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Hardik Trivedi M.S (VLSI Design) Email : [email protected] Mobile : +91-982-566-5563 Profile Summary Currently Working as Technical Associate (ASIC Verification) at E-Infochips Training and Research Academy Ahmedabad. Master in VLSI Design and experience in ASIC Verification Domain. In-depth knowledge on ASIC Verification with Verilog and System Verilog. Excellent communication and presentation skills. Self-motivated, Responsible, Ability to adapt and willingness to learn. Professional Experience: Organization: E-Infochips Training and Research Academy, Ahmedabad. Duration : July 2015 to till date Designation : Technical Associate Description: To Train graduates and professionals in ASIC Verification Domain. Project Details: Current Projects: Development of Verification IP (VIP) for AMBA AXI3 Protocol based on UVM in System Verilog. Verification IP (VIP) is designed based on suitable UVC (Universal Verification Component) structure for AMBA AXI protocol specified interface. This Bus base VIP acts as mater or slave to validate IP and user can configure multiple master or slave without testbench modification. All basic UVC components like driver, sequencer, monitor, agent, scoreboard, env etc. are designed. Various test cases are generated that provide satisfactory functional coverage using constraint random verification. VIP development of AMBA-APB Slave: I have developed AMBA-APB slave environment in which the whole verification Environment with Layer Test bench Architecture with different component like Packet class, driver, monitor scoreboard etc. Various test cases are generated that provide satisfactory functional coverage using constraint random verification using VCS EDA tool. Develop VIP of USB 3.0 SuperSpeed Physical Layer: The project aimed at to manage transfer data either on 2.5 GT/s or 5.0 GT/s depends upon the mode and rate. In Design I manage to capture the data that are coming asynchronously and lock the receiver clock with incoming asynchronous serial data. Verify the complete design of USB 3.0 SuperSpeed Physical Layer using System Verilog. I wrote an exhaustive verification plan from the specifications. I created Verification Environment in System Verilog.

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Hardik Trivedi

M.S (VLSI Design)

Email : [email protected]

Mobile : +91-982-566-5563

Profile Summary

Currently Working as Technical Associate (ASIC Verification) at E-Infochips Training and

Research Academy Ahmedabad.

Master in VLSI Design and experience in ASIC Verification Domain.

In-depth knowledge on ASIC Verification with Verilog and System Verilog.

Excellent communication and presentation skills.

Self-motivated, Responsible, Ability to adapt and willingness to learn.

Professional Experience:

Organization: E-Infochips Training and Research Academy, Ahmedabad.

Duration : July 2015 to till date

Designation : Technical Associate

Description:

To Train graduates and professionals in ASIC Verification Domain.

Project Details:

Current Projects:

Development of Verification IP (VIP) for AMBA AXI3 Protocol based on UVM in System Verilog. Verification IP (VIP) is designed based on suitable UVC (Universal Verification Component) structure for AMBA

AXI protocol specified interface. This Bus base VIP acts as mater or slave to validate IP and user can configure

multiple master or slave without testbench modification. All basic UVC components like driver, sequencer, monitor,

agent, scoreboard, env etc. are designed. Various test cases are generated that provide satisfactory functional coverage

using constraint random verification.

VIP development of AMBA-APB Slave:

I have developed AMBA-APB slave environment in which the whole verification Environment with Layer Test bench

Architecture with different component like Packet class, driver, monitor scoreboard etc. Various test cases are

generated that provide satisfactory functional coverage using constraint random verification using VCS EDA tool.

Develop VIP of USB 3.0 SuperSpeed Physical Layer:

The project aimed at to manage transfer data either on 2.5 GT/s or 5.0 GT/s depends upon the mode and rate. In

Design I manage to capture the data that are coming asynchronously and lock the receiver clock with incoming

asynchronous serial data.

Verify the complete design of USB 3.0 SuperSpeed Physical Layer using System Verilog. I wrote an exhaustive

verification plan from the specifications. I created Verification Environment in System Verilog.

Page 2: Hardik_Trivedi_ASIC

M-Tech Project:

HDLC CONTROLLER DESIGN:

Designed HDLC transmitter using Verilog HDL, HDLC protocol was implemented with transmission of 8bit flag,

followed by data transmission by synchronous FIFO which was further processed by zero stuffing in order to

differentiate data from flag bit during reception. HDLC Receiver received data bit by bit. Reception begins with

recognition of flag register, which indicates the reception of new HDLC frame, followed by zero unstuffing

process, and after that data is received by secondary station.

Academic Profile

Master in Science (VLSI Design)

Manipal University

CGPA 8.43

2012 – 2014

Bachelor of Technology (Electronics & communication)

Rajasthan Technical University

58.31 %

2007-2011

HSC 71.20 %

SSC 72 %

Technical Skills:

HDLs & HVLs Verilog, System Verilog

Verification

Methodology

UVM

Bus Protocols AMBA AXI3, AMBA APB

Serial Protocol USB 3.0 (PHY)

Scripting PERL, Shell Scripting

Tools Synopsys VCS, Cadence NCSim, ModelSim 10.2, QuestaSim 10.2b, DVE

Skills Functional Verification, Constrained-random verification, UVM, Coverage Analysis

Certification:

SOC Verification using System Verilog by Udemy.

Learn OVM & UVM Testbenches from Scratch by Udemy

Achievements:

Secured Runners-up position in Inter Collegiate Volleyball Tournament in Feb 13-14.

Played State Level Volleyball Tournament in 2010.

Secured 4th position in National Level Youth Parliament in 2006.

Page 3: Hardik_Trivedi_ASIC

Paper Represented:

Published paper on “Implementation of USB 3.0 Super Speed Physical Layer Using Verilog HDL” at

International Journal of Computer Applications (IJCA) 95(24):1-5. Published by Foundation of Computer

Science, New York, USA

Published paper on “Design and Verification of USB 3.0 Link Layer (LTSSM)” at International Journal

of Computer Science and Information Technologies (IJCSIT), Vol. 5 (4), 2014, 4916-4921