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HumPROTM Series Master Development System
User's Guide
Table of Contents 1 Introduction 2 Ordering Information 2 HumPROTM Series Transceiver Carrier Board 2 HumPROTM Series Transceiver Carrier Board Objects 3 HumPROTM Series Carrier Board Pin Assignments 3 Programming Dock 3 Programming Dock Objects 4 Prototype Board 4 Prototype Board Objects 5 Initial Setup 6 Using the Prototype Board 8 Using the Programming Dock 10 The Development Kit Demonstration Software 20 Development Kit Demonstration Software Example 24 Carrier Board Schematic 25 Programming Dock Board Schematic 29 Prototype Board Schematic
Warning: Some customers may want Linx radio frequency (“RF”) products to control machinery or devices remotely, including machinery or devices that can cause death, bodily injuries, and/or property damage if improperly or inadvertently triggered, particularly in industrial settings or other applications implicating life-safety concerns (“Life and Property Safety Situations”).
NO OEM LINX REMOTE CONTROL OR FUNCTION MODULE SHOULD EVER BE USED IN LIFE AND PROPERTY SAFETY SITUATIONS. No OEM Linx Remote Control or Function Module should be modified for Life and Property Safety Situations. Such modification cannot provide sufficient safety and will void the product’s regulatory certification and warranty.
Customers may use our (non-Function) Modules, Antenna and Connectors as part of other systems in Life Safety Situations, but only with necessary and industry appropriate redundancies and in compliance with applicable safety standards, including without limitation, ANSI and NFPA standards. It is solely the responsibility of any Linx customer who uses one or more of these products to incorporate appropriate redundancies and safety standards for the Life and Property Safety Situation application.
Do not use this or any Linx product to trigger an action directly from the data line or RSSI lines without a protocol or encoder/decoder to validate the data. Without validation, any signal from another unrelated transmitter in the environment received by the module could inadvertently trigger the action.
All RF products are susceptible to RF interference that can prevent communication. RF products without frequency agility or hopping implemented are more subject to interference. This module does have a frequency hopping protocol built in, but the developer should still be aware of the risk of interference.
Do not use any Linx product over the limits in this data guide. Excessive voltage or extended operation at the maximum voltage could cause product failure. Exceeding the reflow temperature profile could cause product failure which is not immediately evident.
Do not make any physical or electrical modifications to any Linx product. This will void the warranty and regulatory and UL certifications and may cause product failure which is not immediately evident.
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IntroductionThe Linx HumPROTM Series data transceiver modules offer a simple, efficient and cost-effective method of adding wireless capabilities to any product. The Master Development System provides a designer with all the tools necessary to correctly and legally incorporate the module into an end product. The boards serve several important functions:
• Rapid Module Evaluation: The boards allow the performance of the Linx HumPRO™ Series modules to be evaluated quickly in a user’s environment. The development boards can be used to evaluate the range performance of the modules.
• Application Development: A prototyping board allows the development of custom circuits directly on the board. All signal lines are available on headers for easy access.
• Software Development: A programming dock with a PC interface allows development and testing of custom software applications for control of the module.
• Design Benchmark: The boards provide a known benchmark against which the performance of a custom design may be judged.
The Master Development System includes 2 Carrier Boards, 2 Programming Dock Boards, 2 Prototype Boards, 4 regular or amplified HumPROTM Series transceivers*, antennas, batteries and full documentation.
* One part is soldered to each Carrier Board
HumPROTM Master Development System
User's Guide
Figure 1: HumPROTM Series Master Development System
Revised 9/28/2017
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HumPROTM Series Transceiver Carrier Board Objects1. HumPROTM Series Transceiver2. MMCX RF Connector3. Dual Row Header4. Single Row Header
HumPROTM Series Transceiver Carrier BoardOrdering Information
Figure 2: Ordering Information
Figure 3: HumPROTM Series Transceiver Carrier Board
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Ordering Information
Part Number Description
MDEV-***-PRO HumPROTM Series Master Development System
MDEV-A-900-PRO Amplified HumPROTM Series Master Development System
HUM-***-PRO HumPROTM Series Data Transceiver
HUM-***-PRO-CAS HumPROTM Series Data Transceiver with Castellation Connection
HUM-***-PRO-UFL HumPROTM Series Data Transceiver with U.FL Connector
HUM-A-900-PRO-CASAmplified HumPROTM Series High Power Data Transceiver with Castellation Connection
HUM-A-900-PRO-UFLAmplified HumPROTM Series High Power Data Transceiver with U.FL Connector
EVM-***-PRO HumPROTM Series Carrier Board
EVM-A-900-PRO-CASAmplified HumPROTM Series Carrier Board, Castellation Connection with an edge-mount RP-SMA connector
EVM-A-900-PRO-UFL Amplified HumPROTM Series Carrier Board, U.FL Connector
MDEV-PGDOCK Development System Programming Dock
MDEV-PROTO Development System Prototype Board
CON-SOC-EVM EVM Module Socket Kit
*** = Frequency; 868, 900MHz
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Programming Dock
Programming Dock Objects1. Carrier Board Socket2. RP-SMA Antenna Connector3. MODE_IND LED4. Micro USB Connector5. LCD Display
Figure 6: Programming Dock
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HumPROTM Series Carrier Board Pin Assignments
7 MODE_IND9 CMD_DATA_IN11 CMD13 CTS15 CMD_DATA_OUT17 VCC19 NC21 NC23 NC25 NC27 NC29 NC31 NC33 NC35 NC37 NC
GND 6RESET 8
POWER_DOWN 10NC 12PB 14
LNA_EN 16NC 18
PA_EN 20NC 22NC 24NC 26NC 28NC 30NC 32NC 34NC 36
41 NC42 NC43 NC44 NC45 NC46 BE47 NC48 NC49 NC50 NC51 NC52 NC53 NC54 NC55 NC56 NC
40 NC39 CRESP38 EX
ANTENNA 1 2-5 GND (RF Connector)
Amplified HumPROTM Series Carrier Board
Amplified HumPROTM Series Carrier Board Objects1. Amplified HumPROTM Series Transceiver2. Edge-mount RP-SMA RF Connector3. Dual Row Header4. Single Row Header
Figure 4: Amplified HumPROTM Series Transceiver Carrier Board
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Figure 5: HumPROTM Series Transceiver Carrier Board Pin Assignments (Top View)
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Prototype Board
Prototype Board Objects1. Carrier Board Socket2. RP-SMA Antenna Connector3. Micro USB Connector4. Power Switch5. Power LED6. External Battery Connection7. Prototyping Area8. 3.3V Supply Bus9. Ground Bus10. USB UART Interface Lines11. Module Interface Breakout Headers12. Standard SMT Package Footprints13. Command Data Interface Routing Switches (on back)
Figure 7: Prototype Board
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Initial SetupThere are several boards that are included with the Development System. The Carrier Boards have a HumPROTM Series transceiver on a daughter board with headers. These boards snap into sockets on the other boards, enabling the modules to be easily moved among the test boards.
There are two Programming Docks that have a socket for a Carrier Board and a USB interface for connection to a PC. This is used with the demonstration software included with the kit to configure the module through its Command Data Interface.
There are two Prototype Boards that have a socket for a Carrier Board, a USB interface and a large area of plated through holes that can be used to develop custom circuitry. The board can be powered either from the USB connection or an external battery.
The development software supports Windows 7 and 10; with Java 1.6 or later.
Warning: Installing or removing a Carrier Board while power is applied could cause permanent damage to the module. Either turn off power to the board or unplug the USB cable before installing or removing a Carrier Board
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Supply for the module is connected through R17. This can be removed and replaced by another supply or used to measure the current consumption of the module.
Figure 9 shows the bottom of the board.
SW1 and SW2 connect the USB interface to the Command Data Interface lines on the module. This allows the prototype board to be used with the development kit software or a custom application. When in the “USB Connected position”, the module is connected to the USB interface. The “Header Only” position connects the module to the header.
Footprints for 0603 size resistors are on most lines so that pull-ups or pull-downs can easily be added to the lines. The pads are connected to VCC or GND based on the most common configuration for the module. The schematic at the end of this document shows how each line is connected.
Using the Prototype BoardSnap a Carrier Board onto the socket on the Prototype Board as shown in Figure 8.
Connect a micro USB cable into the connector at the top of the board. Plug the other end into a PC or any USB charger. The board is powered by the USB bus. This board features a prototyping area to facilitate the addition of application-specific circuitry. The prototyping area contains a large area of plated through-holes so that external circuitry can be placed on the board. The holes are set at 0.100” on center with a 0.040” diameter, accommodating most industry-standard SIP and DIP packages. Footprints for standard surface mount packages are also included to aid prototyping.
At the top of the prototyping area is a row connected to the 3.3V power supply and at the bottom is a row connected to ground. External circuitry can be interfaced to the transceiver through the breakout headers. The numbers next to the headers correspond to the pin numbers on the Carrier Board. Figure 4 shows the pin assignments for the Carrier Board.
The OVERLOAD LED indicates that that too much current is being pulled from the USB bus. This is used to prevent damage to the parts or the bus. The overload condition is reset once the excess current draw is removed.
Figure 8: Prototype Board with a Carrier Board
Note: The onboard 3.3-volt regulator has approximately 400mA available for additional circuitry when plugged into a PC (60mA with the amplified PRO). If more current is required, the user must power the board from an external supply or a USB charger with more current capabilities, up to 1A.
Figure 9: Prototype Board Bottom Side
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Using the Programming DockSnap a Carrier Board onto the socket on the Programming Dock as shown in Figure 10.
Connect a micro USB cable into the connector at the top of the board. Plug the other end into a PC. The board is powered by the USB bus. The demonstration software included with the kit or custom application software can be used to configure the module through its Command Data Interface. The LCD is used to display information about the module. This includes the module’s local address and a custom nickname. The nickname is entered using the development kit software and can be any name that helps distinguish the modules from one another. This is convenient when multiple programming docks are connected to the same computer. Please see the development kit software section for more information on the nicknames.
The HumPROTM Series transceiver has a serial Command Data Interface that is used to configure and control the transceiver. This interface consists of a standard UART with a serial command set.
Figure 10: Programming Dock with a Carrier Board
Range TestingSeveral complex mathematical models exist for determining path loss in many environments. These models vary as the transmitter and receiver are moved from indoor operation to outdoor operation. Although these models can provide an estimation of range performance in the field, the most reliable method is to simply perform range tests using the modules in the intended operational environment.
Range testing can be performed with the Programming Docks and / or the Prototype Boards. Data can be sent across the link using the included software or a custom microcontroller connected to the module. The RSSI is included with the output data messages, so this can be used to qualify the link.
As the maximum range of the link in the test area is approached, it is not uncommon for the signal to cut in and out as the radio moves. This is normal and can result from other interfering sources or fluctuating signal levels due to multipath effects. This results in cancellation of the transmitted signal as direct and reflected signals arrive at the receiver at differing times and phases. The areas in which this occurs are commonly called “nulls” and simply walking a little farther usually restores the signal. If the signal is not restored, then the maximum range of the link has been reached.
To achieve maximum range, keep objects such as your hand away from the antenna and ensure that the antenna on the transmitter has a clear and unobstructed line-of-sight path to the receiver board. Range performance is determined by many interdependent factors. If the range you are able to achieve is significantly less than specified by Linx for the products you are testing, then there is likely a problem with either the board or the ambient RF environment in which the board is operating. First, check the battery, switch positions, and antenna connection. Next, check the ambient RSSI value with the transmitter turned off to determine if ambient interference is present. High RSSI readings while the transmitter off indicate there is interference. If this fails to resolve the issue, please contact Linx technical support.
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The Development Kit Demonstration SoftwareThe development kit includes software that is used to configure and control the module through the Programming Dock. The software defaults to the Advanced Configuration tab when modules are plugged in (Figure 11). This window configures the module’s settings.
1. Clicking the Contact Linx, Documentation and About labels on the left side expands them to show additional information and links to the latest documentation. This is shown in Figure 12.
2. The Help window shows tips and comments about the software.
3. The active module is connected to the PC and being configured by the software.
4. Available modules are connected to the PC but are not currently being configured or controlled by the software.
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Figure 11: The Master Development System Software Advanced Configuration Tab
5. Known Modules are not currently connected to the PC, but have either been connected to the software in the past or have been manually entered.
6. The Memory group selects whether configurations are written to volatile or non-volatile memory.
7. The configurations are divided into groups. The Addressing group configures the addressing features of the module.
• The Addressing Mode (ADDMODE) menu sets the addressing mode used by the module; either DSN, User or Extended User.
• The Auto Addressing (AUTOADDR) menu turns the automatic addressing feature on and off.
• The MYDSN address is the module’s local address. This is configured at the factory and cannot be changed.
• The DSN Destination Address (DESTDSN) is the address of the desired destination module when DSN addressing mode is used.
• User Source Address (USRCID) is the module’s local address when User and Extended User modes are used.
• User Destination Address (UDESTID) is the address of the destination module when User and Extended User addressing modes are used.
• User ID Address Mask (UMASK) is the mask for screening incoming packets.
• The LASTNETAD is the last address that the module assigned using the JOIN process. This is only used if encryption is used and the module is an administrator.
• The Compatibility (COMPAT) setting allows communication with legacy products.
8. The Radio group configures the radio settings of the module.
• For 900MHz units, checking the ENCSMA box enables the Carrier Sense Multiple Access feature.
• The HOPTABLE menu selects the module’s hopping pattern
• The TXPWR menu sets the module’s transmitter output power.
• The IDLE menu sets the module’s operating state as awake or asleep.
• The ARSSI measurement is the ambient RSSI in the local environment on the current channel at the time when the read command is issued.
• The PRSSI is the RSSI measurement of the last valid packet that was received.
Figure 12: Additional Information
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• Checking the Extended Preamble box configures the module to send a long preamble at the beginning of every packet.
• Checking the Assured Delivery box enables RF acknowledgements and retries when an acknowledgement is not received.
• MAXTXRETRY sets the maximum number of times that the module will retry sending the packet before an exception is thrown.
• Checking the ENCRC box enables the CRC checks on the incoming data. The CRC Errors box shows the number of errors since the last power cycle or the last time the count was reset.
9. The Serial Port group configures all of the UART serial port settings.
• The UARTBAUD menu configures the serial port baud rate, which is used by the module to set the over-the-air RF data rate.
• The Byte Count Trigger (BCTRIG) sets the number of bytes that the UART receives before triggering the transmission of a packet.
• The UART Data Timeout (DATATO) sets the number of milliseconds from the last character received on the UART before the module transmits the data in its buffer.
• Selecting the WAKEACK box instructs the module to output the acknowledgement (0x06) on the UART when the module wakes from sleep or power cycle.
• Selecting the CMDHOLD box instructs the module to buffer any received over-the-air data while processing configuration commands.
• Selecting the SHOWVER box instructs the module to output the firmware version information when the module starts up from a power cycle or reset.
10. The Packet Options group configures the explicit packet transmission and reception, allowing the host microcontroller to control when packets are sent and how they are received. These are set in the PKTOPT register.
11. The Encryption Options group configures the encryption settings.
• Selecting the Encrypted Transmission box enables encryption.
• Clicking the Write Key button opens a window where the 128-bit AES key can be entered (Figure 13).
• Clicking the Clear Key button opens a window where the key can be cleared (Figure 13).
12. The Security Options group corresponds to the SECOPT register. This configures the security options related to encryption and the Join Process for setting up networks.
13. The Exceptions group configures the Extended Exception Flags and Extended Exception Mask.
• Checking the boxes in the EEMASK0 and EEMASK1 rows sets which exception conditions trigger the exception flags
• The EEXFLAG0 and EEXFLAG1 boxes show the current value for the flags. 0x00 means no exceptions were detected. A non-zero value means an exception flag is set. Clicking on the box opens a menu showing which flags are set. Clicking on the flag clears it (Figure 14).
14. The Legacy Exception Registers group configures the Exception Mask and Exception Flags associated with the older 250 Series modules. These are included for backwards compatibility and are not recommended for new designs.
15. The Module Identity group displays the RELEASE value and the firmware version.
16. The Show Commands button opens a window that displays all of the commands sent to the module. This is useful for seeing the UART commands when developing and debugging firmware.
17. The Read All button reads all of the values from the active module.
18. The Write button writes all changes to the active module.
19. The Set Defaults button restores all settings to the factory defaults.
Figure 13: The Master Development System Software Write Key and Clear Key Windows
Figure 14: The Master Development System Software Exception Flags
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20. The Reset Module button issues a command to restart the module.
21. When an 868MHz module is active, the ENCSMA becomes a drop-down menu that selects the LBT + AFA settings (Figure 15).
The modules are shown with four identifiers as shown in Figure 16.
1. The type of module (HumPRO™ or Amplified HumPROTM Series)
2. The module’s local address.
3. A custom name that can be given to the module. Type a name into the box and press Enter to apply it. This name is shown on the LCD display on the programming dock (Figure 17).
4. The active module has an eject symbol that disconnects the software from that module when clicked. The Available modules have a play symbol that makes that module active when clicked.
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Figure 17: The Master Development System Programming Dock with Name and Address Displayed
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Figure 15: The Master Development System Software 868MHz Advanced Configuration Tab
Figure 16: The Master Development System Software Module Identifiers
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The Wireless Chat tab (Figure 18) offers a demonstration of sending data between two modules. There is a window for each connected module.
1. The top of the window shows the address or nickname of the associated module.
2. The chat screen shows the chat messages that have been sent and received. Transmitted messages are in pink, received are in blue.
3. The Send box is where the message text is entered. The message is transmitted when the Send button is clicked.
4. The TX Times box shows how many times the module has transmitted.
5. The RX Count box counts the number of messages that the module has received.
6. The Clear button clears all of the messages from the chat window.
7. The RSSI box indicates the signal strength of the last received message.
8. When the Show As Bytes box is selected the messages are shown as bytes in the chat window.
Figure 18: The Master Development System Software Wireless Chat Tab
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9. When the Echo with RSSI box is checked, the software transmits any message it receives and appends the received RSSI to the end of the message.
10. The Join Status box shows the value in the JOINST register. This indicates the state of Join activity since the module was last reset. Clicking on the box opens a description of the value (Figure 19).
11. The Join Commands button sets the Join Process Control options in the CMD register. Clicking on the button opens a menu of the Join commands. Clicking on one of the commands triggers that operation (Figure 20).
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Figure 19: The Master Development System Software Join Status Register Description
Figure 20: The Master Development System Software Join Commands
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Figure 23: The Master Development System Software Command Set Tab Items Menu
Figure 22: The Master Development System Software Command Set Tab Commands Menu
Figure 24: The Master Development System Software Show Commands Window
The Command Set tab (Figure 21) allows specific commands to be written to the module.
1. The Command box shows the hexadecimal values that are written to the module. Values can be typed into the box or a command can be selected from the Commands menu.
2. The Response box shows the hexadecimal values that are returned from the module in response to a command.
3. The Commands drop-down menu shows all of the commands that are available for the active module (Figure 22). Selecting one of the commands from this menu automatically fills in the Command box. The values can be adjusted by typing in the box.
4. The Items drop down menu displays all of the items that are available for the active module (Figure 23). Selecting one of the items from this menu automatically fills in the Command box. The values can be adjusted by typing in the box.
5. Clicking Send writes the values in the Command box to the module.6. The structure of the selected command and its response is shown in
the main window. Please see the HumPRO™ Series Transceiver Data Guide for definitions of each value.
7. The Show Commands button opens a window that shows the bytes sent to the module and the responses from the module (Figure 24).
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Figure 21: The Master Development System Software Command Set Tab
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Any changes to the current configurations are shown in red. These changes are not written to the module until the Submit button is clicked.
Figure 27: The Master Development System Software with Connected Modules
Figure 28: The Master Development System Software Advanced Configuration with Changes
Development Kit Demonstration Software ExampleThis example shows how to configure two modules to work with each other. The software defaults to the Advanced Configuration tab when opened (Figure 25).
Install Carrier Boards onto the Programming Docks and plug a USB cable between the Programming Docks and the PC. The software automatically detects attached devices. The first module that is identified appears under the Active label. This is the module that is actively controlled by the software. Subsequent modules are listed under the Available label as shown in Figure 26.
Once the modules are detected by the software, the appropriate options are displayed on the Advanced Configurations tab. The module’s documents appear under the Documentation link.
Figure 25: The Master Development System Software Advanced Configuration Tab at Start-up
Figure 26: The Master Development System Software Connected Modules
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Text can be entered into the box. Once the Send button is clicked, the text is transmitted to the other module. The RX Times, TX Times and RSSI boxes display data that can be used to qualify the integrity of the link.
The modules can be used with two computers for range testing. Install the Master Development System software on both computers. Connect both modules to both computers so that the software learns them. Now one module can be used with each computer to form a link.
When using both modules in close proximity to each other, such as when both are connected to one connected to one computer for testing, it is a good idea to set the transmitter output power to a low level. At short ranges and high output power levels the receivers can become saturated and miss packets.
Figure 30: The Master Development System Software Wireless Chat Tab
Changing the active module is accomplished by clicking the play symbol next to the desired module. Changes can now be made to this module.
There are several settings that must match in order for the modules to be able to communicate. This example uses the following settings.
• Addressing mode is DSN
• The DSN Destination Address is the DSN address of the other module. In this example, the module with the 346FA9FC DSN Source Address has the DSN Destination Address of 6DCD70E2 and vice versa.
• The Hopping Pattern is 1.
• The UART Baud Rate is 38400.
Other settings can be used as long as they match on both modules. Once the settings are changed and submitted to both modules, the Wireless Chat tab can be used to transfer data.
Figure 29: The Master Development System Software Advanced Configuration with Changes Written
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Figure 31: HumPROTM Series Transceiver Carrier Board Schematic
Carrier Board Schematic
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Figure 32: Amplified HumPROTM Series Transceiver Carrier Board Schematic
Amplified Carrier Board Schematic
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GND
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SIGNAL ROUTING
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F
GN
D
5V1
DA
T-
2
DA
T+3
NC
4
GSHD 6GSHD 7
GN
D5
J1 Mic
ro U
SB
5VU
SB
RTS
R2
27
R3
27
TXD
RX
D
nCTS
VC
C R20
10k
R47
DN
P
GP
IO2
RX
TXLE
D
D1
R5330 ohm
OR
AN
GE
RX
TXLE
D
VCC
R1710k
GND
NC1
IN2
GND3 OUT 4
VCC 5U5 VCC
GND
R49 DNPBuffer Bypass DNP
RTS nCMD
CMD_DATA_OUTRXD
NC1
IN2
GND3 OUT 4
VCC 5U1 VCC
GND
R4610k
VCC
R48 DNPCMD_DATA_INTXD
Buffer Bypass DNP
GND
MO
DE
_IN
D
R8330 ohm
D4
MO
DE
_IN
D B
LUE
R2410k
S2
VCC
PA
IR
PAIR
GND
R410 ohm
R400 ohm
VCC
GND
SW1
LADJ
R36DNP
R23DNP
GPIO1
RXD
GND
nPDN
R9
10k
GN
D
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
D
GN
DG
ND
R35
10k
R34
10k
R33
10k
R32
10k
R30
10k
R28
10k
R22
10k
R21
10k
R18
10k
R15
10k
R14
10k
R13
10k
R12
10k
R10
10k
GN
DR
3810
kV
CC
R16
10k
VC
C
VC
C R1
1 O
hm
MODE_INDCMD_DATA_IN
CM
D_D
ATA
_OU
T
GN
D
GN
D
GN
DG
ND
GN
D
1
23
45
67
89
1011
1213
1415
1617
1819
2021
2223
2425
2627
2829
3031
3233
3435
3637
J2 Car
rier I
nter
conn
ectR29
10k
GN
D
GN
DV
CC
VC
CR
2710
kR
2510
k
R19
10k
R31
10k
VC
C
PA
IR
GN
DR
2610
kG
ND
R37
10k
GN
DR
3910
kG
ND
R43
10k
R44
10k
GN
DR
4510
kG
ND
RF
1
GND 2-5
AN
T1
GN
DG
ND
X1
1nH
X3
DN
P
GN
DX2
DN
P
LAD
J
nPD
NnC
MD
nCTS
CMD_DATA_IN
GP
IO1
GP
IO2
GP
IO1
Figure 33: Programming Dock Board RF Carrier Area Schematic
Programming Dock Board Schematic
GND
+ C8
100uF
VCC
GND
Vin1
GN
D2
Vout 3
U4LM3940IMP 3.3V
C90.47uF
GND
IN1
GND2
EN3 FAULT 4
ILIM 5
OUT 6
U3TPS2552
GND
5VUSB
GND
R1153.6kPWREN#
USB AREA POWER SUPPLY AREA RF MODULE CARRIER AREA
SIGNAL ROUTING
U8
VDC1
RA52
RA43
MCLR4
RC55
RC46
RC37 RC2 8RC1 9RC0 10RA2 11ICSPCLK 12ICSPDAT 13GND 14
PIC16F1825-I/ST
VCC GND
PGM
CSB RSSISCLRSTPGCPGD
R42 DNP
VCCP
VCC
RS
SISCL
RST
CSB
VCC
GND
GNDC131uF
GND
C141uF C1-2
C1+3
VOUT4
VCC5
GND6
SI7
SCL8
CSB9
RS10
LED+1
LED-12
RST11
LCD1
2x16 LCD
R60 Ohm
MICROCONTROLLER AREA
D2
GN
D
GN
D
+C
14.
7uF
C4
0.01
uF
L1 600R
/1.3
A
GN
D
C6
47pF
R4
0
C2
0.1u
F
VCC12
VCCIO3
3V3O
UT
10
GND 5
GND 13
US
BD
M9
US
BD
P8
RE
SE
T#11
TXD
1
RX
D4
RTS
#2
CTS
#6
CB
US
015
CB
US
114
CB
US
27
CB
US
316
U2
FT23
0X
C5
47pF
PW
RE
N#
C7
0.1u
F
GN
D
5V1
DA
T-
2
DA
T+3
NC
4
GSHD 6GSHD 7
GN
D5
J1 Mic
ro U
SB
5VU
SB
RTS
R2
27
R3
27
TXD
RX
D
nCTS
VC
C R20
10k
R47
DN
P
GP
IO2
RX
TXLE
D
D1
R5330 ohm
OR
AN
GE
RX
TXLE
D
VCC
R1710k
GND
NC1
IN2
GND3 OUT 4
VCC 5U5 VCC
GND
R49 DNPBuffer Bypass DNP
RTS nCMD
CMD_DATA_OUTRXD
NC1
IN2
GND3 OUT 4
VCC 5U1 VCC
GND
R4610k
VCC
R48 DNPCMD_DATA_INTXD
Buffer Bypass DNP
GND
MO
DE
_IN
D
R8330 ohm
D4
MO
DE
_IN
D B
LUE
R2410k
S2
VCC
PA
IR
PAIR
GND
R410 ohm
R400 ohm
VCC
GND
SW1
LADJ
R36DNP
R23DNP
GPIO1
RXD
GND
nPDN
R9
10k
GN
D
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
D
GN
DG
ND
R35
10k
R34
10k
R33
10k
R32
10k
R30
10k
R28
10k
R22
10k
R21
10k
R18
10k
R15
10k
R14
10k
R13
10k
R12
10k
R10
10k
GN
DR
3810
kV
CC
R16
10k
VC
C
VC
C R1
1 O
hm
MODE_INDCMD_DATA_IN
CM
D_D
ATA
_OU
T
GN
D
GN
D
GN
DG
ND
GN
D
1
23
45
67
89
1011
1213
1415
1617
1819
2021
2223
2425
2627
2829
3031
3233
3435
3637
J2 Car
rier I
nter
conn
ectR29
10k
GN
D
GN
DV
CC
VC
CR
2710
kR
2510
k
R19
10k
R31
10k
VC
C
PA
IR
GN
DR
2610
kG
ND
R37
10k
GN
DR
3910
kG
ND
R43
10k
R44
10k
GN
DR
4510
kG
ND
RF
1
GND 2-5
AN
T1
GN
DG
ND
X1
1nH
X3
DN
P
GN
DX2
DN
P
LAD
J
nPD
NnC
MD
nCTS
CMD_DATA_IN
GP
IO1
GP
IO2
GP
IO1
Figure 34: Programming Dock Board Power Supply Area Schematic
GND
+ C8
100uF
VCC
GND
Vin1
GN
D2
Vout 3
U4LM3940IMP 3.3V
C90.47uF
GND
IN1
GND2
EN3 FAULT 4
ILIM 5
OUT 6
U3TPS2552
GND
5VUSB
GND
R1153.6kPWREN#
USB AREA POWER SUPPLY AREA RF MODULE CARRIER AREA
SIGNAL ROUTING
U8
VDC1
RA52
RA43
MCLR4
RC55
RC46
RC37 RC2 8RC1 9RC0 10RA2 11ICSPCLK 12ICSPDAT 13GND 14
PIC16F1825-I/ST
VCC GND
PGM
CSB RSSISCLRSTPGCPGD
R42 DNP
VCCP
VCC
RS
SISCL
RST
CSB
VCC
GND
GNDC131uF
GND
C141uF C1-2
C1+3
VOUT4
VCC5
GND6
SI7
SCL8
CSB9
RS10
LED+1
LED-12
RST11
LCD1
2x16 LCD
R60 Ohm
MICROCONTROLLER AREA
D2
GN
D
GN
D
+C
14.
7uF
C4
0.01
uF
L1 600R
/1.3
A
GN
D
C6
47pF
R4
0
C2
0.1u
F
VCC12
VCCIO3
3V3O
UT
10
GND 5
GND 13
US
BD
M9
US
BD
P8
RE
SE
T#11
TXD
1
RX
D4
RTS
#2
CTS
#6
CB
US
015
CB
US
114
CB
US
27
CB
US
316
U2
FT23
0X
C5
47pF
PW
RE
N#
C7
0.1u
F
GN
D
5V1
DA
T-
2
DA
T+3
NC
4
GSHD 6GSHD 7
GN
D5
J1 Mic
ro U
SB
5VU
SB
RTS
R2
27
R3
27
TXD
RX
D
nCTS
VC
C R20
10k
R47
DN
P
GP
IO2
RX
TXLE
D
D1
R5330 ohm
OR
AN
GE
RX
TXLE
D
VCC
R1710k
GND
NC1
IN2
GND3 OUT 4
VCC 5U5 VCC
GND
R49 DNPBuffer Bypass DNP
RTS nCMD
CMD_DATA_OUTRXD
NC1
IN2
GND3 OUT 4
VCC 5U1 VCC
GND
R4610k
VCC
R48 DNPCMD_DATA_INTXD
Buffer Bypass DNP
GND
MO
DE
_IN
D
R8330 ohm
D4
MO
DE
_IN
D B
LUE
R2410k
S2
VCC
PA
IR
PAIR
GND
R410 ohm
R400 ohm
VCC
GND
SW1
LADJ
R36DNP
R23DNP
GPIO1
RXD
GND
nPDN
R9
10k
GN
D
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
D
GN
DG
ND
R35
10k
R34
10k
R33
10k
R32
10k
R30
10k
R28
10k
R22
10k
R21
10k
R18
10k
R15
10k
R14
10k
R13
10k
R12
10k
R10
10k
GN
DR
3810
kV
CC
R16
10k
VC
C
VC
C R1
1 O
hm
MODE_INDCMD_DATA_IN
CM
D_D
ATA
_OU
T
GN
D
GN
D
GN
DG
ND
GN
D
1
23
45
67
89
1011
1213
1415
1617
1819
2021
2223
2425
2627
2829
3031
3233
3435
3637
J2 Car
rier I
nter
conn
ectR29
10k
GN
D
GN
DV
CC
VC
CR
2710
kR
2510
k
R19
10k
R31
10k
VC
C
PA
IR
GN
DR
2610
kG
ND
R37
10k
GN
DR
3910
kG
ND
R43
10k
R44
10k
GN
DR
4510
kG
ND
RF
1
GND 2-5
AN
T1
GN
DG
ND
X1
1nH
X3
DN
P
GN
DX2
DN
P
LAD
J
nPD
NnC
MD
nCTS
CMD_DATA_IN
GP
IO1
GP
IO2
GP
IO1
Figure 35: Programming Dock Board Signal Routing Schematic
– – – –30 31
GND
+ C8
100uF
VCC
GND
Vin1
GN
D2
Vout 3
U4LM3940IMP 3.3V
C90.47uF
GND
IN1
GND2
EN3 FAULT 4
ILIM 5
OUT 6
U3TPS2552
GND
5VUSB
GND
R1153.6kPWREN#
USB AREA POWER SUPPLY AREA RF MODULE CARRIER AREA
SIGNAL ROUTING
U8
VDC1
RA52
RA43
MCLR4
RC55
RC46
RC37 RC2 8RC1 9RC0 10RA2 11ICSPCLK 12ICSPDAT 13GND 14
PIC16F1825-I/ST
VCC GND
PGM
CSB RSSISCLRSTPGCPGD
R42 DNP
VCCP
VCC
RS
SISCL
RST
CSB
VCC
GND
GNDC131uF
GND
C141uF C1-2
C1+3
VOUT4
VCC5
GND6
SI7
SCL8
CSB9
RS10
LED+1
LED-12
RST11
LCD1
2x16 LCD
R60 Ohm
MICROCONTROLLER AREA
D2
GN
D
GN
D
+C
14.
7uF
C4
0.01
uF
L1 600R
/1.3
A
GN
D
C6
47pF
R4
0
C2
0.1u
F
VCC12
VCCIO3
3V3O
UT
10
GND 5
GND 13
US
BD
M9
US
BD
P8
RE
SE
T#11
TXD
1
RX
D4
RTS
#2
CTS
#6
CB
US
015
CB
US
114
CB
US
27
CB
US
316
U2
FT23
0X
C5
47pF
PW
RE
N#
C7
0.1u
F
GN
D
5V1
DA
T-
2
DA
T+3
NC
4
GSHD 6GSHD 7
GN
D5
J1 Mic
ro U
SB
5VU
SB
RTS
R2
27
R3
27
TXD
RX
D
nCTS
VC
C R20
10k
R47
DN
P
GP
IO2
RX
TXLE
D
D1
R5330 ohm
OR
AN
GE
RX
TXLE
D
VCC
R1710k
GND
NC1
IN2
GND3 OUT 4
VCC 5U5 VCC
GND
R49 DNPBuffer Bypass DNP
RTS nCMD
CMD_DATA_OUTRXD
NC1
IN2
GND3 OUT 4
VCC 5U1 VCC
GND
R4610k
VCC
R48 DNPCMD_DATA_INTXD
Buffer Bypass DNP
GND
MO
DE
_IN
D
R8330 ohm
D4
MO
DE
_IN
D B
LUE
R2410k
S2
VCC
PA
IR
PAIR
GND
R410 ohm
R400 ohm
VCC
GND
SW1
LADJ
R36DNP
R23DNP
GPIO1
RXD
GND
nPDN
R9
10k
GN
D
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
D
GN
DG
ND
R35
10k
R34
10k
R33
10k
R32
10k
R30
10k
R28
10k
R22
10k
R21
10k
R18
10k
R15
10k
R14
10k
R13
10k
R12
10k
R10
10k
GN
DR
3810
kV
CC
R16
10k
VC
C
VC
C R1
1 O
hm
MODE_INDCMD_DATA_IN
CM
D_D
ATA
_OU
T
GN
D
GN
D
GN
DG
ND
GN
D
1
23
45
67
89
1011
1213
1415
1617
1819
2021
2223
2425
2627
2829
3031
3233
3435
3637
J2 Car
rier I
nter
conn
ectR29
10k
GN
D
GN
DV
CC
VC
CR
2710
kR
2510
k
R19
10k
R31
10k
VC
C
PA
IR
GN
DR
2610
kG
ND
R37
10k
GN
DR
3910
kG
ND
R43
10k
R44
10k
GN
DR
4510
kG
ND
RF
1
GND 2-5
AN
T1
GN
DG
ND
X1
1nH
X3
DN
P
GN
DX2
DN
P
LAD
J
nPD
NnC
MD
nCTS
CMD_DATA_IN
GP
IO1
GP
IO2
GP
IO1
Figure 36: Programming Dock Board USB Area Schematic
GND
+ C8
100uF
VCC
GND
Vin1
GN
D2
Vout 3
U4LM3940IMP 3.3V
C90.47uF
GND
IN1
GND2
EN3 FAULT 4
ILIM 5
OUT 6
U3TPS2552
GND
5VUSB
GND
R1153.6kPWREN#
USB AREA POWER SUPPLY AREA RF MODULE CARRIER AREA
SIGNAL ROUTING
U8
VDC1
RA52
RA43
MCLR4
RC55
RC46
RC37 RC2 8RC1 9RC0 10RA2 11ICSPCLK 12ICSPDAT 13GND 14
PIC16F1825-I/ST
VCC GND
PGM
CSB RSSISCLRSTPGCPGD
R42 DNP
VCCP
VCC
RS
SISCL
RST
CSB
VCC
GND
GNDC131uF
GND
C141uF C1-2
C1+3
VOUT4
VCC5
GND6
SI7
SCL8
CSB9
RS10
LED+1
LED-12
RST11
LCD1
2x16 LCD
R60 Ohm
MICROCONTROLLER AREA
D2
GN
D
GN
D
+C
14.
7uF
C4
0.01
uF
L1 600R
/1.3
A
GN
D
C6
47pF
R4
0
C2
0.1u
F
VCC12
VCCIO3
3V3O
UT
10
GND 5
GND 13
US
BD
M9
US
BD
P8
RE
SE
T#11
TXD
1
RX
D4
RTS
#2
CTS
#6
CB
US
015
CB
US
114
CB
US
27
CB
US
316
U2
FT23
0X
C5
47pF
PW
RE
N#
C7
0.1u
F
GN
D
5V1
DA
T-
2
DA
T+3
NC
4
GSHD 6GSHD 7
GN
D5
J1 Mic
ro U
SB
5VU
SB
RTS
R2
27
R3
27
TXD
RX
D
nCTS
VC
C R20
10k
R47
DN
P
GP
IO2
RX
TXLE
D
D1
R5330 ohm
OR
AN
GE
RX
TXLE
D
VCC
R1710k
GND
NC1
IN2
GND3 OUT 4
VCC 5U5 VCC
GND
R49 DNPBuffer Bypass DNP
RTS nCMD
CMD_DATA_OUTRXD
NC1
IN2
GND3 OUT 4
VCC 5U1 VCC
GND
R4610k
VCC
R48 DNPCMD_DATA_INTXD
Buffer Bypass DNP
GND
MO
DE
_IN
D
R8330 ohm
D4
MO
DE
_IN
D B
LUE
R2410k
S2
VCC
PA
IR
PAIR
GND
R410 ohm
R400 ohm
VCC
GND
SW1
LADJ
R36DNP
R23DNP
GPIO1
RXD
GND
nPDN
R9
10k
GN
D
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
D
GN
DG
ND
R35
10k
R34
10k
R33
10k
R32
10k
R30
10k
R28
10k
R22
10k
R21
10k
R18
10k
R15
10k
R14
10k
R13
10k
R12
10k
R10
10k
GN
DR
3810
kV
CC
R16
10k
VC
C
VC
C R1
1 O
hm
MODE_INDCMD_DATA_IN
CM
D_D
ATA
_OU
T
GN
D
GN
D
GN
DG
ND
GN
D
1
23
45
67
89
1011
1213
1415
1617
1819
2021
2223
2425
2627
2829
3031
3233
3435
3637
J2 Car
rier I
nter
conn
ectR29
10k
GN
D
GN
DV
CC
VC
CR
2710
kR
2510
k
R19
10k
R31
10k
VC
C
PA
IR
GN
DR
2610
kG
ND
R37
10k
GN
DR
3910
kG
ND
R43
10k
R44
10k
GN
DR
4510
kG
ND
RF
1
GND 2-5
AN
T1
GN
DG
ND
X1
1nH
X3
DN
P
GN
DX2
DN
P
LAD
J
nPD
NnC
MD
nCTS
CMD_DATA_IN
GP
IO1
GP
IO2
GP
IO1
Figure 37: Programming Dock Board Microcontroller Area Schematic
– – – –32 33
GN
D
OU
TIN
GND
GND
+
C7
10uF
THERM
4
123
U5
THERM
RF
12 3
4 5
6 78 910 1112 1314 1516 1718 1920 2122 2324 2526 2728 2930 3132 3334 3536 37
38394041424344454647484950515253545556
J2Carrier Interconnect Female
1
GN
D2-
5
ANT1CONREVSMA001
GND
GND
GND
GND
GND
78 910 1112 1314 1516 1718 1920 2122 2324 2526 2728 2930 3132 3334 3536 37
38394041424344454647484950515253545556
X1
0 Ohm
6
X3DNP
GNDGND
X2DNP
GND
R24330
5VUSB
D2
PO
WE
R (G
RE
EN
)
D3
OV
ER
CU
RR
EN
T (R
ED
)
R22330
VCC
FAULT
U2
R5
10k
GND
5VUSB
GND
C80.47uF
FAU
LT
IN1
GND2
EN3 FAULT 4
ILIM 5
OUT 6
TPS2553
SW3
5VUSB
EN
FAULT
GND12
J3
100mil HeaderBattery Input
D1
GND
R753.6k
R953.6k
GND
Q1
R310k
BCD Charger
VCC
+
GND
GND
C14.7uF
C3
0.01uF
L1600R/1.3A
GND
C5
47pF
R40
C20.1uF
VC
C12
VC
CIO
3
3V3OUT10
GN
D5
GN
D13
USBDM9
USBDP8
RESET11
TXD 1
RXD 4
RTS 2
CTS 6
CBUS0 15
CBUS1 14
CBUS2 7
CBUS3 16
U6
FT230X
C4
47pF
C60.1uF
GND
5V 1
DAT- 2
DAT+ 3
NC 4
GS
HD
6G
SH
D7
GND 5
J1 Micro USB
RTSCTS
R1 27
R2 27
5VUSB
EN
BCD Charger
TXD
RXD
SW1
SW2
9
15
CMD_DATA_IN
CMD_DATA_OUT
NC1
IN2
GND3 OUT 4
VCC 5U3 VCC
GND
R25DNP
VCC
R27 DNP
NC 1
IN 2
GND 3OUT4
VCC5
U4
R33DNP
GND
VCC
R36 DNP
PROTOTYPEAREA
GND BUS
1
TXD
RX
DR
TSC
TS
VCC BUS
1
TP3
1
TP2
GND GND
TP1
VCC
39404142434445
4647484950515253545556
38373635
293031
323334
78910111213141516171819202122232425262728
1 2 3 4
J6100mil Header
1234567891011121314151617181920212223242526
J5100mil Header
GND
VCC
R10 DNPVCC
123456789
1011
J7100mil Header
123456789
1011121314
J4100mil Header
R45 DNP GND
R44 DNPR43 DNPR42 DNPR41 DNPR40 DNPR39 DNPR38 DNP
GNDGNDGNDGNDGNDGNDGND
GNDR52 DNPR53 DNP GND
R19 DNPGND
VCC
R11 DNPGND
R50 DNP GND
R14 DNPGND
R17 0 ohmVCC
R12 DNPGND
R26 DNP
R23 DNPGND
R21 DNPGND R47 DNP GNDR48 DNP GNDR49 DNP GND
R15DNP
VCC
R18DNP
GND
R13 DNP
R8 DNP
R16 DNPGND
R20 DNPGND
R28 DNPGND R29 DNPVCC R30 DNPGND R31 DNPGND
R32 DNP GND
R34 DNP GNDR35 DNP GND
R54 DNP GNDR55 DNP GNDR56 DNP VCC
C9
0.1uF
GND
VCC
6R6 DNP
Figure 38: Prototype Board Power Supply Area Schematic
GN
D
OU
TIN
GND
GND
+
C7
10uF
THERM
4
123
U5
THERM
RF
12 3
4 5
6 78 910 1112 1314 1516 1718 1920 2122 2324 2526 2728 2930 3132 3334 3536 37
38394041424344454647484950515253545556
J2Carrier Interconnect Female
1
GN
D2-
5
ANT1CONREVSMA001
GND
GND
GND
GND
GND
78 910 1112 1314 1516 1718 1920 2122 2324 2526 2728 2930 3132 3334 3536 37
38394041424344454647484950515253545556
X1
0 Ohm
6
X3DNP
GNDGND
X2DNP
GND
R24330
5VUSB
D2
PO
WE
R (G
RE
EN
)
D3
OV
ER
CU
RR
EN
T (R
ED
)
R22330
VCC
FAULT
U2
R5
10k
GND
5VUSB
GND
C80.47uF
FAU
LT
IN1
GND2
EN3 FAULT 4
ILIM 5
OUT 6
TPS2553
SW3
5VUSB
EN
FAULT
GND12
J3
100mil HeaderBattery Input
D1
GND
R753.6k
R953.6k
GND
Q1
R310k
BCD Charger
VCC
+
GND
GND
C14.7uF
C3
0.01uF
L1600R/1.3A
GND
C5
47pF
R40
C20.1uF
VC
C12
VC
CIO
3
3V3OUT10
GN
D5
GN
D13
USBDM9
USBDP8
RESET11
TXD 1
RXD 4
RTS 2
CTS 6
CBUS0 15
CBUS1 14
CBUS2 7
CBUS3 16
U6
FT230X
C4
47pF
C60.1uF
GND
5V 1
DAT- 2
DAT+ 3
NC 4
GS
HD
6G
SH
D7
GND 5
J1 Micro USB
RTSCTS
R1 27
R2 27
5VUSB
EN
BCD Charger
TXD
RXD
SW1
SW2
9
15
CMD_DATA_IN
CMD_DATA_OUT
NC1
IN2
GND3 OUT 4
VCC 5U3 VCC
GND
R25DNP
VCC
R27 DNP
NC 1
IN 2
GND 3OUT4
VCC5
U4
R33DNP
GND
VCC
R36 DNP
PROTOTYPEAREA
GND BUS
1
TXD
RX
DR
TSC
TS
VCC BUS
1
TP3
1
TP2
GND GND
TP1
VCC
39404142434445
4647484950515253545556
38373635
293031
323334
78910111213141516171819202122232425262728
1 2 3 4
J6100mil Header
1234567891011121314151617181920212223242526
J5100mil Header
GND
VCC
R10 DNPVCC
123456789
1011
J7100mil Header
123456789
1011121314
J4100mil Header
R45 DNP GND
R44 DNPR43 DNPR42 DNPR41 DNPR40 DNPR39 DNPR38 DNP
GNDGNDGNDGNDGNDGNDGND
GNDR52 DNPR53 DNP GND
R19 DNPGND
VCC
R11 DNPGND
R50 DNP GND
R14 DNPGND
R17 0 ohmVCC
R12 DNPGND
R26 DNP
R23 DNPGND
R21 DNPGND R47 DNP GNDR48 DNP GNDR49 DNP GND
R15DNP
VCC
R18DNP
GND
R13 DNP
R8 DNP
R16 DNPGND
R20 DNPGND
R28 DNPGND R29 DNPVCC R30 DNPGND R31 DNPGND
R32 DNP GND
R34 DNP GNDR35 DNP GND
R54 DNP GNDR55 DNP GNDR56 DNP VCC
C9
0.1uF
GND
VCC
6R6 DNP
Figure 39: Prototype Board RF Carrier Area Schematic
Prototype Board Schematic
– – – –34 35
GND
OUT
IN
GN
D
GN
D
+
C7
10uF
THE
RM
4
1
2
3
U5
THE
RM
RF
1
23
45
67
89
1011
1213
1415
1617
1819
2021
2223
2425
2627
2829
3031
3233
3435
3637
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
J2 Car
rier I
nter
conn
ect F
emal
e1
GND 2-5
AN
T1C
ON
RE
VS
MA
001
GN
D
GN
D
GN
D
GN
D
GN
D
78
910
1112
1314
1516
1718
1920
2122
2324
2526
2728
2930
3132
3334
3536
37
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
X1
0 O
hm
6
X3
DN
P
GN
DG
NDX
2D
NP
GN
D
R24
330
5VU
SB
D2
POWER (GREEN)
D3
OVER CURRENT (RED)
R22
330
VC
C
FAU
LT
U2
R5
10k
GN
D 5VU
SB
GN
D
C8
0.47
uF
FAULT
IN1
GN
D2
EN
3FA
ULT
4
ILIM
5
OU
T6
TPS
2553
SW
3
5VU
SB
EN
FAU
LT
GN
D1 2
J3
100m
il H
eade
rB
atte
ry In
put
D1
GN
D
R7 53.6
kR
9 53.6
k
GN
DQ1
R3
10k
BC
D C
harg
er
VC
C
+
GN
D
GN
D
C1
4.7u
F
C3
0.01
uF
L160
0R/1
.3A
GN
D
C5
47pF
R4
0
C2
0.1u
F
VCC12
VCCIO3
3V3O
UT
10
GND 5
GND 13
US
BD
M9
US
BD
P8
RE
SE
T11
TXD
1
RX
D4
RTS
2
CTS
6
CB
US
015
CB
US
114
CB
US
27
CB
US
316
U6
FT23
0X
C4
47pF
C6
0.1u
F
GN
D
5V1
DA
T-
2
DA
T+3
NC
4
GSHD 6GSHD 7
GN
D5
J1M
icro
US
B
RTS
CTS
R1
27
R2
27
5VU
SB
EN
BC
D C
harg
er
TXD RX
D
SW
1 SW
2
9
15
CM
D_D
ATA
_IN
CM
D_D
ATA
_OU
T
NC
1
IN2
GN
D3
OU
T4
VC
C5
U3
VC
C
GN
D
R25
DN
P
VC
C
R27
DN
P
NC
1
IN2
GN
D3
OU
T4
VC
C5
U4
R33
DN
P
GN
DVC
C
R36
DN
P
PR
OTO
TYP
EA
RE
A
GN
D B
US
1
TXDRXDRTSCTS
VC
C B
US
1
TP3
1
TP2
GN
DG
ND
TP1
VC
C
39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 5638373635
29 30 31
32 33 347 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
1234
J6 100m
il H
eade
r1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
J510
0mil
Hea
der
GN
D
VC
C
R10
DN
PV
CC
1 2 3 4 5 6 7 8 9 10 11J7 100m
il H
eade
r
1 2 3 4 5 6 7 8 9 10 11 12 13 14J4 100m
il H
eade
r
R45
DN
PG
ND
R44
DN
PR
43D
NP
R42
DN
PR
41D
NP
R40
DN
PR
39D
NP
R38
DN
P
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
D
GN
DR
52D
NP
R53
DN
PG
ND
R19
DN
PG
ND
VC
C
R11
DN
PG
ND
R50
DN
PG
ND
R14
DN
PG
ND
R17
0 oh
mV
CC
R12
DN
PG
ND
R26
DN
P
R23
DN
PG
ND
R21
DN
PG
ND
R47
DN
PG
ND
R48
DN
PG
ND
R49
DN
PG
ND
R15
DN
P
VC
C R18
DN
P
GN
D
R13
DN
P
R8
DN
P
R16
DN
PG
ND
R20
DN
PG
ND
R28
DN
PG
ND
R29
DN
PV
CC
R30
DN
PG
ND
R31
DN
PG
ND
R32
DN
PG
ND
R34
DN
PG
ND
R35
DN
PG
ND
R54
DN
PG
ND
R55
DN
PG
ND
R56
DN
PV
CC
C9
0.1u
F
GN
D
VC
C
6R
6D
NP
Figure 41: Prototype Board Prototype Area Schematic
GND
OUT
IN
GN
D
GN
D
+
C7
10uF
THE
RM
4
1
2
3
U5
THE
RM
RF
1
23
45
67
89
1011
1213
1415
1617
1819
2021
2223
2425
2627
2829
3031
3233
3435
3637
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
J2 Car
rier I
nter
conn
ect F
emal
e1
GND 2-5
AN
T1C
ON
RE
VS
MA
001
GN
D
GN
D
GN
D
GN
D
GN
D
78
910
1112
1314
1516
1718
1920
2122
2324
2526
2728
2930
3132
3334
3536
37
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
X1
0 O
hm
6
X3
DN
P
GN
DG
NDX
2D
NP
GN
D
R24
330
5VU
SB
D2
POWER (GREEN)
D3
OVER CURRENT (RED)
R22
330
VC
C
FAU
LT
U2
R5
10k
GN
D 5VU
SB
GN
D
C8
0.47
uF
FAULT
IN1
GN
D2
EN
3FA
ULT
4
ILIM
5
OU
T6
TPS
2553
SW
3
5VU
SB
EN
FAU
LT
GN
D1 2
J3
100m
il H
eade
rB
atte
ry In
put
D1
GN
D
R7 53.6
kR
9 53.6
k
GN
DQ1
R3
10k
BC
D C
harg
er
VC
C
+
GN
D
GN
D
C1
4.7u
F
C3
0.01
uF
L160
0R/1
.3A
GN
D
C5
47pF
R4
0
C2
0.1u
F
VCC12
VCCIO3
3V3O
UT
10
GND 5
GND 13
US
BD
M9
US
BD
P8
RE
SE
T11
TXD
1
RX
D4
RTS
2
CTS
6
CB
US
015
CB
US
114
CB
US
27
CB
US
316
U6
FT23
0X
C4
47pF
C6
0.1u
F
GN
D
5V1
DA
T-
2
DA
T+3
NC
4
GSHD 6GSHD 7
GN
D5
J1M
icro
US
B
RTS
CTS
R1
27
R2
27
5VU
SB
EN
BC
D C
harg
er
TXD RX
D
SW
1 SW
2
9
15
CM
D_D
ATA
_IN
CM
D_D
ATA
_OU
T
NC
1
IN2
GN
D3
OU
T4
VC
C5
U3
VC
C
GN
D
R25
DN
P
VC
C
R27
DN
P
NC
1
IN2
GN
D3
OU
T4
VC
C5
U4
R33
DN
P
GN
DVC
C
R36
DN
P
PR
OTO
TYP
EA
RE
A
GN
D B
US
1
TXDRXDRTSCTS
VC
C B
US
1
TP3
1
TP2
GN
DG
ND
TP1
VC
C
39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 5638373635
29 30 31
32 33 347 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
1234
J6 100m
il H
eade
r1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
J510
0mil
Hea
der
GN
D
VC
C
R10
DN
PV
CC
1 2 3 4 5 6 7 8 9 10 11J7 100m
il H
eade
r
1 2 3 4 5 6 7 8 9 10 11 12 13 14J4 100m
il H
eade
r
R45
DN
PG
ND
R44
DN
PR
43D
NP
R42
DN
PR
41D
NP
R40
DN
PR
39D
NP
R38
DN
P
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
D
GN
DR
52D
NP
R53
DN
PG
ND
R19
DN
PG
ND
VC
C
R11
DN
PG
ND
R50
DN
PG
ND
R14
DN
PG
ND
R17
0 oh
mV
CC
R12
DN
PG
ND
R26
DN
P
R23
DN
PG
ND
R21
DN
PG
ND
R47
DN
PG
ND
R48
DN
PG
ND
R49
DN
PG
ND
R15
DN
P
VC
C R18
DN
P
GN
D
R13
DN
P
R8
DN
P
R16
DN
PG
ND
R20
DN
PG
ND
R28
DN
PG
ND
R29
DN
PV
CC
R30
DN
PG
ND
R31
DN
PG
ND
R32
DN
PG
ND
R34
DN
PG
ND
R35
DN
PG
ND
R54
DN
PG
ND
R55
DN
PG
ND
R56
DN
PV
CC
C9
0.1u
F
GN
D
VC
C
6R
6D
NP
Figure 40: Prototype Board USB Area Schematic
Disclaimer
Linx Technologies is continually striving to improve the quality and function of its products. For this reason, we reserve the right to make changes to our products without notice. The information contained in this Data Guide is believed to be accurate as of the time of publication. Specifications are based on representative lot samples. Values may vary from lot-to-lot and are not guaranteed. “Typical” parameters can and do vary over lots and application. Linx Technologies makes no guarantee, warranty, or representation regarding the suitability of any product for use in any specific application. It is the customer’s responsibility to verify the suitability of the part for the intended application. NO LINX PRODUCT IS INTENDED FOR USE IN ANY APPLICATION WHERE THE SAFETY OF LIFE OR PROPERTY IS AT RISK.
Linx Technologies DISCLAIMS ALL WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL LINX TECHNOLOGIES BE LIABLE FOR ANY OF CUSTOMER’S INCIDENTAL OR CONSEQUENTIAL DAMAGES ARISING IN ANY WAY FROM ANY DEFECTIVE OR NON-CONFORMING PRODUCTS OR FOR ANY OTHER BREACH OF CONTRACT BY LINX TECHNOLOGIES. The limitations on Linx Technologies’ liability are applicable to any and all claims or theories of recovery asserted by Customer, including, without limitation, breach of contract, breach of warranty, strict liability, or negligence. Customer assumes all liability (including, without limitation, liability for injury to person or property, economic loss, or business interruption) for all claims, including claims from third parties, arising from the use of the Products. The Customer will indemnify, defend, protect, and hold harmless Linx Technologies and its officers, employees, subsidiaries, affiliates, distributors, and representatives from and against all claims, damages, actions, suits, proceedings, demands, assessments, adjustments, costs, and expenses incurred by Linx Technologies as a result of or arising from any Products sold by Linx Technologies to Customer. Under no conditions will Linx Technologies be responsible for losses arising from the use or failure of the device in any application, other than the repair, replacement, or refund limited to the original product purchase price. Devices described in this publication may contain proprietary, patented, or copyrighted techniques, components, or materials. Under no circumstances shall any user be conveyed any license or right to the use or ownership of such items.
©2018 Linx Technologies. All rights reserved.
The stylized Linx logo, Wireless Made Simple, WiSE, CipherLinx and the stylized CL logo are trademarks of Linx Technologies.
Linx Technologies
159 Ort Lane
Merlin, OR, US 97532
Phone: +1 541 471 6256
Fax: +1 541 471 6251
www.linxtechnologies.com
