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High-speed logic: Measure ment (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design , by Johnson and Graham

High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

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Page 1: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a)

1

CENG3480_B2 Measurement Techniques

Reference: Chapter 3 Measurement Techniques of High speed digital design , by Johnson and Graham

Page 2: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 2

Revision: frequency domain processing and filtering (1) Low-pass filter (2) High-pass filter (3) Band pass filter (4) Tuned filter (narrow band pass filter) See http://www.ee.duke.edu/~cec/final/node1.html

Page 3: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 3

Revision: Filtering is in Frequency domain not time domain Filtering is in Frequency domain, don’t mix up with high/low

amplitude levels

Higher amplitude lower freq.

Lower amplitude Higher freq.

timeamplitude

Page 4: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 4

Examples of filters

R C

R L

R

C

L R

Freq.

gain0dB

0dB

Freq.

Page 5: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 5

Analogies of Low-pass and High pass filters

High passLow pass

Page 6: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 6

A common example of a low pass filter: An operational amplifier: Diagram of gain bandwidth product, from [1]

Page 7: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 7

(1) Low pass filter (Frequency low than F-3dB can pass, or has power gain more than 0.5)

(1) Low pass (e.g. op.amp) At low freq, Gain=1=0dB At -3dB cut off, gain = 0.5, = -3dB

analog system

Vin Vout

Frequency

Gain in dB = 20 log10(Vout/Vin)

0-3dB

Flowpass(-3dB) =1/2RC

3dB cut off point

B=Bandwidth

VcR CIc(t)

E.g.

Page 8: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 8

(2) High pass filtering, (Frequency higher than F-3dB can pass, or has power gain more than 0.5)

High pass At low freq, Gain=0= -dB At -3dB cut off, gain =0.5, = -3dB

0

F-highpass(-3dB) = 1/2(L/R)

3dB cut off point

R L analog system

Vin Vout

Frequency

Gain in dB = 20 log10(Vout/Vin)

-3dB

Page 9: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 9

(3) Band - Pass Filters (Frequency within a range can pass)

0dB 3dB

gain

Band width

E.g. A band-pass filter by combining a low pass F low-pass(-3dB) filter , an ideal amplifier anda high pass F high-pass(-3dB) filter.

Ideal amplifierR L

Page 10: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 10

(4) Tuned filter: special case of a band-pass filter -- only a narrow band can pass

When the low pass F low-pass(-3dB), and the a high pass F high-pass(-3dB)filter are close.

Fc=center frequency, F=bandwidth (narrow)

0dB3dB

gain

Band width F

Fc =1/[2(LC) 1/2 ]Frequency

R

LC

Page 11: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 11

Rise time and bandwidth of CRO probes All scientific instruments have limitations Limitations of oscilloscope systems

inadequate sensitivity• Usually no problem because except most sensitive digital network, we are

well above the minimum sensitivity (analogue system is more sensitive) insufficient range of input voltage?

• No problem. Usually within range limited bandwidth?

• some problems because all veridical amplifier and probe have a limited bandwidth

Two probes having different bandwidth will show different response. Using faster probe

Using slower probe (6 MHz)

Page 12: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 12

Oscilloscope probes Components of oscilloscope systems

Input signal Probe Vertical amplifier

We assume a razor thin rising edge. Both probe and vertical amplifier degrade the rise time of the input signals.

Page 13: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 13

Combined effects: approximation Serial delay The frequency response of a probe, being a combination of several random

filter poles near each other in frequency, is Gaussian.

2

122

22

1_ )( Ncompositerise TTTT

Rise time is 10-90% rise time When figuring a composite rise time, the squares of 10-90% rise times add

Manufacturer usually quotes 3-db bandwidth F3db

approximations T10-90= 0.338/F3dB for each stage (obtained by simulation)

Page 14: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 14

Example:

Given: Bandwidth of probe and scope = 300 MHz

Tr signal = 2.0ns

Tr scope = 0.338/300 MHz = 1.1 ns

Tr probe = 0.338/300 MHz = 1.1 ns

Tdisplayed = (1.12 + 1.12 +2.02)1/2

= 2.5 ns

For the same system, if Tdisplayed = 2.2 ns, what is the actual rise time?

Tactual = (2.22 - 1.12 – 1.12)1/2

= 1.6 ns

Page 15: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 15

Self-inductance of a probe ground loop A Primary factor degrading the performance Current into the probe must traverse the ground loop on the way back to source The equivalent circuit of the probe is a RC circuit The self-inductance of the ground loop, represented on our schematic by series

inductance L1, impedes these current.

Page 16: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 16

Typically, 3 inches (of 0.02” Gauge wire loop) wire on ground plane equals to (approx) 200 nH

Input C = 10pf TLC = (LC)1/2 = 1.4ns

T10-90 = 3.4 TLC = 4.8ns

This will slow down the response a lot.

Page 17: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 17

Estimation of circuit Q Output resistance of source combine with the loop inductance & input

capacitance is a ringing circuit. Where

Q is the ratio of energy stored in the loop to energy lost per radian during resonant decay.

Fast digital signals will exhibit overshoots. We need the right Rs to damp the circuit. On the other hand, it slows down the response.

sR

CLQ

2/1)/(

Page 18: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 18

Impact: probe having ground wires, when using to view very fast signals from low-impedance source, will display artificial ringing and overshoot.

A 3” ground wire used with a 10 pf probe induces a 2.8 ns 10-90% rise time. In addition, the response will ring when driven from a low-impedance source.

Page 19: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 19

Remedy

Try to minimize the earth loop wire Grounding the probe close to the signal source

Back to page 29

Page 20: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 20

Spurious signal pickup from probe ground loops

32108.5

r

AALM

mVsVnhdt

dILV Mnoise 12)/100.7)(17.0( 7

Mutual inductance between Signal loop A and Loop B

where A1 (A2) = areas of loops r = separation of loops Refer to figure for values. In this example, LM = 0.17nH

Typically IC outputs max dl/dt = 7.0 * 107 A/s

12mV is not a lot until you have a 32-bit bus; must try to minimize loop area

Page 21: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 21

A Magnetic field detector

Make a magnetic field detector to test for noise

Page 22: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 22

How probes load down a circuit

Common experience Circuit works when probe is inserted. It fails when probe is removed.

Effect is due to loading effect, impendence of the circuit has changed. The frequency response of the circuit will change as a result.

To minimize the effect, the probe should have no more than 10% effect on the circuit under test.

E.g. the probe impedance must be 10 times higher than the source impedance of the circuit under test.

Page 23: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 23

An experiment showing the probe loading effect

A 10 pf probe looks like 100 ohms to a 3 ns rising edge Less probe capacitance means less circuit loading and better measurements.

A 10 pf probe loading a 25 ohm circuit

Page 24: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 24

Special probing fixtures

Typical probes with 10 pf inputs and one 3” to 6” ground wire are not good enough for anything with faster than 2ns rising edges

Three possible techniques to attack this problem Shop built 21:1 probe Fixtures for a low-inductance ground loop Embedded Fixtures for probing

Page 25: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 25

Shop-built 21:1 probe

Make from ordinary 50 ohm coaxial cable Soldered to both the signal (source) and local ground Terminates at the scope into a 50-ohm BNC connector

Total impedance = 1K + 50 ohms;

if the scope is set to 50 mv/divison,

the measured value is = 50 * (1050/50) = 1.05 V/division

Page 26: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 26

Advantages of the 21:1 probe

High input impedance = 1050 ohm Shunt capacitance of a 0.25 W 1K resistor is around 0.5 pf,

that is small enough. But when the frequency is really high, this shunt capacitance may

create extra loading to the signal source.

Very fast rise time, the signal source is equivalent to connecting to a 1K load, the L/R rise time degradation is much smaller than connecting the signal to a standard 10 pf probe.

Page 27: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 27

Fixtures for a low-inductance ground loop

Refer to figure on page 19 Tektronix manufactures a probe fixture specially designed to

connect a probe tip to a circuit under test.

Page 28: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 28

Embedded Fixture for Probing

Removable probes disturb a circuit under test. Why not having a permanent probe fixture?

The example is a very similar to the 21:1 probe. It has a very low parasitic capacitance of the order 1 pf, much better than the 10 pf probe.

Use the jumper to select external probe or internal terminator.

Page 29: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 29

Avoiding pickup from probe shield currents

Shield is also part of a current path. Voltage difference exists between logic ground and scope

chassis; current will flow. This “shield current * shield resistance R shield“ will produce

noise Vshield

Page 30: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 30

VShield is proportional to shield resistance, not to shield inductance because the shield and the centre conductor are magnetically coupled. Inductive voltage appear on both signal and shield wires.

To observe VShield Connect your scope tip and ground together Move the probe near a working circuit without touching anything. At

this point you see only the magnetic pickup from your probe sense loop

Cover the end of the probe with Al foil, shorting the tip directly to the probe’s metallic ground shield. This reduces the magnetic pickup to near zero.

Now touch the shorted probe to the logic ground. You should see only the VShield

Page 31: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 31

Solving VShield problem

Lower shield resistance (not possible with standard probes) Add a shunt impedance between the scope and logic ground.

Not always possible because of difficulties in finding a good grounding point

Turn off unused part during observation to reduce voltage difference

Not easy Use a big inductance (magnetic core) in series with the shield

Good for high frequency noise. But your inductor may deteriorate at very high frequency.

Redesign board to reduced radiated field. Use more layers

Disconnect the scope safety ground Not safe

Page 32: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 32

Use a 1:1 probe to avoid the 10 time magnification when using 10X probe

Use a differential probe arrangement

Page 33: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 33

Viewing a serial data transmission system

Jitter observed due to intersymbol interference and additive noise.

To study signal, probe point D and use this as trigger as well.

Page 34: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 34

No jitter at trigger point due to repeated syn with positive-going edge.

This could be misleading

For proper measurement, trigger with the source clock The jitter is around half of the previous one. If source clock is not available, trigger on the source data signal point

A or B (where is minimal jitter)

Page 35: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 35

Slowing Down the System clock

Not easy to observe high speed digital signals which include ringing, crosstalk and other noises.

Trigger on a slower clock (divide the system clock) allows better observations because it allows all signals to decay before starting the next cycle.

It will help debugging timing problems.

Page 36: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 36

Observing crosstalk

Crosstalk will Reduce logic margins due to ringing Affect marginal compliance with setup and hold requirements Reduce the number of lines that can be packed together

Use a 21:1 probe to check crosstalk Connect probe and turn off machine; measure and make sure there is

minimal environment noise. Select external trigger using the suspected noise source Then turn on machine to observe the signal which is a combination of

primary signal, ringing due to primary signal, crosstalk and the noise present in our measurement system

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High-speed logic: Measurement (v.9a) 37

Page 38: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 38

Try one of the followings to observe the cross talk Turn off primary signal (or short the bus drivers)

• Varying the possible noise source signal (e.g. signal patterns for the bus)

Compare signals when noise source is on and off • Talk photos with the suspected noise source ON and source OFF.

• The difference is the crosstalk

Generating artificial crosstalk• Turn off, disabled, short the driving end of the primary signal. Induce a

step edge of know rise time on the interfering trace and measure the induced voltage.

• Useful technique when measuring empty board without components.

Page 39: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 39

Measuring Operating Margins In digital system measurements, we are interested to stress the system to

ensure the system is within operation margin specified. Make sure the arrangement is automatic and self recovery Some of the common tests

Additive noise• Add random noise to every node

• Sine waves, square waves or random pattern

• Difficult to administer

• Suitable for data receivers and transmitters Adjusting the timing of a large bus (clock skew margin test)

• Test the combine effects of system setup time, hold time and operating margin etc.

• Connect the devices’ clock signals using the following methods.

– Clock adjustment by coax delay (vary the length)

– Clock adjustment by pulse generator (variable delays)

– Simple circuits for clock phase adjustment

– Clock adjustment by a phase-locked loop

– Clock adjustment by voltage variation

Page 40: High-speed logic: Measurement (v.9a) 1 CENG3480_B2 Measurement Techniques Reference: Chapter 3 Measurement Techniques of High speed digital design, by

High-speed logic: Measurement (v.9a) 40

Power Supply• Power supply variation can change response characteristics

• Vary the supply over a + 10% range

Temperature• Temperature will vary the delay characteristics

• Can use cooling spray, blow dryer etc. Some companies use temperature control ovens

• Make sure the temperature probe is attached to the right place

Data Throughput• Compose a suite of operations that exercise each individual connections

• Not easy to compose test pattern that represents the real situations. Often system passes tests but fails at real operations.

• Good data pattern will uncover unexpected avenues of noise coupling which causes failures

• Complex tests are expensive