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EUDET:EUDET:Status and PerspectivesStatus and Perspectives Ingrid-Maria Gregor, DESYIngrid-Maria Gregor, DESY
The EUDET initiative The EUDET initiative EUDET activitiesEUDET activities
Joint Research Joint Research ActivitiesActivities
NetworkingNetworking Summary and Summary and
OutlookOutlook
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EUDETEUDET
INFN FerraraINFN FerraraINFN MilanINFN MilanINFN PaviaINFN PaviaINFN RomeINFN Rome
NIKHEF AmsterdamNIKHEF Amsterdam
AGH CracowAGH CracowINPPAS CracowINPPAS Cracow CSIC SantanderCSIC Santander
Lund UniversityLund University
CERN GenevaCERN GenevaGeneva UniversityGeneva University
Bristol UniversityBristol UniversityUCL LondonUCL London
Charles University PragueCharles University PragueIPASCR PragueIPASCR Prague
HIP HelsinkiHIP Helsinki
LPC Clermont-FerrandLPC Clermont-FerrandLPSC GrenobleLPSC GrenobleLPHNE ParisLPHNE ParisEcole Polytechnique PalaiseauEcole Polytechnique PalaiseauLAL Orsay LAL Orsay IReS StrasbourgIReS StrasbourgCEA SaclayCEA Saclay
DESYDESYBonn UniversityBonn UniversityFreiburg UniversityFreiburg UniversityHamburg UniversityHamburg UniversityMannheim UniversityMannheim UniversityMPI MunichMPI MunichRostock UniversityRostock University
Tel Aviv UniversityTel Aviv University + 22 associated institutes+ 22 associated institutes
EUDET Partner InstitutesEUDET Partner Institutes
EUDET is an “Integrated Infrastructure Initiative (I3)” within the EUDET is an “Integrated Infrastructure Initiative (I3)” within the EU fundedEU funded “6“6thth framework framework programmeprogramme” ”
Support improvement of Support improvement of infrastructure for detector R&Dinfrastructure for detector R&D with larger with larger prototypes - but not the R&D itselfprototypes - but not the R&D itself
EUDET is EUDET is not a collaborationnot a collaboration
Other institutes can Other institutes can contribute and contribute and exploit the exploit the infrastructureinfrastructure
Infrastructure can be Infrastructure can be re-locatedre-located
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2006 2007 2008 2009
Magnet & Magnet & Pixel Pixel
Telescope Telescope 18%18%
Management Management 4%4%
CalorimeterCalorimeter 33%33%
Networking 9%Networking 9%
TA 2% TA 2%
Tracking 33%Tracking 33%
21.5 million EUR total21.5 million EUR total
(7.0 million EU contribution)(7.0 million EU contribution)
ManpowerManpower
≈ ≈ 57 FTE total57 FTE total
≈ ≈ 17 FTE funded by EU17 FTE funded by EU
most of the resources for the development most of the resources for the development of the infrastruturesof the infrastrutures
Duration of 4 yearsDuration of 4 years
Ramp-up first half 2006Ramp-up first half 2006
Full swing activities for 2.5 yearsFull swing activities for 2.5 years
Last year: phase-out and exploitation of infrastruturesLast year: phase-out and exploitation of infrastrutures
EUDET BudgetEUDET Budget
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Some ILC Detector Design CriteriaSome ILC Detector Design Criteria
Impact parameter resolutionImpact parameter resolution
Momentum resolutionMomentum resolution
Jet energy resolutionJet energy resolution
Calorimeter granularityCalorimeter granularity
Pixel sizePixel size
Material budget, centralMaterial budget, central
Material budget, forwardMaterial budget, forward
)sin/(105 23
przr
)(1051 15
GeV
pT
EEE %30
Need factor three better than SLDNeed factor three better than SLD
Need factor 10 better than LEPNeed factor 10 better than LEP
Needs to be better than ZEUSNeeds to be better than ZEUS
Need factor ~200 better than LHCNeed factor ~200 better than LHC
Need factor ~20 smaller than LHCNeed factor ~20 smaller than LHC
Need factor ~10 less than LHCNeed factor ~10 less than LHC
Need factor ~1000 less than LHCNeed factor ~1000 less than LHC
)sin/(337.7 23
przr
)(1051 15
GeV
pT
EEE %35
Requirements for ILCRequirements for ILC Compare to best performance to dateCompare to best performance to date
Adapte
d f
rom
M.
Dem
art
eau
337 ns
x2820
0.2 s
0.95 ms
Bunch TrainBunch Train
Bunch SpacingBunch Spacing
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EUDET EUDET
NetworkNetwork Transnational Transnational AccessAccess
Joint Research Joint Research ActivitiesActivities
ManagementManagement
Detector R&D Detector R&D NetworkNetwork
Access to Access to DESY Test BeamDESY Test Beam
Access to Detector Access to Detector R&D InfrastructuresR&D Infrastructures
Test Beam Test Beam InfrastructuresInfrastructures
TrackingTracking DetectorsDetectors
CalorimeterCalorimeter
JRA1JRA1
JRA2JRA2
JRA3JRA3
I3 projects based on three pilars (mandatory):I3 projects based on three pilars (mandatory):
EUDET StructureEUDET Structure
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Test beam Infrastructure JRA1Test beam Infrastructure JRA1
Provide test beam telescope with:Provide test beam telescope with:Very high precision: <3 μm precision even at lower energiesVery high precision: <3 μm precision even at lower energies
High readout speed (frame rate >1kHz)High readout speed (frame rate >1kHz)
Easy to use: well defined/described interfaceEasy to use: well defined/described interface
Large range of conditions: cooling, positioning, magnetic fieldLarge range of conditions: cooling, positioning, magnetic field
Suitable to different test beam Suitable to different test beam environments:environments:
construction & initial tests at construction & initial tests at DESY (EDESY (Ee-e- up to 6 GeV) up to 6 GeV)
exploitation at CERN, FNAL etc. exploitation at CERN, FNAL etc. possiblepossible
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JRA1 ScheduleJRA1 Schedule
Phase1: “Demonstrator”Phase1: “Demonstrator”
Phase2: Final telescopePhase2: Final telescope
First test facility will be available quickly for the groups developing pixels First test facility will be available quickly for the groups developing pixels
Use established pixel technology with analogue readout and no data reductionUse established pixel technology with analogue readout and no data reduction
Use pixel sensor with fully digital readout, integrated Use pixel sensor with fully digital readout, integrated Correlated Double Sampling (CDS), and data Correlated Double Sampling (CDS), and data sparsificationsparsification
The beam telescope ready at the end of 2008The beam telescope ready at the end of 2008
2006 2007 2008 2009
nowDemonstratorIntegration Starts
DemonstratorAvailable
Final Telescope Available
Magnet @ DESY Magnet available
CERN test beam
+ Large bore magnet+ Large bore magnet
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(Analogue) Telescope(Analogue) Telescope
Sensors with (analogue)Sensors with (analogue)outputoutput
ReadOutReadOut
Boards to carry theBoards to carry thesensorssensors
Mechanics to positionMechanics to positionthe sensors preciselythe sensors precisely
AUXboard
Ingredients needed for such a telescopeIngredients needed for such a telescope
Trigger LogicUnit
ee--
DUTDUT
EUDRBEUDRB
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Board StatusBoard Status
20 sets of boards 20 sets of boards
AUX board as interface to VME boardAUX board as interface to VME board
Proximity board housing the sensor Proximity board housing the sensor (two types)(two types)
AUX boardAUX board
Proximity boardProximity board
IPHC Strasbourg/DESYIPHC Strasbourg/DESY
AUXboard
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Reference Plane SensorsReference Plane Sensors
Demonstrator: MimoTelDemonstrator: MimoTeluse MimoTel prototypeuse MimoTel prototype
AMS 0.35 OPTO process with 14 and 20μm epitaxial AMS 0.35 OPTO process with 14 and 20μm epitaxial layerlayer
4 sub-arrays (64 × 256 pixel)4 sub-arrays (64 × 256 pixel)
30 × 30 μm30 × 30 μm22 pitch: active area: 7.7 × 7.7 mm pitch: active area: 7.7 × 7.7 mm22
readout : 1.6 ms (4 analog output nodes at 10 readout : 1.6 ms (4 analog output nodes at 10 MHz)MHz)
pixel designed to stand >1 MRad at room pixel designed to stand >1 MRad at room temperaturetemperature
engineering run was in summer 06engineering run was in summer 06
end of October, reception of engineering runend of October, reception of engineering run MimoStar3
MimoTEL Imager10µ Imager12µ
Mimosa16 Mimosa16
Latchup ADC ADC MyMap
TestStruct
Layout of the reticle of the Layout of the reticle of the engineering run AMS-035 OPTO engineering run AMS-035 OPTO 07/2006 on 14 µm (standard) and 20 07/2006 on 14 µm (standard) and 20 µm epi substrateµm epi substrate
From November to end of 2006, two tests in parallelFrom November to end of 2006, two tests in parallelprobe station setup preparation for wafer with 14 µm EPIprobe station setup preparation for wafer with 14 µm EPI
laboratory test for circuits with 20 µm EPIlaboratory test for circuits with 20 µm EPI
IPHC StrasbourgIPHC Strasbourg
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MimoTelMimoTel
End of 2006 to Jan. 2007, dicing 14 µm EPI End of 2006 to Jan. 2007, dicing 14 µm EPI waferwafer
Laboratory test for circuits with 14 µm EPILaboratory test for circuits with 14 µm EPI
AMS did not respect one of our specifications: AMS did not respect one of our specifications: high-resistivity polyhigh-resistivity poly
Biasing DACs out of rangeBiasing DACs out of range
No effect on Mimosa18 (High Resolution No effect on Mimosa18 (High Resolution Tracker)Tracker)
Small modification on the PCB board: MimoTel Small modification on the PCB board: MimoTel can be set "near" nominal conditionscan be set "near" nominal conditions
The dark current on rad-tol diodes (MimoTel) factor of 5 to 10 higher than The dark current on rad-tol diodes (MimoTel) factor of 5 to 10 higher than expected expected The dark current on non rad-tol diodes (Mimosa18) factor of 5 to 10 lower The dark current on non rad-tol diodes (Mimosa18) factor of 5 to 10 lower than expectedthan expected
IPHC StrasbourgIPHC Strasbourg
General remarks:General remarks:
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MimoTel ResultsMimoTel Results
MimoTel (20um EPI layer) MimoTel (20um EPI layer)
Response to Fe55 source at 18Response to Fe55 source at 18ooCC
Noise of 15 electrons in the range of Noise of 15 electrons in the range of what was expected what was expected
KK line good visible line good visible
IPHC/DESYIPHC/DESY
HitmapHitmap
columns
row
s
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Readout: Readout: EUEUDET DET DData ata RReduction eduction BBoard oard
Functionality of motherboard Functionality of motherboard on-line calculation of pixel pedestal and on-line calculation of pixel pedestal and noise, cluster finding, ADCnoise, cluster finding, ADCremote configuration of the FPGAremote configuration of the FPGAon-board diagnosticson-board diagnostics
4 independent signal processing and 4 independent signal processing and digitizing stagesdigitizing stagesImplementationImplementation
One analogue card -> signal processingOne analogue card -> signal processingOne digital card -> USBOne digital card -> USB
INFN FerraraINFN FerraraEUDRBEUDRB
Operational modesOperational modesZero SuppressionZero Suppression readout to minimize readout dead time while normal data takingreadout to minimize readout dead time while normal data takingFull FrameFull Frame readout mode for debugging or off-line pedestal and noise measurementsreadout mode for debugging or off-line pedestal and noise measurements
Boards tested and available for first test in beam June 2007Boards tested and available for first test in beam June 2007
ReadOutReadOut
EUDRBEUDRB
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DAQ Integration ConceptDAQ Integration ConceptHow to integrate the DUT hardware with the JRA1 beam How to integrate the DUT hardware with the JRA1 beam telescope?telescope?
different groups with different detector technologies different groups with different detector technologies and different, pre-existing DAQ systemsand different, pre-existing DAQ systems
nobody has a large pool of effort to rewrite existing nobody has a large pool of effort to rewrite existing codecode
Use completely different hardware and DAQ for the DUTUse completely different hardware and DAQ for the DUT synchronize only with Trigger, Busy and Reset signalssynchronize only with Trigger, Busy and Reset signals
readout software, DAQ and data storage is provided by readout software, DAQ and data storage is provided by the DUT userthe DUT user
events combined off-lineevents combined off-line
Trigger Logic Unit (TLU)Trigger Logic Unit (TLU)receives trigger and passes it on to receives trigger and passes it on to telescope and DUTtelescope and DUT
vetoes further triggers (BUSY)vetoes further triggers (BUSY)
records timestamprecords timestamp
hardware availablehardware available
file
telescopetelescope
DUTDUT
DAQDAQ
tel. ctrl
intfc
DAQDAQ
DUT ctrl
intfcPCPC PCPC
file
Trigger LogicUnit
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Telescope DAQTelescope DAQ
HardwareHardware HardwareHardware HardwareHardware
Writer taskWriter task
telescopetelescope‘‘producer’producer’
DUTDUT‘‘producer’producer’
otherother‘‘producer’producer’
Monitoring task 1Monitoring task 1 Monitoring task 2Monitoring task 2
DAQ buffersDAQ buffers
MonitoringMonitoring buffersbuffers
filefile
DAQ Software is divided into many parallel tasks:DAQ Software is divided into many parallel tasks:several Producerseveral Producer tasks read the hardware tasks read the hardware
one FileWriterone FileWriter task bundles events, writes to task bundles events, writes to file and sends subsets for monitoringfile and sends subsets for monitoring
There can be There can be severalseveral Online -Online - MonitoringMonitoring tasks tasks
oneone Buffer MonitorBuffer Monitor task allows to see what is task allows to see what is going ongoing on
a a FileReaderFileReader can re-inject data into the can re-inject data into the monitoringmonitoring
StatusStatusCan have several producers (Dummy, Mimosa, DEPFET, TLU) all running Can have several producers (Dummy, Mimosa, DEPFET, TLU) all running together.together.
Data from all of them combined by FileWriter and written to binary file.Data from all of them combined by FileWriter and written to binary file.
This can then be converted to a Root file for easier analysis.This can then be converted to a Root file for easier analysis.
First version will be available for test beam in June 2007First version will be available for test beam in June 2007
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Telescope MechanicsTelescope Mechanics
Box 1:Box 1:
fixed position, optical bench for three reference planesfixed position, optical bench for three reference planes
Wall to DUT can be removedWall to DUT can be removed
Box 2:Box 2:
movable in z-direction, optical bench for three reference planesmovable in z-direction, optical bench for three reference planes
Wall to DUT can be removedWall to DUT can be removed
Box 3:Box 3: Gap between 2 and 3, closed by thermal coverGap between 2 and 3, closed by thermal cover
DUT positioned on XYDUT positioned on XY-table -table
XYXY-table-table: external with “long” mechanical structure : external with “long” mechanical structure to locate the DUT between the reference planesto locate the DUT between the reference planes
boxes can be placed into magnetic field, not the XYboxes can be placed into magnetic field, not the XY--table (cost reasons)table (cost reasons)
Want to keep a lot of flexibility for different usersWant to keep a lot of flexibility for different users
Box 1Box 1
Box 3Box 3(DUT)(DUT)
ee--
Box 2Box 2
xx
yy
zz
x
y
PI
DESYDESY
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Senor BoxesSenor Boxes
Mechanics design almost completedMechanics design almost completed
3 planes on one main structure3 planes on one main structureMinimal distance between planes: 7mmMinimal distance between planes: 7mm
Maximum level arm:200 mmMaximum level arm:200 mm
Material: aluminumMaterial: aluminum
DESYDESY
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Telescope OutlookTelescope Outlook
The first version of the EUDET pixel telescope (“demonstrator”) will be The first version of the EUDET pixel telescope (“demonstrator”) will be available for users later this yearavailable for users later this year
Full telescope with digital readout and high resolution available at the Full telescope with digital readout and high resolution available at the end of 2008end of 2008
www.eudet.org
testbeam.desy.de
You can apply for travel money through You can apply for travel money through the the Transnational AccessTransnational Access and use the and use the EUDET test beam infrastructureEUDET test beam infrastructure
You can apply for test beam time at DESYYou can apply for test beam time at DESY
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JRA2: Tracking; TPCJRA2: Tracking; TPC
2007: FC construction
integrate the efforts of European institutions working on integrate the efforts of European institutions working on tracking detectors for the ILCtracking detectors for the ILC
improvement of existing infrastructures for tracking improvement of existing infrastructures for tracking detectors, detectors, the developments of common prototypesthe developments of common prototypesdevelopment of novel techniques for SI based tracking development of novel techniques for SI based tracking detectorsdetectors
Three tasksThree tasks
Large TPC prototypeLarge TPC prototype
field cage, end plate interface, readoutfield cage, end plate interface, readout
Si TPC readoutSi TPC readout
Timepix chip, diagnostics planeTimepix chip, diagnostics plane
Si trackingSi tracking
Mechanics, cooling, electronicsMechanics, cooling, electronics
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Large TPC PrototypeLarge TPC Prototype
a large field cage and prototype readout a large field cage and prototype readout electronicselectronics
developed to optimally use the magnet test developed to optimally use the magnet test facility (JRA1)facility (JRA1)
field cage structure which combines light field cage structure which combines light weight with excellent high voltage behaviour weight with excellent high voltage behaviour and mechanical stiffnessand mechanical stiffness
readout electronicsreadout electronics::a programmable preamplifier – shaper ASICa programmable preamplifier – shaper ASIC
a digitization system based on a modified a digitization system based on a modified ALTRO chip (ALICE)ALTRO chip (ALICE)
2007: FC constructionfield shaping strips developedfield shaping strips developed
field shaping system should guarantee field field shaping system should guarantee field homogeneity of better than 1% throughout the homogeneity of better than 1% throughout the active volume of the chamberactive volume of the chamber
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Timepix in a 3-GEM detector at DESY testbeamTimepix in a 3-GEM detector at DESY testbeam
5GeV e5GeV e-- track trackwith with -electron(s)-electron(s)
in TOT modein TOT mode in TOF mode in TOF mode
Si TPC ReadoutSi TPC Readout
use a CMOS pixel detector combined with some kind of gas gain griduse a CMOS pixel detector combined with some kind of gas gain grid
Upgrade Medipix2 chip to get 3D information: timestamp enables TOT infoUpgrade Medipix2 chip to get 3D information: timestamp enables TOT info
Timepix has been produced with a good yield and is working -> first testbeamTimepix has been produced with a good yield and is working -> first testbeam
Timepix covered with 4Timepix covered with 4m of amourphous Silicon with a standard Micromegas in m of amourphous Silicon with a standard Micromegas in He/C4H10 (80/20)He/C4H10 (80/20)
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Silicon TrackingSilicon Tracking
support for large sensor R&D
enable groups to contribute to the development enable groups to contribute to the development of long and thin Si-detector componentsof long and thin Si-detector components
providing common tools needed to test and providing common tools needed to test and simulate these sensors under real life simulate these sensors under real life conditionsconditions
highly multiplexed, deep submicron front-highly multiplexed, deep submicron front-end electronicsend electronics
with low power consumption and the with low power consumption and the possibility for power cyclingpossibility for power cycling
DSM (130 nm)DSM (130 nm)
prototype of the alignment system to prototype of the alignment system to work out work out
alignment challenges,alignment challenges,
the distortions handlingthe distortions handling
calibrations for the overall calibrations for the overall tracking systemtracking system
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JRA3: Infrastructure for CalorimetersJRA3: Infrastructure for Calorimeters
improving the existing calorimeter improving the existing calorimeter prototype stackprototype stack
development of novel stack development of novel stack instrumentationinstrumentationnovel readout systemsnovel readout systems
to be provided at the infrastructureto be provided at the infrastructure
ECALECAL, HCAL, VFCAL, HCAL, VFCAL
Electronics, DAQElectronics, DAQ
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ECALECALThe ECAL “EUDET module 0”The ECAL “EUDET module 0”
barrel module prototypebarrel module prototype
0.4t tungsten, 1.8m long0.4t tungsten, 1.8m long
~1/6 instrumented (12k ch.)~1/6 instrumented (12k ch.)
One tower for e test beamOne tower for e test beam
Embedded electronicsEmbedded electronics
1.5mm gap (PCB + wafer + ASICs1.5mm gap (PCB + wafer + ASICs
Power pulsingPower pulsing
Test full scale mechanics, cooling, Test full scale mechanics, cooling, communicationcommunication
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HCAL, VFCALHCAL, VFCAL
HCALHCALRealistic structure Realistic structure
Integrated electronicsIntegrated electronics
Readout architecture like Readout architecture like ECALECAL
Calibration system, test standCalibration system, test stand
VFCALVFCALSensor test standsSensor test stands
Irradiation test beam infrastructureIrradiation test beam infrastructure
Already usedAlready used
Readout electronicsReadout electronics
Laser alignment systemLaser alignment system
µm level precisionµm level precision
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Calorimeter ElectronicsCalorimeter ElectronicsVFCALVFCAL
ElectronicsElectronicsIntegration is key Integration is key Digital part next to sensitive analogue FEDigital part next to sensitive analogue FEPower pulsing, stabilityPower pulsing, stability
HaRDROCHaRDROC64 ch digital HCAL chip64 ch digital HCAL chipUnder testUnder test
SKIROCSKIROC36ch ECAL chip 36ch ECAL chip At foundry (0.35 AMS)At foundry (0.35 AMS)
SPIROCSPIROC36ch analogue (SiPM) HCAL chip36ch analogue (SiPM) HCAL chipUnder designUnder design
More versions in the pipelineMore versions in the pipeline
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(Calorimeter) DAQ(Calorimeter) DAQ
PC/s
ASICs
FE
Con
trol
-lin
k
ODR
Store
Data
-link
PC/s
ASICs
FE
Con
trol
-lin
k
ODR
Store
Data
-link
Slab
FEFPGA
PHYASIC
Data
ASIC ASICASIC
Conf
Clock + Control
FE
Slab
FEFPGA
PHYASIC
Data
ASIC ASICASIC
Conf
Clock + Control
Slab
FEFPGA
PHYASIC
Data
ASIC ASICASIC
Conf
Clock + Control
Slab
FEFPGA
PHYASIC
Data
ASIC ASICASIC
Conf
Clock + Control
FE
PC
Mo
the
rbo
ard
PCI-Receiver
Large FPGA
MemoryMicro-
Processor/s
TX Module
RX Module
RX Module
RX Module
RX Module PCIe Interface
CPUInter-Slot
PC
I-E
xpre
ss B
us
Fast ControlInterface
PC
Mo
the
rbo
ard
PCI-Receiver
Large FPGA
MemoryMicro-
Processor/s
TX Module
RX Module
RX Module
RX Module
RX Module PCIe Interface
CPUInter-Slot
PC
I-E
xpre
ss B
us
Fast ControlInterface
e.g. off-detector receiver: off-the-shelfe.g. off-detector receiver: off-the-shelf
Scalable DAQ system Scalable DAQ system Commercial hardware where possibleCommercial hardware where possible
Prototype for full detector Prototype for full detector andand useable in test useable in test beambeam
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EUDET Networking ActivityEUDET Networking Activity
EUDET Annual workshop, EUDET Annual workshop, MPI Munic, Oct 18-20, 2006MPI Munic, Oct 18-20, 2006
Information exchangeInformation exchangewww.eudet.orgwww.eudet.org
Annual workshops (open to Annual workshops (open to everyone)everyone)
Computing and analysisComputing and analysisGrid based computer clusterGrid based computer cluster
Common software for test Common software for test beams and ILC simulationsbeams and ILC simulations
Not EUDET specificNot EUDET specific; ; embedded in ILC software & embedded in ILC software & simulation effort, already simulation effort, already usedused
Shower simulation Shower simulation Support from Geant4 teamSupport from Geant4 team
Deep sub-micron rad-hard Deep sub-micron rad-hard electronics electronics
Access through CERN Access through CERN contractscontracts
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Transnational AccessTransnational Access
Imposed by EU to foster trans-European access to research Imposed by EU to foster trans-European access to research infrastructureinfrastructure
Take advantage of it: Take advantage of it: apply for travel money!apply for travel money!For travel to DESY test beamFor travel to DESY test beam
For travel to use any of the infrastructure created within the For travel to use any of the infrastructure created within the EUDET initiativeEUDET initiative
Magnet, beam telescopeMagnet, beam telescope
Field cage, SiTPC, Si trackerField cage, SiTPC, Si tracker
Calorimeter structure, readout, test standsCalorimeter structure, readout, test stands
Open to any European group Open to any European group EUDET or notEUDET or not
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ConclusionConclusion
EUDET is an “Integrated Infrastructure Initiative (I3)” within the EUDET is an “Integrated Infrastructure Initiative (I3)” within the EU EU fundedfunded “6 “6thth framework framework programmeprogramme” ”
an example of the high recognition of the ILC by the an example of the high recognition of the ILC by the European Union European Union
Support improvement of Support improvement of infrastructure for detector R&Dinfrastructure for detector R&D with with larger prototypes - but not the R&D itselflarger prototypes - but not the R&D itself
Different Joint Research Activities (JRA) Different Joint Research Activities (JRA)
The initiative provides resources which help to proceed towards The initiative provides resources which help to proceed towards the next phase of ILC detector R&Dthe next phase of ILC detector R&D
Start in 2006: first milestones met, first deliverables Start in 2006: first milestones met, first deliverables delivereddelivered
EUDET will have a big impact on the Detector R&D for ILC!EUDET will have a big impact on the Detector R&D for ILC!
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Backup SlidesBackup Slides
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EUDETEUDET
EUDET is an “Integrated Infrastructure Initiative (I3)” within the EUDET is an “Integrated Infrastructure Initiative (I3)” within the EU fundedEU funded “6 “6thth framework framework programmeprogramme” ”
an example of the high recognition of the ILC by the European Union an example of the high recognition of the ILC by the European Union
Support improvement of Support improvement of infrastructure for detector R&Dinfrastructure for detector R&D with larger prototypes - but not the R&D itself with larger prototypes - but not the R&D itself
Example: TPC field cage for R&D on end plates, calorimeter structure for R&D on novel sensors,Example: TPC field cage for R&D on end plates, calorimeter structure for R&D on novel sensors,……
EUDET is EUDET is not a collaborationnot a collaboration
Other institutes (EU, non-EU) can contribute and exploit the infrastructureOther institutes (EU, non-EU) can contribute and exploit the infrastructure
Infrastructure can be re-locatedInfrastructure can be re-located
EUDET brings some fresh money – but not enoughEUDET brings some fresh money – but not enough
Additional resources required to exploit infrastructureAdditional resources required to exploit infrastructure
No free lunch: administrative work and No free lunch: administrative work and timelinestimelines
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JRA1JRA1Test Beam Test Beam
InfrastructureInfrastructure
T. Haas T. Haas DESYDESY
JRA2JRA2Tracking Tracking DetectorsDetectors
J. TimmermansJ. TimmermansNIKHEFNIKHEF
JRA3JRA3
CalorimeterCalorimeter
F. SefkowF. Sefkow
DESYDESYCh. de la TailleCh. de la Taille
LAL OrsayLAL Orsay
NA2NA2Detector R&D Detector R&D
NetworkNetwork
K. DeschK. DeschBonnBonn
I3I3CoordinatorCoordinator
J. MnichJ. MnichDESYDESY
Steering Steering CommitteeCommittee
External External Scientific Scientific Advisory Advisory BoardBoard
EUEU
Members from Members from all 3 regionsall 3 regions
Task leaders have been assigned for the various work packagesTask leaders have been assigned for the various work packages
Annual EUDET meetings and workshopsAnnual EUDET meetings and workshops
EUDET ManagementEUDET Management
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EUDET and R&D collaborationsEUDET and R&D collaborations
EUDET may be seen as a sort of large virtual “institute” in the EUDET may be seen as a sort of large virtual “institute” in the overall worldwide ILC detector R&D “collaboration”overall worldwide ILC detector R&D “collaboration” Provides resources, takes responsibilitiesProvides resources, takes responsibilities Make optimal use and avoid duplication on international scale Make optimal use and avoid duplication on international scale
On sub-detector level, the EUDET activities (JRA’s) are closely On sub-detector level, the EUDET activities (JRA’s) are closely coordinated with the R&D collaborationscoordinated with the R&D collaborations
EUDET is a contract between partner institutes and EC with well EUDET is a contract between partner institutes and EC with well defined milestones and deliverablesdefined milestones and deliverables Needs some own management structure, meetingsNeeds some own management structure, meetings Somewhat reduced flexibilitySomewhat reduced flexibility
Most challenging impact: need to Most challenging impact: need to synchronizesynchronize the timelines the timelines
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EUDET ActivitiesEUDET Activities
Detector R&D Network:Detector R&D Network: Information exchange and intensified Information exchange and intensified
collaborationcollaboration Common simulation and analysis Common simulation and analysis
frameworkframework Validation of simulationValidation of simulation Deep submicron radiation-tolerant Deep submicron radiation-tolerant
electronicselectronics
Test Beam InfrastructureTest Beam Infrastructure Large bore magnetLarge bore magnet Pixel beam telescopePixel beam telescope
Tracking DetectorsTracking Detectors Large TPC prototypeLarge TPC prototype Silicon TPC readoutSilicon TPC readout Silicon trackingSilicon tracking
CalorimeterCalorimeter ECALECAL HCALHCAL Very Forward CalorimeterVery Forward Calorimeter FE Electronics and Data Acquisition SystemFE Electronics and Data Acquisition System