HMI Introduction - twse.com.tw

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HMIHMI IntroductionIntroduction


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�� Company ProfileCompany Profile

�� Product PortfolioProduct Portfolio

�� Core TechnologyCore Technology

�� R&D StrengthR&D Strength

�� HMI PerformanceHMI Performance

�� Motivation of EBI MarketMotivation of EBI Market

OutlinesOutlines


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Chairman

2003/5

Industry Type

Main Products

Location of Headquarters

President

Capital

Number of Employees

Date of Establishment

Shu, Chin-Yung

Jack Y. Jau

NT$ 660,000,000

208 people (446 people of HMI group)

Semiconductor

Electron beam inspection equipment

Hsinchu City, Taiwan (R.O.C.)

Company ProfileCompany Profile

Type of

Shareholders

Financial

Institutions

Other Juridical

Persons

Domestic

Natural Persons

Foreign Institutions

& Natural PersonsTotal

Shareholding 521,479 28,672,000 19,773,521 17,033,000 60,000,000

Holding Percentage (%)

0.79% 43.44% 29.96% 25.81% 100%

Shareholders StructureShareholders Structure Date：2012/5/17


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Org. Chart of HMI GroupOrg. Chart of HMI Group

HMI US HMI Beijing

Administration& Finance

Chairman

President

Board MeetingInternal Auditor

Safety& Facility

Date：2012/6/30

HMI Japan

Manufacturing

HMI Korea

TQMBusiness

Development & Support

RD & Tech. Support


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HMI Headquarters

- Based in Hsinchu City

- Operation center of the corporation

HMI Headquarters & HMI Headquarters & HsinchuHsinchu Science Park Branch Science Park Branch

Hsinchu Science Park Branch

- Based in Hsinchu Science Park

- R&D center


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- Based in Tainan Science Park

- Manufacturing and production center of the corporation

- R&D center

Tainan BranchTainan Branch


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HMI USA HMI USA Hermes Hermes MicrovisionMicrovision, Inc., Inc.

- Established in 1998- Located in San Jose, California - R&D center of the corporation


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HMI China, HMI Japan and HMI KoreaHMI China, HMI Japan and HMI Korea

HMI China: HMI China: Hermes Microvision Co., Ltd.(Beijing)- Located in Beijing

- Research and manufacture center of modules

HMI Japan: HMI Japan: Hermes Microvision Japan Inc. - Located in Tokyo

- Sales and technical service center

HMI Korea: HMI Korea: Hermes Microvision Korea Inc.- Located in Kyungki-do

- Sales and technical service center


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Year Major Events

1998Hermes Microvision, Inc. was founded in Silicon Valley, and started to be devoted to R & D for electron beam (e-beam) wafer inspection equipment.

2003

Hermes Microvision Precision Technology Co., Ltd. was founded in Hsinchu City, and the

paid-in capital is NT$1 million.

Company changed its name to Hermes Microvision, Inc..

Successfully developed eScan®300, the first inspection system of HMI.

2004

HMI Taiwan acquired 100% shares of HMI USA.

Company moved to the Hsinchu Science Park.

Sold first inspection system (eScan 300), and successfully penetrated the e-beam wafer inspection market that was monopolized by American and Japanese companies.

Set up Tainan branch at the Southern Taiwan Science Park to enlarge production scale.

Increased paid-in capital to NT$500 million.

2005Official gained entrance into the production line of Japanese and Korean semiconductor

foundries.

2006

Japan branch office established.

Successfully developed eScan®310 and eScan®380.

Received "2006 Supplier Excellence Awards in E-Beam Inspection" from Taiwan Semiconductor Manufacturing Company.

MilestonesMilestones


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Listed on Taiwan's GreTai Securities Market on May 21. 2012


Year Major Events

2007Increased paid-in capital to NT$780 million.

Received certificate of ISO 9001:2000.

2008

Japan and Korean subsidiaries established and Japan branch office terminated.

Reduced paid-in capital by NT$650 million while simultaneously applied cash injection of

NT$280 million. The final paid-in capital was NT$410 million.

Public issue of shares.

Successfully developed eP2, eScan Lite and eScan®315.

2009China subsidiary became important module production site.

Successfully developed eScan®400.

2010Successfully developed eScan®320 eXplore, eManager Workstation and Supernova.


2011

Successfully developed eP2.

Registered as an emerging stock company.

Company moved to the Hsinchu city, and set up Hsinchu science park branch.

MilestonesMilestones


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Product PortfolioProduct Portfolio


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Semiconductor Capex

~65 Billion USD

Equipment Capex~44 Billion USD

Wafer fab equipment Capex~36 Billion USD

Process Control

~4.4 Billion USD

Market SegmentMarket Segment

Year 2012


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Thin FilmThin Film

CVDCVD PVDPVD

ECDECD

CMPCMP

Ion ImplantIon Implant

RTPRTP FurnaceFurnace

IntegrationIntegrationEtchEtchLithoLitho

OPCOPC Wet StationWet Station

Critical

Dimension Insp.

Critical

Dimension Insp.

MASKMASK

PR coating/

Bake/Develop

(Track)

PR coating/

Bake/Develop

(Track)

Scanner(Stepper)

Scanner(Stepper)

Single Wafer

Processor

Single Wafer

Processor

Dry EtchDry Etch Dry StripDry Strip

Thin Film Insp.Thin Film Insp.

Defect Insp.Defect Insp.

AutomationAutomation

Yield Yield

EnhancementEnhancementAutoAuto

SupplierSupplier

TEL

Sokudo

SEMES

ASMLNikon

Canon

Brooks

Asyst

HP

Lam Research

TEL

AMATMattson

PSK

Novellus

SemitoolDNS

SES

SEZ

Ebara

Varian

SENAxcelis

Nissin

AMAT

Novellus

TEL

Ulvac

Semitool

Hitachi

AMAT

KLA-TencorRudolph

Nanometrics

MattsonDNS

ASMHitachi

Tokyo Seimitsu

Key Supplier Chain for Semiconductor ManufacturingKey Supplier Chain for Semiconductor Manufacturing

eP Series

Process Monitoring

eXplore

Mask Inspection

eScan®320

High Sensitivity InspectioneScan®400

High Throughput

Inspection System

HMI eScan® Series Product

Hermes Hermes MicrovisionMicrovisionSupernova™

Die-to-databaseInspection


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Process steps

Wafer yield

Critical steps

HMI eBeam Inspection System

TROUBLE FAST FEEDBACK

Process steps

Fab cost $

Yield NG !Slow feedback time

Purpose of Purpose of eBeameBeam Inspection System (1)Inspection System (1)

wafers

Fab cost $


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Inline Process Flow

PC/ DFM Hotspots

eP2Process

Monitoring

Design OPC Litho Etch CMPMask

eXplore Mask Inspection

Mask Defects

eScan®320 High sensitivity defect inspection

eScan®400 High throughput defect inspection

Data-Input/ Output

Data Output

Inline Process steps

Random/ Systematic VC and Physical

Defects on both Array/ Logic areas

ADI Large Logic AreasArray LogicVC hotspots

Physical hotspots

Results

D2D, D2DB Mask Inspection

D2DB Capability

Supernova™D2DB engine

Purpose of Purpose of eBeameBeam Inspection System (2)Inspection System (2)


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Core Technology Core Technology


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1991 2003 2013

65nm 14nm250nm

~ 1931First SEM

First eBeam inspectionsystem by KLA

First advancedeBeam inspection

system by HMI

First multi-columneBeam inspection

system by HMI

SEM Technology for Wafer InspectionSEM Technology for Wafer Inspection

eBeameBeam inspectioninspection

Wafe

r In

sp

ecti

on

Tech

no

log

y

Optical inspection

1998

Tech node28nm


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Objective lens Objective lens ---- focuses the beam onto the wafer surface

where signal electrons will be generated

X

Y

Z

XYZ stage XYZ stage ---- operated for selecting various regions of

interest on the wafer.

Deflectors Deflectors ---- "scan" the beam in a raster fashion.

Final aperture Final aperture ---- further eliminates high-angle electrons

Condenser lens Condenser lens ---- collimates beam to roughly parallel

Condenser aperture Condenser aperture ---- eliminates high-angle electrons.

Electron Gun Electron Gun ---- produces electron beam

SESEBSEBSE

Wafer Wafer ---- situates on top of e-chuck.

Detector Detector –– detect SE and BSE signal.

How does eHow does e--beam work?beam work?


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eBeam system

Algorithm

Mechanicalsystem

GDS analysis

e-optics

Image comparison

Stage

GDS computingpower

deflection

Imaging

Vacuum

High resolution

High sensitivity

High stability

Feed back to design

Module Sub-module Output

eScan®

HMIHMI Owns All Key TechnologyOwns All Key Technology


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2012201020082006

eScan30030nm

eScan31015nm

eScan315xp10nm

eScan3207nm

eScan5003nm

2004

E-beam resolution achieves ~30% improvement at every generation.

5

HMIHMI + Semi conductor Technology Coverage+ Semi conductor Technology Coverage


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R&D StrengthR&D Strength


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R&D Org. ChartR&D Org. Chart

TaiwanRD & Tech.

Support Center

TaiwanRD & Tech.

Support Center

USA

RD Center

USA

RD CenterChina

RD Center

China

RD Center

Chief Tech. Officer

Chief Tech. Chief Tech.

OfficerOfficer

• ADC eManager

• Image Processing

• SEM

• EE, Analog

• Mechanical, platform

• Defect analysis

• Technical support

• System integration

• Digital and analog design

• auto Focus Design

• Field Emission Research

• Electronic Modules design

• E-Beam Detectors design

• Super Computer Architecture

• Inspection algorithm design

• High Precision X.Y.Z Stage integration

• Product prototype

• Multi-Axis Electron-Optics parts prototype

• EO Column

• EO sources

• E-Chuck Design

• EE module prototyping

Date：2012/6/30


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HMI PerformanceHMI Performance


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設備用途設備用途設備用途設備用途生產單位生產單位生產單位生產單位 ––––

研發單位研發單位研發單位研發單位 ––––

生產與研發單位生產與研發單位生產與研發單位生產與研發單位 ––––

HMIHMI Worldwide CustomersWorldwide Customers

Top Memory and Logic fabs are our customers


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Machine Sales StatusMachine Sales Status

Machine Sales by Region

as of June 2012as of June 2012

Market ShareMarket Share

EU 2%SG 6% CN 7%

KR 27%

JP 16%

TW 35%

US 7%

All numbers are approximate.


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Last 5 years Consolidated Net ProfitLast 5 years Consolidated Net Profit

24%

68%

654

1,808

2,678

Y 2011

34%

70%

16%

62%

(10%)

55%

(35%)

39% 1406951648390Gross Profit / Gross Margin

Net Income /

Profit Margin

Net Sales

682251(120)(345)

19941,5451,168988

Y 2012 Q2Y 2010Y 2009Y 2008Million NTD


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Motivation of EBI MarketMotivation of EBI Market


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REVOLUTION

Revolution of Mobile Devices

Wireless,

Smartphone, HD media, Cloud demand growth

Revolution = Revolution = ““Small and CompactSmall and Compact””


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Motivation of EBI MarketMotivation of EBI Market

Consuming 3C products

IC industry

Semiconductor industry

CAPEX of advanced fabs

Demand of Demand of HMI eBeameBeam Inspection SystemInspection System


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More inspection tools with high resolution are required to meet the trend

To

tal In

sp

ectio

n L

ayers

0

10

20

30

40

50K

ille

r D

efe

ct

Co

un

ts

0

20

40

60

80

100

120

140

160

Killer Defect Counts (Physical Defect)

Killer Defect Counts (VC Defect)

Total Inspection Layers

65 45 32 22

Technology Node (nm)

Defect Inspection TrendDefect Inspection Trend

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HMI Introduction - twse.com.tw