Generic Repair Manual

1220-1336 Rev 1 © Sony Ericsson Mobile Communications AB – Company Internal

Generic Repair Manual - electrical -

Generic Repair Manual (elect)

1220-1336 Rev 1 © Sony Ericsson Mobile Communications AB – Company Internal 2(37)

This Generic Repair Manual – electrical consists of generic information and is as such a complementary document to the following product specific repair documents: • Tests & Calibration - electrical • Troubleshooting Guide - electrical • Component Replacement - electrical

Since the content of this Generic Repair Manual is valid for all phone models to be launched within a foreseeable future, the information to be found in this manual will not be copied to the documents listed above. If you for some reason will find a discrepancy between this manual and any product specific document, the information found in the product specific document should be regarded as the valid source of information.



CONTENTS

1 Process Flow Chart ........................................................................4 2 Setup Go/NoGo Test ......................................................................5

2.1 Stand-Alone vs. SERP........................................................................... 5 2.2 Antenna Coupler vs. Direct Line .......................................................... 5 2.3 Antenna Coupler Testing ...................................................................... 6 2.4 Direct Line Testing................................................................................. 7

2.4.1 Direct Line....................................................................................................... 7 2.4.2 Direct Line with RF Fixture ............................................................................ 7

2.5 Connections ........................................................................................... 8 2.5.1 Stand-Alone .................................................................................................... 8 2.5.2 SERP................................................................................................................ 8

3 Troubleshooting Directions ..........................................................9 4 Moisture & Baking........................................................................11 5 PBA Component Finder...............................................................12 6 Soldering.......................................................................................13

6.1 Lead-Free Soldering ............................................................................ 13 6.2 Temperature Issues ............................................................................. 15

7 Go/NoGo Testing..........................................................................16 7.1 Overview............................................................................................... 16 7.2 Channel Allocation Table .................................................................... 17 7.3 Power Level Allocation Table ............................................................. 17 7.4 Test Limits ............................................................................................ 18 7.5 Attenuation Factors ............................................................................. 18 7.6 Test Sequence – Antenna Coupler..................................................... 19

7.6.1 GSM 850 - Measurements & Test Limits..................................................... 20 7.6.2 GSM 1900 - Measurements & Test Limits................................................... 21 7.6.3 GSM 1800 - Measurements & Test Limits................................................... 22 7.6.4 GSM 900 - Measurements & Test Limits..................................................... 23 7.6.5 UMTS 850 - Measurements & Test Limits................................................... 24 7.6.6 UMTS 1700 - Measurements & Test Limits................................................. 25 7.6.7 UMTS 1900 - Measurements & Test Limits................................................. 26 7.6.8 UMTS 2100 - Measurements & Test Limits................................................. 27

7.7 Test Sequence – Direct Line ............................................................... 28 7.7.1 GSM 850 - Measurements & Test Limits..................................................... 29 7.7.2 GSM 1900 - Measurements & Test Limits................................................... 30 7.7.3 GSM 1800 - Measurements & Test Limits................................................... 31 7.7.4 GSM 900 - Measurements & Test Limits..................................................... 32 7.7.5 UMTS 850 - Measurements & Test Limits................................................... 33 7.7.6 UMTS 1700 - Measurements & Test Limits................................................. 34 7.7.7 UMTS 1900 - Measurements & Test Limits................................................. 35 7.7.8 UMTS 2100 - Measurements & Test Limits................................................. 36

8 Revision History ...........................................................................37



1 Process Flow Chart

1.Unit in

2.Determine

fault

4.Troubleshoot

Hardware fault found!

5.Repair

6.Upgrade software to latest revision

(if needed)

8.Update with LabelMake(if needed)

9.Test

10..Unit out

Pass!

3.Customer abuse!

Reject!

Software fault found! No fault found!

Liquid intrusioncheck!

11.Repair cannotbe carried out

Fault not repairableat this service level!Cause of failure not

found!

Fault not repairableat this service level!

Fail!

1. Unpack and handle the unit according to local instructions.

2. Use the Test Instructions - mechanical to confirm that the phone is faulty and try to verify customer’s complaint. Perform those tests needed for confirmation of the failure. If a software fault or no fault is found, upgrade the software. If a hardware fault is found, start troubleshooting.

3. If liquid intrusion or other kind of abuse can be established, the unit must be rejected according to your local instructions.

4. Use the Troubleshooting Guides - mechanical & electrical, to determine the cause of failure.

5. Use the Working Instructions - mechanical & Component Replacement - electrical, to repair the unit. Parts that can be replaced are found in the Part List - mechanical and Component Replacement - electrical.

6. Look for software information in the document Customization.Upgrade to the latest software revision, if needed, and report

as ’SW Upgrade’. If no fault has been found, alternatively perform a ’Software Update Content Refresh’.

8. If required, print out and attach a new label as described in theWorking Instructions - mechanical.

9. Perform all tests described in the Test Instructions - mechanical and Tests & Calibration - electrical.

10. Handle and package the unit according to local instructions. If no fault has been found, report as ’NTF’.

11. If a failure cannot be found or be repaired at this service level, choose one of the following alternatives:

- Swap the unit according to the Swap Instructions and local instructions

- Return the unit to the customer on request- Send the unit to next level of repair according to local

instructions

7.Calibration(if needed)

7. If a repair that requires calibration has been done, then calibrate the unit using SERP as described in Tests & Calibration – electrical. TO BE DONE BY AUTHORIZED SERVICE CENTERS ONLY!



2 Setup Go/NoGo Test

All Go/NoGo tests are based on SEMC approved test instruments to be installed with: • a SEMC Go/NoGo test script to be downloaded from vendor site • a locally written Go/NoGo test script

and the test result has to be verified against the Go/NoGo Testing. Non-SEMC test scripts need to be approved by SEMC!

2.1 Stand-Alone vs. SERP The handling and control of the test instrument can be done in two ways, Stand-Alone or SERP. STAND-ALONE • The test instrument controls the entire testing, and:

- a relatively inexpensive test instrument can be used - is suitable for service centers not being authorized to perform calibrations

SERP The test instrument executes the testing but is controlled by the SERP application of a computer, and: - a rather expensive test instrument must be used - is suitable for service centers being authorized to carry out calibrations (no need for a separate Stand-Alone test instrument)

2.2 Antenna Coupler vs. Direct Line The input readings to the test instruments can be setup in two different ways: - Antenna Coupler (a radiated test inside a shield box) - Direct Line (a conductive test from the phone’s external antenna connector, with or without an RF Fixture, depending on the phone model to be tested). ANTENNA COUPLER Testing with an Antenna Coupler is considered to be the best alternative: - testing can be done on all phones - the shield box isolates the phone and makes it non-susceptible to exterior interference - the entire phone is tested Testing can be done with a fully charged battery or a dummy battery with external power supply (if the shield box is prepared for this). However, testing with a fully charged battery is the preferred method, since the presence of a standard battery may affect the readings in a more accurate way. DIRECT LINE Testing with Direct Line implies certain limitations: - testing can only be done on phones with an external antenna connector - the phone may be susceptible to exterior interference - the function of the phone’s internal antenna is not tested If a Direct Line test says ‘Go’, the phone ought to be tested with an Antenna Coupler and if this test says ‘NoGo’, there is probably an antenna related problem with the phone.



Setup Go/NoGo Test

2.3 Antenna Coupler Testing

The grid positioning plate of the shield box, containing the antenna coupler, includes a number of holes arranged in a grid, X-axis = A to R and Y-axis = 1 to 25, where the grid positioning holder will be placed.

Place the grid positioning holder with its reference point (see arrow) in the matrix position stated in the product specific document Tests & Calibration for the phone. Insert a test USIM (a standard test SIM can be used for GSM phones only) that is compatible with the instrument, attach a fully charged battery and the battery cover. Place the phone in the antenna coupler as shown in Tests & Calibration and Rohde & Schwarz grind plat for SERP and close the lid of the shield box. Start the test instrument, run the proper test script and follow the instructions on the test instrument.

The product specific documents Tests & Calibration will include a picture similar to the adjacent one that clearly specifies how to position the grid positioning holder and the phone.



Setup Go/NoGo Test

2.4 Direct Line Testing 2.4.1 Direct Line Insert a test USIM (a standard test SIM can be used for GSM phones only) that is compatible with the instrument and connect a fully charged standard battery and battery cover or a dummy battery with external power supply. Remove the phone’s external antenna cap and connect the RF Antenna Adaptor to the antenna connector on the phone. Connect the other end of the cable to the test instrument. Start the instrument, run the proper direct line script and follow the instructions on the test instrument.

2.4.2 Direct Line with RF Fixture Insert a test USIM (a standard test SIM can be used for GSM phones only) that is compatible with the instrument and connect a fully charged standard battery and battery cover or a dummy battery with external power supply and, if necessary, the battery cover. Remove the phone’s external antenna cap and mount the RF Antenna Adaptor on the RF Fixture and attach the RF cable. Secure the phone to the fixture and connect the opposite end of the RF cable to the test instrument.

Start the instrument, run the proper test script and follow the instructions on the test instrument.



Setup Go/NoGo Test

2.5 Connections

2.5.1 Stand-Alone Connect the RF cable to the test device (antenna coupler or direct line) and the RF-port of the test instrument. The optional printer is connected to the test instrument and is recommended for printouts of the test results.

2.5.2 SERP Connect the RF cable to the test device (antenna coupler or direct line) and the RF-port of the test instrument. The computer includes a GPIB card that connects to the test instrument via the GPIB cable. The optional printer is connected to the computer and is recommended for printouts of the test results.

Optional GPIB cable

RF cable

Printer cable

RF cable

Printer cable

Optional



3 Troubleshooting Directions

GENERAL The product specific document Troubleshooting Guide - electrical should be used only after the actions from the Troubleshooting Guide - mechanical repair have been exhausted for the specific symptom. The purpose of the Troubleshooting Guide - electrical is to indicate the electrical level repair actions associated with the different failure symptoms. For symptoms that have multiple repair actions, the repair actions are listed in order of their probability of creating a successful repair.

EXAMPLE Power On/Off Symptom: Replace:

Current draw when powered off V0302 N5700 N7520

The first action has the highest probability, and subsequent actions have lower probabilities, e.g. V0302 N5700 N7520. The intention is for the repair technician to implement the first repair action and then retest the phone. If the phone continues to fail the same test, then the technician should continue to the second repair action. If the phone continues to fail the same test after all of the repair actions are exhausted, then the phone will be considered not repairable at this level. EQUIPMENT & MEASUREMENTS Voltage, current, and resistance information is provided for some symptoms to enable faster repairs. A power supply with digital current display and a DMM (Digital MultiMeter) are required for these purposes as shown in the pictures below. Purchase of such equipment and performing these measurements are optional but recommended.

Perform current measurements using a dummy battery and power supply with digital current display. The phone should be fully assembled (battery cover not required).



Troubleshooting Directions

Use the DMM to carry out voltage measurements on diodes.

Use the DMM to carry out resistance measurements.

ADDITIONAL TROUBLESHOOTING INFORMATION Certain steps in the troubleshooting flow may require additional visual information. To jump to that information, click on the ’Go To’ icon To revert to the previous position in the troubleshooting flow, click on the ‘Return’ icon For service centers using hard-copies the additional information is found at the end of the Troubleshooting Guide – electrical under section Additional Info (if applicable).



4 Moisture & Baking

Some components in the products are moisture sensitive and must be ‘baked’ prior to use, if they have been exposed to air. These components and their moisture sensitivity levels are specified in the product specific document Component Replacement, section Component Placing. Below is a brief description of moisture sensitivity levels, but repair centers should visit the JEDEC website for more details before reworking moisture sensitive components. Search for the most recent version of the IPC/JEDEC J-STD-033A standard online at http://www.jedec.org LEVEL 1 - unlimited floor life, does not require dry pack or ‘re-baking’ LEVEL 2 - 1 year floor life LEVEL 2A - 4 weeks floor life LEVEL 3 - 168 hours floor life LEVEL 4 - 72 hours floor life LEVEL 5 - 48 hours floor life LEVEL 5A - 24 hours floor life LEVEL 6 - 6 hours floor life COMMON TO LEVEL 2, 2A ,3 ,4 ,5 ,5A, 6 - ≤ 30oC at 60% relative humidity - shipped in dry pack - must be ‘re-baked’ after being opened If floor life is exceeded Parts shipped from a Sony Ericsson parts warehouse are most likely not shipped in dry packs. This means that the time elapsed between placing the order and receiving the parts must be considered as time exposed to the environment. Different moisture sensitivity levels and exposure times create the need for different ‘baking’ temperatures and times. For more information regarding ‘baking’, refer to: SEMC PBA Repair Requirement Specification – Repair Centers, 1/1056-LXE110 0378.



5 PBA Component Finder

Use Adobe Reader 8 (or later) to open the PDF-document containing the component placing and then locate the “Find” box.

Type the position number of the component to be found and press ‘Enter’.

The position number of the component is shown with shaded text. If necessary, use the Zoom function (blue ellipse above) to find the shaded text.



6 Soldering

6.1 Lead-Free Soldering

All recent Sony Ericsson mobile phones are manufactured with lead-free solder and lead-free components! During electrical repair, it is critical to make sure that no lead is introduced. This symbol indicates that the product is lead- free.

All lead-free PBA’s will be marked with this symbol.

A lead-free work area must be set up completely separated from work areas that are used to make lead repairs. The lead-free work area must also be clearly labeled with the lead free symbol as shown in the adjacent picture. The items on this desk must remain lead-free. They must be adequately labeled to make their lead-free status clearly and easily recognized.

LFS (lead-free solder paste) characteristics: - high melting point (typically 220°C) - low wetability - high surface tension - difficult to spread - recommended tip temperature = 360°C When servicing PBA’s that have been manufactured with LFS (lead-free solder paste), LFS must be used. If not, there is a high risk for unreliable soldering joints. Lead-free solder joints are more difficult to inspect as they do not have shiny surfaces like leaded solder joints and lead-free solder does not flow as well as leaded solder, so some of the solder pad areas may remain exposed.



Soldering: Lead-Free Soldering

Solder joints with lead: Shiny surface!

Lead-free solder joints: Matt surface!



Soldering

6.2 Temperature Issues

HOT AIR GUN TEMPERATURE REQUIREMENTS The air temperature must not exceed 360oC. This temperature should be measured 5 mm from the nozzle outlet. If it is not possible to remove and/or solder with 360oC, another repair process (e.g. BGA rework, soldering iron, bottom heater) must be considered to ensure a high process control. A temperature being too high can cause damage and cracks due to the thermal stress on sensitive components, e.g. ceramic components like capacitors.

SOLDERING TIP TEMPERATURE REQUIREMENTS The soldering tip temperature must be minimum 310oC and maximum 360oC. A temperature being too high can cause damage and cracks due to the thermal stress on sensitive components, e.g. ceramic components like capacitors.

BOTTOM HEAT REQUIREMENTS In certain cases some components may require a bottom heater during repair in order to pre-heat the board and to level out the T on the PBA. This will also minimize the thermal stress. The temperature on the PBA surface must not exceed 150oC to minimize inter-metallic growth and thermal stress on the PWB.

BGA REWORK SPECIFICATIONS For all components that require the use of a BGA Rework Station, follow the: Technical Requirement, Generic document; Space ID: 1207-2949 and Heat treatment document, product specific (available only when there is support for BGA profiles on CSPN) For more information regarding generic repair methods, refer to: SEMC PBA Repair Requirement Specification – Repair Centers, 1/1056-LXE110 0378



7 Go/NoGo Testing

7.1 Overview This section provides information for centers who want to write their own test scripts as opposed to using SEMC scripts. Non-SEMC test scripts need to be approved by SEMC! The test requirements for UMTS and/or GSM phones using an antenna coupler or direct line connection are included in this section. These test sequences should be used as an arrival and verification test of the radio functionality. Tests are done in signaling mode, i.e. a call has been established to the test instrument. The test instrument controls the transceiver unit. RF performance is measured with an antenna coupler or the direct line connection, whichever method is selected. This document includes all available bands! Most phone models do not include all these bands! The test should be designed so those users with little or no system expertise can perform accurate testing. The measurements should run automatically, though a certain amount of manual work is included (and mandatory), such as phone call setup (i.e. dialing a number). It is recommended to have the measurements results stored or printed out. It should be possible to change the channels used in testing due to possible local radio interference. The ranges for these settings are specified under the Channel Allocation Table. All functions and settings should be protected in such a manner that the end-user cannot directly change them. (For example, a password or encrypted settings file.) The test instrument must be capable of using different attenuation factors for RX and TX and it must also be possible to use various attenuation factors for different channels in each band. The attenuation factors that should be used are found in the product specific document ‘Tests & Calibration’!



Go/NoGo Testing

7.2 Channel Allocation Table

Band Ch definition Any ARFCN of:GSM850 Low 128-132 GSM850 Mid 187-191 GSM850 High 247-251

GSM900 Low 975-979 GSM900 Mid 36-40 GSM900 High 120-124

GSM 1800 Low 512-516 GSM 1800 Mid 697-701 GSM 1800 High 881-885

GSM1900 Low 512-516 GSM1900 Mid 658-662 GSM1900 High 806-810

WCDMA 850 Low 4132 WCDMA 850 Mid 4175 WCDMA 850 High 4233

WCDMA 1700 Low 1312 WCDMA 1700 Mid 1410 WCDMA 1700 High 1513 WCDMA 1900 Low 9262 WCDMA 1900 Mid 9400 WCDMA 1900 High 9538

WCDMA 2100 Low 9612 WCDMA 2100 Mid 9750 WCDMA 2100 High 9888

7.3 Power Level Allocation Table

Band PL definition Power level (PL)GSM850 Lowest 19 GSM850 Mid 12 GSM850 Highest 7

GSM900 Lowest 19 GSM900 Mid 12 GSM900 Highest 5

GSM1800/1900 Lowest 15 GSM1800/1900 Mid 8 GSM1800/1900 Highest 0



Go/NoGo Testing

7.4 Test Limits The test limits for each measurement are specified in the sequence tables. Since the coupler introduces higher measurement inaccuracy, some measurements may have wider limits than stated in the GSM and 3GPP specifications. The conducted limits conform to the phase 2 GSM and 3GPP specification.

7.5 Attenuation Factors The different scripts must be configured with the correct attenuation factors and named after the product that they are designed to test. The attenuation factors to be used are stated in the product specific document Tests & Calibration.



Go/NoGo Testing

7.6 Test Sequence – Antenna Coupler

INITIALIZING AND CALL SETUP

Parameter Value Unit BCCH Mid Ch TCH Mid Ch Tx power level High PL RF output power -40 dBm System GSM 850

SEQUENCE If a standard battery is used for this test, It is most important that this is a fully charged battery, otherwise there is a high risk for incorrect test results!

1. Initialize the instrument 2. Insert a test USIM (a standard test SIM may be used for GSM testing only) and attach a fully

charged standard battery to the phone 3. Position the phone in the shield box as described in the product specific document Tests &

Calibration 4. Turn on the phone and wait for registration 5. Set up a call to the instrument or let the instrument call the phone 6. Close the lid on the shield box 7. Audio loopback

- set power level to high - activate audio loopback in the instrument - operator must acknowledge passed or failed before the test is continued

8. On-going test - refer to the measurement and test limits on the following pages and the product specific document Tests & Calibration

9. Test end - disconnect the call and end the test



Go/NoGo Testing: Test Sequence – Antenna Coupler

7.6.1 GSM 850 - Measurements & Test Limits

7.6.1.1 Low TCH Parameter Value Unit TCH Low Ch Tx power level High PL RF output power -68 dBm System GSM 850

Measurement Test Limits Unit Tx power 29 ±4 dB RMS Phase error 0 ±5 deg Rx Level 34-50 dB Rx Quality 0-3 units

7.6.1.2 Mid TCH

Parameter Value Unit TCH Mid Ch Tx power level Mid PL RF output power -102 dBm System GSM 850

Measurement Test Limits Unit Tx power 19 ±5 dB RMS Phase error 0 ±5 deg Peak Phase error 0 ±20 deg Freq error ±0.1 ppm Hz Rx Level 2-14 dB Rx Quality 0-3 units

7.6.1.3 High TCH

Parameter Value Unit TCH High Ch Tx power level Low PL RF output power -68 dBm System GSM 850

Measurement Test Limits Unit Tx power 5 ±7 dB RMS Phase error 0 ±5 deg





7.6.2.1 Low TCH Parameter Value Unit TCH Low Ch Tx power level Low PL RF output power -68 dBm System GSM 1900

Measurement Test Limits Unit Tx power 0 ±7 dB RMS Phase error 0 ±-5 deg Rx Level 34-50 dB Rx Quality 0-3 units

7.6.2.2 Mid TCH



7.6.2.3 High TCH

Parameter Value Unit TCH High Ch Tx power level High PL RF output power -68 dBm System GSM 1900








7.6.3.2 Mid TCH



7.6.3.3 High TCH









7.6.4.2 Mid TCH



7.6.4.3 High TCH






7.6.5 UMTS 850 - Measurements & Test Limits

7.6.5.1 Low TCH Parameter Value Unit TCH Low Channel Power level Max dBm RF out -93 dBm

Measurement Test Limits Unit Tx max output power 19 to 27 dB EVM 17.5 max % Frequency error -0.1 to 0.1 deg Tx adjacent channel level ratio +/- 5MHz -36 dBc Tx adjacent channel level ratio +/- 10MHz -46 dBC

7.6.5.2 Mid TCH

Parameter Value Unit TCH Mid Channel Power level Max dBm RF out -93 (* -104) dBm

Measurement Test Limits Unit Tx max output power 19 to 27 dB EVM 17.5 max % Frequency error -0.1 to 0.1 deg Tx adjacent channel level ratio +/- 5MHz -36 dBc Tx adjacent channel level ratio +/- 10MHz -46 dBC Rx reference sensitivity level* (RF out: -104) -0.1 to 0.1 %

7.6.5.3 High TCH

Parameter Value Unit TCH High Channel Power level Max dBm RF out -93 dBm








7.6.6.2 Mid TCH



7.6.6.3 High TCH









7.6.7.2 Mid TCH



7.6.7.3 High TCH









7.6.8.2 Mid TCH



7.6.8.3 High TCH





Go/NoGo Testing

7.7 Test Sequence – Direct Line

INITIALIZING AND CALL SETUP

Parameter Value Unit BCCH Mid Ch TCH Mid Ch Tx power level High PL RF output power -40 dBm System GSM 850

SEQUENCE It is most important that a fully charged battery is used, otherwise there is a high risk for incorrect test results!

1. Initialize the instrument 2. Insert a test USIM (a standard test SIM may be used for GSM testing only) and attach a fully

charged standard battery or a dummy battery with external power to the phone 3. Attach the RF Fixture 4. Connect the RF cable to the phone and the test instrument 5. Turn on the phone and wait for registration 6. Set up a call to the instrument or let the instrument call the phone 7. Audio loopback

- set power level to high - activate audio loopback in the instrument - operator must acknowledge passed or failed before the test is continued

8. On-going test - refer to the measurement and test limits on the following pages and the product specific document Tests & Calibration

9. Test end - disconnect the call and end the test



Go/NoGo Testing: Test Sequence – Direct Line




7.7.1.2 Mid TCH


Measurement Test Limits Unit Tx power 19 ±3 dB RMS Phase error 0 ±5 deg Peak Phase error 0 ±20 deg Freq error ±.1 ppm Hz Rx Level 4-12 dB Rx Quality 0-3 units

7.7.1.3 High TCH







7.7.2.1 Low TCH Parameter Value Unit TCH Low Ch Tx power level Low PL RF output power -68 dBm System GSM 1900


7.7.2.2 Mid TCH



7.7.2.3 High TCH

Parameter Value Unit TCH High Ch Tx power level High PL RF output power -68 dBm System GSM 1900








7.7.3.2 Mid TCH



7.7.3.3 High TCH









7.7.4.2 Mid TCH



7.7.4.3 High TCH

Parameter Value Unit TCH High Ch TxX power level Low PL RF output power -68 dBm System GSM 900








7.7.5.2 Mid TCH



7.7.5.3 High TCH









7.7.6.2 Mid TCH



7.7.6.3 High TCH









7.7.7.2 Mid TCH



7.7.7.3 High TCH









7.7.8.2 Mid TCH



7.7.8.3 High TCH





8 Revision History

Rev. Date Changes / Comments 1 2008-Oct-02 First release

Documents

Generic Repair Manual