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Technical White Paper for System Reliability Prediction of eLTE 2.3 INTERNAL Product Name Confidentiality eLTE Confidential Product Version 22 pages in total V2.3 Technical White Paper for System Reliability Prediction of eLTE 2.3 (For internal use only) Prepared by Liu Hao (employee ID: 00273140) Date 2014-06-03 Reviewed by Date Approved by Date Huawei Technologies Co., Ltd All rights reserved.

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  • Technical White Paper for System Reliability Prediction of eLTE 2.3

    INTERNAL

    Product Name Confidentiality

    eLTE Confidential

    Product Version 22 pages in total

    V2.3

    Technical White Paper for System Reliability

    Prediction of eLTE 2.3

    (For internal use only)

    Prepared by Liu Hao (employee ID: 00273140) Date 2014-06-03

    Reviewed by Date

    Approved by Date

    Huawei Technologies Co., Ltd

    All rights reserved.

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    Change History

    Date Issue Description Author

    2014-06-20 1.01 Added the eCNS610-related

    information.

    Liu Hao (employee ID:

    00273140)

    2014-06-03 1.00 Completed the draft. Liu Hao (employee ID:

    00273140)

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    Technical White Paper for System Reliability

    Prediction of eLTE 2.3 Key words:

    eLTE 2.3, reliability, eCNS600, eCNS610, DBS3900

    Abstract:

    This document describes the methods for calculating the reliability indicators of the network elements (NEs)

    in the eLTE 2.3 solution.

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    1 Reliability Modeling

    The reliability modeling involves the following steps:

    1. Defining functions and physical components

    2. Defining faults

    3. Defining fault properties

    4. Constructing reliability models

    5. Determining the number of simulations and the life cycle

    6. Determining assumptions in reliability prediction

    1.2 Defining Functions and Physical Components

    The first step for calculating system reliability is to determine the physical components used for reliability

    modeling. Not all components in the system need to be incorporated in reliability modeling. The

    components that do not impact key services, such as maintenance terminals, can be ignored in reliability

    modeling if not required. Component selection for reliability modeling also depends on actual applications.

    For example, if the voice broadcast system is used for management assistance, which is not a key service,

    the components in the system can be ignored in reliability modeling. However, if the voice broadcast

    system is involved in security tracing, the components need to be incorporated in reliability modeling.

    In system-level reliability modeling, typical components include the eCNS, eNodeB, terminals involving

    security services (for example, a vehicle-mounted terminal for train control), transmission devices, antenna

    feeder devices, and power supply modules. Sometimes, a mobile terminal is ignored in system-level

    reliability modeling, but its reliability can be independently calculated.

    1.3 Defining Faults

    System reliability indicators have a close relationship with system fault definitions. Different fault

    definitions lead to different calculation results of reliability indicators.

    When system or subsystem faults are defined for NEs or boards working in redundancy mode, the

    redundancy type needs to be considered. For example, an eNodeB fault is determined for an eNodeB with

    three carriers working in 2+1 backup mode only when two or more carriers are faulty. For a co-site network

    hosting two eNodeBs working in 1+1 backup mode, a fault in only one eNodeB is not considered as a

    system fault.

    However, the duration for active/standby switchover needs to be considered in the preceding situations. For

    details, see section 1.4 "Defining Fault Properties."

    Besides hardware faults, other fault types may be involved in a project, such as software faults, faults

    caused by human errors, and faults caused by external factors (for example, lightning stroke and violent

    damage).

    1.4 Defining Fault Properties

    Common fault properties are defined as follows:

    Failure distribution curve, failure rate, and mean-time-to-failure (MTTF)/mean time between failures

    (MTBF)

    Mean time to repair (MTTR) and definition of repairs and spare parts

    Fault impact

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    Failure Distribution Curve, Failure Rate, and MTTF/MTBF

    A failure rate is the average number of failures for a component per unit of time after the component begins

    to fail. Generally, a failure rate is expressed as . Accordingly, the failure rate function is expressed as (t)

    because the failure rate is a function of the time t. The failure rate function corresponds to the failure

    distribution curve, the value of which may vary according to the component. The failure rate for an

    electronic component within its life cycle is generally a constant, and exponential distribution is used for

    such a failure rate. The failure rate for a mechanical component, however, varies depending on the time

    segment. Weibull distribution is generally used for such a failure rate.

    MTTF indicates the average interval at which a fault occurs on a component. MTTF is a reciprocal of a

    failure rate expressed by exponential distribution.

    To calculate the MTTF of a board to determine the reliability of the board, the failure distribution curve (or

    failure model) must be first determined, and then the failure rate can be determined.

    MTBF indicates the average time between consecutive failures of a component, which can be calculated in

    the following formula: MTBF = MTTF + MTTR.

    MTTR and Definition of Repairs and Spare Parts

    MTTR is closely related to service availability. The value of MTTR equals the sum of Mean Active Repair

    Time (MART) and Mean Logistical and administrative Delay Time (MLDT). MART is related to factors

    such as architecture design, fault management design, and board startup time and is the intrinsic reliability

    feature of components, while MLDT is the mean delay time to ensure network maintenance, such as the

    time spent on personnel dispatch, transportation, and acquisition of spare parts. MLDT is related to the

    staffing and equipment for the maintenance team.

    The definition of repairs and spare parts involves resources and spare parts required for a repair. With the

    definition, the number of spare parts in the system and the maintenance cost for the life cycle of a project

    can be calculated. The transportation of spare parts also affects MTTR.

    Fault Impact

    The fault impact determines the impact of a fault on the functions and subsystem. The impact can be

    classified into high, medium, and low levels. The impact of a fault that affects the entire system and causes

    a failure to provide services is a high-level impact. If a fault leads to short-period service interruption in a

    specific area served by multiple eNodeBs, the impact of the fault is a medium-level impact. A low-level

    impact indicates short-period service interruption for a single service channel caused by, for example, ring

    topology switchover after transmission interruption. An example of a low-level impact is 2s voice service

    interruption. The fault impact is defined so that it can be used with the failure rate to determine the list of

    critical items in the system, which facilitates the availability optimization of the entire system.

    1.5 Constructing Reliability Models

    Huawei uses reliability block diagrams (RBDs) to construct systematic reliability models for analysis and

    calculation of reliability indicators.

    The structure of an RBD indicates the logical relationships of faults in a system. Each block indicates a

    fault of a component, a subsystem fault, or an event that affects the system fault. As for a subsystem fault,

    the structure of another RBD can be used to indicate its internal logical relationships. The logical flow of an

    RBD starts from the input on the left and ends at the output on the right. Between the input and the output

    of the RBD, multiple blocks are arranged in serial or parallel connections depending on the characteristics

    of a system.

    A system with serially connected blocks indicates that a fault in any component will result in a system failure.

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    Figure 1-1 System with serially connected blocks

    Block 1 Block 2 Block 3

    A system with parallel connected blocks indicates that the components work in redundancy mode.

    Figure 1-2 System with parallel connected blocks

    Block 2

    Block 1

    Block 3

    A complex system consists of both serial and parallel connections, indicating that serially and parallel

    connected subsystems exist in the system.

    An RBD can also indicate the redundancy relationship of a decision system (k out of n). As indicated by

    the number 2 in Figure 1-3, at least two paths of the three parallel paths must work properly. When two

    paths are faulty, the system is faulty.

    Figure 1-3 Decision system

    Block 2

    Block 1

    Block 3

    2

    An RBD can also be used to analyze common cause failures. The common cause failure indicates a fault

    that can lead to failures of multiple functional components. If there is a common cause failure in a system

    with redundancy design, the failure must be expressed as a block serially connected to other blocks in an

    RBD. As shown in Figure 1-4, blocks 1 and 2 are failures of independent components working in

    redundancy mode, and the failure expressed by block 3 can lead to simultaneous failures of the two

    components.

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    Figure 1-4 System with a common cause failure

    Block 1

    Block 2

    Block 3

    1.6 Determining the Number of Simulations and the Life Cycle

    The number of simulations and the life cycle are involved as two important parameters in the calculation of

    the system unavailability based on the reliability model and fault model. The number of simulations is the

    number of times the system reliability model runs in simulation mode. Each time a system reliability model

    runs in simulation mode, the system determines whether it stably runs for a specified period. The specified

    period is the life cycle. For example, if the number of simulations is 1000, the life cycle is one year, and the

    number of times a fault occurs within the life cycle of the entire system calculated based on the system

    reliability model is 50, the system unavailability is 5%.

    1.7 Determining Assumptions in Reliability Prediction

    1.7.1 MTTR

    MTTR is defined depending on the actual maintenance capability in a project. For example, the in-transit

    time for the repair of eNodeBs in a remote area is different from that for the repair of eNodeBs near a city.

    There is an assumption for the calculation of MTTR for each NE. For details, see the reliability prediction

    report of each NE.

    1.7.2 Software Availability

    Software reliability is the capability that the software possesses to implement the required functionality

    under specified conditions within a specified period. Software reliability can be measured by availability.

    Software availability is the probability for the software not to cause system failures under specified

    conditions within a specified period. Software reliability and hardware reliability have many differences,

    which are caused by the fault mechanisms of software and hardware. Therefore, software reliability is

    assessed differently from hardware reliability.

    No mature quantitative measure is available for the analysis of software availability in the industry.

    Therefore, software availability is excluded from the reliability models in this document. If software

    availability needs to be considered in a project, an assumed target value can be given to an associated NE.

    1.7.3 External Factors

    External factors are not considered in the reliability models in this document.

    In some projects, however, some external factors need to be considered as required. For example, the

    probability of optical fiber faults caused by rodents need to be considered in areas where no rodent-free

    measure is used for optical fibers. In areas flooded with violence, the probability of violent damages to the

    outdoor equipment needs to be considered.

    Lightning protection measures are taken for Huawei outdoor eNodeBs, and therefore the probability of damages caused by lightning stroke can be ignored.

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    1.7.4 Human Factors

    Human factor analysis or human error analysis is used to measure the impact of human errors on system

    availability. Human errors are errors leading to system faults caused by misoperations of system operation

    personnel. Humans are flexible in executing tasks. Humans can handle exceptions and faults at any time,

    but human errors may also be introduced. Human errors mainly include the failure to execute a specified

    function, incorrect execution of a specified function, and execution of an unspecified function.

    Human errors are not considered in reliability models in this document. In actual projects, the system

    operation behaviors of humans can be determined based on the application scenario of the system to

    analyze the impact of human errors so as to calculate the probability of human errors that may lead to

    system faults. A large number of methods can be used to analyze the probability of human errors, among

    which there is a simple method that mainly depends on the judgment of experts, that is, human error

    assessment and reduction technique (HEART).

    2 Reliability Prediction Methods

    2.1 Board Reliability Prediction Methods

    2.1.1 Component Reliability Prediction Method

    The formula for calculating the component failure rate is as follows:

    TiSiQiGiSSi

    where,

    Gi is the generic steady-state failure rate for the ith component.

    Qi is the quality factor of the ith component.

    Si is the stress factor of the ith component.

    Ti is the steady-state temperature factor for the ith component under normal working temperature.

    Under 40C and 50% stress, S equals T, which has a value of 1.0, and therefore the formula can be simplified as:

    Ssi = Gi Qi

    2.1.2 Method for Calculating the Board Failure Rate

    The board failure rate is the sum of the component failure rates and can be calculated in the following

    formula:

    n

    i

    SSiiESS N1

    where,

    n is the number of component types.

    Ni is the number of components of the ith component type.

    E is the board environment factor. For the fixed and controlled environment on the ground, E has a value of 1.0.

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    2.2 System Reliability Prediction Methods

    The calculation of system reliability depends on the system fault definitions to a large extent. Different

    system fault definitions lead to use of different algorithms. For example, some board faults in the system

    lead to a failure of the entire system, whereas some board faults lead to unavailability of only some

    functions in the system. According to Bellcore SR-TSY-001171, there are two kinds of system-level faults:

    total system downtime (TSD) and partial system downtime (PSD).

    2.2.1 System Fault Definitions and Formula

    TSD is an approximate time period during which the entire system breaks down and fails to handle any

    requests. TSD is generally expressed as minutes per year.

    PSD is the weighted mean of the downtime during which the system only partially fails. The weight factor

    is the number of lines impacted by a specific failure mode.

    The calculation formulas for the TSD and PSD are as follows:

    Ti

    LiNTNL

    iDTSD

    Li NL

    Lii NLDPSD0

    ))/((

    where,

    Li is the number of subscriber lines impacted by failure mode i.

    Ti is the number of trunk lines impacted by failure mode i.

    NT is the total number of trunk lines in the system.

    NL is the total number of subscriber lines in the system.

    Di is the predicted downtime of failure mode i, expressed as minutes per year.

    2.2.2 Calculation of Di

    According to the preceding formulas, the calculation of system reliability or system availability depends on

    the calculated Di value of each board.

    The impact of a failure mode is first analyzed to determine which boards in the system will cause TSD and

    which will cause PSD. Then, the Di values of these boards are calculated.

    During Di calculation, boards with redundancy and boards without redundancy are differentiated.

    Calculation of Di for Boards Without Redundancy

    The availability of a board without redundancy can be calculated in the following formulas according to the

    previously calculated failure rate and determined recovery rate (reciprocal of MTTR):

    Availability (A) = MTBF/(MTBF + MTTR)

    Downtime (Di) = 525,600 x (1-A) (expressed as minutes/year)

    Failure rate (1 Failures In Time or FIT) = 10-9

    /hour

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    Calculation of Di for Boards with Redundancy

    The availability of boards with redundancy can be calculated by using the Markov model for repairable

    products.

    Boards with redundancy can be differentiated by work mode: active/standby backup and load sharing. The

    availability of the two types of boards with redundancy can be calculated in one of the following formulas:

    The availability of boards working in N+1 backup mode can be calculated as follows:

    })1()1()]1(1[{1 NaCNaNNaCA NN

    The availability of boards working in N+1 load sharing mode can be calculated as follows:

    )}1()1()1()]1(1[{1 1 NaCNaNNaCA NAN

    A

    where,

    A is the availability of boards working in N+1 redundancy mode.

    C is the switchover ratio or the probability of successful switchover times.

    CA is the probability of successful switchover times for the active board.

    CS is the probability of successful switchover times for a standby board.

    CA x CS indicates the switchover ratio of boards working in active/standby backup mode.

    CA indicates the switchover rate of the boards working in load sharing mode.

    a is the availability of each board working in N+1 redundancy mode, which can be calculated using

    MTBF/(MTBF+MTTR).

    Di can be calculated based on the availability.

    In actual applications, the calculation of Di is complicated with many conditions considered. For example,

    the backup mode can be warm backup or hot backup, and the time for an active/standby switchover cannot

    be calculated using a simple formula. The lifetime distribution of different components can neither be

    calculated using a simple formula.

    To accurately calculate the system availability, Huawei adopts professional reliability simulation software.

    The software creates system reliability models based on RBDs and then analyzes the system availability

    and reliability based on Monte-Carlo simulation to simulate the availability indicators close to the actual

    projects.

    2.3 Other Relevant Parameters

    The MTTR mentioned in this document refers to the onsite repair time and does not include the time

    required for personnel transfer or logistics.

    In this document, the MTTR of each board and equipment is determined to be 1, 2, 4, or 24 hours

    according to the MIL-HDBK-472, engineering experience, and field data.

    In addition, according to the reliability engineering baseline of Huawei, the failure detection rate of active

    boards is 95%, the failure detection rate of standby boards is 90%, and the switchover success rate is 99%.

    3 eCNS600 Configuration and Reliability Prediction

    3.1 eCNS600 Reliability Prediction Models

    eCNS600 reliability models can be constructed based on boards configured with or without redundancy.

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    3.1.1 eCNS600 Reliability Model Constructed with Boards Configured Without Redundancy

    PEM EPC FAN

    SMU

    SMU

    SDM

    SWU

    SWU

    SWI OMU USI

    ISU OXI

    3.1.2 eCNS600 Reliability Model Constructed with Boards Configured with Redundancy

    PEM

    PEM

    FPC

    FPC

    FAN

    FAN

    SMU

    SMU

    SWU

    SWU

    SWI

    SWI

    OMU

    OMU

    SDM

    SDM

    USI

    USI

    ISU

    ISU

    QXI

    QXI

    3.2 Typical Configurations of eCNS600 Reliability Models

    3.2.1 Typical Configuration of eCNS600 Boards Without Redundancy

    Board/Module Description Quantity

    PEM Power Entry Module 1

    FPC Flexible Printed Circuit 1

    FAN Fan 1

    SMU Service Management Unit 2

    SDM Service Data Management 1

    SWU Switch Unit 2

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    Board/Module Description Quantity

    SWI Switch Interface Unit 1

    OMU Operation and Maintenance Unit 1

    USI Universal Service Interface 1

    ISU Integrative Session Unit 1

    QXI QUAD 10GE Interface Unit 1

    3.2.2 Typical Configuration of eCNS600 Boards with Redundancy

    Board/Module Description Quantity

    PEM Power Entry Module 2

    FPC Flexible Printed Circuit 2

    FAN Fan 2

    SMU Service Management Unit 2

    SDM Service Data Management 2

    SWU Switch Unit 2

    SWI Switch Interface Unit 2

    OMU Operation and Maintenance Unit 2

    USI Universal Service Interface 2

    ISU Integrative Session Unit 2

    QXI QUAD 10GE Interface Unit 2

    3.3 eCNS600 Board Reliability Indicators

    Board/Module Failure Rate (FITs) MTBF (Hours) MTBF (Years)

    OMU 2219.61 450529.60 51.43

    USI 403.19 2480220.24 283.13

    ISU 1973.01 506839.80 57.86

    QXI 403.19 2480220.24 283.13

    SMM 683.53 1462993.58 167.01

    SDM 101.1 9891196.83 1129.13

    SWU 2357.99 424090 48.41

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    Board/Module Failure Rate (FITs) MTBF (Hours) MTBF (Years)

    SWI 518.08 1930203.83 220.34

    PEM 487 2053261.6 234.4

    FAN 1000 1000000 114.2

    FPC 272.7 3667033.4 418.6

    3.4 eCNS600 Reliability Prediction

    3.4.1 Reliability Prediction for eCNS600 Boards Without Redundancy

    MTBF (Years) MTTR (Hours) Availability Interruption Duration (Minutes/Year)

    15.73 1 99.99928% 3.81

    15.73 2 99.99854% 7.62

    3.4.2 Reliability Prediction for eCNS600 Boards with Redundancy

    MTBF (Years) MTTR (Hours) Availability Interruption Duration (Minutes/Year)

    40.0 1 99.99972% 1.50

    40.0 2 99.99943% 3.00

    4 eCNS610 Configuration and Reliability Prediction

    4.1 eCNS610 Reliability Prediction Models

    Figure 4-1 eCNS610 reliability prediction model with eight hard disks, fans working in 7+1 backup mode, and power supply modules working in 1+1 backup mode

    Mother

    board

    RAID

    controller

    card

    CPU I/O card

    Backplane

    connecting

    hard disks

    Hard disk 1

    Hard disk 8

    ...

    Fan 1

    Fan 8

    ...

    Power supply

    module 1

    Power supply

    module 2

    8 7

    Memory 1

    Memory 24

    ... 24

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    4.2 Typical Configurations of eCNS610 Reliability Models

    Board/Module Quantity

    Mother board 1

    RAID controller card 1

    CPU 1

    Memory 24

    I/O card 1

    Backplane connecting hard disks 1

    Hard disk 8

    Fan 8

    Power supply module 2

    4.3 eCNS610 Board Reliability Indicators

    Board/Module Failure Rate (FITs) MTBF (Hours) MTBF (Years)

    Mother board 3721.0 268744.96 30.7

    RAID controller card 559.2 1788268.96 204.1

    CPU 40.0 25000000 2853.8

    Memory 5000.0 200000 22.83

    Backplane connecting hard disks 82.9 12062726.2 1377.0

    I/O card 82.6 12106537.5 1382.0

    Fan 582.0 1718213.06 196.1

    Hard disk 3425.0 291970.80 33.33

    Power supply module 2000.0 500000 57.1

    4.4 eCNS610 Reliability Prediction

    MTBF (Years) MTTR (Hours) Availability Interruption Duration (Minutes/Year)

    12.29 1 99.999071% 4.88

    12.29 2 99.998143% 9.76

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    5 DBS3900 Configuration and Reliability Prediction

    A DBS3900 consists of two independent modules: baseband (BB) module and radio frequency (RF)

    module, which are connected over the common public radio interface (CPRI) through an optical cable.

    5.1 BBU3900/BBU3910

    The BBU3900/BBU3910 is an indoor baseband unit, which fits into 2U space of any standard 19-inch

    cabinet. The BBU3900/BBU3910 occupies small space and can be easily installed.

    The BBU3900/BBU3910 includes boards such as UMPT, UPEU, and UBFA and is fed with 48 V DC

    power.

    5.2 RRU3251/RRU3232/RRU3252/RRU3253

    The RRU3251, RRU3232, RRU3252, and RRU3253 are remote radio units used outdoors, which can be

    installed on a pole or a wall near the antenna.

    Figure 5-1 RRU

    5.3 DBS3900 Reliability Prediction Models

    5.3.1 DBS3900 Reliability Model Constructed with Boards Configured Without Redundancy

    Figure 5-2 DBS3900 reliability model 1

    UPEUc FANc UMPT LBBP

    RRU

    RRU

    ...

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    5.3.2 DBS3900 Reliability Model Constructed with UPEUs and LBBPs Configured with Redundancy

    Figure 5-3 DBS3900 reliability model 2

    UPEUc

    UPEUc

    FANc UMPT

    LBBP

    LBBP

    RRU

    RRU

    ...

    5.3.3 DBS3900 Reliability Model Constructed with UMPTs Configured with Redundancy

    Figure 5-4 DBS3900 reliability model 3

    UPEUd

    UPEUd

    FANd

    UMPT LBBP

    LBBP

    RRU

    RRUUMPT

    ...

    5.4 Typical Configurations of DBS3900 Reliability Models

    5.4.1 Typical Configuration 1 for the DBS3900

    Board/Module Description Quantity

    UPEUc Power and Environment interface unit 1

    FANc BBU Fan Module 1

    UMPT Main Processing & Transmission unit 1

    LBBPd2 Baseband Process and Radio Interface unit 1

    RRU3251 Remote Radio Unit 1-3

    5.4.2 Typical Configuration 2 for the DBS3900

    Board/Module Description Quantity

    UPEUc Power and Environment interface unit 1

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    Board/Module Description Quantity

    FANc BBU Fan Module 1

    UMPT Main Processing & Transmission unit 1

    LBBPd2 Baseband Process and Radio Interface unit 1

    RRU3232/RRU3252/RRU3256 Remote Radio Unit 1-3

    5.4.3 Typical Configuration 3 for the DBS3900

    Board/Module Description Quantity

    UPEUc Power and Environment interface unit 2

    FANc BBU Fan Module 1

    UMPT Main Processing & Transmission unit 1

    LBBPd2 Baseband Process and Radio Interface unit 2

    RRU3251 Remote Radio Unit 1-3

    5.4.4 Typical Configuration 4 for the DBS3900

    Board/Module Description Quantity

    UPEUc Power and Environment interface unit 2

    FANc BBU Fan Module 1

    UMPT Main Processing & Transmission unit 1

    LBBPd2 Baseband Process and Radio Interface unit 2

    RRU3232/RRU3252/RRU3256 Remote Radio Unit 1-3

    5.4.5 Typical Configuration 5 for the DBS3900

    Board/Module Description Quantity

    UPEUc Power and Environment interface unit 2

    FANc BBU Fan Module 1

    UMPT Main Processing & Transmission unit 2

    LBBPd2 Baseband Process and Radio Interface unit 2

    RRU3251 Remote Radio Unit 1-3

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    5.4.6 Typical Configuration 6 for the DBS3900

    Board/Module Description Quantity

    UPEUc Power and Environment interface unit 2

    FANc BBU Fan Module 1

    UMPT Main Processing & Transmission unit 2

    LBBPd2 Baseband Process and Radio Interface unit 2

    RRU3232/RRU3252/RRU3256 Remote Radio Unit 1-3

    5.4.7 Typical Configuration 7 for the DBS3900

    Board/Module Description Quantity

    UPEUd Power and Environment interface unit 1

    FANd BBU Fan Module 1

    UMPT Main Processing & Transmission unit 1

    LBBPd2 Baseband Process and Radio Interface unit 1

    RRU3251 Remote Radio Unit 1-3

    5.4.8 Typical Configuration 8 for the DBS3900

    Board/Module Description Quantity

    UPEUd Power and Environment interface unit 1

    FANd BBU Fan Module 1

    UMPT Main Processing & Transmission unit 1

    LBBPd2 Baseband Process and Radio Interface unit 1

    RRU3232/RRU3252/RRU3256 Remote Radio Unit 1-3

    5.4.9 Typical Configuration 9 for the DBS3900

    Board/Module Description Quantity

    UPEUd Power and Environment interface unit 2

    FANd BBU Fan Module 1

    UMPT Main Processing & Transmission unit 1

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    Board/Module Description Quantity

    LBBPd2 Baseband Process and Radio Interface unit 2

    RRU3251 Remote Radio Unit 1-3

    5.4.10 Typical Configuration 10 for the DBS3900

    Board/Module Description Quantity

    UPEUd Power and Environment interface unit 2

    FANd BBU Fan Module 1

    UMPT Main Processing & Transmission unit 1

    LBBPd2 Baseband Process and Radio Interface unit 2

    RRU3232/RRU3252/RRU3256 Remote Radio Unit 1-3

    5.4.11 Typical Configuration 11 for the DBS3900

    Board/Module Description Quantity

    UPEUd Power and Environment interface unit 2

    FANd BBU Fan Module 1

    UMPT Main Processing & Transmission unit 2

    LBBPd2 Baseband Process and Radio Interface unit 2

    RRU3251 Remote Radio Unit 1-3

    5.4.12 Typical Configuration 12 for the DBS3900

    Board/Module Description Quantity

    UPEUd Power and Environment interface unit 2

    FANd BBU Fan Module 1

    UMPT Main Processing & Transmission unit 2

    LBBPd2 Baseband Process and Radio Interface unit 2

    RRU3232/RRU3252/RRU3256 Remote Radio Unit 1-3

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    5.5 DBS3900 Board Reliability Indicators

    Board/Module Failure Rate (FITs) MTBF (Hours) MTBF (Years)

    UPEUc 380 2631578.95 300.4

    UPEUd 560 1785714.29 203.8

    FANc 940 1063829.79 121.4

    FANd 950 1052631.58 120.1

    UMPT 1550 645161.29 73.6

    LBBPd 1120 892857.14 101.9

    RRU3253/3259 5710 175131.35 19.9

    RRU3251 2460 406504.07 46.4

    RRU3232/RRU3252/RRU3256 3100 322580.65 234.4

    5.6 DBS3900 Reliability Prediction

    5.6.1 Reliability of the DBS3900 Configured in Mode 1

    MTBF (Years) MTTR (Hours) Availability Interruption Duration (Minutes/Year)

    28.99 1 99.99961% 2.07

    28.99 3 99.99882% 6.21

    5.6.2 Reliability of the DBS3900 Configured in Mode 2

    MTBF (Years) MTTR (Hours) Availability Interruption Duration (Minutes/Year)

    28.90 1 99.99960% 2.08

    28.90 3 99.99881% 6.23

    5.6.3 Reliability of the DBS3900 Configured in Mode 3

    MTBF (Years) MTTR (Hours) Availability Interruption Duration (Minutes/Year)

    46.20 1 99.99998% 1.30

    46.20 3 99.99926% 3.90

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    5.6.4 Reliability of the DBS3900 Configured in Mode 4

    MTBF (Years) MTTR (Hours) Availability Interruption Duration (Minutes/Year)

    46.12 1 99.99997% 1.30

    46.12 3 99.99926% 3.90

    5.6.5 Reliability of the DBS3900 Configured in Mode 5

    MTBF (Years) MTTR (Hours) Availability Interruption Duration (Minutes/Year)

    123.54 1 99.999908% 0.48

    123.54 3 99.999723% 1.44

    5.6.6 Reliability of the DBS3900 Configured in Mode 6

    MTBF (Years) MTTR (Hours) Availability Interruption Duration (Minutes/Year)

    122.22 1 99.999907% 0.49

    122.22 3 99.999720% 1.47

    5.6.7 Reliability of the DBS3900 Configured in Mode 7

    MTBF (Years) MTTR (Hours) Availability Interruption Duration (Minutes/Year)

    27.77 1 99.999589% 2.16

    27.77 3 99.998767% 6.48

    5.6.8 Reliability of the DBS3900 Configured in Mode 8

    MTBF (Years) MTTR (Hours) Availability Interruption Duration (Minutes/Year)

    27.54 1 99.999585% 2.18

    27.54 3 99.998756% 6.54

    5.6.9 Reliability of the DBS3900 Configured in Mode 9

    MTBF (Years) MTTR (Hours) Availability Interruption Duration (Minutes/Year)

    46.00 1 99.999752% 1.30

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    MTBF (Years) MTTR (Hours) Availability Interruption Duration (Minutes/Year)

    46.00 3 99.999255% 3.90

    5.6.10 Reliability of the DBS3900 Configured in Mode 10

    MTBF (Years) MTTR (Hours) Availability Interruption Duration (Minutes/Year)

    45.86 1 99.999751% 1.31

    45.86 3 99.999253% 3.92

    5.6.11 Reliability of the DBS3900 Configured in Mode 11

    MTBF (Years) MTTR (Hours) Availability Interruption Duration (Minutes/Year)

    121.03 1 99.999906% 0.49

    121.03 3 99.999717% 1.48

    5.6.12 Reliability of the DBS3900 Configured in Mode 12

    MTBF (Years) MTTR (Hours) Availability Interruption Duration (Minutes/Year)

    120.61 1 99.999905% 0.50

    120.61 3 99.999716% 1.50