iNEMI Environmental

Projects

Stephen Tisdale, Intel Electronics Goes Green

September 9, 2012

2

AGENDA

• Current Situation Analysis

• Environmental Project Portfolio

• iNEMI Low-Halogen Position Statement

• Industry Standards

• iNEMI Projects Status

Mercury Ban

Batteries

WEEE

RoHS

Batteries

Battery law

2000

Today

CA Green

Chemistry,

RoHS

State

mercury,

PBB/PBDE,

e-waste laws

E-waste &

packaging

laws

E-waste

Battery law

E-waste , Dfe product &

Packaging

E-waste

ErP

REACH

E-waste &

Energy

E-waste

China RoHS

Energy law

Energy

E-waste,

RoHS

Packaging

Federal

CPSIA

IPP 25 EU States –

WEEE & RoHS

RoHS study

E-waste,

RoHS

E-waste,

RoHS Draft Dfe,

Take-back,

Packaging Draft RoHS, Battery

GLOBAL REGULATORY TRENDS:

The pace of change quickens

2006 2007 2008 2009 2010 2011 2012 2013+

Product Design Requirements are Increasing

Industry Must Stay Ahead of the Curve…

Eco-Design

Std 62430

Material Declaration Std

62474*

JIG 101 Material Declaration

Std - Products

Material

Declaration

Std1752

JIG 201 Material Declaration

Std – Shipping

Media

Material

Declaration

Std1752 v. 2

Internationally recognized industry standards can facilitate cost effective IT data exchange solutions

Recast

RoHS

Conflict Minerals

India RoHS

Servers

TSCA

Laptop/PC

These initiatives involve data/information

exchange throughout industry supply chain

Low

Halogen

0

2,000

4,000

6,000

8,000

10,000

12,000

2000 2001 2002 2003 2004 2005 2006 2007 2008 2009

Hits on external facing product ecology website

144K 255K

Customer Demands are Increasing

Custo

mer

requests

fo

r pro

duct

eco

logy d

ata

0.1

10

1,000

10,0000

1970 1980 1990 2000 2010

Mips/Watt

Gas Mileage

100,000 mpg

10 mpg

The IT industry is uniquely positioned to

respond:

Moore’s Law and Sustainability

If automobiles followed Moore’s law

they would achieve 100,000 mpg!

Environmentally Sustainable Electronics

(ESE)

8

iNEMI Environmental Project Portfolio

• HFR-Free PCB Material Evaluation (competed in 2008)

• HFR-Free Leadership Program

– HFR-Free PCB Materials (completed in Q1 2012)

– HFR-Free Signal Integrity (completed in Q4 2011)

• PVC Alternative Initiative (completed in 2011)

• HFR-Free High Reliability PCB (completion Q4 2012)

• Eco-Impact Evaluator for ICT Equipment – LCA (completion Q4 2012)

• White Paper of Harmonization Of Environmental Data Management

(completion Q4 2012)

8

9

iNEMI supports removal of:

Halogenated Flame Retardants (HFRs)

and Polyvinyl Chloride (PVC)

iNEMI Position Statement Can Be Found Here :

http://thor.inemi.org/webdownload/projects/ese/HFR-Free/Low-Halogen_Def.pdf Supported by iNEMI and its member companies (Dell, HP, Intel, Lenovo, Cisco, Sun, Tyco Electronics etc.)

1 - Applies only to halogenated flame retardants and PVC. Halogens are below 1000 PPM bromine and 1000 PPM chlorine when used in Flame Retardants or PVC

iNEMI’s Low-Halogen1 Position

10

10

Low-Halogen Electronics Standards

Industry

Standards

(PCB Material Only)

IEC 61249-2-21

JPCA-ES-01-1999

IPC - 4101B

Industry Standard (Defining “Low-Halogen”

Electronic Products)

(Removal of BFR/CFR/PVC)

JS-709A (Joint JEDEC / ECA Standard)

Supply Chain Alignment / Definition Critical

NOTE: The JEDEC/ECA Joint Industry Standard “JS-709A” Defining “Low-

Halogen” Electronic Products (Removal of BFR/CFR/PVC), is aligned to the

iNEMI Position Statement and is available through the JEDEC Website at

http://www.jedec.org

11

HFR-free Technology Leadership Program

Stephen Tisdale, Intel – Chair HFR-Free Leadership Program

HFR-Free PCB Materials Chair: John Davignon – Intel

HFR-Free Signal Integrity Chair: Stephen Hall - Intel

Co-Chair: David Senk - Cisco

Identify key thermo-mechanical performance characteristics and determine if they are in the

critical path for the HFR-free PCB material transition.

Ensure there is no degradation of electrical signals in HFR-free PCB materials, base on investigation of

permittivity and loss as well as how they are impacted by moisture absorption in new HFR-free materials.

HFR-Free Technology

Leadership Program

HFR-Free PCB

Materials

Chair:

John Davignon, Intel

Project Chair: Project Co-Chair:

Strategy Tactics Start: End:

Issues Graphics

Focus Area:

Sep-12 TIG:

Goal: Define the material set parameters and test conditions for all relevant market segments

Environment

ECE

HFR-Free PCB Materials – Phase 2

-- John Davignon, Intel

• Identify key performance characteristics and test criteria - Make recommendations for performance tests

– Electrical

– Output broadband frequency dependent dielectric constant (Dk) and loss tangent (Df) of candidate halogen-free laminate materials (10KHz - 20GHz)

– Moisture absorption impact on Dk, Df

– Breakdown Voltage Analysis

– Simulate results of high speed buses …. DDR3, PCI2,3

– Thermo-Mechanical - Critical Margin Degradation Review

• Define and correlate test metrology to critical defects

• Define the PCB material property requirements

• Define the material set parameters and test conditions for all relevant market segments

• Carry out the necessary testing of available materials from participating companies

• Publish a set of material guidelines

• Drive test conditions and material properties into supplier data sheets

• Large number of tests proposed may impact schedule for Phase 2 testing schedule

12-10 9-11

Focus Area:

Sep-12 TIG:

Project Members

Environment

ECE

HFR-Free PCB Materials

HFR-Free Technology

Leadership Program

HFR-Free Signal

Integrity

Chair: Stephen Hall, Intel;

Co-Chair: David Senk, Cisco

Project Chair: Project Co-Chair:

Strategy Tactics Start: End:

Issues Graphics

Focus Area:

Sep-12 TIG:

Goal: Define the electrical signaling and PCB material property requirements as well as the associated test conditions

Environment

ECE

HFR-Free Signal Integrity – Phase 2

David Senk, Cisco Stephen Hall, Intel

• Identify candidate materials for evaluation

• Poll the supplier base, keying in on candidate materials for market segment applications.

– Identify candidate HFR-free laminate materials to allow interchangeability for standard halogenated materials

• Define the electrical signaling

• Define the material set parameters and test conditions for all relevant market segments

• Carry out the necessary testing of available materials from participating companies

• Publish a set of material guidelines

• Drive test conditions and material properties into supplier data sheets

• Higher permittivity of HFR-materials leads to more crosstalk & reduced bus performance

• More crosstalk necessitates more routing area which can lead to increased cost

• Reduced Margins

08-10 09-11

3.4 3.5 3.6 3.7 3.8 3.9 4 4.1

3.4

3.6

3.8

4

4.2

4.4

4.6

4.8

5

15 17 19 21 23 25

Eye Area (ps-volts)

perm

itti

vit

y

Eye from lower limit of 1080 FR4

Eye from upper

range of HF

materials on the

market

37.5% margin degradation

voltage

Time, ps

voltage

Time, ps

Nominal 1080 FR4 permittivity

Focus Area:

Sep-12 TIG:

Project Members

Environment

ECE

HFR-Free Signal Integrity

HFR-Free High Reliability

Chair:

Steve Tisdale,

Intel

Project Chair: Project Co-Chair:

Strategy Tactics Start: Anticipated End:

Issues Graphics

Focus Area:

Sep-12 TIG:

Goal: Promote standards for bromine flame retardant (BFR) free printed wiring boards

Miniaturization

Organic PCB TIG

HFR-Free High Reliability PCB

-- Stephen Tisdale, Intel

• Phase 1.0- Initiate project

• Phase 1.1- Review prior work and identify testing method

• Phase 1.2- Develop, manage, and execute performance testing

• Phase 1.3- Compile results, evaluate and publish results

• Extend results of the Halogen Free PCB Phase I Project

• Build on industry knowledge and capability

• Create a proactive stance in the electronics industry for other non-regulated halogenated organic substances

• Stimulate supply capability

• Consider unique market segment requirements

• Identify technology readiness and gaps

• Determine HF board level reliability for various components

10-08 06-10

Focus Area:

Sep-12 TIG:

Project Members

Miniaturization

Organic PCB TIG

HFR-Free High Reliability PCB

Eco-Impact Evaluator for ICT

Equipment

Chair: Tom Okrasinski, Alcatel-

Lucent;

Co-chair: John Malian, Cisco

Project Chair: Project Co-Chair:

Strategy Tactics Start: Anticipated End:

Issues Graphics

Focus Area:

Sep-12 TIG:

Goal: Develop a tool to more easily derive key eco-environmental information for an ICT equipment / assets

Environment

ECE

Eco-Impact Evaluator for ICT Equipment – Phase 2

John Malian, Cisco Tom Okrasinski, Alcatel-Lucent

• Focused on developing an estimator / emulator tool that will provide a degree of accuracy relative to the end results intended use

• Build on the knowledge from the ICT industry, published literature and publicly available data / information

• Final development and deployment of the data collection and maintenance survey

• Focused on commonly used equipment / assets within the ICT industry

• Centered on generating prototype tool leading to an industry standard

• Intended to be periodically updated

• Building on the knowledge from the ICT industry

• Providing eco-impact for ICT products is becoming an increasing requirement for placing products on the market

• The benefits of this eco-environmental impact estimator will provide a more simplified means of evaluating such impacts

06-11 06-12

Focus Area:

Sep-12 TIG:

Project Members

23

Environment

ECEt

Eco-Impact Evaluator for ICT Equipment – Phase 2

PVC Alternatives

Chair:

Scott O’Connell, Dell Inc.

Project Chair: Project Co-Chair:

Strategy Tactics Start: End:

Issues Graphics

Focus Area:

Sep-12 TIG:

Goal: Perform an Life Cycle Assessment of the electrical and mechanical properties, and safety aspects of PVC alternatives for Power Cord Sets

Environomental

ECE

PVC Alternatives

-- Scott O’Connell, Dell

• Phase I conduct a cradle-to-grave Life Cycle Assessment (LCA) on PVC and PVC-free Alternatives for detachable US desktop power cord sets

• Phase 2 Conduct performance testing of different PVC-free alternatives

• Phase 1 - Develop environmental (LCA) comparing PVC with PVC-free compounds for detachable desktop US power cord sets

• Phase 2 - Develop and conduct a test to gain a better understanding of the electrical, mechanical and safety aspects of PVC-free alternatives

• Industry migration to “PVC-free” materials

• LCA studies can be costly and it remains to be seen if there will be a critical mass of companies who want to share the cost of performing a full LCA on various materials used in US Power Cord Sets.

01-11 07-11

Focus Area:

Sep-12 TIG:

Project Members

Environment

ECE

PVC Alternatives Initiative

27

iNEMI Active Environmental Projects

• All are driving scientific study of key electronics

manufacturing alternative materials, design practices,

&/or product performance metrics

• The goals are to deliver highly reliable, user friendly, and

environmentally friendly products and processes

• Many key projects are wrapping up in depth learning and

results in 2012

• To get the most learning and benefit from iNEMI projects

you need to be an iNEMI member and GET INVOLVED

28

Feedback??

29

Thank You