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 1 Earl J. Lum +1-650-430-2221 [email protected] Huawei Technologies W-CDMA 2100MHz RRU 3804 February 2010 Entire contents © 2010 E JL Wireless Research LLC. All Rights Reserved. Reproduction of this publicat ion in any form without prior written permission is strictly forbidden and will be prosecuted to the fully extent of US and International laws. The transfer of this publication in either paper or electronic form to unlicensed third parties is strictly forbidden. The information contained herein has been obtained from sources EJL Wireless Research LLC deems reliable. EJL Wireless Research LLC disclaims all warranties as to the accuracy, completeness or adequacy of such information. EJL Wireless Research LLC shall have no liability for errors, omissions or inadequacies in the information contained herein or for the interpretation thereof. The reader assumes sole responsibility for the selection of these materials to achieve its intended results. The opinions expressed herein are subject to change without notice. DesigN Analysis - Infrastructure

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Earl J. Lum+1-650-430-2221

[email protected] 

Huawei Technologies W-CDMA 2100MHzRRU 3804

February 2010

Entire contents ©2010 EJ L Wireless Research LLC. All Rights Reserved. Reproduction of this publication in any form without priorwritten permission is strictly forbidden and will be prosecuted to the fully extent of US and International laws. The transfer of thispublication in either paper or electronic form to unlicensed third parties is strictly forbidden. The information contained herein hasbeen obtained from sources EJ L Wireless Research LLC deems reliable. EJ L Wireless Research LLC disclaims all warranties as tothe accuracy, completeness or adequacy of such information. EJ L Wireless Research LLC shall have no liability for errors,omissions or inadequacies in the information contained herein or for the interpretation thereof. The reader assumes soleresponsibility for the selection of these materials to achieve its intended results. The opinions expressed herein are subject tochange without notice.

DesigN Analysis - Infrastructure

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TABLE OF CONTENTSEXECUTIVE SUMMARY ....................................................................... 6 Active/Passive Component Summary ................................................................ 6 Important Note: ............................................................................................ 6 CHAPTER 1: HUAWEI UMTS W-CDMA BBU/RRU SYSTEM ..........................7 1.1 Overview of Huawei UMTS W-CDMA BBU/RRU Platform.................................. 7

 CHAPTER 2: MECHANICAL ANALYSIS.................................................... 17 2.1 Exterior Mechanical Analysis......................................................................17 2.2 Interior Mechanical Analysis ......................................................................26 CHAPTER 3: RRU SYSTEM ............................................................... 28 CHAPTER 4: RECEIVER SUB-SYSTEM ................................................... 32 Area A.........................................................................................................32 Area A1: Diversity Receiver............................................................................34 Area A2: VSWR Sense Circuit..........................................................................36 Area A3: IF Receiver .....................................................................................39 Area A4: Transmit D/A...................................................................................41 Area A5: Dual Stage Gain Amplifier .................................................................43 Area A6: Receiver Clock Generator ..................................................................45

 CHAPTER 4: TX POWER AMPLIFIER SUB-SYSTEM ..................................... 47 Area B1: RF Transmit Chain............................................................................48 Area B2: RF Amplifier power Supply Conditioning ..............................................50 Area B3:Transmit RF Sampling Circuit.............................................................52 CHAPTER 6: BASEBAND SUB-SYSTEM .................................................. 54 Area C1: Transmit Feedback A/D.....................................................................54 Area C2: Digital Baseband..............................................................................56 CHAPTER 6: TRX POWER SUPPLY ....................................................... 59 CHAPTER 7: POWER SUPPLY PROTECTION /FIBER OPTIC TRANSCEIVER INPUT ..... 62 Fiber Optic Transceiver Modules/Fiber Optic Cables ............................................65 CHAPTER 8: TX /RX DUPLEXER FILTER.................................................. 68 CHAPTER 9: AC/DC POWER SUBSYSTEM .............................................. 72 Daughter Card [Component ID 27]..................................................................80 APPENDIX A - PASSIVE CASE SIZE ANALYSIS.......................................... 82 APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS ...................... 85 

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TABLES

Table 1: Area A1 Bill of Materials ...................................................................................................35 Table 2: Area A2 Bill of Materials ...................................................................................................38 Table 3: Area A3 Bill of Materials ...................................................................................................40 Table 4: Area A4 Bill of Materials ...................................................................................................42 Table 5: Area A5 Bill of Materials ...................................................................................................44 Table 6: Area A6 Bill of Materials ...................................................................................................46 Table 7: Area B1 Bill of Materials ...................................................................................................49 Table 8: Area B2 Bill of Materials ...................................................................................................51 Table 9: Area B3 Bill of Materials ...................................................................................................53 Table 10: Area C1 Bill of Materials.................................................................................................. 55 Table 11: Area C2 Bill of Materials.................................................................................................. 58 Table 12: Area D Bill of Materials ...................................................................................................60 Table 13: Area E Bill of Materials ...................................................................................................63 Table 14: Duplexer Filter Protection Circuitry Bill of Materials ............................................................71 Table 15: AC/DC Power Subsystem Unit Area A Bill of Materials......................................................... 76 Table 16: AC/DC Power Subsystem Unit Area B Bill of Materials......................................................... 78 Table 17: Daughter Card Bill of Materials ........................................................................................ 81 Table 18: Passive Component Case Size Distribution by System Subsection ........................................ 83 Table 19: Active/Passive Component Distribution by System Subsection.............................................84 Table 20: Active Semiconductor Vendor Distribution by System Subsection.........................................86 

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EXHIBITS

Exhibit 1: Huawei BBU....................................................................................................................7 Exhibit 2: Huawei BBU/RRU 3 Sector Site Example.............................................................................8 Exhibit 3: Huawei RRU3804 System Level Block Diagram....................................................................8 Exhibit 4: Huawei RRU Shipping Box, Side View.................................................................................9 Exhibit 5: Huawei RRU Shipping Box, Internal View............................................................................9 Exhibit 6: Huawei RRU3804, Front View.......................................................................................... 10 Exhibit 7: Huawei RRU, Back View with Mounting Bracket ................................................................. 10 Exhibit 8: Huawei RRU, Left Side View............................................................................................ 11 Exhibit 9: Huawei RRU, Right Side View.......................................................................................... 11 Exhibit 10: Huawei RRU, Bottom View ............................................................................................ 12 Exhibit 11: Huawei RRU, Top View ................................................................................................. 12 Exhibit 12: Huawei RRU Front View, Plastic Cover Removed ..............................................................13 Exhibit 13: Huawei RRU Back View, Plastic Cover Removed...............................................................13 Exhibit 14: Huawei RRU, Right Side View ........................................................................................ 14 Exhibit 15: Huawei RRU, Left Side View .......................................................................................... 14 Exhibit 16: Huawei RRU, Right Side View with Cover Removed .......................................................... 14 Exhibit 17: Huawei RRU, Front View with PDU Removed ................................................................... 15 Exhibit 18: RRU Side Panel Close Up .............................................................................................. 15 Exhibit 19: Huawei RRU, Front View with Cover Removed ................................................................. 16 Exhibit 20: RRU Plastic Cover, Front and Back Views ........................................................................ 17 Exhibit 21: RRU Plastic Front Cover, External and Internal Views .......................................................18 Exhibit 22: RRU Plastic Back Cover, External and Internal Views........................................................ 18 Exhibit 23: RRU Plastic Cover, Right and Left Side Views................................................................... 19 Exhibit 24: RRU Metal Cover, Top View........................................................................................... 20 Exhibit 25: RRU Metal Cover, Bottom View...................................................................................... 20 Exhibit 26: RRU Metal Heatsink...................................................................................................... 21 Exhibit 27: RRU Metal Housing Frame, Top View .............................................................................. 22 Exhibit 28: RRU Metal Housing Frame, Bottom View ......................................................................... 23 Exhibit 29: RRU External Metal Housing Frame Connections ..............................................................23 Exhibit 30: RRU Mounting Bracket.................................................................................................. 24 Exhibit 31: Shipping Container for RRU Pole Mounting Brackets ......................................................... 24 Exhibit 32: RRU Pole Mounting Brackets ......................................................................................... 24 Exhibit 33: RRU Power Distribution Unit .......................................................................................... 25 Exhibit 34: RF Internal Shield, Top View ......................................................................................... 26 Exhibit 35: RF Internal Shield, Bottom View ....................................................................................27 Exhibit 36: RRU RF cables ............................................................................................................. 28 Exhibit 37: Huawei RRU3804 Printed Circuit Board (Top View)...........................................................29 Exhibit 38: Huawei RRU3804 System Printed Circuit Board (Bottom View) .......................................... 30 Exhibit 39: RRU3804 Heat Sink...................................................................................................... 31 Exhibit 40: Area A Component Diagram .......................................................................................... 32 Exhibit 41: RRU3804 Receiver Block Diagram .................................................................................. 33 Exhibit 42: Area A1 Component Diagram ........................................................................................ 34 Exhibit 43: Area A2 Component Diagram ........................................................................................ 36 Exhibit 44: Antenna VSWR Sensing Circuit ......................................................................................37 Exhibit 45: Area A3 Component Diagram ........................................................................................ 39 Exhibit 46: Area A4 Component Diagram ........................................................................................ 41 Exhibit 47: Area A5 Component Diagram ........................................................................................ 43 Exhibit 48: Area A6 Component Diagram ........................................................................................ 45 Exhibit 49: Huawei RRH 3804 RF Transmit Power Amplifier sub-System..............................................47 Exhibit 50: Huawei RRH3804 RF Transmit Chain Block Diagram......................................................... 47 Exhibit 51: Area B1 Component Diagram ........................................................................................ 48 Exhibit 52: Area B2 Component Diagram ........................................................................................ 50

 Exhibit 53: Area B3 Component Diagram ........................................................................................ 52 Exhibit 54: Area C1 Component Diagram........................................................................................ 54 Exhibit 55: Area C2 Component Diagram........................................................................................ 56 Exhibit 56: Area D Component Diagram.......................................................................................... 59 Exhibit 57: Area E Component Diagram .......................................................................................... 62 Exhibit 58: RRH Fiber Optic Transceivers ........................................................................................ 65 Exhibit 59: Fiber Optic Transceiver Module......................................................................................65 Exhibit 60: Remote Radio Unit Main Fiber Optic Cable....................................................................... 66 

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Exhibit 61: Remote Radio Unit Secondary Fiber Optic Cable ..............................................................67 Exhibit 62: Huawei RRH 3804 Duplexer Filter, Top View.................................................................... 68 Exhibit 63: Huawei RRH 3804 Duplexer Filter, Bottom View............................................................... 68 Exhibit 64: Huawei RRH 3804 Duplexer Filter, Top View, Internal....................................................... 69 Exhibit 65: Huawei RRH 3804 Duplexer Filter, Signal Path Analysis .................................................... 69 Exhibit 66: Duplexer Filter Circuit Protection.................................................................................... 70 Exhibit 67: Duplexer Filter Protection Circuitry Component Diagram................................................... 70 Exhibit 68: Huawei RRU with AC/DC Power Subsystem Unit ..............................................................72 Exhibit 69: Huawei AC/DC Power Subsystem Unit, Top View.............................................................. 73 Exhibit 70: Huawei AC/DC Power Subsystem Unit, Bottom View ........................................................73 Exhibit 71: Huawei AC/DC Power Subsystem Unit, Internal View........................................................ 74 Exhibit 72: AC/DC Power Subsystem Unit Area A Component Diagram ...............................................75 Exhibit 73: AC/DC Power Subsystem Unit Area B Component Diagram ...............................................77 Exhibit 74: Daughter Card Component Diagram, Top View................................................................80 Exhibit 75: Daughter Card Component Diagram, Bottom View ........................................................... 80 Exhibit 76: Passive Component Case Size Distribution ......................................................................82 Exhibit 77: Identified Passive Component Market Share by Vendor .................................................... 84 Exhibit 78: Active Semiconductor Component Share......................................................................... 85 Exhibit 79: Active Semiconductor Market Share by Vendor................................................................87 Exhibit 80: IC (>8 pin) vs. Discrete Active Semiconductor Share .......................................................87 Exhibit 81: High Pin Count (64+) Active Semiconductor Market Share by Vendor................................. 88