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©2018 by System Plus Consulting | GaN Systems GS61004B 1
22 bd Benoni Goullin44200 NANTES - FRANCE
+33 2 40 18 09 16 [email protected] www.systemplus.fr
GaN Systems GS61004B100V 45A GaN TransistorPower Semiconductor report by Elena Barbarini May 2018 – sample
REVERSE COSTING®– STRUCTURAL, PROCESS & COST REPORT
©2018 by System Plus Consulting | GaN Systems GS61004B 2
SUMMARY
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 13
o GaN Systems
o Products
Physical Analysis 18
o Summary of the Physical Analysis
o Package analysis
Package opening
Package Cross-Section
o HEMT Die
HEMT Die View & Dimensions
HEMT Die Process
HEMT Die Cross-Section
HEMT Die Process Characteristic
Transistor Manufacturing Process 57
o HEMT Die Front-End Process
o HEMT Die Fabrication Unit
o Final Test & Packaging Fabrication unit
Cost Analysis 70
o Summary of the cost analysis
o Yields Explanation & Hypotheses
o HEMT die
HEMT Front-End Cost
HEMT Die Probe Test, Thinning & Dicing
HEMT Wafer Cost
HEMT Die Cost
o Complete device
Packaging Cost
Final Test Cost
Price Analysis 85
o Estimation of selling price
Comparison 88
o Comparison of GaN systems devices
o Comparison between GaN systems and EPC
o Comparison between 100V GaN on Si and Si MOSFET
Feedback 92
Company services 94
©2018 by System Plus Consulting | GaN Systems GS61004B 3
Overview / Introductiono Executive Summaryo Marketo Reverse Costing
Methodology
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Executive Summary
GaN Systems is trying to compete with EPC, the market leader, on low voltages HEMT market. System Plus Consulting unveils GS61004Bfrom GaN Systems, the latest device driving 100V optimized for AC-DC converters and high frequency, high efficiency power conversion.
The GS61004B from GaN Systems is a GaN on Silicon HEMT transistor packaged in the GaNpx Embedded Die package. It features a high-voltage breakdown voltage of 100V for a current of 45A (25°C), with lower switching losses.
The GS61004B is packaged is an innovative embedded die package developed by AT&S (ECP® process). This package has no wire bondingto reduce the inductance and a design to increase the heat management.
The new position of the die in the package allows to enhance the thermal dissipation and a simplification of the process reduces the timeand the cost of manufacturing.
Based on a complete teardown analysis, the report also provides an estimation of the production cost of the epitaxy and the package.
Finally, the report shows a comparison between the standard 100V Si MOSFETs and the low voltages GaN on Si HEMT.
©2018 by System Plus Consulting | GaN Systems GS61004B 4
Overview / Introductiono Executive Summaryo Marketo Reverse Costing
Methodology
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Main Players Roadmap
2010 2016 20172011 2012 2013 2014 2015
First GaN Power device
First commercial product Start production
80V power stage
600V power stage
First commercial product
GaN IC
GaN IC
First commercial product
First commercial product
+
+
+First commercial
product
©2018 by System Plus Consulting | GaN Systems GS61004B 5
Overview / Introductiono Executive Summaryo Marketo Reverse Costing
Methodology
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Availables GaN devices
0
10
20
30
40
50
60
70
80
90
100
0 200 400 600 800 1000 1200 1400
Cu
rre
nt (
A)
Voltage (V)
Identified GaN Power Devices Transphorm
GaN System
EPC
TI
Panasonic
Sanken
VisIC
Dialog
Sampling/Development
Values based on Datasheet
©2018 by System Plus Consulting | GaN Systems GS61004B 6
Overview / Introduction
Company Profile & Supply Chain o GaN Systems Profileo GaN Systems Products
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
GS61004B Datasheet
©2018 by System Plus Consulting | GaN Systems GS61004B 7
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Summaryo Packageo GaN HEMT
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
o Package size : xxmm x xxmm xxxmm
o The package markings include the following markings :
GaN Systems logo
61004B
(e4) 78K8
Package characteristics
Package Front view
Package Back viewPackage Side view
Reference of component
Lot date codePb free
Pre plated Au
©2018 by System Plus Consulting | GaN Systems GS61004B 8
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Summaryo Packageo GaN HEMT
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Package Views front side
Package frontside
Package frontside – Cu removal Package frontside – without solder ball
Package frontside– plastic removal
©2018 by System Plus Consulting | GaN Systems GS61004B 9
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Summaryo Packageo GaN HEMT
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
• The RDL connects to the top metals by a series of microvia.
Package cross section
Package cross-section – Optical view
©2018 by System Plus Consulting | GaN Systems GS61004B 10
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Summaryo Packageo GaN HEMT
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Redistribution Cross-section
Redistribution on the power transistor – SEM cross-section view
©2018 by System Plus Consulting | GaN Systems GS61004B 11
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Summaryo Packageo GaN HEMT
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
xx
mm
HEMT die Dimensions
HEMT Die – Optical view
o Die dimensions: xx mm² (xxmm x xxxmm)
o There is no marking on the die
xxx mm
©2018 by System Plus Consulting | GaN Systems GS61004B 12
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Summaryo Packageo GaN HEMT
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Die plan view
HEMT Die – Optical & SEM view
©2018 by System Plus Consulting | GaN Systems GS61004B 13
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Summaryo Packageo GaN HEMT
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Die cross section
Die cross section – SEM View
o Substrate thickness: xxxx µm
©2018 by System Plus Consulting | GaN Systems GS61004B 14
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Summaryo Packageo GaN HEMT
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Die cross section
Die cross section – SEM View
o Transistor pitch: xxxxx µm
©2018 by System Plus Consulting | GaN Systems GS61004B 15
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Summaryo Packageo GaN HEMT
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Die cross section -Gate
Die cross section – SEM View
©2018 by System Plus Consulting | GaN Systems GS61004B 16
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Summaryo Packageo GaN HEMT
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Die cross section - Epitaxy
Die cross section – TEM View
©2018 by System Plus Consulting | GaN Systems GS61004B 17
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flowo HEMT Fab Unito HEMT Process Flowo Packaging Fab Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Description of the Wafer Fabrication Units - HEMT
In our calculation, we simulate a production unit using xxxmm wafers.
Estimated HEMT wafer fab unit:
Name: TSMC, Taiwan
Wafer diameter: xxxmm (6-inch)
Capacity: xxx wafers / month
Year of start: xxx
Most advanced process: xxxµm
Products: Silicon power die, GaN and SiC
Location: Hsinchu, Taiwan
©2018 by System Plus Consulting | GaN Systems GS61004B 18
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flowo HEMT Fab Unito HEMT Process Flowo Packaging Fab Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
GaN Transistor - Process Flow (4/4)
Metal 3
• IMD 2 •Metal 3
Passivation•Passivation
Drawing not to Scale
©2018 by System Plus Consulting | GaN Systems GS61004B 19
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flowo HEMT Fab Unito HEMT Process Flowo Packaging Fab Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Semi-additive PCB Process
•AOI inspection•Solder mask (LPI
deposition, exposure & developing)
Semi-additive PCB Process
•Board routing
Semi-additive PCB Process
•Electrical test
Semi-additive PCB Process
•Nickel Finishing•AOI inspection
GaNpx Packaging Process Flow (4/4)
©2018 by System Plus Consulting | GaN Systems GS61004B 20
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing ProcessFlow
Cost Analysiso Summaryo Die Costo Packaging Costo Component Cost
Selling Price Analysis
Comparison
About System Plus
Wafer Front-End Cost
The front-end cost ranges from $xxx to $xxx according toyield variations.
The main part of the wafer cost is due to the xxx withxxx%.
©2018 by System Plus Consulting | GaN Systems GS61004B 21
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing ProcessFlow
Cost Analysiso Summaryo Die Costo Packaging Costo Component Cost
Selling Price Analysis
Comparison
About System Plus
Redistribution Cost
Packaging
The component has redistribution that is probably manufactured by AT&S.
The cost is estimated between $xxx and $xxxxx per wafer.
©2018 by System Plus Consulting | GaN Systems GS61004B 22
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing ProcessFlow
Cost Analysiso Summaryo Die Costo Packaging Costo Component Cost
Selling Price Analysis
Comparison
About System Plus
HEMT Die Cost
The HEMT Component cost ranges from $xxx to $xxxaccording to yield variations.
The Front-end manufacturing represents xxx% of thecomponent cost (medium yield estimation).
Probe test, dicing and scrap account for xxx% of thecomponent cost.
©2018 by System Plus Consulting | GaN Systems GS61004B 23
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing ProcessFlow
Cost Analysiso Summaryo Die Costo Packaging Costo Component Cost
Selling Price Analysis
Comparison
About System Plus
Component Cost
The component cost ranges from $xxx to $xxx accordingto yield variations.
The HEMT die represents xxx% of the component cost.
Package, Final test and yield losses account for xxx% ofthe component cost.
©2018 by System Plus Consulting | GaN Systems GS61004B 24
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Plus
Estimated Manufacturer Price
The component selling price ranges from $xxxto $xxx according to yield variations.
©2018 by System Plus Consulting | GaN Systems GS61004B 25
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparisono GaN Systems comparisono EPC vs GaN Systems o 100V GaN vs Si
About System Plus
Comparison between GaN Systems and EPC 100V GaN HEMT
GS61004B EPC2045
©2018 by System Plus Consulting | GaN Systems GS61004B 26
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Power Semiconductors & Compound• Efficient Power Conversion EPC2040• GaN Systems GaNpx Top Cooled – AT&S ECP® Embedded
Power Die Package• Transphorm TPH3002PS 600V GaN on Silicon HEMT• Transphorm GaN-on-Silicon HEMT TPH3206PS• GaN Systems GS66508P GaN on Si transistor• EPC – 2010 GaN 200V power transistor• Infineon – IPB60R280C6 600V CoolMOS C6 MOSFET• Toshiba – TK31E60W 4thgen DTMOS 600V Super-
Junction MOSFET• GaN on Si HEMT vs SJ MOSFET : Technology and Cost
Comparison
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
Advanced Packaging• Power Module Packaging: Material Market and Technology Trends 2017
Compound Semi.• Power GaN 2017: Epitaxy, Devices, Applications, and Technology
Trends
PATENT ANALYSIS - KNOWMADE
Compound Semi. • III-N Patent Watch
©2018 by System Plus Consulting | GaN Systems GS61004B 27
COMPANYSERVICES
©2018 by System Plus Consulting | GaN Systems GS61004B 28
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>40 reports per year)
Costing Tools
Trainings
©2018 by System Plus Consulting | GaN Systems GS61004B 29
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal
Contact
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