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The environmental regulations to reduceaverage CO2 emissions and automotivetrends play in favor of stronger vehicleelectrification and faster deployment ofElectric Vehicles/ Hybrid Electric Vehicles(EV/HEVs). Yole Développement expectsthat EV/HEV market in number of vehicleswill reach 24 Million units by 2024.
Increasing battery energy capacity enableslonger driving range of electric cars andpowerful electric motors enable strongacceleration.
High electric power and needs for inverterdownsizing bring challenges on the powermodule level.
Innovations at this level concern differentsolution such as power module aspect(power card-like power module),baseplate structure (pin fin), coolingtechnology (double-side cooling).
Hitachi combines all these key innovationsin its new integrated 3rd generationdouble-side cooling power module. In thisdesign, Hitachi implements a built-insilicon insulated-gate bipolar transistors(IGBTs) and diodes.
System Plus Consulting presents a deepanalysis of the Hitachi power moduleintegrated in Audi e-tron’s inverter.
Supported by a full teardown of themodule’s components and housing, thisreport reveals Hitachi’s innovative assetsto assemble its 3rd generation double-sided cooling package as well as thedesigns of its IGBT and diode.
This report includes an estimatedmanufacturing cost of all the module’scomponents and its selling price analysis.It proposes a comparison between doublesided cooling automotive power modulesfrom Hitachi, Toyota, and Infineon.
These comparisons highlight differences inthe packaging design, dies, and costs.
COMPLETE TEARDOWN WITH
• Detailed optical and SEM photos
• Precise measurements
• Material EDX analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Estimated selling price
• Technology and cost comparisons with Toyota Prius DSC, and Infineon HybridPACK FF400R07A01E3
Discover Hitachi’s power module and its innovative assembling technology ofintegrated double-side cooling structure.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: Hitachi DSC Power Module from Audi e-tronInverter
Pages: 127
Date: January 2020
Format: PDF & Excel file
Price: EUR 3,990
Hitachi Double-Side Cooling Power Module from Audi e-tron’s Inverter
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS
Overview/Introduction
• Executive Summary
• Market
• Reverse Costing Methodology and Glossary
Company Profile
• Hitachi Company Profile
• Hitachi Inverter Technology
• Supply Chain
Physical Analysis
• Synthesis of the Physical Analysis
• Package Analysis
Package opening & cross-section
• Si IGBT Die
IGBT die view & dimensions
IGBT die process & cross-section
• Si Diode Die
Diode die view & dimensions
Diode die process & cross-section
Manufacturing Process
• Si IGBT Fabrication Unit and Process Flow
• Si Diode Fabrication Unit and Process Flow
• Final Test & Packaging Fabrication unit and Process Flow
AUTHORS
Cost Analysis
• Synthesis of the Cost Analysis, Yields Explanation & Hypotheses
• Si IGBT
IGBT front-end cost and wafer cost per process step
IGBT die probe test & dicing
IGBT die cost
• Si Diode
Diode front-end cost and wafer cost per process step
Diode die probe test & dicing
Diode die cost
• Power Card Cost
Power card BOM & card assembly cost
• Module Cost
Module BOM cost
Packaging assembly
Final module cost
Selling Price Analysis
• Definition of prices
• Estimation of selling price
Comparison
• Hitachi vs Toyota vs Infineon DSC Power Modules
HITACHI DOUBLE-SIDE COOLING POWER MODULE FROM AUDI E-TRON'S INVERTER
RELATED REPORTS
Infineon FF400R07A01E3 Double Side Cooled IGBT ModuleDiscover Infineon‘s first double sided cooling power module for automotiveJanuary 2018 - EUR 3,490*
Toyota Prius Power ModulesToyota Prius 4 PCU modules integrate IGBT and freewheeling diodes onto innovative double side cooling packaging for hybrid electric vehicles, allowing better thermal dissipation, modularity and scalability of the system.September 2016 - EUR 3,490*
Mitsubishi J1- Series 650V High-Power Modules for AutomotiveThe first power module with 7th-gen CSTBT IGBT and an innovative integrated substrate.October 2018 - EUR 4,990*
Amine Allouche is part of System PlusConsulting’s Power Electronics andCompound Semiconductors team.Amine holds a Master’s degreefocused on Micro and Nano-technologies for integrated Systems.
Véronique Le Troadec has joinedSystem Plus Consulting as alaboratory engineer. Coming fromAtmel Nantes, she has extensiveknowledge in failure analysis ofcomponents and in deprocessing ofintegrated circuits.
COSTING TOOLS
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Process-BasedCosting Tools
ParametricCosting Tools
WHAT IS A REVERSE COSTING®?
Reverse Costing® is the process of disassembling a device (or asystem) in order to identify its technology and calculate itsmanufacturing cost, using in-house models and tools.
IC Price+
MEMS CoSim+
MEMS Price+
Power CoSim+
Power Price+
LED CoSim+
3D PackageCoSim+
DisplayPrice+
PCBPrice+
SYSCost+
CONTACTS
ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting is specialized
in the cost analysis of electronics
from semiconductor devices to
electronic systems.
A complete range of services and
costing tools to provide in-depth
production cost studies and to
estimate the objective selling price of
a product is available.
Our services:
• STRUCTURE & PROCESS
ANALYSES
• TEARDOWNS
• CUSTOM ANALYSES
• COSTING SERVICES
• COSTING TOOLS
• TRAININGS
www.systemplus.fr
Headquarters22, bd Benoni GoullinNantes Biotech44200 NantesFrance+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGermany+49 151 23 54 41 [email protected]
America Sales OfficeSteven LAFERRIEREWestern USA & Canada+1 [email protected]
Chris YOUMANEastern USA & Canada+1 919-607-9839 [email protected]
Asia Sales OfficeTakashi ONOZAWAJapan & Rest of Asia+81 80 4371 [email protected]
Mavis WANGGreater ChinaTW +886 979 336 809CN [email protected]
Peter OKKorea+82 10 4089 [email protected]
Our analysis is performed with our costing tool Power CoSim+.
System Plus Consulting offers powerful costing tools to evaluate the production cost and selling price from
single chip to complex structures.
Power CoSim+Cost simulation tool to evaluate the cost of any Power Electronics process or device: from single chip tocomplex structures.
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8.FORCE MAJEURESystem Plus Consulting responsibility will not be involved in non execution or late delivery of one of its dutiesdescribed in the current terms and conditions if these are the result of a force majeure case. Therefore, the forcemajeure includes all external event unpredictable and irresistible as defined by the article 1148 of the French CodeCivil?
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