From Technologies to Applications - Intel€¦ · · 2014-03-08From Technologies to Applications J.R. Lèquepeys, Head of Silicon Component Division ... Specific packaging solutionsDemonstrators

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INTEL – ERIC - 2012 | 1

Laboratoire d’électronique et de technologie de l’information

From Technologies to Applications

J.R. Lèquepeys, Head of Silicon Component Division

2012


INTEL – ERIC - 2012 | 2

AGENDA

• Brief overview of CEA-Leti

• Some of our technology roadmaps

• Leti plays a key role for boosting innovation through:

• Close partnership with industrial partners

• Startup creation


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CEA-Leti | The CEA at a glance

is one of the largest research organizations in Europe, focused on energy, health, information technologies, and national defense

10

>16,000 People (10% PhD and Post Doc)

Research centers

Commissariat à l’Énergie Atomique et aux Énergies Alternatives


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CEA-Leti | About Leti Founded in 1967 as part of CEA

1,700 researchers

50 start-ups & 365 industrial partners

Over 1,880 patents

250 M€ budget

CEO Dr. Laurent Malier

210 PhD students + 30 post PhD with 85 foreign students (35%)

~ 30M€ CapEx

273 generated in 2011 40% under license


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CEA-Leti | Mission and Focus

A single mission:

A clear focus: • µ-nanotechnologies, with critical

mass in Si • Advanced devices for new

applications

Create innovation & transfer it to industry

Mass Production

Pilot Line

Applied Research

Basic Research


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New

products

Proprietary

Open

Disruptive

concepts

Academic Lab Academic Lab


Academic Lab Academia Lab

Corp Lab Industrial

R&D

Business

Units

External Integration Lab

CEA-Leti | Cooperation model


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External Integration Lab New

products

Proprietary

Open

Disruptive

concepts

Corp Lab Industrial

R&D

Business

Units

Pre competitive &

generic focus

CEA-Leti | Cooperation model and postionning

Focus on IP

Mix of precomp & comp



Academic Lab Academia Lab


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Nanotec 300

Advanced CMOS 200

MEMS 200

Smart Systems Integration

Design

Integrative Chemistry & Biology

Nanoscale Characterization

Photonics

CEA-Leti | A Complete Set of Research Platforms


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CONSUMER

ENERGY &

ENVIRONMENT

SECURITY

& SAFETY

AUTOMOTIVE SPACE &

SCIENCE

CEA-Leti | From Technologies to Applications

WIRELESS & SMART DEVICES

APPLICATIONS – NEW PRODUCTS

More Moore & More than Moore

+

IC Design + Embedded Software

INDUSTRY & MEDICAL


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• Some of our technology roadmaps • CMOS, Memory, 3D, Sensors, Actuators, RF,

Photonics, Power devices, Litho, Imagers, displays…

• Leti plays a key role for boosting innovation through :



AGENDA


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Roadmap | CMOS activities and devices at Leti

Our main goal: find an alternative to planar Bulk with a good Speed/Power tradeoff:

•Variability reduced by 2

•Speed improved by 30%

•Power consumption reduced up to 40%

2013 2015 2012 2016 2014 2017

Sensing

Logic

Nanowires

Dual channel xsSOI Si/SiGe

UTBOX

20nm 14nm

sSOI

10nm

3D stacked devices

Memory

3D

(b) (c) (d)

(e)

10nm 10nm

200nm

10nm

Rectangular Si NW Circular Si NW

5nm

Si NWs(a)SiN

20nm

NWs

HM(001)

(11

1)

(b) (c) (d)

(e)

10nm 10nm

200nm

10nm

Rectangular Si NW Circular Si NW

5nm

Si NWs(a)SiN

20nm

NWs

HM(001)

(11

1)

Nanowires for

sensors

Charge based eNVM

Resistive eNVM

Electrode for actuation

Nanowire for detection

Functionality

Our vision • Planar FDSOI is the right

choice for 20 and 14nm: • Simpler process than

FinFET

• Excellent Speed/Power tradeoff

• Nanowire will emerge for 10nm

• Alternative 3D integration process for further scaling


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Roadmap | E-Memory activities at Leti

Our main goal: Explore embedded non-volatile memory • Reduced fabrication

cost

• Reduced power consumption(10x)

• Reduced latency

• Increased endurance (reach 1e15)

Our vision: Resistive memories (as PCM, CBRAM, OXRAM and MRAM) can offer these advantages => back-end solutions, low-voltages, fast speed, high endurance, good reliability, high scalability

a

2011 2013 2015 2017 2019 2021

Objectives: Cost reduction, short latency, low power consumption, high endurance

Technologies: PCM, CBRAM, OxRAM, MRAM

One-to-one industrial collaborations

Applications: Microcontrollers for automotive, smart cards & telecom

Non volatile logic with resistive switching devices

Applications: Reconfigurable circuits, resilient and non volatile logic circuits

« Embedded resistive memories »

Objectives: to reduce circuit size, power consumption and delays

Internal research program

PhDs European and national projects

Device level

Circuit level

System level

Neuromorphic systems using resistive synapses

Applications: vision, security, transport, robotics, computing, neurosciences

New applications

New systems


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Roadmap | 3D at Leti Mechanical

Stress

management

modules (stress buffer,

compliant int.)

Modules for

RF (integrated

antenna)

Thermal

management

modules

Specific packaging

solutions Dicing, direct-on-board, bio-

compatibility

Technology add-on

Bio Techno

Modules Biocomp,…

Silicon on Flex

Modules

Si interposer

TSV Ø10µm, 50µm pitch

Memory on Logic Logic-on-analog Logic-on-logic

(Advanced on

Mature)

Cache memory on many core

(3D network-in-memory)

Active interposer

(NOC interconnect)

Fine grain partitionning Pitch <10µm

Modular and Stackable processor

(NOC interconnect)

TSV Cu Damascene

line

Bonding

Thinning

RDL

Bumps

TSV last

Stacking Interconnects,

underfill, P&P

Core 3D Technology (200 & 300 mm)

3D Technology Toolbox 200 & 300 mm

Roadmap for Silicon Demonstrators


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Roadmap | Sensor at Leti (M&NEMS Platform)

3D Accelero 3D magneto 3D gyro Microphone &

Pressure sens.

Miniaturized sensors

Generic platform for sensor integration

sensors fusion

No parasitic sensitive MEMS size inertial mass

+ Nano-size piezoresistive gauge

An approach for low power consumption

All these sensors on the same die, with the same IC for readout


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AGENDA



• Leti plays a key role for boosting innovation through:




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A key partner | With industrial Partners / Customers

Access to Technological platforms

Dedicated personnel Common labs

Broad expertise provided

Research Proof-of-concept Prototypes Volume production

Long-term IP approach and careful IPR management

One-to-one collaboration Global Capabilities


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A key partner | Transfer with industrial partners

Our model for cooperation :

Joint programs

Joint teams

| 17

Permanent & Continuous Transfer

License Agreement

Win-Win partnership


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A key partner | Main Industrial transfers in microelec. /microsystems

http://www.altissemiconductor.com/index.php

http://www.soitec.com/fr/index.php

http://www.shinko.co.jp/english/index.html

http://www.brewerscience.com/

http://www.spp-pts.com/


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Leti: the gateway for greater access to technology thanks to

world class links with academia and Research Labs

A key partner | Open Collaboration with World Class Academia Partners

Network of Carnot institutes (CSEM, FhG, VTT)

HTA a technology one stop-shop for industry

Tokyo Institute of Technology MicroMachine Center Tsukuba Innovation Arena partners : AIST, NIMS, Tsukuba University

IBM (Albany, Fishkill) Caltech

Berkeley

Cambridge


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2001 2010

Image S 751 - Megapixel

Module final S 754 Image S 754 - Megapixel

TSV

Camera for Mobile Phone • VGA (300kpixels) • Camera size evolution • 3D impact on Embedded Cameras

Key Accomplishments | Industrial Transfer


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Bolometer based Infrared Detector Arrays • Pixel 17µm transferred • Pixel 12µm demonstrated • Wafer Pixel Packaging • NETD = 50 mK


Detector to read-out circuit contact pad

Thermal insulation

CMOS read-out circuit

Reflector

Mechanical holder

Amorphous Silicon

Commercial product

640 x 480 - 25 µm


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125Mb/s RFID for remote powering High Capacity Data Storage • Coupling RFID (UHF &

13.56MHz) and UWB impulse radio

• Data rate from 54 to 125 Mbps @ 30cm

• Power consumption: 5mW • Chip area: 4mm² • ST CMOS 130nm, 1.2V


Download time of 10s for a 1 Gigabit of content from battery-less memory tags

VLSI ’10 Nokia World ’09 Nokia World ’11 JSSC ’12


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DNA detection and IR Camera used for flu detection

(Avian flu, H1N1 flu)



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Accelerometers (automotive market)

• low G accelerometer

• On-Chip-Sealing on 200 mm

• 640 SOI wafers processed in LETI



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3D Stacking Memory on logic Wide I/O demonstrator (application smartphone)

• Array of ~1000 TSVs

• Memory

• Array of ~1000 bumps

• 4 x 128bits @ 200MHz 12.8GBps


Bank 0

Channel 0 Channel 1

Channel 2 Channel 3

Bank 2

Bank 1

Bank n

Bank 0

Bank 2

Bank 1

Bank n

Bank 0

Bank 2

Bank 1

Bank n

Bank 0

Bank 2

Bank 1

Bank n

Leti Mag 3D

platform Array of ~1000

TSVs

Memory Array of ~1000 µ-

bumps

4 x 128bits @

200MHz

12.8GBps


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3D High Density Interposer • 100 µm thick interposer • 10 µm diameter TSV • 100 000 intercos / Chip • 0.5 µm resolution RDL


Ligne 2

Ligne 1

TSV 10x100µm

Via

Available 200mm

Transfer to 300mm running


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Micro-displays for embedded entertainment Above CMOS OLED displays: • A low-power solution • HD-TV compatible • A natural 3D-view extension


Colored

filters

Substrat Si

CMOS

Metal

anode

OLED

cathode

Collective packaging

Pixel size = 3µm Embedded color filters Collective packaging 1 Mpixel RGB


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New generation of pacemaker Cardiac Rhythm Management (CRM) 1. Heart activity measurement Ventricular micro-probe: Asic + MEMS accelerometer

2. Heart activity stimulation peripheral Asic + electrodes

3. Ultra Low Power RF Links


1

2

hermeticity

RF

driver

sensor

Functionalized

surface

Multi-connecting

•High integration •Reliability •Full hermeticity •Blood biocompatibility •High autonomy •RF Link

3D for integration PICS

~1.2mm ~900um

RF Die PICS


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80 85 90 95 00 05

year

10 15

Startup

19

97

Startup

APIX 20

11

LETI / Caltech Alliance

20

07

NanoSystems

Partnership

20

09

Common lab. 2

01

0

Tra

nsfe

rs

Quartz

accelerometer

Weight sensor Hygrometer Pressure sensor

Pacemaker accelerometer

Geophone Accelerometer Inertial

platform

Ke

y d

ate

s

bulk technology

Surface micro-

machining

« Intra-CMOS »

demonstration

Waferscale

packaging

M&NEMS concept

Thin film

packaging

Above IC MEMS

demonstration

Comb drive

accelero patent

MEMS

technology

NEMS for

gas detection

MEMs: 28 years of industrial transfer



INTEL – ERIC - 2012 | 30



• Leti plays a key role for boosting innovation through : • Close partnership with industrial partners

• Start-up creation

AGENDA


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Leti,

45 years of history


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ACQUIRED (20%)

DISCONTINUED (20%)

Leti,

50 start-ups created

START-UPS CREATION: An efficient way to transform ideas/technologies into value/jobs


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Since 2000 24 start up created

5 discontinued

Since 2008 13 start up created 2 discontinued

3053 active jobs


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25 yrs

n°3 WW in high-end infrared

detectors


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20 yrs

Leader in advanced substrates for microelectonics

Leader in concentration PV


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15 yrs

High-end MEMS sensors Operations in US & China


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10 yrs

Leader in low cost infrared imagers


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Leader in motion- sensing applications

5 yrs

INTEL Capital invests 6.5M€


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5 yrs

Leader in micro-dispays


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Create a start-up at Leti : collective support

to maximize the chance of success


INTEL – ERIC - 2012 | 41

A strong partner for innovation, from technologies to applications ,

in a dynamic and global

environment

Documents

From Technologies to Applications - Intel€¦ · · 2014-03-08From Technologies to Applications J.R. Lèquepeys, Head of Silicon Component Division ... Specific packaging solutionsDemonstrators