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Gas discharge plasma and their applications
MYEONG YEOL CHOI (Sam Choi)
Electrical Engineering Ph.D. student Advisor: Dr. George J. Collins, Supervisor: Dr. Il Gyo Koo
11/29/2010
Introduction to Sam
• Born in South Korea in 1981 • Bachelor’s degree(2007):
– Electrical Engineering at Ajou University in South Korea
• Republic Of Korea Marine Corps (2001-2003)
• Master’s degree(2009): – Chemistry at Ajou University in
South Korea
• Ph.D. student(2009-present): – Electrical Engineering at
Colorado State University
Contents
1. Plasma definition
2. Introduction to variety of plasma applications
3. Why variety?
4. How to generate plasma?
5. What kind of parameters do we have?
6. How to control the parameters to optimize plasmas?
7. Conventional plasma applications
8. Emerging field - Plasma health care
9. Sam’s preliminary work
10. conclusion
Plasma – the 4th state of matter
http://www.nasa.gov/mission_pages/themis/auroras/sun_earth_connect.html
Variety of plasma applications
Fluorescent light
http://www.walyou.com/blog/2009/08/25/plasma-lamp-design/
Ozone generator
http://compucentro.info/blog/tmp/ozone-generator.html Plasma display panel
http://tv-plasma-reviews.blogspot.com/2009_02_01_archive.html
Laser
http://medgadget.com/archives/2009/12/frikkin_lasers.html
Plasma arc welding
http://www.flickr.com/photos/rmstringer/2911413043/sizes/l/in/photostream/
http://www3.ntu.edu.sg/mae/research/programmes/thinfilms/tfresearch.asp
Microelectronics
Wide Range of Temperature
Thermal-equilibrium
Te=Tg
<Arc welding>
10,000oC-100,000oC
Non-thermal equilibrium
Te>>Tg
<Skin sterilization>
Tg ≈ 25-1000oC
Te ≈ 10,000-100,000oC
http://www.svarka-rezka.com.ua/eng/documents/about.html Blood Coagulation and Living Tissue Sterilization by Floating-Electrode Dielectric Barrier Discharge in Air
Complexity of plasma reaction
Baldur Eliasson, Senior Member, IEEE, and Ulrich Kogelschatz, IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 19, NO. 6, DECEMBER 1991
Electrical generation of plasmas
<Deposition of SiH4 on solar cell, flat panel, or micro electronics>
1. Capacitively coupled plasma
10-3m < d < 10m
2. RF voltage source
3. SiH4 + H2 gas
4. Total gas flow rate: 50sccm
5. 0.5torr pressure
<Conditions>
J. Jolly and J.-P. Booth, J. Appl. Phys. 97, 103305 (2005)
H atom density vs. voltage, frequency, and pressure
J. Jolly and J.-P. Booth, J. Appl. Phys. 97, 103305 (2005)
Electrical voltage, frequency and chamber pressure are important to plasma characteristic.
Chemicals
Adding chemicals can improve desired chemical reactions.
A. Hammad, E. Amanatides, D. Mataras*, D. Rapakoulias, Thin Solid Films 451 –452 (2004) 255–258
<Deposition of SiH4 on silicon substrate>
How to design plasma?
• Plasma electrode type
– Capacitively coupled plasma: voltage source
– Inductively coupled plasma: current source
• Frequency: DC to microwave(GHz)
• Working gas and pressure: paschen curve
Plasma types
“C” Capacitively Coupled Plasma
“L” Inductively Coupled Plasma
𝑬(𝑽/𝒎) = −𝛻𝑉 𝛻 × 𝑬(𝑽/𝒎) = −𝜕𝑩
𝜕𝑡
Claire Tendero a,*, Christelle Tixier a, Pascal Tristant a, Jean Desmaison a, Philippe Leprince b, Spectrochimica Acta Part B 61 (2006) 2 – 30
Frequency
Claire Tendero a,*, Christelle Tixier a, Pascal Tristant a, Jean Desmaison a, Philippe Leprince b, Spectrochimica Acta Part B 61 (2006) 2 – 30
Operating gas and its pressure
The amplitude of breakdown voltage depends on operating gas and its pressure.
𝑉𝑏𝑟𝑒𝑎𝑘𝑑𝑜𝑤𝑛= F 𝑔𝑎𝑠, 𝑝𝑟𝑒𝑠𝑠𝑢𝑟𝑒
http://en.wikipedia.org/wiki/Paschen_curve
< Paschen curve >
Control of discharge parameters to optimize plasmas
• Voltage & current
– Impedance matching
• Addition of chemicals
• Operating gas and pressure
– vacuum plasma system for low pressure plasma
Control of voltage & current
Impedance matching for maximum power delivery
Γ =𝑅𝑎 − 𝑅𝑏𝑅𝑎 + 𝑅𝑏
<Example of RF capacitively coupled plasma system>
50Ω or 75Ω Industry standard
Addition of Chemicals
V. L. Bukhovets and I. G. Varshavskaya, Protection of Metals and Physical Chemistry of Surfaces, 2009, Vol. 45, No. 6, pp. 645–651.
Target electrode
Gas inlet
Substrate
<Diamond Like Carbon deposition> 1. Gas phase precursor
• organic gas : CH4, C5H12, C3H6O • H2, Ar
2. Liquid phase precursor • gas and vapor mixture: CH3OH,
C2H5OH, CH3COOCH3, etc 3. Solid phase precursor
• Target material: graphite • Target electrodes works as a
carbon source for diamond like carbon deposition.
Control of gas & pressure
http://www.azom.com/details.asp?ArticleID=912
<Typical vacuum plasma system>
Low pressure plasma 1. Vacuum chamber 2. Vacuum pump 3. High quality sealing
Atmospheric pressure plasma 1. No need to use expensive
vacuum equipment 1. Reduce cost 2. more samples available
(ex. biological samples) 2. Easy to build
Application of plasma
1. Light source – Fluorescent light, plasma display panel
2. Surface modification – Thin film processing: etching, sputtering
3. Chemical reaction – Generation of radicals: ozone water purification in Europe
4. Plasma health care – emerging field – Bloodless surgery: tissue cutting, coagulation
– Sterilization on surgical tools and hands
– Tissue texturing: joint
Light
<Fluorescent Light> <Plasma Display Panel>
Molecular excitation in the plasma -> UV emission -> absorption in phosphor -> emission of visible light
Annemie Bogaertsa,*, Erik Neytsa, Renaat Gijbelsa, Joost van der Mullenb, Spectrochimica Acta Part B 57 (2002) 609–658
http://escience.anu.edu.au/lecture/cg/Display/printCG.en.html
Surface modification
Jong Hoon Kim, Juhee Sohn, Jin Hoon Cho, Myeong Yeol Choi, Il Gyo Koo, Woong Moo Lee*, Plasma Process. Polym. 2008, 5, 377–385
(a) Schematics of the experimental setup and the electrodes configuration
(b) AFM images of the surface of the Nafion membrane: Plasma treated a) For 0 min, b) For 1 min, c) For 3 min, d) For 5 min, with a 400W rf powered He/H2 plasma.
(a)
(b) <Nafion surface treatment in cc rf discharge>
0
2
4
6
C-F C-C S-O C-O C-SCh
emic
al b
on
d e
ner
gy
(eV
)
Chemical reactions
• Ozone water purification in Europe
M. Kogoma, S. Okazaki, Raising of ozone formation efficiency in a homogeneous glow discharge plasma at atmospheric pressure, J. Phys. D: Appl. Phys. 27 (1994) 1985–1987.
(a) Ozonizer electrode
U. Kogelschatz, B. Eliasson, W. Egli, From ozone generators to flat television screens: history and future potential of dielectric-barrier discharges, Pure Appl.
Chem. 71 (1999) 1819–1828
(b) Large ozone generator producing 60 kg ozone/h (by courtesy of Ozonia Ltd).
in out
Emerging application of plasma - Plasma Health Care
• Plasma application to biomedical
1. Spatially selective: thermal spread control of electro-surgery
2. Low temperature: sterilization at low temperature
3. Reactive species: chemical coagulation for bloodless surgery
Spatially selective plasma
http://www.valleylab.com/education/poes/index.html
<Valleylab Electro-surgical system>
10-6m2 entry area 0.5m2 exit area
Vs.
Low temperature plasma
Fig. 1. SEM images of the Bacillus subtilis spores (a) before plasma treatment and (b) after plasma treatment for 5 min with a ruptured spore pointed.
Fig. 2. Fluorescence images of the propidium iodide stained Bacillus subtilis spores (a) before plasma treatment and (b) after plasma treatment for 5 min.
(Color version available online at http://ieeexplore.ieee.org.)
Xutao Deng, Jianjun Shi, and Michael G. Kong, IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 34, NO. 4, AUGUST 2006
Inactivation of Bacillus subtilis Spores Using Cold Atmospheric Plasmas
Reactive species plasma
Gregory Fridman, Marie Peddinghaus, HalimAyan, Plasma Chem Plasma Process (2006) 26:425–442
- Temperature of the cut remains at room temperature. - Wound remains wet.
<Chemical coagulation for bloodless surgery>
Equipment and analytical tools for Sam’s plasma research
Plasma generation
• Electrical – Signal generator
– Amplifier
• Gas – Mass flow meters:
gas flow rate
Measurement
• Electrical – Z-scan
– Oscilloscope
• Optical – Spectrometer
– ICCD camera
• Sample – High speed camera
– FT-IR
– Microscope
Sam’s preliminary work
• Plasma for tissue cutting
– Contact vs. non-contact mode plasma
– Plasma type: atmospheric pressure plasma jet
– Frequency: 13.56MHz
– Sample: chicken breast (muscle)
Experimental Setup
Motorized stage
Amplifier Matching Box
Function Generator MFC
Motion Controller
BNC Connector
Sample
He or
Ar
Plasma device
Contact vs. non-contact Plasma for tissue cutting
Contact mode plasma Non-contact mode plasma
Result
Contact mode cut Non-contact mode cut
13.56MHz, 50W, Ar 500sccm 13.56MHz, 50W, He 1000sccm
Conclusion
• Conventional plasma application
– Light
– Surface modification
– Chemical reaction
• Emerging plasma application
– Bloodless plasma surgery
– Sterilization
– Coagulation
• Sam’s future work
– Plasma application to tissue cutting
– Electrical and Chemical effect on tissue samples
– Plasma selectivity on different tissue
References
1. Annemie Bogaerts, Erik Neyts, Renaat Gijbels, Joost van der Mullen, Spectrochimica Acta Part B 57 (2002) 609–658
2. G E Morfill1, M G Kong2 and J L Zimmermann1, New Journal of Physics 11 (2009) 115011
3. Jaime Castro B.,1 Marlon H. Guerra-Mutis,1,3 and Hector Jaime Dulce M.2, Plasma Chemistry and Plasma Processing, Vol. 23, No. 2, June 2003
4. Joerg Liebmann a,*, Joachim Scherer b, Nikita Bibinov d, Priyadarshini Rajasekaran d, Reinhold Kovacs b, Roland Gesche c, Peter Awakowicz d, Victoria Kolb-Bachofen a , asdfasdf, Nitric Oxide xxx (2010) xxx–xxx
5. Gregory Fridman, Marie Peddinghaus, HalimAyan, Alexander Fridman, Manjula Balasubramanian, Alexander Gutsol, Ari Brooks, Gary Friedman, Plasma Chem Plasma Process (2006) 26:425–442
6. Junhong Chen1 and Jane H. Davidson1,2, Plasma Chemistry and Plasma Processing, Vol. 22, No. 2, June 2002
7. Brian E. Thompson, Kenneth D. Allen, Albert D. Richards, and Herbert H. Sawin, J. Appl. Phys. 59 (6),15 March 1986
8. Ulrich Kogelschatz1, Plasma Chemistry and Plasma Processing, Vol. 23, No. 1, March 2003
9. A. Sureshkumara, R.Sankarb, MahitoshMandalb, SudarsanNeogia,∗ , International Journal of Pharmaceutics, 396 (2010) 17–22
10. Claire Tendero a,*, Christelle Tixier a, Pascal Tristant a, Jean Desmaison a, Philippe Leprince b, Spectrochimica Acta Part B, 61 (2006) 2 – 30
11. Magali Boutonnet Kizling *, Sven G. Jaras, Applied Catalysis A: General, 147 (1996) 1-21
12. L. Bárdos, H. Baránková *, Thin Solid Films, 518 (2010) 6705–6713
13. Z Hubicka1,4, M Cada1, M Sicha1,2, A Churpita1,3, P Pokorny1, L Soukup1 and L Jastrabik1, Plasma Sources Sci. Technol. 11 (2002) 195–202
14. MYRON H. MILLER, Specmchimica Acta, vol. 39B, No. 1, 13-56, 1984
15. E. Stoffels, R. E. J. Sladek and I. E. Kieft, Physica Scripta. Vol. T107, 79–82, 2004
16. Vassili Karanassios, Spectrochimica Acta Part B, 59 (2004) 909– 928
17. M. P. BACHYNSKI, “Plasma Physics-An Elementary Review*”, PROCEEDINGS OF THE IRE
18. Ladislav Bardos a,b,*, Hana Barankova a,b, Vacuum 83 (2009) 522–527
19. E. E. Kunhardt, Member, IEEE, IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 28, NO. 1, FEBRUARY 2000
20. Liqing Yang a, Jierong Chen a,b,*, Junling Gao b, Yafei Guo b , Applied Surface Science 255 (2009) 8960–8964
21. Hajime Shiki a, Yukikazu Ito a, Hirofumi Takikawa a,*, Eiji Usuki b, Takashi Okawa c, Shigenobu Yamanaka c, Yoshimi Nishimura d, Shigeji Hishida d, Vacuum 83 (2009) 29–33
22. M.Y.A. Mollah, R. Schennach, J. Patscheider, S. Promreuk, D.L. Cocke, Journal of Hazardous Materials B79 (2000) 301–320
References
23. M G Kong1, G Kroesen2, G Morfill3,5, T Nosenko3,4, T Shimizu3, J van Dijk2 and J L Zimmermann3,4, New Journal of Physics 11 (2009) 115012
24. E Stoffels1, I E Kieft1, R E J Sladek1, L J M van den Bedem2, E P van der Laan2, M Steinbuch2, Plasma Sources Sci. Technol. 15 (2006) S169–S1802
25. Gregory D. Emsellem, The 29th International Electric Propulsion Conference, Princeton University, October 31 – November 4, 2005
26. N St J Braithwaite, Plasma Sources Sci. Technol. 9 (2000) 517–527.
27. M. Moreau, N. Orange, M.G.J. Feuilloley, Biotechnology Advances 26 (2008) 610–617
28. J. Ehlbecka, A. Ohl, M. Maaß, U. Krohmann, T. Neumann, Surface and Coatings Technology 174 –175 (2003) 493–497
29. Ulrich Kogelschatz, Baldur Eliasson and Walter Egli, Pure Appl. Chem., Vol. 71, No. 10, pp. 1819-1828, 1999.
30. J Hopwood, Plasma Sources Sci. Technol. 1 (1992) 109-116.
31. N St J Braithwaite, Plasma Sources Sci. Technol. 9 (2000) 517–527.
32. Robert J. Carman, Daniel J. W. Brown, and James A. Piper, IEEE JOURNAL OF QUANTUM ELECTRONICS, VOL. 30, NO. 8, AUGUST 1994
33. Baldur Eliasson, Senior Member, IEEE, and Ulrich Kogelschatz, IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 19, NO. 6, DECEMBER 1991
34. S. Purushotham and R. V. Ramanujan, JOURNAL OF APPLIED PHYSICS 107, 114701 (2010)
35. H. Nowakowska, V. Stranak, Z. Hubicka, M.Tichy, R. Hipper, 20th ESCAMPIG, 13-17 July 2010, Novi Sad, Serbia
36. Zh Kiss’ovski, M Kolev, A Ivanov, St Lishev and I Koleva, J. Phys. D: Appl. Phys. 42 (2009) 182004 (6pp)
37. J Y Jeong, S E Babayan, V J Tu, J Park, I Henins, R F Hicks and G S Selwyn, Plasma Sources Sci. Technol. 7 (1998) 282–285.
38. THOMAS J. MANNING* AND WILLIAM R. GROW, Inductively Coupled Plasma - Atomic Emission Spectrometry
39. R. A. Rudder, G. C. Hudson, J. B. Posthill, R. E. Thomas, R. C. Hendry, D. P. Malta, and R. J. Markunas, Appl. Phys. Lett. 60 (3), 20 January 1992.
40. J. Esteve, M.C. Polo, G. Sanchez, Vacuum 52 (1999) 133-139.
41. V. L. Bukhovets and I. G. Varshavskaya, Protection of Metals and Physical Chemistry of Surfaces, 2009, Vol. 45, No. 6, pp. 645-651.
42. M. Asmann, D. Kolman, J. Heberlein, E. Pfender, Diamond and Related Materials 9 (2000) 13–21.
43. K. Bewilogua, C.V. Cooper, C. Specht, J. Schroder, R. Wittorf , M. Grischke, Surface and Coatings Technology 127 2000. 224-232.
44. R.W. Pryor, K.R. Padmanabhan, K. Chawla, Diamond and Related Materials 4 ( 1995) 128-132.
45. Marcus Asmann, Joachim Heberlein, and Emil Pfender1, Plasma Chemistry and Plasma Processing, Vol. 20, No. 2, 2000
46. SEIICHIRO MATSUMOTO, JOURNAL OF MATERIALS SCIENCE LETTERS 4 ( 1 9 8 5 ) 600-602.
47. Yoichi HIROSE and Yuki TERASAWA, JAPANESE JOURNAL OF APPLIED PHYSICS, VOL. 25, No. 6, JUNE, 1986, pp. L519-L521
References
48. Sanjiv Kapoor, Michael A. Kelly, and Stig B. Hagstrom, J. appl. Phys. 77 (12), 15 June 1995
49. E.A.G. Hamers, W.G.J.H.M. van Sark, J. Bezemer, H. Meiling, W.F. van der Weg, Journal of Non-Crystalline Solids 226 (1998) 205-216.
50. M Moravej, S E Babayan, G R Nowling, X Yang and R F Hicks, Plasma Sources Sci. Technol. 13 (2004) 8–14.
51. A. Hammad, E. Amanatides, D. Mataras*, D. Rapakoulias, Thin Solid Films 451 –452 (2004) 255–258
52. Anatoly L. Vikharev, Oleg A. Ivanov, and Alexander G. Litvak, IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 24, NO. 2, APRIL 1996
53. Kazuo Sugiyama, Kazutoshi Kiyokawa, Hiroyuki Matsuoka, Akihiko Itou, Kazunori Hasegawa, Kazuyoshi Tsutsumi, Thin Solid Films 316 1998. 117-122.
54. R. Foest, M. Schmidt, K. Becker, International Journal of Mass Spectrometry 248 (2006) 87–102.
55. U. Konelschatz, B. Eliasson and W. Egli, J. PHYS IV FRANCE 7 (1997)
56. T Yokoyama, M Kogoma, T Moriwaki and S Okazak, J. Phys. D: Appl. Phys. 23 (1990) 1125-1 128.
57. Han S. Uhm, Journal of the Korean Physical Society, Vol. 42, February 2003, pp. S775-S781.
58. Baldur Eliasson, Senior Member, IEEE, and Ulrich Kogelschatz, IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 19, NO. 6, DECEMBER 1991
59. K H Becker, K H Schoenbach and J G Eden, J. Phys. D: Appl. Phys. 39 (2006) R55–R70.
60. C.H. Yi, Y.H. Lee, G.Y. Yeom, Surface and Coatings Technology 171 (2003) 237–240.
61. Oleg Baranov, Maxim Romanov, Matthias Wolter, Shailesh Kumar, Xiaoxia Zhong, and Kostya (Ken) Ostrikov, PHYSICS OF PLASMAS 17, 053509 (2010)
62. B. Window and G. L. Harding, J. Vac. Sci. Technol. A 8 (3), May/Jun 1990
63. T. Novikova, B. Kalache, and P. Bulkin, JOURNAL OF APPLIED PHYSICS VOLUME 93, NUMBER 6
64. Mark A. Sobolewski, Jung-Hyung Kim, JOURNAL OF APPLIED PHYSICS 102, 113302 (2007)
65. Kallol Bera, Shahid Rauf, Kartik Ramaswamy, and Ken Collins, JOURNAL OF APPLIED PHYSICS 106, 033301 (2009)
66. L. Wilken, V. Hoffmann, and K. Wetzig, JOURNAL OF APPLIED PHYSICS 99, 063305 (2006)
67. J. J. Shi and X. T. Deng, JOURNAL OF APPLIED PHYSICS VOLUME 94, NUMBER 10 15 NOVEMBER 2003
68. F J Gordillo-Vazquez, C Gomez-Aleixandre and J M Albella, Plasma Sources Sci. Technol. 10 (2001) 99–116.
69. J. Jollya! and J.-P. Booth, JOURNAL OF APPLIED PHYSICS 97, 103305 (2005)
70. H. Curtins, N. Wyrsch, M. Favre, and A. V. Shah, Plasma Chemistry and Plasma Processing, VoL 7, No. 3, 1987
71. JULIE A. HORNER, PENGYUAN YANG, and GARY M. HIEFTJE, Applied Spectroscopy, Volume 54, Number 12, (2000)
72. L. Marques, J. Jolly, L. L. Alves, JOURNAL OF APPLIED PHYSICS 102, 063305 (2007)
References
73. Michael Hertl and Jacques Jolly, J. Phys. D: Appl. Phys. 33 (2000) 381–388.
74. Zhigang Chen, Shahid Rauf, and Ken Collins, JOURNAL OF APPLIED PHYSICS 108, 073301 (2010)
75. Jong Hoon Kim, Juhee Sohn, Jin Hoon Cho, Myeong Yeol Choi, Il Gyo Koo, Woong Moo Lee, Plasma Process. Polym. 2008, 5, 377–385
76. Fukusaburou Itou, Akio Kitaya, Norikazu Okamoto, “Plasma Addressed Liquid Crystal Display”
77. Ulrich Kogelschatz, Baldur Eliasson and Walter Egli, Pure Appl. Chem., Vol. 71, No. 10, pp. 1819-1828, 1999.
78. Masuhiro Kogoma and Satiko Okazaki, J Phys. D Appl. Phys. 27 (1994) 1985-1987.
79. EDWARD W.HAGLEY, LU DENG,WILLIAM D. PHILLIPS, KEITH BURNETT, and CHARLES W.CLARK, “The atom laser”
80. X. T. Deng and J. J. Shi, APPLIED PHYSICS LETTERS 87, 153901 (2005)
81. Xutao Deng, Jianjun Shi, and Michael G. Kong, IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 34, NO. 4, AUGUST 2006