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HumDTTM Series Master Development System
User's Guide
Table of Contents 1 Introduction 2 Ordering Information 2 HumDTTM Series Transceiver Carrier Board 2 HumDTTM Series Transceiver Carrier Board Objects 3 HumDTTM Series Carrier Board Pin Assignments 3 Programming Dock 3 Programming Dock Objects 4 Prototype Board 4 Prototype Board Objects 5 Initial Setup 6 Using the Prototype Board 8 Using the Programming Dock 10 The Development Kit Demonstration Software 17 Development Kit Demonstration Software Example 22 Carrier Board Schematic 23 Programming Dock Board Schematic 28 Prototype Board Schematic 30 Notes
Warning: Some customers may want Linx radio frequency (“RF”) products to control machinery or devices remotely, including machinery or devices that can cause death, bodily injuries, and/or property damage if improperly or inadvertently triggered, particularly in industrial settings or other applications implicating life-safety concerns (“Life and Property Safety Situations”).
NO OEM LINX REMOTE CONTROL OR FUNCTION MODULE SHOULD EVER BE USED IN LIFE AND PROPERTY SAFETY SITUATIONS. No OEM Linx Remote Control or Function Module should be modified for Life and Property Safety Situations. Such modification cannot provide sufficient safety and will void the product’s regulatory certification and warranty.
Customers may use our (non-Function) Modules, Antenna and Connectors as part of other systems in Life Safety Situations, but only with necessary and industry appropriate redundancies and in compliance with applicable safety standards, including without limitation, ANSI and NFPA standards. It is solely the responsibility of any Linx customer who uses one or more of these products to incorporate appropriate redundancies and safety standards for the Life and Property Safety Situation application.
Do not use this or any Linx product to trigger an action directly from the data line or RSSI lines without a protocol or encoder/decoder to validate the data. Without validation, any signal from another unrelated transmitter in the environment received by the module could inadvertently trigger the action.
All RF products are susceptible to RF interference that can prevent communication. RF products without frequency agility or hopping implemented are more subject to interference. This module does not have a frequency hopping protocol built in.
Do not use any Linx product over the limits in this data guide. Excessive voltage or extended operation at the maximum voltage could cause product failure. Exceeding the reflow temperature profile could cause product failure which is not immediately evident.
Do not make any physical or electrical modifications to any Linx product. This will void the warranty and regulatory and UL certifications and may cause product failure which is not immediately evident.
!
– –1
IntroductionThe Linx HumDTTM Series Remote Control Transceiver modules offer a simple, efficient and cost-effective method of adding remote control capabilities to any product. The Master Development System provides a designer with all the tools necessary to correctly and legally incorporate the module into an end product. The boards serve several important functions:
• Rapid Module Evaluation: The boards allow the performance of the Linx HumDT™ Series modules to be evaluated quickly in a user’s environment. The development boards can be used to evaluate the range performance of the modules.
• Application Development: A prototyping board allows the development of custom circuits directly on the board. All signal lines are available on headers for easy access.
• Software Development: A programming dock with a PC interface allows development and testing of custom software applications for control of the module.
• Design Benchmark: The boards provide a known benchmark against which the performance of a custom design may be judged.
The Master Development System includes 2 Carrier Boards, 2 Programming Dock Boards, 2 Prototype Boards, 4 HumDT™ Series transceivers*, antennas, USB cables and full documentation.
* One part is soldered to each Carrier Board
HumDTTM Master Development System
User's Guide
Figure 1: HumDTTM Series Master Development System
Revised 8/30/2017
– – – –2 3
HumDTTM Series Transceiver Carrier Board Objects1. HumDTTM Series Transceiver2. MMCX RF Connector3. Dual Row Header4. Single Row Header
HumDTTM Series Transceiver Carrier Board
Ordering Information
Figure 2: Ordering Information
Figure 3: HumDTTM Series Transceiver Carrier Board
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HumDTTM Series Carrier Board Pin Assignments
Figure 5: HumDTTM Series Transceiver Carrier Board Pin Assignments (Top View)
7 MODE_IND9 CMD_DATA_IN11 VCCD13 CTS15 CMD_DATA_OUT17 VCC19 VCCD21 VCCD23 NC25 NC27 NC29 NC31 NC33 NC35 NC37 NC
GND 6RESET 8
POWER_DOWN 10NC 12
VCCD 14LNA_EN 16GPIO_0 18PA_EN 20
NC 22NC 24NC 26NC 28NC 30NC 32NC 34NC 36
41 GPIO_542 GPIO_443 GPIO_344 GPIO_245 GPIO_146 ACTIVE47 NC48 NC49 NC50 NC51 NC52 NC53 NC54 NC55 NC56 NC
40 GPIO_639 GPIO_738 VCCD
ANTENNA 1 2-5 GND (RF Connector)
Programming Dock
Programming Dock Objects1. Carrier Board Socket2. RP-SMA Antenna Connector3. MODE_IND LED4. Micro USB Connector5. LCD Display
Figure 4: Programming Dock
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Ordering Information
Part Number Description
MDEV-***-DT HumDTTM Series Master Development System
HUM-***-DT HumDTTM Series Transceiver
EVM-***-DT HumDTTM Series Carrier Board
MDEV-PGDCK Development System Programming Dock
MDEV-PROTO Development System Prototype Board
CON-SOC-EVM EVM Module Socket Kit
*** = Frequency; 868MHz, 900MHz
– – – –4 5
Prototype Board
Prototype Board Objects1. Carrier Board Socket2. RP-SMA Antenna Connector3. Micro USB Connector4. Power Switch5. Power LED6. External Battery Connection7. Prototyping Area8. 3.3V Supply Bus9. Ground Bus10. USB Interface Lines11. Module Interface Headers12. Command Data Interface Routing Switches (on back)
Figure 6: Prototype Board
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Initial SetupThere are several boards that are included with the Development System. The Carrier Boards have a HumDTTM Series transceiver on a daughter board with headers. These boards snap into sockets on the other boards, enabling the modules to be easily moved among the test boards.
There are two Programming Docks that have a socket for a Carrier Board and a USB interface for connection to a PC. This is used with the demonstration software included with the kit to configure the module through its Command Data Interface.
There are two Prototype Boards that have a socket for a Carrier Board, a USB interface and a large area of plated through holes that can be used to develop custom circuitry. The board can be powered either from the USB connection or an external battery.
The development software supports Windows 7 and 10; with Java 1.6 or later.
Warning: Installing or removing a Carrier Board while power is applied could cause permanent damage to the module. Either turn off power to the board or unplug the USB cable before installing or removing a Carrier Board
!
Note: The Prototype board uses a USB to UART chip to connect the module to the PC. This chip is powered from the 5V on the USB cable. It has an input line that detects the voltage on Vcc and sets the UART voltage levels to match as soon as power is applied to the chip.
It is important that the power switch (SW3) be set appropriately before the USB cable is plugged in. If an external power supply is used and the switch is off when the cable is plugged in, then the UART output voltage may not be set correctly and could result in communication failures.
Set the switch to BAT when using an external supply or to USB to use the USB bus to power the module. Then plug in the USB cable.
– – – –6 7
The overload condition is reset once the excess current draw is removed.Supply for the module is connected through R17. This can be removed and replaced by another supply or used to measure the current consumption of the module.
Figure 8 shows the bottom of the board.
SW1 and SW2 connect the USB interface to the Command Data Interface lines on the module. This allows the prototype board to be used with the development kit software or a custom application. When in the “USB Connected position”, the module is connected to the USB interface. The “Header Only” position connects the module to the header.
Footprints for 0603 size resistors are on most lines so that pull-ups or pull-downs can easily be added to the lines. The pads are connected to VCC or GND based on the most common configuration for the module. The schematic at the end of this document shows how each line is connected.
Using the Prototype BoardSnap a Carrier Board onto the socket on the Prototype Board as shown in Figure 7.
Set the power switch (SW3) and connect a micro USB cable into the connector at the top of the board. Plug the other end into a PC or any USB charger. The board is powered by the USB bus. This board features a prototyping area to facilitate the addition of application-specific circuitry. The prototyping area contains a large area of plated through-holes so that external circuitry can be placed on the board. The holes are set at 0.100” on center with a 0.040” diameter, accommodating most industry-standard SIP and DIP packages.
At the top of the prototyping area is a row connected to the 3.3V power supply and at the bottom is a row connected to ground. External circuitry can be interfaced to the transceiver through the breakout headers. The numbers next to the headers correspond to the pin numbers on the Carrier Board. Figure 5 shows the pin assignments for the Carrier Board.
The OVERLOAD LED indicates that that too much current is being pulled from the USB bus. This is used to prevent damage to the parts or the bus.
Figure 7: Prototype Board with a Carrier Board
Note: The onboard 3.3-volt regulator has approximately 400mA available for additional circuitry when plugged into a PC. If more current is required, the user must power the board from an external supply or a USB charger with more current capabilities, up to 1A.
Figure 8: Prototype Board Bottom Side
– – – –8 9
Using the Programming DockSnap a Carrier Board onto the socket on the Programming Dock as shown in Figure 9.
Connect a micro USB cable into the connector at the top of the board. Plug the other end into a PC. The board is powered by the USB bus. The demonstration software included with the kit or custom application software can be used to configure the module through its Command Data Interface. The LCD is used to display information about the module. This includes the module’s local address and a custom nickname. The nickname is entered using the development kit software and can be any name that helps distinguish the modules from one another. This is convenient when multiple programming docks are connected to the same computer. Please see the development kit software section for more information on the nicknames.
The HumDTTM Series transceiver has a serial Command Data Interface that is used to configure and control the transceiver. This interface consists of a standard UART with a serial command set.
Figure 9: Programming Dock with a Carrier Board
Range TestingSeveral complex mathematical models exist for determining path loss in many environments. These models vary as the transmitter and receiver are moved from indoor operation to outdoor operation. Although these models can provide an estimation of range performance in the field, the most reliable method is to simply perform range tests using the modules in the intended operational environment.
Range testing can be performed with the Programming Docks and / or the Prototype Boards. Data can be sent across the link using the included software or a custom microcontroller connected to the module. The RSSI is included with the output data messages, so this can be used to qualify the link.
As the maximum range of the link in the test area is approached, it is not uncommon for the signal to cut in and out as the radio moves. This is normal and can result from other interfering sources or fluctuating signal levels due to multipath effects. This results in cancellation of the transmitted signal as direct and reflected signals arrive at the receiver at differing times and phases. The areas in which this occurs are commonly called “nulls” and simply walking a little farther usually restores the signal. If the signal is not restored, then the maximum range of the link has been reached.
To achieve maximum range, keep objects such as your hand away from the antenna and ensure that the antenna on the transmitter has a clear and unobstructed line-of-sight path to the receiver board. Range performance is determined by many interdependent factors. If the range you are able to achieve is significantly less than specified by Linx for the products you are testing, then there is likely a problem with either the board or the ambient RF environment in which the board is operating. First, check the battery, switch positions, and antenna connection. Next, check the ambient RSSI value with the transmitter turned off to determine if ambient interference is present. High RSSI readings while the transmitter off indicate there is interference. If this fails to resolve the issue, please contact Linx technical support.
– – – –10 11
The Development Kit Demonstration SoftwareThe development kit includes software that is used to configure and control the module through the Programming Dock. The software defaults to the Advanced Configuration tab when opened (Figure 10). This window configures the module’s settings.
1. Clicking the Contact Linx, Documentation and About labels on the left side expands them to show additional information and links to the latest documentation. This is shown in Figure 11.
2. The Help window shows tips and comments about the software.
3. The active module is connected to the PC and being configured by the software.
4. Available modules are connected to the PC but are not currently being configured or controlled by the software.
5. Known Modules are not currently connected to the PC, but have either been connected to the software in the past or have been manually entered.
6. The memory setting configures the software to read and write from either volatile memory or non-volatile memory.
7. The Device Type section configures the module as either an Access Point, End Device or Range Extender.
8. The Encryption Key box shows the module’s 16 byte AES encryption
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Figure 10: The Master Development System Software Advanced Configuration Tab
key. This can only be read from modules configured as an AP.
9. The Address box shows the module’s current local address. The Network ID is the identifier of the network that the module is in. No other module with the same Network ID can have the same Address.
10. The Joined Modules list shows all of the modules that have joined with the current module. An ED and RE are only joined with an AP, so they have one entry. An AP can be joined to up to 50 other modules, including up to 4 REs.
11. The Radio section configures the radio functions. The checkboxes select which RF channels are used. The TX Power menu sets the transmitter output power. The data rate menu sets the serial UART data rate, which the module uses to configure the over-the-air data rate. The RSSI Readback shows the RSSI value of the last good packet that was received.
12. The GPIO Expander Type menus configure the eight GPIOs as digital inputs, digital outputs or analog inputs. The digital inputs are also configured to use internal pull-up or pull-down resistors, or set to high-impedance. High impedance deactivates the internal resistors.
13. The Status column shows the current status of all of the GPIO lines on the active module.
14. The Internal 20kohm radio button sets the internal resistors as either pull-up or pull-down.
15. The module identity box shows the active module’s name, firmware version and serial number.
16. The Read All button reads all of the values.
17. The Submit button writes all changes to the active module.
18. The Set Defaults button restores all settings to the factory defaults.
Figure 11: The Master Development System Software Additional Information
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– – – –12 13
The 868MHz version of the module operates on one of 68 channels as opposed to being agile among 4 channels. The software automatically detects the frequency band for the active module and adjusts the selection. The 868MHz module changes the channel selection from the check boxes to a drop-down menu in the Radio section (1).
All other selections and operation are identical for both versions. The examples that follow show the 900MHz version, but the same procedures apply for the 868MHz version.
The modules are shown with four identifiers as shown in Figure 13.
1. The type of module (HumDT™ Series)
2. The module’s local address.
3. A custom name that can be given to the module. Type a name into the box and press Enter to apply it. This name is shown on the LCD display on the programming dock.
4. The active module has an eject symbol that disconnects the software from that module when clicked. The Available modules have a play symbol that makes that module active when clicked.
Figure 13: The Master Development System Software Module Identifiers
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Figure 14: The Master Development System Programming Dock with Name and Address Displayed
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Figure 12: The Master Development System Software Advanced Configuration Tab
– – – –14 15
The Wireless Chat tab (Figure 15) offers a demonstration of sending data between two modules. There is a window for each connected module.
1. The top of the window shows the address of the associated module.
2. The chat screen shows the chat messages that have been sent and received.
3. The Send box is where the message text is entered. The message is transmitted when the Send button is pressed.
4. The To menu selects the address of the connected module that is to receive the message (the destination address).
5. The TX Times box shows how many times the module has transmitted.
6. The RX Count box counts the number of messages that the module has received.
7. The Clear button clears all of the messages from the chat window.
8. The RSSI box indicates the signal strength of the last received message.
9. When the Show As Bytes box is selected the messages are shown as bytes in the chat window.
Figure 15: The Master Development System Software Wireless Chat Tab
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The Command Set tab (Figure 16) allows specific commands to be written to the module.
1. The Command box shows the hexadecimal values that are written to the module. Values can be typed into the box or a command can be selected from the Commands menu.
2. The Response box shows the hexadecimal values that are returned from the module in response to a command.
3. The Commands drop-down menu shows all of the commands that are available for the active module (Figure 17). Selecting one of the commands from this menu automatically fills in the Command box. The values can be adjusted by typing in the box.
4. The Items drop down menu displays all of the items that are available for the active module (Figure 18). Selecting one of the items from this menu automatically fills in the Command box. The values can be adjusted by typing in the box.
5. Clicking the Send button writes the values in the Command box to the module.
6. The structure of the selected command and its response is shown in the main window. Please see the HumDT™ Series Transceiver Data Guide for definitions of each value.
7. The Show Commands button opens a window that shows all of the bytes sent to the module and the responses from the module.
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Figure 16: The Master Development System Software Command Set Tab
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Figure 18: The Master Development System Software Command Set Tab Items Menu
Figure 17: The Master Development System Software Command Set Tab Commands Menu
Figure 19: The Master Development System Software Show Commands Window
The Network tab shows the interaction of all of the connected modules on one screen. Figure 20 shows two modules on the screen, but up to 8 modules can fit at one time.
The screen shows the network configuration of all modules that are connected to the PC. The drop-down menu changes the module’s device type and the text box has the module’s network ID. This screen makes it easy to quickly set up the network and visually verify its configuration.
Figure 20: The Master Development System Software Network Tab
– – – –18 19
Development Kit Demonstration Software ExampleThis example shows how to configure two modules to work with each other. The software defaults to the Advanced Configuration tab when opened (Figure 21).
Install Carrier Boards onto the Programming Docks and plug a USB cable between the Programming Docks and the PC. The software automatically detects attached devices. The first module that is identified appears under the Active label. This is the module that is actively controlled by the software. Subsequent modules are listed under the Available label as shown in Figure 22.
Once the modules are detected by the software, the appropriate options are displayed on the Advanced Configurations tab and a Network tab appears. The module’s documents appear under the Documentation link.
Figure 21: The Master Development System Software Advanced Configuration Tab at Start-up
Figure 22: The Master Development System Software Connected Modules
Any changes to the current configurations are shown in red. These changes are not written to the module until the Submit button is clicked.
Changing the active module is accomplished by either clicking the play symbol next to the desired module or dragging it from the Available list to the Active spot. Changes can now be made to this module.
Figure 23: The Master Development System Software with Connected Modules
Figure 24: The Master Development System Software Advanced Configuration with Changes
– – – –20 21
There are several settings that must match in order for the modules to be able to communicate. This example uses the following settings.
• The Encryption Key must match on both modules. This can only be read out of an AP.
• Network ID must match on both devices.
• The UART Baud Rate is 9600.
Other settings can be used as long as they match on both modules. Once the settings are changed and submitted to both modules, the Network tab can be used to graphically view the network topology and the Wireless Chat tab can be used to transfer data.
Figure 25: The Master Development System Software Dragging to Change the Active Module
Clicking on the Network tab shows the current state of all modules connected to the PC.
Both modules are set as End Devices. There must be at least one Access Point in every network, so one module must be changed. This is accomplished by clicking the drop-down menu on one of the modules and selecting AP.
Both modules must have the same Network ID, so change the ID number in one or both of the boxes to match.
Figure 26: The Master Development System Software Network Tab
Figure 27: The Master Development System Software Network Tab
– – – –22 23
A dotted line appears between the modules indicating that they are joining the network.
A solid line appears between the modules when they are joined and ready to communicate. The Wireless Chat tab can now be used to send data between the modules.
Figure 28: The Master Development System Software Network Tab
Figure 29: The Master Development System Software Network Tab
Figure 30: The Master Development System Software Wireless Chat Tab
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GP
IO_1
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
AC
TIV
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VC
CD
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Figure 31: HumDTTM Series Transceiver Carrier Board Module Schematic
Carrier Board Schematic
GND
+ C8
100uF
VCC
GND
Vin1
GN
D2
Vout3
U4LM3940IMP 3.3V
C90.47uF
GND
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GND2
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FAULT4
ILIM5
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U3TPS2552
GND
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USB AREA POWER SUPPLY AREA RF MODULE CARRIER AREA
SIGNAL ROUTING
U8
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RC55
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38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
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10k
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GP
IO1
GP
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Figure 32: Programming Dock Board RF Carrier Area Schematic
Programming Dock Board Schematic
– – – –26 27
GND
+ C8
100uF
VCC
GND
Vin1
GN
D2
Vout3
U4LM3940IMP 3.3V
C90.47uF
GND
IN1
GND2
EN3
FAULT4
ILIM5
OUT6
U3TPS2552
GND
5VUSB
GND
R1153.6knPWREN
USB AREA POWER SUPPLY AREA RF MODULE CARRIER AREA
SIGNAL ROUTING
U8
VDC1
RA52
RA43
MCLR4
RC55
RC46
RC37
RC28
RC19
RC010
RA211
ICSPCLK12
ICSPDAT13
GND14
PIC16F1825-I/ST
VCC GND
PGM
CSB RSSISCLRSTPGCPGD
R42 DNP
VCCP
VCC
RS
SISCL
RST
CSB
VCC
GND
GNDC131uF
GND
C141uF C1-
2
C1+3
VOUT4
VCC5
GND6
SI7
SCL8
CSB9
RS10
LED+1
LED-12
RST11
LCD1
2x16 LCD
R60 Ohm
MICROCONTROLLER AREA
D2
GN
D
GN
D
+C
14.
7uF
C4
0.01
uF
L1 600R
/1.3
A
GN
D
C6
47pF
R4
0
C2
0.1u
F
VCC12
VCCIO3
3V3O
UT
10
GND5
GND13
US
BD
M9
US
BD
P8
RE
SE
T#
11
TX
D1
RX
D4
RT
S#
2
CT
S#
6
CB
US
015
CB
US
114
CB
US
27
CB
US
316
U2
FT
230X
C5
47pF
nPW
RE
N
C7
0.1u
F
GN
D
5V1
DA
T-
2
DA
T+
3
NC
4
GSHD6
GSHD7
GN
D5
J1 Mic
ro U
SB
5VU
SB
RT
SR
227
R3
27
TX
DR
XD
nCT
S
VC
C R20
10k
R47
0 oh
m
GP
IO2
RX
TX
LE
D D1
R5330 ohm
OR
AN
GE
RX
TX
LE
D
VCC
R1710k
GND
NC1
IN2
GND3 OUT 4
VCC 5U5 VCC
GND
R49 0 ohmBuffer Bypass DNP
RTS nCMD
CMD_DATA_OUTRXD
NC1
IN2
GND3 OUT 4
VCC 5U1 VCC
GND
R4610k
VCC
R48 0 ohmCMD_DATA_INTXD
Buffer Bypass DNP
GND
MO
DE
_IN
D
R8330 ohm
D4
MO
DE
_IN
D B
LUE
R2410k
S2
VCC
PA
IR
PAIR
GND
R410 ohm
R400 ohm
VCC
GND
SW1
LADJ
R36DNP
R23DNP
GPIO1
RXD
GND
nPDN
R9
10k
GN
D
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
D
GN
DG
ND
R35
10k
R34
10k
R33
10k
R32
10k
R30
10k
R28
10k
R22
10k
R21
10k
R18
10k
R15
10k
R14
10k
R13
10k
R12
10k
R10
10k
GN
DR
3810
kV
CC
R16
10k
VC
C
VC
C R1
1 O
hm
MODE_INDCMD_DATA_IN
CM
D_D
AT
A_O
UT
GN
D
GN
D
GN
DG
ND
GN
D
1
23
45
67
89
1011
1213
1415
1617
1819
2021
2223
2425
2627
2829
3031
3233
3435
3637
J2 Car
rier
Inte
rcon
nectR
2910
k
GN
D
GN
DV
CC
VC
CR
2710
kR
2510
k
R19
10k
R31
10k
VC
C
PA
IR
GN
DR
2610
kG
ND
R37
10k
GN
DR
3910
kG
ND
R43
10k
R44
10k
GN
D
R45
10k
GN
D
RF
1
GND 2-5
AN
T1
GN
DG
ND
X1
1nH
X3
DN
P
GN
DX2
DN
P
LAD
J
nPD
NnC
MD
nCT
S
GP
IO1
GP
IO1
GP
IO2
Figure 33: Programming Dock Board Power Supply Area Schematic
GND
+ C8
100uF
VCC
GND
Vin1
GN
D2
Vout3
U4LM3940IMP 3.3V
C90.47uF
GND
IN1
GND2
EN3
FAULT4
ILIM5
OUT6
U3TPS2552
GND
5VUSB
GND
R1153.6knPWREN
USB AREA POWER SUPPLY AREA RF MODULE CARRIER AREA
SIGNAL ROUTING
U8
VDC1
RA52
RA43
MCLR4
RC55
RC46
RC37
RC28
RC19
RC010
RA211
ICSPCLK12
ICSPDAT13
GND14
PIC16F1825-I/ST
VCC GND
PGM
CSB RSSISCLRSTPGCPGD
R42 DNP
VCCP
VCC
RS
SISCL
RST
CSB
VCC
GND
GNDC131uF
GND
C141uF C1-
2
C1+3
VOUT4
VCC5
GND6
SI7
SCL8
CSB9
RS10
LED+1
LED-12
RST11
LCD1
2x16 LCD
R60 Ohm
MICROCONTROLLER AREA
D2
GN
D
GN
D
+C
14.
7uF
C4
0.01
uF
L1 600R
/1.3
A
GN
D
C6
47pF
R4
0
C2
0.1u
F
VCC12
VCCIO3
3V3O
UT
10
GND5
GND13
US
BD
M9
US
BD
P8
RE
SE
T#
11
TX
D1
RX
D4
RT
S#
2
CT
S#
6
CB
US
015
CB
US
114
CB
US
27
CB
US
316
U2
FT
230X
C5
47pF
nPW
RE
N
C7
0.1u
F
GN
D
5V1
DA
T-
2
DA
T+
3
NC
4
GSHD6
GSHD7
GN
D5
J1 Mic
ro U
SB
5VU
SB
RT
SR
227
R3
27
TX
DR
XD
nCT
S
VC
C R20
10k
R47
0 oh
m
GP
IO2
RX
TX
LE
D D1
R5330 ohm
OR
AN
GE
RX
TX
LE
D
VCC
R1710k
GND
NC1
IN2
GND3 OUT 4
VCC 5U5 VCC
GND
R49 0 ohmBuffer Bypass DNP
RTS nCMD
CMD_DATA_OUTRXD
NC1
IN2
GND3 OUT 4
VCC 5U1 VCC
GND
R4610k
VCC
R48 0 ohmCMD_DATA_INTXD
Buffer Bypass DNP
GND
MO
DE
_IN
DR8330 ohm
D4
MO
DE
_IN
D B
LUE
R2410k
S2
VCC
PA
IR
PAIR
GND
R410 ohm
R400 ohm
VCC
GND
SW1
LADJ
R36DNP
R23DNP
GPIO1
RXD
GND
nPDN
R9
10k
GN
D
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
D
GN
DG
ND
R35
10k
R34
10k
R33
10k
R32
10k
R30
10k
R28
10k
R22
10k
R21
10k
R18
10k
R15
10k
R14
10k
R13
10k
R12
10k
R10
10k
GN
DR
3810
kV
CC
R16
10k
VC
C
VC
C R1
1 O
hm
MODE_INDCMD_DATA_IN
CM
D_D
AT
A_O
UT
GN
D
GN
D
GN
DG
ND
GN
D
1
23
45
67
89
1011
1213
1415
1617
1819
2021
2223
2425
2627
2829
3031
3233
3435
3637
J2 Car
rier
Inte
rcon
nectR
2910
k
GN
D
GN
DV
CC
VC
CR
2710
kR
2510
k
R19
10k
R31
10k
VC
C
PA
IR
GN
DR
2610
kG
ND
R37
10k
GN
DR
3910
kG
ND
R43
10k
R44
10k
GN
D
R45
10k
GN
D
RF
1
GND 2-5
AN
T1
GN
DG
ND
X1
1nH
X3
DN
P
GN
DX2
DN
P
LAD
J
nPD
NnC
MD
nCT
S
GP
IO1
GP
IO1
GP
IO2
Figure 34: Programming Dock Board Signal Routing Schematic
GND
+ C8
100uF
VCC
GND
Vin1
GN
D2
Vout3
U4LM3940IMP 3.3V
C90.47uF
GND
IN1
GND2
EN3
FAULT4
ILIM5
OUT6
U3TPS2552
GND
5VUSB
GND
R1153.6knPWREN
USB AREA POWER SUPPLY AREA RF MODULE CARRIER AREA
SIGNAL ROUTING
U8
VDC1
RA52
RA43
MCLR4
RC55
RC46
RC37
RC28
RC19
RC010
RA211
ICSPCLK12
ICSPDAT13
GND14
PIC16F1825-I/ST
VCC GND
PGM
CSB RSSISCLRSTPGCPGD
R42 DNP
VCCP
VCC
RS
SISCL
RST
CSB
VCC
GND
GNDC131uF
GND
C141uF C1-
2
C1+3
VOUT4
VCC5
GND6
SI7
SCL8
CSB9
RS10
LED+1
LED-12
RST11
LCD1
2x16 LCD
R60 Ohm
MICROCONTROLLER AREA
D2
GN
D
GN
D
+C
14.
7uF
C4
0.01
uF
L1 600R
/1.3
A
GN
D
C6
47pF
R4
0
C2
0.1u
F
VCC12
VCCIO3
3V3O
UT
10
GND5
GND13
US
BD
M9
US
BD
P8
RE
SE
T#
11
TX
D1
RX
D4
RT
S#
2
CT
S#
6
CB
US
015
CB
US
114
CB
US
27
CB
US
316
U2
FT
230X
C5
47pF
nPW
RE
N
C7
0.1u
F
GN
D
5V1
DA
T-
2
DA
T+
3
NC
4
GSHD6
GSHD7
GN
D5
J1 Mic
ro U
SB
5VU
SB
RT
SR
227
R3
27
TX
DR
XD
nCT
S
VC
C R20
10k
R47
0 oh
m
GP
IO2
RX
TX
LE
D D1
R5330 ohm
OR
AN
GE
RX
TX
LE
D
VCC
R1710k
GND
NC1
IN2
GND3 OUT 4
VCC 5U5 VCC
GND
R49 0 ohmBuffer Bypass DNP
RTS nCMD
CMD_DATA_OUTRXD
NC1
IN2
GND3 OUT 4
VCC 5U1 VCC
GND
R4610k
VCC
R48 0 ohmCMD_DATA_INTXD
Buffer Bypass DNP
GND
MO
DE
_IN
D
R8330 ohm
D4
MO
DE
_IN
D B
LUE
R2410k
S2
VCC
PA
IR
PAIR
GND
R410 ohm
R400 ohm
VCC
GND
SW1
LADJ
R36DNP
R23DNP
GPIO1
RXD
GND
nPDN
R9
10k
GN
D
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
D
GN
DG
ND
R35
10k
R34
10k
R33
10k
R32
10k
R30
10k
R28
10k
R22
10k
R21
10k
R18
10k
R15
10k
R14
10k
R13
10k
R12
10k
R10
10k
GN
DR
3810
kV
CC
R16
10k
VC
C
VC
C R1
1 O
hm
MODE_INDCMD_DATA_IN
CM
D_D
AT
A_O
UT
GN
D
GN
D
GN
DG
ND
GN
D
1
23
45
67
89
1011
1213
1415
1617
1819
2021
2223
2425
2627
2829
3031
3233
3435
3637
J2 Car
rier
Inte
rcon
nectR
2910
k
GN
D
GN
DV
CC
VC
CR
2710
kR
2510
k
R19
10k
R31
10k
VC
C
PA
IR
GN
DR
2610
kG
ND
R37
10k
GN
DR
3910
kG
ND
R43
10k
R44
10k
GN
D
R45
10k
GN
D
RF
1
GND 2-5
AN
T1
GN
DG
ND
X1
1nH
X3
DN
P
GN
DX2
DN
P
LAD
J
nPD
NnC
MD
nCT
S
GP
IO1
GP
IO1
GP
IO2
Figure 35: Programming Dock Board USB Area Schematic
– – – –28 29
GND
+ C8
100uF
VCC
GND
Vin1
GN
D2
Vout3
U4LM3940IMP 3.3V
C90.47uF
GND
IN1
GND2
EN3
FAULT4
ILIM5
OUT6
U3TPS2552
GND
5VUSB
GND
R1153.6knPWREN
USB AREA POWER SUPPLY AREA RF MODULE CARRIER AREA
SIGNAL ROUTING
U8
VDC1
RA52
RA43
MCLR4
RC55
RC46
RC37
RC28
RC19
RC010
RA211
ICSPCLK12
ICSPDAT13
GND14
PIC16F1825-I/ST
VCC GND
PGM
CSB RSSISCLRSTPGCPGD
R42 DNP
VCCP
VCC
RS
SISCL
RST
CSB
VCC
GND
GNDC131uF
GND
C141uF C1-
2
C1+3
VOUT4
VCC5
GND6
SI7
SCL8
CSB9
RS10
LED+1
LED-12
RST11
LCD1
2x16 LCD
R60 Ohm
MICROCONTROLLER AREA
D2
GN
D
GN
D
+C
14.
7uF
C4
0.01
uF
L1 600R
/1.3
A
GN
D
C6
47pF
R4
0
C2
0.1u
F
VCC12
VCCIO3
3V3O
UT
10
GND5
GND13
US
BD
M9
US
BD
P8
RE
SE
T#
11
TX
D1
RX
D4
RT
S#
2
CT
S#
6
CB
US
015
CB
US
114
CB
US
27
CB
US
316
U2
FT
230X
C5
47pF
nPW
RE
N
C7
0.1u
F
GN
D
5V1
DA
T-
2
DA
T+
3
NC
4
GSHD6
GSHD7
GN
D5
J1 Mic
ro U
SB
5VU
SB
RT
SR
227
R3
27
TX
DR
XD
nCT
S
VC
C R20
10k
R47
0 oh
m
GP
IO2
RX
TX
LE
D D1
R5330 ohm
OR
AN
GE
RX
TX
LE
D
VCC
R1710k
GND
NC1
IN2
GND3 OUT 4
VCC 5U5 VCC
GND
R49 0 ohmBuffer Bypass DNP
RTS nCMD
CMD_DATA_OUTRXD
NC1
IN2
GND3 OUT 4
VCC 5U1 VCC
GND
R4610k
VCC
R48 0 ohmCMD_DATA_INTXD
Buffer Bypass DNP
GND
MO
DE
_IN
D
R8330 ohm
D4
MO
DE
_IN
D B
LUE
R2410k
S2
VCC
PA
IR
PAIR
GND
R410 ohm
R400 ohm
VCC
GND
SW1
LADJ
R36DNP
R23DNP
GPIO1
RXD
GND
nPDN
R9
10k
GN
D
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
D
GN
DG
ND
R35
10k
R34
10k
R33
10k
R32
10k
R30
10k
R28
10k
R22
10k
R21
10k
R18
10k
R15
10k
R14
10k
R13
10k
R12
10k
R10
10k
GN
DR
3810
kV
CC
R16
10k
VC
C
VC
C R1
1 O
hm
MODE_INDCMD_DATA_IN
CM
D_D
AT
A_O
UT
GN
D
GN
D
GN
DG
ND
GN
D
1
23
45
67
89
1011
1213
1415
1617
1819
2021
2223
2425
2627
2829
3031
3233
3435
3637
J2 Car
rier
Inte
rcon
nectR
2910
k
GN
D
GN
DV
CC
VC
CR
2710
kR
2510
k
R19
10k
R31
10k
VC
C
PA
IR
GN
DR
2610
kG
ND
R37
10k
GN
DR
3910
kG
ND
R43
10k
R44
10k
GN
D
R45
10k
GN
D
RF
1
GND 2-5
AN
T1
GN
DG
ND
X1
1nH
X3
DN
P
GN
DX2
DN
P
LAD
J
nPD
NnC
MD
nCT
S
GP
IO1
GP
IO1
GP
IO2
Figure 36: Programming Dock Board Microcontroller Area Schematic
GN
D
OU
TIN
GND
GND
+
C7
10uF
THERM
4
123
U5
THERM
RF
12 3
4 5
6 78 910 1112 1314 1516 1718 1920 2122 2324 2526 2728 2930 3132 3334 3536 37
38394041424344454647484950515253545556
J2Carrier Interconnect Female
1
GN
D2-
5
ANT1CONREVSMA001
GND
GND
GND
GND
GND
78 910 1112 1314 1516 1718 1920 2122 2324 2526 2728 2930 3132 3334 3536 37
38394041424344454647484950515253545556
X1
0 Ohm
6
X3DNP
GNDGND
X2DNP
GND
R24330
5VUSB
D2
PO
WE
R (G
RE
EN
)
D3
OV
ER
CU
RR
EN
T (R
ED
)
R22330
VCC
FAULT
U2
R5
10k
GND
5VUSB
GND
C80.47uF
FAU
LT
IN1
GND2
EN3 FAULT 4
ILIM 5
OUT 6
TPS2553
SW3
5VUSB
EN
FAULT
GND12
J3
100mil HeaderBattery Input
D1
GND
R753.6k
R953.6k
GND
Q1
R310k
BCD Charger
VCC
+
GND
GND
C14.7uF
C3
0.01uF
L1600R/1.3A
GND
C5
47pF
R40
C20.1uF
VC
C12
VC
CIO
3
3V3OUT10
GN
D5
GN
D13
USBDM9
USBDP8
RESET11
TXD 1
RXD 4
RTS 2
CTS 6
CBUS0 15
CBUS1 14
CBUS2 7
CBUS3 16
U6
FT230X
C4
47pF
C60.1uF
GND
5V 1
DAT- 2
DAT+ 3
NC 4
GS
HD
6G
SH
D7
GND 5
J1 Micro USB
RTSCTS
R1 27
R2 27
5VUSB
EN
BCD Charger
TXD
RXD
SW1
SW2
9
15
CMD_DATA_IN
CMD_DATA_OUT
NC1
IN2
GND3 OUT 4
VCC 5U3 VCC
GND
R25DNP
VCC
R27 DNP
NC 1
IN 2
GND 3OUT4
VCC5
U4
R33DNP
GND
VCC
R36 DNP
PROTOTYPEAREA
GND BUS
1
TXD
RX
DR
TSC
TS
VCC BUS
1
TP3
1
TP2
GND GND
TP1
VCC
39404142434445
4647484950515253545556
38373635
293031
323334
78910111213141516171819202122232425262728
1 2 3 4
J6100mil Header
1234567891011121314151617181920212223242526
J5100mil Header
GND
VCC
R10 DNPVCC
123456789
1011
J7100mil Header
123456789
1011121314
J4100mil Header
R45 DNP GND
R44 DNPR43 DNPR42 DNPR41 DNPR40 DNPR39 DNPR38 DNP
GNDGNDGNDGNDGNDGNDGND
GNDR52 DNPR53 DNP GND
R19 DNPGND
VCC
R11 DNPGND
R50 DNP GND
R14 DNPGND
R17 0 ohmVCC
R12 DNPGND
R26 DNP
R23 DNPGND
R21 DNPGND R47 DNP GNDR48 DNP GNDR49 DNP GND
R15DNP
VCC
R18DNP
GND
R13 DNP
R8 DNP
R16 DNPGND
R20 DNPGND
R28 DNPGND R29 DNPVCC R30 DNPGND R31 DNPGND
R32 DNP GND
R34 DNP GNDR35 DNP GND
R54 DNP GNDR55 DNP GNDR56 DNP VCC
C9
0.1uF
GND
VCC
6R6 DNP
Figure 37: Prototype Board Power Supply Area Schematic
GN
D
OU
TIN
GND
GND
+
C7
10uF
THERM
4
123
U5
THERM
RF
12 3
4 5
6 78 910 1112 1314 1516 1718 1920 2122 2324 2526 2728 2930 3132 3334 3536 37
38394041424344454647484950515253545556
J2Carrier Interconnect Female
1
GN
D2-
5
ANT1CONREVSMA001
GND
GND
GND
GND
GND
78 910 1112 1314 1516 1718 1920 2122 2324 2526 2728 2930 3132 3334 3536 37
38394041424344454647484950515253545556
X1
0 Ohm
6
X3DNP
GNDGND
X2DNP
GND
R24330
5VUSB
D2
PO
WE
R (G
RE
EN
)
D3
OV
ER
CU
RR
EN
T (R
ED
)
R22330
VCC
FAULT
U2
R5
10k
GND
5VUSB
GND
C80.47uF
FAU
LT
IN1
GND2
EN3 FAULT 4
ILIM 5
OUT 6
TPS2553
SW3
5VUSB
EN
FAULT
GND12
J3
100mil HeaderBattery Input
D1
GND
R753.6k
R953.6k
GND
Q1
R310k
BCD Charger
VCC
+
GND
GND
C14.7uF
C3
0.01uF
L1600R/1.3A
GND
C5
47pF
R40
C20.1uF
VC
C12
VC
CIO
3
3V3OUT10
GN
D5
GN
D13
USBDM9
USBDP8
RESET11
TXD 1
RXD 4
RTS 2
CTS 6
CBUS0 15
CBUS1 14
CBUS2 7
CBUS3 16
U6
FT230X
C4
47pF
C60.1uF
GND
5V 1
DAT- 2
DAT+ 3
NC 4
GS
HD
6G
SH
D7
GND 5
J1 Micro USB
RTSCTS
R1 27
R2 27
5VUSB
EN
BCD Charger
TXD
RXD
SW1
SW2
9
15
CMD_DATA_IN
CMD_DATA_OUT
NC1
IN2
GND3 OUT 4
VCC 5U3 VCC
GND
R25DNP
VCC
R27 DNP
NC 1
IN 2
GND 3OUT4
VCC5
U4
R33DNP
GND
VCC
R36 DNP
PROTOTYPEAREA
GND BUS
1
TXD
RX
DR
TSC
TS
VCC BUS
1
TP3
1
TP2
GND GND
TP1
VCC
39404142434445
4647484950515253545556
38373635
293031
323334
78910111213141516171819202122232425262728
1 2 3 4
J6100mil Header
1234567891011121314151617181920212223242526
J5100mil Header
GND
VCC
R10 DNPVCC
123456789
1011
J7100mil Header
123456789
1011121314
J4100mil Header
R45 DNP GND
R44 DNPR43 DNPR42 DNPR41 DNPR40 DNPR39 DNPR38 DNP
GNDGNDGNDGNDGNDGNDGND
GNDR52 DNPR53 DNP GND
R19 DNPGND
VCC
R11 DNPGND
R50 DNP GND
R14 DNPGND
R17 0 ohmVCC
R12 DNPGND
R26 DNP
R23 DNPGND
R21 DNPGND R47 DNP GNDR48 DNP GNDR49 DNP GND
R15DNP
VCC
R18DNP
GND
R13 DNP
R8 DNP
R16 DNPGND
R20 DNPGND
R28 DNPGND R29 DNPVCC R30 DNPGND R31 DNPGND
R32 DNP GND
R34 DNP GNDR35 DNP GND
R54 DNP GNDR55 DNP GNDR56 DNP VCC
C9
0.1uF
GND
VCC
6R6 DNP
Figure 38: Prototype Board RF Carrier Area Schematic
Prototype Board Schematic
– – – –30 31
GND
OUT
IN
GN
D
GN
D
+
C7
10uF
THE
RM
4
1
2
3
U5
THE
RM
RF
1
23
45
67
89
1011
1213
1415
1617
1819
2021
2223
2425
2627
2829
3031
3233
3435
3637
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
J2 Car
rier I
nter
conn
ect F
emal
e1
GND 2-5
AN
T1C
ON
RE
VS
MA
001
GN
D
GN
D
GN
D
GN
D
GN
D
78
910
1112
1314
1516
1718
1920
2122
2324
2526
2728
2930
3132
3334
3536
37
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
X1
0 O
hm
6
X3
DN
P
GN
DG
NDX
2D
NP
GN
D
R24
330
5VU
SB
D2
POWER (GREEN)
D3
OVER CURRENT (RED)
R22
330
VC
C
FAU
LT
U2
R5
10k
GN
D 5VU
SB
GN
D
C8
0.47
uF
FAULT
IN1
GN
D2
EN
3FA
ULT
4
ILIM
5
OU
T6
TPS
2553
SW
3
5VU
SB
EN
FAU
LT
GN
D1 2
J3
100m
il H
eade
rB
atte
ry In
put
D1
GN
D
R7 53.6
kR
9 53.6
k
GN
DQ1
R3
10k
BC
D C
harg
er
VC
C
+
GN
D
GN
D
C1
4.7u
F
C3
0.01
uF
L160
0R/1
.3A
GN
D
C5
47pF
R4
0
C2
0.1u
F
VCC12
VCCIO3
3V3O
UT
10
GND 5
GND 13
US
BD
M9
US
BD
P8
RE
SE
T11
TXD
1
RX
D4
RTS
2
CTS
6
CB
US
015
CB
US
114
CB
US
27
CB
US
316
U6
FT23
0X
C4
47pF
C6
0.1u
F
GN
D
5V1
DA
T-
2
DA
T+3
NC
4
GSHD 6GSHD 7
GN
D5
J1M
icro
US
B
RTS
CTS
R1
27
R2
27
5VU
SB
EN
BC
D C
harg
er
TXD RX
D
SW
1 SW
2
9
15
CM
D_D
ATA
_IN
CM
D_D
ATA
_OU
T
NC
1
IN2
GN
D3
OU
T4
VC
C5
U3
VC
C
GN
D
R25
DN
P
VC
C
R27
DN
P
NC
1
IN2
GN
D3
OU
T4
VC
C5
U4
R33
DN
P
GN
DVC
C
R36
DN
P
PR
OTO
TYP
EA
RE
A
GN
D B
US
1
TXDRXDRTSCTS
VC
C B
US
1
TP3
1
TP2
GN
DG
ND
TP1
VC
C
39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 5638373635
29 30 31
32 33 347 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
1234
J6 100m
il H
eade
r1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
J510
0mil
Hea
der
GN
D
VC
C
R10
DN
PV
CC
1 2 3 4 5 6 7 8 9 10 11J7 100m
il H
eade
r
1 2 3 4 5 6 7 8 9 10 11 12 13 14J4 100m
il H
eade
r
R45
DN
PG
ND
R44
DN
PR
43D
NP
R42
DN
PR
41D
NP
R40
DN
PR
39D
NP
R38
DN
P
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
D
GN
DR
52D
NP
R53
DN
PG
ND
R19
DN
PG
ND
VC
C
R11
DN
PG
ND
R50
DN
PG
ND
R14
DN
PG
ND
R17
0 oh
mV
CC
R12
DN
PG
ND
R26
DN
P
R23
DN
PG
ND
R21
DN
PG
ND
R47
DN
PG
ND
R48
DN
PG
ND
R49
DN
PG
ND
R15
DN
P
VC
C R18
DN
P
GN
D
R13
DN
P
R8
DN
P
R16
DN
PG
ND
R20
DN
PG
ND
R28
DN
PG
ND
R29
DN
PV
CC
R30
DN
PG
ND
R31
DN
PG
ND
R32
DN
PG
ND
R34
DN
PG
ND
R35
DN
PG
ND
R54
DN
PG
ND
R55
DN
PG
ND
R56
DN
PV
CC
C9
0.1u
F
GN
D
VC
C
6R
6D
NP
Figure 39: Prototype Board USB Area Schematic
GND
OUT
IN
GN
D
GN
D
+
C7
10uF
THE
RM
4
1
2
3
U5
THE
RM
RF
1
23
45
67
89
1011
1213
1415
1617
1819
2021
2223
2425
2627
2829
3031
3233
3435
3637
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
J2 Car
rier I
nter
conn
ect F
emal
e1
GND 2-5
AN
T1C
ON
RE
VS
MA
001
GN
D
GN
D
GN
D
GN
D
GN
D
78
910
1112
1314
1516
1718
1920
2122
2324
2526
2728
2930
3132
3334
3536
37
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56
X1
0 O
hm
6
X3
DN
P
GN
DG
NDX
2D
NP
GN
D
R24
330
5VU
SB
D2
POWER (GREEN)
D3
OVER CURRENT (RED)
R22
330
VC
C
FAU
LT
U2
R5
10k
GN
D 5VU
SB
GN
D
C8
0.47
uF
FAULT
IN1
GN
D2
EN
3FA
ULT
4
ILIM
5
OU
T6
TPS
2553
SW
3
5VU
SB
EN
FAU
LT
GN
D1 2
J3
100m
il H
eade
rB
atte
ry In
put
D1
GN
D
R7 53.6
kR
9 53.6
k
GN
DQ1
R3
10k
BC
D C
harg
er
VC
C
+
GN
D
GN
D
C1
4.7u
F
C3
0.01
uF
L160
0R/1
.3A
GN
D
C5
47pF
R4
0
C2
0.1u
F
VCC12
VCCIO3
3V3O
UT
10
GND 5
GND 13
US
BD
M9
US
BD
P8
RE
SE
T11
TXD
1
RX
D4
RTS
2
CTS
6
CB
US
015
CB
US
114
CB
US
27
CB
US
316
U6
FT23
0X
C4
47pF
C6
0.1u
F
GN
D
5V1
DA
T-
2
DA
T+3
NC
4
GSHD 6GSHD 7
GN
D5
J1M
icro
US
B
RTS
CTS
R1
27
R2
27
5VU
SB
EN
BC
D C
harg
er
TXD RX
D
SW
1 SW
2
9
15
CM
D_D
ATA
_IN
CM
D_D
ATA
_OU
T
NC
1
IN2
GN
D3
OU
T4
VC
C5
U3
VC
C
GN
D
R25
DN
P
VC
C
R27
DN
P
NC
1
IN2
GN
D3
OU
T4
VC
C5
U4
R33
DN
P
GN
DVC
C
R36
DN
P
PR
OTO
TYP
EA
RE
A
GN
D B
US
1
TXDRXDRTSCTS
VC
C B
US
1
TP3
1
TP2
GN
DG
ND
TP1
VC
C
39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 5638373635
29 30 31
32 33 347 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
1234
J6 100m
il H
eade
r1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
J510
0mil
Hea
der
GN
D
VC
C
R10
DN
PV
CC
1 2 3 4 5 6 7 8 9 10 11J7 100m
il H
eade
r
1 2 3 4 5 6 7 8 9 10 11 12 13 14J4 100m
il H
eade
r
R45
DN
PG
ND
R44
DN
PR
43D
NP
R42
DN
PR
41D
NP
R40
DN
PR
39D
NP
R38
DN
P
GN
DG
ND
GN
DG
ND
GN
DG
ND
GN
D
GN
DR
52D
NP
R53
DN
PG
ND
R19
DN
PG
ND
VC
C
R11
DN
PG
ND
R50
DN
PG
ND
R14
DN
PG
ND
R17
0 oh
mV
CC
R12
DN
PG
ND
R26
DN
P
R23
DN
PG
ND
R21
DN
PG
ND
R47
DN
PG
ND
R48
DN
PG
ND
R49
DN
PG
ND
R15
DN
P
VC
C R18
DN
P
GN
D
R13
DN
P
R8
DN
P
R16
DN
PG
ND
R20
DN
PG
ND
R28
DN
PG
ND
R29
DN
PV
CC
R30
DN
PG
ND
R31
DN
PG
ND
R32
DN
PG
ND
R34
DN
PG
ND
R35
DN
PG
ND
R54
DN
PG
ND
R55
DN
PG
ND
R56
DN
PV
CC
C9
0.1u
F
GN
D
VC
C
6R
6D
NP
Figure 40: Prototype Board Prototype Area Schematic
Disclaimer
Linx Technologies is continually striving to improve the quality and function of its products. For this reason, we reserve the right to make changes to our products without notice. The information contained in this Data Guide is believed to be accurate as of the time of publication. Specifications are based on representative lot samples. Values may vary from lot-to-lot and are not guaranteed. “Typical” parameters can and do vary over lots and application. Linx Technologies makes no guarantee, warranty, or representation regarding the suitability of any product for use in any specific application. It is the customer’s responsibility to verify the suitability of the part for the intended application. NO LINX PRODUCT IS INTENDED FOR USE IN ANY APPLICATION WHERE THE SAFETY OF LIFE OR PROPERTY IS AT RISK.
Linx Technologies DISCLAIMS ALL WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL LINX TECHNOLOGIES BE LIABLE FOR ANY OF CUSTOMER’S INCIDENTAL OR CONSEQUENTIAL DAMAGES ARISING IN ANY WAY FROM ANY DEFECTIVE OR NON-CONFORMING PRODUCTS OR FOR ANY OTHER BREACH OF CONTRACT BY LINX TECHNOLOGIES. The limitations on Linx Technologies’ liability are applicable to any and all claims or theories of recovery asserted by Customer, including, without limitation, breach of contract, breach of warranty, strict liability, or negligence. Customer assumes all liability (including, without limitation, liability for injury to person or property, economic loss, or business interruption) for all claims, including claims from third parties, arising from the use of the Products. The Customer will indemnify, defend, protect, and hold harmless Linx Technologies and its officers, employees, subsidiaries, affiliates, distributors, and representatives from and against all claims, damages, actions, suits, proceedings, demands, assessments, adjustments, costs, and expenses incurred by Linx Technologies as a result of or arising from any Products sold by Linx Technologies to Customer. Under no conditions will Linx Technologies be responsible for losses arising from the use or failure of the device in any application, other than the repair, replacement, or refund limited to the original product purchase price. Devices described in this publication may contain proprietary, patented, or copyrighted techniques, components, or materials. Under no circumstances shall any user be conveyed any license or right to the use or ownership of such items.
©2018 Linx Technologies. All rights reserved.
The stylized Linx logo, Wireless Made Simple, WiSE, CipherLinx and the stylized CL logo are trademarks of Linx Technologies.
Linx Technologies
159 Ort Lane
Merlin, OR, US 97532
Phone: +1 541 471 6256
Fax: +1 541 471 6251
www.linxtechnologies.com
