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Future Requirements of Innovative APC Approaches Holger Lebrecht (Project Leader)

Infineon Technologies Austria AG

10/10/2012 Page 2

Table of contents

Path to Innovations

Innovative APC Approaches

Requirements of Innovations

Advantages of Innovative Approaches

Copyright © Infineon Technologies 2012. All rights reserved.

10/10/2012 Page 3

Table of contents

Path to Innovations





10/10/2012 Page 4 Copyright © Infineon Technologies 2012. All rights reserved.

Infineon’s Business Today

Hence, what are the main challenges within Power-Logic (PL) semiconductor manufacturing from an Advanced Process Control (APC) view?

Marketing Analysis (Focus on Manufacturing)

Customers Competitors Context Company Collaborators

…

Chip Card & Security ICs providers

(Contract) Partners

Suppliers

Academic Institutions

Solutions for Mobility

Solutions for Security

Solutions for Energy

Efficiency

High quality products and

services

Leading edge technology and

IP portfolio

Reliable and innovative solutions

> 30 years manufacturing

experience

Automotive ICs providers

Industrial Power Control ICs providers

Power Management &

Multimarket ICs providers

… Varying

boundary conditions

Pork-cycle affected business

Increased manufacturing

complexity

Inter-cultural aspects

…


PL Manufacturing Challenges

Government subsidies and harmful laws (IP) in APAC

Mature semiconductor Fabs

Different wafer-sizes (150 mm – 300 mm)

Mature equipment and standards

Different automation levels

Changing Fab loading proportions

Development and high volume loading

Continues demand to production efficiency increase

Cost down Roadmaps

Establishing of a Zero Defect culture

International standards and customer policies

Transformation speed of the business


How to Cope with That?

It is all about ”Thinking Out of the Box” and coming up with innovative APC

solutions for…

Predictive

Maintenance (PdM)

Virtual Metrology

(VM)

Run-to-Run Control (R2R)

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Path to Innovations






Innovative APC Solutions

Predictive Maintenance (PdM)

Prediction of equipment health condition

Monitoring of equipment behavior (multivariate)

Equipment fault recognition and corrective actions

Feeds to Virtual Metrology and Run-to-Run Control

Benefits of PdM

Improvement of equipment utilization (uptime)

Reduction of wafer scrap (no unscheduled down)

Effort reduction for Mean Time To Repair (MTTR) and equipment release after maintenance

Prevention of Waddington effect (avoidance of recurrences)

Optimized spare-parts supply (based on PdM statistics)


Application Example of PdM

Escalating pressure problem of an Etching workcenter impacts defect density and could lead to wafer scrap

(00:00) Beginning of 09/12/2012

(18:14) Pressure problem is detected by multivariate PdM system

(20:00) Pressure problem is detected by univariate FDC system

Multivariate equipment health monitoring index

16 wafer affected



Virtual Metrology (VM)

Prediction of inline-measurements

Prediction of electrical device parameters

Adjustment of inline measurements sampling rate

Feeds to Run-to-Run Control and Predictive Maintenance

Benefits of VM

Reduction of inline measurements based on adaptive control plans

Estimation of actuation variables changes on electrical device parameter changes

Control effort reduction for predicted measurements

Extendable base-system for knowledge generating self-learning networks


Application Examples of VM

Wafer

Etc

hin

g R

ate

[nm

/s]

Wafer

measured values

predicted values

measured values

predicted values

3.5

2.6

Gat

e-S

ou

rce

Vo

ltag

e [V

]

Prediction of Gate-Source Voltage of MOSFET transistor based on consideration of

Correlated electrical device parameter unit process results, recipe settings, equipment conditions, and context information

Calculated etching rate based on predicted film thickness removal by consideration of

Pre-etching thickness target error, open etching area, equipment sub-unit, logistics, recipe settings and equipment condition



Next level Run-to-Run Control (R2R) Closed-loop controls using non-inline measurements

Feed-forward Control of electrical device parameters

Adaptive inter unit-process control loops

Feeds from Virtual Metrology and Predictive Maintenance

Benefits of R2R Improvement of Cp/Cpk, yield, and new technology enabler

Prevention of non productive runs (SAHD wafer)

Advanced automation (no human interactions)

Adaptive equipment condition monitoring (reduced ANKOs)

Enhanced production control business process

Reduced control sustaining effort


Application Examples of R2R

~70 % SAHD

reduction ~50 % rework

reduction

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Path to Innovations





Modell based prediction and adaptive decision and control systems Framework



Production flow

Process FEOL 1

Process BEOL+9

Process FEOL n

Metrology PCM

Process FEOL+1

Metrology FEOL n

External systems

Self-Learning Health-Based Production Decision and Control Framework

FEOL…Frontend of Line BEOL…Backend of Line

VM FEOL n

PdM FEOL n

PdM FEOL+1

PdM BEOL+9

VM PCM

R2R BEOL+9

R2R FEOL n

External systems


Framework Requirements

Ensure a fast, flexible, and reliable development, applications enhancement, and rollout environment

Provide customized interfaces to entire fab automation networks

Develop appropriate business processes for room for innovations and changing boundary conditions

Provide simple application modules and smart core components which includes complex features

Lead cultural changes from specification-to-delivery to iterative-self-implementation approaches

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Path to Innovations


Investigation results




Benefits

Static control scheme is transformed into a dynamical

control scheme with focus on Zero-Defect and

Operational Excellence

Robust quality sustaining due to control of each wafer

Cycle time improvements in production and ramp-ups

Faster yield learning based on intimate knowledge of

single wafer fates

Prediction of single wafer fates early in production chain

Acceleration of technology development processes

Improved production efficiency (150 mm – 300 mm)

Reduced project efforts and earlier break-even points


Contact Information

Dipl.-Ing. (FH) Holger Lebrecht

Infineon Technologies Austria AG

Advanced Process Control

Villach, Regensburg, Kulim, Dresden

IFAT OP FE T UPD 6

Tel: +43 5 1777 3722

Mobile: +43 676 8205 3722

Efax: +49 941 202 924183

mailto:[email protected]

mailto:[email protected]

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Future Requirements of Innovative APC Approachessemieurope.omnibooksonline.com/2012/semicon_europa/SEMICON... · Future Requirements of Innovative APC Approaches ... (multivariate)