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8/19/2019 IC data sheet
1/14
Package InformationIncluding
Surface Mount
FAST AND LS TTL
7
8/19/2019 IC data sheet
2/147-2
FAST AND LS TTL DATA
BIPOLAR LOGIC SURFACE MOUNT
WHY SURFACE MOUNT?
Surface Mount Technology is now being utilized to offer answers to many problems that have been created in the use of insertion technology.
Limitations have been reached with insertion packages and PC board technology. Surface Mount Technology offers the opportunity to continue to advance the State-of-the-Art designs that cannot be accomplished with Insertion Technology.
Surface Mount Packages allow more optimum device performance with the smaller Surface Mount configuration.Internal lead lengths, parasitic capacitance and inductance that placed limitations on chip performance have been reduced.
The lower profile of Surface Mount Packages allows more boards to be utilized in a given amount of space. They are stacked closer together and utilize less total volume than insertion populated PC boards.
Printed circuit costs are lowered with the reduction of the number of board layers required. The elimination or reduction of the number of plated through holes in the board, contribute significantly to lower PC board prices.
Surface Mount assembly does not require the preparation of components that are common on insertion technology lines.
Surface Mount components are sent directly to the assembly line, eliminating an intermediate step.
Automatic placement equipment is available that can place Surface Mount components at the rate of a few thousand per hour to hundreds of thousands of components per hour.
Surface Mount Technology is cost effective, allowing the manufacturer the opportunity to produce smaller units and/or offer increased functions with the same size product.
SURFACE MOUNT AVAILABILITY
Bipolar Logic is currently offering LS-TTL and FAST-TTL inproduction quantities in SOIC packages.
Refer to the following Selector Guide (SG366/D) which indi-cate availability and package type for these families.
These families may be ordered in rails or on Tape and Reel.Refer to Tape and Reel information for ordering details.
THERMAL DATA
The power dissipation of surface mount packages is depen-dent on many factors that must be taken into consideration inthe initial board design. The board material, the board surfacemetal thickness, pad area and the proximity to other heatgenerating components all have a bearing on the devicedissipation capability.
200
180
160
140
120
100
MIN DIE SIZE2K MILS2
MAX DIE SIZE8K MILS2
SEE FIG. 2 FORHEAT SINK DETAIL
SO-8 LEADFRAME SO-14 SO-16(.090″ x .110″ ) METAL = COPPER (.090″ x .170″ ) (.090″ x .170″ )
NARROWPACKAGE STYLE
DATA TAKEN USING PHILIPS SO TEST BOARD # 7322-078, 80873
° C/Wθ JA
Figure 2-1. Thermal Resistance, Junction-To-Ambient ( ° C/W)
Measurement specimens are solder mounted on printedcircuit card 19 mm × 28 mm × 1.5 mm in still air. No auxiliarythermal condition aids are used.
This data was collected using thermal test die in 20-pin PLCCpackages on PLCC test boards (2.24 ″ x 2.24 ″ x .062 ″ glassepoxy, type FR-4, with solder coated 1 oz./sq. ft. copper).
8/19/2019 IC data sheet
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FAST AND LS TTL DATA
TAPE AND REEL
STANDARD BIPOLAR LOGIC INTEGRATED CIRCUITSMotorola has now added the convenience of Tape and Reel
packaging for our growing family of standard Integrated Circuitproducts. The packaging fully conforms to the latest EIA
RS-481A specification. The antistatic embossed tapeprovides a secure cavity sealed with a peel-back cover tape.
MECHANICAL POLARIZATION
SOIC DEVICESTypical
Linear direction of travel
View is from tape side
GENERAL INFORMATION
— Reel Size 13 inch (330 mm) Suffix R2 — Tape Width 12 mm to 24 mm (see table) — Units/Reel (see table) — No Partial Reel Counts Available and Minimum Lot Size is Per Table
ORDERING INFORMATIONTo order devices which are to be delivered in Tape and Reel, add the suffix R2 to the device number being ordered.
TABLE 2.1 Tape and Reel Data
Device TypeTape Width
(mm) Device/ReelReel Size
(inch)Min Lot Size Per Part No.
Tape and Reel
SO-8 12 2,500 13 5,000SO-14 16 2,500 13 5,000SO-16 16 2,500 13 5,000SO-16 Wide 16 1,000 13 5,000SO-20 Wide 24 1,000 13 5,000
8/19/2019 IC data sheet
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FAST AND LS TTL DATA
PACKAGE OUTLINESSOIC
MIN MINMAX MAXMILLIMETERS INCHES
DIMABCDFGJKMPR
8.553.801.350.350.40
0.190.10
0°5.800.25
8.754.001.750.491.25
0.250.25
7°6.200.50
0.3370.1500.0540.0140.016
0.0080.004
0°0.2290.010
0.3440.1570.0680.0190.049
0.0090.009
7°0.2440.019
1.27 BSC 0.050 BSC
NOTES:1. DIMENSIONS “A” AND “B” ARE DATUMS AND
“T” IS A DATUM SURFACE.2. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.3. CONTROLLING DIMENSION: MILLIMETER.4. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
5. MAXIMUM MOLD PROTRUSION 0.15 (0.006)PER SIDE.6. 751A-01 IS OBSOLETE, NEW STANDARD
751A-02.
-A-
-B- P
G C
KSEATINGPLANE
14 PLD M F J
7 PL
R X 45 °
17
814
Case 751A-02 D Suffix14-Pin Plastic
SO-14
MIN MINMAX MAXMILLIMETERS INCHES
DIMABCDFGJKMPR
9.803.801.350.350.40
0.190.10
0°5.800.25
10.004.001.750.491.25
0.250.25
7°6.200.50
0.3860.1500.0540.0140.016
0.0080.004
0°0.2290.010
0.3930.1570.0680.0190.049
0.0090.009
7°0.2440.019
1.27 BSC 0.050 BSC
NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.5. 751B-01 IS OBSOLETE, NEW STANDARD
751B-03.
1 8
916
-A-
-B- P
16 PLD
-T-
K
CG
M
R X 45 °
FJ
8 PL
SEATINGPLANE
Case 751B-03 D Suffix16-Pin Plastic
SO-16
NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.5. 751D-01, AND -02 OBSOLETE, NEW STANDARD
751D-03.
MIN MINMAX MAXMILLIMETERS INCHESDIMABCDFGJKMPR
12.657.402.350.350.50
0.250.100°
10.050.25
12.957.602.650.490.90
0.320.25
7°10.550.75
0.4990.2920.0930.0140.020
0.0100.004
0°0.3950.010
0.5100.2990.1040.0190.035
0.0120.009
7°0.4150.029
1.27 BSC 0.050 BSC
-A-
-B- P10 PL1 10
1120
G
-T-
D 20 PL K
C SEATINGPLANE
R X 45 °
M F J
Case 751D-03 DW Suffix20-Pin PlasticSO-20 (WIDE)
B0.25 (0.010) M M
B0.25 (0.010) M M
B0.25 (0.010) M M
T0.25 (0.010) B AM S S
T0.25 (0.010) B AM S S
T0.25 (0.010) B AM S S
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FAST AND LS TTL DATA
PACKAGE OUTLINESSOIC (continued)
Case 751E-03 DW Suffix24-Pin PlasticSO-24 (WIDE)
MIN MINMAX MAXMILLIMETERS INCHES
DIMABCDFGJKMPR
15.257.402.350.350.41
0.2290.127
0°10.050.25
15.547.602.650.490.90
0.3170.292
8°10.550.75
0.6010.2920.0930.0140.016
0.00900.0050
0°0.3950.010
0.6120.2990.1040.0190.035
0.01250.0115
8°0.4150.029
1.27 BSC 0.050 BSC
NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. 751E-01 AND -02 OBSOLETE, NEW STANDARD751E-03.
-A-
-B- P1 12
24 13
G
-T-
D 24 PL
C
K
SEATINGPLANE
M F J
R X 45 °
12 PL
0.25 (0.010) B
0.25 (0.010) T B AM
M M
S S
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FAST AND LS TTL DATA
PACKAGE OUTLINESCERAMIC DUAL IN-LINE
Case 632-08 J Suffix14-Pin Ceramic Dual In-Line
Case 620-09 J Suffix16-Pin Ceramic Dual In-Line
Case 732-03 J Suffix20-Pin Ceramic Dual In-Line
MIN MINMAX MAXMILLIMETERS INCHES
DIMABCDFGJKLMN
19.056.233.940.391.40
0.213.18
0°0.51
19.947.115.080.501.65
0.384.31
15°1.01
0.7500.2450.1550.0150.055
0.0080.125
0°0.020
0.7850.2800.2000.0200.065
0.0150.170
15°0.040
2.54 BSC
7.62 BSC
0.100 BSC
0.300 BSC
NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIM F MAY NARROW TO 0.76 (0.030) WHERETHE LEAD ENTERS THE CERAMIC BODY.5. 632-01 THRU -07 OBSOLETE, NEW STANDARD
632-08.
14 8
1 7
-A-
-B-
-T-SEATING
PLANE
F G
D 14 PLN
K
C L
J 14 PLM
MIN MINMAX MAXMILLIMETERS INCHES
DIM19.056.10 —0.39
1.40
0.23 —
0°0.39
19.557.364.190.53
1.77
0.275.08
15°0.88
0.7500.240
—0.015
0.055
0.009 —
0°0.015
0.7700.2900.1650.021
0.070
0.0110.200
15°0.035
1.27 BSC
2.54 BSC
7.62 BSC
0.050 BSC
0.100 BSC
0.300 BSC
ABCDEFGJKLMN
NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.4. DIM F MAY NARROW TO 0.76 (0.030) WHERE
THE LEAD ENTERS THE CERAMIC BODY.5. 620-01 THRU -08 OBSOLETE, NEW STANDARD
620-09.
-B-
-A-
16 PL
-T-
C
D
EF G J
K
MN
SEATINGPLANE
16 PL
L
16 9
1 8
NOTES:1. LEADS WITHIN 0.25 mm (0.010) DIA., TRUE
POSITION AT SEATING PLANE, AT MAXIMUMMATERIAL CONDITION.
2. DIM L TO CENTER OF LEADS WHEN FORMEDPARALLEL.
3. DIM A AND B INCLUDES MENISCUS.
MIN MINMAX MAXMILLIMETERS INCHES
DIM23.886.603.810.381.40
0.510.203.18
25.157.495.080.561.65
1.270.304.06
0°0.25
0.9400.2600.1500.0150.055
0.0200.0080.125
0.9900.2950.2000.0220.065
0.0500.0120.160
15°1.02
2.54 BSC
7.62 BSC
0.100 BSC
0.300 BSC
ABCDFGHJKLMN
0°0.010
15°0.040
B
C
D GH
J
M
N
AL
20 11
1 10
SEATINGPLANE K
F
0.25 (0.010) T AM S 0.25 (0.010) T BM S
0.25 (0.010) T AM S0.25 (0.010) T BM S
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FAST AND LS TTL DATA
PACKAGE OUTLINESCERAMIC DUAL IN-LINE (continued)
Case 758-01 J Suffix24-Pin Ceramic Dual In-Line
Case 623-05 J Suffix24-Pin Ceramic Dual In-Line
(WIDE BODY)
Case 740-03 J Suffix48-Pin Ceramic Dual In-Line
MIN MINMAX MAXMILLIMETERS INCHES
DIMABCDFGJKLNP
31.507.243.680.381.14
0.202.547.620.519.14
32.647.754.440.531.57
0.334.197.871.27
10.16
1.2400.2850.1450.0150.045
0.0080.1000.3000.0200.360
1.2850.3050.1750.0210.062
0.0130.1650.3100.0500.400
2.54 BSC 0.100 BSC
NOTES:1. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.2. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1973.
24 13
1 12
C
D 20 PL
F
G
JKN
INSIDE OF LEADS
L
P
B
-T-SEATINGPLANE
-A-
MIN MINMAX MAXMILLIMETERS INCHES
DIM
ABCDEFGJKLMN
60.3614.643.050.381
0.762
0.2042.54
0°1.016
2.3760.5760.1200.015
0.030
0.0080.100
0°0.040
2.4240.6040.1700.021
0.055
0.0130.165
10°0.060
1.27 BSC
2.54 BSC
15.24 BSC
0.050 BSC
0.100 BSC
0.600 BSC
NOTES:1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIM L TO CENTER OF LEAD WHEN FORMED
PARALLEL.
61.5615.344.310.533
1.397
0.3304.19
10°1.524
-B-
-A-
-T-SEATING
PLANE
48 25
1 24
F
CK
D 48 PL
N
E
J
M
L
G
MIN MINMAX MAXMILLIMETERS INCHES
DIM31.2412.704.060.411.27
0.20
3.18
32.7715.495.590.511.52
0.30
4.06
0°0.51
1.2300.5000.1600.0160.050
0.008
0.125
1.2900.6100.2200.0200.060
0.012
0.160
15°1.27
2.54 BSC
15.24 BSC
0.100 BSC
0.600 BSC0°
0.02015°
0.050
ABCDFGJ
KLMN
NOTES:1. DIM “L” TO CENTER OF LEADS WHEN
FORMED PARALLEL.2. LEADS WITHIN 0.13 mm (0.005) RADIUS OF
TRUE POSITION AT SEATING PLANE ATMAXIMUM MATERIAL CONDITION. (WHENFORMED PARALLEL).
SEATING PLANE
24 13
1 12
A
L
D
F
G JK MN
B
C
T A0.25 (0.010) M M
T A0.25 (0.010) M M T B0.25 (0.010) M M
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FAST AND LS TTL DATA
PACKAGE OUTLINESPLASTIC
Case 646-06 N Suffix14-Pin Plastic
Case 648-08 N Suffix16-Pin Plastic
Case 738-03 N Suffix20-Pin Plastic
MIN MINMAX MAXMILLIMETERS INCHES
DIM18.166.103.690.381.02
1.320.202.92
19.566.604.690.531.78
2.410.383.43
0°0.39
0.7150.2400.1450.0150.040
0.0520.0080.115
0.7700.2600.1850.0210.070
0.0950.0150.135
10°1.01
2.54 BSC
7.62 BSC
0.100 BSC
0.300 BSC0°
0.01510°
0.039
ABCDFGHJKLMN
NOTES:1. LEADS WITHIN 0.13 mm (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUMMATERIAL CONDITION.
2. DIMENSION “L” TO CENTER OF LEADS WHENFORMED PARALLEL.
3. DIMENSION “B” DOES NOT INCLUDE MOLDFLASH.4. ROUNDED CORNERS OPTIONAL.5. 646-05 OBSOLETE, NEW STANDARD 646-06.
1 7
14 8
B
A NOTE 4
F
HG
DSEATINGPLANE
N
K
C
L
J
M
MIN MINMAX MAXMILLIMETERS INCHES
DIMABCDFGHJKLMS
18.806.353.690.391.02
0.212.807.50
0°0.51
19.556.854.440.531.77
0.383.307.7410°
1.01
0.7400.2500.1450.0150.040
0.0080.1100.295
0°0.020
0.7700.2700.1750.0210.070
0.0150.1300.305
10°0.040
NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION “L” TO CENTER OF LEADS WHEN
FORMED PARALLEL.4. DIMENSION “B” DOES NOT INCLUDE MOLD
FLASH.5. ROUNDED CORNERS OPTIONAL.6. 648-01 THRU -07 OBSOLETE, NEW STANDARD
648-08.
2.54 BSC1.27 BSC
0.100 BSC0.050 BSC
-A-
B1 8
916
F
H GD 16 PL
SC
-T- SEATINGPLANE
KJ
M
L
MIN MINMAX MAX
MILLIMETERS INCHES
DIM25.666.103.810.39
1.27
0.212.80
27.176.604.570.55
1.77
0.383.55
0°0.51
1.0100.2400.1500.015
0.050
0.0080.110
1.0700.2600.1800.022
0.070
0.0150.140
15°1.01
1.27 BSC
2.54 BSC
7.62 BSC
0.050 BSC
0.100 BSC
0.300 BSC
ABCDEFGJKLMN
0°0.020
15°0.040
NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION “L” TO CENTER OF LEAD WHEN
FORMED PARALLEL.4. DIMENSION “B” DOES NOT INCLUDE MOLD
FLASH.5. 738-02 OBSOLETE, NEW STANDARD 738-03.
-A-
B
C
K
NEG F
D 20 PLJ 20 PL
L
M
-T-SEATINGPLANE
1 10
1120
T A0.25 (0.010) M M
T A0.25 (0.010) M MT B0.25 (0.010) M M
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FAST AND LS TTL DATA
PACKAGE OUTLINESPLASTIC (continued)
Case 724-03 N Suffix24-Pin Plastic
Case 649-03 N Suffix24-Pin Plastic
Wide Body
Case 711-03 N Suffix40-Pin Plastic
MIN MINMAX MAXMILLIMETERS INCHES
DIMABCDEFGJKLMN
31.256.353.690.38
1.02
0.182.80
0°0.51
15°1.01
0°0.020
15°0.040
32.136.854.440.51
1.52
0.303.55
1.2300.2500.1450.015
0.040
0.0070.110
1.2650.2700.1750.020
0.060
0.0120.140
1.27 BSC
2.54 BSC
7.62 BSC
0.050 BSC
0.100 BSC
0.300 BSC
NOTES:1. CHAMFERRED CONTOUR OPTIONAL.2. DIM “L” TO CENTER OF LEADS WHEN FORMED
PARALLEL.3. DIMENSIONS AND TOLERANCES PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.1 12
1324
-A-
-B-
C
K
N
-T-SEATINGPLANE
G
E
F
D 24 PL
J 24 PLM
NOTE 1
L
MIN MINMAX MAXMILLIMETERS INCHES
DIMABCDFGHJKLMN
51.6913.723.940.361.02
1.650.202.92
0°0.51
52.4514.225.080.561.52
2.160.383.43
15°1.02
2.0350.5400.1550.0140.040
0.0650.0080.115
0°0.020
2.0650.5600.2000.0220.060
0.0850.0150.135
15°0.040
2.54 BSC
15.24 BSC
0.100 BSC
0.600 BSC
NOTES:1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 mm (0.010) AT MAXIMUMMATERIAL CONDITION, IN RELATION TO SEATINGPLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHENFORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1 20
40 21
B
AC
N
K
SEATINGPLANE
M
J
L
H G F D
T A0.25 (0.010) M M
T B0.25 (0.010) M M
MSEATINGPLANE
G J
L
B
AP
HF
K
C
D
N
Q
NOTES:1. LEADS WITHIN 0.13 mm (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUMMATERIAL CONDITION.
2. DIMENSION “L” TO CENTER OF LEADS WHENFORMED PARALLEL.
3. 649-02 OBSOLETE, NEW STD 649-03 SEE ISSUE“C” FOR REFERENCE.
MIN MINMAX MAXMILLIMETERS INCHES
DIMABCDFGHJKLMNPQ
31.5013.214.700.381.02
1.650.202.92
14.99 —0.510.130.51
32.1313.725.210.511.52
2.160.303.43
15.4910°
1.020.380.76
1.2400.5200.1850.0150.040
0.0650.0080.1150.590
—0.0200.0050.020
1.2650.5400.2050.0200.060
0.0850.0120.1350.610
10°0.0400.0150.030
2.54 BSC 0.100 BSC
1 12
1324
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FAST AND LS TTL DATA
PACKAGE OUTLINESPLASTIC (continued)
Case 767-02 N Suffix48-Pin Plastic
MIN MINMAX MAXMILLIMETERS INCHES
DIM61.3413.723.940.361.02
0.202.92
0°0.51
62.1014.225.080.551.52
0.383.81 0°
1.01
2.4150.5400.1550.0140.040
0.0080.115
0°0.020
2.4450.5600.2000.0220.060
0.0150.150
0°0.040
DETAIL X
DETAIL XTIP TAPER
GD
FPLANESEATING M
J
C
N
48 25
241
-B-
-A-
-T-
ABCDFGHJKLMN
15.24 BSC 0.600 BSC
1.79 BSC 0.070 BSC2.54 BSC 0.100 BSC
NOTES:1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLDFLASH. MAXIMUM MOLD FLASH 0.25 (0.010).5. 767-01 OBSOLETE. NEW STANDARD 767-02.
48 PL
48 PL
L
0.25 (0.010) T BM S0.51 (0.020) T AM S
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FAST AND LS TTL DATA
PACKAGE OUTLINESPLCC
S
Case 775-02 FN Suffix20-Pin Plastic
ABCEFGHJKRUVWXYZ
G1K1Z1
MIN MINMAX MAXMILLIMETERS INCHES
DIM9.789.784.202.290.33
0.660.510.648.898.891.071.071.07 —2°
7.881.02
2°
10.0310.034.572.790.48
0.81 — —9.049.041.211.211.420.5010°8.38 —10°
0.3850.3850.1650.0900.013
0.0260.0200.0250.3500.3500.0420.0420.042
—2°
0.3100.040
2°
0.3950.3950.1800.1100.019
0.032 — —
0.3560.3560.0480.0480.0560.020
10°0.330
—10°
1.27 BSC 0.050 BSC
NOTES:1. DATUMS -L-, -M-, -N-, AND -P- DETERMINED
WHERE TOP OF LEAD SHOULDER EXIT PLASTICBODY AT MOLD PARTING LINE.
2. DIM GI, TRUE POSITION TO BE MEASURED ATDATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLDPROTRUSION. ALLOWABLE MOLD PROTRUSIONIS 0.25 (0.010) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.6. 775-01 IS OBSOLETE, NEW STANDARD 775-02.
-N- Y BRK
-M--L-
W
V-P-
D
D20 1
A
RZ
C
G
G1
E
J
DETAIL S
B
U
Z1
G1X
H
F
DETAIL S
K
K1
0.10 (0.004)SEATINGPLANE
-T-
VIEW D-D
0.18 (0.007) T N –PM S S L –MS S
0.18 (0.007) T N –PM S S L –MS S
0.25 (0.010) T N –PM S S L –MS S
0.18 (0.007) T L –MM S S N –PS S
0.18 (0.007) T N –PM S S L –MS S
0.18 (0.007) T L –MM S S N –PS S
0.18 (0.007) T N –PM S S L –MS S
0.25 (0.010) T L –MS S N –PS S
0.18 (0.007) T L –MM S S N –PS S
0.18 (0.007) T L –MM S S N –PS S
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FAST AND LS TTL DATA
PACKAGE OUTLINESPLCC (continued)
S
Case 776-02 FN Suffix28-Pin Plastic
G1
ABCEFGHJKRUVW
XYZ
G1K1Z1
MIN MINMAX MAXMILLIMETERS INCHES
DIM12.3212.324.202.290.33
0.660.510.64
11.4311.431.071.07
1.07 —2°
10.421.02
2°
12.5712.574.572.790.48
0.81 — —
11.5811.581.211.21
1.420.5010°
10.92 —10°
0.4850.4850.1650.0900.013
0.0260.0200.0250.4500.4500.0420.042
0.042 —2°
0.4100.040
2°
0.4950.4950.1800.1100.019
0.032 — —
0.4560.4560.0480.048
0.0560.02010°
0.430 —10°
1.27 BSC 0.050 BSCNOTES:
1. DUE TO SPACE LIMITATION, CASE 776-02 SHALLBE REPRESENTED BY A GENERAL (SMALLER)CASE OUTLINE DRAWING RATHER THANSHOWING ALL 28 LEADS.
2. DATUMS -L-, -M-, -N-, AND -P- DETERMINEDWHERE TOP OF LEAD SHOULDER EXIT PLASTICBODY AT MOLD PARTING LINE.
3. DIM G1, TRUE POSITION TO BE MEASURED ATDATUM -T-, SEATING PLANE.
4. DIM R AND U DO NOT INCLUDE MOLDPROTRUSION. ALLOWABLE MOLD PROTRUSIONIS 0.25 (0.010) PER SIDE.
5. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.
6. CONTROLLING DIMENSION: INCH.7. 776-01 IS OBSOLETE, NEW STANDARD 776-02.
-N- Y BRK
D
D
W
-M--L-
-P-
28 1
V
28LEADS
ACTUAL
DETAIL S
B
U
Z1
G1X
VIEW D-D
H
K1
K
F
DETAIL S
G
C
Z
A
R
E
0.10 (0.004)SEATINGPLANE
-T-J
0.18 (0.007) T N –PM S S L –MS S
0.18 (0.007) T N –PM S S L –MS S
0.25 (0.010) T N –PM S S L –MS S
0.18 (0.007) T L –MM S S N –PS S
0.18 (0.007) T N –PM S S L –MS S
0.18 (0.007) T L –MM S S N –PS S
0.18 (0.007) T N –PM S S L –MS S
0.18 (0.007) T L –MM S S N –PS S
0.18 (0.007) T L –MM S S N –PS S
0.25 (0.010) T L –MS S N –PS S
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FAST AND LS TTL DATA
PACKAGE OUTLINESPLCC (continued)
Case 779-02 FN Suffix68-Pin Plastic
ABCEFGHJKRUVWXYZ
G1K1Z1
MIN MINMAX MAXMILLIMETERS INCHES
DIM25.0225.024.202.290.33
0.660.510.64
24.1324.131.071.071.07 —2°
23.121.02
2°
25.2725.274.572.790.48
0.81 — —
24.2824.281.211.211.420.5010°
23.62 —10°
0.9850.9850.1650.0900.013
0.0260.0200.0250.9500.9500.0420.0420.042
—2°
0.9100.040
2°
0.9950.9950.1800.1100.019
0.032 — —
0.9560.9560.0480.0480.0560.020
10°0.930
—10°
1.27 BSC 0.050 BSC
NOTES:1. DUE TO SPACE LIMITATION, CASE
779-02 SHALL BE REPRESENTED BY AGENERAL (SMALLER) CASE OUTLINEDRAWING RATHER THAN SHOWINGALL 68 LEADS.
2. DATUMS -L-, -M-, -N-, AND -P-DETERMINED WHERE TOP OF LEADSHOULDER EXIT PLASTIC BODY ATMOLD PARTING LINE.
3. DIM G1, TRUE POSITION TO BEMEASURED AT DATUM -T-, SEATINGPLANE.
4. DIM R AND U DO NOT INCLUDE MOLDPROTRUSION. ALLOWABLE MOLDPROTRUSION IS 0.25 (0.010) PER SIDE.
5. DIMENSIONING AND TOLERANCINGPER ANSI Y14.5M, 1982.
6. CONTROLLING DIMENSION: INCH.7. 779-01 IS OBSOLETE, NEW STANDARD
779-02.
68LEADS
ACTUAL
-N-
-L-
-P-V
D
D
W
-M-
168
A
R
E
JG
G1
C
Z
B
U
Z1
G1X
H
F
K
K1
DETAIL SDETAIL S
VIEW D-D
0.10 (0.004)SEATINGPLANE
-T-
Y BRK 0.18 (0.007) T N –PM S S L –MS S
0.18 (0.007) T N –PM S S L –MS S
0.25 (0.010) T N –PM S S L –MS S
0.18 (0.007) T L –MM S S N –PS S
0.18 (0.007) T N –PM S S L –MS S
0.18 (0.007) T L –MM S S N –PS S
0.18 (0.007) T N –PM S S L –MS S
S
0.18 (0.007) T L –MM S S N –PS S
0.18 (0.007) T L –MM S S N –PS S
0.25 (0.010) T L –MS S N –PS S
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FAST AND LS TTL DATA