, 2006 Liisa Hakola 5

nn StateState­­ofof­­thethe­­artart,, industrialindustrial, piezo, piezo electricelectric inkjetinkjetprintheadsprintheads →→ researchresearch resultsresults upscalableupscalable forforproductionproduction

WaterWater­­,, oiloil­­ andand solventsolvent­­basedbased inksinksUVUV­­curablecurable inksinksHotHot meltmelt inksinks andand waxeswaxesConductiveConductive andand dielectricdielectric inksinksBiochemicalBiochemical andand diagnosticdiagnostic fluidsfluidsIndicatorIndicator fluidsfluids

InkjetInkjet researchresearch environmentenvironment at VTTat VTT

April 24th, 2006 Liisa Hakola 6

PrintingPrinting methodsmethods

Printing methods

Conventionalprinting

Digitalprinting

Offset

Flexography

Gravure

Screen printing

Electrophotography Inkjet

Dry toner

Liquid toner

Continuous Drop­on­demand

Binarydeflection

Multipledeflection

Thermal

Piezo­electric

Binary

Greyscale

April 24th, 2006 Liisa Hakola 7

InkjetInkjet printingprinting comparedcompared toto otherother printingprintingtechnologiestechnologies

InkjetInkjetnn CustomisationCustomisation,, smallsmall seriesseriesnn PrintingPrinting speedspeed increasingincreasing ((currentlycurrently

aroundaround 1 m/s)1 m/s)nn SubstrateSubstrate independentindependentnn InkInk developmentdevelopment challengingchallengingnn EasyEasy toto integrateintegrate withwith existingexisting

productionproduction lineslines

ConventionalConventional printingprinting methodsmethodsnn NoNo variablevariable data,data, largelarge volumesvolumesnn MassMass manufacturingmanufacturing withwith highhigh

speedspeed ((aroundaround 20 m/s)20 m/s)nn NotNot allall substratessubstrates suitablesuitablenn InkInk developmentdevelopment notnot soso

challengingchallengingnn IntegrationIntegration requiresrequires spacespace andand

changeschanges inin existingexisting productionproductionlineslines

April 24th, 2006 Liisa Hakola 8

InkjetInkjet printingprinting technologytechnology

nn DigitalDigital nonnon­­impactimpact printingprintingmethodmethod, additive, additive

nn SubstrateSubstrate independentindependentnn AccurateAccurate,, highhigh resolutionresolution,, highhigh

speedspeednn PossibilityPossibility forfor massmass customisationcustomisationnn LowLow materialmaterial consumptionconsumptionnn Inks forInks for allall kindskinds ofof applicationsapplications

Drop generator Chargeelectrode

High­voltagedeflection plate Gutter

Substrate

Continuous ink­jet

Orifice

Pressurechamber

Heater

Ink

Drop­on­demand ink­jet

April 24th, 2006 Liisa Hakola 9

BenefitsBenefits of inkjetof inkjet printingprinting inin printedprintedelectronicselectronics

nn DirectDirect writewrite ofof electronicelectronic componentscomponents andand circuitscircuitsnn lessless manufacturingmanufacturing stepsstepsnn lessless materialmaterial wastewastenn costcost savingssavingsnn shortershorter turnaroundturnaround timestimes smallsmall seriesseries andand customisationcustomisation

resistmask + expose

etching

printing materialsubstrateInkjet printing:

substratematerial

spin­coating e.g.

Photolithography:

cleaning

April 24th, 2006 Liisa Hakola 10

ApplicationApplication areasareas for inkjetfor inkjet printedprinted electronicselectronics

nn NotNot meantmeant toto replacereplace traditionaltraditional manufacturingmanufacturing methodsmethodsnn LowLow­­costcost devicesdevicesnn LowLow performanceperformance,, singlesingle­­useuse,, disposabledisposable devicesdevicesnn NewNew applicationapplication areasareasnn NewNew featuresfeatures toto printedprinted productsproductsnn HybridHybrid printingprinting inkjet forinkjet for customisationcustomisationnn MultipleMultiple materialmaterial depositiondeposition withwith severalseveral printheadsprintheadsnn LayeringLayering ofof materialsmaterials 3D3D structuresstructures

Conductiveink

HeatPrinthead

Resistorink

Dielectricink

UV

Semi­conductive

ink

etc.

Curing

Protectivelayer

Curing

Conductiveink

IR

April 24th, 2006 Liisa Hakola 11

NanoNano­­particleparticle inksinks forfor makingmaking conductorsconductors

nn SmallSmall particleparticle sizesize andand inkink stabilitystabilitycrucialcrucial in inkjetin inkjet printingprinting

nn NanoNano­­particlesparticles provideprovidenn highhigh metalmetal loadingloading withwith lowlow viscosityviscositynn inkink stabilitystabilitynn jettingjetting reliabilityreliabilitynn lowlow curingcuring temperaturetemperature

nn MetalMetal nanonano­­particleparticle inksinks provideprovideprintedprinted conductorsconductors withwith lowlowresistanceresistance valuesvaluesnn eveneven in thein the rangerange ofof µµ

Curing

April 24th, 2006 Liisa Hakola 12

100 µm

50 µmsilvernanoparticleconductorprintedat VTT onpolyimide

InkjetInkjet printingprinting finefine conductorsconductors

nn LinesLines asas finefine asas possiblepossible andandcontinuouscontinuous

nn DropDrop sizesize andand spreadingspreading definedefine linelinewidthwidth

nn PrintPrint resolutionresolution definesdefines linelinecontinuitycontinuity

nn SubstrateSubstrate prepre­­treatmenttreatment oror prepre­­patterningpatterning

2.4 mm

2.4 mm

April 24th, 2006 Liisa Hakola 13

InkjetInkjet printingprinting multimulti­­layerlayer electronicselectronics

nn TransistorsTransistors,, displaysdisplays,, passivepassivecomponentscomponents

nn MultiMulti­­colourcolour printingprintingnn atat leastleast oneone printhead forprinthead for eacheach inkinknn colorcolor registrationregistration

nn InteractionsInteractions betweenbetween differentdifferentmaterialsmaterialsnn printingprinting onon substratesubstrate vs.vs. printingprinting onon

inkink layerlayernn colourcolour bleedbleed

nn InkInk availabilityavailability

Electrodes

Dielectric

Conductor

Resistor layer

ConductorFerrite layer

April 24th, 2006 Liisa Hakola 14

UVUV­­curablecurable dielectricdielectric inkink for inkjetfor inkjet printingprinting

nn PrintingPrinting inin elevatedelevated printheadprintheadtemperaturetemperature

nn DryingDrying withwith absorption and UVabsorption and UVlightlight

nn GoodGood wearwear resistanceresistancenn HighHigh glossglossnn SmoothSmooth inkink layerlayer withoutwithout pinpin

holesholes

1st silverelectrode

2nd silverelectrode

Dielectric inkjet printedbetween electrodes

Example of capacitor

April 24th, 2006 Liisa Hakola 15

ExperimentalExperimental

nn UVUV­­curablecurable polymerpolymer basedbased dielectricdielectricinkink ((yellowyellow))nn CuringCuring withwith 120 W/cm H120 W/cm H bulbbulb UVUV lightlight

sourcesource for 20for 20 secondssecondsnn 11 oror 22 inkink layerslayers

nn SilverSilver nanonano­­particleparticle inkink ((blackblack))nn CuringCuring in 120in 120 ooC for 15C for 15­­3030 minutesminutesnn 11 oror 22 inkink layerslayers

nn PaperPaper andand plasticplastic substratesubstratenn PiezoPiezo­­electricelectric inkjet, 80 plinkjet, 80 pl dropdrop sizesize,,

630630 dpidpi resolutionresolution

10 cm

April 24th, 2006 Liisa Hakola 16

0

10

20

30

40

50

60

70

0 200 400 600 800 1000 1200 1400 1600 1800

X (µm)

Z (µm)

10 ink layers, UV­curing 30 s

5 ink layers, UV­curing 30 s

1 ink layer, UV­curing 10 s

1 ink layer, UV­curing 30 s

HeightHeight profileprofile ofof UVUV­­curedcured dielectricdielectric inkink layerslayersonon plasticplastic substratesubstrate

peak over scale

~13µm

~20µm

~45µm

April 24th, 2006 Liisa Hakola 17

PerformancePerformance ofof multimulti­­layerlayer electronicselectronics

600 m ­ 220 

1 layer dielectic and 1 layer silver on paper 190 mpin holes?

> 1 M

60­190 m

•on paper increase in amount of dielectriclayers increases resistance on top of it

~1 ­ 200 

April 24th, 2006 Liisa Hakola 18

SummarySummary

nn InkjetInkjet printingprinting suitablesuitable methodmethod forformanufacturingmanufacturing electronicselectronics

nn FineFine inkjetinkjet printedprinted conductorsconductors possiblepossibleeveneven withoutwithout substratesubstrate prepre­­treatmenttreatment

nn MetalMetal nanonano­­particleparticle inksinks produceproduceconductiveconductive structuresstructures withwith lowlow resistanceresistance

nn InkjetInkjet printingprinting suitablesuitable methodmethod forfor makingmakingmultimulti­­layerlayer structuresstructures

nn UVUV­­curablecurable dielectricdielectric inkink producesproduces smoothsmoothandand thickthick inkink layerslayers

April 24th, 2006 Liisa Hakola 19

ThankThank youyou forfor youryour attentionattention!!

Liisa HakolaLiisa Hakola,, ResearchResearch ScientistScientist

VTTVTT ––TechnicalTechnical ResearchResearch CentreCentre of Finlandof FinlandFunctionalFunctional PrintingPrinting

P.O.BoxP.O.Box 1000, FI1000, FI­­02044 VTT, Finland02044 VTT, Finland

phonephone: +358 20 722 7206: +358 20 722 7206

faxfax: +358 20 722 7052: +358 20 722 7052

ee­­mailmail:: [email protected]@vtt.fi