Index

aablative laser processing 635abrasive material 750accelerated stress test 212acrylate-based UV inkjet ink formulations 136acrylate monomers 136, 653acrylic acid copolymers (ASE) 190active-matrix (AM)– organic light-emitting diode 232– technologies 651acylphosphine oxides 64, 71, 120– photoinitiators 73, 85additive manufacturing (AMs) 7, 650, 865– key strengths 650– technologies 649additives 201adhesion 209, 653– ink 784– poor 484– technologies 380– valuation of 211aerosol cans 737aerospace 649Afinia L801 desktop label printer 344agglomeration 199agility 650AGS Turbiscan 35air-cooled light sources 536aircraft 654air flow– cross-flow to filter out dots 315– speed 572AirProducts 167aliphatic acrylates 135amines 85– coinitiators 85– modified oligomers 86amino alkyl radical cation 78α-aminoketone 69, 83

– derivatives 70– photoinitiators 70amorphous solid 376amphiphilic character 137AMs. see additive manufacturing (AMs)anionic chemical dispersion systems 185Annovi, Alberto 4anthraquinone 182antireflection (AR) 400AOI. see area of interest (AOI)application– development 581– line printing 19– printed antennae 5, 18– printed batteries 18aqueous dispersions 108aqueous ink system 25, 55, 152, 163, 781– dynamic surface tension response 164– latex ink, formulation of 164– pigment inks 172, 173– UV inks 172area of interest (AOI) 449ArrayJet microarrayer 676Arrhenius equation 562arylglyoxylate ester photoinitiators 77aryl iodonium salts, exposure to UV

radiation 131aryl sulfonium 131aseptic filling/sterilization 811ashing 524assembled film battery 19ASTM Standards 381atmospheric plasma 515atomizer 762automotive– maintenance systems 275– and motorcycle industry 737– presses 762azo/diazo class disperse dyes 182

877

Handbook of Industrial Inkjet Printing: A Full System Approach, First Edition. Edited by Werner Zapka. 2018 Wiley-VCH Verlag GmbH & Co. KGaA. Published 2018 by Wiley-VCH Verlag GmbH & Co. KGaA.

bback-to-back printheads 256Bakelite resin 747ball mills 196bank card reader 629basic web lead module 844batch processing 198batch-to-batch consistency 139bell/waterfall method 7632,2´,2´-(1,3,5-benzinetriyl)-tris(1-phenyl-1-H-

benzimidazole) (TBPi) 235benzophenone photoinitiators 81Bernoulli’s principle 824biaxially oriented polypropylene (BOPP) 801bidirectional printing 790big volumes model 4, 5bimolecular reaction mechanism 80binders 200biodegradable biomaterials 661biofabrication 674bioinformatics 674biopatterning 661bioprinting 661, 674– inkjet-based 662bisacylphosphine oxide (BAPO) 70, 71, 73– photoinitiators 734,4´-bis(N,N-dialkylamino)

benzophenones 122bisque firing 763bit-map data 220black inkjet 136black pigments 167bleached chemical wood fiber 749bleeding effects 174Blue Wool Scale 136board printing JUPITER JPT-C-2100 828boiling point 563bonding agent (BA) 465, 466bovine serum albumin 666brittleness 405building integrated PV (BIPV) 639built-in camera detection system 746bulk factor 208bulk ink properties 414butt join stitch 792

cCaber Apparatus 419CAD data 220CAD files 635, 655cadmium selenide (CdSe) system 234cadmium sulfide (CdS) 641cadmium telluride (CdTe) 639

– semiconductor junction 641cakeof unsintered powder 655calcium carbonate 368calibration, of inkjet press 693camera-based inspection system 773Canon FPA-1100 NZ2 single module 855Canon Océ Colorwave 910 346capability targets 303capacitance 559, 637– to digital converter 626– sensors 637, 823–– humidity 627capital-intensive development 736caprolactam 654cartridges 758case study– HPPage-wide array 326–– application areas 331–– drop formation process 329–– printhead design 327–– specifics of TIJ technology 326– hybrid aqueous–UV 48–– head design comparisons 49–– influence of waveform 51–– ink concept introductions 48–– ink recirculation 51–– latency, head interactions 49–– managing nozzle health 53–– print process factors 56–– substrate/ink comparisons 55–– sustainability, head interactions 54cationic– inks–– free radical, performance

comparison 131–– inkjet 131– photoinitiator 131– pigments 368– polymerization 131CDF. see cumulative distribution function

(CDF)cellulose– based substrates 166– cellulosic fibers 363, 364– polyester blend 191CEN Standards 381center-to-edge temperature deviation 574centrifugal glazing 763ceramic effect 768, 782ceramic inkjet inks 136, 151, 154, 159, 160,

772–775– characteristics 152– color/effect 156

878 Index

– and consumption 767– density 156– digital decoration 767–– ceramic 151– filtration time 156– firing cycle 151– glaze/ink interaction 157– industrial ceramic tile manufacturing 151– interaction–– before firing 157–– during firing 158– liquid fraction 152– manufacturing cost chart 768– pigments 153, 763, 767– printing 157– properties 154, 767– safety considerations 160– saturation point curve 159– shelf life 8, 156– solid fraction 153– storage 156– surface tension 156– viscosity 155ceramic laminate 764ceramic market 154ceramic materials 564ceramics printing 766ceramic tiles 4, 5, 780– batching 761– body composition 761– decoration 773–– requirements 761– design 765– digital decoration for 766– drop trajectories in 766– drying 762– firing 763– forming 762– glazing 763, 770– humidity of 769– industry 4– inkjet printing of 765– manufacture 5, 761–– challenge for 5–– process 761, 762– mixing/grinding 761– printing 765– raw materials used in 761– single-pass inkjet printer design for 772–– electronics and print engine 777–– frame and color bars 772–– ink distribution system (IDS) 775–– maintenance procedure devices 780

–– printheads 773–– RIP/color management software 778– spray drying 762– typology, sizes and glazing line speed 763– unglazed 764channel walls 264charge electrodes 314charge plates 315charges-coupled device (CCD) 402– camera 439chemical compatibility 493– test kits 475chemical composition 381chemical dispersion systems 185chemical incompatibility 474, 475chemical primer solutions 380chemical reduction 216chemical resistance 381– of polymers 382chemical treatments 380Chevron actuator 289Chevron architecture 289Chevron design 288chips 340chlorobenzene 230, 233– spin coating solution 231chlorotriazine functionality 166chondrocyte 667chromatic development 158CIELAB space 694CIJ. see continuous inkjet (CIJ)classification, labeling, and packaging

(CLP) 161clays 157cleaning glass surfaces, treatment methods

for 400cleaning procedure, conditions for finding

suitable 399CleviosTM AI 4083 233clocking bottle transport 805closed-loop system 825cloth touching 480CMYK. see cyan, magenta, yellow, and black

(CMYK)coalescence, acceptable/unacceptable 169coatings 200– chemical primer 380– material, chemical composition 186– paper 368– surface liquid absorbency 186– types 368cockle 169coding 141

Index 879

coefficient of thermal expansion (CTEs) 212collapsible tubes 737colorants 749, 753– for black inkjet inks 167– inkjet inks with pigments 172Colordyne CD3600 Laser Pro label press 345colors– aqueous 167– balancing 825– bars 772– durability 142– fastness 5– gamut 142– ink 168– intensity 767– management 188, 828–– software 828– matching process 819– pigments 167– printing stage 743– registration 488– reproduction 186– saturation 153– science 752– sensation 752– unacceptable/acceptable bleed 168combinatorial techniques 674COMET ebeam Technologies (Comet

EBT) 551, 554commercialization– available inkjet label press (see graphium)– bioprinting technologies 669– challenges 631compact/thin chassis design 267compatibility test 493complementary metal-oxide semiconductor

(CMOS) 232, 354, 402complex digital converting system 735complex label designs, easing production

of 726– banner printing 727– combining power of digital with versatility of

flexo 726– fit-for-purpose 726– substrate choice 726– variable data 727complex rheology– continuous inkjet (CIJ) 425– drop-on-demand inks 428– during ink formulations, additives to

optimize 423– with jetting behavior 425component K 492, 498

– rendered and adapted version 499computational fluid dynamics (CFD) 592computer-aided design template 322conduction 569conductivities 8, 493, 561, 562– inks 196–– surface treatment, droplet size effect of 219– polymers 318cone screw 278confocal/interferometric microscopy 205contact angle– in dependence on surface conditions 398– for water on some typical polymers 380– and wetting behavior, relationship 379contaminants 143, 528, 657– ambient control 577– control 576– gas tight design, of the drying oven 576– proper refreshment 576– sealing of insulation materials 576– suitable web support 576– void defect 858– web transport through oven 577continuous inkjet (CIJ) 11, 25, 141, 313,

316, 841– binary charge deflection 314– device of thermal stimulation type 354– inkjet printing behavior 426– Kodak Stream technology 351–– principle of operation 351–– scalable technology 354– printing 662– print system specifications 842– process 314, 351, 356–– binary charge deflection 314–– weaknesses 314continuous liquid interface projection

(CLIP) 659continuous pressed laminates (CPL) 751continuous single-pass printing 824controlling layer thickness 16convective drying oven 567conventional– bulb dryer 731– inkjet systems 856– labeling machines 801– photolithography 851, 852, 863– printing–– finishing methods, advantages/

disadvantages 733–– machine 807–– processes 742–– vs. digital printing 733

880 Index

– tube manufacturing line 738conversion efficiencies 493converting processes 689– CMYK process printing 692– gamut 696– by market sector 709– Pantone system 695– primer 690– printing with high opacity white ink 691– spot color printing and emulation 694– unwinding/rewinding 689– web cleaning and corona treatment 689conveying 811conveyors 743cooldown 574copolymerization 377copper indium gallium diselenide (CIGS) 639– solar cells 646copper oxide particles 563corona 17, 484, 515– system, with discharge in operation 519– treatment 689, 690–– device 484–– module 516corrosion 533cotton– for printing 170– reactive dye printing 169couplings 476critical micelle concentration (cmc) 168critical surface tension 379– for water on some typical polymers 380cross media 835crossover digital, flexo, and digital

hybrid 698cross-process direction, imaging

models 590CrystalPoint 30CSG pty 258cumulative density functions 452cumulative distribution function (CDF) 452cure delay 139Curie temperature 287custom digital machine vision systems 465customer requirements, software, and user

concept 814cyan, magenta, yellow, and black (CMYK) 185– data 692– pigment inks 357– printing 693, 743Cycle4Green (C4G) 687cylindrical packaging decoration 744cylindrical screen printing process 15

ddata handling, in industrial inkjet printing 4652D barcodes 835DBP. see double-belt press (DBP)decoration– decorative paper, printing on 748– decorative plastic laminates 747– designs 801– process 5décor industry 825décor inks 754décor paper 747, 748, 750, 752, 819, 828– characteristics of 748– impregnation of 755– with inkjet primer 751–– cons 751–– pros 751– printing 750–– history of 747–– for inkjet 750décor printing– inkjet 752–– inks for, selection criteria 753–– printheads for, selection criteria 753– paper drying in 755– print houses 748– technical description, with inkjet

printing 748décor storage 820D300e direct digital dispensing system 6753D effect 5deflection plates 315Delta E 753demagnification 446demagnifying telecentric optic 446dendrimers 96density correction 793desktop applications 25desktop printing 163development cost 7893D hydrogel structures 322Diamtix recirculation systems 166dielectric barrier discharge (DBD) 515dielectric constants 386diethylamino-substituted benzophenone

derivative 82, 105diethyl phthalate (DEP) 4232,4-diethylthioxanthone (DETX) 70diffusion-hindered photoinitiators 146diffusive wave spectrometer (DWS) 418difunctional α-hydroxyketone

photoinitiators 106difunctional photoinitiator 84

Index 881

digital decoration 765, 770, 782digital documents 650digital fabrication process 820digital files 646, 650, 655digital glazing 782, 784digital hybrid, advantage of 697– cold stamp foil 700– inline flood coat and spot varnish 698–– lamination 700– metallic process 701– peel and reveal 700– spot colors and specialist inks 701digital inkjet printing 645, 800– label 147digital inks 772, 782digital prepress processes 736digital printers 744, 771, 782, 817, 822, 828– Hymmen’s JUPITER line 818– inkjet 180digital printing 146, 693, 801, 833, 840– conditions affecting 734– disadvantages 734– of labels 683– machine 737– technology 820, 839– unit 731– UV inkjet print engine 732digital production technology 830digital techniques 8, 801digital working principle 489Dimatix 26– inkjet printer 605– Q-class 544-dimethylamino-substitued derivatives 70dimethyl benzil ketal 66, 693D inkjet printing– direct 651– in life sciences 661diode-pumped solid-state laser 641direct printing 180, 802, 817direct product decoration printing 265direct-to-garment (DTG) 179direct-to-shape– digital motivation 800– full height printing of shape 793– printing 141, 799–– digital 816discing 763dispersants 195, 199, 201disperse dyes 170, 182– inkjet inks 179Disperse Red 60 183dispersions 197

disruptive innovations 800dithiocarbamate photoinitiators 592D linearization/density correction 7942D molten area 655DMP-2800 603DoD. see drop-on-demand (DoD)Dolcevita

745Doppler setup– on microdrop jetting device 441Doppler-shifted laser beam 441double-belt press (DBP) 751, 817double ITO (DITO) design 637double printing 792d31 piezoelectric constant 2473D printers 6522D printing 6503D printing 650, 8513D product decoration 262drawer loading door, ideal for glovebox

integration 523draw-release-reinforce (DRR) 292– timing 293dried ink evaluation 36– adhesion 36– color 36– fluid resistance, compatibility 37– mechanical resistance 37– weathering and other stress tests 37drive per nozzle (DPN) technology 280,

281, 795droplet diameter 495droplet generation 229, 318, 448– dimensionless parameters used to

model 665– and ejection 663– high-resolution 446droplet size 498droplet speeds 483droplet velocity 446, 447drop-on-demand (DoD) 151, 184, 352, 355,

411, 841– frequency 439– inkjet dispensing technologies 663– inkjet inks 186– inkjet printing–– behavior 427–– methods 663drop-per-dot (dpd) 453drops– ejection process 319– formation process 26, 41, 55, 434– jetting, effect of 596– laydown strategy 791

882 Index

– placement 585–– error 584, 585, 588–– repeatability 858–– strategy 794– poor formation–– acoustic sensing 14, 435–– air bubbles 435–– capacitive sensing 436–– failure origins 432–– feedforward control 441–– impedance spectroscopy 437–– ink layer 434–– in-line and off-line detection of 431–– meniscus consistency 432–– monitoring droplet formation 438–– nozzleplate wetting 433–– paint 435–– pinch-off 435–– satellite drops 434– shape analyzer 512– size 52, 583–– requirement 583– surface interaction 56– visualization–– frequency dependence 41–– in practice 39–– systems 40–– velocity determination 40, 595–– waveform basics 40DR pulse duration 293Drupa 2008 26drying oven 568– air flow system 568– convective 19, 567– heating system 568– horizontal–– hunch back transport 568–– straight transport 568– internal ambient control 568– oven tunnel 568– refreshment system 568– U-shape horizontal web transport 568– vertical web transport 569– web support 568drying process 19, 47, 567, 569– convective 19, 569– curing/sintering 570– electron beam (EB) 544– etching 524– evaporation 569– glazing 763– grinding 762– heat thermofixing process 171

– spray 762– stage, water removal 175DST measurements 343D Systems 653D 263T eco glass 402dual-beam laser interferometer (DBLI) 303Du Noüy principle 33duroplastic resins 751Durst 26dye diffusion thermal transfer (D2T2) 179dyeing polyester 170dyes 167, 184– aqueous inks 168, 170–172–– background 171–– as colorants 167–– direct print process 171–– disperse 170–– drop-on-demand desktop systems 167–– process 168, 170–– reactive 169–– sublimation 172– inks 166, 170, 181–– aligns 171– molecules 191– particle stability, ink carrier system 184– sublimation digital imaging, reliable colorant

development 191– sublimation inkjet inks 180, 181, 184,

186, 190–– advantages of imaging 181–– color considerations 187–– development opportunities 191–– engineering aspects 188–– printing 187, 188–– sublimation colorants in digital

imaging 182–– transfer media/substrate 184– sublimation transfer printing

mechanism 183dynamic compensation techniques 589dynamic contact angle 45dynamic ink properties 414– surface tension 414– viscoelasticity 415dynamic nozzle failure 825dynamic scanning calorimetry (DSC) 35dynamic surface mapping 797dynamic surface tension 33Dyne test 690

eEB. see electron beam (EB)ebeam inkjet dryer (EID) 553

Index 883

– prototype 553, 554ebeam lamps 550– new generation 553ecological goals 800economically bottler needs 800economically market needs 800edge banding 748effects inks 782elasticity 377elastomeric polymers 657elastomers 377, 657electrical conductivity 208electrical conductor 209electrical impulse 201electrical resistance 461electric conductivity 416electrodes– material, 3D view 19– printed on current collector 19electromagnetic spectrum– UVB and UVA range 64– UV region 118electromigration 212electron accelerator 550electron beam (EB) 130, 543– advantages of 544– classic processor 550–– pumped 551– cross-linking 543– curable liquid media 545– curing 543–– drying 544–– enhances product qualities 544–– processes 547– formulations 545, 546– for inkjet applications 553– lithography 854– operating parameters 547–– dose 547, 548–– energy consumption 549–– inerting 549–– operation and maintenance 548–– penetration of energetic electrons 547–– safety and shielding 549– processor 551– sterilizing 543– UV curing, differences between 545electron beam curing (EBC) 545electron beam melting (EBM) 659electronically align nozzles 466electronic circuit printing 851electron penetration 548electron processing system 550

electron transfer layer (ETL) 611, 614electrostatic inkjetting 319electrostatic mechanism 313Emerald QE 244EMI/RFI remediation 319emission spectrum 533– UV-A 533– UV-B and UV-C 534– UV LED 535E modulus 385emulsion polymers 175encoder system design 741end-shooters 478energy consumption 642energy density 123– photometric evaluation 127energy-efficient equipment 193environmental conditions 381, 636, 653epoxy molding compound (EMC) 630Epson 301EPS/PDF file 738error compensation 584erythritol acrylates 135esters 152estimated time to failure (ETF) 316ethylene glycol 228ethylene/propylene glycol acrylates 135EuPIA 145EUV. see extreme ultraviolet (EUV)evaporated metal double four-point measuring

probe 460evaporation 567exposure time 448extensional rheometers 418extreme ultraviolet (EUV) 852– lithography systems 855eye irritation 138

ffabrication technology 354– OLED devices 613feature shearing defect 858feature size 493feedback controls 442feedback encoders 483feldspars 157, 761FFEI Graphium 692filament break-up process 418filament stretching techniques 419filament thinning 420filling 811film-assisted molding (FAM) 622, 630film coatings 369

884 Index

film manufacturing 377– casting/extrusion processes 377– surface tension 13, 378–– modification 378filters 476firing chambers 155firing cycle 154firing process 157flame-retardant materials 658flame spray pyrolysis (FSP) 197flame treatment 516flash lamp systems 559flatbed cylinder screen printing process 14flatbed screen printing process, principle and

nomenclature 13flexographic printing 631– units 735flexography 7, 8Flexo UV ink 697FlexSmell– label, functional inkjet-printed 610– schematic design 609flex to install 212floating wood tiles 817floor tiles 763– production 768fluid flow– behavior 8– compatibility, wider 25– flow reaction technology 198– rate 476fluid–gaseous interphase 202fluid measurements, overview 33– other properties 35– particle size 33– sedimentation 34– surface tension 33– viscosity 33fluid viscosity 476fluorescent polymers 225fluorine-doped tin oxide (FTO) 641fluoropolymers 373food packaging 25– applications 84, 93, 147– legislation 94– migration mechanisms 143– printing 142food safety 142– packaging printing 143– of printed package 144footwear industry 658forced flow system 823formulations 546

fossil fuels 323, 639FOTURAN glasses 405fourth industrial revolution 815frame design for minimization of UV stray

light 542free-flowing powder 762frits 157Fromm Z parameter 665FujiFilm 26FUJIFILM Dimatix, Inc. 241, 246, 248, 581,

582, 589, 590, 592– DMP-5000 floor 672– DMP series printers 671–– materials 671– printhead geometry 242– Samba G3L 189– by VersaDrop 243full-width at half-maximum (FWHM) 104functional inks 210, 662– formulation 204– inkjet 212– printing 7, 489

ggallium-doped medium-pressure mercury

lamp– emission spectrum 121gallium halides 120Gallus DCS 340 with predigital flexo unit 692Gallus ECS340 731Gallus Labelfire– digital print engine–– inkjet printhead 732– Gallus Labelfire 340 731–– digital print unit 732–– technical performance 733gaming application, in BILD tabloid 834gas evaporation 216gasoline 318gas permeability 380gastrointestinal tract 87Gaussian beam (GB) 860Gaussian-like weight distribution 94generative manufacturing 7ghost droplets 454Gibb’s free energy 323glass– ceramic 404– composition 395– contact angle–– determination 397–– 46° of noncleaned glass surface 397–– 108° on hydrophobic glass surface 397

Index 885

– down-draw process 394– enhanced glass strength 395– formats 395– fractions 157– frame mounting 406– free-standing 406– geometrical properties 395– laser drilled 406– manufacturing process 392, 395–– conventional technology 393–– melt diagram for 392–– thin glass technology 393– material 401–– AF 32 Eco Thin Glass 402–– B 270 I Ultrawhite Glass 404–– D 263 T Eco Thin Glass 402–– MEM pax 402–– optical glass 401– photosensitive 405– physical/chemical properties 393– selections, properties 395– substrates, structuring 405– surface properties 396– surface treatments 396–– cleaning and coating for touchscreen

application 400–– methods to clean 398–– quality, determination of 396– transition temperature 376, 377, 854– types–– main characteristics 391–– properties of 403– as universal material 391– up-draw process 394glazers 5glazes– achieving 159– characteristics 158– composition 158– ink interactions 767– same inks for different 159global inkjet systems 796globally harmonized system (GHS) 161glost firing 763glycerin 229glycerol 165glycols 152– aldehyde 197GMP principles 145, 146gold nanoparticles 617granulation 762graphical printing method 364, 601– décor printing 8

graphic software 746graphics printing 766graphium 23, 720– design, coupled with Fujifilm’s UV ink 721– digital hybrid label press 23, 723, 724– FFEI Ltd 723– flexibility with 721– productivity 723–– automated cleaning 724–– finishing 725–– manipulation of the crossover 724–– modular 724–– print bar 725–– wide web width 724–– workflow 725– unique capability of integrating optionalflexo

stations for 720gravure 8– printing 609, 818gray component replacement (GCR) 719grayscale capable 257grayscale printing 497green bodies 773gutter 315

hHagen–Poiseuille equation 320Hahn–Schickard works 632hardware– driving arrangement 50– LEL alarm 574– safety 574Harima’sAg nanoparticle conductive ink (NPS-

JL) 218, 221HDNA. see high-density nozzle architecture

(HDNA)HD plates 686head– alignment 587– maintenance system 480– position error 586health care 649heating equipment/method 181, 190heat-sensitive anchoring side 191height profile of the edge of the electrode 19Hewlett Packard 657hexamethylbisimidazol (HABI) derivative 77high-density fiber 818high-density nozzle architecture (HDNA) 321– design options 331– firing chambers and nozzles 328– printhead 329high-frequency

886 Index

– rheology 428– rheometers 417high-pressure laminate (HPL) 747, 751– decorative 751– for high-resistant surfaces 748high-speed camera setup– at normal viewing angle 593– at side viewing angle 593high-speed in-flight jetting photographs

412high-speed sintering (HSS)– approach 656– machine 655–– working 656– parts made by 658– potential applications for 658– process 654high-speed video, particle tracking 593high standoff printing 591high-volume printing 478, 833histogram changes 451histogram matching 452hole injection layer (HIL) 613homolytic cleavage reaction 66hot melt– applications 241– inks 30– transfer media 187HP DeskJetTM thermal inkjet printer 667HPL. see high-pressure laminate (HPL)HP Latex platform 26HP T300 Color Inkjet Web Press 465–467HSS. see high-speed sintering (HSS)humidity 396hybrid– approach, benefit of 636– aqueous UV inks 172– inkjet ink systems 186– label printing system 731– laser/inkjet processing 643– machine 635– model 698– OSI process 642– printing system 708, 734–– challenges 734– processing 5, 11, 21, 635, 636, 642, 646– system 697–– production, managing 727– UV inks 132hydraulic path 476hydrogen abstraction 80hydrophobically modified acrylic acid

copolymers (HASE) 190

hydrophobically modified polyurethanes(HEUR) 190

hydrophobic synthetic polymericmaterials 181

1-hydroxy-cyclohexyl-phenyl-ketone 67α-hydroxyketones 66, 68– derivative 100– photoinitiator 64, 109hydroxyl-containing fiber materials 191Hymmen 817– approach, JUPITER digital printing line 821– inkjet technology, chronological

development 821– JUPITER machines 825–– technical challenges 825– printer, additional features 831– software 825

iidentification (ID)– IDTechEx 7– protection 232IIJ. see industrial Inkjet (IIJ)iLIF setup 440image quality 355– color gamut 356– dot size and resolution 355– image registration and artifact detection 356– poor 484Imagexpert 438imaging models 589immersion lithography 851– quad-patterning 864Imperial Chemical Industries (ICI) 179impregnated paper 819impregnation resin 750imprinted patterns, SEM images 866imprinting fluid 851impurity control 190Inca Digital 26indium phosphide (InP) 234indium tin oxide (ITO) 611, 637– coatings 607–– glass, IJ ink confinement 644–– substrates 226, 638– precursors 318– used in touch sensors 637individualization 833inductance 559industrial application requirements 241– general purpose 250– high-performance graphics 249– legacy general purpose 251

Index 887

– legacy products 241– MEMS technology 242– nonwetting coatings 247– Q-Class family 243– RediJet jetting technology 244– Samba printheads 10, 246– sputtered Nb-PZT film 247– StarFireSG1024/A 10, 246– StarFireTM SG1024/C 245– VersaDrop jetting technology 242industrial digital printing 817industrial inkjet (IIJ) 737– background 24, 738– implementations, system approach 471–– automate right process 472–– chemical compatibility 474–– demonstrator fail 472–– electronics/software 485–– encoder 483–– human error 487–– ink systems 478–– maintenance systems 480–– motion systems 481–– operator error 487–– postprocesses 485–– preprocesses 484–– pressures 475–– printhead 483–– speed 481–– temperatures affects 477–– total cost of ownership 473–– UV pinning lamps 487–– wobble 482– printing 7, 163, 431–– simulation 741– technology 738industrial printing 7– applications 136– production technology 817industrial-size vacuum plasma system 522Industry 4.0 815– and direct print 815– within the KHS 816in-flight drops 415infrared absorbing ink 655injection molding 649ink distribution system (IDS) 775, 783inkjet printing (IJP) 601– direct-write laser processing, comparison

of 636– drop-on-demand 315– to enable selective sintering 654– fundamentals of 313

– of labels 683–– 2000 Barco Dotrix 683–– Drupa 2016 684–– Label Expo 2007 683–– Label Expo 2015, hybrid concepts 683–– Label Expo 2016 684– machine 757– of osteochondral material 668– and reaction 651– station 740– technologies 841–– companies role in developing 675–– selection 841– unit 503inkjetting 16, 490– advantage 707– approach 656–– to sintering 657– biofabrication 669– bioprinting 666, 669–– from lab to fab–scaling 671–– technologies, commercial 669– chamber architecture 318– coated décor paper 750– colors 750– in custom and surface manufacturing 322– décor paper, in paper manufacturing

process 751–– cons 751–– pros 751– dispenser 854– drug discovery 674–677– EB inks 555– firing 166–– timescale 165– fluid 200–– shear viscosities 417– formulations 231– head 840– imprint 848–– accuracy 845–– positioning 848– industry 824–– additive manufacturing, future

perspective 652, 659–– 3D printing, future perspective 21, 659– inks 131, 139, 195, 413, 750–– droplets with a (porous) substrate surface,

interaction of 366–– manufacturing process 767–– performance 136– lab printing machine 757– machine for décor printing 757, 758

888 Index

– nozzles 269, 437– other forms of 319– for other processes 321– overview of 11, 313– papers 750, 754–– cons 751–– pros 750– primer 751– printheads 635, 739–– operates 416–– technology 662– printing 5, 141, 225, 226, 489, 506, 606, 613,

644, 653, 655, 748, 750, 756, 768–772, 787,788, 845

–– adhesion of 620–– of antenna structures 630–– boards 756–– challenges 612, 769–– combined with photonic curing 561–– conductive silver tracks, white light

interferometer measurement 618–– droplets on liquid-crystal polymer film 220–– IDCs 626–– machines 787–– metal lines 617–– silver line 621–– silver structures, fluid-level sensor

demonstrator 628–– silver tracks 624–– on PI 618

–– temperature sensor structure onPET+PBT 624

–– tile 770–– tracks 619–– UV-curing acryl-based insulator 628– pros and cons 5– reliability, quantitative assessment 445–– analysis algorithm 448û456–– computing time 456–– droplet presence analysis 454–– histogram matching 451–– idea and experimental setup 446–– low contrast optimization 451–– preflight techniques, summary 453–– robustness to nozzle position variation 450–– theoretical considerations 447– single-pass printer 763– system 656, 657–– design considerations 854–862– technology 3, 489, 490, 649, 650, 737,

787, 851–– cons of 4–– important aspects of 492

–– into industry 4–– in lithographic patterning 851–– potential user 3–– pros of 3– vs. screen printing, direct comparison 12inks 811– borne contaminants 445– characterization methods 31– combined bulk properties 414– contact angles 248– delivery systems 753– density 583– droplet ejection 440– feed pipe rules 270– filled channel–– acoustic response 298– flow behavior 413– flux 320– food safety and sustainability 812–– migration 812–– recyclability 813– formulation 131, 136– glaze contact surface 157– ink behavior 56– ink interactions 47– methacrylate/allyl and vinyl groups 134– particle size 367– performance 163– physical fingerprint 423– printing 183– production–– pigments used for 767– properties 9–– acrylate functionality 135– receiving layer 129– receptive additives 751– recirculation system 733– rheology 218– robustness and appearance 811– solid fraction density 156– stability 268– substrates 358–– ISO-certified program tests available

papers 359–– OEM aqueous pigment ink

formulations 358–– pairings 496– supply system 743– system–– air removal from printhead 273–– design 739– technology 26, 48, 357–– aqueous 27

Index 889

–– choosing an ink type 31–– Energy-Curable 30–– Hot melt 30–– hybrids 31–– oil 29–– solvent 28– type selection 754– viscosity 155– wetting improvement 46inline– digital printing–– label printing systems 731–– in newspapers, requirements 840– resistance 459– typical machine configuration 399InPrint 7input controller 828insulated junction bipolar transistor

(IGBT) 559integration– CMOS-MEMS processing 354– digital converting system 735– digital printing system 840– inkjet components, in newspaper press 843– inkjet interface 847– inkjet workflow – register process 847– integrated circuit (IC) 206– successful creating 714–– ability to print flat vibrant colors 718–– factors to consider when selecting

printhead 714–– gray levels and resolutions 716–– highlight detail 719–– performance 720–– qualifying a head to a specific

application 714–– reliability 715–– selecting right printhead technology for

label market 714–– smooth blends 719–– uniformity 718–– viscosity range 716integrator 490, 492– role of 490, 491intelligent layout 728– automated image matching 728– CAD import 728– job container with multiworkflow

automation 729– MIS integration 728– object specific optimization 729– rules-based step and repeat 728– variable data 729

– versioned and ganged labels 728– wide range of supported devices 729interdigital capacitors (IDCs) 626– layout for printing 627intermediate media 186internal acoustics 445International Color Consortium 739International Electrotechnical

Commission 200International Roadmap for Semiconductors

(ITRS) 853internet enquiry 737intracolor drying stations 56intravenous (IV) 148iron-doped medium-pressure mercury lamp– emission spectrum 121iron oxides 749irradiance 123irradiation 657isobornyl acrylate 135isolation 569isopropanol (IPA) 226isopropyl thioxanthone (ITX) 82ISO Standards 381isotropic conductive adhesive (ICA) 619iterative learning control (ILC) 442ITO. see indium tin oxide (ITO)

jjet and flash imprint lithography (J-FIL) 852,

853– applications in semiconductors 862– defectivity 859– improvements 857– in inkjet dispensed drops and contact

molding 853– multitiered dual damascene structures 864– nanoimprint lithography 862– process for nanoscale patterning 855– spin coats 853jet break-up mechanism downstream 413JetSpyderTM printhead technology 676jetting– algorithm 220– assembly 588– behaviour 605–– between colors of a commercial UV ink

sets 412– conditions–– complex rheology characterization

tools 416– frequency 856– performance 165

890 Index

– sustainability 42–– automated methods 43–– manual methods 42– temperature 34, 154JetXpert system 40J-FIL. see jet and flash imprint lithography

(J-FIL)JPT-C-2100 prints 830JUPITER– comparison between 830– inner view 826– printers–– JPT-C-2100 829–– machine 826–– modular concept 823– products printed by 829

kkaolin 749KHS Company 799– development parameters 804kiln process 769kilohertz systems 527kinetic energy 324Kodak Enterprise Inkjet Systems Division 351Kodak PROSPERTM 351– inkjet 356Kodak Stream Technology 842Kodak Versamark 6240 technology 842Konica Minolta– documentation 260– inkjet division 254, 738– inkjet printhead technology 253–– alignment 277–– bad ink 276–– basic waveform effect 260–– consistency 272–– electrical waveform signals 261, 277–– future prospective 280–– history 253–– interleaving printheads 257–– KM printhead strengths 267–– life 273–– markets/geography 278–– quality 271–– reliability in inkjet printing 267–– series 255–– type 204 printhead 254– inkjet team 258– inkjet technology 742– KM512 264–– actuator structure 256–– KM512LN printing heads 614

–– printheads 254, 257, 259, 260–– series 258, 262–– vs. KM1024 264– KM1024–– actuator structure 264–– architecture KM512, comparison of 264–– family 263–– KM1024i series 10, 263, 265–– series 262–– typical printhead mounting plate 262– KM-1 B2 sheet-fed press 266– KM drive per nozzle printheads 280– KM1800i 11, 266– KM independent channel printheads, print

productivity 280– KM128 SNG 281, 282–– typical accuracy 282– printheads 272, 278, 279Konica technology 254Konishiroku Photo Industry Inc. (KPI) 253– missing nozzle 254kraft paper 747

llabel functionality 684label printing– optimum compatibility, role of 736label substrates 686Lambert–Beer equation 62laminate flooring industry 817– automatic décor selection 821– color deviation, role of 820– correction lot 821– décor length 821– décor mixing, role of 820– décor storage, role of 820– digital printing, role of 820– lot-size one, role of 820– production speed 821– register correction 821laminate manufacturing– analog process 819– flooring tiles 818– industry 748, 749, 817– layers involved 818– process 819laminate planks 820laminate printing– data transfer 831– integration 831– key features 831– maintenance 831– modularity 831

Index 891

– system approach 831lamination 751larger wide format machine manufacturers 26laser ablation 226, 640– process 636– synthesis 197laser-based solution 655laser direct-write postprocessing 645laser-Doppler interferometry 441laser Doppler vibrometer (LDV) 286laser measuring system 746laser modification 646laser processing, heads 635laser scanning microscope 205laser sintering 643, 654, 657, 658latency comparisons 53latex inks 172, 173, 175latex printing process, drying/curing

stages 175LCD lithography 404LED. see light-emitting diode (LED)LEL. see lower explosion level (LEL)licensee MIT-Inkjet 285ligand-free nanoparticles 197light-emitting diode (LED) 529– characteristics 530– dryers 735– lamp 530– manufacturers 531– radiation sources 107light scattering 446lignins 185linear erosion 450linear machine 743– concept, with continous bottle transport 806– design 805line break defect 858line conveyor belt 764liner materials 688line scan camera 446LineScan technique 447, 455liquid-crystal polymer (LCP) 618liquid electrophotography (LEP) 695liquid fraction density 156liquid-phase sintering 656liquid UV inks, health/safety aspects 137lithography– approaches 631, 863– offset 744– soft 851– thermal imprint 853– tools, increasing cost 862

lookup table (LUT) 451lower explosion level (LEL) 19, 574– condensation 575– decrease air flow speed 575– decrease temperatures 575– enough refreshment 575– preheat drying oven 575– proper air pressure 575low-migration (LM) inks 142, 146, 147– formulation 812– UV inkjet inks vs. standard UV inkjet

inks 146low-pressure laminate (LPL) 751low-pressure plasma principle 514LPKF-LDS process 629LPL. see low-pressure laminate (LPL)lucifer yellow labeled biotin (Y-biotin) 666LUT. see lookup table (LUT)

mmachine concept 802– influencing factors 803machine design 810mandrel 739manroland web systems 838, 841– CROMOMAN 839– integrated inkjet block diagram 846– product inkjet integration 842–848–– automation module details 845–– integrated inkjet operation 848–– integrated inkjet workflow/usability 847–– web lead module details 843manufacturing– capacitive touch screens 636– floor applications 313– process 685marangoni flow 415market sectors 708– label market 708– UV inkjet 708marking 141Martinenghi– link with 738– system 737masking– agents 200– filling improvements 859– techniques 184mass customization 323, 800master printers 772material compatibility 268, 490, 493material properties 380

892 Index

– barrier properties 387–– long-term durability and recycling 388– chemical properties 381– electrical and optical properties 384– environmental effects and durability 386– mechanical properties 383– thermal properties 381Material Safety Data Sheet 138materic effect 5matrixophilic segment 137maximum spreading factor 165M-Class jetting module 241mechanical devices 743mechanical ink jetting (MIJ) 319mechanical Memjet 347mechanical valve inkjetting (MVI) 319– VideoJet Systems International coder

systems 319mechanical weave 767mechanotronic/robotic control 791mechatronics 787, 803– machine 810medium-density fiber/high-density fiber

boards 818medium-pressure mercury lamp 119, 120– emission spectrum 120ME160H two-color version 282melamine-faced chipboard (MFC)

laminate 751melamine impregnated paper, thermosetting

of 756melamine resin 747– based impregnation 756– lamination of 747melamine treated paper 751melting decomposition temperatures

(Tm) 377Memjet– balancing cost vs. performance 341– based products 336– continuing to set standard 347– designed for success 339– drop ejector array 337– future innovations for ink, and

printheads 346– inks 342– key parameters, for current printheads 341– in marketplace 343– printhead 336–– manufacturing 338– printing system 335–– magenta inks 342– technical history of 336

– thermal printhead nozzle 338– Waterfall Printing Technology

335MEMS. see microelectromechanical system

(MEMS)meniscus pressure 776, 783mercury arc lamps 535mercury-doped 134mercury lamps, medium-pressure 122mesh count 16mesh geometry 16metal lines– adhesion properties 619– on injection-molded substrates–– inkjet printing 618– printing results 618– resistance 619metal nanoparticle 197, 216– conductive ink 216– inkjet printing 218– inks formulation–– additives 199–– adhesion 209–– application of functional inks 199–– bulk factor 208–– chemical precipitation 198–– chemical reliability 213–– contact angle 203–– electronic applications 195–– end-user requirements 195–– flame spray synthesis 197–– flexibility 211–– fluid systems/printed patterns,

characterization of 200–– functional inks for printed electronics 195–– laser induced 197–– physical/chemical characterization 9, 200–– polyol process 197–– printability/jetting performance 204–– printed patterns, physical and electrical

characterization of 203–– printing definition 208–– resistance/resistivity 205–– rheology 201–– solvo thermalsynthesis 197–– surface hardness/scratch resistance 210–– surface tension 202–– thermomechanical reliability 212–– topography measurement 205–– wet milling of bulk metal 196–– zeta potential 201metal organic decomposition (MOD) 215– drawbacks 199metamerism 752

Index 893

metamers 7522-methoxycarbonyl-substituted

benzophenone 81methyl ammonium lead trihalide

(perovskites) 639methyl diethanolamine 85methyl ethyl ketone 254-(4-methylphenylthio)-substituted

benzophenone derivative 82Michelangelo printing machine 737, 744Michler’s ketone 106MICR ink 173microchip fabrication 524microcontact printing 851microelectromechanical system (MEMS) 352,

654. see also silicon micro electro-mechanical systems (SiMEMS)

– based actuators/sensors 247– CMOS chip 339– drop ejector 301– KM MEMS printheads 283–– operating method 282–– specifications 283– mirror 439– silicon MEMS-based printhead 241–– Samba printhead 166– technology 280MicroFab 4-fluid printhead station 672microlens 653– optical properties 653microreaction technology (MRT) 198microzoning 835– amorphous 376migration-sensitive applications 144– food packaging applications 106– low-migration inkjet inks 142migration testing 813milled glazes 763milling chamber geometries 138missing drops 431MIT folding endurance test 212models of converting using inkjet 702– desktop converting 702– full hybrid solution 705– fully integrated laser-based finishing 705– fully integrated semirotary or full rotary

magnetic die-cutting, slitting, andsheeting 704

– low investment 703– reel to reel with inline finishing 704– reel to reel with offline finishing 703– retrofit hybrid solution 706– third-party finishing solution 705

Modular, rotary machine concept 808Moiré-like artifacts 482molded interconnect device (MID) 617molding press 764molecular surface composition 514monoacylphosphine oxide (MAPO) 71, 73, 100Moore’s law 862mottling effects 174moulds 652M-Solv 635, 638– manufacture hybrid IJ/laser equipment 636– MSV6505 639– MSV200 series–– inkjet/laser hybrid materials processing

tool 645–– machines 644multichannel radiometer, spectral

sensitivity 124multifunctional polymeric α-hydroxyketone

photoinitiator 103multiopening presses 817multipass– industrial printing machines 25– printing 132multiple charge deflection, during CIJ 314multiple encoders 739multiple variable data applications, in one print

product 836multizone dryer, with web handling 576

nNa+ ion 396NAND flash memory 864nanoimprint lithography (NIL) 851, 856,

862, 865– basic components 852– process 853nanosilver-based inkjet inks 8nanosilver ink 626nanosilver sol– viscosity vs. shear rate 202nanosize effect 215narrow nozzles rows 267narrow web ebeam dryer (NED) 554Nassenger textile printers 258National Institute of Standards andTechnology

(NIST) 125National Metrology Institute of Germany 125near-field communication (NFC) 609near-infrared (NIR) 604newspapers– individualization 833–– applications and business models 833–835

894 Index

–– combination of applications in one printproduct 835

–– cross media 835–– gaming and lotteries 833–– logistics 835–– microzoning 835– as link to online media 834– press 839–– basic principle 836–– imposition layout 837– printing 833, 835–840–– arrangement of digital print unit

839–– production 837, 839Newtonian– flow behavior 412, 417– fluid 422– low-molecular-weight PS20 425NIL. see nanoimprint lithography (NIL)nitrogen inertization 131N-methyl-2-pyrrolidone (NMP) 258nonabsorbing– food container 811– substrates 380noncontact inkjet printing 5noncross-linked molecule chains 812nondoped 134nonfiring state 166nonlinear mapping 795non-Newtonian– behavior 423– rheological constraints 653non-page-wide incarnations 321nonprinting pulses 294Norrish type I reaction 64Notion Systems 490NovaCentrix 560– Pulseforge 1300 460Nova/Galaxy assemblies 241NovoGen MMX BioprinterTM 673nozzle 352, 447– array 753–– NPI 591–– widths 351– chamber 475, 481– columns print 466– design in HP A51 328– electrostatically deflected 314– errors 466– evolution of number of 319– firing 270– geometry 318– hole

–– particle 274–– solids buildup 275– latency/open time 43– mapping 793– moisture levels 321– number and flow rate of 320– output 313– packing density 467– per column in (NPCI) 321– pitch variations 496– plate 245, 433–– flooding 445–– material 275– redundancy 466– relative position 302– rows 497, 791– selection 795– sensing 437– wetting 163Nur 26

oOce Colorsteam 3000 Twin 172OE-A organization 8OEM customers 279, 742OEM projects 24, 742offset printing 846Ohnesorge number 665oil-based pigmented inks 4OLED. see organic light-emitting diode (OLED)oligomers 136, 653one-step interconnect (OSI) 641– process stages on CdTe TF-PV–– microscopic images 642– TF-PV minimodules 642operating window tests 268operator software 848optically sensitive substrates 636OPV. see organic photovoltaic (OPV)orange peel 657organic– contamination 396– degradation 157– pigments 749– polyelectrolytes 368organic light-emitting diode (OLED) 10, 225,

459, 575, 601– architecture 226, 230– device 613–– performance 227– grid structure/conductive polymer 227– indium tin oxide (ITO) 10, 225– inkjet printed layers

Index 895

–– based on emissive polymers 230– inkjet printed PEDOT–– PSS layers 228– inkjet printing 10, 225– printed OLED security feature 232– substrate–– and bottom electrode 225–– pretreatment for inkjet printed 10, 225– transparent electrodes 10, 225organic photovoltaic (OPV) 611– cell 612– inkjet-printed, using chlorinated

solvents 612– solution-processed 611osteochondral material 668outdoor floors 764oven drying, of inkjet-printed functional

fluids 567oven temperatures 571overprint varnishes 544oxygen inhibition 63, 111ozone cleaning system 518

ppackaging 5, 142– types 712– workplace, digital technology for 744pad printing 7page-wide array (PWA) 320– incorporating printer 326– inkjet die design 327page-wide printing 320– using TIJ 321paint measurement 436paint signal 436palletizing 811pantone inks 739paper– based substrates 363– as carrier 749– colors 752– definition of 363– properties of 364–– bulk properties 364–– laminates and composites 369–– physical-chemical interaction of inks with

the paper 367–– porosity and ink penetration 366–– wetting and surface properties 366– sheet, melt extrusion coating with 369paraffins 152para-hydroxyethoxy substituted

α-hydroxyketone derivative 67

parking plates 826particle size 368, 657– distribution (PSD) 186, 189, 216– reduction 136pasteurizing 811PEDOT:PSS. see poly(3,4-

ethylenedioxythiophene):polystyrenesulfonate (PEDOT:PSS)

peel and reveal promotional label printed usinggraphium 701

pencil hardness test 210PET. see polyethylene terephthalate (PET)PH. see printhead (PH)pH drift 170phenolic resin, thermosetting 747phenyl acrylates 1354-phenylbenzophenone 81, 84phenylglyoxylate esters 77photoabsorbers 645photoactive layer 612photodiode signal 561photogenerated acids 61photograde inkjet paper 370photographic plate coating 59photoinduced β-cleavage reaction 84photoinitiators 59, 60, 117, 118, 134, 138, 139,

546, 553– absorbing 62, 119– acylphosphine, absorption,

photobleaching 74– acylphosphine oxides 71, 72– α-aminoketone 68, 69– benzoin ethers 66– benzoin isopropyl ether 66, 67– bisacylphosphine oxide 73– blends 64, 73, 103–– type I 83–– for UV LED applications 105– class 66– coinitiators 85– difunctional combining 7– difunctional α-hydroxyketone

photoinitiators 68– historical background 59– α-hydroxyketones 67– low-migration food packaging

86–104– miscellaneous classes 78– mixtures 63– SML values 88– types 77–– type I 7, 63, 64–– type II 7, 78, 81, 82, 96

896 Index

– UV inkjet inks 60– UV LED curing 104– UV radical curing 62– UV/Vis absorption spectra 66– water-based UV inkjet 108photolithography 8, 226, 852– bezel made by 607photonic curing 557–559, 561, 563, 564– inkjet printed nanocrystal silver ink 561– inkjet-printed silver trace. 561– low-temperature substrate 563– operating parameters 560– production tool 558– sinter nanocopper particles in air 563– technology behind 558photonic flash sintering 459photonic sintering 602, 642, 643photopolymerization 59, 117– unsaturated substances 59photopolymerization efficiency 94photo printing 173photoresist patterning 851photosintering process 218photovoltaic (PV) 8, 643, 662– material 639Photron SA5 high-speed camera 592phthalocyanine-based cyan 173physical vapor deposition (PVD) 287PI. see polyimide (PI)piezo-activated torsion resonator 418piezo-actuator 783piezo-axial vibrator (PAV) 417– oscillatory linear viscoelastic data 418piezoelectric. see also piezoelectric inkjet (PIJ)– ceramic strip 295– DOD aqueous dye sublimation ink–– physical property 186– effect 286– element 435– performance, figure of merit 247– printheads 166– transducer 663piezoelectric inkjet (PIJ) 25, 315, 317, 431, 663– devices 414, 666– printhead designs 316– printing 319– technologies 467pigment 136, 153, 158, 167, 169, 173, 174– agglomerate, in slurry 138– dispersion 138, 139– inkjet inks 191–– as colorants 172– inks 782

–– with emulsion polymers 8, 173– and matter interacts 158– nonfunctional pigment inks 173– particle sizes–– in inkjet inks 136– slurry 138– stabilization process, by steric

stabilization 137– surface 138pigmentophilic group 137PIJ. see piezoelectric inkjet (PIJ)pinning 811PixDro LP50 603, 605– printing platform 614pixel-based printing method 497placement error 587Planck–Einstein relation 117plasma– activation 523– chamber 516– cleaning 522– etching 524– point source, with rotary nozzle 521– reaction, chemistry and physics 513– surface treatment methods 513– systems 526– working 17, 512plasticizer 187plastic laminates– application 747– material 747plastics– packaging decoration 743– substrates, printing on 140– water and oxygen permeation 388Plastics Directive 145Plateau–Rayleigh instability 314platform design 501– automation 505– complexity and performance 506– drop formation analysis 504– environment 505– ink supply system 503–– recirculating ink supply 504–– size and refill concept 504–– static ink supply 504– maintenance 504– modular engineering 502– nozzle calibration 502– platform layout 502– precision and repeatability 502– print stage 502–– adaptation of print direction 503

Index 897

–– substrate fixation 502–– substrate temperature 502– process unit 503Polaris PQ 244polyamide (PA) 620, 628– fibers 363polycarbonate 373– electrical properties 387poly-diallyl-dimethyl-ammonium

chloride 368polyester 136, 363– foils wetting envelopes 607– molecular structure 171– textile materials 187polyether acrylates 136polyether ketones 373polyether polyols (PEPO) 190poly(3,4-ethylenedioxythiophene):polystyrene

sulfonate (PEDOT:PSS) 228, 613– dispersions 228– film 229, 230, 233– ink 614– inkjet formulations 229, 230– layer 611poly(ethylene) glycol (PEG)– macromers 667– substituted derivative 68poly(ethylene) glycol dimethacrylate

(PEGDMA) 668polyethylene naphthalate (PEN) 602polyethylene terephthalate (PET) 80, 187, 209,

602, 812– beverage bottle 147– conventional filling line 802– film 221– PET-ITO-1, microscopic images 608– polyester 689– web material, four-zone/two-stage

temperature recipe 569polyimide (PI) 209, 618– film printed pattern 221– foil 625–– resistance measurement of inkjet-printed

silver tracks 619– inkjet-printed conductive silver tracks

618polymer– based substrates 226– components, chemical composition 374– dimensional changes due to change in

temperature 388– dispersant 136, 138–– pigmentophilic groups 137

– electrical and optical properties 386– films 373–– substrates 373– glass sandwich 407– glass transition (Tg) temperatures 377– material 187, 232, 373– melting decomposition temperatures

(Tm) 377– nonabsorbing substrates 373– photoinitiators 99, 100– properties 383– selection 381– sintering 657– structures 94– substrate surface 183– surface/air boundary 181– temperature limits 383– thioxanthone derivatives 84, 106– types 373–– type I photoinitiator 96– typical water uptake 388polymerization 93, 131, 134, 146, 376, 653poly(methyl methacrylate) (PMMA) 853polypropylene (PP) 144polystyrene (PS) 373, 423– solutions 424polyurethane 654polyvinyl acetate 389polyvinylchloride 148, 373poor printing definition– and fine electrical traces 209porcelain stoneware 764– glazed 764– natural 764– satin 764– unglazed 764pore size 366–368porous coatings 368postprocessing 654potassium hydroxide (KOH) 258– type 204 255potential energy 324potential new line layout 802powder cake 655power specifications 535– dose 536– emitting window width 536– peak irradiance 535– power 535precipitated calcium carbonate (PCC) 368precision vacuum transport 829preflight optimizations 453Prelect TPS 35 G2 207

898 Index

– cross-sectional area evaluation 206PRELECT

TPS 30G2– drop-watcher analysis 204– fine electrical traces with good printing 210Prelect TPS 60 G2– silver sol 201– thixotropy measurement 203prepolymerized materials 546, 653press configurations/page layouts 838press control interface 849pretreatment method 525– geometry of parts and substrates 525– process gas limitations 525– process temperature limitations 526priming 140print carousels, fully equipped 809printed circuit board (PCB) 215– based thermoset package 630, 631– metal contact pad 621printed electronics (PE) 7, 601– bezel in touch panels 606– inkjet printed organic photovoltaics 610– printed smart card 605– production upscaling 602– smart labels 609– two-colored organic light-emitting

diodes 613printed metal lines 621– electrical connection 620–– contact pads 620–– isotropic conductive adhesive 622–– soldering 621–– spring contacts 621– inkjet printing on 3D surfaces 622printer– frames 777– modules 335printhead (PH) 741, 753, 758, 766, 769, 773,

783, 787–789, 793– aligning 825– alignment errors 766– arrangement of 740– array 8, 789, 790– choice of 493–– availability 494–– material compatibility 493–– productivity 496–– recirculating printhead 16, 494–– resolution and minimal feature size 494–– rheology 494–– specific pattern requirements 496– control 438, 828– and corresponding printing grid 497

– for decor printing application 24, 754– design 411– drawing 306– evaluation 38–– drop viewing 39–– equipment 38–– ink supply 38– and gray level 717– with internal ink circulation system 189– jetting characteristics 583– life 267– manufacturers 204, 646– nozzles 155, 277–– plate 478– printing 781, 794– and resist delivery system, requirements 856– Spectra QE-128 620– static, continuous bottle transport 805– tolerances 277– voltage labels 271printing. see also screen printing– antennae 18, 630– applications, in digital production 756– artifacts 431– bars 8– battery, stack design of 18– bottles, recycle 814– conductive silver tracks 622– conductive tracks 624– cotton 170– cycles 739– of cylinders/tubes 793, 795, 797– definition, good–– fine electrical traces 210– electronics (see printed electronics (PE))– environment 7– functional materials 664– inks 749–– properties 8– manager 828– OE-A classification 11– onto cones 795– onto spheres 796– parameters 209– paths 789–– direct-to-shape 787–– curved surface 787

–– onto a cup 791–– onto a flat surface 790– patterns 44, 455– on pens, phone covers, laptop covers 141– process factors 22, 44, 685–– contact angle testing 45

Index 899

–– pretreatment 45–– print evaluation methods 46–– surface wetting 44– productivity 531– quality 56, 268, 727–– monitoring 814–– optimization 848–– vs. print speed 841– segments 809– shapes 788– silver tracks 618, 629– software 745– speeds, landing inaccuracy 481– strain sensors 625– strategy 497–– dosing applications 499–– jetting evaluation 501–– pattern generation and adaptation of print

direction 497–– postprocessing 500–– preprocessing 499–– printing onto substrate grid 498–– process evaluation 499– stress sensor 625– systems–– holistic approach to 342–– UV inkjet ink 133– technologies 617, 803, 810– unit, with eight printheads 505– wet on wet 792– workflow 815processed per second (PPS) 465process optimization 459product development 650productivity 11, 582profile bars 827projects delivery 742ProJetTM printers 653proprietary differentiation 800protein-based inks 666prototype ebeam inkjet dryer 554prototyping interactions 56Proxel-GXL containing BIT 167pucks 8152011 puck system 809PulseForge

560pulse-forming network (PFN) 559pulse width modulation (PWM) 559pulverization equipment 189pure silver, volume resistivity 208purge cycle 780PUShTM process 655PWA. see page-wide array (PWA)

pyramid produced by printing aqueous inkonto 652

qQ-Class 245QDs. see quantum dots (QDs)quantum dots (QDs) 10, 233– inkjet printing of QLED devices 235– inkjet printing on paper 10, 235Quick Response Code 148quinophthalone 182

rradiation absorption 61, 62– by photoinitiator 62radical formation 63radio-frequency identification (RFID) 232, 601– card 605– chips 606– tag 606radiometer 123, 126– single- and multichannel 126– strip spectral sensitivity 127rapid prototyping 650raster image processing (RIP) 185, 467, 589raw paper sheet cross section 365raw paper surface 364Rayleigh-Plateau instability 440Rayleigh-Taylor instability 433reactive ion etching (RIE) 524reactive organic metallic (ROM) 199reagglomerate 136real-time surface scanning 791RediJet technology 245, 246, 248red small-molecule emitters (RSM) 613reflective optics 852refractive indices 385relative humidity (RH) 628reliability 4, 445, 725– assessment 42– industrial-grade transport system 726– jettability 195– printheads 725resins 653– impregnated kraft papers 751resistant polymeric network 132resistivity values, of common materials 207resolution 8, 356– achievable 17– and productivity 493reusable labels 687reverse osmosis-based processes 170Reynolds number 324, 665

900 Index

RFID. see radio-frequency identification (RFID)rheology 25– compatibility 493– modifiers 200– profile 201roller kiln 763– hybrid 764roller printing 768roll-to-roll (R2R) 179, 601, 613– industrial-scale manufacturing 602– JUPITER JPT-W-840 827– 5 laser processing machine 639– modes 636– printing process 605rotary die-cutter 735rotary gravure. see rotogravurerotary machine concept 807rotational screen printing process 15rotogravure– lab printers 757– machines 748– printing 750, 752–– machines 750R2R. see roll-to-roll (R2R)R0603 SMD on printed metal lines 622

sSAMBA printheads 246, 590sample web lead 845Sapphire QS 244satellite drops 431, 432scalable printing technology (SPT) 321, 466scanning electron microscopy (SEM) 205SCHOTT antifingerprint-coated MIROGARD

DARO glass 401SCHOTT borofloat glass– inkjet-printed 207SCHOTT thin glass 394Scitex 26screening techniques 794– variations 486screen printing 4, 16, 609– fine line stencils and print results 20– principles and capabilities 13– variants of 14– vs. inkjet 11sedimentation 156selection criteria 687selective laser sintering 643self-adhesive labels, stock 687semiconductors 489, 524, 640, 861semirotary die-cutter 735sensitization processes 63, 83

sensors 489, 662– on 2D/3D plastic substrates 617– on injection-molded thermoplastic

substrates 624–– antennas 630–– fluid-level sensor 628–– humidity sensor 627–– intrusion sensor 629–– stress sensor 625–– temperature sensor 624–– touch sensor 626– sensitivity 628Service Carriage 321shaft encoders 742shapes 788– cylinder or tube 788shearing defects 856sheet-to-sheet (S2S) modes 602, 613, 636shelf life 527shrink packing 811silica/alumina-based minerals 157silicon-controlled rectifier (SCR) 559silicon die 304silicone additives 34silicone rollers 763silicon micro electro-mechanical systems

(SiMEMS) 242. see alsomicroelectromechanical system (MEMS)

silk/screen printing 738silver-containing sample, with nitric acid 201silver ink 625silver inkjet formulations, for gird

applications 227silver metal nanoparticle conductive ink

(NPS-J) 216, 642– sintering temperature and resistivity 217silver nanoparticles– particle size distribution 217– TEM image 217silver nanowire (AgNW) networks 637SiMEMS. see silicon micro electro-mechanical

systems (SiMEMS)SimPulse software 561single conductive ink droplet, ejection of 219single-droplet ejection 447single-nozzle flux 583single-nozzle inkjet dispenser 670single-pass printer 777– frame 772– inkjet printing 133, 140, 583, 784– printhead 583 (see also printhead)single pinning lamp 740sintering 7, 656, 657

Index 901

– high-speed 658– inhibitor 657– sintered polymers 654– sintered silver nanoparticles, physical and

electrical behavior of 203– S2S tool 605– temperature behavior 208skin irritation level 137skyscraper mode, printing 308, 793, 795, 807slab 764slave printers 772slot die coating 8slurry 762small office and home office (SOHO) 185– market 7– printers, thermal and piezo

printheads 141small-scale photonic sintering setup 603small-scale vacuum plasma system 523small tube, time to print 740small vacuum-enabled slit 826smart packaging 601Smithers PIRA 7software and workflow concepts 814solar cell 8, 489– perovksite-based 611solder bump 652solenoid valve 319solid color printing 765Solid Ink technologies 30Solidscape Inc. 652solvent– based fluids 474– based inks 781– carrier coboiling vapor 191– in functional inkjet formulations 199– inks 174–– vs.UV-curable inks, drying process for 130,

822sonification 666spatial frequency track wobble 482Spectra Inc 26spectral UV categories, ISO 21348 119spectroradiometer 125– spectral sensitivity 126SPGPrints BV 604spin coating 228, 230spray drying 761, 762SSMMEB. see steady-state macroscopic

mechanical energy balance (SSMMEB)ST. see surface tension (ST)standard ceramic ink– particle size distribution curve 153

– viscosity curves, at differenttemperatures 155

standard deviation 450standard errors 454StarFire– SG1024 166– SG1024/A printheads feature fluid

interface 246– SG1024/C–– features 400 dpi 245–– ink connections 245–– printheads 246starvation 478steady shear rheometers 417steady-state macroscopic mechanical energy

balance (SSMMEB) 323– equation 324– factors and relationship to 325– factors differ based on type of inkjet

technology 324sterilization step 148stitching 791, 793– strategies 792–– 1D density 792–– 2D density 792–– density stitches 792–– masking stitches 792–– moving stitch 792–– 50% stitch 792strain-printed meanders 626Stream Inkjet Technology 351–353– future prespective 359stress elongation curves 384stress-strain curve 384stripping 524stroboscopic setup 440sublimation– colorants 182–– in digital imaging 182– dyes 182, 183, 186, 187– imaging 187–– major advantages of 181– inkjet ink 187–189–– applications 181–– printing 188–– transfer parameters 181– printed polymer substrate viewing effect 182– transfer printing process 180substrate 686– coating/pretreatment, 193– preheating system 56– supplied, cleanliness of 510– surface condition matters 17, 509

902 Index

– technical specification 686suction– bars 780– cleaning 826sulfonated lignin, chemical structure of 185α-sulfonyl ketone 84SunChemical 25, 26, 48, 619, 622superinkjet technology 221supply chain 801surface activation 517– ingredients 164surface energy (SE) 55, 378surface mounted devices (SMD) 619– on printed metal lines 621–– with ICA 622– R1206 620– resistors 621surface preparation 636surface pretreatment methods 512– cleaning and activation 17, 515– industrial usage 518–– atmospheric plasma 519–– corona 518–– vacuum plasma (or low-pressure

plasma) 521surface properties 368, 510surface quality 385surface roughness 366surface structures, for minimization of UV light

reflections 541surface tension (ST) 25, 55, 318, 353, 378– of LDPE 379– low dynamic 55surfactants 199, 201, 662– surfactant/Ag ratio concentration 197sustainability 582swathes, meeting 792sweating 474Swiss Ordinance– 817.023.21 145– SR 617.023.21 93– SR 817.023.21 87synthetic polymer 174system temperature control 572

ttalc 749technical DNA 731TecnoFerrari– GeCo software 778– ink distribution system 783– printer components 775– VivaJet printer 772

– Vivascan 3D pattern detector 773telecentric illuminator 446temperature-controlled ink 305temperature cycle test 212tensile properties, of polymers 385tertiary alkylamines 86testing tube printer systems 742test methods, for surface activity 511– contact angle test 511– test inks 511– Test Methods Manual IPC TM-650 212tests latency 44textile printing 163TF. see through-flow (TF)theoretical gray-level distributions, in imaging

of droplets 449thermal inkjet (TIJ) technologies 25, 176,

316, 663– based bioprinting technology 668– conductivity 405– curing process 196– damage 657– device 664– drying ovens 745– dynamics 572– induced oxidization of polymer powder 657– management 352, 563– mass 562– printheads 179, 320–– chips 466–– designs 318– printing 319– processes 562– sensitive substrates 646– stability 4– thermo gravimetric analysis 201thermophysical properties 560thermoplasts 812thermosetting 747, 750, 753, 755– brittle polymers 383– packages 630– polymers 377thin film PV (TF-PV) 308– panels 639– technologies 643thin film transistor (TFT) 601thinner caliper liners 687thinner film-based liners 687thioxanthone 84– absorption maxima 107– derivatives 67– ketyl radicals 84– photoinitiators 76, 77, 82

Index 903

– thioxanthone/amine coinitiator reaction 83– UV/Vis absorption spectra 83thread diameter 16three-cycle acoustic firing– cycles, phases, and grayscale 289through-flow (TF) technology 822through nozzle tester (TNT) 304tic marks, detection, histogram of 456TIJ. see thermal inkjet (TIJ)tile– bodies 762– dark white ink printed 160– inkjet printing 781– pseudometallic effects 160tilted printhead 500time-of-flight device 417Timson, Marcus 7TiO2, for printing white 163tissue engineering 322titanium dioxide 137, 749toluene 318total cost of ownership (TCO) 473, 801– iceberg model 473total organic carbon (TOC) 201touch panel (TP) 606trace resistivity for photonic cured samples 562trace-substrate interface 563trade-offs 790transfer– media 186– membrane/film 186– printing method 180, 187transparent conductive (TC) 637– coated dielectric substrate 637– material 637transparent polymer 227trends in industry 708– anticounterfeiting and brand protection 712– clearer more transparent labeling 711– more stringent guidelines–– new labeling technologies 712– reduced lead time 708– reduction in quantities and increase in

frequency of orders 711– shrink-stretch sleeve 713– supply chain tracking 713– sustainability and eco-friendly materials 713– variable data 7111,2,4-trichlorobenzene 230, 231trigger signal correction 825trimaster filament profile 421, 422– thinning profile 424trimaster setup 419

trimming capability 295tristimulus values 752TritonTM X-100 228TTP Meteor 179tubes– chemical incompatibility 474– inner diameter 476– printing 141tunnel dryers 762

uultraviolet (UV)– absorber 192–– Tinuin 405 192– artificial radiation 59– curable inkjet ink 129, 130, 689, 811–– epoxies 318–– formulation 111, 135–– organic pigments 136– curing 547–– delay 739–– insulator 626–– performance 111–– technology 59, 130, 138– EB radiation 546– energy 117– exposure 129, 130– flexo 142– formulation 70, 80, 546– induced polymerization mechanisms 131– inkjet ink 60–62, 82, 94, 118, 119, 129–132,

135, 136, 139–141, 146, 147, 270, 692, 742–– applications 63, 80, 108–– compounds 134–– films 119, 120–– flexo and offset low-migration 145–– formulation 61, 63, 64, 68–71, 93, 103, 117,

130, 131, 134, 137, 140–– free radical 131–– for industrial applications 129–– in industrial print systems 139–– production 138–– requirements 132–– types 130–– viscosity 134– inkjet label printing 142– inkjet printing 129, 132, 142, 697–– multipass and single-pass 133–– solutions 148–– water-based formulations 108– inkjet single-pass printing systemdesign 140– inkjet systems 139– lamp 547, 653

904 Index

–– types 739– LED array 532– LED benefits 537– LED curing 141, 147, 529–– Braille printing 539–– coding and marking 539–– container printing 539–– decoration 539–– digital inkjet 18, 538–– D textured printing 540–– features of 537–– flexographic printing 538–– integration considerations 540–– labels and packaging 539–– markets and applications 538–– material formulation 537–– photoinitiator (PI) 537–– pinning 540–– posters and signage 539–– screen 18, 538–– stray light 541–– systems 529, 531, 731–– thermal management and

aerodynamics 540– LED lamps 532–– system suppliers 531– LED light source 534–– components 530, 531– LED radiation sources 69, 75, 82, 93, 122,

124, 134–– emission spectra of 122– LEDs low-irradiance 140– LED technology components 529–– array, grouping of LEDs 531–– base building block 530–– cooling, thermal management 532–– optics, guiding light 533– light 134, 270, 529, 547– liquid UV inks, health/safety aspects 137– offset 142– ozone treatment 226, 517– pinning 739–– lamps 488–– module 733– printers 653– printing 147–– on interior decoration panels 142–– systems 139– radiation 64, 104, 117, 120, 123, 131–133–– absorbtion 117–– blocking nanoparticles 192–– energy correlation with wavelength 118–– inkjet ink films 119

–– measurement 123–– wavelength 117– radiation source 118, 125, 139, 140–– dopedmedium-pressuremercury lamp 120–– LED technology 122–– medium-pressure mercury lamp 119– standard inkjet inks 145– systems 141– uniformity of UV LED light source 538– UV-A ink 428– UVA region 118– UVB radiation 120–– short-wavelength 119– UVC radiation 122–– short-wavelength 119– white inkjet inks 73, 137unidirectional scanning 789unsintered powder 654upstream eddy observation 594urethane acrylates 136UV. see ultraviolet (UV)

vvacuum– deposition processes 640– low-pressure plasma 17, 515– plasma 526, 528– pumping system 480– wiping 480valves 476vaporization 187vapor pressure 570varnish 141vascular endothelial growth factor (VEGF) 667VersaDropTM technologies 248, 581– characteristic of 242– tuning on drops 244very large-scale integration (VLSI) 354vinyl amides 136N-vinylcaprolactam 136vinyl ether monomer 136vinyl sulfone groups– chlorotrazine, reaction pathway 170viscosity 8, 33, 155, 545– measurements 494– polymers 656– vs. concentration 202– vs. temperature 202volatile organic compound (VOCs) 137, 182volatile solvents (VOC) 129voltage waveforms 288volume resistivity 206Vutek 26

Index 905

wwafers per hour (wph) 854wafer technology 524wall tile 763water-based– colorants 755– glazes 769– inks 755– PEDOT ink 612– PEDOT layer 613– UV inkjet inks 109–– formulations 111water contact angles 248waterfall printhead technology 335water-soluble acylphosphine oxide

photoinitiators 109water-soluble bisacylphosphine oxide

photoinitiators 109waveform 152– operation 292– optimization 445wax candle 17, 509web 466– cleaning device 731– confirming 571– digital printing systems 735– lead principle 844– temperature 573–– infrared drying in of convective

heating 574– weave error 587– webbing-up devices 843– web-fed print 42Weber numbers (We) 665– vs. Reynolds numbers, parametric

plot of 665wet-in-wet 488wet milling 761–763wet-on-dry printing 140wet printing 755wettability 860– glass surface 398wetting 378– behavior of liquids 510white light interferometer profiles 641wide-format multipass printing 805wood fibers 364wood-grain defects 592, 595wrong wipes 276

xXaar 126– End Shooters 307

– printheads, prototypes of 307Xaar 501 297– ink recirculation arrangement 298Xaar 1001– family-based industrial printing

machines 299– printheads 822–– family 296, 297, 309–– side-shooter 823Xaar 1002– printheads 300–– in grayscale operation 291–– ink recirculation arrangement 296Xaar 1003– HSS1003, Head Personality Card 486– printhead 309–– HSS1003 486– PZT walls 289– side shooter channel array 290Xaar 5601– performs 166– printhead 304, 307Xaar 128 actuator, monolithic cantilever

structure 288Xaar Hydra 860– Ink Supply System 299– modification 861Xaar-like end-shooter design 255Xaar Print Bar System 300, 308Xaar printhead 285, 291, 294, 308, 774– technology 296Xaar’s End Shooter printhead designs 288Xaar shared-wall technique 264Xaar’s inkjet printing technology 285– additional waveform features 293– Chevron Architecture 289– cuts 294– edge-mounted side shooter architecture 11,

296– hybrid side shooter architecture 295– hydra ink supply 299– inkjet applications and development 306– ink recirculation (TF) technology 297– MEMS drop ejectors, with thin film

piezoelectric actuators 301– monolithic cantilever architecture 287– nonprinting pulses 293– overview 285– piezoelectric shear mode 285– pre- and postpulses 294– print bar system 300– shared wall design 287– three-cycle acoustic firing 289

906 Index

– trimming 295– waveform 291– Xaar’s 5601 MEMS drop ejector 30108/2008 Xaar skyscraper test rig 808Xaar’s technology development 286Xaar’s unique TF Technology 297Xaar waveform 292Xaar XJ126-200 printhead 422Xennia 605XJ128 288– 18 XJ128 actuators per wafer 287X-ray shielding 550X-ray tube 551, 552

yYoung’s modulus 860YouTube clip, customer installation 746

zZERODUR

glass ceramic 404Zero velocity 324Zinc–tin oxides 318zirconium silicate 157ZnO nanoparticle suspension 612ZnS single shell 235Zonyl

FS-300 228

Index 907