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HQ02b : Test plan overview Test plan overview: Main elements and Open questions H. Bajas TE-MSC-TF H. BAJAS Update meeting on HQ02b assembly and test plan 02/05/2014

HQ02b : Test plan overview Test plan overview: Main elements and Open questions H. Bajas TE-MSC-TF H. BAJASUpdate meeting on HQ02b assembly and test plan02/05/2014

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Page 1: HQ02b : Test plan overview Test plan overview: Main elements and Open questions H. Bajas TE-MSC-TF H. BAJASUpdate meeting on HQ02b assembly and test plan02/05/2014

HQ02b : Test plan overview

Test plan overview: Main elements and Open questions

H. BajasTE-MSC-TF

H. BAJAS Update meeting on HQ02b assembly and test plan02/05/2014

Page 2: HQ02b : Test plan overview Test plan overview: Main elements and Open questions H. Bajas TE-MSC-TF H. BAJASUpdate meeting on HQ02b assembly and test plan02/05/2014

HQ02b : Test plan overview

H. BAJAS Update meeting on HQ02b assembly and test plan02/05/2014

CERN Test Facility Schedule

• The Insert will be available after MQXC2 test, saying Mid-March 2014 if everything goes well.

• With anticipated actions (DAQ & HFU setup), HQ02b preparation with assembly on insert, continuity and warm HV test would take 2 days.

• Based on HQ01-e, the cooling down would take 50 hours.

• Three weeks (15 days) of Powering Test is scheduled at CERN.

• Warm-up.

Page 3: HQ02b : Test plan overview Test plan overview: Main elements and Open questions H. Bajas TE-MSC-TF H. BAJASUpdate meeting on HQ02b assembly and test plan02/05/2014

HQ02b : Test plan overview

H. BAJAS Update meeting on HQ02b assembly and test plan02/05/2014

Status of the interfaces

• Mechanical

• The technical drawings have been provided.• Nothing is changing compare to HQ01e.• Rods are at CERN, length 250 mm.• The holes on the suspension plate gets the same diameter (OK)

• Electrical

• 82 Voltage taps (including 3rd lead splice survey), OK• 8 Quench Antennas (16 wires), OK (treated as V_taps)• 1 Acoustic System, (1 BNC + 2 wires),

OK (machining needed for BNC bath, wires treated as V_taps).

Page 4: HQ02b : Test plan overview Test plan overview: Main elements and Open questions H. Bajas TE-MSC-TF H. BAJASUpdate meeting on HQ02b assembly and test plan02/05/2014

HQ02b : Test plan overview

H. BAJAS Update meeting on HQ02b assembly and test plan02/05/2014

Test facility limits at 1.9 K and 4.2 K

• Cryogenics condition recovery time (based on HQ01e)

• @ 4.2 K, quench with 11 Miits, 200 kJ bath deposited energy. 1 hour 30 min

• @ 1.9 K, quench with 13 Miits, 320 kJ bath deposited energy. 2 hours 30 min 4 to 6 quenches per day 16 to 24 quenches for dedicated training period

Page 5: HQ02b : Test plan overview Test plan overview: Main elements and Open questions H. Bajas TE-MSC-TF H. BAJASUpdate meeting on HQ02b assembly and test plan02/05/2014

HQ02b : Test plan overview

H. BAJAS Update meeting on HQ02b assembly and test plan02/05/2014

Test facility limits at 1.9 K and 4.2 K

• Cryostat pressure rise concern:

• He buffer (balloon) activated for pressure > 2.2 bars.• Based on HQ01e, quench @ 4.2 K is at the limit.

Page 6: HQ02b : Test plan overview Test plan overview: Main elements and Open questions H. Bajas TE-MSC-TF H. BAJASUpdate meeting on HQ02b assembly and test plan02/05/2014

HQ02b : Test plan overview

H. BAJAS Update meeting on HQ02b assembly and test plan02/05/2014

Test facility limits at 1.9 K and 4.2 K

• Cryostat pressure rise concern:

• Based on HQ01e, quench @ 4.2 K is at the limit.• 1.9 K, 14 Miits (300 kJ, training) HeII transition (no evaporation)

18 Miits (700 kJ, no dump), evaporation, balloon used 4.5 hours recovery (!!)

• At 4.2 K, the pressure should be surveyed: @ Iss the balloon will surely be usedHigh Miits not recommended

• At 1.9 K, safe pressure-wise, high Miits recovery can be long.

Page 7: HQ02b : Test plan overview Test plan overview: Main elements and Open questions H. Bajas TE-MSC-TF H. BAJASUpdate meeting on HQ02b assembly and test plan02/05/2014

HQ02b : Test plan overview

H. BAJAS Update meeting on HQ02b assembly and test plan02/05/2014

Main parameters of the test Preliminary cold test to ensure test can be carried on:

• T = 4.2 K (or directly 1.9 K) ?

• Rdump = 120 mW in order to test high voltage at low current.

• Provoked extraction @ IM = 3 and 6 kA using PH firing.

• Provoked extraction @ IM = 3 and 6 kA using CLIQ.

• Provoked extraction @ IM = 3 and 6 kA using PH + CLIQ.

• Do we want to perform 9 kA extraction:• No: may spoil “virgin state” before training• Yes: extra point for CLIQ

Page 8: HQ02b : Test plan overview Test plan overview: Main elements and Open questions H. Bajas TE-MSC-TF H. BAJASUpdate meeting on HQ02b assembly and test plan02/05/2014

HQ02b : Test plan overview

H. BAJAS Update meeting on HQ02b assembly and test plan02/05/2014

Main parameters of the test Training performance:

• T = 1.9 K

• Rdump = 60 mW (Vmax = 1 kV @ Iss ) to be coherent with FERMI test.

• Delay before energy extraction (details in word document): • 5 ms (limit bath deposited energy at maximum)• Miits ~ 14 MA2.s @ Iss• Enough to follow propagation (??)• Coherent with FERMI test (??)

• Threshold for quench detection• Detection on differential and direct signals• Differential: 10 mV, direct: I-dependent, manually

adapted.• FERMI test settings for HQ02a2 (??)

Page 9: HQ02b : Test plan overview Test plan overview: Main elements and Open questions H. Bajas TE-MSC-TF H. BAJASUpdate meeting on HQ02b assembly and test plan02/05/2014

HQ02b : Test plan overview

H. BAJAS Update meeting on HQ02b assembly and test plan02/05/2014

Test plan main questions

• Current Ramp Profile for regular training• RR = 50 A.s-1 up to 10 kA (or 12-13 kA ??)• RR = 20 A.s-1 up to Iq• Cored cable RR dependence could allow going with 50 A.s-1

all the way which also same time…

• Criteria for stopping trainingAssume we get to 16 kA relatively quickly.From 16 kA to 16.5kA, train unless we find an actual plateau (DIq < 50 A in 5 quenches).From 16.5 kA to 17 kA: stop if DIq < 250 A in 5 quenches (less than 10 quenches in this interval) From 17 kA to 18 kA: stop if DIq < 500 A in 5 quenches (less than 10 quenches in this interval).

Page 10: HQ02b : Test plan overview Test plan overview: Main elements and Open questions H. Bajas TE-MSC-TF H. BAJASUpdate meeting on HQ02b assembly and test plan02/05/2014

HQ02b : Test plan overview

H. BAJAS Update meeting on HQ02b assembly and test plan02/05/2014

Test plan main questions

• Do we split the training in two parts?• Inserting lower current quenches with CLIQ and/or PH test• Test CLIQ at 1.9 K or 4.2 K?• Observe the effect of CLIQ+PH on training current gain.

• CLIQ extra Miits? Filament breakage? Hot Spot?

• Do we check the performance @ 4.2 K after training?

• Do we check the performance @ low ramp rate (all the way) if the maximum current has increased wrt. FERMI test?

• Do we want temperature dependence study?

Page 11: HQ02b : Test plan overview Test plan overview: Main elements and Open questions H. Bajas TE-MSC-TF H. BAJASUpdate meeting on HQ02b assembly and test plan02/05/2014

HQ02b : Test plan overview

H. BAJAS Update meeting on HQ02b assembly and test plan02/05/2014

High Miits test parameters

• The idea is to play only with the extraction delay to increase the Miits in a more controled and predictable way.

• The dump can be as high as voltage allows to limit deposited energy.

• The dump could also be removed as it was do for HQ01-e• The inner layer PH could also be removed as it was do for HQ01-e.

• 18.3 MA2.s

Let us see expectation….

Page 12: HQ02b : Test plan overview Test plan overview: Main elements and Open questions H. Bajas TE-MSC-TF H. BAJASUpdate meeting on HQ02b assembly and test plan02/05/2014

HQ02b : Test plan overview

H. BAJAS Update meeting on HQ02b assembly and test plan02/05/2014

High Miits test parameters

Extraction delay L Rd Rmt Iq V max E max Miits T

[s] [mH] [mW] [mW] [s] [kA] [V] [kJ] [MA2.s] [K]

0.005 5.8 60 20 0.0725 18.3 1098 971.2 13.8 206

0.01 5.8 60 20 0.0725 16.5 990 789.5 12.6 179

Miits [MA2.s]

12.6 0 0.005 0.01 0.015 0.02 0.025 0.03 0.035 0.04 0.045 0.05 0.055 0.06 0.065 0.07 0.075 0.080 39.48 40.84 42.2 43.56 44.92 46.28 47.64 49.01 50.37 51.73 53.09 54.45 55.81 57.17 58.53 59.9 61.26

10 26.32 27.68 29.04 30.4 31.76 33.12 34.49 35.85 37.21 38.57 39.93 41.29 42.65 44.01 45.38 46.74 48.120 19.74 21.1 22.46 23.82 25.18 26.54 27.91 29.27 30.63 31.99 33.35 34.71 36.07 37.43 38.8 40.16 41.5230 15.79 17.15 18.51 19.87 21.24 22.6 23.96 25.32 26.68 28.04 29.4 30.76 32.13 33.49 34.85 36.21 37.5740 13.16 14.52 15.88 17.24 18.6 19.97 21.33 22.69 24.05 25.41 26.77 28.13 29.49 30.86 32.22 33.58 34.9460 9.869 11.23 12.59 13.95 15.31 16.68 18.04 19.4 20.76 22.12 23.48 24.84 26.2 27.57 28.93 30.29 31.65

T [K]179.4 0 0.005 0.01 0.015 0.02 0.025 0.03 0.035 0.04 0.045 0.05 0.055 0.06 0.065 0.07 0.075 0.08

0 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.910 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.920 386.2 442.3 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.930 255.5 295.6 340.8 391.5 448.2 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.940 191.2 222.4 258 298.5 344 395.1 452.2 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.9 501.960 131.8 153.9 179.4 208.8 242.6 281 324.4 373.1 427.7 488.6 501.9 501.9 501.9 501.9 501.9 501.9 501.9

T [K] > 300 K

Dump resistor

value [mW]

Energy Extraction Delay [s]

Dump resistor

value [mW]

Miits [MA2.s] >18

Energy Extraction Delay [s]

Page 13: HQ02b : Test plan overview Test plan overview: Main elements and Open questions H. Bajas TE-MSC-TF H. BAJASUpdate meeting on HQ02b assembly and test plan02/05/2014

HQ02b : Test plan overview

H. BAJAS Update meeting on HQ02b assembly and test plan02/05/2014

High Miits test parameters

Page 14: HQ02b : Test plan overview Test plan overview: Main elements and Open questions H. Bajas TE-MSC-TF H. BAJASUpdate meeting on HQ02b assembly and test plan02/05/2014

HQ02b : Test plan overview

H. BAJAS Update meeting on HQ02b assembly and test plan02/05/2014

Thank you for your attention.