Henkel Advanced Thermal

Materials for Higher

Performance

2016 TW Power Seminar

Oct 6th, 2016

2

Agenda

1. Henkel Overview

2. Roadmaps / TIM portfolios

3. Applications per Market Segment

4. BOND-PLY LMS-HD Discussion

5. Conclusion

3

Who we are140 Years of History

• Founded 1876

• Headquarters: Düsseldorf, Germany

4

Adhesive TechnologiesTotal Henkel Sales

2015 Sales by business sector

Corporate = sales and services not assignable to the individual business sectors.

49%

22%

28%

1%

Adhesive Technologies Beauty Care Laundry & Home Care Corporate

49% of Henkel Sales

Adhesive

Technologies

5

Adhesive TechnologiesFive Business Segments

Packaging

And Consumer

Goods

Transport

and

Metal

General

IndustryElectronics

Consumer,

Craftsmen

and

Building

6

Serving Our Customers WorldwideGlobal End-to-End Business

Henkel has a global presence with a footprint in every geography

Globally aligned infrastructure to serve our customers locally

Electronics Headquarters:

Irvine, CA USA

Estimated Adhesive ElectronicsEmployees: 3,086

R&D, Technical Service, Sales

R&D, Technical Service, Sales, Manufacturing

Technical Service, Sales, Manufacturing

Manufacturing

7

Henkel ElectronicsProduct Lines

Die Attach

Adhesives

Molding

Compounds

Assembly

AdhesivesLiquids

Inks &

Coatings

Solder

Materials

Thermal

Solutions

• Die Attach Paste

• Die Attach Film

• Dicing Die Attach

Film

• Conductive Die

Attach Film

• WBC

• Mold Compound

• Powders

• ECA

• NCA

• SMA

• ABA

• Assembly Films

• Underfills

• Sealants

• CBP

• Encapsulants

• Light Cure

Adhesives

• LPM

TECHNOMELT

• LCM

• NCP

• Conductive Inks

• Non-Conductive

Inks

• Blendable

Resistors

• Shielding Coatings

• Solder Paste

• Liquid Flux

• Solder Wire

• Solder Wire

• Solder Bar

• Assembly Film

• Thermal Interface

• Thermally

Conductive

Adhesives

• Thermally

Conductive

Grease

• Liquid Gap Filler

• GAP PADS

• SIL PADS

• Insulated Metal

Substrate (IMS)

Abbreviations:ABA = Assembly Bench AdhesivesLCM = Liquid Compression MoldingNCP = Non Conductive Paste

ECA = Electrically Conductive AdhesiveNCA = Non Conductive AdhesiveCBP = Circuit Board Protection

LPM = Low Pressure MoldingSMA = Surface Mount AdhesivesWBC = Wafer Backside Coating

8

Technology Platforms & Market DriversMarket-Tailored Product Solutions

Henkel Solutions

Assembly LiquidsAssembly

Adhesives

Circuit Board

Protection

Solder

Materials

Thermal

Materials

Mark

et

Need

s

Customer Mfg.

Efficiency

Sustainability

High Reliability

Miniaturization

Potting

Compound

Electrically

Insulating Film

Printed Inks

Encapsulants

(Glob Top)

Insulated Metal

Substrate (IMS)

Gap Pads

Low Pressure

Molding

Non-Conductive

Pastes

Liquid Gap

Filler

Conformal Coatings

Electrically Conductive

Pastes

Assembly Film

Adhesives

Surface Mount

Adhesives

Gasketing

CSP Underfills

(Cornerbond)

Solder Materials

9

Agenda

1. Henkel Overview

2. Roadmaps / TIM Portfolios

3. Applications per Market Segment

4. BOND-PLY LMS-HD Discussion

5. Conclusion

ADHESIVES

LIQUID

GAP FILLER

THIN

BONDLINE

GAP PAD® SIL-PAD®

THERMAL

CLAD®

THERMALLY

CONDUCTIVE

MATERIALS

10

Power Market Drivers

Power Densities Cost Automation Legislation

• Increasing Watts/In3

• Driving Higher

Reliability

Requirements

• Si SiC/GaN

• Low Cost Chinese

Entrants

• Process Improvement

• Manual to Semi or Fully

Automatic

• Reduced Manufacturing

Footprint

• Improved Efficiencies

• Sustainable

• Environmental

11

Global Power Supply TrendsHenkel Solutions

• The Power Supply industry is advancing innovation through investment in

lean manufacturing and total cost solutions….

• Henkel’s Innovative Thermal Interface

Materials (TIMs):+Eliminate Mechanical Fasteners

+Save Space (2D & 3D)

+Ensure Highest Dielectric Strength

+Ensure Highest Thermal Performance

+Improve L/T Reliability & Durability

+Increase Production Though-put / Yields

= Lowest Total Solution Cost

12

Gap Pad® TIMsExpanding Pad-Form Innovation

RELEASED

1 2 3 4 5

Thermal Performance (W/m-K)

SOFT

VALUE

Silicone

Silicone-Free

POLYURETHANE

Lowest

Modulus

HC1000

HIGH DURABILITY

GPV0, 1450, 1500

GP1000HD

GP HC 3.0

GP3500 ULMULTRA LOW MOD

GPV0-US-C

6

GP2202SF

GP1000SF GP2200SF

GP3004SF

GP HC 5.0

Specialty

NEW LINE

EMI Absorbing GP EMI 1.0

7

*

* *

Putty-like

5000S352500S20,3000S30 GPV0-S/US, 1500S, 2000S40

13

Gap Filler Liquid TIMsMarket Leading Solutions

GF1000, GF1000SR, GF1500, GF2000

RELEASED

Thermal Performance (W/m-K)

GAP FILLER 2K

POTTING 2K

LOW MODULUS 2K

2K Cure-In-Place

LOW VOLATILE 2K GF1500LV

1 2 3 4 5 6

GF3500LV

GF1400SL

LIQUI-FORM LF2000 LF3500

1K Pre-Cured Gel

SILICONE FREE 2K GF1100SF

**

GF3500S35GF1000/1000SR, 1500, 2000 GF4000

14

Liquid AdhesivesFlexible Cure – Coming Soon

RELEASED

1 2 3 4 5

Thermal Performance (W/m-K)

LIQUI-BOND SA

HEAT-CURE

LBSA1000, 1800, 2000

Silicone

One-part refrigerated-storage, heat-cure

2K RT-storage, heat-cure

Epoxy

LBSA3505

LBEA1805LIQUI-BOND EA

383 high bond strength, no glass beadsLOCTITE:

Activator-based

Adhesives

LOCTITE: Silicone

384

315

3874

3873

5404

3875

3876

repairable, no glass beads

with glass beads

no glass beads

with glass beads

One-part refrigerator-store, heat cure

Two-part, no glass beads

Two-part, with glass beads

Silicone

Acrylic – RT Fast Fixture

LOCTITE:

2K Bead-on-Bead

LIQUI-BOND

Adaptive CURE 2K RT storage / RT - Flexible cure

15

Adhesives (Pad form)Pressure Sensitive Adhesives & Laminates

RELEASED

1 2 3 4 5

Thermal Performance (W/m-K)

Tapes

BOND-PLY

Pressure Sensitive

Adhesive

BP100

BP400

Fiberglass reinforced

Un-reinforced

Polyimide film reinforced

BOND-PLY

HEAT-CURE BP LMS500P

Fiberglass reinforced

Polyimide film reinforced

BP660P

BP LMS-HD*Laminates

BP800

SEALANTS (NEW) TLB 400 SLT

16

Thin Bond-Line Thermal Interface MaterialPad-Form

RELEASED

2.0 1.0 0.5 0.25

TO220 Thermal Performance (oC/W @ 50PSI)

HF625

Phase Change Material

HF300P

HF225U/T

Aluminum Foil

Fiberglass reinforced

Polyimide film reinforced

PEN film reinforced

HF300G

HF105, 225F-AC

Unreinforced

Hi-FLOW:

Electrical Isolating

Non-Isolating

EIF1000 KB(1), KA(2), K3

TCF2000 (AF)

Aluminum reinforced, Zinc Oxide Filler

Polyimide film reinforced

TCF1000 (AL, ALH)

LOCTITE:

Electrical Isolating

Non-Isolating Aluminum reinforced, Graphite Filler

TCF4000 PXFUn-reinforced, Aluminum Filler

HF650P

HF565U/T

17

Thin Bond-Line Thermal Interface MaterialDispensable

RELEASED

2.0 1.0 0.5 0.25

TO220 Thermal Performance (oC/W @ 50PSI)

Non-Curing Compounds

TIC TIC1000A TIC4000

LOCTITE

PHASE CHANGE

PASTES

LOCTITE Grease

1000hr@125C Open Bake Stable

TCP8010 TC8M

TCP4000 (D, Pm, Pe, DLV)

TCP7000

TCP7800NC

18

Sil-Pad® Thermal Interface Material

RELEASED

1.5 0.8 0.4 0.2

Thermal Performance (oC-in2/W @ 50PSI)

Silicone

SIL-PAD

Silicone-Free

SP400-9mil, 7mil SP900S, SPA1500/2000, SP2000

Polyimide film

SP800-5mil

SP980-9mil (High pressure applications)

POLY-PAD

Highest Electrical

Isolation

Polyimide film

SP-K4, K6, K10

SP1200-12mil

PP-K4 PP-K10

PP-400 PP-1000

Highest Electrical

Isolation

Q-PAD

Rubber-based Mica & Grease Replacement

Aluminum Foil

Fiberglass reinforced Q-PAD 3

Q-PAD II

SOFT-TACK SP1500STSP1100ST

19

Agenda

1. Introduction

2. Roadmap

3. Applications per Market Segment

4. BOND-PLY LMS-HD Discussion

5. Conclusion

20

Network / Server / Workstation / Computer Power SuppliesHenkel Solutions

Application: Discrete to heat plate

No Mechanical Fasteners

Material Feature Benefits

BOND-PLY

LMS-HD

Cured

core

Guaranteed min.

VBD No fixture in

oven

LIQUI-BOND

SA 2000

1k,

2 W/m-k

Excellent thermals, 1

part # vs pads

LIQUI-BOND

EA 1805Epoxy

Optional cure from

25ºC up to 150ºC

LIQUI-BOND

SA 2005

(Jefferson)

2k,

Flexible

cure

25ºC cure or very fast

cure at elevated

temps

GAP PAD VO

Ultra Soft

Soft/Com-

pliant

Low stress on

componentsAC-DC Power Supply

21

Network / Server / Workstation / Computer Power SuppliesHenkel Solutions

Application: Discrete to heat plate

Mechanical Fasteners

DC-DC ConverterAC-DC Power Supply

Material Feature Benefits

SIL-PAD K-10,

TCP 1700

Multiple

SP

options

SP line: Wide variety

of thickness, W/m-k,

hardness, substrates

HI-FLOW 650P PCM Wets out interface

like a liquid, film

isolation

Q-PAD 2 Non-

isolating

For use on Insulated

packages

22

Power ManagementHenkel Solutions

Application: PCBA to heat sink

No Mechanical Fasteners

Material Feature Benefits

LIQUI-BOND

SA 1000

Low

viscosity

Screenable, 1 part #

vs. pads

LIQUI-BOND

SA 2000

2 W/m-k Excellent thermals

BOND-PLY

LMS-HD

Cured

core

Guaranteed min.

VBD No fixture in

oven

BOND-PLY 800 PSA Press and stick

DC-DC Converter

23

Power ManagementHenkel Solutions

Application: PCBA to heat plate Material Feature Benefits

Gap Filler 1500 1.8 W/m-k Low assembly force,

1 part # vs pads

LIQUI-FORM

2000

Low CVE Minimal expansion

during reflow temps

LIQUI-FORM

3500

Low CVE,

3.5 W/m-k

Minimal expansion

during reflow temps

Gap Filler 4000 4.0 W/m-k Excellent ThermalsDC-DC ¼ Brick

24

AutomotiveHenkel Solutions

Application: Power control unit, Cool, Seal, Isolate Material Feature Benefits

Gap Filler 1500 1.8 W/m-k Low assembly force,

1 part # vs pads

New 2k LIQUI-

BOND

materials,

Adhesive

Flexible

cure

temps

Ability to cure at 25ºC

up to 180ºC

TLB 400 SLT

Sealant

Flexible

cure

temps

Ability to cure at 25ºC

up to 180ºC

25

Energy Management / PhotovoltaicHenkel Solutions

Application: Cooling PCBA to heat sink Material Feature Benefits

Gap Filler 1500 1.8 W/m-k Low assembly force,

1 part # vs pads

LIQUI-BOND

2000

2 W/m-k Excellent adhesion

and thermals

LIQUI-FORM

3500

Low CVE,

3.5 W/m-k

Minimal expansion

during reflow temps

Gap Filler 4000 4 W/m-k Excellent Thermals

GAP PAD HC

3.0

3 W/m-k Cost effective pad,

excellent thermals

26

Power Supply TrendsHenkel Solutions

Components and Low Cost Heat Sinks with increased out-

of-flatness tolerance

• Thicker and more Compliant Bond-Ply LMS-HD, up to 16 mil

• Liqui-Bond SA 2000, dispensable solution with elevated

temperature cure

• Liqui-Bond SA 2005 (Project Jefferson), 2k flexible cure

profile, can be cured at room temperature up to 180°C.

Room temperature storage

Smaller footprint, Compact designs, Higher power density

• High thermal conductivity adhesives, now up to 3 W/mk

• Wide variety of adhesive options to eliminate mechanical

fasteners

27

Agenda

1. Henkel Overview

2. Roadmap

3. Applications per Market Segment

4. BOND-PLY LMS-HD Discussion

5. Conclusion

28

BOND-PLY LMS-HD

This Innovative Construction combines:

• Cured Inner Layer: A high performance inner core coated over fiber glass (e.g. a High Performance “Sil-Pad”)• Delivers:

• High dielectric breakdown voltage (DBV)

• High thermal performance (Tc)

• High durability

• Ease / Handling

• Uncured Outer Layers: Two thermally enhanced, B-staged layers symmetrically coated over the cured inner layer.• Delivers:

• Soft interface for enhanced wet-out (Pre-Cure).

• Low stress laminate for L/T Reliability (Post Cure).

Now available in

16 mil thickness.

29

BOND-PLY LMS-HD

Processing (Typical)

• Oven cured after initial pressure only (IPO)• Not required to run the assembly fixture through

the pass-thru oven.• Reduces oven time and post-processing time due

to reduced thermal mass.

Target Applications

• High Performance discrete Semi-Conductor / Heatsink assemblies where traditional attachment methods include clips, screws, rivets, or PSA tapes.

• High Density Power Designs with limited space and High Reliability requirements.

30

BOND-PLY LMS-HDPower Supply Trends

Discrete Device and Heatsink Flatness is becoming more variable:

Heat Sink Flatness

Standard Thicknesses are available to Optimize your Design:• 10 mil: ~3mil• 12 mil: ~4 mil• Now available in16 mil

• Die-cut parts or Kiss-cut Rolls

31

BOND-PLY LMS-HD Wet-outHow LMS HD works

• Interfacial wet-out initiates via displacement.

• Increased dwell time = Greater wet-out = Greater lap shear performance.

• Primary process variables include pressure, pressure distribution, and dwell time.

Note: Not to scale

No Force

TO-220

Excessive Force and/or dwell

time

Moderate Force

32

BOND-PLY LMS-HDCost Savings Over Traditional Assemblies

• LMS-HD vs Traditional A (3) component example…

• Reduced heatsink costs: No drilling or tapping.

• Improved Quality DPPM on heatsinks due to poor deburring or upsets.

• More compact designs: Potential use of D2 Pak vs. TO-220

Application Example

0

25

50

75

100

Screw Ferrell Tap Labor Energy Total AssemblyCost

Assembly CostsTraditional vs. LMS-HD

Pad LMS-HD

<$$

33

BOND-PLY LMS and LMS-HD ProcessingCure Profiles

With Fixture, LMSBLN Simulation

No Fixture, LMS-HDBLN Simulation

<22 minutes!

34

Value Stream MappingImproved Processing with BOND-PLY LMS-HD

Inventory:

1. Standardization

heat sink profile

2. LMS-HD roll,

standard width

Inventory:

1. Discrete

Components

Tooling:

Single minute

exchange of die

Automatic

cut-to-length

LMS-HD

Place LMS-

HD on heat

sink

Place

components

on LMS-HD

Jig

Press

components

on LMS-HD

Custom

Press Insert

Cure in Oven

LMS

assembly,

No Fixture

Change

Over Time:

Est. 1 min

Place in

bin: Bin

size = to

the Kanban

order size

Est. 1 min Est. 1 min Est. 1 min Est. 8 min

Total Cycle

Time

Est. 11 min

Est. 0 min Est. 0 min

Value

Add

Wait

Est. 0 min

LEAN Opportunities:

Smaller batch sizes:

1. Single minute tooling

change over

2. Eliminate raw material

inventory change by using

standardized heat sink profiles

and rolls of LMS-HD that are

cut to length on the assembly

line

3. Placing oven in-line with

assembly table

4. Finished good inventory level

drops to Kanban order size

35

Agenda

1. Henkel Overview

2. Roadmap

3. Applications per Market Segment

4. BOND-PLY LMS-HD Discussion

5. Conclusion

36

ConclusionsHenkel solutions

• Offers a wide range of innovative and high performance materials to solve your most

challenging thermal needs.

• New materials have been developed that save space, assembly costs and energy, yet

provide great thermal and adhesion performance.

• Henkel maintains its industry leadership position by partnering with industry leaders to

develop the next generation of thermal products.

• Please feel free to contact us with your challenging thermal needs!

Thank you!