IEEE 64th ECTC – Orlando, FL, USA May 27–30, 2014

Future packaging and required interposer technologies for

cognitive computing devices

Yasumitsu Orii,Senior Manager of Science & Technology, IBM Research Tokyo

2014 CPMT SeminarLatest Advances in Organic Interposers

2IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 2May 27 – 30, 2014

• Computer System for the Era of Big Data

• What is “Cognitive Computer” ?

• Requirement for Cognitive Computing Devices

– Interposer Technologies

– Packaging Technologies

Agenda / Outline / Overview

3IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 3May 27 – 30, 2014

• Computer System for the Era of Big Data

• What is “Cognitive Computer” ?

• Requirement for Cognitive Computing Devices

– Interposer Technologies

– Packaging Technologies

Agenda / Outline / Overview

4IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 4May 27 – 30, 2014

Info-Plosion

The oceans of data to be produced in the worldThe size of data generated per Day in 2010 is “1ZB”, which is equal to 3.7 trillion years News Paper Data.

5IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 5May 27 – 30, 2014

3 40zettabytes zettabytes

2012 2020

Source: IDC Digital Universe

Data volume is increasing !

6IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 6May 27 – 30, 2014

Internet of Things

7IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 7May 27 – 30, 2014

11 42% %

2005 2020

Ratio of the data generated by sensors

Source: IDC Digital Universe

Big data to be accelerated by IoT

8IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 8May 27 – 30, 2014

Capacity of communication Infrastructure exceeds its limit in 2020

Glo

bal D

ata

Volu

me

in E

xaby

tes

Multiple sources: IDC,Cisco

100

90

80

70

60

50

40

30

20

10

Aggr

egat

e U

ncer

tain

ty %

9000

8000

7000

6000

5000

4000

3000

2000

1000

0

2005 2010 2015

Uncertain

Certain

Global Technology Outlook 2012

9IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 9May 27 – 30, 2014

• Computer System for the Era of Big Data

• What is “Cognitive Computer” ?

• Requirement for Cognitive Computing Devices

– Interposer Technologies

– Packaging Technologies

Agenda / Outline / Overview

10IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 10May 27 – 30, 2014

Cognitive Systems: A new era of computingC

ompu

ter I

ntel

ligen

ce

Time

TabulatingSystems Era

Programmable Systems Era

CognitiveSystems Era

3rd Generation

11IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 11May 27 – 30, 2014

IBM Watson Project

Ken Jennings, who won a record 74 consecutive "Jeopardy!" games in 2004-05 Brad Rutter, who is the biggest all-time money winner.

15TB Memory2,880 Processor core200KW

System to backup more rapid and accurate medical diagnosis.

System to check potential coactions between medicines.

System to refer past authority by lawyers and benches.

System for hypothesis scenario and legal compliance in finance sector.

It is expected to apply the technologies for Watson to many applications.

12IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 12May 27 – 30, 2014

Computers and the Brain are Different and Complementary

10 Hz, parallel, high fanout

20W

1.2 L

106 neurons/cm2

Integrates memory

3.55 GHz, sequential, linear

200kW

12,000 L

～5,000 connections/cm2

Separates memory

13IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 13May 27 – 30, 2014

IBM Creating New Cognitive Technologies

OFF

ON

Crossbar architecture

Power, space, memory, and communication scale with synapses

14IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 14May 27 – 30, 2014

Brain-inspired Chip

~1010 synapses/cm2 ~106 neurons/cm2

5x108 transistors/cm2

@500 transistors/neuron

~104 neurons/cortical column

Biological Brain

Electronic BrainMulti-Gbit/secDigital comms

Layered cortical circuits with ~106

neurons/cm2

~1010 intersections/cm2 @ 100 nm pitch

~5x103 long range axons @ 1 Hz

(Ref. http://archive.hpcwire.com/hpcwire/2011-08-18/ibm_reveals_cognitive_computing_chips.html)

15IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 15May 27 – 30, 2014

• Computer System for the Era of Big Data

• What is “Cognitive Computer” ?

• Requirement for Cognitive Computing Devices

– Interposer Technologies

– Packaging Technologies

Agenda / Outline / Overview

16IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 16May 27 – 30, 2014

Human’s brain

• Human’s brain: 1011 (100Billion) neurons1015 (1000Trillion) synapses

Wikipedia

1400cm3 (1.4L)

Eye: 1B neurons10T synapses

J. DiCarlo et al., Neuron, 2012

17IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 17May 27 – 30, 2014

Brain size of mammals

S. Herculano-Houzel 2009

Mouse’s brain:70M neurons700B synapses

Mouse’s vision (est.):0.7M neurons (~1M)7B synapses (~10B)

Human’s brain:100B neurons1,000T synapses

Human’s vision:1B neurons10T synapses

18IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii

Package Outline on Implementation

Chained synapse to neuron connection

• Package outline• 4 die stacked with 7mmSQ chips.• Area arrayed 125,000 signal I/Os and same counts of power and ground per chip in 14m

pitch.• 16 die stacks on interposer.• Chained synapse to synapse connection between die stacks.

Information input for neuron

interposer

16 die stacks

• Assumption : Mouse’s eye (synapse=10B, # of neurons=1M)Number of I/O estimation• Tota signal I/O of neurons: 1M x 2 • Total I/O with power & ground: 4M• Layers of RBM: 16 (= number of stacked chip)• Total I/O with power & ground of a stack (4dies)

: 1M x 2 x 2 / 16=250,000

Die size estimation• Total drivers of a stack (4 dies) :125,000• # of driver on a die: 125,000 / 4=31,250• Area of driver (45nm): 25 x 50 =1,250um2

• Area of die: 0.00125 x 31,250 um2

= 39.0625mm2 -> 6.25mm2

19IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii

0

2

4

6

8

10

12

14

16

18

20

0 0.2 0.4 0.6 0.8 1

Wiring Study of Interposer

Chi

p ed

ge

10m

To n

euro

n in

put

Bottom chip footprint

Bottom chip Line width, mN

umbe

r of s

igna

l lay

er re

quire

d• Interposer technology innovation required

• Most likely less than 0.5m line and spacing• Land-less capability for via connection

between layers• Appropriate pad surface finishing for

10m interconnection

20IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 20May 27 – 30, 2014

• Computer System for the Era of Big Data

• What is “Cognitive Computer” ?

• Requirement for Cognitive Computing Devices

– Interposer Technologies

– Packaging Technologies

Agenda / Outline / Overview

21IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 21May 27 – 30, 2014

10micron pitch interconnection

Solder bump: 5m Ni/Au pad: 6m

Al wiring

Post：3mt

（Cu. Ni)

SnAg：3mtNi：3mt /Au:0.1mt

Solder bump: 5m Ni/Au pad: 6m

Al wiring

Post：3mt

（Cu. Ni)

SnAg：3mtNi：3mt /Au:0.1mt

Substrate : 10mmx10mm

4X4 10 m-pitch cluster bumps

Chip7mmx7mm

- Wiring on chip/substrate

- Bump/Pad structure

30X30 100 m-pitch cluster array 10 m pitch SnAg bump

10 m pitch Ni/Au pad

IMCs

IMCs

22IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 22May 27 – 30, 2014

- Bonding with contact-retry alignment method

- Bonding condition: 300 deg. C, 10N

Joining

IMC

Ni

Au

Joining

IMC

Ni

Au

Joining

IMC

Ni

Au

Ni-post: Good continuity, IMC growth

Cu-post：Void generated due to consumed solder

10micron pitch interconnection

23IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 23May 27 – 30, 2014

IMS (Injection Molded Solder) technology

Very simple process Green process

• No flux, No formic acid• Minimum solder waste

Pure solder injection• Higher solder volume• Extendible to very fine pitch• Solder alloy flexibility

One pass for multiple solder sizes

Solder Paste (Solder powder + Flux)

Reflow + Cleaning

Squeegee

Metalmask

Substrate

- Solder Paste Printing Method -

IMS head

Mask

Molten Solder

Interposer

- Molten Solder Injection Method -

reference

24IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 24May 27 – 30, 2014

IMS (Injection Molded Solder)

Substrate ／ Interposer ／ wafer

Molten solder

N2 pressure

25IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 25May 27 – 30, 2014

Wafer IMS technology : Demonstration with 8’ wafer

50um

50um diameter

50um

75um diameter

Wafer IMS demonstration with various opening size in 8 inch wafer !!!

solder bump solder bump

Demonstrated Wafer IMS bumping with 8 inch wafer

26IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 26May 27 – 30, 2014

Experimental Results of IMS TechnologyB

efor

eSt

rippi

ngA

fter

Strip

ping

30m 40m 50m 75m 100m

After IMS After Stripping After Cu seed etch

50m

30m

8inch wafer

No residue was confirmed through stripping and Cu seed etchingThe process was confirmed for several bump diameters

27IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 27May 27 – 30, 2014

A Future led by Cognitive technology

Ref. IEICEVol.94,No.8,2011

Terminal devices responsible for low-end cognitive processing and delivery to data center, to avoid information explosion

Terminal devices enable cognitive processing.Workload is balanced b/w data center and terminals.

Data center responsible for advanced cognitive processing using accumulated valuable information

28IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii 28May 27 – 30, 2014

Mission for IBM Research Tokyo

Metal Interconnect

Optical interconnect

Wireless interconnect

Current computer Future computer

Toyosu

Shin-Kawasaki

Universities

PartnersCognitive & Bio-inspiredvon Neumann architecture

System technology research

Element technology research

System technology research and element technology research for new era computing will be performed under collaboration among universities and partners.

29IEEE 64th ECTC – Orlando, FL, USA May 27 – 30, 2014Yasumitsu Orii

Thank you for your attention !