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HIRP OPEN 2017
HIRP(Huawei Innovation Research Program) www.huawei.com
Openness
Collaboration
Innovation
2
Huawei at a Glance
18万 员工
15 80,000 72 170+ 129 研究院/所 研发员工 品牌排名 国家 世界500强排名
180,000 Employees
15 80,000 No. 72 170+ No. 129
R&D institute
and centers
R&D
employees
Interbrand's Top
100 Best Global
Brands
Countries Fortune
Global 500
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Providing ICT Solutions & Services
Consumer Business
A brand loved by consumers
Carrier Business
Customers' best strategic partner
Enterprise Business
Enabler and best partner of enterprise
digital transformation
A Global Leader of ICT Solutions and Products
Information Distribution and Presentation Information Transmission Information Processing and Storage
Data center infrastructure
Big data analytics platforms
Cloud services
Smartphones
MBB & home devices
Wearable devices
Vehicle telematics
Wireless networks
Fixed networks
Carrier software and core
networks
Enterprise networks
M2M connection management
platforms
Serving global carriers Serving hundreds of millions of consumers
Serving global enterprises and industry customers
Professional services
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Sustainable, Robust Growth
• Enterprise business: innovative solutions for digital
transformation delivered together with partners; profitable and
sustainable growth in key industries (e.g., smart cities, energy,
finance, transportation, and manufacturing)
• Consumer business: key breakthroughs in the global high-end
market, taking Huawei's brand influence to a new level
• Carrier business: stronger position in network products and
services; video, cloud, and operations transformation as
strategic priorities; growing the industry and moving it forward;
higher working capital efficiency
USD billion
2012 2013
46.7
2014
35.4 39.3
61.3
2015
75.1
2016
Sales Revenue
Note: financial data audited by KPMG
Robust growth across all business segments,
thanks to balanced market presence worldwide and
commitment to strategic focus
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Academia & Industry – challenges and solutions
Industry Academia
Academia Industry
Resources
•Imagination
•Insight
•Efficiency
Challenge:
Asymmetry
Solution:
Collaboration
We want:
•Rapid progress
•Birds-eye-view solutions
•Balanced partnership
...
We want:
•Unrestricted process
• Deep research
•More data
...
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Technology & Innovation Management Thinking
1 2
3 Theory
Practice
Feedback
1 2 3 HIRP
•Finance
•Experiences
•Knowledge
•Knowledge
•Advanced products
•New tech
•Reputation
•Relationships
•Finance
Right
projects
Right partners Commercial-
ization process
Input Output
Open/Flagship/Exploratory
New demands,…
Input Technology and innovation
management process Output
Knowledge
Technology
Innovation
Competitiveness
Output thinking
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What HIRP is about HIRP:Huawei Innovation Research Program
An Open Innovation Initiative, a sponsorship program targeted at funding leading universities and research
institutes conducting innovative research in ICT areas
HIRP
Innovation Ideas
Knowledge
Know-how
…
Academia Industry
Real Requirements
Market Demonds
Problems
…
Build a Better Connected World Through Open Innovation & Cooperation
Innovative Solutions & Products
Core patents Excellent academic
achievements
Power of
knowledge Sponsorship
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Why HIRP?
Consumer Business
A brand loved by consumers
Huawei:
• Improve and ensure competitiveness
through cooperation with academia.
• Better serve our customers.
• Lead the ICT industry.
Academia:
• Understand the real requirements from
the market.
• Transfer academic results into
productive innovations
• Identify new research directions.
• Nourish talents and grow teams
Balance the research freedom of
academia and the goals of industry,
Carrier Business
Customers' best strategic partner
• Research and innovation are high-risk
activities, that go hand in hand with
failures.
• Huawei’s commitment to continuous
investment in R&D, long-term
cooperation and innovation .
• Only pure perseverance leads to
breakthrough.
Enterprise Business
Enterprises' best innovation partner
• The collaboration with academia needs
to be open: open-mindedness in a
friendly and open atmosphere.
• Explore the cutting-edge topics from
multiple paths and multiple directions.
• Enlarge the investment in the basic
research under the tip of the iceberg.
• Spur novel ideas to great opportunities,
fasten transfer from knowledge to
productivity.
Complementary
Advantages Innovation is marathon Open Collaboration
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Over 11 Years of History
2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
Hundreds of world-class research organizations
Almost 30 countries worldwide More than 600 HIRP projects were awarded
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Focused on ICT Areas
Huawei Pipe Strategy
Information
Storage/
Computing
Information
Transport
Information
Create
/Display
Wireless Communication Technology
Network & Information security Technology
Operation System
Engineering Technology
Data Management and Process
TOPIC Areas
Future Networks
Optical Technology
Storage Technology
Computing Technology
Big Data & Artificial Intelligence
Media Technology
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HIRP Structure
Support research that will significantly
impact technology areas that are of
mutual interest to academic and Huawei.
Large and multi-year contract-based
awards.
Invitation-only basis, inviting leading-
class faculty members from top
universities and research institutes around
the world .
HIRP FLAGSHIP
Bring together internationally renowned
leading researchers for the purpose of
exploring cutting-edge topics.
Format: Advisory Board、Summit、
Seminar etc.
Invitation-only basis
HIRP Exploratory
Support novel and early-stage research
ideas in the ICT areas that Huawei
published or even beyond.
1~2 year award with amount about
70,000 USD.
Open call for proposals , usually 2
rounds per year. Yet accept online
submission anytime for novel ideas.
HIRP OPEN
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HIRP Process & IPR Policy
HIRP Open: usually 2 rounds
per year, the main round is in
May ;
accept online submission
anytime for novel ideas
HIRP Exploratory & HIRP
Flagship :Invitation-only
basis, is announced periodically
according to industry and
technology developments
Submission through
HIRP WEBSITE
http://innovationresearch
.huawei.com/
Or
The agreement type or IPR Policy depends on the
project,there is
•Contract –based
•Collaborative research
•Sponsored research
•Gift funding
HIRP Open: usually in
1 months after proposal
submission
HIRP Exploratory &
HIRP Flagship :
usually in 1~2 weeks
after proposal submission
•Owned by Huawei
•Owned by University
•Jointly owned
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HIRP OPEN 2017
HIRP OPEN 2017 first round will publish 140 research subjects involving 13 technical fields
HIRP OPEN
2017
Wireless Communication Technology
Future Networks
Optical Technology
Computing Technology
Big Data & Artificial Intelligence
Media Technology
Storage Technology
Engineering Technology
Network & Information security Technology
Human-Computer Interaction
Data Management and Process
Operation System
LBS & GIS
15th May, 2017 15th May ~ 15th June July 2017 July ~ September, 2017
For further inquiry and any comments, please contact us by Email: [email protected]
You could visit http://innovationresearch.huawei.com/IPD/hirp/portal/hirp/contact-us.html or http://www.huawei.com/en/
Note: Please use IE or Chrome and set security level to MEDIUM.
HIRP OPEN 2017 - Wireless Communication Technology
Network
Slicing
Connection
1,000K connection/Km2
Mobility
500km/h
Throughput
10Gbps
/connection
Latency
1 ms
E2E
5G
100Mbps 10K 350Km/h 30~50ms Flexibility
LTE
Ga
pe 30~50x 100x 100x 1.5x NFV/SDN
MBB intelligence architecture for
future networks
Intelligent operation and maintenance
Network Slice
New Wireless Communication Network
based on common data
Array Base Station / Array Receiver
5G Massive MIMO
Coverage enhancement at High frequency band
Satellite communication/Drone communication
Wireless Physical Layer Algorithm
Design(combined with machine learning)
Cellular Passive IoT
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HIRP OPEN 2017 - Optical Technology
DSP
FEC
DR DAC
LD
PD ADC DSP FEC TIA
OA
OA
Modulator
Fiber
Quantum dot laser
High speed EML、DML
High speed VCSEL
High speed MZM
New type modulator
OE integrated ICT (Monolithic Driver+MZM)
High speed PIN
High sensitivity APD
OE integrated ICR (Monolithic PD+TIA)
New type fiber
Spatial fiber
multiplexing
800G+system
solution
Radio over Fiber
system analysis
Laser Technology Modulation Technology Receiving Technology Fiber Technology System Solution
Optical Transmission System and Module
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HIRP OPEN 2017 – Computing Technology / Big Data & Artificial Intelligence
Computing Technology:
Model building based on source code for
problem location
Fast failure detection technology for cloud-
distributed cluster
Acceleration of Graph Analytics based on
processor-FPGA system
Programming models and static/dynamic
tools for complex accelerator
Software and hardware optimization for
heterogeneous system
Quantum Algorithms
Superconducting Quantum Computing
Big Data & Artificial Intelligence:
Self learning microservice governance
autopilot, how to find the abnormal services
and take actions from huge data
Serverless function scheduling prediction: In
Serverless system, there are a varieties of
approaches to reduce the function call latency.
Data mining historical function call data might
be able to find function reference patterns
To develop efficient MLN approaches to
automatically analyze the associative
characteristics of the large-scale switch fault
data which has been collected by Huawei, and
to ensure high accuracy in detecting the
principle sources of the switch faults
Technology in Recommender Systems
Supply Chain Planning Technology
Human Brain-Inspired New Computing
Paradigm
Hardware Platform
Virtualization /OS
DB
Middleware
Application
Management software
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To optimize the design of file system in the scenario of cross-
region distributed file system
Design cross-Available Zone(AZ) distributed file system based
on distributed pool
HIRP OPEN 2017 – Storage Technology
Scenario 1:Data Protection
Prevent the Metadata Inconsistency
from Spreading
Location of useless Data in File
System’s Backup
Scenario 2:Distributed Cloud File System
Scenario 3:
Battery Storage Enhanced safety, Failure mechanisms for lithium battery
Wireless Charging Technology
VMware vSphere
On-Premise Site
BCManager eBackup
FusionSphere
Public Cloud
VM3’
VM3
Production storage
Production storage
Backup Storage
SAN/NAS/S3
BCManager eBackup
FusionSphere
VM1
Production storage
VM2
VM4
VM1’
S3
1 VM data backup
3 Directly backup the data
or replicate the data to remote public S3 cloud
2 Back up the data to local storage
3 Remote site replication of backed up data
4
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Terminal Device ESD simulation ESD test method
Structural Level
ESD static simulation
• Protective Device
• Layout
• IC ESD model
• Module (TP/LCD Camera
Speaker Receiver)
System level
ESD dynamic simulation
Circuit Level
EM model
characterisation
PCBA ESD/EOS simulation
HIRP OPEN 2017 - Engineering Technology
TP/LCD module test module which can find
most of the problems of the module itself
Mobile terminal test module which can find
the problems of mobile terminal, for
example grounding and so on
We will also test the voltage of IC port and
compare it with the simulation results
We will also test the voltage of IC port and
compare it with the simulation results
Copyright©2015 Huawei Technologies Co., Ltd. All Rights Reserved. All logos and images displayed in this document are the sole property of their respective copyright holders. No endorsement, partnership, or affiliation is suggested or implied. The information in this document may contain predictive statements including, without limitation, statements regarding the future financial and operating results, future product portfolio, new technology, etc. There are a number of factors that could cause actual results and developments to differ materially from those expressed or implied in the predictive statements. Therefore, such information is provided for reference purpose only and constitutes neither an offer nor an acceptance. Huawei may change the information at any time without notice.