High Efficiency DC/DC Power Module MSN12AD12... · 2019. 8. 16. · Rev. P09 1 High Efficiency DC/DC Power Module MSN12AD12-MP FEATURES: High Power Density Power Module Typical Load:10A

Rev. P09

1

High Efficiency

DC/DC Power Module MSN12AD12-MP

FEATURES:

High Power Density Power Module

Typical Load:10A for 0.6V ~ 2.5V

Typical Load:8A above 2.5V ~ 5.5V

Input Voltage Range from 4.5V to 16V

Output Voltage Range from 0.6V to 5.5V

94.5% Peak Efficiency at 12Vin to 3.3Vout

Protections (Non-Latch OCP, UVP, UVLO,

OTP and Latch-Off for OVP)

Differential Output Voltage Remote Sense

Programmable Soft-Start

Pre-Biased Output

Forced CCM Operation

Power Good Indication

Output Voltage Tracking

Size 8.6mm x 7.5mm x 6.5mm

Pb-free (RoHS compliant)

MSL 3, 245ºC Reflow

APPLICATIONS:

General Buck DC/DC Conversion

DC Distributed Power System

Telecom and Networking Equipments

Servers System

GENERAL DESCRIPTION:

The MSN12AD12-MP is a high frequency, high

power density and complete DC/DC power

module. The PWM controller, power MOSFETs

and most of support components are integrated

in one hybrid package.

The features of MSN12AD12-MP include

constant-on-time (COT) control mode that

provides fast transient response and eases loop

stabilization. Besides, MSN12AD12-MP is an

easy to use DC/DC power module, it only needs

input/output capacitors, one voltage dividing

resistor, one over current protection resistor

and one resistor of MODE pin to perform

properly.

The low profile and compact size enables

utilization of space on the bottom or top of PC

boards either for highly density point of load

regulation to save the space and area. It is

suitable for automated assembly by standard

surface mount equipment and complies with

Pb-free and RoHS compliance.

TYPICAL APPLICATION CIRCUIT & PACKAGE SIZE:

FIG.1 TYPICAL APPLICATION CIRCUIT FIG.2 HIGH DENSITY POWER MODULE

8.6 mm

6.5 mm

7.5 mm

Rev. P09

2

MSN12AD12-MP

ORDER INFORMATION:

Part Number Ambient Temp. Range

(°C)

Package

(Pb-Free) MSL Note

MSN12AD12-MP -40 ~ +105 LGA Level 3 -

Order Code Packing Quantity

MSN12AD12-MP Tray 900

ELECTRICAL SPECIFICATIONS:

CAUTION: Do not operate at or near absolute maximum rating listed for extended periods of time. This stress may

adversely impact product reliability and result in failures outside of warranty.

NOTES:

1. The test board size is 80mm× 80mm× 1.6mm with 4 layers, 2oz per layer, on 0 LFM condition.

The test condition is complied with JEDEC EIJ/JESD 51 Standards.

Parameter Description Min. Typ. Max. Unit

Absolute Maximum Ratings

VIN to GND Continuous - - +18 V

SW to GND Continuous -0.3 - VIN+0.3 V

VCC to GND - - +4.5 V

EN to GND Continuous - - +4.5 V

Continuous, IEN<30uA - - +16 V

All other pins to GND -0.3 - +4.3 V

OCP Setting point 0.6Vo~5.5Vo - - 13.5 A

Tc Operating case temperature - - +120 °C

Tj Operating junction temperature -40 - +150 °C

Tstg Storage temperature -40 - +150 °C

Thermal Information

Rth(jc)(1) Thermal resistance from junction to

ambient (note 1) - 12 - ℃/W

Recommendation Operating Ratings

VIN Input Supply Voltage +4.5 - +16.0 V

VOUT Adjusted Output Voltage +0.6 - +5.5 V

Ta Ambient Temperature -40 - +105 °C

Mean Time Between Failure

MTBF 12V to 5V@10A, Ta=40℃ 27,813,037 Hours

Rev. P09

3

MSN12AD12-MP

VINGND VCC

EN CS

VINVINVINVINVIN

VINVINVINVINVIN

VINGNDGNDGNDGND

GND

NC

GND

PG FB VOSNS- TRK

SGND

MODE

VOUTVOUT

VOUTVOUT

VOUTVOUT

VOUTVOUT

1234567

A

B

C

D

E

F

PIN1

PIN CONFIGURATION:

TOP VIEW

PIN DESCRIPTION:

Symbol Pin No. Description

VIN A1, B1, C1~5,

D1~5

Power input pin. It needs to be connected to input rail. It also needs to

be connected to thermal dissipation layer by vias connection.

VCC A3 Internal 3V LDO output. The driver and control circuits are powered

from the VCC voltage.

GND A2,A4~5,

B2~5

System ground. All voltage levels are referenced to the pins. All pins

should be connected together with a ground plane

VOUT A6~7, B6~7,

C6~7, D6~7

Power output pin. It needs to be connected to output rail. It also

needs to be connected to thermal dissipation layer by vias connection.

SGND E1 Analog ground. Select SGND as the control circuit reference point.

NC E7 No connect.

CS F1 Current limit. Connect a resistor to ground to set the current limit trip

point.

MODE F2 Connect a 60.4KΩ resistor to SGND for 1MHz force CCM operation.

TRK F3

External tracking voltage input. The input signal of this pin is the

tracking reference for the module output voltage. Otherwise, place a

decoupling ceramic capacitor between TRK and VOSNS- as close to the

module as possible. The capacitance of this capacitor determines the

soft start time.

VOSNS- F4

Remote sense negative input. Connect VOSNS- to the negative side of

the voltage sense point directly. Short VOSNS- to GND if the remote

sense is not used.

FB F5

Feedback. Connect a resistor between this pin and VOSNS- for

adjusting output voltage. Place this resistor as closely as possible to

this pin and VOSNS-.

EN F6 Enable – to pull the pin higher than 1.22V

Disable – to pull the pin lower than 0.8V

PG F7

Power good output. PG is an open-drain signal. A pull-up resistor

connected to VCC to indicate a logic high signal if the output voltage is

within regulation.

Rev. P09

4

MSN12AD12-MP

ELECTRICAL SPECIFICATIONS: (Cont.)

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 80mm× 80mm× 1.6mm, 4 layers 2 oz.

The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited.

Cin =22uF/25V/1206/X7R MLCC * 2 pcs, Cout = 47uF/10V/1210/X7R MLCC * 3 pcs

Symbol Parameter Conditions Min. Typ. Max. Unit

Input Characteristics

Iin(VIN)

Input supply bias

current Vin=12V, Vout=1.8V, Iout=0A, 1MHz - 27 - mA

IS(VIN) Input supply current Vin=12V, Vout=1.8V,Iout=10A, 1MHz - 1.63 - A

Output Characteristics

IOUT(DC) Output continuous

current range Vin=12V, Vout=1.8V 0 - 10 A

ΔVOUT/ΔVIN Line regulation Vin=4.5V to 16V, Vout=1.8V, Iout=10A - 0.5 - %

ΔVOUT/ΔIO Load regulation Vin=12V, Vout=1.8V, Iout=0~10A - 0.5 - %

Vo, set Output voltage set

point Vin=12V, Vout=1.8V with 0.1% resistor -1.0 - +1.0 %Vo,set

FSW Switching Frequency MODE connect a 60.4KΩ to SGND 800 1000 1200 KHz

VCC VCC regulator - 3.0 - V

Enable Signal

VENABLE Logic high Voltage Module On 1.17 1.22 1.27 V

Logic low Voltage Module Off - - 0.8 V

VEN-HYS Enable hysteresis - 0.2 - V

Power Good

VPGH

Power good high

threshold FB Voltage >96% - <110%

VREF

VPGL

Power good low

threshold FB Voltage <88% - >120%

VPG

Power good sink

current capability IPG = 1mA - - 0.8 V

PGTD Power good low to

high delay After VREF rise > 95% - 0.9 - mS

Protection Characteristics

OVP Output over voltage

protection - 116% - VREF

UVP Output under voltage

protection - 80% -

TSD Thermal shutdown

temperature - 160 - ℃

TSD-HY Thermal shutdown

hysteresis - 30 - ℃

OCP Recommend over

current protection

Vin=12V, Vout=0.6V ~ 2.5V,

Rcs=4.87KΩ//47pF 11 - 15.5 A

Vin=12V, Vout=3.3V ~ 5V,

Rcs=5.6KΩ//47pF 10.5 - 15 A

SCP Short current

protection Auto-recovery

Rev. P09

5

MSN12AD12-MP

PERFORMANCE CHARACTERISTICS: (VOUT=1.0V)



Cin =22uF/25V/1206/X7R MLCC * 2 pcs, Cout = 47uF/10V/1210/X7R MLCC * 3 pcs.

The following figures provide the typical characteristic curves at 1.0Vout.

FIG.3 EFFICIENCY V.S. LOAD CURRENT

(VIN=12V, VOUT=1.0V)

FIG.4 DE-RATING CURVE


FIG.5 OUTPUT RIPPLE

(VIN=12V, IOUT=0A)

FIG.6 OUTPUT RIPPLE

(VIN=12V, IOUT=10A)

FIG.7 TRANSIENT RESPONSE

(VIN=12V, 5A to 10A LOAD STEP)

FIG.8 TURN-ON

(VIN=12V, IOUT=10A)

EN

VOUT

PG

Rev. P09

6

MSN12AD12-MP










FIG.11 OUTPUT RIPPLE

(VIN=12V, IOUT=0A)


(VIN=12V, IOUT=10A)



FIG.14 TURN-ON

(VIN=12V, IOUT=10A)

PG

EN

VOUT

Rev. P09

7

MSN12AD12-MP











(VIN=12V, IOUT=0A)


(VIN=12V, IOUT=8A)



FIG.20 TURN-ON

(VIN=12V, IOUT=8A)

PG

EN

VOUT

Rev. P09

8

MSN12AD12-MP











(VIN=12V, IOUT=0A)


(VIN=12V, IOUT=8A)



FIG.26 TURN-ON

(VIN=12V, IOUT=8A)

PG

EN

VOUT

Rev. P09

9

MSN12AD12-MP

APPLICATIONS INFORMATION:

SAFETY CONSIDERATION: Certain applications and/or safety agencies may require fuses at the inputs of power conversion

components. Fuses should also be used when there is the possibility of sustained input voltage reversal

which is not current limited. For greatest safety, we recommend a fast blow fuse installed in the

ungrounded input supply line. The installer must observe all relevant safety standards and regulations.

For safety agency approvals, install the converter in compliance with the end-user safety standard.

INPUT FILTERING: The module should be contacted to as low AC impedance source supply and a highly inductive source

or line inductance can affect the stability of the module. An input capacitor must be placed directly to

the input pin of the module, to minimize input ripple voltage and ensure module stability.

OUTPUT FILTERING: To reduce output ripple and improve the dynamic response to as step load change, the additional

capacitor at the output must be used. Low ESR polymer and ceramic capacitors are recommended to

improve the output ripple and dynamic response of the module.

OUTPUT VOLTAGE PROGRAMMING: The Module has an internal 0.6V reference voltage, The output voltage can be programmed by the

dividing resistor RFBH and RFBL, and division resistor needs to be closed as possible to the VOUT pin, FB

pin and VOSNS- pin. A value of between 100Ω and 3.4kΩ is highly recommended for both resistors.

Assume RFBH set 976 ohm, The output voltage can be calculated as shown in Equation 1 and the

resistance according to typical output voltage is shown in TABLE 1.

(EQ.1)

TABLE 1

SOFT START TIME PROGRAMMING: The minimum soft-start time is limited at 1ms. It can be increased by adding a SS capacitor between

TRK pin and VOSNS- pin. The total SS capacitor value can be determined with Equation 2:

(EQ.2)

OUTPUT VOLTAGE TRACKING AND REFERENCE: The Module provides an analog input pin (TRK) to track another power supply or accept an external

reference. When an external voltage signal is connected to TRK, it acts as a reference for the Module

output voltage. The FB voltage follows this external voltage signal exactly, and the soft-start settings

are ignored. The TRK input signal can be in the range of 0.3V to 1.4V. During the initial start-up, the TRK

must reach at least 600mV first to ensure proper operation. After that, it can be set to any value

between 0.3V and 1.4V.

VOUT 1.0V 1.2V 1.5V 1.8V 2.5V 3.3V 5V

Rtrim(ohm) 1470 976 649 487 309 215 133

nFV

uAmsTnFC SS

SS 22)(6.0

)(36)()(

FBL

RBH

R

R10.6VOUT

Rev. P09

10

MSN12AD12-MP

APPLICATIONS INFORMATION: (Cont.) POWER GOOD (PG): The Module has a power good (PG) output. PG is the open-drain of a MOSFET. Connect PG to VCC or

another external voltage source less than 3.6V through a pull-up resistor (typically 10kΩ). After

applying the input voltage, the MOSFET turns on, so PG is pulled to GND before soft-start is ready. After

the FB voltage reaches 96% of the REF voltage, PG is pulled high after a 0.8ms delay.

When the FB voltage drops to 80% of the REF voltage, or exceeds 116% of the nominal REF voltage, PG

is latched low. PG can only be pulled high again after a new soft start.

If the input supply fails to power the Module, PG is clamped low, even though PG is tied to an external

DC source through a pull-up resistor.

UVLO (ENABLE) PROGRAMMING:

The Module turns on when EN goes high; the Module turns off when EN goes low. EN cannot be left

floating for proper operation.

As FIG.27, EN can be connected a resistor divider from VIN to AGND used to program the input voltage

(UVLO thresholds). RENH and RENL should be chosen that VEN doesn’t exceed 3.6V when VIN reaches

the maximum value. The resistor divider values can be determined with Equation 3:

(EQ.3)

FIG.27 PROGRAM EN CIRCUIT(UVLO SETTING)

When only RENH is connected to Vin without RENL, then RENH should be chosen so that the maximum

current going to EN is 30μA, RENH can be calculated with Equation 4:

(EQ.4)

ENL

ENLENHUVLO

R

RRVV

22.1

)(03.0

)()(

mA

VVKR MAXIN

ENH

Rev. P09

11

MSN12AD12-MP

APPLICATIONS INFORMATION: (Cont.) RECOMMENDATION LAYOUT GUIDE:

FIG.28 LAYOUT GUIDE SCHEMATIC

FIG.29 TOP LAYER FIG.30 BOTTOM LAYER

Rev. P09

12

MSN12AD12-MP

APPLICATIONS INFORMATION: (Cont.)

RECOMMENDATION ON LAYOUT: (Cont.)

1、 Place the FB components R1(RFBH)、R2(RFBL) close to the module, so that the FB trace can be

minimized to offer less noise coupling.

2、 For lower noise coupling of the differential output voltage remote sense function, an C filter

(C12-100pF) must be in place between Vos+ and Vos-, an R-C filter (R5-2ohm, C11-100pF) must

be in place within the path of Vos-, VOSNS- and SGND. Refer to Fig.28 for the exact circuitry

3、 SGND and PGND don’t need connected together, because already connect at inside of power

module.

4、 OCP point setting resistor R4 must be connected with a MLCC C10 (47pF) in parallel.

5、 MLCC input decoupling capacitors C8 and C9 (1uF and 100pF) are required to be placed on the

bottom side of the PCB connecting pin VIN and pin PGND (refer to Fig. 30)

THERMAL CONSIDERATIONS: All of thermal testing condition is complied with JEDEC EIJ/JESD 51 Standards. Therefore, the test

board size is 80mm× 80mm× 1.6mm with 4 layers on 0 LFM condition. The Module is designed for using

when the case temperature is below 120°C regardless the change of output current, input/output

voltage or ambient temperature.

Rev. P09

13

MSN12AD12-MP

APPLICATIONS INFORMATION: (Cont.)

REFLOW PARAMETERS: Lead-free soldering process is a standard of making electronic products. Many solder alloys like Sn/Ag,

Sn/Ag/Cu, Sn/Ag/Bi and so on are used extensively to replace traditional Sn/Pb alloy. Here the

Sn/Ag/Cu alloy (SAC) are recommended for process. In the SAC alloy series, SAC305 is a very popular

solder alloy which contains 3% Ag and 0.5% Cu. It is easy to get it. FIG.31 shows an example of

reflow profile diagram. Typically, the profile has three stages. During the initial stage from 70°C to 90°C,

the ramp rate of temperature should be not more than 1.5°C/sec. The soak zone then occurs from

100°C to 180°C and should last for 90 to 120 seconds. Finally the temperature rises to 230°C to 245°C

and cover 220°C in 30 seconds to melt the solder. It is noted that the time of peak temperature should

depend on the mass of the PCB board. The reflow profile is usually supported by the solder vendor and

user could switch to optimize the profile according to various solder type and various manufactures’

formula.

FIG.31 RECOMMENDATION REFLOW PROFILE

Rev. P09

14

MSN12AD12-MP LAND PATTERN REFERENCE:

Unit: mm General Tolerances:± 0.2mm

0.000.64

1.91

3.18

0.64

1.91

3.18

0.0

0

1.2

7

2.5

4

3.8

1

1.2

7

2.5

4

3.8

1

0.63

0.63All around R0.05~0.1

C0.2

0.000.64

1.91

3.18

0.64

1.91

3.18

0.0

0

1.2

7

2.5

4

3.8

1

1.2

7

2.5

4

3.8

1

0.53

0.53

C0.2

TOP VIEW TOP VIEW

TYPICAL RECOMMENDED STENCIL PATTERN

LAND PATTERN WITH PADS (STENCIL t=120μm)

Rev. P09

15

MSN12AD12-MP PACKAGE OUTLINE DRAWING:

Unit: mm General Tolerances:± 0.2mm

e

ZD

D

E PIN1

A

ZE e

7.3 7.5 7.78.4 8.6 8.8

6.5

1.27 1.321.220.5750.49

0.6750.4750.590.39

- -

Top View

Side View

Bottom View

PIN1

Lp

b

0.63 0.680.580.63 0.680.58

Rev. P09

16

MSN12AD12-MP MARKING REFERENCE:

Unit: mm

PIN1

Top View Bottom View

MSN12AD12-MP

PIN1

AAAYYMDDXX

Marking note:

1. Circle represents the fiducial point of SMT

2. MSN12AD12-MP represents the Product Name

3. AAAYYMDDXX represents the Lot Number

Rev. P09

17

MSN12AD12-MP

PACKING INFORMATION:

Unit: mm

Tray Packing

Tray Chamfer

PIN1MSN12AD12-MP

AAAYYMDDXX

PACKAGE IN TRAY LOADING ORIENTATION

TRAY DIMENSION

Rev. P09

18

MSN12AD12-MP REVISION HISTORY:

Date Revision Changes

2017.10.16 00 Release the preliminary datasheet.

2018.03.14 01 Add de-rating curve

2018.05.28 02

1、 Update page 2 EN max rating 2、 Correct page 3, 4 pin define 3、 Update page 5~6 Spec. 4、 Update page 13 EN (UVLO) information

2018.07.10 03

1、 Update typical output current from 12A to 8A~10A 2、 Add layout guide 3、 Add package outline drawing 4、 Add land pattern reference 5、 Add marking Drawing 6、 Add package information

2018.10.29 04

1、 Change Operating temperature from 85 degree to 105 degree

2、 Update page 5~8 performance characteristic 3、 Update page 2 and 11 case temperature and thermal

de-rating point from choke 110 degree to 120 degree 4、 Correct page 13, 14 pin 1

2018.12.28 05 1、 Update page 3 pin 1 of top view 2、 Update page 15 marking reference information

2019.03.14 06 1、 Update page 4 OCP maximum and minimum

2019.03.29 07 1、 Update page 14 package outline drawing information

2019.04.09 08

1、 Update page 3 pin description of SGND 2、 Add page 11 layout guide schematic 3、 Update page 11 layout guide of top and bottom layer 4、 Update page 12 recommendation information of layout

2019.07.01 09

1、 Page 2 packing transfer to tray from tape & reel and quantity update to 900 pcs from 1000 pcs

2、 Update page 2 Tj and Tstg maximum from 125℃ to 150℃ 3、 Add page 2 MTBF information 4、 Update page 11 and 12 information about layout guide 5、 Add page 17 packing information 6、 Updated page 2 Rth(jchoke-a) to Rth(jc) 7、 Update page 14 stencil pattern with square pads to

stencil pattern with pads

Documents

High Efficiency DC/DC Power Module MSN12AD12... · 2019. 8. 16. · Rev. P09 1 High Efficiency DC/DC Power Module MSN12AD12-MP FEATURES: High Power Density Power Module Typical Load:10A