Greeting from Chapter Chair - IEEE · Dr Mohanraj Soundara Pandian on Emerging MEMS Devices and Applications, followed by final lecture entitled PiezoMEMS Design, Fabrication and

IEEEElectronicsPackagingSociety(EPS)MalaysiaChapterNewsletterH2-2019

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GreetingfromChapterChair:Greetings to all EPS M’sia members. Time flies, as usual. Looks like thepublicationofthe2Hofthe2019newsletterisapproachingthebeginningofthenewyear2020,butjustintimefortheLunarNewYear!AccordingtolocalStarNewspaper,theElectricalandElectronic(E&E)Industrycontributed 38% of total exports with a trade surplus of RM119bn, highestamong all the sub sectors in themanufacturing segment in the recent year.Greatopportunitieslieaheadforussincenumerousmultinationalcompanies(MNCs) are reinvesting in the state of the art technology to continue tostreamlinemanufacturingandhoneitsprocessestoincreaseproductivity.Thisisachievedbytheadditionofautomationandcomputingpower,aligningittothe Industry 4.0 initiative. This would pave the way for more developmentprospects for our engineers and homegrown leaders to spearhead therelevantoperations.

ShawFongWONGIEEEEPSM’sia

ChapterChair2019IntelTechnology

Ourchapterhasonceagainheldmanygreatandexcitingevents,accomplishingourplannedmilestonesperschedule.We concluded our Bi-Annual 1-Day TechnicalWorkshop covering the state of the art technicaldiscussionrelatedtoartificial intelligence (AI) technologyandheterogeneous integrationrelatedpackagingknowledge sharing. Theeventwaswell received,with goodengagement frommore than180participantsfrom a diverse group of industry professionals, researchers and undergraduates from 30+ companies andlocalMalaysianuniversities.Ouron-going “Best Engineering StudentAward”(BESA)program isprogressingwell as usual. We have awarded this BESA program to the winners from the local universities, whichconsistedofUniversityofMalaya,U-TARandtheNottinghamUniversityin2019,andlookingtoexpandingtoothereducationistitutionsinthenearfuture.<Youcanrefertothedetailedupdateinthis2Hnewsletter>WehaveactivelyengagedtheIEEEstudentbranchintheStudentBranchAdoptionProgramtocultivatemoreIndustry-Academic interaction on Science, Technology, Engineering and Mathematics (STEM) initiatives.Some of this involved volunteer efforts from our technical community to present technical talks andpresentationstoournextgenerationhomegrownengineeringtalents,organizeeventsandsponsorships.AtechnicaltalktoUniMAPduringtheirIEEEDayentitled“SemiconductorPackagingforAutonomousDriving”was supported by IEEE EPS Malaysia as part of this drive. Per plan, we also continued our Reach Outopportunities by delivering a few invited talks and participated actively in a few established Regional EPSConferencessuchasECTC,ICEPT,IMPACT,EPTCthatwasheldinUSA,PeopleRepublicofChina,HongKong,Taiwan, Singapore amongst others. We continue our in technical knowledge exchanges as well as crosschapters’engagementstoformaclose-knittechnicalcommunity.TheactiveengagementfromMalaysiaEPSchapterhadgarneredourchapterandsomecommittedindividualswithinourcommunitysomeprestigiousawardsfromMalaysiaIEEESectionaswellasEPSHQ,somethingtobeproudof!Sowhat’snext from IEEEEPSMalaysiaChapter tomotivateour regionalengineeringcommunity touptheante for technical excellence? It’s the upcoming 39th International Electronics Manufacturing Technology(IEMT)2020Conference!!WearelookingforwardtoseeingallofyouthereinPutrajayathisyear!!Istronglybelievewecanmaintaingoodlinkageswithour long-timeestablishedfriendships,asidefromthetechnicalknowledgeexchanges. Ihopedyou’vehadfun in2019andanticipatinganevenbetterchapter in2020!!Lookingforwardtoyourcloseparticipationandcontinuedsupportinourexciting2020events!


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IEEEEPSStudentBranchProgramEngagement–IndustrialLectureProgram (ReportedbyMohdHafizIsmail,InfoprovidedbyDr.Banu)

IndustrialLectureProgramwassuccessfullyorganizedbyIEEEElectronicsPackagingSocietyMalaysiaChapter,IEEE UniMAP Student Branch and School of Microelectronic Engineering, Universiti Malaysia Perlis on 1stOctober2019atAuditoriumTuankuSyedFaizuddinPutraLibrary.Thisprogram,whichispartofIEEEMalaysiaSectionStudentBranchAdoptionprogram,involvedthreespeakersfromindustries;DrEuPohLengfromIEEEEPSMalaysiaandNXPSemiconductorMalaysia,DrMohanrajSoundaraPandianandDrJohnTanfromSilterraMalaysiaSdn.Bhd.155finalyearstudents(RK05MicroelectronicEngineering,RK86ElectronicEngineeringandRK89 Photonic Engineering) and staff from School of Microelectronic Engineering, UniMAP attended thisprogram–firstIEEEDay2019eventinMalaysiaSection.

Figure1:GroupphotoatAuditoriumTuankuSyedFaizuddinPutraLibraryafterfirstsession

ThisIndustrialLectureProgramwasco-chairedbyDrHasnizahbintiArisandDrNorainibintiOthman.EmceefortheprogramwasMuhammadAliSajjadbinMohamadHabibullah,ChairofIEEEUniMAPStudentBranch.3studentvolunteerswereLiewPuiYen,StelliaWongSuawMayandLiangKaiQi.Theprogramwasorganizedin4sessions.ThefirstsessionwasalectureentitledSemiconductorPackagingforAutonomousDrivingbyDrEuPoh Leng. This is followed by visit by all speakers to School of Microelectronic Engineering laboratories;microfabricationcleanroom,failureanalysislab,laserlabandsimulationlab.ThethirdsessionwasalecturebyDrMohanrajSoundaraPandianonEmergingMEMSDevicesandApplications,followedbyfinallectureentitledPiezoMEMSDesign,FabricationandCharacterizationbyDrJohnTan.MuhammadAmiruzHusainibiSuhaimi,NurShahirahbinti ZakariaandNurulNadiahbintiAwangwere selectedasbestparticipants,basedon theirreflectionaftereachlecturesessions.Theprogramendedwithgroupphotosessionandlunch.

Figure2:ThefirstlecturesessiondeliveredbyDr.EuPohLengfromIEEEEPSMalaysiaandNXPSemiconductorMalaysia


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Figure3:WinnersofQ&Qsessions,prizessponsoredbyIEEEEPSMalaysia

Figure4:ATokenofAppreciationfromSchoolofMicroelectronicEngineering,UniMAPandIEEEUniMAPSBtoDrEuPohLeng,deliveredbyIrDrBanua/pPoobalan,UniMAPSeniorLecturerandExecutiveCommitteeofIEEEEPSMalaysia

Figure5:Visitbythespeakerstolaboratories,facilitiesatSchoolofMicroelectronicEngineering,UniversitiMalaysiaPerlis

Figure6:TokenofAppreciationfromSchoolofMicroelectronicEngineering,UniMAPandIEEEUniMAPSBtoDrMohanrajandDrJohnTan,deliveredbyDrHasnizahArisandDrNorainiOthman,UniMAPSeniorLecturerandExecutiveCommitteeofIEEEMalaysiaSectionSensorsandNanotechnologyJointCouncilsChapter


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IEEEEPSBESAFYPAwards2019 (CompiledbyAssoc.Prof.Ir.Dr.YewHoongWONG)

BestEngineeringStudentAwards(BESA)FinalYearProjectUndergraduateWinnersfor2019

EPSMalaysiahasaregular“BestEngineeringStudentAwards(BESA)”forUndergraduatesontheirFinalYearProject. This is the 3rd year of its roll out and the aim is to reward and encourage technical excellence inMalaysia’snextgenerationofengineers.Congratulations to thewinnerswhoreceivecashprize,bookandacertificatefromIEEEEPS!Student Supervisor FinalYearPaperTitle UniversityChanWengXin Prof.Dr.A.S.M.A.

HaseebEffectsofCobaltNanoparticleAdditiontoTin-BismuthSolder

UniversityofMalaya(UM)

TayYuJun Dr.KarenWongMeeChu

ThermomigrationinSn-Ag-Cu-PtSolderJoints

UniversitiTunkuAbdulRahman(UTAR)

OmarMohamedSaidAlyAhmedElnaggar

Dr.RoselinaAdelhi BiomimeticHandProsthesis-INCREDIBLE!!

UniversityofNottingham(MalaysiaCampus)

Table1:Summaryofthe2019BESAFYPRecipients

WinneroftheBestEngineeringStudentAward(BESA)2019atUniversityofMalayaThe Best Engineering Student Award (BESA) 2019 at University ofMalaya (UM) was awarded toMr. ChanWeng Xin, a Materials Engineering student in the Department of Mechanical Engineering. The title of hisproject was "Effects of Cobalt Nanoparticle Addition to Tin-Bismuth Solder". Sn-58Bi is a high strengthmaterial; however, its low ductility reduces the reliability issue during the service life. In past decades,researchershavefoundthattheadditionofnanoparticlecouldenhancethereliabilityissue.Sincetheadditionofcobaltnanoparticle toSn-58Bihasnotbeenstudiedyet, thus in this research,Cobaltwasusedasa thirdelement(nanoparticle)additiontoSn-58Bisoldermaterial.

WengXinwouldliketoexpresshisgratitudetoIEEE-EPSMalaysiaChapterfortheBESA2019award.Hewould

also like toexpresshisappreciation for thementorshipofhis supervisor,Prof.Dr.A.S.M.A.Haseeband the

FinalYearProject(FYP)coordinatorDr.NazatulLianaSukiman.Theirguidancehadbeenmonumental inthis

achievement.Thewinner receivedmonetaryawardandacertificate. Ir.Dr.WongYewHoong, the IEEE-EPS

MalaysiaChapterrepresentativeintheFacultyofEngineeringUM,presentedthecertificate.

Figure7:Ir.Dr.WongYewHoongpresentingtheBESA2019certificatetoChanWengXin


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IEEEEPSMalaysia2019SemiconductorAdvancedPackagingWorkshop (ReportedbyEngHooLEOW)

The2019SemiconductorAdvancedPackagingWorkshoporganizedbyIEEEEPSMalaysiaChapterisback!Thebi-annualone-daytechnicalworkshoptookplaceatEastinHotel,PenangandNewWorldHotel,PetalingJayascheduled on September 24th and 25th respectively. It featured contemporary packaging trends anddevelopmentofemergingtechnologiesfromtwodistinguishedspeakersinthefieldofsemiconductor:(1)Prof.Dr.Madhavan Swaminathan (Georgia Tech, USA) on “Intelligent Digital Convergence for AI and 5G” (2)Dr.JohnLauHonShing(UMTC,Taiwan)on“Fan-OutWafer/Panel-LevelPackaging&HeterogeneousIntegrations(SiPs)”.

Figure8:Honorablespeakers:Prof.Dr.Swaminathan,GeorgiaTech,USA&Dr.JohnLau,UMTC,Taiwan.

Approximately 180 attendees - a diverse group of industry professionals, researchers and undergraduatesfrom 30+ companies and local universities Malaysia wide participated in this informative and qualityknowledge sharing session. In 2019, EPS Malaysia Chapter and Anton-Paar Sdn. Bhd. have exceptionallyextended sponsorship to academia, primarily aimedat providing industrial exposure topotential graduates.What’snext from IEEEEPSMalaysiaChapter to constantlymotivate regional engineering community to thenext level of technical excellence? –it’s the 39th International ElectronicsManufacturing Technology (IEMT)2020Conference.WearelookingforwardtoseeingyounextyearinPutrajaya!!

Figure9: 2019 Semiconductor Advanced Packaging Workshop AttendeesatEastinHotel,Penang


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Figure10:AttendeesatNewWorldHotel,PetalingJaya.

Figure11:Souvenirpresentationtospeakersastokenofappreciation

Figure12:Workshop-In-ProgressandNetworkinghour


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IEEE2ndChapterChairMeeting2019Notes/Passdown (NotesfromAssoc.Prof.Ir.Dr.YewHoongWONGandKhaiChatTAN)

IEEE2ndChapterChairMeeting2019Date:23rdNovember2019Time:9.00am–1.00pmVenue:IOIPalmGardenHotel,Putrajaya

ExtractofmeetingbasedonmaterialspresentedbySectionexcomembers.

1. UpdatebyIEEEMalaysiaSectionChaira. Visibility and reputation of IEEEMalaysia improved by establishing “strategic communication”

portfolio, i.e. through dissemination of information in “Did You Know” posters. Any ideas orcontentscangothroughthisportfolio.

b. Four (4) senior member elevation workshop have been conducted in 2019 to increase thenumberofseniormembership.

c. VariouseducationalandprofessionalactivitiesconductedthroughoutMalaysia.d. EstablishedIEEEMalaysiaDistinguishedLectureProgram(MyDLP).Sofar, four(4)activitieshad

beenconductedthroughoutMalaysiain2019.e. IEEEMalaysiaSectioniscallingfornominationforthefollowingawards:

Nominationstobesubmittedby30thNov2019.

Figure13:2019AwardNominationsforRegion10

f. In theeventof technically co-sponsora conference,a feecanbechargeon theworkofpaperreviewing/similaritytestetc

2. UpdatebyIEEEMalaysiaSectionSecretarya. SecretaryannouncedthatEPShasrebateofUSD295viavToolreportssubmission.b. SecretarytracedthatuptoOct2019,EPShasonlyfiledin2reports.EPSsecretaryhasfiledina

total of 16 reports in vTool up to Nov 2019 [7 Technical, 5 Admin, 3 Professional, and 1Nontechnical (AwardsDinner)],pending for3 reports [Impact2019 (Technical), IEMT2020Nov2019Meeting(Admin),andIEEEDayinUniMAP(Professional)]tobefiled.


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c. For2019,EPS is required to submit reportson (minimum)2 technicalmeetingsand1 financial

report.ReportingisdueonThirdFridayinFeb2020.

3. Financematter:a. Issuearisewithseveralchaptersregardingonlinebankingservicesincludedifficultiestoregister

anaccount,unabletochangesignatory,usernamebeingoverridebysection.ThisisduetosingleROSusedforeverychapters.

b. Tosolvetheissue,sectionproposetoregistereachchapterswith:Option1:individualROSnumber.Option2:eachchapterhasextensionofrunningnumberfromSectionROS#examplePPM-001-10-25111987001societyAPPM-001-10-25111987002societyBPPM-001-10-25111987003societyC

c. Firstroundshowofhandsuggestpostponementofproposalduetomanyuncertainties,sectionwilldiscussfurtherwithROSforoptionsavailableandcomebacktochaptersonthebestoption.

d. Sectionandchapterscollectivelyagreetoreducetheconferencesurpluscontributiontosectionfrom30%to15%.

4. AGM2020a. EncourageallchapterstohaveAGMonthesamedate(18thJan2020)b. Annualdinnerheldsamenight,withguestofhonorMESTECCMinisterYeoBeeYin.(pending

confirmation)


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REGIONALEVENTS:

20thInternationalConferenceonElectronicPackagingTechnology(ICEPT) (WrittenbyEngHooLEOW)

The “International Conference on Electronic Packaging Technology” (ICEPT)- one of IEEE EPS flagshipconference,wasorganizedoutsidemainlandChinaforthefirsttime,astomarkitsnotablemilestoneof20thanniversaryin2019.Theconferencewasheldfrom11thto15thAugust2019,attheHongKongSciencePark,Shatin, featuring 6 professional development short courses, 3 opening address, 7 keynotes, near 300interactivepresentations,8exhibitionboothsand1complimentarytechnicalsitevisitatASM.Approximately250delegates,be it industryprofessionalsoracademicians fromregion-wideparticipated in theconferencethatshowcasedthequalityandquantityoflate-breakingdevelopmentsofemergingsemiconductorpackagingtechnologies for Integrated Circuits (ICs), opto-electronics, passives, MEMS, etc. In addition, IEEE EPS R10representativesalsometupface-to-facetoalignonfuturecollaborations.KudostoHongKong-Chinateam!!Thisfeatwouldnothavebeenpossiblewithouttheirtirelesseffort…

Figure14:Groupphotooftheparticipants

IEEEEPSR10Meetingheldonthe14thofAug2019hadakeytakeawaysummary–WorkforwardtoenhanceEPTCastheR10EPSflagshipconference(Asia-ECTCversion)


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20thElectronicsPackagingTechnologyConference(EPTC)atSingapore (WrittenbyDr.YikYeeTAN)

Mr.WongShawFongandDr.TanYikYeerepresentedEPSMalaysiaChapterintheIEEEElectronicsPackagingTechnology Conference (EPTC) from Dec 4th to 6th in Marina Bay Sands, Singapore. The conference hadattracted more than 400 attendees from around the world with 160 technical papers and 20 invitedpresentationsscheduledandpresentedin20oralsessionsandaninteractivepostersession.Theconferenceintroduced 5 professional development courses by experts from both industry and academia, and it wasopenedtoall registeredconferenceparticipantswithoutadditionalcosts.Oneof themoreexcitingsessionswasthe“HeterogeneousIntegrationRoadmap”(HIR)byDr.WilliamChen,Dr.BillBottomsandotherexperts.TheHIR20191steditionwasreleasedinOct2019;itisfreetoatotalof23Chapterstodownload.Otherthanthis,thereweremanyleadingedgetechnologiesshowcasedbyexhibitors,openedtocrowdbrowsingduringbreak time between presentations. Therewas also an announcement from the EPTC organizing committeethat they would seriously consider organizing the EPTC in other Asian locations from 2020 onwards. EPSMalaysiaislookingforwardtopartneringwiththeminthenearfuturetoholdthisnotableconferenceinourhomeground.

EPSMalaysiawas given an opportunity to promote 2020 IEEE 39th International ElectronicsManufacturingTechnologyConference(IEMT)duringluncheononDec6th.Dr.TanYikYeewasusingavideofile,whichwasrecorded in IEMT2018, to spark interest amongst the attendees to promote this event. Thiswas definitelyworthathousandwordsbyreviewingtheactualcrowdandcontentthathadsuccessfullyattractedmorethan400globalparticipantsinthepast.AflyerwithsomeofthehighlightswasalsoavailablefordistributionattheEPSboothandluncheontabletopromoteIEMT2020conferenceinPutrajaya,Malaysia.GoodjobbyDr.TanfortheforesightandinitiativetopreparetherequiredvideoandfortakingtheopportunitytoadvertiseIEMT2020atETPC2019!!

Figure15:Dr.TanYikYeeispromotingIEMT2020onstageandtheflyerisdistributedtoparticipants.


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IEEER10ChapterChairMeetingatEPTCSingapore(December,2019)(SummarizedbyDr.YikYingTAN)

TheIEEEEPSRegion10ChaptersChairsmeetingwasheldatEPTCconferenceonDec5th.Allregion10Chapterleaders were warmly invited to meet with fellow EPS leaders to get the latest update, guidance andnetworkingtosupporteachotherinrunningtheEPSchapterattheirrespectivecountries.

Figure16:Region10ChapterleadersmeetingatEPTC2019inSingapore.

ItwaswithgreatpridethatWongShawFongwasselectedtoreceivethe2019RegionalContributionAwardforRegion10(AsiaandPacific)duetohisoutstandingandsustainedleadershipcontributionstotheIEE/EPSMalaysiaChapter.Hedeservesthisprestigiousawardgivenhisnumerousyearsofoutstandingcontributionsand leadership in multiple regional conferences and local IEEE EPS activities. He was significant in thedevelopmentofElectronicPackagingSocietyMalaysiaChapter,instrumentalindevelopingclosecollaborationeventsandhadstrongengagementwithotherR10chaptersthroughtechnicalcommitteeparticipation.

Figure17:Mr.WongShawFongreceivingaward“2019RegionalContributionAwardforRegion10(AsiaandPacific)”

Documents

Greeting from Chapter Chair - IEEE · Dr Mohanraj Soundara Pandian on Emerging MEMS Devices and Applications, followed by final lecture entitled PiezoMEMS Design, Fabrication and