Hunter 2011

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Corporate Overview

• Established: January 1, 1968

• Fed Tax ID: 77-0170595

• State Corp No: 1598731

• State Resale No: SRGH-26-791818

• SBA: P0088723

• DUNS: 050516962

• NAISC Code 541330: Engineering Services• NAISC Code 334412 Bare PC Board Manufacturing• NAISC Code 334412 Bare PC Board Manufacturing• NAISC Code 334418: Assembled PC Board Manufacturing

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Corporate Overview:National Design Coverageg g

Corporate HeadquartersSanta Clara, CA:

Santa Clara, CA:• Designers - 4• Electrical Engineers - 1

• 42,800 sq ft Manufacturing Facility• 120-Employees

★ ★

San Diego, CA:• Designers - 10• Electrical Engineers - 5• Software Engineers - 1

Crossville, TN:★

★★

★

★★

Crossville, TN:• Designers – 2

Denver, CO:• Designers - 3

Neptune NJ:

★

★ Neptune, NJ:• Designers – 14• Electrical Engineers – 3• RF Engineers – 1• Software Engineer – 1

★★ Corporate Headquarters

Design Center

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Design CenterSales Channel

Corporate Overview:Markets Served

Military & Aerospace

Test & Measurement Medical Device Semiconductor

Applications

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Corporate Overview:Core Competenciesp

Engineering & Design

&DFX

PCB Fabrication

Electronics Manufacturing

ServicesTest Fulfillment

DFX Services

Services

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Corporate Overview:ISO Certifications

*AS9100 Certification Scheduled July 2011*

ISO 9001 : 2000ISO 13485 : 2003

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ISO 9001 : 2000ISO 13485 : 2003

Corporate Overview:IPC CertificationsIPC Certifications

J-STD-001 IPC-A-600IPC-A-610 IPC-7711/7721

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Corporate Overview:Mil-Spec Certificationsp

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Corporate Overview:ITAR Registeredg

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Corporate Overview:Some of our CustomersSome of our Customers


Design Layout ServicesDFM DFT DFXDFM DFT DFX

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• Designer 6• Summer 08• P-CAD 2004

• Concept HDL-XL• Allegro PCB XL• Spectra Router XL

• Design Architect• DxDesigner• PADs LogicP CAD 2004

• P-CAD 2006Spectra Router XL

• OrCAD• OrCAD-CIS• OrCAD PCB Designer

PADs Logic• Board Station• Expedition• PADs Layout

• Master PCB Designer• Master IC Test Designer

• Schematic Capture• PCB Design Suite• FPGA Design• PR Editor XR


FABRICATION

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PCB Fabrication:Mechanical CapabilitiesMechanical Capabilities

Attribute Internal ExternalMax Panel Size 18" x 24" > 24" x 54"

Max Board Thickness 0.300" 0.480"Min Rigid Core Thickness < 0.002" < 0.002"

Min Prepreg Core Thickness < 0.002" < 0.001"Min Line Features (Trace/Space) – ¼ oz Cu 0.0025”/0.0025” 0.0025”/0.0025”

Max Layer Count > 40 > 60Max Layer Count > 40 > 60Aspect Ratio (0.006" Conventional PTH) > 22 : 1 > 32 : 1

Min Conventional Drill Size 0.008" 0.004"Min Plated Through Hole (PTH) 0.006" 0.002"

Min Land Pad (PTH) < 0.010" < 0.008"Min Laser Drill - 0.002"

Min Cu Filled Via (HDI) 0.006" 0.004"Min Land Pad (HDI) 0.010" 0.006"

HDI Aspect Ratio (0.004" Cu Filled Via) > 1 : 1 2 : 1Min Plane Relief 0 020" 0 010"Min Plane Relief 0.020 0.010

Minimum Routing Radius 0.012" < 0.012"Min Device Pitch 0.010" 0.010"

Plated Hole Tolerance +/- 0.002" < 0.002"Layer-to-Layer Registration +/- 0.003" < 0.002"


Impedance Tolerance +/- 5% 3%

PCB Highlights:Plating FinishesPlating Finishes

Plating Finish Internal External

Electroless Cu ✔

Electroless Ni Immersion Au (ENIG) ✔

Electroplated Cu, Ni/Au, Sn/Pb ✔

Hot Air Solder Level (HASL) ✔

Pb-Free Hot Air Solder Level (HASL) ✔

Electroless Ni Electroless Pd Immersion Au ✔(ENEPIG) ✔

Immersion Au ✔

Immersion Ag ✔

Immersion Sn ✔


PCB Highlights:Material OfferingsMaterial Offerings

45NK N4000

ArlonNelco

84N N5000

85N N7000

CLTE, -AT, -XT N8000

FR370 N9000

FR406 RO30xx

FR408 RO32xx

Isola RogersIS410 RO4xxxx

IS415 RT/duroid

IS620i TMM xxxIS620i TMM xxx

IS680

TaconicfastRise

Nan Ya NPG-170 RF

Panasonic M t 6 TLC TLX TLY


Panasonic Megtron 6 TLC, TLX, TLY

PCB Highlights:CAM/DFM ToolsCAM/DFM Tools

Genesis 2000• Design Optimization:

Imaging

• Line Features• Signal Layers• Power/Ground Layers

• Coupon Generator

AOITest

• Coupon Generator• Etch Compensation• Copper Balancing• HDI Tool Suite• Via Analysis• Neck Down Repair• Auto Drill Manager• Auto Rout Manager

DrillingRouting


Auto Rout Manager

PCB Highlights:CAM/DFM ToolsCAM/DFM Tools

Si900e• Impedance magnitude• Skin depth• Insertion loss S21• Conductor loss dB• Dielectric loss dBDielectric loss dB• Propagation velocity• Propagation delay• Differential propagation velocity

Diff ti l d l• Differential delay• Odd mode Z magnitude• Even mode Z magnitude• SPICE RLGC


• 2 & 4-Port S-Parameters

PCB Highlights:Fab Tools

Paragon 6600I LDI System

Fab Tools

• DoF: +/- 300μm• Registration Accuracy: 24μm• Annular Ring Accuracy: > 12μm• Line Features: 0.001”

Discovery 8000 AOI System• 100% Inspection On All Panels

0 001” Li F t• 0.001” Line Features• SIP Technology

VeriSmart Verification & Repair StationVeriSmart Verification & Repair Station• 18x-78x Zoom/Magnification Range• 0.0001” Measurements• 0 002” Line Features


0.002 Line Features

PCB Highlights:Fab Tools

I t XR E ll 689

Fab Tools

Inspectra XR•X-Ray of scaling factors affecting hole-size & interlayer registration, & tool metrology

Excellon 689•Spindle Speed: 180,000 rpm•Infeed / Retract Rate: 1,500 ipm (38 / i )tool metrology

•Depth Control: +/- 0.0002” (38 m/min)• Drill Accuracy: +/- 0.001”• Positional: +/- 0.0002”• Repeatability: +/- 0.0001”epeatab ty / 0 000


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EMS Highlights:Capabilities & ServicesCapabilities & Services

J-STD-001 / IPC-610-A / IPC-7711 / IPC-7721

Surface Mount, Through-Hole, & Mechanical Assembly

Box & System Build

Repair & Rework

Design for Manufacturing (DFM)

Continuity, In-Circuit, & Electronic Bench Testing

Automated Optical Inspection (AOI)

Automated X-Ray Inspection (AXI)

Conformal Coatingg

Supply-Chain Management

Fulfillment & Deployment


EMS Highlights:Design for ManufacturingDesign for Manufacturing

• Automated Interface to AOI, AXI, ATE, & ERP Tools, ,

• Process Engineering• Production Planning• Lean Materials Planning

E i t M it i &• Equipment Monitoring & Management

• Real-Time Quality Control• Valor Parts Library with >35-y

Million OEM Part-Numbers• Auto-Generated SMT Libraries


EMS Highlights:SMT LinesSMT Lines

UP2000 HiE•Fiducial Alignment

KE-750E• 0402 – 20mm sq

KE-2020•0201 50mm sq

1800EXL•Fiducial Alignment•Alignment Accuracy:+/-0.001”•Alignment Repeatability: +/- 0.001”

t 6 Si

0402 20mm sq Component Placement

• Up to 12,000 CPH• X/Y Resolution –

0 005”

•0201 – 50mm sq Component Placement•Up to 20,000 CPH•Leaded, BGA, & Odd Shaped Component

•Eight Heating Zones•Two Cooling Zones•Five Profiling Thermal Couples•Conveyer Speeds up toat 6-Sigma

•11-Second Cycle Times 0.005

• X/Y Repeatability - +/-0.001”

(Two / SMT Line)

Shaped Component Compatibility

Conveyer Speeds up to 40” / minute.•Steady State Control with <2 C Gradients


( )

EMS Highlights:Automated InspectionAutomated Inspection

Structural DefectsStructural DefectsStructural Defects• Solder Bridging• Solder Voids/Opens• Missing/Damaged

Components

Structural Defects• Solder Bridging• Solder Voids/Opens• Missing/Damaged

ComponentsTRI TR-7550 AOI Agilent 5DX AXIComponents• Billboards• Tombstones• Lifted Leads• Solder Ball Defects

Components• Billboards• Tombstones• Lifted Leads• Solder Ball Defects

TRI TR 7550 AOI•High-Speed In-Line Dynamic Imaging•Digital 3 CCD Full-Color Camera

Agilent 5DX AXI•3D X-Ray Laminography•80-140 Solder Joints/Second•0.2mm Device Pitch• Solder Ball Defects

• BGA Reflow Defects• Insufficient Solder• Excessive Solder• Misalignment

• Solder Ball Defects• BGA Reflow Defects• Insufficient Solder• Excessive Solder• Misalignment

Camera•1001005 Case Sizes•Optical Character Recognition & Verification

0 e ce tc•Image Acquisition Time of 5-Images/Second•Surface Map Time of 5-Points/Sec


• Misalignment• Misalignment

EMS Highlights:Test Equipmentq p

86100C86100C E3631AE3631A E5810AE5810A N9020AN9020AHMC T2100HMC T2100

E8364CE8364CE4438CE4438C 8400CJ8400CJi3070i3070

34401A34401A 34970A34970A8595E8595E SR5500SR5500 TDS 784CTDS 784C


Jason S LevyJason S LevyStrategic Alliance Director

[email protected](408) 328-9775 Direct

www.hunterpcb.com

Documents

Hunter 2011