Hardware Difference Between BSC6910 and BSC6900

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    Hardware Difference Between BSC6910

    and BSC6900

    Hardware Difference Between BSC6910 andBSC6900

    Issue 1.00

    Date 2013-06-06

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    About This Document

    AuthorPrepared by Shailendra Nalavade Date 2013-06-06

    Reviewed by Date

    Reviewed by

    Approved by Date

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    Contents

    Author 3

    1. Power Connections Between PDF and BSC 5

    2. DIP Switches 6

    3.Subrack Board Configuration 8

    4.Board Level Difference

    5.Conclusion 13

    References 3

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    1. Power Connection between PDF and BSC

    BSC6910:

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    In BSC6910 the DIP switches are Vertical while in BSC6900 they are Horizontal.

    BSC6910:

    BSC6900:

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    Note: The definition of the DIP switches remains the same.

    3. Subrack Board Configuration

    The Major difference is that the OMU board position is shifted from Rear to front in BSC6910.

    BSC6910:

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    i) The SPU/XPU and DPU processing boards of BSC6900 is replaced by single processing

    board EGPU.

    This means we have only EGPU boards in BSC6910 for both control and user plane which works in

    N+1 configuration.

    Also the EGPU boards process both CS and PS user data.

    For EGPU board, it automatically adjusts the NodeB or cells on the board. There is no requirement

    for specifying Subsystem number while configuring NodeB,

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    ii) The electrical E1/T1 boards are no longer present in BSC6910 .

    This means EIU,AEU,PEU boards are not present in BSC6910.

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    iii) Only higher versions of earlier interface boards are used in BSC6910 (c and above)

    a and b versions interface boards are not used.

    So we have only AOUc,UOIc,POUc,FG2c,FG2d,GOUc,GOUd.

    XOUa is a new board.

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    iv) Introduction for Evolved OMU and Evolved SAU board.

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    v) Introduction of 10GE interface board - EXOUa

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    5. Conclusion:

    This document helps to introduce about some basic hardware differences between BSC6900 and BSC6910.

    Besides the point mentioned in above documents there are many other differences like Resource Sharing,

    Management sharing, heat dissipation and others. There are also changes in the configuration part ofInterfaces. Engineers are advised to study the relevant documents for more details.

    References:

    1. Hedex

    2. BSC6910 Training PPT.

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