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HUAWEI SE2900 Session Border Controller V300R002C10

Hardware Description

Issue 01

Date 2016-01-15

HUAWEI TECHNOLOGIES CO., LTD.

Issue 01 (2016-01-15) Huawei Proprietary and Confidential

Copyright © Huawei Technologies Co., Ltd. i

Copyright © Huawei Technologies Co., Ltd. 2016. All rights reserved.

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holders.

Notice

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within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,

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Huawei Technologies Co., Ltd.

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mailto:[email protected]

HUAWEI SE2900 Session Border Controller

Hardware Description Contents


Copyright © Huawei Technologies Co., Ltd.

ii

Contents

1 Service Processing Device ........................................................................................................... 1

1.1 Subrack Datasheet ........................................................................................................................................................ 2

1.2 Subrack Classification and Numbering Rules .............................................................................................................. 5

1.3 F8002 DC Subrack ....................................................................................................................................................... 6

1.3.1 PEM ......................................................................................................................................................................... 12

1.3.2 Fan Tray ................................................................................................................................................................... 15

1.4 F8002 AC Subrack ...................................................................................................................................................... 17

1.4.1 AC PSU .................................................................................................................................................................... 24

1.4.2 Fan Tray ................................................................................................................................................................... 28

1.5 F8002 Subrack System Topology Structure ................................................................................................................ 30

1.5.1 CAN Bus .................................................................................................................................................................. 30

1.5.2 Base Topology Structure .......................................................................................................................................... 31

1.5.3 eFabric Topology Structure ...................................................................................................................................... 32

1.6 F8002 Subrack System Monitoring ............................................................................................................................ 33

1.6.1 Power Module Monitoring ....................................................................................................................................... 33

1.6.2 Fan Tray Monitoring ................................................................................................................................................ 33

1.7 MXU ........................................................................................................................................................................... 34

1.7.1 MXUA0 ................................................................................................................................................................... 34

1.8 SPU ............................................................................................................................................................................. 45

1.8.1 SPUA0 ..................................................................................................................................................................... 45

1.8.2 SPUA1 ..................................................................................................................................................................... 53

1.8.3 SPUZ0 ..................................................................................................................................................................... 61

1.9 VPU ............................................................................................................................................................................ 69

1.9.1 VPUA0 .................................................................................................................................................................... 69

1.9.2 VPUA1 .................................................................................................................................................................... 77

1.10 Filler Panel ................................................................................................................................................................ 85

2 Other Accessories ........................................................................................................................ 87

2.1 Alarm Box ................................................................................................................................................................... 87

2.2 Optical Module ........................................................................................................................................................... 91

2.3 Electrical Module ........................................................................................................................................................ 98

3 Cables .......................................................................................................................................... 101

3.1 Power Cables and PGND Cables .............................................................................................................................. 101


Hardware Description Contents



iii

3.1.1 Power and PGND Cables to a Subrack .................................................................................................................. 101

3.1.2 Power Cables of the Alarm Box............................................................................................................................. 104

3.2 Signaling Cables ....................................................................................................................................................... 105

3.2.1 Ethernet Cable ....................................................................................................................................................... 105

3.2.2 LC/PC-LC/PC-Multi-Mode Optical Cable ............................................................................................................ 108

3.2.3 DLC/PC-DLC/PC-Multi-Mode Optical Cable ...................................................................................................... 109

3.2.4 LC/PC-LC/PC-Single-Mode Optical Cable ........................................................................................................... 110

3.2.5 MPO/PC-MPO/PC-Multi-Mode Optical Cable ..................................................................................................... 112

3.2.6 High-Density Cable ............................................................................................................................................... 113

3.2.7 DB9-RJ45 Serial Cable .......................................................................................................................................... 115


Hardware Description 1 Service Processing Device



1

1 Service Processing Device

About This Chapter

1.1 Subrack Datasheet

1.2 Subrack Classification and Numbering Rules

1.3 F8002 DC Subrack

1.4 F8002 AC Subrack

1.5 F8002 Subrack System Topology Structure

1.6 F8002 Subrack System Monitoring

1.7 MXU

1.8 SPU

1.9 VPU

1.10 Filler Panel





2

1.1 Subrack Datasheet





3





4





5

1.2 Subrack Classification and Numbering Rules

Subrack Numbering Rules Each subrack has a unique number.

The subracks in a cabinet are numbered in ascending order from bottom to top. The basic

subrack is the first subrack from the bottom and is numbered 0.

If there are multiple cabinets, the subracks are numbered in ascending order based on the

cabinet numbers.

Figure 1-1 illustrates how subracks are numbered.

Figure 1-1 Subrack numbering rules

Figure 1-1 uses a cabinet configured with more than two subracks as an example. Number subracks

based to the subrack numbering rule depending on the actual situation.

Subrack Slot Numbering Rules

The slots in an subrack are numbered from 1 in ascending order from bottom to top and then

from left to right.

Figure 1-2 illustrates how the slots are numbered in an F8002 subrack.





6

Figure 1-2 Slot numbering rules in the F8002 subrack

The slot identifiers are labeled inside the subrack.

1.3 F8002 DC Subrack

Functions

Table 1-1 describes the functions of the F8002 subrack.

Table 1-1 F8002 subrack functions

Function Description

Power supply Two power entry modules (PEMs) are configured in 1+1

redundancy mode. Each PEM supplies DC power to the entire

subrack through the backplane.

Data transmission The F8002 subrack provides data transmission channels.

Heat dissipation Two fan trays are configured to dissipate heat for the subrack.

Subrack identification Each F8002 subrack has a unique number.

If the subrack number is not set, the subrack number indicators are blinking in sequence. For details

about how to set the subrack number, see Hardware-Specific Modifications.

Appearance

Figure 1-3 shows an F8002 subrack.





7

Figure 1-3 F8002 subrack (unit: mm)

Each F8002 subrack provides six slots for installing the multi-function switch units (MXUs)

and service boards. Figure 1-4 shows the slot positions of the F8002 subrack.

Figure 1-4 F8002 subrack slot positions

The F8002 subrack provides:

Slots 2 and 5 for MXUs.

Slots 1, 3, 4, and 6 for service boards.





8

PEM 1 and PEM 2 for PEMs.

Fan 1 and Fan 2 for fan trays.

Figure 1-5 shows the front view of an F8002 subrack in full configuration.

Figure 1-5 Front view of an F8002 subrack in full configuration

Figure 1-6 shows the rear view of an F8002 subrack.

Figure 1-6 Rear view of an F8002 subrack

Table 1-2 describes the components of the F8002 subrack.

Table 1-2 F8002 subrack components

Component

Quantity

Description

MXU 2 The MXUs implement operation, maintenance, and

management of the system.

Two MXUs are installed in slots 2 and 5 to work in

active/standby mode.

Service

boards

4 The service boards can be installed in slots 1, 3, 4, and 6. The

service boards in any two slots can be configured in


PEM 2 Two PEMs are configured in 1+1 redundancy mode. If one





9

Component

Quantity

Description

PEM is faulty, the power supply to the subrack is not affected.

Fan tray 2 Two fan trays are configured to draw in cool air from the front

of the subrack and exhaust warm air from the rear of the

subrack. Figure 1-7 shows the air flows.

Ground

point

2 The F8002 subrack provides two ground points.

If the subrack is used in North America, connect both ground

points. If the subrack is used in other regions, only connect one

of the ground points.

Electrostatic

discharge

(ESD) jack

1 The F8002 subrack provides one ESD jack.

Figure 1-7 Heat dissipation in the subrack

Figure 1-8 shows the power supply mode of the F8002 subrack. Each PEM supplies power to

all slots and fan trays in the subrack.





10

Figure 1-8 F8002 subrack power supply mode

Logical Structure

Figure 1-9 shows the logical structure of the F8002 subrack.

Figure 1-9 F8002 subrack logical structure

The MXUs implement subrack management and data exchange in the subrack.

The MXUs work in active/standby mode. Only the active MXU executes management

tasks. The MXUs also manage the two fan trays through the RS485 bus and the two

PEMs through the Inter-integrated circuit (I2C) bus.

The service data and signaling data from a service board is forwarded in eFabric

channels to the MXUs through the backplane. The MXUs then forward the data to

another service board.

The management data from a service board is forwarded in Base channels to the MXUs

through the backplane. The MXUs then forward the data to another service board.

The power distribution box (PDB) in the subrack provides two DC power supplies to the

subrack.





11

Hardware and Software Compatibility

Table 1-3 lists the boards that can be used in F8002 subracks.

Table 1-3 Types of boards in the F8002 subrack

MXU Type Compatible Service Board Type

Compatibility Rule

MXU SPU

VPU

-

Technical Specifications

Table 1-4 lists the technical specifications of the F8002 subrack.

Table 1-4 F8002 subrack technical specifications

Item Specifications

Mechanical

specificatio

ns

Dimensions (H x W x D) 130.5 mm x 442.0 mm x 675.0 mm (5.14 in. x

17.40 in. x 26.57 in.)

Weight of an empty

subrack

20.8 kg (45.86 lb)

NOTE

An empty subrack is equipped with two fan trays

and two PEMs.

Weight of a fully loaded

subrack

47.8 kg (105.38 lb)

NOTE

A fully loaded subrack is equipped with two fan

trays, two PEMs, two MXUA0s, and four SPUA0s.

Power

supply

Rated input voltage -48 V DC to -60 V DC

Operating voltage -40 V DC to -72 V DC

Total power inputs Two

Rated input current 60 A/power input

Power rating 2400 W (The rated power of each PEM is

2400 W)

NOTE

The subrack is configured with two PEMs in 1+1

redundancy mode.

Environme

ntal

specificatio

ns

Temperature Long-term operating temperature: 0°C to

45°C (32°F to 113°F)

Short-term operating temperature: -5°C to

+55°C (23°F to 131°F)

Storage temperature: -40°C to +70°C

(-40°F to +158°F)





12

Item Specifications

Humidity Long-term operating humidity: 5% RH to

85% RH (non-condensing)

Short-term operating humidity: 5% RH to


Storage humidity: 10% RH to 95% RH

(non-condensing)

Altitude -60 m to +4000 m (-196.85 ft to +13123.20 ft)

Short term means that the consecutive working period is not more than 96 hours and that the cumulative

working period over a year is not more than 15 days.

1.3.1 PEM

Functions

Table 1-5 describes the functions of the power entry module (PEM).

Table 1-5 PEM functions


Power supply Supplies power to devices in the subrack.

Supports wide input voltage range.

Power

distribution

monitoring

Detects the installation status and type of PEMs.

Provides the indicators on the panel to indicate PEM status.

Detects the voltage and power of the subrack.

Detects the status of the circuit breakers and surge protection circuits.

Detects the PEM temperature.

Reports voltage, current, and power information in real time.

Implements the electronic label function.

Protection Implements surge protection, short circuit protection, and

over-current protection.

Prevents incorrect insertion.

Appearance

Figure 1-10 shows a PEM.





13

Figure 1-10 PEM

Figure 1-11 shows the PEM panel.

Figure 1-11 PEM panel

1. STATUS

indicator

2. Power input

terminal RTN(+)

3. Power input terminal

protective cover 4. Handle





14

5. Captive

screw

6. Circuit breaker 7. Power input terminal

NEG(-)

8. Circuit breaker

protective cover

The circuit breaker is switched on when it is turned up and is switched off when it is turned down.

Indicators

Table 1-6 describes the STATUS indicator on the PEM panel.

Table 1-6 STATUS indicator on the PEM panel

Silk Screen

Meaning State State Description

STATUS Status

indicator Off There is no power supply.

Green The PEM is operating properly.

Red The power supply is abnormal.

The surge protection circuit is faulty.

The circuit breaker is faulty.


Table 1-7 lists the technical specifications of the PEM.

Table 1-7 PEM technical specifications

Item Specifications

Mechanical

specificatio

ns

Dimensions (H x W x

D)

122.5 mm x 65.0 mm x 122.7 mm (4.82 in. x

2.60 in. x 4.83 in.)

Weight 1.0 kg (2.20 lb)

Input terminal Duplex M6

Voltage

and current

Rated input voltage -48 V DC to -60 V DC

Maximum input voltage -40 V DC to -72 V DC

Total power inputs 1


PEM voltage drop ≤ 0.5 V

Power rating 2400 W

Environme

ntal

specificatio


45°C (32°F to 113°F)






15

Item Specifications

ns +55°C (23°F to 131°F)

Storage temperature: -40°C to +70°C (-40°F

to +158°F)

Relative humidity ≤ 95% RH




1.3.2 Fan Tray

Functions

Table 1-8 describes the functions of the fan tray.

Table 1-8 Fan tray functions


Heat dissipation The fan trays draw in cool air from the front of the subrack and

exhaust warm air from the rear of the subrack.

Monitoring Fan monitoring boards are configured for fan trays to:

Provide ports for communicating with the switch boards.

Detect and report the fan operating status and speed values.

Control the health indicators on the fan trays.

Support fan blocking status detection and reports fan

alarms.

Support online software upgrades and log uploads.

Monitor and report the fan temperature.

Detect the fan tray installation status.

Speed adjustment The fan speed can be automatically or manually adjusted based

on the ambient temperature, implementing fan speed

adjustment for low-power operating.

Hot swap Online replacement is supported.

Appearance

Figure 1-12 shows a fan tray.





16

Figure 1-12 Fan tray

Indicators

There is an indicator on the panel of a fan tray, showing the fan tray operating status. Table

1-9 describes the indicator on the panel.

Table 1-9 Health indicator on the fan tray

Silk Screen Meaning State State Description

None Health indicator Off The fan monitoring

module is not powered on.

Blinking green Blinking at 0.5 Hz: The

fan tray is operating

properly, and the

communication is

normal.

Blinking at 4 Hz: The


properly, but the

communication is

abnormal.

Steady orange The fan monitoring

module is powered on, but

the hardware is abnormal.

Blinking red at 0.5

Hz

An alarm is generated.





17


Table 1-10 lists the technical specifications of the fan tray.

Table 1-10 Technical specifications of a fan tray

Item Specifications

Mechanical

specificatio

ns

Dimensions (H x W x

D)

124.5 mm x 131.0 mm x 124.7 mm (4.90 in. x

5.16 in. x 4.91 in.)


Electrical

specificatio

ns

Total power inputs Two power inputs are provided by the backplane

in the subrack.

Maximum power

consumption

140 W

Typical power

consumption

20 W

Environme

ntal

specificatio

ns


70°C (32°F to 158°F)


to +158°F)

Noise 66 dBA

1.4 F8002 AC Subrack

Functions

Table 1-11 describes the functions of the F8002 subrack.

Table 1-11 F8002 subrack functions


Power supply Two AC power supply units (PSUs) are configured in 1+1

redundancy mode. Each AC PSU supplies DC power to the

entire subrack through the backplane.

Data transmission The F8002 subrack provides data transmission channels.

Heat dissipation Two fan trays are configured to dissipate heat for the subrack.

Subrack identification Each F8002 subrack has a unique number.

If the subrack number is not set, the subrack number indicators are blinking in sequence. For details

about how to set the subrack number, see Hardware-Specific Modifications.





18

Appearance

Figure 1-13 shows an F8002 subrack.

Figure 1-13 F8002 subrack (unit: mm)

Each F8002 subrack provides six front slots and four rear slots. The front slots are installed

with the multi-function switch units (MXUs) and service boards. The rear slots are installed

with AC PSUs and fan modules. Figure 1-14 shows the slot positions.





19

Figure 1-14 F8002 subrack slot positions

The F8002 subrack provides:

Slots 2 and 5 for MXUs.

Slots 1, 3, 4, and 6 for service boards.

PSU 1 and PSU 2 for AC PSUs.

Fan 1 and Fan 2 for fan trays.

Figure 1-15 shows the front view of an F8002 subrack in full configuration.

Figure 1-15 Front view of an F8002 subrack in full configuration

Figure 1-16 shows the rear view of an F8002 subrack.





20

Figure 1-16 Rear view of an F8002 subrack

Table 1-12 describes the components of the F8002 subrack.

Table 1-12 F8002 subrack components

Component

Quantity

Description

MXU 2 The MXUs implement operation, maintenance, and

management of the system.

Two MXUs are installed in slots 2 and 5 to work in


Service

boards

4 The service boards can be installed in slots 1, 3, 4, and 6. The

service boards in any two slots can be configured in


AC PSU 2 Two AC PSUs are configured in 1+1 redundancy mode. If one

AC PSU is faulty, the power supply to the subrack is not

affected.

Fan tray 2 Two fan trays are configured to perform heat dissipation for

the components in the subrack. Figure 1-17 shows the air

flows.

Heat dissipation of the subrack: The fans draw in cool air

from the front of the subrack and exhaust warm air from the

rear of the subrack.

Heat dissipation of the PSUs: The fans draw in cool air

from the side panels of the subrack and exhaust warm air

from the rear of the subrack.

Ground

point

2 The F8002 subrack provides two ground points.

If the subrack is used in North America, connect both the

ground points. If the subrack is used in other regions, only

connect one of the ground points.

Electrostatic

discharge

(ESD) jack

1 The F8002 subrack provides one ESD jack.





21

Figure 1-17 Heat dissipation in the subrack

Figure 1-18 shows the power supply mode of the F8002 subrack. Each AC PSU supplies

power to all slots and fan trays in the subrack.

Figure 1-18 F8002 subrack power supply mode

Logical Structure

Figure 1-19 shows the logical structure of the F8002 subrack.





22

Figure 1-19 F8002 subrack logical structure

The MXUs implement subrack management and data exchange in the subrack.

The MXUs work in active/standby mode. Only the active MXU executes management

tasks. The MXUs also manage the two fan trays through the RS485 bus and the two AC

PSUs through the Inter-integrated circuit (I2C) bus.

The service data and signaling data from a service board is forwarded in eFabric

channels to the MXUs through the backplane. The MXUs then forward the data to

another service board.

The management data from a service board is forwarded in Base channels to the MXUs

through the backplane. The MXUs then forward the data to another service board.


Table 1-13 lists the boards that can be used in F8002 subracks.

Table 1-13 Types of boards in the F8002 subrack

MXU Type Compatible Service Board Type

Compatibility Rule

MXU SPU

VPU

-


Table 1-14 lists the technical specifications of the F8002 subrack.





23

Table 1-14 F8002 subrack technical specifications

Item Specifications

Mechanical

specificatio

ns

Dimensions (H x W x D) 130.5 mm x 442.0 mm x 675.0 mm (5.14 in. x

17.40 in. x 26.57 in.)

Weight of an empty

subrack 20.8 kg (45.86 lb)

NOTE

An empty subrack is equipped with two fan trays

and two AC PSUs.

Weight of a fully loaded

subrack 47.8 kg (105.38 lb)

NOTE

A fully loaded subrack is equipped with two fan

trays, two AC PSUs, two MXUA0s, and four

SPUA0s.

Power

supply

Rated input voltage AC: 200 V to 240 V

High-voltage DC: 240 V

Maximum input voltage AC: 176 V to 264 V

High-voltage DC: 192 V to 288 V

Total power inputs Two


Power rating 2000 W (The rated power of each AC PSU is

2000 W)

NOTE

The subrack is configured with two AC PSUs in 1+1

redundancy mode.

Environme

ntal

specificatio

ns

Temperature Operating temperature: 0°C to 40°C (32°F

to 104°F)

Storage temperature: -40°C to +70°C

(-40°F to +158°F)

Humidity Long-term operating humidity: 5% RH to


Short-term operating humidity: 5% RH to


Storage humidity: 10% RH to 95% RH

(non-condensing)








24

1.4.1 AC PSU

Functions

Table 1-15 describes the functions of the AC power supply unit (PSU).

Table 1-15 AC PSU functions


Power supply Supports AC and high-voltage DC power inputs, and converts AC

input power into DC output power.

Supplies DC power to devices in the subrack.

Supports current equalization.

Power

distribution

monitoring

Detects the AC PSU installation status, AC PSU type, and power

input.

Provides indicators on the panel to indicate AC PSU status.

Supports queries on input/output voltage and current.

Supports queries on input power and maximum output power.

Supports queries on the electronic label, temperature, and version of

the AC PSUs.

Detects the fan fault of the AC PSUs.

Protection Supports input under-voltage and over-voltage protection.

Supports input overcurrent and short circuit protection.

Supports output overvoltage protection.

Supports output short circuit current restriction protection.

Supports overheat protection.

Prevents incorrect insertion.

Appearance

Figure 1-20 shows a AC PSU.





25

Figure 1-20 AC PSU

Figure 1-21 shows the AC PSU panel.





26

Figure 1-21 AC PSU panel

1. STATUS indicator 2. Fan 3. Handle 4. Cable tie holder

5. Power cable clip slot 6. Power input port 7. Captive screw -

Indicators

Table 1-16 describes the STATUS indicator on the AC PSU panel.

Table 1-16 STATUS indicator on the AC PSU panel

Silk Screen


STATUS Status

indicator

Off There is no power supply.

Steady green The AC PSU is operating properly.

Blinking green

at 0.5 Hz

The AC PSU is in hibernation mode and

is supplying no power.

Blinking green

at 4 Hz

The AC PSU software is being loaded.

Steady red The input voltage is not within the

normal range.

The output voltage is not within the





27

Silk Screen


normal range.

An output overcurrent or short circuit

fault is occurring.

The AC PSU temperature reaches the

threshold.

A AC PSU fan is faulty

The storage devices are faulty.


Table 1-17 lists the technical specifications of the AC PSU.

Table 1-17 AC PSU technical specifications

Item Specifications

Mechanical

specificatio

ns

Dimensions (H x W x

D)

120.0 mm x 79.0 mm x 122.0 mm (4.72 in. x

3.11 in. x 4.80 in.)


Voltage

and current

Rated input voltage AC: 200 V to 240 V

High-voltage DC: 240 V

Maximum input voltage AC: 176 V to 264 V

High-voltage DC: 192 V to 288 V

Rated input current 10 A

Operating frequency AC: 50 Hz/60 Hz

Power input One

Power rating 2000 W

Environme

ntal

specificatio

ns

Temperature Operating temperature: 0°C to 40°C (32°F to

104°F)


to +185°F)

Humidity 5% RH to 95% RH (non-condensing)






28

1.4.2 Fan Tray

Functions

Table 1-18 describes the functions of the fan tray.

Table 1-18 Fan tray functions


Heat dissipation The fan trays draw in cool air from the front of the subrack and

exhaust warm air from the rear of the subrack.

Monitoring Fan monitoring boards are configured for fan trays to:

Provide ports for communicating with the switch boards.

Detect and report the fan operating status and speed values.

Control the health indicators on the fan trays.

Support fan blocking status detection and reports fan

alarms.

Support online software upgrades and log uploads.

Monitor and report the fan temperature.

Detect the fan tray installation status.

Speed adjustment The fan speed can be automatically or manually adjusted based

on the ambient temperature, implementing fan speed

adjustment for low-power operating.

Hot swap Online replacement is supported.

Appearance

Figure 1-22 shows a fan tray.





29

Figure 1-22 Fan tray

Indicators

There is an indicator on the panel of a fan tray, showing the fan tray operating status. Table

1-19 describes the indicator on the panel.

Table 1-19 Health indicator on the fan tray

Silk Screen Meaning State State Description

None Health indicator Off The fan monitoring

module is not powered on.

Blinking green Blinking at 0.5 Hz: The


properly, and the

communication is

normal.

Blinking at 4 Hz: The


properly, but the

communication is

abnormal.

Steady orange The fan monitoring

module is powered on, but

the hardware is abnormal.

Blinking red at 0.5

Hz

An alarm is generated.





30


Table 1-20 lists the technical specifications of the fan tray.

Table 1-20 Technical specifications of a fan tray

Item Specifications

Mechanical

specificatio

ns

Dimensions (H x W x

D)

124.5 mm x 131.0 mm x 124.7 mm (4.90 in. x

5.16 in. x 4.91 in.)


Electrical

specificatio

ns

Total power inputs Two power inputs are provided by the backplane

in the subrack.

Maximum power

consumption

140 W

Typical power

consumption

20 W

Environme

ntal

specificatio

ns


70°C (32°F to 158°F)


to +158°F)

Noise 66 dBA

1.5 F8002 Subrack System Topology Structure

1.5.1 CAN Bus

Functions

The controller area network (CAN) bus performs board power management and transmits

subrack information between the MXUs and service boards. Figure 1-23 shows the CAN bus

connections.





31

Figure 1-23 CAN bus connections

Topology

The bus topology is used for CAN bus connections. The CAN bus works as follows:

The MXUs are the management units, and the service boards are the managed units in

the subrack. The management and managed units communicate with each other.

Each board is connected to the CAN bus through two independent channels. If one

channel is unavailable, the other channel is used to ensure uninterrupted communication.

1.5.2 Base Topology Structure

Functions

The Base plane serves as the management and control plane in the subrack. It provides

channels for loading software and transmitting alarms and maintenance information.

Figure 1-24 shows the Base plane connections.

Figure 1-24 Base plane connections





32

Topology

The dual-star topology is used for Base plane connections. The Base plane works as follows:

The Base plane connects to each service board slot through the backplane.

The Base plane connects to the MXUs in other subracks through the Base port on the

panel to implement cascading.

The Base channel between the two MXUs enhances communication reliability. Service

processing is not affected if one Base channel becomes unavailable for any service

board.

1.5.3 eFabric Topology Structure

Functions

The enhanced Fabric (eFabric) plane transmits service data in the system.

Figure 1-25 shows the eFabric plane connections.

Figure 1-25 eFabric plane connections

Topology

The dual-star topology is used for eFabric plane connections. The eFabric plane works as

follows:

All service boards are connected to the MXUs through the eFabric plane. The MXUs

exchange the service data for service boards.

The eFabric channel between the two MXUs enhances communication reliability.

Service processing is not affected if one eFabric channel becomes unavailable for any

service board.





33

1.6 F8002 Subrack System Monitoring

1.6.1 Power Module Monitoring

The multi-function switch unit (MXU) communicates with the baseboard management

controller (BMC) in the power module over the Inter-Integrated Circuit (I2C) to deliver

monitoring commands and report messages. When detecting an irregular voltage or current,

the BMC in the power module reports an alarm to the MXU. The MXU then forwards the

alarm to the upper-layer network management system (NMS).

Figure 1-26 shows the structure of the power module monitoring system in the F8002

subrack.

Figure 1-26 Structure of the power module monitoring system in the F8002 subrack

The BMCs in power modules communicate with the shelf management modules (SMMs) in

MXUs to implement monitoring of the following information about power modules:

Power module installation status, type and version

Electronic label

Surge protection

Circuit breaker status

Power input

Input/output voltage and current

System power

Temperature

Fan fault of the power modules

1.6.2 Fan Tray Monitoring

The F8002 subrack has built-in fan trays. The fan monitoring module monitors the fan

running status and adjusts the fan speed based on the subrack temperature.

The shelf management modules (SMMs) in the multi-function switch units (MXUs) manage

and monitor the fan trays through the RS485 bus.

Figure 1-27 shows the structure of the fan tray monitoring system in the F8002 subrack.





34

Figure 1-27 Structure of the fan tray monitoring system in the F8002 subrack

The fan tray monitoring system carries out the following functions:

Monitors the fan stall state.

Generates temperature alarms.

Queries the fan speed.

Controls the fan speed.

Detects the fan tray installation status.

Detects the fan tray slot numbers.

1.7 MXU

The multi-function switch units (MXUs) exchange service plane data and provide ports for

eFabric interface cascading.

1.7.1 MXUA0

Functions

Table 1-21 describes the functions of the MXUA0.

Table 1-21 Functions


Operation and maintenance The general processing card (GPC) on the MXUA0

implements subrack configuration and maintenance,

monitors the system status, and performs performance

measurement.

Supports one Intel® Core™ quad-core I7-3615QE

processor with low power consumption.

Provides two double data rate 3 (DDR3) memory

channels, each for installing one 8 GB unbuffered

dual in-line memory module (UDIMM). The board





35


offers a maximum memory capacity of 16 GB.

Supports 1333 MHz or 1600 MHz UDIMMs.

Supports error checking and correction (ECC).

Switching and

management

Network

switching

The MXUA0 implements intra-subrack switching and

inter-subrack expansion on the Base plane and eFabric

plane.

The panel provides two external 1GE Base ports and

two 40GE eFabric ports.

The Base plane provides one 1GE channel for each

service slot.

The eFabric plane provides 80 Gbit/s bandwidth for

each service slot.

There are Base and eFabric plane interconnect

channels between MXUA0s.

Device

manageme

nt

The SMM provides the following device management

functions:

Board management

− Detects the board temperature, voltage, and

power, implements power control, manages board

hot swap and reset, and monitors the operating

and health status.

− Supports out-of-band and remote management.

Subrack management

− Performs power supply monitoring, fan

management, and power distribution

management.

− Communicates with the baseboard management

controllers (BMCs) on service boards to manage

and control the service boards.

Storage Supports one 600 GB 2.5-inch SAS disk.

Hot swap The boards are hot-swappable.

Appearance

The MXUA0s are half-width boards and can be installed in front slots 2 and 5 in the F8002

subrack. Figure 1-28 shows an MXUA0.





36

Figure 1-28 Appearance (unit: mm)

Figure 1-29 shows the hardware structure of the MXUA0.





37

Figure 1-29 Hardware structure

Table 1-22 describes the components of the MXUA0.

Table 1-22 Components

No.

Component

Quantity Description

1 Hard disk 1 One 2.5-inch, 600 GB SAS hard disk is configured before

delivery.

2 Dual

in-line

memory

module

(DIMM)

1 One 8 GB DIMM is used to provide 8 GB memory.





38

No.

Component


3 Cover 1 The metal cover is used to protect the board components

and guide air flows.

Figure 1-30 shows the MXUA0 panel.

Figure 1-30 Panel

1. LAN0 2. LAN1 3. RS232 4. RS485

5. eFabric LAN0 6. eFabric LAN1 7. Subrack number

indicators

8. Base LAN0

9. Base LAN1 10. HLY

indicator

11. ACT indicator 12. Ejector levers

13. OFL

indicator/button

14. DIP button 15. eFabric LAN0/LAN1

indicators

16. HD-ALM

indicator

17. LAN1 LINK

indicator

18. LAN1 ACT

indicator

19. LAN0 LINK

indicator

20. LAN0 ACT

indicator

Interfaces

Figure 1-31 shows the panel ports on the MXUA0. Table 1-23 describes the panel ports.

Figure 1-31 Panel ports





39

Table 1-23 Panel port description

Silk Screen Meaning Port Type Standard

LAN0/LAN1 O&M network port RJ45 10/100/1000BASE-

T

RS232 System

commissioning serial

port

RJ45 RS232

RS485 port Power distribution

monitoring serial

port

RJ45 RS485 port

eFabric

LAN0/LAN1

Cascading port for

the eFabric plane

Quad Small

Form-factor

Pluggable Plus

(QSFP+)

40GBASE-SR4

Base LAN0/LAN1 Cascading port of

the Base plane

RJ45 10/100/1000BASE-

T

Indicators

Figure 1-32 shows the indicators and buttons on the MXUA0. Table 1-24 describes the

indicators and buttons.

Figure 1-32 Indicators and buttons

Table 1-24 Description of indicators and buttons

Silk Screen

Meaning

State State Description

HLY

Health

indicat

or

Off The board is not powered on.

Steady green The board is operating properly.

Blinking red An alarm is generated. The blinking frequency

indicates the alarm severity:





40

Silk Screen

Meaning


Blinking at 0.5 Hz: indicates a minor alarm.

Blinking at 1 Hz: indicates a major alarm.

Blinking at 4 Hz: indicates a critical alarm.

ACT

Active/

Standb

y

indicat

or

Off The SMM is in standby mode.

Green The SMM is in active mode.

HD-

ALM

Hard

disk

fault

indicat

or

Off The hard disk is operating properly.

Red The hard disk is faulty.

OFL

Offline

indicat

or

Off The GPC is operating properly.

Blinking blue The GPC is sending a request for power-on or

power-off, or the GPC is being powered on or off.

Steady blue The GPC is powered off. You can remove the board

at the time.

Offline

button -

To power on the GPC, hold down this button for

more than 0.5 seconds.

To safely power off the GPC, hold down this

button for 6 seconds until the OFL indicator is

blinking blue. When the OFL indicator is blinking

blue, the GPC is in the graceful power-off state.

When the OFL indicator is steady blue, the GPC

is powered off.

To forcibly power off the GPC, hold down this

button for 6 seconds when the GPC is in the

graceful power-off state.

DIP

indic

ator/

Subr

ack

numb

er

indic

ators

Button/

Indicat

ors for

setting

a

subrack

number

Off An indicator in the off state stands for the binary digit

0.

Blinking green

at 2 Hz

If indicators L to H are blinking at 2 Hz in sequence,

the indicators are in test mode. The indicators are in

test mode when:

The DIP button is pressed.

The subrack number is not obtained after the

board is powered on or reset.

Blinking green

at 4 Hz

If indicators H to L are blinking at 4 Hz, the subrack

number 0 is being set. After the subrack number is set

to 0, the indicators turn off.

Blinking green

at 1 Hz

If indicators H to L are blinking at 1 Hz, the subrack

number is being set to a number between 1 and 7.





41

Silk Screen

Meaning


Steady green

An indicator in the on state stands for the binary digit

1.

To set the subrack number, hold down the DIP button

for 6 seconds until the indicators enter the setting

mode, press the DIP button to set the subrack

number, and then hold down the DIP button for 6

seconds to complete the setting.

Binary numbers 000 to 111 indicate subrack numbers

0 to 7 respectively.

NOTE

The subrack number can be set only on the active SMM.

The standby SMM only supports indicator test mode.

If you do not press the DIP button within 30 seconds after

the indicators enter the setting mode, the indicators exit

the setting mode without saving the settings.

Each time you press the DIP button, the subrack number

increases by 1. The subrack number restarts from 0 after

it passes 7.

ACT

Networ

k port

indicat

or

Off The port is not sending or receiving data.

Blinking yellow The port is sending or receiving data.

LIN

K

Networ

k port

indicat

or

Green The link is connected.

Off The link is faulty or disconnected.

eFabr

ic

LAN

0/LA

N1

Indicat

or of

the

cascadi

ng port

of the

eFabric

plane

Off The link is faulty or disconnected.

Steady green The link is connected.

Blinking green The port is sending or receiving data.

Base

LAN

0/LA

N1

Indicat

or of

the

cascadi

ng port

of the

Base

plane

Green off The link is faulty or disconnected.

Steady green The link is connected.

Yellow off The port is not sending or receiving data.

Blinking yellow The port is sending or receiving data.

In the cascading environment, if the MXUA0 GPC in the slave subrack is isolated, the GPC is powered

off, the OFL indicator is off, and the OFL button is unavailable.





42

Logical Structure

Figure 1-33 shows the logical structure of the MXUA0.

Figure 1-33 Logical structure

The MXUA0 panel provides the following ports:

Two GE ports

One serial port for system commissioning

One serial port for PDB monitoring

Two ports for eFabric plane cascading

Two ports for Base plane cascading

The GPC implements configuration and maintenance, monitors system status, and collects

performance statistics. It also provides two GE ports for O&M.

The SMM monitors the MXUA0 and the BMCs on service boards, and performs subrack

management.

Fabric LAN implements the eFabric network switching.

Base LAN implements the Base network switching.





43

The power module supplies power to the components on the MXUA0.


Table 1-25 lists hardware and software compatibility of the MXUA0.

Table 1-25 Hardware and software compatibility

Board Model Spare Parts Model Compatibility Rule

MXUA0 MXUA0 Only a board of the same

model can be used to

replace the MXUA0.

You do not need to

manually upgrade software.

Technical Specifications Network switching performance specifications

Table 1-26 lists the network switching performance specifications of the MXUA0.

Table 1-26 Network switching performance specifications

Item Specifications

Description

Number of

Base plane

ports

11 Four GE ports connected to the service boards in the

subrack through the backplane

One GE port connected to the GPC of the MXU

One GE port connected to the GPC of the other MXU in

the subrack through the backplane

One GE port connected to the CPU of the MXU

One GE port connected to the CPU of the other MXU in

the subrack through the backplane

Two GE ports provided on the front panel for Base

plane cascading

One 10GE port for interconnection with the Base plane

of the other MXU, implementing Base plane

redundancy. This port is disabled by default.

Number of

eFabric

plane ports

20 Sixteen 20GE ports connected to the four service boards

in the subrack through the backplane (a maximum of

four 20GE ports for each service board)

Two 40 GE ports connected to the eFabric plane of the

other MXU, implementing eFabric plane redundancy.

Of the two ports, one is reserved for future use and

another is disabled by default.

Two 40GE ports on the front panel for eFabric plane

cascading





44

Item Specifications

Description

Port rate GE/10GE

line speed for

the Base

plane

The Base plane supports full line-speed switching.

The cascading ports support 10/100/1000 BASE-T

auto-negotiation.

The service ports support 1000 BASE-X.

The interconnection ports support 10G XAUI.

20GE/40GE

line speed for

the eFabric

plane

The eFabric plane supports full line-speed switching.

The cascading ports support 40G QSFP+.

The service ports support 20G DXAUI.

The interconnection ports support 40G XLG.

Switching

capability

44 Gbit/s for

the Base

plane

Full duplex mode

480 Gbit/s for

the eFabric

plane

Full duplex mode

Number of

MAC

addresses

32768 The ports support automatic learning of MAC addresses.

The MAC address table can contain a maximum of 32,768

MAC addresses.

Number of

VLANs

4094 The VLANs comply with the 802.1Q standard.

Port binding 8 Port binding complies with the 802.3AD standard. A

maximum of eight ports with the same rate can be bound.


Table 1-27 lists the technical specifications of the MXUA0.

Table 1-27 Technical specifications

Item Specifications

Mechanical

specifications

Dimensions (H x

W x D)

35.1 mm x 205.0 mm x 531.0 mm (1.38 in. x 8.07

in. x 20.91 in.)


Electrical

specifications

Maximum

power

consumption

146 W

Typical power

consumption

125 W

Power supply Two redundant -48 V DC inputs (provided by the

backplane)





45

Item Specifications

Environmental

specifications

Temperature Long-term operating temperature: 0°C to 45°C

(32°F to 113°F)


+55°C (23°F to 131°F)

Storage temperature: -40°C to +70°C (-40°F to

+158°F)

Temperature change rate: 15°C/h (27°F/h)

Humidity Long-term operating humidity: 5% RH to 85%

RH (non-condensing)

Short-term operating humidity: 5% RH to 95%

RH (non-condensing)



1.8 SPU

The service processing units (SPUs) implement service processing and board management.

1.8.1 SPUA0

Functions

Table 1-28 describes functions of the SPUA0.



Service

processing

Uses one Intel® Xeon® full-power, 8-core Sandy Bridge-EP CPU.

Provides four double data rate 3 (DDR3) memory channels, each for

installing one 16 GB registered dual in-line memory module

(RDIMM). The board offers with the maximum memory capacity of

64 GB.

Supports 800 MHz, 1066 MHz, and 1333 MHz RDIMMs.


Interfacing Provides two 1GE Base ports for communicating with Base planes of

multi-function switch units (MXUs) through the backplane.

Provides two 20GE Fabric ports for communicating with Fabric

planes of MXUs through the backplane.

Provides two 20GE Update interfaces for communicating with the

switching planes through the backplane.

Provides four enhanced small form-factor pluggable (SFP+) ports





46


and four SFP ports on the panel.

Management Provides an independently powered baseboard management controller

(BMC). The BMC connects to the SMM through the Network Controller

Sideband Interface (NC-SI) bus. The BMC provides the following

functions:

Manages the field replaceable unit (FRU) information, sensor data

records (SDRs), and system event logs (SELs).

Detects the board temperature and voltage, reports alarms, and

controls the power-on, power-off, hot swap, and reset operations of

the board.

Supports serial port redirection.

Loads board software online.


Appearance

The SPUA0s are half-width boards and installed in the front service board slots of the subrack.

Figure 1-34 shows an SPUA0.


Figure 1-35 shows the hardware structure of the SPUA0.





47


Table 1-29 describes the components of the SPUA0.


No. Component


1 BMC 1 The BMC, a processing module independent from

the CPU, implements board management and





48

No. Component


provides system interfaces, General Purpose

Input/Output (GPIO), serial ports, and

Inter-Integrated Circuit (I2C) bus.

2 CPU 1 The board uses one Intel® Xeon® full-power, 8-core

Sandy Bridge-EP CPU.

3 Heat sink 1 The heat sink is used to cool the CPU.

4 Cover 1 The metal cover is used to protect the components

on the board and guide air flows.

5 RDIMM 3 Three 16 GB RDIMMs are used to provide 48 GB

memory.

NOTE

The RDIMMs are installed close to CPU0. The three

RDIMMs are installed in sockets J45, J46, and J7, as

shown in Figure 1-35.

6 Solid-state

drive (SSD)

1 The SSD stores the operating system (OS) and field

programmable gate array (FPGA) files.

Figure 1-36 shows the board panel.

Figure 1-36 Panel

1. SFP+ ports 2. Optical port indicators 3. SFP ports 4. UID indicator

5. HLY indicator 6. Ejector levers 7. OFL indicator/button -

Interfaces

Figure 1-37 shows the panel ports on the board. Table 1-30 describes the panel ports.





49


Table 1-30 Port description

Silkscreen Meaning Type Standard

port 0 10GE or 1GE

optical port or

electrical port

SFP+

NOTE

The ports can be set

to the

auto-negotiation or

forced mode.

10G BASE-R

port 1 10GE or 1GE

optical port

port 2 10GE or 1GE

optical port or

electrical port

port 3 10GE or 1GE

optical port

port 4 1GE optical port or

electrical port

SFP

NOTE


to the

auto-negotiation or

forced mode.

1000 BASE-T

port 5 1GE optical port


electrical port


Indicators

Figure 1-38 shows the indicators and buttons on the board. Table 1-31 describes the indicators

and buttons.





50



Silk Screen

Meaning


HLY Health

indicator


Steady

green The board is operating properly.

Blinki

ng red

An alarm is generated. The blinking frequency indicates

the alarm severity:




UID Location

indicator

Off

The indicator is used to locate a device to be operated.

You can customize the function of this indicator.

Steady

green

Blinki

ng

green

OFL

Offline

indicator

Off The board is operating properly.

Blinki

ng

blue

The board is sending a request for power-on or power-off,

or the board is being powered on or off.

Steady

blue

The board is powered off. You can remove the board at the

time.

Offline

button -

To power on the board, hold down this button for more

than 0.5 seconds.

To safely power off the board, hold down this button

for 6 seconds until the OFL indicator is blinking blue.

When the OFL indicator is blinking blue, the board is

in the graceful power-off state. When the OFL

indicator is steady blue, the board is powered off.





51

Silk Screen

Meaning


To forcibly power off the board, hold down this button

for 6 seconds when the board is in the graceful

power-off state.

0 to 7

Optical

port

indicator

s

Green

off The link is faulty or disconnected.

Steady

green The link is normal.

Yello

w off The port is not sending or receiving data.

Blinki

ng

yellow

The port is sending or receiving data.

Logical Structure

Figure 1-39 shows the logical structure of the board.


The modules of the board provide the following functions:

The expedited forwarding (EF) module on the access side provides four SFP+ and four SFP ports on the panel.





52

The processing module forwards service data and implements data encryption and

decryption.

The EF module on the backplane side provides the Update , Base, and Fabric channels to

communicate with the switch modules.

The BMC module implements board management and interacts with the backplane

through the CAN bus.

The power module supplies power to the function modules of the board.


Table 1-32 lists hardware and software compatibility of the SPUA0.



SPUA0 SPUA0 Only a board of the same


replace the SPUA0.

You do not need to



Table 1-33 lists the technical specifications of the SPUA0.


Item Specifications

Mechanical

specifications

Dimensions (H x

W x D)

45.2 mm x 205.0 mm x 531.0 mm (1.78 in. x 8.07

in. x 20.91 in.)


Electrical

specifications

Maximum

power

consumption

190 W

Typical power

consumption

175 W

Power supply Two -48 V DC power supplies (provided by the

backplane)

Environmental

specifications


(32°F to 113°F)


+55°C (23°F to 131°F)


+158°F)






53

Item Specifications


RH (non-condensing)


RH (non-condensing)



1.8.2 SPUA1

Functions

Table 1-34 describes functions of the SPUA1.



Service

processing

Uses two Intel® Xeon® full-power, 8-core Sandy Bridge-EP CPUs.

Supports two QuickPath Interconnect (QPI) ports, with the

maximum data transmission rate of 8.0 GT/s.

Provides eight double data rate 3 (DDR3) memory channels, each

for installing one 16 GB registered dual in-line memory module


128 GB.



Interfacing Provides two 1GE Base ports for communicating with Base planes

of multi-function switch units (MXUs) through the backplane.



Provides two 20GE Update ports to the backplane for

communicating with the switching planes.




(BMC). The BMC connects to the SMM through the Network

Controller Sideband Interface (NC-SI) bus. The BMC provides the

following functions:





the board.





54





Appearance

The SPUA1s are half-width boards and installed in the front service board slots of the subrack.

Figure 1-40 shows an SPUA1.


Figure 1-41 shows the hardware structure of the SPUA1.





55


Table 1-35 describes the components of the SPUA1.


No. Component



the CPUs, implements board management and





56

No. Component





2 Encryption

and

decryption

daughter

board

1 This board performs data encryption and

decryption.

3 CPU 2 Intel ® Xeon® full-power, 8-core Sandy Bridge-EP

CPU

4 Heat sink 1 The heat sink is used to cool CPUs. Two CPUs

share one heat sink.



6 RDIMM 6 Six 16 GB RDIMMs are used to provide 96 GB

memory.

NOTE

The RDIMMs are installed close to the CPUs. The six

RDIMMs are installed in sockets J45, J46, J47, J48, J7

and J8, as shown in Figure 1-41.

7 Solid-state

drive (SSD)




Figure 1-42 Panel







57

Interfaces





port 0 10GE or 1GE

optical port or

electrical port

SFP+

NOTE


to the

auto-negotiation or

forced mode.

10G BASE-R

port 1 10GE or 1GE

optical port

port 2 10GE or 1GE

optical port or

electrical port

port 3 10GE or 1GE

optical port


electrical port

SFP

NOTE


to the

auto-negotiation or

forced mode.

1000 BASE-T



electrical port


Indicators


and buttons.





58



Silk Screen

Meaning


HLY Health

indicator


Steady


Blinki

ng red


the alarm severity:




UID Location

indicator

Off



Steady

green

Blinki

ng

green

OFL

Offline

indicator


Blinki

ng

blue



Steady

blue


time.

Offline

button -


than 0.5 seconds.










59

Silk Screen

Meaning




power-off state.

0 to 7

Optical

port

indicator

s

Green


Steady


Yello


Blinki

ng

yellow


Logical Structure









60


decryption.







Table 1-38 lists hardware and software compatibility of the SPUA1.



SPUA1 SPUA1 Only a board of the same


replace the SPUA1.

You do not need to



Table 1-39 lists the technical specifications of the SPUA1.


Item Specifications

Mechanical

specifications

Dimensions (H x

W x D)

45.2 mm x 205.0 mm x 531.0 mm (1.78 in. x 8.07

in. x 20.91 in.)


Electrical

specifications

Maximum

power

275 W

Typical power 240 W


backplane)

Environmental

specifications


(32°F to 113°F)


+55°C (23°F to 131°F)


+158°F)







61

Item Specifications

RH (non-condensing)


RH (non-condensing)



1.8.3 SPUZ0

Functions

Table 1-40 describes functions of the SPUZ0.



Service

processing

Uses one Intel® Xeon® full-power, 8-core Sandy Bridge-EP CPU.

Provides four double data rate 3 (DDR3) memory channels, each for



64 GB.



Interfacing Provides two 1GE Base ports for communicating with Base planes of




Provides two 20GE Update interfaces for communicating with the

switching planes through the backplane.






functions:





the board.








62

Appearance

The SPUZ0s are half-width boards and installed in the front service board slots of the subrack.

Figure 1-46 shows an SPUZ0.


Figure 1-47 shows the hardware structure of the SPUZ0.





63


Table 1-41 describes the components of the SPUZ0.


No. Component



the CPU, implements board management and





64

No. Component






Sandy Bridge-EP CPU.




5 RDIMM 3 Three 16 GB RDIMMs are used to provide 48 GB

memory.

NOTE

The RDIMMs are installed close to CPU0. The three

RDIMMs are installed in sockets J45, J46, and J7, as

shown in Figure 1-47.

6 Solid-state

drive (SSD)




Figure 1-48 Panel



Interfaces






65




port 0 10GE or 1GE

optical port or

electrical port

SFP+

NOTE


to the

auto-negotiation or

forced mode.

10G BASE-R

port 1 10GE or 1GE

optical port

port 2 10GE or 1GE

optical port or

electrical port

port 3 10GE or 1GE

optical port


electrical port

SFP

NOTE


to the

auto-negotiation or

forced mode.

1000 BASE-T



electrical port


Indicators


and buttons.





66



Silk Screen

Meaning


HLY Health

indicator


Steady


Blinki

ng red


the alarm severity:




UID Location

indicator

Off



Steady

green

Blinki

ng

green

OFL

Offline

indicator


Blinki

ng

blue



Steady

blue


time.

Offline

button -


than 0.5 seconds.










67

Silk Screen

Meaning




power-off state.

0 to 7

Optical

port

indicator

s

Green


Steady


Yello


Blinki

ng

yellow


Logical Structure

Figure 1-51 shows the logical structure of the SPUZ0.








68


decryption.







Table 1-44 lists hardware and software compatibility of the SPUZ0.



SPUZ0 SPUZ0 Only a board of the same


replace the SPUZ0 board.

You do not need to



Table 1-45 lists the technical specifications of the SPUZ0.


Item Specifications

Mechanical

specifications

Dimensions (H x

W x D)

45.2 mm x 205.0 mm x 531.0 mm (1.78 in. x 8.07

in. x 20.91 in.)


Electrical

specifications

Maximum

power

consumption

190 W

Typical power

consumption

175 W


backplane)

Environmental

specifications


(32°F to 113°F)


+55°C (23°F to 131°F)


+158°F)






69

Item Specifications


RH (non-condensing)


RH (non-condensing)



1.9 VPU

The voice and video process unit (VPU) processes media data, including voice and video

data.

1.9.1 VPUA0

Functions

Table 1-46 describes the functions of the VPUA0.



Processing

function

Uses one Intel ® Xeon ® full-power, 6-core Ivy Bridge-EN CPU.

Provides two double data rate 3 (DDR3) memory channels, each for


(RDIMM). The board offers The maximum memory capacity is 32

GB.



Ports Provides two 1GE Base ports for communicating with Base planes of




Provides two 10GE enhanced small form-factor pluggable (SFP+)

optical ports and two GE SFP optical or electrical ports. These four

ports are reserved.

Management

function

Provides an independently powered baseboard management controller



functions:








70



the board.



Provides a loading interface for board testing.


Appearance

The VPUA0s are half-width boards and installed in the front service board slots of the

subrack. Figure 1-52 shows a VPUA0.


Figure 1-53 shows the hardware structure of the VPUA0.





71


Table 1-47 describes the components of the VPUA0.


No. Component


1 Solid-state

drive (SSD)



2 Baseboard

managemen

t controller

(BMC)

1 The BMC, a processing module independent of the

CPU, implements board management and provides

interfaces and buses, such as system interfaces,

General Purpose Input/Output (GPIO), serial ports,

and Inter-Integrated Circuit (I2C) bus.


Ivy Bridge-EN CPU.







72

No. Component



6 Memory 2 Two 16 GB RDIMMs are used to provide 32 GB

memory.

7 Digital

signal

processing

(DSP)

daughter

board

1 The DSP daughter board processes voice and video

data.


Figure 1-54 Panel

1. SFP+ optical port 2. Optical port indicators 3. SFP port

4. UID indicator 5. HLY indicator 6. Ejector levers

7. OFL indicator/button 8. SFP port 9. SFP+ optical port

Interfaces






73




PORT (0 and 1) 10GE media port SFP+ 10G BASE-R

PORT (2 and 3) 1GE

signaling/Network

File Server (NFS)

interface

SFP 1000 BASE-X

Indicators


and buttons.






74


Silk Screen

Meaning


HLY Health

indicator


Steady


Blinki

ng red


the alarm severity:




UID Location

indicator

Off



Steady

green

Blinki

ng

green

OFL

Offline

indicator


Blinki

ng

blue



Steady

blue

The board is powered off. The board can be removed at

the time.

Offline

button -

To power off the board, hold down this button for 6

seconds until the indicator is blinking blue. When the

OFL indicator is blinking blue, the board is in the

graceful power-off state. When the OFL indicator is

steady blue, the board is powered off.



power-off state.


than 0.5 seconds.

0 to 3

Optical

port

indicator

s

Off The link is disconnected or faulty.

Steady

green The link is connected.


Blinki

ng

yellow






75

Logical Structure




The service interface converter implements conversion between optical data service

interfaces and media data service interfaces or data service interfaces on the backplane.

The configuration and control planes configure conversion module chips on the service

interface and exchange control plane information with the switch modules.

The DSP daughter board processes the media data, such as the voice and video data.





Table 1-50 lists hardware and software compatibility of the VPUA0.



VPUA0 VPUA0 Only a board of the same





76



replace the VPUA0.

You do not need to



Table 1-51 lists the technical specifications of the VPUA0.


Item Specifications

Mechanical

specifications

Dimensions (H x

W x D)

45.2 mm x 205.0 mm x 531.0 mm (1.78 in. x 8.07

in. x 20.91 in.)


Electrical

specifications

Maximum

power

consumption

200 W

Typical power

consumption

185 W


backplane)

Environmental

specifications


(32°F to 113°F)


+55°C (23°F to 131°F)


+158°F)



RH (non-condensing)


RH (non-condensing)







77

1.9.2 VPUA1

Functions

Table 1-52 describes the functions of the VPUA1.



Processing

function

Uses one Intel ® Xeon ® full-power, 6-core Ivy Bridge-EN CPU.

Provides two double data rate 3 (DDR3) memory channels, each for


(RDIMM). The board offers The maximum memory capacity is 32

GB.



Ports Provides two 1GE Base ports for communicating with Base planes of




Provides two 10GE enhanced small form-factor pluggable (SFP+)

optical ports and two GE SFP optical or electrical ports. These four

ports are reserved.

Management

function

Provides an independently powered baseboard management controller



functions:





the board.



Provides a loading interface for board testing.


Appearance

The VPUA1s are half-width boards and installed in the front service board slots of the

subrack. Figure 1-58 shows a VPUA1 board.





78


Figure 1-59 shows the hardware structure of the VPUA1.





79


Table 1-53 describes the components of the VPUA1.


No. Component


1 Digital

signal

processing

(DSP)

daughter

board

2 The DSP daughter board processes voice and video

data.

2 Solid-state

drive (SSD)



3 BMC 1 The BMC, a processing module independent of the

CPU, implements board management and provides

interfaces and buses, such as system interfaces,

General Purpose Input/Output (GPIO), serial ports, and Inter-Integrated Circuit (I2C) bus.





80

No. Component



Ivy Bridge-EN CPU.




7 Memory 2 Two 16 GB RDIMMs are used to provide 32 GB

memory.


Figure 1-60 Panel

1. SFP+ optical port 2. Optical port indicators 3. SFP port

4. UID indicator 5. HLY indicator 6. Ejector levers

7. OFL indicator/button 8. SFP port 9. SFP+ optical port

Interfaces






81




PORT (0 and 1) 10GE media port SFP+ 10G BASE-R

PORT (2 and 3) 1GE

signaling/Network

File Server (NFS)

interface

SFP 1000 BASE-X

Indicators


and buttons.






82


Silk Screen

Meaning


HLY Health

indicator


Steady


Blinki

ng red


the alarm severity:




UID Location

indicator

Off



Steady

green

Blinki

ng

green

OFL

Offline

indicator


Blinki

ng

blue



Steady

blue

The board is powered off. The board can be removed at

the time.

Offline

button -

To power off the board, hold down this button for 6

seconds until the indicator is blinking blue. When the

OFL indicator is blinking blue, the board is in the

graceful power-off state. When the OFL indicator is

steady blue, the board is powered off.



power-off state.


than 0.5 seconds.

0 to 3

Optical

port

indicator

s

Off The link is disconnected or faulty.

Steady

green The link is connected.


Blinki

ng

yellow






83

Logical Structure




The service interface converter implements conversion between optical data service

interfaces and media data service interfaces or data service interfaces on the backplane.

The configuration and control planes configure conversion module chips on the service

interface and exchange control plane information with the switch modules.

The two DSP daughter boards process the media data, such as the voice and video data.



The PSU supplies power to the function modules of the board.


Table 1-56 lists hardware and software compatibility of the VPUA1.



VPUA1 VPUA1 Only a board of the same





84



replace the VPUA1.

You do not need to



Table 1-57 lists the technical specifications of the VPUA1.


Item Specifications

Mechanical

specifications

Dimensions (H x

W x D)

45.2 mm x 205.0 mm x 531.0 mm (1.78 in. x 8.07

in. x 20.91 in.)


Electrical

specifications

Maximum

power

consumption

310 W

Typical power

consumption

290 W


backplane)

Environmental

specifications


(32°F to 113°F)


+55°C (23°F to 131°F)


+158°F)



RH (non-condensing)


RH (non-condensing)







85

1.10 Filler Panel

Functions

Filler panels are installed in vacant slots to prevent dust and air from entering the subrack.

Appearance

Filler panels can be classified into:

Filler panels for half-width service boards

Figure 1-64 shows a filler panel installed in the vacant slot for a half-width service

board.

Figure 1-64 Filler panel for a half-width service board (unit: mm)

Interfaces

Filler panels provide no port.

Indicators

There is no indicator on filler panels.


Table 1-58 lists the technical specifications of filler panels for half-width service boards.

Table 1-58 Technical specifications of filler panels for half-width service boards

Item Specifications

Mechanical

specifications

Dimensions (H x

W x D)

45.2 mm x 215.0 mm x 120.0 mm (1.78 in. x 8.46

in. x 4.72 in.)





86

Item Specifications



Hardware Description 2 Other Accessories



87

2 Other Accessories

About This Chapter

2.1 Alarm Box

2.2 Optical Module

2.3 Electrical Module

2.1 Alarm Box

Functions

The alarm box is used to receive alarm information and provide audio and visual alarms.

The universal alarm box adopts a box structure. It features advanced technology, appropriate

layout, and high operability, serviceability, and security. The alarm box is generally mounted

on the wall in the maintenance and monitoring room.

Exterior

The front panel of the alarm box provides the following components: alarm sound indicator,

alarm severity indicator, serial interface communication status indicator, speaker, alarm

confirm button, alarm sound turnoff button, and alarm sound turnoff indicator. Figure 2-1

shows the front panel of the alarm box.





88

Figure 2-1 Front panel of the alarm box

1. Critical alarm indicator 2. Major alarm indicator 3. Minor alarm indicator

4. Warning alarm indicator 5. Speaker 6. Alarm confirm button

7. Serial communication status

indicator

8. Alarm sound turnoff

button

9. Alarm sound turnoff

indicator

Interfaces

The side panel of the alarm box provides the following components: AC power connector,

power switch, remote speaker interface, indicator test button, and lock. Figure 2-2 shows the

side panel of the alarm box.





89

Figure 2-2 Side panel of the alarm box

1. Lock 2. Indicator test button 3. Remote speaker interface

4. Power switch 5. AC power socket 6. Communication interface

7. -48 V power input interface - -

Indicators

You can use the indicator test button to test all the indicators. On pressing the button, all the

indicators, such as the alarm indicators, alarm sound indicators, and serial interface

communication indicator, are turned on. To turn off the indicators, press the button again.

Except the critical alarm, the alarm sound of the major, minor, and warning alarms cannot be

turned on or off by using the alarm sound turnoff button. There are four alarm sound turnoff

indicators on the alarm box. They are EMERGENCY, IMPORTANT, ORDINARY,

PROMPTING, corresponding to the critical alarm, major alarm, minor alarm, and warning

alarm respectively.

The status of the alarm indicator is as follows:

If an indicator is on, it indicates that the alarm sound of the corresponding severity is

turned off. The alarm box does not generate alarm sound if an alarm of the

corresponding severity is reported.

If an indicator is off, it indicates that the alarm sound of the corresponding severity is

turned on. The alarm box generates alarm sound if an alarm of the corresponding

severity is reported.





90

As the alarm sound of the critical alarm cannot be turned off, the critical alarm indicator is always off.

You can turn off the alarm sound for the alarms of different levels by pressing the alarm sound

turnoff button. This function, however, does not affect the state of the alarm severity indicator.

Table 2-1 describes the methods used to stop the alarm sound.

Table 2-1 Methods used to stop the alarm sound

State of the Alarm Sound Turnoff Indicator

Pressing the Alarm Sound Turnoff Button

Alarm Sound

The four indicators are

always off.

No operation is required. The alarm sound is enabled

for all alarms.

The alarm sound turnoff

indicator for the warning

alarm is on and other

indicators are off.

Press the alarm sound

turnoff button once.

The alarm sound for the

warning alarms is disabled.


indicators for the warning

alarm and minor alarms are

on and other indicators are

off.


turnoff button twice.


warning and minor alarms is

disabled.


indicators for the warning,

minor, major alarms are on

and that for the critical

alarm is off.


turnoff button for three

consecutive times.


warning, minor, and major

alarms is disabled.

The four indicators are

always off.


turnoff button for four

consecutive times.

The alarm sound for all

alarms is enabled.


Table 2-2 lists the technical specifications of the alarm box.

Table 2-2 Technical specifications of the alarm box

Category

Item Specifications

Mechanic

al

specificat

ions

Dimensions (W x H x D) 412 mm x 282 mm x 90 mm (16.22 in. x 11.10

in. x 3.54 in.)


Environ

mental

paramete

rs

Working environment Indoor

Temperature 0°C to 45°C (32°F to 113°F)

Relative humidity 10% RH to 95% RH





91

Category

Item Specifications

System

configura

tion

paramete

rs

Power supply DC: -48 V to -60 V/0.5 A

AC: 100 V/50 Hz/0.3 A to 240 V/50 Hz/0.3 A

RS422 communication

distance

100 m (328.08 ft)

RS232 communication

distance 80 m (262.46 ft)

Maximum number of

communication interfaces

5

Maximum remote alarm

confirm distance

30 m (98.42 ft)

Maximum distance of the

remote speaker (1W active

speaker)

30 m (98.42 ft)

2.2 Optical Module

Functions

An optical module provides optical-to-electrical and electrical-to-optical conversion functions.

It is connected to an optical fiber to transmit signals.

Appearance

Optical modules can be classified into the following types by encapsulation type: small

form-factor pluggable (SFP), enhanced SFP (eSFP), small form-factor pluggable plus (SFP+),

10-GB small form-factor pluggable transceiver (XFP), and quad small form-factor pluggable

plus (QSFP+). The optical module appearance varies according to the encapsulation type.

Figure 2-3 shows an SFP/SFP+ optical module. Figure 2-4 shows a QSFP+ optical module.





92

Figure 2-3 SFP/SFP+ optical module

Figure 2-4 QSFP+ optical module

Figure 2-5 shows the structure of an optical module.





93

Figure 2-5 Optical module structure

1. Dust-proof cap 2. Transmit port 3. Spring

4. Label 5. Connector 6. Shell

7. Receive port 8. Handle -

Optical modules of the same encapsulation type may differ in the transmission rate,

transmission distance, and operating wavelength.

The transmission rate can be 1.25 Gbit/s, 10.3125 Gbit/s, or 41.25 Gbit/s.

The operating wavelength can be 850 nm, 1310 nm, or 1550 nm.

The transmission distance can be 550 m, 15 km, 40 km, 80 km, or 120 km.

The transmission distance of an optical module depends on the operating wavelength. Table

2-3 lists the mapping between the operating wavelength and the transmission distance.

Table 2-3 Mapping between the operating wavelength and the transmission distance

Operating Wavelength Transmission Distance

850 nm ≤ 500 m

1310 nm ≤ 40 km

1550 nm > 40 km or even to 120 km without any

relay

The label on an optical module specifies its transmission rate, operating wavelength,

transmission distance, transmission mode, and encapsulation type. Figure 2-6 shows the label

on an optical module.





94

Figure 2-6 Label on an optical module


Table 2-4 shows the technical specifications of optical modules.

Table 2-4 Technical specifications of optical modules

Model Transmission Rate (Gbit/s)

Transmission Distance (km)

Transmission Mode

Optical Fiber Type

Optical Port Parameters

Encapsulation Type

Operating Temperature

OMXD3

0008

41.25 ≤ 0.15 Multimo

de

Optica

l

conne

ctor

type:

MPO

Optica

l fiber

type:

multi

mode

Operating

wavelength

: 850 nm

Transmit

optical

power:

–7.3 dBm

to –1.0

dBm

Extinction

ratio: ≥ 3.0

dB

Receiver

sensitivity:

≤ -9.5 dBm

Overload

optical

power: 2.4

dBm

QS

FP+

0°C–70°C

(32°F–15

8°F)

eSFP-85

0nm-100

2.125

(multira≤ 0.50 Multimo

de

Optica

l

Operating

wavelength

eSF

P

–20°C to

+85°C





95



Transmission Mode

Optical Fiber Type


Encapsulation Type


0Base-S

x/FC200

MM

te) conne

ctor

type:

LC

Optica

l fiber

type:

multi

mode

: 850 nm

Transmit

optical

power:

–9.5 dBm

to –2.5

dBm

Extinction

ratio: ≥ 9.0

dB

Receiver

sensitivity:

≤ -17.0

dBm

Overload

optical

power: 0

dBm

(–4°F to

+185°F)

eSFP-13

10nm-10

00Base-

Lx SM

1.25 ≤

10.00

Single-

mode

Optica

l

conne

ctor

type:

LC

Optica

l fiber

type:

single

-mode

Operating

wavelength

: 1310 nm

Transmit

optical

power:

–9.0 dBm

to –3.0

dBm

Extinction

ratio: ≥ 9.0

dB

Receiver

sensitivity:

≤ -20.0

dBm

Overload

optical

power: -3.0

dBm

eSF

P

0°C–70°C

(32°F–15

8°F)

eSFP-13

10nm-10

00Base-

Vx

1.25 ≤

40.00

Single-

mode

Optica

l

conne

ctor

type:

LC

Operating

wavelength

: 1310 nm

Transmit

optical power:

eSF

P

0°C–70°C

(32°F–15

8°F)





96



Transmission Mode

Optical Fiber Type


Encapsulation Type


Optica

l fiber

type:

single

-mode

–5.0 dBm

to 0 dBm

Extinction

ratio: ≥ 9.0

dB

Receiver

sensitivity:

≤ -23.0

dBm

Overload

optical

power: -3.0

dBm

eSFP-15

50nm-10

00Base-

Zx/FC10

0

1.25 ≤

80.00

Single-

mode

Optica

l

conne

ctor

type:

LC

Optica

l fiber

type:

single

-mode

Operating

wavelength

: 1550 nm

Transmit

optical

power:

–2.0 dBm

to +5.0

dBm

Extinction

ratio: ≥ 9.0

dB

Receiver

sensitivity:

≤ -23.0

dBm

Overload

optical

power: -3.0

dBm

eSF

P

0°C–70°C

(32°F–15

8°F)

OMXD3

0001

10.00 ≤ 0.30 Multimo

de

Optica

l

conne

ctor

type:

LC

Optica

l fiber

type:

multi

mode

Operating

wavelength

: 850 nm

Transmit

optical

power:

–7.3 dBm

to –1.0

dBm

Extinction ratio: ≥ 3.0

SFP

+

0°C–70°C

(32°F–15

8°F)





97



Transmission Mode

Optical Fiber Type


Encapsulation Type


dB

Receiver

sensitivity:

≤ -9.9 dBm

Overload

optical

power: -1.0

dBm

OSX001

001

10.00 ≤

10.00

Single-

mode

Optica

l

conne

ctor

type:

LC

Optica

l fiber

type:

single

-mode

Operating

wavelength

: 1310 nm

Transmit

optical

power:

–8.2 dBm

to +0.5

dBm

Extinction

ratio: ≥ 3.5

dB

Receiver

sensitivity:

≤ -12.6

dBm

Overload

optical

power: 0.5

dBm

SFP

+

0°C–70°C

(32°F–15

8°F)

OSX080

N00

9.9530–

10.3125

≤

80.00

Single-

mode

Optica

l

conne

ctor

type:

LC

Optica

l fiber

type:

single

-mode

Operating

wavelength

: 1550 nm

Transmit

optical

power: 0

dBm to 4

dBm

Extinction

ratio: ≥ 9

dB

Receiver

sensitivity:

≤ -24 dBm

Overload

SFP

+

0°C–70°C

(32°F–15

8°F)





98



Transmission Mode

Optical Fiber Type


Encapsulation Type


optical

power: -7

dBm

OSX040

N00

9.95–11

.10

≤

40.00

Single-

mode

Optica

l

conne

ctor

type:

LC

Optica

l fiber

type:

single

-mode

Operating

wavelength

: 1550 nm

Transmit

optical

power:

–4.7 dBm

to +4 dBm

Extinction

ratio: ≥ 3

dB

Receiver

sensitivity:

≤ -14.1

dBm

Overload

optical

power: 0.5

dBm

SFP

+

0°C–70°C

(32°F–15

8°F)

2.3 Electrical Module

Functions

An electrical module provides optical-to-electrical and electrical-to-optical conversion

functions. It is connected to an Ethernet cable to transmit signals.

Appearance

Figure 2-7 shows an electrical module.





99

Figure 2-7 Electrical module

Figure 2-8 shows the structure of an electrical module.

Figure 2-8 Electrical module structure

1. Handle 2. Spring 3. Label





100

4. Connector 5. Shell 6. Port

An electrical module uses an RJ45 port, and is connected to an Ethernet cable to support the

maximum transmission distance of 100 m.


Table 2-5 describes the technical specifications of an electrical module.

Table 2-5 Technical specifications of an electrical module

Model Transmission Rate (Mbit/s)


Port Type Encapsulation


SFP-1000Bas

eT

10–1000,

auto-negotia

tion

≤ 0.1 RJ45 electrical

port

SFP 0°C–70°C

(32°F–158°F)


Hardware Description 3 Cables



101

3 Cables

About This Chapter

3.1 Power Cables and PGND Cables

3.2 Signaling Cables

3.1 Power Cables and PGND Cables

3.1.1 Power and PGND Cables to a Subrack

Functions A power cable connects the power input terminal on a subrack to the power output

terminal on the power distribution box (PDB) to supply power to the subrack.

A PGND cable connects the ground point on a subrack to the ground point on a

mounting bar of the cabinet for proper grounding.

Appearance Power cable

− Power cable with OT terminals

Both ends of a power cable are OT terminals. The blue cable is connected to the

NEG(-) terminal, and the black cable is connected to the RTN(+) terminal. Figure 3-1

shows power cables with OT terminals.

Figure 3-1 Power cables with OT terminals

− Power cable with dual-hole JG terminals





102

Both ends of a power cable are dual-hole JG terminals. The blue cable is connected to

the NEG(-) terminal, and the black cable is connected to the RTN(+) terminal. Figure

3-2 shows power cables with dual-hole JG terminals.

Figure 3-2 Power cable with dual-hole JG terminals

− AC power cable

Most countires have their own AC power cables, including China, Europe, and North America.The

delivered AC power cables must comply with local standards. The following uses China AC power

cables as an example.

AC power cables include the AC power cable using the C13 straight female (SF) and

the PI straight male (SM) and the AC power cable using the C13 angled female (AF)

and the C14 SM. The two types of power cables differ in the power port. Figure 3-3

shows an AC power cable using the C13 SF and PI SM. Figure 3-4 shows an AC

power cable using the C13 AF and C14 SM.

Figure 3-3 AC power cable using the C13 SF and PI SM





103

Figure 3-4 AC power cable using the C13 AF and C14 SM

PGND cable

− PGND cable with OT terminals

Each subrack is configured with one PGND cable. The cable is yellow and green.

Both ends of the PGND cable are OT terminals. Figure 3-5 shows a PGND cable with

OT terminals.

Figure 3-5 PGND cable with OT terminals

− PGND cable with dual-hole JG terminals

Each subrack is configured with one PGND cable. The cable is yellow and green.

Both ends of the PGND cable are dual-hole JG terminals. Figure 3-6 shows a PGND

cable with dual-hole JG terminals.

Figure 3-6 PGND cable with dual-hole JG terminals

The subrack used in North America uses power cables with dual-hole JG terminals and PGND cables

with dual-hole JG terminals.


Table 3-1 lists the technical specifications of the power and PGND cables for a subrack.





104

Table 3-1 Technical specifications of the power and PGND cables for a subrack

Item Specifications

Power cable Power cable with OT terminals or dual-hole JG

terminals: 10 mm2 (8 AWG)

AC power cable

AC power cable using the C13 SF and PI SM:

China, 250 V/10 A, 1 mm2, 10°C to 70°C, and

C13 SF and PI SM

AC power cable using the C13 AF and C14

SM: China/Europe, 250 V/10 A, 1 mm2, -20°C

to +105°C, and C13 AF and C14 SM

PGND cable 16 mm2 (6 AWG)

3.1.2 Power Cables of the Alarm Box

Functions

The power cables are used for supplying power to the alarm box.

Table 3-2 lists the configuration of the power cables.

Table 3-2 Configuration of the power cables

Power Supply

Quantity

Remarks

AC power

supply

1 The cable is configured only if system down notification is

required for the alarm box. If the length of the cable is not

sufficient, connector boards must be added. The boards are

provided by carriers. If carriers do not provide the connector

boards, the quantity of the required boards must be provided in

the survey report.

DC power

supply

1 DC power cable is recommended. An alarm box requires only

one power cable. The length of the cable cannot exceed 100 m

(328.08 ft).

Exterior

None.


Table 3-3 lists the technical specifications of the power cables of alarm boxes.





105

Table 3-3 Technical specifications of the power cables of alarm boxes

Name Specifications

AC power cable Voltage: 220 V/250 V

Length: 6 m (19.68 ft) (The length varies

according to the actual situation.)

Gauge: 3 x 0.75 mm2 (3 x 0.001 in.2)

Color: black

DC power cable One end of the DC power cable is a 4-pin

connector, and the other end is two 1-pin

connectors.

Voltage: -48 V

Length: 30 m (98.42 ft) (The length

varies according to the actual situation.)

Gauge: 0.8 mm2 (0.001 in.2)

Color: black

3.2 Signaling Cables

3.2.1 Ethernet Cable

Functions

Ethernet cables are used for cascading devices or for communication between devices and the

network. Through Ethernet cables, devices can be locally serviced and remotely accessed over

the network.

Ethernet cables transmit 100 Mbit/s or 1000 Mbit/s signals.

Appearance

An Ethernet cable is a straight-through. It is made of Category 5 enhanced shielded or

unshielded twisted pair cables and RJ45 connectors at both ends. Figure 3-7 shows the

appearance of an Ethernet cable.





106

Figure 3-7 Ethernet cable appearance

Figure 3-8 shows the structure of an Ethernet cable.

Figure 3-8 Ethernet cable structure

Pinouts

Figure 3-9 shows the pins at both ends of a straight-through cable. Table 3-4 describes the

pins.





107

Figure 3-9 Pins at both ends of a straight-through cable

Table 3-4 Pins at both ends of a straight-through cable

X1 X2 Pin Color Pinouts

1 1 White and orange A pair of twisted

pair cables 2 2 Orange

3 3 White and green A pair of twisted

pair cables 6 6 Green

5 5 White and blue A pair of twisted

pair cables 4 4 Blue

7 7 White and brown A pair of twisted

pair cables 8 8 Brown


Table 3-5 lists the technical specifications of the Ethernet cable.

Table 3-5 Technical specifications of the Ethernet cable

Item Specifications

Connectors X1 and X2 RJ45

Number of pins 8 pins

Diameter of the inner conductor 0.51 mm (0.02 in.)

Wire gauge of the inner conductor 24 AWG

Number of cores 8

Outer jacket flame retardant 28





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3.2.2 LC/PC-LC/PC-Multi-Mode Optical Cable

Function

The LC/PC-LC/PC-multi-mode optical cables are used to connect service boards and network

elements (NEs).

Appearance

The LC/PC-LC/PC-multi-mode optical cable is orange, as shown in Figure 3-10. Users can

choose single-mode or multi-mode optical cables based on site requirements.

Figure 3-10 LC/PC-LC/PC-multi-mode optical cable

An LC/PC connector is used at both ends of an LC/PC-LC/PC multi-mode optical cable.

Figure 3-11 shows an LC/PC connector.

Figure 3-11 LC/PC connector


The LC/PC-LC/PC-multi-mode optical cables comply with ITU G651 and GB/T 12357. Table

3-6 lists the technical specifications of the LC/PC-LC/PC-multi-mode optical cable.

Table 3-6 Technical specifications of the LC/PC-LC/PC-multi-mode optical cable

Item Specifications

Cable type Optical jumper

Transfer mode Multi-mode





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Item Specifications

Number and type of optical

connector I

LC/PC


connector II

LC/PC

Diameter of the optical fiber

core

62.5/125 um

Outer diameter of an optical

cable

2.0 mm (0.08 in.)

Service life 500 times

3.2.3 DLC/PC-DLC/PC-Multi-Mode Optical Cable

Functions

The DLC/PC-DLC/PC-multi-mode optical cables are used to connect LAN switches or disk

arrays to other network devices.

Exterior

Figure 3-12 shows the exterior of a DLC/PC-DLC/PC-multi-mode optical cable.

Figure 3-12 Exterior of a DLC/PC-DLC/PC-multi-mode optical cable

Both ends of a DLC/PC-DLC/PC-multi-mode optical fiber are DLC/PC connectors.





110


The DLC/PC-DLC/PC-multi-mode optical cables comply with the ITU G651 and GB/T

12357 standards. Table 3-7 lists the technical specifications of the

DLC/PC-DLC/PC-multi-mode optical cables.

Table 3-7 Technical specifications of the DLC/PC-DLC/PC-multi-mode optical cables

Item Specifications

Category Patch cord

Cable model A1b

Transmission mode Multi-mode


connector I

DLC/PC


connector II

DLC/PC


core

62.5/125um


fiber

2.0 mm (0.08 in.)

Optical fiber length 5.0 m (16.40 ft.)

Service life (times) 500

Net weight 0.048 kg (0.106 lb)

Lowest operating

environment temperature

-20 degC

Highest operating

environment temperature

70 degC

3.2.4 LC/PC-LC/PC-Single-Mode Optical Cable

Function

The LC/PC-LC/PC-single-mode optical cables are used to connect service boards and

network elements (NEs).

Appearance

The LC/PC-LC/PC-single-mode optical cable is yellow, as shown in Figure 3-13. Users can

choose single-mode or multi-mode optical cables based on site requirements.





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Figure 3-13 LC/PC-LC/PC-single-mode optical cable

An LC/PC connector is used at both ends of an LC/PC-LC/PC-single-mode optical cable.

Figure 3-14 shows an LC/PC connector.

Figure 3-14 LC/PC connector


The LC/PC-LC/PC-single-mode optical cables comply with ITU G.652 and GB/T 9771.1.

Table 3-8 lists the technical specifications of the LC/PC-LC/PC-single-mode optical cable.

Table 3-8 Technical specifications of the LC/PC-LC/PC-single-mode optical cable

Item Specifications

Cable type Optical jumper

Transfer mode Single-mode


connector I

LC/PC


connector II

LC/PC


core

9/125 um


cable

2.0 mm (0.08 in.)






112

3.2.5 MPO/PC-MPO/PC-Multi-Mode Optical Cable

Function

The MPO/PC-MPO/PC-multi-mode optical cables are used to connect the optical ports on

two devices for data communications.

The MPO/PC-MPO/PC-multi-mode optical cables transmit 41.25 Gbit/s signals.

Appearance

The MPO/PC-MPO/PC-multi-mode optical cable is cyan, as shown in Figure 3-15.

Figure 3-15 MPO/PC-MPO/PC-multi-mode optical cable

An MPO/PC connector is used at both ends of an MPO/PC-MPO/PC-multi-mode optical

cable. Figure 3-16 shows an MPO/PC connector.

Figure 3-16 MPO/PC connector





113


The MPO/PC-MPO/PC-multi-mode optical cables comply with ITU G651 and GB/T 12357.

Table 3-9 lists the technical specifications of the MPO/PC-MPO/PC-multi-mode optical cable.

Table 3-9 Technical specifications of the MPO/PC-MPO/PC-multi-mode optical cable

Item Specifications

Cable type Optical cable component

Transfer mode Multi-mode


connector I

MPO/PC


connector II

MPO/PC


core

50 um/125 um

Number of optical fiber cores 8


cable

3.5 mm (0.14 in.)

Optical cable length 2 m (78.74 in.), 30 m (1181.1 in.) or 100 m (3937 in.)


3.2.6 High-Density Cable

Functions

A high-density cable is connected to a high-density port at one end, and provides one VGA

port, three USB ports, and one serial port at the other end for data transmission.

Appearance

Figure 3-17 shows a black high-density cable.





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Figure 3-17 High-density cable


Figure 3-18 shows the pins at both ends of a high-density cable. Table 3-10 lists the technical

specifications of the high-density cable.

Figure 3-18 Pins at both ends of a high-density cable (unit: mm)

Table 3-10 Technical specifications of the high-density cable

Item Specifications

X1 Cable connector, MDR, 26-pin, male, cable

solder type, for OEM

X2 Cable connector, D connector, 15-pin,

female connector, cable solder type, three





115

Item Specifications

rows, for OEM

X3 USB2.0 connector, double line, 8-pin,

female connector

X4 Network interface connector, 8-bit 8-pin,

shielded, model socket/top plugging type,

with fixed pin/pin tail length 3.43 mm

X5 USB2.0 connector, single line, 4-pin, female

connector

W1-2 Twisted-pair cable, 100 ohms, SEYVP, 0.48

mm, 26 AWG, 4 pairs, black

W3-4 Twisted-pair cable, 100 ohms, SEYVP, 0.48

mm, 26 AWG, 2 pairs, black

3.2.7 DB9-RJ45 Serial Cable

Functions

The DB9-RJ45 serial cable is used for data transmission. It has a DB9 connector at one end

and an RJ45 connector at the other end. The DB9 connector connects to the serial port of a

client, and the RJ45 connector connects to the serial port of a device.

Appearance

Figure 3-19 shows the appearance of a DB9-RJ45 serial cable.

Figure 3-19 DB9-RJ45 serial cable appearance

Figure 3-20 shows the structure of a DB9-RJ45 serial cable.





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Figure 3-20 DB9-RJ45 serial cable structure

Pinouts

Table 3-11 lists the pins at both ends of a DB9-RJ45 serial cable.

Table 3-11 Pins at both ends of a DB9-RJ45 serial cable

Wire No. Start Pin End Pin Signal

W X1.2 X2.3 TX

X1.3 X2.6 RX

X1.5 X2.5 GND


Table 3-12 lists the technical specifications of the DB9-RJ45 serial cable.

Table 3-12 Technical specifications of the DB9-RJ45 serial cable

Item Specifications

Connector type Cable Connector-04040838-D

Connector-9PIN-Female Connector-Cable

Welding Type

Network Interface Connector-Single

Row-Single

Interface-8PIN-8bit-Shielded-Crystal

Connector

Cable model Symmetric twisted pair cable

Characteristic impedance 100 ohms

Diameter of the inner conductor 0.32 mm (0.01 in.)

Wire gauge of the inner conductor 28 AWG

Color Gray

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