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i_
Abbreviation6
AOI-Al38
AER
AHU
AWN
BCDS
BOD
c4
CCA
CD0
CLW
COD
CPU
CRB
cs
DR
DfEHS
DLW
DO
DoELG
DR0
IEMA
EBT
EECA
EEJ
EEJA
EHS
EMEA
EMEAR
EMI
EMP
EMS
ENV
EPA
EPS
ERFB
ERT
ESA
ESB
ESIA
1 Air Emission Points Identified in the Intel IPCL Application
Annual Environment Report
Air Handling Unit
Acid Waste Neutralisation
Bulk Chemical Delivery System
Biological Oxidation Demand
Controlled Collapse Chip Connect; Wafer Finishing Process
Chromated Copper Arsenic
Catalytic Destruction Oxidiser
Concentrated Lead Waste
Chemical Oxygen Demand
Central Processing Unit
Change Review Board
Corporate Services
Design for the Environment
Design For Environmental Health 8 Safety
Dilute Lead Waste
Dissolved Oxygen
Department of Environment & Local Government
Diesel Range Organics
Institute of Environmental Management 8 Assessment
Effluent Balance Tank
European Electronic Components Association
Tool Set used in C4 area
Tool Set used in C4 area
Environment, Health & Safety
Europe, Middle East & Africa, Regional Grouping Of Intel Facilities
Europe, Middle East & Africa Region
Environmental Management Incident
Environmental Management Plan
Environmental Management System
Environment
Environmental Protection Agency
External Product Specification
Eastern Regional Fisheries Board
Emergency Response Team
Environmental Self Assessment
Electricity Supply Board
European Semi-Conductor Industry Association
FlO/F14/F24 Fab lO/Fab IlMFab 24
FWR Facilities Work Request
GPS Global Positioning System
GWGs Global Warming Gases
GWP Global Warming Potential
L
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H#
HSA
HVAC
HVM
IEN
IF0
IGEE
INEE
IPCL
IRI-IR6
IRCS
IS0
IS0 14001
JIA
KCC
KIA
Kreha Unit
KWhtWS
LOD
LRW
MAC
MAH
MFG
MMTCE
MOA
MW
N/A
N/E
OEM
Qps
Man Hole #
Health & Safety Authority
House Vacuum
High Volume Manufacturing
Improvement Engineering
Ireland Fab Operations
Index of Gross Eco Efficiency
Index of Net Eco Efficiency
Integrated Pollution Control Licence
Intel Ireland Office Building Nomenclature
Ireland Corporate Services
International Standards Organisation
Accredited Environmental Management System
Japanese Semi-Conductor Industry Association
Kildare County Council
Korean Semi-Conductor Association
Brand Name for a VOC Abatement Treatment Unit
Kilowatt Hours Per Wafer Start
Limit of Detection
Lead Reclaim Waste
Maximum Admissible Concentration
Make-up Air Handlers
Manufacturing
Million Metric Tones Carbon Equivalent
Mother Of All
Monitoring Well
Not Applicable
Not Emitted
Original Equipment Manufacturer
Operations
0 P804-PI262 Process 804 - Process 1262; Intel Corp. Production Technology Nomenclature
PAS
PER
PERL
PFC
PGMEA
PLC
POR
POTW
POU
PRO
PSSS
Percentage Against Schedule
Pollution Emission Register
Pollution Emission Register List
Per Fluorocarbons
PTD
Q#
Ql
Q2
Q3
Propylene Glycol Mono Methyl Ether Acetate
Programmable Logic Controller
Plan Of Record
Public Office of Treatment Works
Point Of Use
Petrol Range Organics
Process Specific Support Systems; process where gas & chemical support systems are provided for process equipment.
Portland Technology Development
Quarter Number
Quarter 1 (for 2004 this is Dee 28 ‘03- Mar 27 ‘04)
Quarter 2 (for 2004 this is Mar 28 ‘04- Jun 26 ‘04)
Quarter 3 (for 2004 this is Jun 27 ‘03- Sep 25 ‘04)
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Q4
RCTO
RIW
RO
RODI
ROI
SIA
SLllSL2
SOP
SSP
svoc
SW
TBC
TFS
TPH
TTP
UPW
VDF
voc
VSD
WBT
WP
wsc
WWI
YTD
i , ,
. . ‘7
‘_ : : . ! ,i
: .
. , . : , . - ,~ j . ”
I :;‘
Quarter 4 (for 2064 ttiis iS’.!&p %‘&I - Dee 26 ‘04)
Brand Name for a VOC Abatement Treatment Unit
Reuse Industrial Water
Reverse Osmosis
Reverse Osmosis De-lonized
Return On Investment
Semi- Conductors Association of America
Safety Level l/Safety Level 2
Standard Operating Procedures
Supplier Service Program
Semi-Volatile Organic Carbon
Surface Water Discharge
To Be Confirmed
Trans Frontier Shipment Document
Total Petroleum Hydrocarbons
Technician Training Package
Ultra Pure Water
Vertical Diffusion Furnace
Volatile Organic Compounds
Variable Speed Drive
Web Based Training
White Paper
World Semiconductor Council
Work Week
Waste Water
Year To Date
.
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Table of Contents
INTRODUCTION
1.1 Site Details 1.2 Description Of Site Activities
1.3 Environmental Policy 1.4 Environmental Management Organisational Chart
SUMMARY INFORMATION
2.1
2.2
2.3
2.4
2.5
Self Monitoring Data 7 2.1.1 Wastewater Emissions 7 2.1.2 Emissions to Atmosphere 9 2.1.3 Summary of Waste Data 15 Agency Monitoring and Enforcement 16 2.2. I Agency Monitoring Visits 16 2.2.2 Agency Inspections 16 Resource Management 18 2.3.1 Water Consumption and Minimisation 18 2.3.2 Energy Consumption 20 2.3.3 Material Efficiency 21 Environmental Incidents and Complaints 22 2.4.1 Environmental Incidents 22 2.4.2 Complaints 29 Submission of Summary Information 29
MANAGEMENT OF THE ACTIVITY 3.1 EMP Report for 2003 3.2 Environmental Management Programme Report 2004
3.2.1 Schedule Of Environmental Objectives & Targets 2004 3.2.2 EMP Proposal For 2004
3.3 Pollution Emissions Register 3.3.1 Pollution Emission Register (PER) Report for 2003 3.3.2 Pollution Emission Register (PER) Proposal for 2004
3.4 EMS Activities for 2003
LICENCE-SPECIFIC REPORTS 4.1 Groundwater Monitoring Summary Report 4.2 River Rye Water Monitoring Report 4.3 Louisa Spa Water Quality Monitoring 4.4 Surface Water Discharge Summary Report 4.5 Boiler Water/Cooling Water Treatment Chemicals 4.6 Examination of Individual Effluent Waste Streams 4.7 Residual Management Plan 4.8 PFC Emissions Report
APPENDIX 1 ANNUAL NOISE MONITORING REPORT
APPENDIX 2 BUND REPORT
1 1
5 6
34 47 47 49 59 59 77 78
87 91 93 96 97 98 100 100
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Annual Etivironmental Report 2003 1 1
1 INTRODUCTION
1.1 SITE DETAILS
Licence Register Number: 589
Licensee Name: Intel Ireland Ltd
Address: Collinstown Industrial Park, Leixlip, Co. Kildare
1.2 DESCRIPTION OF SITE ACTIVITIES Intel Ireland Ltd. consists of two manufacturing facilities on the site; IF0 and Fab 24.
Ireland Fab Operations (IFO) is made up of two factories, which were previously known as Fab 10 and Fab 14. Both these factories have been amalgamated and they now operate and are managed as one manufacturing organization. IF0 covers approximately 130,000 square metres and includes a 13,000 square metre ‘Class I’ Clean Room for the manufacture of microchips.
IF0 manufactures high speed Pentium@ Ill and Pentium@ 4 support chips using the very latest manufacturing technology available in the semiconductor industry. There are three processes operating within IFO, 0.13 micron technology used in the production of Flash memory, 0.18 micron technology used in the production of microprocessors and 0.25 micron technology used in the production of chipsets that optimise a PC’s overall performance in handling graphics, 3-D images, video and audio. In lay terms, 0.13 micron technology creates millions of transistors on an Integrated Circuit (chip) the size of a finger-nail.
Fab 24 is the latest addition to the site. The Fab 24 building will total 52,000 sq metres in size, which includes a 15,000 sq metres Clean Room manufacturing area. This facility will begin production of 300mm/l2” wafer technology in 2004.
During 2003 Intel Ireland Ltd employed a total of 3200 permanent employees and 1000 sustaining contractors.
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Annual Environmental Reaort 2003 1 2
Manufacturing Activities
The Fab buildings each contain major areas in which wafers are processed. These areas are referred to as functional areas and are called:
Diffusion, Lithography, Etch, Thin Films and Planarisation. The general
principles of manufacturing microprocessors is that the wafer is passed
between the different areas to build up a complex 3-dimensional device on
the surface of the wafer. External contacts for the microprocessors are
made by what is known as the C4 process.
The manufacturing activities carried out on site fit into a number of
categories. These are
D#usion: where layers are introduced or ‘grown’ on a semiconductor wafer
under high temperature conditions. Implanted chemicals are then
introduced to selectively change the electrical properties of sections of the
wafer.
Lithography: creation of patterns for the electrical circuits on the wafer
surface in a process similar to photography using ultraviolet light passing
through apertures in a mask to selectively expose areas of the wafer.
Etch: translates the pattern created by lithography into a three-dimensional
structure by selectively etching channels into the surface substrates.
Thin Films: A film of material is introduced to either create conductive
interconnects between layers, electrical isolation or protection from the
environment.
flanarisation: the surface of the wafer is polished by the use of mechanical
and mild chemical abrasives to achieve a uniform flat layer.
/on Implantation: used to introduce impurities or ‘dope’ the silicon with
materials such as phosphorous, boron or arsenic. Implantation changes
the electrical characteristics of specific areas of the wafer.
The wafer will pass through each. of these functional areas many times
before the full three-dimensional structure of each integrated circuit has
been built up. Each wafer will have more than one hundred integrated
circuit dies produced, with each die forming the basis of a ‘silicon chip’.
C# Process: To allow each integrated circuit to be connected to a printed
circuit board for installation into computers, connections must be created to
connect the circuit to other electrical components on the board. These are
produced in the C4 process. During this step lead and tin solder connects are introduced onto the back of the circuit by an electrolytic process.
Sort: Each chip is then electrically tested in a quality assurance step
known as SORT and then distributed to another Intel plant outside Ireland for final packaging. These processes produce a multiplicity of products
which change continuously.
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Annual &vircmnental Report 2003 1 3
The wafer fabs, which produce the silicon-based devices, use complex
processes involving two billion pounds of equipment and 300-500 operational steps all housed in an ultra-clean environment. The material
does not move through the factory in a linear fashion from front to back, but loops back on itself, revisiting some areas sometimes more than
twenty times.
Support Activities
To support manufacturing operations, a number of on-site utilities
including chemical storage and handling facilities, ultra pure water
treatment plant, bulk gas plants, boilers and chillers along with wastewater
treatment plants are required. These provide the raw materials, conditions and services necessary for the manufacturing process.
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Annual Environmental ReDort 2003 1 4
1.3 ENVIRONMENTAL POLICY Intel Ireland operates a rigorous environmental management system (EMS),
which is independently certified to the international environmental standard
IS0 14001. An EMS is a requirement of our IPC licence, the fact that we have
a certified EMS, creates additional confidence in the standard of our
environmental controls.
In line with IS0 14001 requirements and to demonstrate the sites
commitment to Environmental Management, Intel Ireland has developed an
Environmental Policy. This policy is reviewed and updated on an annual basis is signed by the site managers annually. A copy of the 2003 Environmental
Policy is outlined below.
Intel Ireland Limited comprises of the semiconductor integrated circuit manufacturing
facilities - Ireland Fab Operations (IFO) and Fab24 (under construction).
Intel Ireland is committed to achieving a high standard of environmental performance.
To fulfil this commitment, Intel will:
8 comply, as a minimum, with all applicable regulatory requirements.
I continually improve our environmental programs through our Environmental
Management System ( EMS); our framework for evaluation of all site
processes and emissions.
#4 promote pollution prevention technology to conserve natural resources,
minimize emission loads to air, land, water. 0 aim towards the goals of materials elimination, substitution, minimization and
recycling. iQB ensure that the operational controls we have in place to manage our
environmental systems are safe, effective and robust. 9 strive for environmental excellence by developing environmental responsibility
across all levels of our organisation, through awareness and training programs.
G& audit and review our Environmental Management System to ensure it remains
effective and proactive.
GB work with regulatory agencies, the local community and our employees to
ensure that we identify and address emerging areas of environmental
concern.
G% encourage all our employees to act as advocates for Intel Ireland Ltd.
9 require contractors, sub-contractors, designers and suppliers engaged with
Intel to apply environmental standards compatible with our own.
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, . -’ j.
Annuftl Environmental Report 2003 1 5
1.4 ENVIRONMENTAL MANAGEMENT ORGANISATIONAL CHART
This section details the roles, authority, responsibilities and interrelations of key staff responsible for environmental activities. The Environmental management structure is represented below
Intel Ireland General Manager ’
The Intel Ireland General Manger has overall responsibility for Environmental Management on the site. He/She is responsible for evaluating the annual Environmental Self Assessment (ESA) review and thus for the assessment of the site’s Environmental performance against its stated targets and objectives. The General Manager also sets direction during the annual review and facilitates that these targets and objectives are achieved by attending Environmental Ops meeting which occur on a formal basis once per quarter.
IFO/F24 Plant Managers
The IFO/F24 Plant Managers have overall responsibility for Environmental Management in their specific plant. He/She participates in the annual ESA and thus in the assessment of the Site and in particular their plant’s Environmental performance against its stated targets and objectives. The Plant Manager sets direction during the ESA and ensures that the targets and objectives are met.
Ireland Corporate Services Manager: (IRCS)
The IRCS Manager reports to the EMEA CS Reg,ional Manager and has overall responsibility for Environmental Management in the IRCS area. He/She participates in the annual EMS review and thus in the assessment of the Site and in particular CS’s Environmental Performance against its stated goals and objective. The CS Manager sets direction during the annual review and ensures that the CS targets and objectives are met.
IFO/F24 Manufacturing Manager
The IFO/F24 Manufacturing Manager has overall responsibility for the self- sustaining manufacturing operation in their respective Fabs to meet throughput, quality and environmental requirements.
EHS Manager
The Intel Ireland EHS Manager reports to the IRCS Manager and is matrixed to the EMEA Regional EHS Manager and is responsible for the day-to-day management of the Environmental Health and Safety Department within the
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Annual Environmental Report 2003 1 6
site. He/She has responsibility to ensure that stated Environmental targets
and objectives are met. He /She sets direction on Environmental matters and
gives direction during ESA. The EHS manager advises the CS Manager of
requirements, to ensure sufficient resources are in place to run the EMS.
Environmental Manager
The Environmental Manager reports to the Environmental Health and Safety
Department Manager. The Environmental Manager has overall responsibility for Environmental Management across the site and for achieving stated
Environmental targets. Together with the EHS Manager the Environmental
Manager sets direction on environmental matters and ensures that Intel remain in compliance with relevant licences. The Environment Manager
ensures that the EHS Manager is informed of resources needed to run the
EMS. The Environmental Manager is responsible for the operational running
of Environmental Ops and ESA. The Environmental Manager is responsible for the EMI (Environmental Management Incident) programme. The
Environmental Manager has a team of approximately seven individuals who
drive the Intel Ireland Ltd environmental programme on a planned basis.
Emergency Response Team
The Site Emergency Response Team is responsible for the facility during an
emergency. An ERT leader who directs operations leads the team. ERT have
specialised training to deal with a range of potential incidents.
Environmental Department
The Environmental Department currently comprises of seven environmental
graduates whose work is subdivided to deal with many aspects of environmental programme management including:
n Integrated Pollution Control Licence management (IPCL)
n Environmental Management System (EMS)
. Environmental excellence programme
. Community environmental awareness
Essentially the objective is that the operation of the activity complies with all
applicable environmental regulations and policies, and that the site’s
environmental management system be managed in a sustainable fashion for
social, environmental and economic purposes.
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Annual Environmental Report 2003 1 7
2 SUMMARY INFORMATION
2.1 SELF MONITORING -DATA
2.1 .I Wastewater Emissions Thirteen wastewater parameters including total heavy metals (sum of arsenic, chromium, copper, nickel, lead, tin and cobalt) are measured weekly on the basis of daily composite sampling. Flow, pH and temperature are measured on a continuous basis before being discharged from the site. Licensed effluent emissions to Kildare County Council Wastewater Treatment Facility in Leixlip are summarised on the following
page. All measured parameters, averaged at less than 23.1% of the Licence Limit over the full year of 2003. The following bar graph compares the average concentration for each parameter to the Licence Limit. There was 1 exceedance of the IPC Licence in 2003. On the q4’h August, the IPCL Limit for pH was exceeded. The EPA was immediately notified of the incident and an on-site investigation was undertaken. The EPA Inspector reviewed the follow-up incident report on-site on lgth February 2004. The event had no environmental impact as the effluent from the site is discharged directly to the wastewater treatment plant in Leixlip.
Comparison of Effluent Discharge Limits & Average Concentration of Effluent Analysed, 2003
2003 Summary of Licensed Effluent Emissions to Kildare County Council
,i ix
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Annual Environmental Report 2003 1 8
<_. . . , . . . ) -se. , , - - . . . .l__, - . . - . _. - .
Paramefer Monitoring Average Annuai Permit Percentage
Freq. Emission Emission Limit of Licence
Cont. (mg//) (kg)* (mg/r) Limit (%)
Average Flow
(m3/day) Continuous 6818.336 NA 16500 41.323
PH Continuous 7.700 NA 6-9.5 NA
BOD Weekly 11.038 27,131 90 12.264
COD Weekly ~20.642 <47,932 180 cl 1.468
Ammonia (as N) Weekly 7.067 17,669 41 17.236
Total Phos. (as P) Weekly co.451 ~1,164 5 c9.023
Suspended Solids Weekly <I 3.679 ~32,844 180 ~7.600
Total Dissolved Weekly 818.000 1,969,794 4500 18.178
Solids
Sulphates Weekly 254.585 610,240 1100 23.144
Nitrates (as N) Weekly 4.144 10,225 25 16.577
Fluoride Weekly 2.985 7,565 18 16.583
Cyanide Weekly co.01 0 ~26 0.1 <I 0.385
Tin Weekly <0.002 ~6 0.4 co.575
Lead Weekly co.005 40 0.4 cl ,321
Total Heavy Metals Weekly co.054 429 1 c5.400
Chromium Bi-annually co.004 cl0 0.1 c4.333 Nickel Bi-annually co.008 cl8 0.2 c3.917
Copper Bi-annually co.031 ~76 0.3 cl 0.250
Arsenic Bi-annually co.003 ~6 0.1 ~2.521 Cobalt Monthly <0.002 c5 NA
Note *The daily mass emissions were calculated from the reported
concentration of the daily composite samples and the corresponding total
flow for the day. The Annual Emissions for 2003 for each parameter was
calculated from these emission values.
Where the concentrations of parameters measured during 2003 were
reported as below the limit of detection, the parameter has been assumed
to be at the detection limit to enable average concentrations and annual
emission rates to be calculated. The reported concentrations and
emission rates are thus reported as ‘less than’ the calculated values.
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Annual Environmental Report 2003 1 9
2.1.2 Emissions to Atmosphere
2.1.2.7 2003 Summary of Licenced Emissions to Atmosphere
Section 5.5 of the IPC licence requires
“A summary report of emissions to atmosphere shall be submitted to the
Agency as part of the AER. The information contained in this report shall
be prepared in accordance with any relevant guidelines issued by the
Agency”.
This section identifies the annual emissions to atmosphere from licenced
emission points identified in Intel’s IPC licence. Emissions are derived from
four main sources including: .
l boiler and generator emission sources (NO, and CO)
l acid scrubber exhausts (acid gases) l specialty exhausts (arsenic and total dusts)
l solvent exhausts (volatile organic compounds, VOC) . RCTO Emissions (volatile organic compounds, VOC, NO, and CO)
A summary of average emission concentrations in comparison to the licence limits has been presented in the following table.
Total Annual Emissions to Atmosphere (Combined Fab IO & Fab 14)
Many of the monitored components have been identified to be below the
limit of sampling and analytical detection.
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Annual Environmental Report 2003 / IO
2.1.2.2 Nitrogen Oxides (NO,) & Carbon Monoxide (GO) Emissions
Emission Point Reference No’s: AOI, A03, A04, A05, A06, AIOI, A102, A103, A104, A35, A36, A52, A53
Pat&&t& Monitoring Average Permit Limit Annual Percentage
Freq. Emission (mg/Nm3) Emission Compliance
Cont. (kg) (mg/Nm3)
~NO;;,:~j:~:, :.:-::‘~ .> Annual 115.2 170 Note 1 20565 100% i .; . . . _ ‘,.. I. 2, _ _;_ ;; :. 1, 6.. ;.:;... y .j ,..:. ~.I >;:‘:k:;,‘“.;~; Annual 12 100 409 100% .j .“I,:‘ _... ta<’ %,~r..y.., ~.,~ ,..l‘i. ;-‘,“. ‘-.;>,; 1~ <I:. :..;“..:.,(,;.” y? ,.
Note 1: There are different limits for NO, as NO* for different boilers on site,
170 mg/Nm3 is the lowest limit for the Fab 14 boilers and this is used as a
comparison.
2.1.2.3 Acid Gases Emissions
Emission Point Reference NO’S: A07, A08, AIO, A14, A15, A16, A20, A22, A23 (Fab 10)
_.,_ r^-- ._.~, . . . . . .._, . . ..- ._i... Parameter Monitoring Average Permit Limit Annual Percentage
Freq. Emission (mg/Nm3) Emission Compliance
Cont. (kg) (mg/Nm3)
Ital Fluorides? I
Quarterly 0.04 0.5 ,. .: -. __ . . 80 ~,,, ‘-lOOD/p’,.
., _ . . .., :. : 1,. .., ‘>F . . ,..: .,, .._ .: ..‘.
&p;. y:i:, Quarterly 0.03 0.3 46
., . . . . dr~flt~&fi~
I.:“-; ~oo,,-q: ,‘. ._ .
.Tc
G;
Note: All Total Acids as HCI emissions below the limit of detection, 0.01 mg/m3
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Ann&h Enhonmental Report 2003 1 11
Emission Point Reference vo’s.: A105, A106, A107, A108, Al09, AIIO, All1 (Fab 14)
2.1.2.4 TA Luff Classified Inorganic Dusts & Total Dusts Emissions
Emission Point Reference No’s.: A26, Al 16
-Bi annual N/E
Bi annual
Bi annual N/E
Bi annual 0.65
N/E : Class I and II TA Luft Inorganic Dust Particles not emitted.
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Emission Point Reference NO’S: All, A12, A18, A19 (Fab 10)
Annual Environmental Report 2003 1 12
Emission Point Reference NO’S: Al37, A138
P.~ra-e~&t‘ : . “ . I
hhhhxj .Aveiage j Permit Limit Annual Percentage
Freq. Emission (mg/Nm3) Emission Compliance Cont. (kg)
(mg/Nm3)
TA.,Luft I,:.: ‘- Bi annual 0.019 0.2 0.90
~!~~+iic_+i&~-~
._ -1og4i : _ . . .
: .Pa’t-tiCl~ &ss iI j ‘,TJ kufi. ‘:‘j.if” ci.’ Bi annual N/E 0.2 0.00 .~,~6&~i,&~D~S~..l.
.: & %, -., _, fI ., -.
‘+~~c&?~~ass : _, . . . ., ‘~
-: 1 ;’ ;,,,i.,, ‘; : . . . . ,+ : _.‘. ,_’
.’ ~ 8 ,..’ _ ::
:&I?$$~~&&~ Bi annual 1.43 20 D&ts,‘:: :, ,:,i.::
67.82 -_:-. ~lbb.%’ .( _. ., ‘. ._
N/E : Class III TA Luft Inorganic Dust Particles not emitted.
2.1.2.5 Emissions of Class I, II and Ill Organic Compounds
r Paraineter 1’ Monitoring 1 Average 1 rermlt Limit 1 Annual 1 Percentage
150 423.69 ., 100%.. ', __ :.:
8 72.60 .’ ,.lbO~% ‘.
C) I ! Quarterly 2.13
Quarterly 0.36
: ._.
Quarterly 0.36 t%
n
Quarterly 3.50 20 702.80 . <IO0 % _ urgaw,yass j -111.: ;-‘., -..‘t. .( -.,:‘ .: .,
: 20 72.60 ; ‘OC
Emission
Cont.
(mg/Nm3 as
(mg/Nm3) Emission Compliance
(kg as C)
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Annual Envihnmental Report 2003 1 13
Emission Point Reference No.: Al 12 (Fab 14 VOC Adsorption unit)
Quarterly 1 1.95 I 150 1 548.61
Quarterly 0.36 20 102.12
Quarterly 0.36 100 102.12
Quarterly 3.20 150 1 900.73 1
Emission Point Reference Nob.: Al 13, Al 14, Al 15, Al36 (Fab 14)
Quarterly
Quarterly 1 0.36 ( 20 j 142.11 /
Quarterly 0.83 20 325.15
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Emission Point Reference NO’S: A56 (Fab 10)
“P;‘a&m&’ ‘. Monitoring Average Permit Limit Annual Percentage Freq. Emission (mg/Nm3) Emission* Compliance
Cont. (kg as C> (mg/Nm3 as
Cl Ttit&Orgh$‘,( Quarterly 0.91 50 79.87 Cart&:: : 1 .:
loo -%- -,, ,‘. y..
TA- Luft .-I: : ,,. ‘I
Quarterly 0.36 5 31.91 -idil%~:: orgar+~ :..:. : ._,.-:,. .( &ig, :::.‘., ,. ” .,
I .,_. ,’ .;. :
: T&L@ :. .? .: 1; Quarterly 0.36 20 31.91
yjc,! ,’ ‘:-. 1.qo %. “.
‘,.T. ‘.,
,,,:; ‘J::: ., . . . .
fit”, .:.Z Quarterly 1.43 50 126.08 ,.,. I .,,.’ l.Oq!! IIC .1
Emission Point Reference NO’S: A57 (Fab 10)
Parameter Monitoring Average Permit Annual Percentage Freq. Emission Cont. Limit Emission* Compliance
-I (mg/Nm3 as C) (mg/Nm3) (kg as C) I
:-Total ,Qrganid‘,,, _; Quarterly 7.32 50 59.63 ‘,I l‘O@% : .c~~b+:_~~ : .$ ;j.;. ;ijz:
.,I, : .,: : :,
.,,_ :..,. .;_ : .,,. ,;_A .:- . . ,__ ~ ,;, .-. ,.:, .( ./ _4 .G.- .c _j .y ,_ .:;+ __, _.:
::yjj; L-,&yg3ni~‘” Quatier,y 0.71 5 5.76
,~~~&&‘, ,;:< :::::. )._ .‘ido a/o
,;: ..‘- achy’,.‘.:,, ., ‘.,;: ,,: .‘. - . . 1~ ), :.; ,‘I ,y:,-‘:-. t . . ., : .- ..: . . . .: ,. ._ .;. 1. . . . Y,,,.. ..,’ -.
,:c(ijc,:;,‘: ‘,;,.:$:I ~:.:; : ._ ~..“:.- -._ Continuous 0.41 400 3.34 $w%l ;:,; ,,,_: .,“” ,. ,,I ; : .-, I ,,I 1.’ ::yz.. -*._ _ .( ‘,, .I ; ‘_ _
No; tiS h&Ii<. :_ ” Continuous 0.41 200 3.34 :.: ;fj() g; ,’ ,.,..: ,. .’ .1 :. ‘, _ ;._ _,1. . . :. .:
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Ann&i’E&ironmental Report 2003 1 15
2.1.3 Summary of Waste Data (in Tonnes)
Total Waste 3791.48 Total Waste Disposed of 1820.278 Total Waste Recovered 1971.2
Hazardous Waste (in Tonnes)
Corrosive Arsenic* Flammable Arsenic* Flammable Debris* Corrosive Debris* General Solvent Lead Reclaim Waste Lead Waste-concentrated Fluorescent Lamps Batteries Used Oil
0 0 0.914 0.135 1.049 1.302 1.315 2.679 1.996 7.292 13.17 15.085 26.559 23.184 77.998
13.399 14.661 27.309 24.078 79.447 64.55 71.12 70 89.66 295.33
0 0 3.4 0 3.4 135.88 148.1 144.43 134.62 563.03
0.58 0.11 0.35 0.21 1.25 0 0.41 0.47 0 0.88 0 4.4 1.32 0 5.72
Non-Hazardous Waste (in Tonnes)
Cardboard Recycled 10.81 16.41 25.39 20 72.61 Metal Recycled 101.83 120.95 124.52 120.5 467.8 Plastic Recycled 0 0.62 0 9.18 9.8 Wood Recycled 133.59 118.78 46.22 28.2 326.79 Other Recycled 57.16 151.04 153.29 160.49 521.98 General Non-hazardous 167.5 235.01 251.54 219.18 873.23
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Annual Environmental Report 2003 1 16
2.2 AGENCY MONITORING AND ENFORCEMENT The AER Guidance Note requires that any significant differences between monitoring carried out by Intel and that of the Agency, be highlighted in this section.
22.1 Agency Monitoring Visits
The various monitoring visits made by the Agency during 2003 are outlined in
the Table below.
. I ‘+i/. ,L : ; . , _ . - ~‘,‘.,~,-:‘~-.~=.r...~ . . : , il _’ I , , ? , . , ;
. ( ,‘a_ , . . - . . -:I ’. ‘- i
Da;te ‘Of Visit Date of Results Purpose of Visit
06 Mar 2003 03June2003 Water SW / WW?
13 May 2003 08 July 2003 Water SW I WWI
05 August 2003 05 November 2003 Water SW / WWI
14 December 2003 23 March 2004 Water SW I WWI --_-. ._
Note
SW refers to Surface Water Discharges WWI refers to Wastewater Discharges
A comparison was made between the EPA results and those provided by the external laboratory (Bord na Mona) for the split sample. While some differences were noted, none of the detected parameters were over our IPCL Limit.
2.2.2 Agency Inspections
There were three Agency Inspections during 2003.
Inspector visit 15 January 2003
The purpose of this visit was to introduce the new EPA Licence Inspector to the site and to conduct a compliance walk of the facility. The following items were reviewed during this visit.
. Operation of Fab 10 Scrubbers and RCTO(VOC abatement unit)
n Operation of Fab 14 Scrubbers and Kreha Unit(VOC abatement unit)
n Operation of Fab 14 AWN, hydrogen fluoride and phosphoric treatment systems
n inspection of Bulk Storage Tank Area
. Records of generator use and testing for Fab 10
n Report on Total Phosphorus incident in 2002.
m Clarification on Monitoring Frequencies for various parameters
n Discussion on Fab 24 status
. Status of continuous noise monitor
. Viability of recycling lead waste
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::. Annual~Environmental Report 2003 1 17
Inspector Visit 1st April 2003; The focus of this audit .was a desk review of records, reports and the 2003 EMP. The following were reviewed during this visit.
= EMP Implementation = Quarterly Monitoring Reports . ERT Training n Documentation regarding recent Incident Reports = Calibration Records n Boiler Monitoring Results . Environmental SOPS m Notification Procedures 9 Surface Water lnspeqtion Log
A walk, of the Fab IO scrubber decks, the RCTO, the Retention Pond, Firewater retention arrangements, bunding and the Fab IO Waste Collection Systems was also conducted during this visit.
Inspector Visit 5’h August 2603. Inspector came on site as a result of a Sodium Hydroxide spill in Fab 24. The Inspector toured the site and received’an update on the incident. The River Rye was sampled by the Agency upstream of site, at the site and downstream of the site. There was no environmental impact as a result of this incident. A copy of the final incident report was issued to the Agency.
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Annual Environmental Report 2003 1 18
2.3 RESOURCE MANAGEMENT
2.3.1 Water Consumption and Minimisation
The usage of water is a function of several variables including production
levels and water conservation measures in place. In addition, there is a base
loading on the facilities that is independent of production levels.
Table 2.3.1 on the following page shows water consumption in relation to
production levels for 2003 in comparison with previous years. Annualised
productions levels over the course of 2003 were at a level of 301,020 wafers, which represents a decrease of approximately 8% in relation to production
figures for 2002.
There was a total of 1,935,OOO m3 of water used over the course of 2003
compared with 2,311,OOO m3 used over 2002. Overall, there was a reduction
in water usage of 9% on a production basis. When this reduction is added to the reduction achieved in 2001 and 2002, it shows that there has been a
decrease of 22% between 2000 and 2003 and that the amount of water
required to produce one wafer has decreased from 8.2m3 to 6.4 m3.
If water conservation and efficiency systems had not been made since 2000,
then it would have required over 534,000 m3 more freshwater to operate the
factories over the course of 2003.
Intel Corporation has adopted a Corporate Goal of offsetting at least 25% of
the total annual incoming water supply needs with reclaimed water and more
efficient systems. Intel Ireland has worked to contribute towards that goal and by the end of 2003 the IF0 plant was performing to that level.
Notwithstanding these achievements, Intel Ireland intends to implement
systems in 2004 and beyond to further reduce the quantity of water used per unit of production at the IF0 and the new Fab24 factories. These are detailed
in the Environmental Management Programme (EMP) Section of the AER
(Section 3.2.1.)
Condition 10.3.2 (ii) requires that the quantity of water consumed on site for drinking/sanitary purposes be detailed in the AER.
A summary of this information based on Kildare County Council potable water
meter readings for 2003 is given in the table below.
Quarter Qtr 1 Qtr 2 Qtr 3 Qtr 4
Volume of Water Consumed 11428 7211 9318 6904 for Drinking/Sanitary
purposes (m3) 1
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Table 2.3.1 IF0 Annualised Water consumption as a function of production levels
2000 to 2003
Ql 548333 93,165 5.89
Q2 616539 98,315 6.27
Q3 603935 69,382 8.7
Q4 541785 67,605 8.01
Total 2,310,591328,467 7
Ql 466188 66,943 7
Q2 476821 74,959 6.4
Q3 ho983 79,267 6.4
Q4 480534 79,851 6
Total 1.934.525301.020 6.4
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Annual Environmental Report 2003 1 20
2.3.2 Energy Consumption
Annual Electricity Usage
Quarter
Ql
Q2
Q3
Q4
Total (kWh)
Electricity
Used per Wafer Start (kWhM/S\
Hecfricity Usage (kWh)
2007 2002 2003
65519,868 63,389,672 66198574
66,818,397 64,772,186 67828229
66,489,932 67,607,405 71276312
66,103,279 66,201,014 66959612
264,931,476 263,357,738 272,262,726
706.0 801.8 904.5
rat;;.leas usage at !
Ql 42,792,097
Q2 27,545,252
Q3 25,978,644
Q4 36,784,297
Total (kWh) 133,100,290
Natural Gas Used 354.7
si
Gas Usage (KWh)
2001
/
Gas Usage (KWh) Gas Usage (KWh)
2002 on site* 2003
31,635,939 40,484,558
31,468,430 43,069,640
27,069,813 39,304,799
35,086,930 54,216,037
125,261,112 177,075,034
381.4 588.3
Electricity
Usage for
Site (kWh)
2003
69166323
83509875
97128322
98252177
S48,056,69i
1146.9
1 1
Note
*Actual IF0 Gas Consumption Data is unavailable for 2003 as IF0 and
F24 used a common gas meter. In 2004 separate gas meters will record
usage for IF0 and Fab 24, as Gas Consumption is not related to
productivity, it is assumed that consumption of Gas at IF0 only is very
similar to the 2002 figures.
Both overall electrical and gas consumption increased in 2003 over the
2002 figures. This increase is attributed to Fab 24 construction work
continued during 2003. The Sort area was also expanded in 2003 which further increase energy demand.
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Anthal Etivironmental Report 2003 1 21
Discussion of Results Utility consumption trends were reviewed against wafer production and it was concluded that there is no relationship between electricity consumption and wafer starts. A constant cleanroom environment has to be maintained irrespective of wafer loading.
Natural Gas usage is not related to wafer starts, it is dependent on heat load. Increased heat load comes about from outside air conditions and Increased tool exhaust load.
Outside air affects the clean room on cold days whereby the make-up air to the clean room requires more heating than usual and so heat load increases on the boilers.
Increased heat load comes about as more tools come on line and the general exhaust load increases. Safety Level l(SL1) and Safety Level 2 (SL2) are safety checks that the tool must undergo before going into production. These tools require exhaust even though they do not process wafers. In order to maintain pressure, the make-up air increases, this in turn increases the makeup air requiring conditioning and thereby increasing heating and cooling.
In 2003 10 major energy reduction projects were implemented on-site, this resulted in a saving of 250MWh for electricity and a 125MWh saving for natural gas.
A note on some of the key initiatives being addressed by Corporate Services for energy efficiency are addressed separately in the EMP Section of the AER under utilities as a focus topic for continuous environmental improvement.
23.3 Material Efficiency
In 2004 Intel Ireland will introduce in Fab 24 the manufacture of a new process PI262 and will produce 300 mm wafers. The total silicon surface area of a 300-mm wafer is 225 percent (or more than twice) that of a 200- mm wafer, and the number of printed die (individual computer chips) is increased to 240 percent. The bigger wafers lower the production cost per chip while diminishing overall use of resources. Three-hundred-mm wafer manufacturing will use approximately 40 percent less energy and water per chip than a 200-mm wafer factory. Because energy, water, gas, and chemical consumption is less when manufacturing on 300 mm wafers, the new process is also more sustainable from an environmental perspective.
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Annual Environmental Report 2003 I 22
2.4 ENVIRONMENTAL INCIDENTS AND COMPLAINTS
2.4.1 Environmental Incidents
introduction
This section details the Environmental Incidents that occurred in 2003.
Condition 4.3 of the Intel Ireland IPC Licence required that
A summary report of reported incidents shall be submitted to the Agency
as part of the AER. The information contained within this repot? shall be
prepared in accordance with any relevant guidelines issues by the Agency.
Environmental Incidents
There were twelve environmental incidents in the course of 2003. These incidents were reported to the Agency. The incidents are summarised in
the table below.
In addition to the environmental incidents detailed below, we also reported
the malfunction of the following monitoring equipment in the course of
2003. None of these malfunctions led to loss of control of the abatement systems.
Date
1 7’h January 2003
4’h February 2003
1 2’h February 2003
1 3th June 2003
14fh July 2003
23rd October
7’h November 2003
Downtime
Fab 10 TOC Analyser (RCTO Inlet, Outlet A56 & Oxidizer A57)
Fab 10 TOC Analyser (RCTO Inlet, Outlet A56 & Oxidizer A57)
Fab 10 TOC Analyser (RCTO Inlet, Outlet
A56 & Oxidizer A57)
Fab 14 (Al 12) TOC Analyser
Fab 14 (Al 12) TOC Analyser
Fab 10 (RCTO Outlet A56) and Fab 14 (Al 12) TOC Analyser
Fab 10 TOC Analyser (RCTO Inlet, Outlet
A56 & Oxidizer A57)
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Incident Details
Date of Occurrence: 2!jth January Incident Description: Internet Virus identified on the Intel network A worm virus infected the l,ntel network. Environmental abatement system control was never compromised however there is potential that some records during that period cannot be retrieved due to virus. Duration: 25’h - 26th January 2003 Description of Actions Taken: IT Department took necessary measures to contain the virus and prevent its spread. Production was reduced as a precaution until Jan 26’h. Authorities Contacted; EPA
Date of Occurrence: 4’h February Incident Description: FablO RCTO by-pass Event Failure of the PLC (Programmable Logic Controller) causing the RCTO system to fail and go into by-pass mode. Duration: 9 hours 20 minutes Description of Actions Taken: The PLC was repaired. The RTCO was restarted without issue. Authorities Contacted: EPA
Date of Occurrence: 24h April Incident Description: Overflow of Treated Wastewater from chamber of EBT (Effluent Balance Tank) Estimated flow of 15-18 m30f treated wastewater was released from the EBT. No wastewater reached the River Rye. Duration: IO minutes Description of Actions Taken: The outflow from the chamber was shut off immediately. Discharge valve on EBT was closed and Fab24 flushing activities ceased. Discharge valve on Fabl4 AWN was also closed and diverted to AWN sump. Authorities Contacted: EPA, KCC and ERFB
Date of Occurrence: 14” May Incident Description: Voltage Dip: Voltage dip occurred on site as a result of external construction work impacting on 220kv utility network supplying site. Fan on Scrubber #4 (IPCL Emission Point A16) failed. No other piece of environmental equipment was affected. Note the voltage dip also affected some of the servers on site, resulting in a loss of data from the FablO continuous emission monitors (TOC and
I’
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Annual Environmental Report 2003 1 24
combustion gases on the FablO RCTO) during the time period of 14:31 until
21 :I2 when servers operation was restored.
Duration: 6 hours 49 Minutes
Description of Actions Taken: Scrubber #3 was immediately rotated on in
place of Scrubber #4.
Authorities Contacted: EPA
Date of Occurrence: 17’h May
Incident Description: Small Fire occurred within a.n Air Compressor in
the Fabl4 Energy Centre:
A fire occurred in one of the Air Compressors in the Fab14 Energy Centre. The fire was completely contained within the Compressor Housing.
Duration: Approximately 30 minutes to 1 hour
Description of Actions Taken: The fire sprinkler system activated
automatically to prevent the spread of the fire. The fire was extinguished and the firewater was collected and contained on-site with no environmental
effect. Firewater was discharged to KCC Wastewater Treatment Plant at
Leixlip.
Authorities Contacted: EPA and KCC
Date of Occurrence: 26’h May
Incident Description: Disposal of Treated Wood:
Wood which was used as a base for shipment of Fab24 tools from a supplier
in US was found to be treated with CCA (Chromated Copper Arsenic) as a
preservative. A small percentage of this wood was sent off site for recycling before the
method of treatment was detected.
Duration: N/A
Description of Actions Taken: All CCA timber has been segregated and stored on site for future disposal.
This incident relates to one supplier only who has been informed to use heat-
treated wood for all future shipments.
Authorities Contacted: EPA
Date of Occurrence: 14’h July
Incident Description: Disposal of Rubber Coated Gaskets: Intel was informed from an equipment supplier that five gaskets on a point-of-
use abatement device known as a catalytic destruction oxidizer (CDO)
located in subfab contain asbestos. Prior to this disclosure, Intel was not aware that these gaskets contained asbestos.
The asbestos in the gaskets is fully encapsulated in rubber. The CDOs
support two types of fabrication tools which generate a corrosive exhaust that
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i\nnud Environmental Report 2003 1 25
is reacted in the CDO. During normal maintenance on the CDOs some gaskets maybe replaced. In the past, the removed gaskets were double bagged, labelled as corrosive waste and disposed of with our other corrosive wastes by shipment for incineration. Due to the small quantity and size of gaskets it is deemed that there was no environmental impact as a result of this incineration. Description of Actions Taken: Going forward Intel has implemented new procedures to remove the CD0 ‘gaskets that contain asbestos using a certified asbestos technician. Proper disposal will involve shipment of these gaskets to REB Landfill Site in Germany for deep burial. A letter requesting approval for this disposal route was submitted to the EPA. Authorities Contacted: EPA
Date of Occurrence: 3rd August Incident Description: Sodium Hydroxide Spill: Approximately 22,000 litres of 25% sodium hydroxide solution was spilled from a day tank bund located between the Fab14 and Fab 24 buildings. The caustic solution flowed over a concrete/tarmac area to the east of the bund. In that location was a partially covered manhole (HI) which gave the spillage access to the PVC covered electrical cables inside it. When this filled up the liquid subsequently travelled through the ducts until it reached manhole 7 (H7), from there it collected in the basement of the Ryebrook electrical station. Of the 22,000 litres of sodium hydroxide that spilled from the day tank bund, it was estimated that 7,000 litres were recovered from the Ryebrook Substation, 5,090 litres were recovered from the manholes and the material surrounding the manholes and 650 litres were recovered from the tarmacadam where the spill occurred. 9,260 litres of sodium hydroxide were unaccounted for. An Incident Investigation and Risk Assessment was carried out on the incident.
This concluded:
. No sodium hydroxide has entered the groundwater monitoring wells.
. There is no threat to the River Rye flora and fauna as a result of the spill.
. There is little or no sodium hydroxide remaining at the Intel site. It has undergone a series of chemical reactions and has been converted to the carbonate and bicarbonate salts.
Duration: 160 minute
Description of Actions Taken: . As a standard precaution, the contained storm system was
immediately diverted from the retention pond to the AWN and the retention pond outlet to the River Rye was shut down.
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Annual Environmental Report 2003 1 26
.
The EPA was notified on the 3rd of August and they visited the site in
the 5’h of August to review the incident and take samples of the River
Rye, all of the results were within normal range. External consultants were engaged to advise on actions to be taken
and to assess the overall impact of the incident. All potential pathways for caustic solution dispersion were identified, it
was determined that the main pathway by which the spilled liquor was
dispersed from the spill site, was entry into an electrical services
trench.
All electrical equipment that came into contact with the sodium
hydroxide, was decontaminated using water and the contaminated
water was collected at each manhole using a vacuum tanker to
minimize seepage into the ground.
With effect from 3rd August a monitoring regime for the Retention Pond
was implemented, all results were within normal range. The retention
pond was reopened after 30 days of sampling.
A monitoring programme of the ground water in the area of the spill
was implemented on the 3” of August.
Additional monitoring wells were drilled to allow a detailed examination
of the geology and to enable more detailed monitoring of the
groundwater between the back of the site and the River Rye.
A groundwater control level concentration was set at 500mg/l sodium
and a trigger level was set at lOOOmg/l sodium. To date the highest groundwater concentration of sodium was 217mg/l, which was
adjacent to the spill and therefore no remediation has been required.
The Risk Assessment carried out concluded that based on the monitoring results to date no remedial action will be require
A monitoring regime for River Rye both upstream and downstream
commenced ~‘5’~ August. The River continued to trend in the normal
range. The Risk Assessment carried out for the incident concluded
that the caustic spill would not pose any threat to the River Rye flora
and fauna. Investigative inceptor trenches were excavated and inspected to
determine whether there were any seepage form ducts/manholes. The
ground in the affected area consists of clay and therefore presented
natural containment abilities. Soil and silt from the manholes was
removed and stored in corrosive barrels. Results from all the samples
taken post spill illustrated no measurable changes.
Authorities Contacted: EPA, KCC, ERFB and Duchas
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2 ‘.
, : AI-&I Environmental Report 2003 1 27
Date of Occurrence: 1 2th August Incident Description: Unauthorised dumping on the Intel Ireland Site. Unauthorized dumping of material, by persons with no connection to Intel. Duration: Unknown Description of Actions Taken: Notification to KCC. An environmental representative from the KCC inspected the area of dumping. No report received from KCC to date on this incident Authorities Contacted: EPA and KCC
Date of Occurrence: 14’h~August . Incident Description: pH’ exceedance at the Wastewater Effluent Compliance point. The pH of the EBT exceeded the IPC Licence upper limit of pH 9.5. The high pH was due to a Fab14 AWN damaged probe (B), which had failed at pH of 6.52 and retained this value when set as the controlling probe during a scheduled calibration. Hence no alarms were received because probe failed at a value with the spec range (6.5 - 9.0). This drove continuous caustic dosing for a two-hour period. There was no impact to the POTW . Duration: 2 hours Description of Actions Taken: EBT closed and FablO bypass opened until pH back in spec. Environmental trends updated to include AWN tank pH levels that will capture flat-lining of probes within spec limits. Roles and responsibilities reviewed and updated for all invasive calibration activity. Authorities Contacted: EPA and KCC
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Date of Occurrence: 128’~ August
Incident Description: Back-up of drain into a bunded area in the Fab24
construction site. Back up of drain into a bunded area on the Fab 24 construction site.
The liquid in the bunded area consisted of a mixture of ultra pure water and lime.
A small volume of the liquid overflowed the bund into an area covered by a
contained drainage system. Duration: Shours 20 minutes
Description of Actions Taken: Situation identified immediately and all
systems feeding this drain were isolated. Investigation concluded that the
contained drainage was effective and there was no impact to the surface water,
groundwater or soil.
Authorities Contacted: EPA
Date of Occurrence: 22nd October
Incident Description: Monitoring Equipment effected by a power cut due to a lightening storm:
n Fab 10 VOC Exhaust, Emission point A56:
FablO RCTO abatement unit was offline and the TOC continuous
analyser was not operational.
. Fab14 VOC Exhaust, Emission Point A112:
Fabl4 continuous analyzer was not operational.
n Weather Station Equipment:
Ambient air quality monitoring equipment for NO, and SO, was also affected but returned to normal operation directly after the strike.
n Retention Pond, Emission point SW-I: The flow meter at the outlet of the retention pond was not functioning due
to lightening strike. m Natural Gas Supply Pressure:
Site experienced an issue with the natural gas supply pressure. As a short
term solution 2 standby boilers were converted to run on diesel in place of natural gas.
Description of Actions Taken: All above equipment was repaired and
operational. In the case of running the boilers on diesel, all boilers were
reverted to natural gas fuel supply when the Fab14/F24 Natural gas was tied
into the site’s new high-pressure natural gas line (30’” October).
Authorities Contacted: EPA
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Annual Environmental Report 2003 1 29
Complaints
Condition 12.3 of the IPC Licence requires that:
A summary of the number and nafure of complaints received shall be included in the A ER.
The Public Affairs department deals with any complaint received from the public with support from the environmental department.
Public Affairs maintain a log of all environmental complaints received from the pubic. This log contains information regarding the complainant and the nature of the complaint. Each complaint is communicated to the environmental department, the complaint is investigated and an appropriate response is determined. Details of the response are held in the complaints log.
During the course of 2003 there were no complaints received.
January 0 0 0 0 0 0
February 0 0 0 0 0 0
March 0 0 0 0 0 0
0 0 0 0
June 0 0 0 0 0 0
August 0 0 0 0 0 0
September 0 0 0 0 0 0
October 0 0 0 0 0 0
2.5 SUBMISSION OF SUfViMARY INFORMATION
A copy of the AER Summary Date Table is included in the following pages. This information was also submitted to the EPA.
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- -.----. 1931215 2488692.585 83ooo 53100 38100 a2844
'50 34600 13100 22800 27131 00 59ooo 37300 4cmO 47932
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IV-d I - I - I - I 1 tva
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Annual Environmental Report 2003 1 32
4211.37 3837.85 3909.36 3791.478
0 0 0 0
0 0 375 416.03
3255.73 2506.32 2580.03 2652.12
0 0 0 0
1702.15 1235.1 1185.12 1213.29 I
0 0 375 416.03
0 0 0 0
96.09 58.34 533 37
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150202‘ Yes
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150202' Yes
140603' Yes
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Solids 2 Acid/Alkali contaminated Waste with Solvents Arsenic 2 Acid/Alkali contamianted Waste solids Lead 2 Acid/Alkali contaminated Waste Solids Mixed Solvent 3 Organic waste and Organic
Chlorinated Solvents
77.998 D’O
8.341 D’O
9.312 Df0
250.07 D’O
(c) Off-site Ekokem Oy Ab 0395YO270/1 II, Abroad 81NS0100
(c) Off-site Ekokem Oy Ab 0395’10270/111, Abroad 81NSO/OO
(c) Off-site Ekokem Oy Ab 0395\/0270/111, Abroad 81NS0100
(c) Off-site Ekokem Oy Ab 0395\/0270/111, Abroad 81NSOlOO
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Annual Environmental Report 2003 1 34
3 MANAGEMENT OF THE ACTIVITY
3.1 EMP Report for 2003
A summary of the EMP for 2003 is detailed in the table below.
j _- .‘__., 1 : ::_: i.._ 1t, . &jecfive #
(Short Term)
(Short Term)
(Short Term)
(Long Term)
(Long Term)
(Long Term)
(Long Term)
(Long Term)
(Long Term)
(Long Term)
(Long Term)
(Long Term)
-r :’
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ropic Objective Target
‘rejects required Implement the projects/studies set Complete all projects/studies by new IPCL out in the new IPC Licence within agreed timeframes.
.ab Quality Ensure high standards of quality from laboratories
Develop an audit schedule and complete to ensure 100% PAS.
Vaste Vendor Ensure high standards at Waste -acilities Vendor
Develop an audit schedule and complete to ensure 100% PAS.
iazardous Waste Reduce environmental impact of vrlanagement hazardous waste generated by
Five projects were specified in
IF0 operations. EMP 2003, target details are
given in the EMP Report
don-Hazardous lllaste
Continue to work on improving total recycling rate on non-haz
Four projects were specified in
wastes EMP 2003, target details are given in the EMP Report
-raining Iwareness
Sustain the level of environmental Develop new Environmental knowledge on the site through Awareness Class material to formal training and general include video content. Roll out awareness programs. the Environmental Awareness
Class to appropriate personnel.
\ir Emissions; Drive international semi-conductor Agree on reduction goals to be Global Warming PFC reduction agreement with Gases) industries and governments that
established by the World
levels the playing field and is Semiconductor Council (WSC)
consistent with Intel’s capability. and report emissions annually. Represent Intel Irl on EECA & IBEC Climate Change Group, drive voluntary MOA commitments.
‘FC Reduction FMAT Introduction Pursue the feasibility of introducing FMAT in place of &Fe and thus reduce PFC emissions
invironmental Sustain IS014000 Certification for Sustain the IS014000 nanagement the site. Certification for the site and
extend the certification to cover the Fab 24 when in sustaining mode.
datural tesources
Reduce normalized water demand Achieve freshwater savings of to site and consequent 10% for IF0 plant. wastewater discharge to KCC Treatment works.
latural Achieve a steady reduction in Achieve a 5% reduction in !esources utilities consumption from 1998 to utilities consumption per wafer
2003. start by Q4’2004
iorporate Be seen to be a good Corporate Undertake at least 3 Citizenship Citizen in terms of support for
environmental projects in the environmental support projects
Local Community to improve environmental awareness/ performance in the local community
24 Start Up Comply with IPC Licence and Statutory requirements during
100% compliance with IPCL and
basebuild, equipment installation Statutory Requirements
and commissioning.
Cey Date
4s specifiec in Licence
Q4’2003
Q4’2003
Variable
Variable
2003
2003
2003
2003
2003
2003
2004
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Annual ‘thronmental Report 2003 1 35
projects/studies set out in the new IPC Licence agreed timeframes.
A new IPC Licence was granted to Intel Ireland in February 2002. The licence set out a number of studies, reports and projects that must be completed within set timeframe. The aim of this Objective was to have all these studies, reports and projects completed within the stated timeframe.
21 reports were due to be submitted to the Agency at various time frames after the licence was issued. All of these reports have been issued with 100% progress against schedule.
quality from laboratories
Intel wishes to obtain the highest level of service from the environmental laboratories with which it contracts. The aim is to develop a schedule for auditing the laboratories, which will be reflective of the relative importance of each facility, and to complete all audits as per the schedule.
All existing laboratories used to sample or analyse wa’stewater, surface water or air emissions, were audited by members of Intel’s Environmental Department during 2002. The audits recommended that the audit process be repeated on a frequency of 2 years. As per the EMP a list of relevant facilities was drawn up in 2003 and an audit schedule for 2004 has been developed.
No new laboratories were recruited during 2003.
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Annual Environmental Reaoti 2003 1 36
Objective # Topic Objective Target Key Date
3 Waste Vendor Ensure high standards at Develop an audit scheduleQ4’2003
(Short Term) Facilities Waste Vendor and complete to ensure
100% PAS.
Intel is committed to ensuring that all waste generated by the company are treated
properly by licensed vendors. The aim is to develop a schedule for auditing waste
facilities, which will be reflective of the relative importance of each facility, and to
complete all scheduled audits ensure that the waste be being treated in the
appropriate manner.
The facilities used to treat, dispose of Intel’s waste vendors are to be audited by
members of Intel’s Environmental Department.
The audits will involve reviewing the following items: . sampling procedures . recording of waste/ treatment
n staff training, . analysis procedures,
n housekeeping of facility . environmental standards . reporting
Two successful Waste Audits were carried out in 2003 for handling/processing of IF0 waste, with only minor corrective actions being issued for attention. The audits recommended that the audit process be repeated on a frequency of 2 years.
The audit schedule for 2004 was developed in Q4 2003.
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Annual Environmental Report 2003 1 37
.ong Term)
L
Hazardous Reduce environmental A. Maintain water content Variable Waste impact of hazardous wastein waste solvents at Management generated by IFOpresent levels and seek to
operations. I reduce further. B. Investigate possibility of diverting waste resist bottles from incineration to recycling C. Investigate possibility of diverting some Concentrated Lead Waste (CLW) to AWN D. Investigate the possibility of fuel blending mixed solvent E. Investigate possibility of recycling CLW G. Investigate theOn Hold possibility of off-site recycling of HF/H3P04
The reduction in the generation of waste is one of the tenets of the Intel Ireland Environmental Policy. The purpose is to reduce the burden on the environment. It also has the advantage of reducing costs in the long term after the expense of the necessary changes have been paid off. The projects selected for attention are those that are judged to be achievable and which are capable of reducing the rate of waste generation from operations.
A. Water levels were maintained at 2002 levels through out 2003. A regional cross-site team was established with Israel to investigate potential water savings throughout the region. This team meets fortnightly to investigate potential ideas.
B. All facilities are currently installed for the bottle washing facility, with EHS and Air Products working on the operations specs for this operation.
C. A change to POR was requested by the IR site to implement a synthetic resin on site to treat the CLW. There is a planned trial run for ‘04 and based on the results of this there will have to be a White Paper (WP) completed. If this WP is successful there will be a possibility of diverting some CLW to AWN.
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D. Intel Ireland along with our Hazardous waste vendor Onyx Environmental
Services located a company (Scoribel) in the Belgium who could fuel blend
solvents. To ensure the company could comply with Intel’s high standards,
members of Intel’s Environmental Department audited the Scoribel site.
Solvent samples were then sent to Scoribel for investigation. Scoribel
determined that they were able to take the bulk solvent mixture and based on
this information, TFS requirements and EPA approval were sought by Intel.
The first load of Bulk solvent for fuel blending was sent from IF0 in WW47. Scoribel successfully completed the fuel blending of this waste stream. All
IF0 bulk solvent now goes to Scoribel for Fuel Blending.
E. A potential vendor was found in the UK for CLW. Intel carried out audits on
the Lambson facility, samples were sent to them, and the sample analyses proved successful. Intel then worked on getting regulatory approval from the
EPA and Onyx worked on getting TFS requirements in place. The first CLW
load was sent out Q2 ‘03. By diverting the waste stream from Physio
Chemical treatment to Recycling, our on site chemical waste recycling,
increased from 9% to 45%.
F. A potential vendor was found in the UK for recycling HF/H3P04. However on
auditing the facility, Intel were not happy to ship waste to the facility, as the
facility was still in construction mode. The facility will be re-visited when
construction has been completed.
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Annuai Environmental Report 2003 1 39
I Non- Continue to work on A. 60% recycle rate to bevariable Long Term) Hazardous improving total recycling achieved through improved
L
Waste rate on non-haz wastes Imaterials segregation and\ management, and identification of recyclable streams. B. Recycling of filter cake from HF/H3P04 treatment C. Waste reduction initiative - removal of polystyrene cups D. Introduce Lord of the Bins centres across all off ice buildings
The recycling of waste material is judged to be preferable to disposal. All non- hazardous waste material continues to be reviewed to determine their suitability for recycling. Waste segregation at source is in place for many materials. The projects focused on in 2003 were those that were deemed to have the best possibility of success.
A. In 2002, Intel Ireland achieved of 60% recycling rate of non hazardous waste. This achievement exceeded both Corporate expectations and the National Average Recycling Rate. This rate was achieved by continued focus on the segregation of waste and identification of markets for wastes. The main focus for 2003 was office recycling, with the introduction of a recycling centre on each office floor. This focused on the segregations of wastes by the individual producers, with a pilot of “Bin Free” offices in certain areas of the site. Intel also completed a review of the waste services on-site culminating in a renegotiation of the non-haz waste contract. One of the main stipulations of the new contract was that the contract owner must strive to improve on the recycling rates that were achieved in 2003.
B. A potential vendor was found in the UK for recycling filter cake from HF/H3P04 treatment. However on auditing the facility, Intel were not happy to ship waste to the facility, as the facility was still in construction mode. The facility will be re-visited when construction has been completed
C. 2003, saw the introduction of IR6 Canteen in Fab 24. IR6 Canteen now holds a range of crockery so that the employees have the choice to take the type of cup that they wish. All canteens stock reusable mugs on site, and offer a reduction in the cost of tea/coffee when people use these cups. All canteens
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Annual Environmental Report 2003 1 40
on site were issued with cup washers, aptly named ‘Fresh Cup’ so that
employees are able to wash their own reusable plastic cups.
For cultural and logistical reasons there continues to be a need for disposable
cups onsite. A desktop study was completed to ascertain which type of
disposable cup had the lowest environmental impact. From the information
currently available, it was concluded that polystyrene cups are environmentally superior to paper cups, in terms of the amount of raw
material they contain and the energy and water they consume during their
manufacture. As there is currently no viable recycle/compost route for either disposable paper or polystyrene cups in Ireland, landfill remains the only
waste management option for this waste. A British Recycling company; “Save
a Cup” plans to extend their disposable cup recycling venture into Ireland but
this is only for non-expanded polystyrene cups (Vending Machine Cups), not
expanded polystyrene cups.
D. Lord of the Bins is now established across the entire site. A pilot programme
of Bin Free offices was initially started by the EHS department, this initiative
was taken by the new IR6 Office block and now the block is entirely Bin Free,
this helped increase the use of the Lord of the Bins through out the site. Plans
are in place to extend the Bin free office idea across the site.
. , , .
Objective #
3
(Long Term)
Topic Objective Target Key Date
Training Sustain the level of Develop new 2003 Awareness environmental knowledge Environmental Awareness
on the site through formalClass material to include , training and generalvideo content. Roll out the awareness programs. Environmental Awareness
Class to appropriate personnel.
Intel believes that appropriate training of personnel is one of the key requirements of
successful Environmental Management. The following classes with a major
environmental focus currently operate on the site:-
l CS Environmental Awareness l MFG Environmental Awareness
l Hazardous Waste Management
l Decontamination
The CS Environmental Awareness Class is targeted at personnel working in the
Facilities Systems Areas. It provides an overview of the Environmental Policy and
applicable legislation. It focuses on the role of these personnel in the operation of the
environmental protection systems such as the AWN system and Scrubbers.
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Anhal Ehvironmental Report 2003 1 41
The MFG Environmental Awareness Class is targeted at selected personnel working
in specific areas of manufacturing (e.g. the Wet Etch Area). It also covers an
overview of the Environmental Policy and applicable legislation. The focus of the class is on the important of correct operations within manufacturing to minimize
impact to the environmental protection systems.
Both the CS and MFG Environmental Awareness Classes were updated during 2003.
The Hazardous Waste Management Class focuses on the detailed operational requirements for the management of hazardous waste ‘on site. The Class has been
revised in order to make it more focused.
The Decontamination Class focuses on the procedure for the decontamination of all
systems and equipment to ensure there is no residual risk to personnel or to the environment. During 2003 this class was updated to reflect changes in the
Programme.
The following is a summary of environmental training carried out in 2004 l CS Environmental Awareness - (4 sessions, 36 attended) l MFG Environmental Awareness - (12 sessions, 113 attended) l Hazardous Waste Management - (I 8 sessions, 153 attended)
l Decontamination - (31 sessions, 325 attended)
Warming Gases)
agreement with industries will deliver its contribution
and governments that levels to the target of reducing all
the playing field and is member companies’
consistent with Intel’s annual absolute PFC
capability. emissions to ten percent (on an MMTCE basis)
below the 1995 baseline
PFC emissions by 2010.
During the course of 2003 Ireland Fab Operations invested significant capital and
engineering time in the development of alternative recipes to use a replacement chemical with lower global warming potential for Chemical Vapour Deposition
equipment (tools) that currently utilise per fluorinated compounds C2Fs and CF4. This
work has been particularly challenging due to the variety of recipes with very specific
functions and the variety of types of tools on which the functions are performed within Ireland Fab Operations. Two tools were retrofitted with new gas supply lines to
deliver the replacement chemical to the tool process chambers so that testing could
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be conducted to develop alternative process recipes. 27 new recipes based on the
replacement chemical, with lower global warming potential, were successfully
developed in 2003 to be processed on 6 different types of tools. Out of a total of 34
tools C2F6 has been replaced on 2 ‘pilot test’ tools and the groundwork has been laid
for more significant progress in proliferating the replacement chemical on the remaining 32 tools over the course of 2004 and 2005. Once this project is completely
implemented it is estimated that an annual reduction in PFC emissions in excess of
20,000 metric tonnes carbon equivalent (MTCE) will be achieved.
., .,
Objective # Topic Objective Target Key Date
5 Environmental Sustain IS014000 Sustain the IS01 4000 2003
(Long Term) Management Certification for the site. Certification for the site
and extend the certification
to cover Fab 24 when in
sustaining mode.
Over the course of 2003, our external auditors; SGS Yarsley, audited Intel Ireland on
two occasions. These audits were carried out on the following dates:- . ‘13’h May 2003
. 1 8’h November 2003
The Audit in May was a regular six monthly IS014000 audit. The purpose of the audit was to independently certify that our systems on site continue to meet the standard
specified in the International Standard. No corrective actions were noted. Some
development points were noted which the company has subsequently closed.
0 The audit in November 2003 was another six monthly verification audit similar to the May audit. One minor corrective actions and some development points were noted
during this Audit. The Company has subsequently closed these issues.
Intel Corporation has worked to gain accreditation for the whole Corporation in July 2002. This Corporation Registration is held by Intel Ireland in addition to the local
Registration held from SGS Yarsley. The Ireland Site was not audited for the
Corporate accreditation in 2003, an Audit is scheduled for 2004.
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3 (Long Term)
Natural Resources
Reduce normalized water Achieve a freshwater 2003 demand to site and saving of 10% for IF0 consequent wastewater (FablO and Fab14) discharge to KCC manufacturing plant. Treatment Works.
The reduction in the quantity of water per unit of production was given in Section 2.3 of the AER, showing a 22% reduction in water consumption per unit production since 2000. The year on year improvement from 2002 to 2003 was 9%. The EMP target for 2003 was to achieve a 10% freshwater savings where percent freshwater savings is defined as follows:
% Fresh Water Savings = Fresh Water Savings Total Water Requirement
where, i
Total Water Requirement = Fresh Water Savings + incoming Fresh Water
Intel exceeded the EMP goal by achieving an average freshwater saving for the year of 14.6%.
During the course of the year 2003, measures have been maintained in place that have had the benefit of reducing our demand for fresh water on site.
l FablO Reuse Industrial Water (RIW) - This system takes the reject water from the FablO Ultra Pure Water (UPW) Plant and uses the water to feed the Cooling Towers and Scrubbers.
l Fab14 2nd Pass RO Reject Water Reuse System - This system takes the reject water from the 2nd Pass Reverse Osmosis (RO) modules within the UPW Plan and returns that water to the headworks of the UPW Plant to increase the overall efficiency of the plant. (The 2nd Pass RO Water actually contains less impurities that the incoming water)
l Caustic Dosing of the Fab14 Scrubbers - The operation of three of the Scrubbers on Caustic Dosing has been maintained over the course of the year.
In addition, further initiatives for freshwater savings were pursued in 2003. Over the course of the year, the following projects were undertaken:
l Validation, through field measurements, of the IF0 (FablO and Fab14) water balance model, the model matches actual field flowrates within 5%. This allows us to ensure water systems are working optimally and allows us to identify opportunities for further water conservation
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l Concentration cycles in FIO and F14 cooling towers were increased . Re-commissioning of Fab14 URW (Ultra Pure Water Reuse), which had been
previously decommissioned due to process issues.
l Feasibility study into the expansion of FIO RIW system to reuse waste water
from cleanroom process equipment in addition to re-use of UPW reject water.
The study has proven successful and this project will be implemented in
2004.
>bjective # Topic
(Long Natural
-erm) Resources
. . ^_ _ . , . , , . _ . . ; , . < * , . v .,__ ^ ,7 , , .
Objective Target
Achieve a steady reduction Achieve a 5% reduction ir n utilities consumption from utilities consumption per
1998 to 2003. wafer start by Q4’2004
Utilities:-
Electricity
Natural Gas
Gases/Chemicals
After careful review of the trends of utility consumption versus wafer production it
was concluded that there is no relationship between utility consumption and wafer starts. A constant cleanroom environment has to be maintained irrespective of
wafer loading.
In 2003 despite an increase in the site with the construction of Fab 24 electricity
and the expansion of Sort, energy reduction projects implemented on-site,
resulted in a saving of 250MWh for electricity and a 125MWh saving for natural
gas. These savings were achieved by the successful completion of the following
projects;
.
.
.
.
.
.
.
.
.
.
Reduce N+2 Redundancy of non-critical plant Peak Demand winter load shedding
Office HVAC - Out of Hours reduction
Unoccupied Areas - Auto Light Switches
Autoflame Control of Boilers in Fab 10 Fab 14 URW Plant
OFA time control in IRI
Vacuum Pump Coldbagging & Warmbagging
Cooling Tower Change of blowdown rates IRI Automation Room - HVAC Optimisation
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projects in the Community performance in the local
community
The environmental department supported a number of very successful environmental projects undertaken by Intel Ireland during 2003. The projects can be grouped into three main types.
l Promoting Recycling in the Community l Environmental Awareness in Schools l Planting projects
These are further discussed in Section 3.4 of this report.
Promoting Recycling in the Community a Intel Ireland have been involved in many very successful initiative to help increase recycling rates in the community and to ensure that waste is dealt with in an appropriate manner. These most significant project in 2003 was the White Good/ Computer recycling day in April 2003.
Environmental Awareness in Schools
Intel continued to play a supporting role in the promotion of the Green Schools Programme in the local area. Two of the schools that Intel has special links with; the Glebe and Colaiste Chiarain both in Leixlip, received Green Flag in 2003 and both schools have completed the programme in a year, one of the fastest times for any school.
Between March and May of 2003, Intel in association with the Liffey Champion ran a Debating Challenge for Intel’s 11 link schools. The heats all took on an environmental theme with issues such as “ Irish People don’t give a damn about the environment” being debated. Scoil Dara from Kilcock emerged as overall winners of this challenge.
There was also a successful Eco-Design Competition where local schools were encouraged to make Christmas themed items from recyclable goods and waste materials so as to encourage the reuse of materials
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Planting Projects
Many tree and shrub planting projects were organised the local community by Intel
Ireland. In June 2003, the EHS Department carried out a planting project in the
grounds of the Scout Den in Leixlip
Objective # Topic Objective Target Key Date
9 F24 Start Up Comply with IPC Licence 100% compliance with 2004
(Long Term) and Statutory requirements IPCL and Statutory
during basebuild, equipment Requirements
installation and
commissioning.
A dedicated environmental engineer was assigned to the Fab 24 start-up to ensure that all environmental programmes were in place for IPC compliance during the start-
up.
Weekly audits were carried out of the construction site to ensure that high
environmental standards were maintained during the construction phase of the project.
Projects that were co-ordinated and approved by the environmental team included:
n Bund approval
m Disposal of chemicals n Maintaining low noise levels
= CSS and storm sewer design,
n support on design issues and supporting the design teams for abatement
technologies
The environmental team co-ordinated the team who were responsible for ensuring
that chemical disposal during the PSSS/tool start-up was in compliance with the
licence. The team successfully ensured that all tools in Fab 24 were commissioned
with no impact to the Fab and there were no environmental incidents, The team was
composed of Engineering, Ops, tool owners and Trimega The team met on a daily
basis during the ramp.
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Anhtial tdvironrnental Report 2003 1 47
3.2 ENVIRONMENTAL MANAGEMENT PROGRAMME REPORT 2004
32.1 SCHEDULE OF ENVIRONMENTAL OBJECTIVES &TARGETS 2004
The 2004 Intel Objectives and Targets are made up of one short-term and ten strategic long-term projects. Objectives and Targets were chosen in order to establish realistic and meaningful improvements for that projected period. A summary of these targets and objectives is given in the table below.
(Short Term)
(Long Term)
(Long Term)
(Long Term)
(Long Term)
(Long Term)
:ompliance I required as a result of Regulatory actions within the and IS0 Audits or on-site timeframes reauired. investigations
hazardous Waste(Reduce environmental impact of IA. Maintain water content ir Aanagement hazardous waste generated by IR waste solvents at present
SITE operations. levels and seek to reduce further.
S. Investigate possibility of diverting waste resist bottles from incineration to recycling
C. Investigate possibility of diverting some Concentrate< Lead Waste (CLW) to AWN
D. Investigate the possibility of off-site recycling of HF/H3P04
Jon-Hazardous Continue to work on improving A. 64% recycle rate to be ‘Vaste total recycling rate on non-haz achieved through improved
wastes materials segregation and management, and
Training 4wareness
identification of recyclable streams. S. Recycle filter cake from HF/H~PO.I treatment
Sustain the level of environmental Roll out the Environmental knowledge on the site through Awareness Class to formal training and general appropriate personnel. awareness programs.
4ir Emissions; Drive international semi-conductor As a member of the (Global Warming PFC reduction agreement with ESIAIEECA Intel Ireland wil Gases) industries and governments that deliver its contribution to the
levels the playing field and is target of reducing all consistent with Intel’s capability. member companies’ total
annual absolute PFC emissions to ten percent (01 an MMTCE basis) below tht 1995 baseline PFC emissions by 2010.
Environmental Sustain IS014000 Certification for Sustain the IS014000 Management the site. Certification for the site.
Prepare for extension of certification to cover Fab 24
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Objective # Topic 5 (Long Term) Natural
Resources
Objective Target Key Date
Reduce normalized water demand Achieve freshwater savings 2007 to site and consequent of 25% for IF0 and Fab 24 wastewater discharge to KCC operations by 2007 Treatment works.
7 (Long Term) Natural Resources
3 (Long Term) Corporate Citizenship
3 (Long Term) Lab Quality
10 (Long Term) Waste Vendor Facilities
Reduce energy consumption on Achieve a 4% reduction in Q4 2004 site. utilities consumption per
wafer start by Q4’2004
Be seen to be a good Corporate Undertake at least 3 2003 Citizen in terms of support for environmental support environmental projects in the projects to improve Local Community environmental awareness/
performance in the local community
Ensure high standards of quality Develop an audit schedule Q4’2003 from laboratories and complete to ensure
100% PAS. Ensure high standards at Waste Develop an audit schedule Q4’2003 Vendor and complete to ensure
100% PAS.
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Annual environmental Report 2003 1 49
3.2.2 EMP Proposal For 2004
Objective 1 (Short Term)
Audit and Incident Compliance
Target
Ensure all actions raised as a result of Regulatory and IS0 Audits or on-site
investigations are closed-out of within the required timeframes.
Reason
Ensure regulatory and policy compliance
As required throughout 2004
Review the plans and status at regular Env Dept As required throughout 2004 meetings to ensure closure of the items within anv suecified timeframes.
Notify the relevant agency of closure IEnv Dept IAs required throughout 2004
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Objective I (Long Term)
Reduce environmental impact of hazardous waste generated by IR Site Operations.
Target
A. Maintain water content in waste solvents at present levels and seek to reduce further.
Reason
To reduce financial and environmental costs of treating solvent waste which contains a high percentage of water.
Project Summary Owner Key Date/Commerk Continue to test each load of waste solvent for Env. Dept. QI’OI- Ongoing
water content.
Work with Other Intel Sites to identify projectsEnv. Dept.
(if any) for further water reductions
Estimate project cost and ROI. Env. Dept.
Pilot Projects Env. Dept.
Implement Projects Env. Dept.
Q1’04
TBC
TBC
TBC
Objective 1 (Long Term)
Reduce environmental impact of hazardous waste generated by IR SITE operations.
Target
B. Investigate the possibility of diverting waste resist bottles from incineration to
recycling
Reason
To reduce the Financial and Environmental burden of solvent waste disposal.
Safety Sign-off (Ergo issue identified and to be Env. Dept ./ Q2 ‘04 resolved) Operations
Contract in place with relevant operationEnv. Dept./ Q2-Q3’ 04
procedures to divert resist bottles Contractor
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Objective 1 (Long Term)
Reduce environmental impact of hazardous waste generated by onsite.
Target
C. Investigate possibility of diverting some Concentrated Lead Waste (CLW) to AWN
Reason
Install Change if WP is accepted (CS /Env Dept ITBC
Objective I (Long Term)
Reduce environmental impact of hazardous waste generated by IR SITE operations.
Target
D. Investigate the possibility of off-site recycling of H3P04
Reason
To fully compare the financial and environmental costs of onsite treatment versus
Identify suitable waste vendor Env. Dept. Ql’ 01 Done Carry out audit of vendor. Env. Dept. Ql’ 01 Done Upon favourable audit results, carry out site Env. Dept. Q2’ 01 Done tours at Intel with Vendor Correlate Volume/Quantity data. Env. Dept. Q3’ 01 Done Review potential technology to increase Env. Dept. Q3/Q4’ 01 recycleability of the waste. (Linked to F24) Investigate waste companies who can recycle Env. Dept Q3’04 Phosphoric waste as opposed to water treatment companies Obtain EPA approval to change to waste management practices
Env. Dept. TBC
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Objective 2 (Long Term)
Continue to work on improving total recycling rate on non-hazardous wastes
Target
A. 64% recycle rate to be achieved through improved materials segregation and
management, and identification of recyclable streams.
Reason
To comply with Waste Management Act and Corporate Intel goals
Continue to work with Waste Mgt Contractor toEnv. Dept. identify and develop markets for recycled
materials.
Q4/‘02 Ongoing
Pilot of Office Waste Segregation Env. Dept. Q4/‘02 Done
investigate Office waste Segregation and theEnv. Dept. Q1’03 Done I reduction for non Haz waste
Based on Ofice Waste Segregation PilotEnv. Dept.
results, introduce office waste segregation
across the site.
Q2/3 ‘03 Done
Implement Waste Plastics recycling program Env. Dept.
Negotiate the Non hazardous waste contract toEnv. Dept.
ensure that there is an improvement in the recycling figures
Q1/‘04 Done
Q4 ‘03 Done
Monitor increase in recycling rate with vendor Env. Dept
and report out on the supplier report card if
rates are not achieved
Ql-Q4 ‘04
0
Enforce bin free zone in offices except for Env. Dept. Q2’ 04 dedicated recycling locations.
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Objective 2 (Long Term)
Continue to work on improving total recycling rate on non-hazardous wastes
Target
6. Recycle filter cake from HF/H3P04 treatment
Reason
audit was unsuccessful and Intel continues to
If positive, put in place provisions to allow theEnv. Dept. cake to be recycled.
TBC
Schedule first trial shipment
Objective 3 (Long Term)
Sustain the level of environmental knowledge on the site through formal training and general awareness programs.
Target
Roll out the Environmental Classes to appropriate personnel. Update Decontamination Class.
Condition 2.9 of the IPC Licence requires that appropriate training be provided for all
Update Decon training material to make it more interactive Env. Dept./Trg. Q2 ‘04 Sustain all environmental classes and ensure that all F24Env. Dept.PTrg. Ongoing personnel receive relevant environmental training. Update TTP package for CS Techs with reference to F24 Env. Dept. Q2 ‘04
I Roll-out Revised TTP package Env./Ops Training Q2-Q3 ‘04 I
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Objective 4 (Long Term).
Drive international semi-conductor PFC reduction agreement with industries and
governments that levels the playing field and is consistent with Intel’s capability. Continue to investigate PFC substitution which reduce emissions,
Target
As a member of the ESWEECA Intel Ireland will deliver its contribution to the target
of reducing all member companies’ total annual absolute PFC emissions to ten
percent (on an MMTCE basis) below the 1995 baseline PFC emissions by 2010.
Reason
l To support Kyoto protocol initiative to universally reduce PFC emissions.
n To show the Semiconductor industry to be a world leader in pioneering a
successful global voluntary environmental agreement
. To continue to reduce PFC emissions.
Project Summary Owner
Sustain PFC emission tracking system and report emission of Env. Dept.
GWG’s to both the EU PFC semiconductor Task Force and the Irish EPA through AER reports.
Key Date/Comment
March of each year
Drive tool manufacturers, gas suppliers and semiconductor PTD/Env.
industry to support PFC emissions reduction programme for Dept.
future technologies through Intel’s PTD organisation in Oregon.
Ongoing
tools with significant contribution towards PFC’s emissions
identified and tool
ensure no impact to product yield results from replacement
Process test production lots and analyse end of line yield data to Process Eng H2 2004
ensure no impact to product yield results from replacement of
C2F6 on nitride deposition tools.
Proliferate replacement gas on nitride deposition tools Process Eng H2 2005
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Annual Environmental Report 2003 1 55
Objective 5 (Long Term)
Sustain IS014000 Certification for the site.
Target
Sustain the IS014000 Certification for the site and extend the certification to cover the new Plant (Fab 24) when in sustaining mode.
Reason
To strengthen legal compliance and continuous environmental improvement across the site.
Q3 ‘04 - Ql ‘05 Environmental Aspects of the Fab 24 Site. Thi
Facilitate IS014000 Corporate Registration Env. Dept. Audit.
Q3 ‘04
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Objective 6 (Long Term)
Reduce norrnalized water demand to site and consequent wastewater discharge to
KCC Wastewater Treatment Works.
Target
Achieve freshwater savings of 25% for IF0 and Fab 24 operations by 2007
Reason
To conserve natural resources & reduce requirements for water infrastructure
development.
As detailed in section 2.3.1 and 3.2.2 of this report, Intel Ireland has achieved
significant reductions in water usage from 2000 to 2003. In order to continue to drive
improvements and to encompass the new Fab24 manufacturing plant into the water
conservation strategy, a new target has been developed in 2004 to span the next 3 years up to 2007. An aggressive target has been set to achieve 25% fresh water
savings by 2007. Fresh water savings is defined by:
% Fresh Water Savings = Fresh Water Savinqs
Total Water Requirement
where, Total Water Requirement = Fresh Water Savings + Incoming Fresh Water
A detailed account of the projects that have been identified to reach the target are
described in the table below.
‘,;b:)i.;*.$.> ii ~.-~,.i,~~~~i;..~~~~ ..,,: ;,-. +‘l. : .,. ..-I.‘. ^ ., ._ -. P*oject Summary Owner Key Date/
Comment Development and validation of site Water balance:
Validate the Fab24 plant water balance once high volume manufacturing Industrial Water
conditions are in effect Management Team Qtr 4 2004 (IVVMT)
Implement and maintain projects previously initiated: Proliferate Fab scrubber optimized set-points to all Fab14 dosing IWMT scrubbers Qtr 2 2004
Switch on expanded FablO Re-use Industrial Water (RIW) system IWMT Qtr 2 2004
Optimize operation of Fab24 Ultra Pure Water (UPW) Supply System to IWlvlT Qtr 1 2004 minimize the volume of UPW produced that is in excess of factory demand. Commission Fab24 Ultra Pure Water Reuse (URW) system ]IWMT jQtr 2 2004
Investigate if FablO and Fab24 scrubber blowdown is optimized Ensure Fab24 cooling towers cycle rate is optimized Develop a tool to monitor and manage existing site water conservation measures to ensure optimum operation
IWMT IWMT IWMT
Qtr 3 2004 Qtr 2 2004 Qtr 3 2004
Develop long-term project plan to reach 25% fresh water savings:
Assess the benefit and feasibility of further water conservation measures IWMT Qtr 1 2004
Develop an optimized strategy where projects with the greatest return on IWMT Qtr 2 2004 investment, in both financial and water conservation terms are selected for implementation. Implement selected projects IWTvlT 2005 I2006
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And Environmental Report 2003 1 57
Objective 7 (Long Term)
Reduce energy and electricity consumption on site
Target
Achieve a 500mwh saving in electrical consumption and IOOmwh reduction in natural gas consumption by end of 2004.
Reason
To improve energy efficiency on-site and to support the Kyoto Protocol
Objective 8 (Long Term) \ Be seen to be a good Corporate Citizen in terms of support for environmental projects in the local community
Target
Undertake at least 3 environmental support projects to improve environmental awareness/ performance in the local community
Reason
To be an “Asset fo the Community” (Intel Value)
Continue to drive Aluminium Can Recycling in local Env. Dept.
community
On-Going
Support computer hardware recycling project in theEnv. Dept.
local community.
Q2 ‘04
Work with Public Affairs to continue to have an Env. Dept.
environmental focus in Intel Involved Projects
On-going
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Objective 9 (Long Term)
Ensure high standards of quality from laboratories
Target
Develop an audit schedule and complete to ensure 100% PAS.
Reason
Validate analysis
Project Summary Owner
Make list of relevant labs Env. Dept.
Revisit Labs audited in 2002 Env. Dept.
Visit new facilities Env. Dept.
Complete Audit and Report Env. Dept.
. Key Dafe/Cokment
Done
2004
As required.
Within 1 month of
completing audit.
Objective IO (Long Term)
Ensure high standards at Waste Vendor
Target
Develop an audit schedule and complete to ensure 100% PAS
Reason
To ensure correct operation of the facilities and the proper treatment of Intel’s waste therein. Project Summary Owner Key OateKom&nf
Make list of relevant facilities Env. Dept. Done
Revisit Facilities audited in 2002 Env. Dept. 2004
Visit new facilities Env. Dept. As required.
Complete Audit and Report Env. Dept. Within 1 month of
completing audit.
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; . _ A&ha1 Environmental Report 2003 1 59
3.3 POLLUTION EMISSIONS REGISTER
3.3.1 Pollution Emission Register ( PER ) Report for 2003
This section includes an introduction to Intel’s PER and a summary of fhe
methodology used to assess these pollutants.
Introduction
The Pollution Emission Register (PER) is a requirement of the Integrated Pollution Control Licence (Reg. No. S89), as issued to Intel Ireland Ltd. Specifically, under Condition 2.4.1 and Condition 2.4.2 of the Integrated Pollution Control Licence, the following is noted:
2.4. I The substances to be included in the PER shall be agreed with the Agency each year by reference to the list spekified in the AER guidance
note. The PER shall be prepared in accordance with any relevant
guidelines issued by the AQency and shall be submitted as part of the AER.
2.4.2 The licensee shall, not later than six months from the date of grant
of this licence and thereafter as part of the AER, agree with the Agency the
list of substances to be included in the PER, and the mefhodology to be used in their determination.
As per Condition 2.4.1, Intel Ireland submitted a proposal for the PER 2003 in the Annual Environmental Repot-t of 2002 which was accepted by the EPA. This PER includes fluoride, lead and Sulfolane and a reason for inclusion of these substances has been outlined in the approved PER proposals.
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Summary of Methodology for substances requiring a full PER.
Sulfolane
Sulfolane is a component chemical of the substance PRS3000, which is used in the lithography area as a photoresist stripper. PRS3000 contains
approximately 4060% sulfolane. It is a potential skin and eye irritant if
exposure to high concentrations occurs. It is a T.A Luft Class II Volatile
Organic Compound.
The estimate of the usage of sulfolane on site was carried out based on
direct measurement and mass balance. The mass balance is based on the
year’s consumption of sulfolane. The boundaries for the mass balance as
follows:
Inputs
PRS3000 enters the Bulk Chemical Delivery System (BCDS)
OutDuts
Bulk Liquid Solvent Waste Transport Offsite
Emissions to Air ( VOC’S )
Liquid Effluent
Fugitive Emissions and Solvent Contaminated Waste
Note no sulfolane leaves on the product wafers. The methods and data
used in determining sulfolane waste streams are as follows:
Inputs:
PRS3000 entering BCDS
Chemical inventory records for totes of PRS3000 issued to the Fab are
used to determine the consumption of sulfolane.
outputs:
Bulk Liquid Solvent Waste Transported Offsite Solvent from east and west shell solvent waste storage tanks is sent
offsite in bulk tankers. For all consignments the contents of the tanker are weighed and specific analysis carried out for each component including
sulfolane. However, the results of the samples analysed may not be
entirely representative of the % of components in the bulk solvent as this
is not a mixed tank, i.e. immiscible liquids layers may be present and not
accounted for in the grab sample. Therefore this method is used to
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Annual l%ihnental Rwort 2003 1 61
estimate the quantity of sulfolane in the waste stream and a mass balance is used to confirm the results.
Emissions to Atmosphere Intel corporate VOC emissions model, based on extensive emissions testing is used to report VOC emissions to atmosphere in US semiconductor manufacturing plants to the US EPA. This model has found that the Emission Factor for sulfolane is 0.000018 of all PRS300 inputted into the system while running the P856, P858 and P859 manufacturing process. Therefore the quantity of sulfolane emitted to atmosphere from exhaust can calculated by multiplying the total volume of PRS3000 inputted by the emission factor to determine the fraction that is emitted to atmosphere.
Liquid Effluent Sulfolane emissions in liquid effluent are arrived at by the use of estimary methods. The effluent to the waste treatment plant is weekly screened for COD and the results of these analyses indicate negligible losses. The bunding and drainage used on site means that the emissions to surface waters are assumed to contain no solvents. Therefore the “Liquid Effluent” total loss is considered negligible.
Fugitive emissions and Solvent Contaminated Waste Fugitive emissions and Solvent Contaminated Waste are then estimated by means of mass balance for the purpose of the PER. Fugitive emissions are considered in more detail in a Fugitive Emission Study report submitted to the Agency where Intel have assessed fugitive VOC emissions from existing semiconductor manufacturing systems and solvent effluent systems.
The results of the PER for sulfolane are shown graphically below, the Eco- Efficiency indices are calculated as per guidelines issued by the agency. Measured emissions to air are estimated to be less than 2% of the T.A. Luft Class II licence limit.
Gross Usage: = PRS300 Solution * No. of Containers used * Fraction of solution that is Sulfolane.
Recovery: = Waste Solvent Recycled * Fraction of solvent that is Sulfolane.
Waste: = Waste Solvent * Fraction of solvent that is Sulfolane. Emissions to air and fugitive emissions.
‘. i’ , , . :
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Eco - Productivity Indices
Index of Gross Eco- Efficiency (IGEE):
IGEE = Gross Process Waste x 100
Gross Usage
IGEE = 100%
Gross usage is defined as the total usage of a given pollutant in a facilities
product line(s). Gross Process Waste is defined as the amount of pollutant that is emitted from the process via air, effluent and waste emissions. It
does not include materials incorporated into the product and is gross of
any amount recovered. IGEE of 100% was calculated for Sulfolane. Gross
process waste includes amount of sulfolane emitted as a waste, air emissions and recovered material.
Index of Nett Eco-Efficiency (INEE)
INEE = Nett Process Waste x 100
Gross Usage INEE= 14%
Nett Process waste is defined as the amount of pollutant that is emitted from
the process minus the amount of that pollutant that is recovered on or off-site.
INEE allows for recycling/reuse to be included in the Eco-Efficiency Index
determination. INEE of 14% was calculated for Sulfolane. Nett Process Waste
for Sulfolane includes the amount of Sulfolane emitted as a waste and air
emission minus the amount recovered from the recycled solvent. This is a
large improvement on 2002 when the INEE was 40% , this was due to the
fact that recycling of solvent had only begun at the end of 2002. It can be
seen from both indexes that INEE HGEE which suggests responsible management of Sulfolane as efforts have been made to recover the
Sulfolane. It is hoped that the INEE value will continue to decrease as the volume of waste solvent recycled is increased.
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2003 Sulfolane Mass Balance Liquid Emissions 0%
Air Emissions 0%
Fugitive Emissions 0%
“, Waste Solvent
100%
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Lead
Intel Ireland uses Pb 300 Lead Makeup in the wafer finishing method C4
(Controlled Collapse Chip Connect) in Fab 14. Historically (and in Fab IO), the parts of the finished die for electrical connections were left exposed
and work was carried out at a subsequent operation in a different factory.
The C4 process creates minute dots or blobs of solder (which contains
lead and tin) on the Die while they are still part of the original wafer. These dots of solder can be fused to contact areas on the final IC package. This
is a more robust and dependable technology for assembling high pin count
chips. Pb 300 is used in the C4 area, at the EEJA (plating tools), the wafer
is then passed through the Semi tools (SSP’s) and the Wet stations.
The following potential inputs/outputs are considered in the Lead mass
balance analysis. The period for the following analysis is 2003.
Inputs
Pb 300 make up
Lead Anodes
Lead Concentrate Bottles
outputs
LRW (Lead Reclaim Waste) Stream
DLW (Dilute Lead Waste) Stream
CLW (Concentrated Lead Waste) Stream
1 Used Anodes
I 1 Lead on the wafer
The streams contributing to each class of emission are summed to give a
total for each class according to:
Input
l Totes Lead make-up
l Lead Anodes in the EEJ’s baths
l Top up bottle
output
l Liquid effluent - DLW system that passes through the Ion exchangers
l Waste - CLW and LRW effluent and the lead that remains in the Ion
exchange system.
l Product on Wafer - The Lead which is deposited on the wafer
l Recovery - The Lead used Anodes *
* Lead Anodes are used in the bath in the EEJA tools, they act as a source
of Lead. Lead is deposited on the wafer and the anode replenishes the Lead make up solution. The Lead solution acts as an electrolyte.
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Air emissions
All the Lead waste transfer tanks are connected to scrubbed exhaust. Flow in the scrubbed exhaust is directed to one of the vertical countercurrent type scrubbers, which uses water as the scrubbing media. The Lead is always kept in liquid form, and the waste also contains a lot of water. The scrubber efficiency is therefore taken to be 100%. The scrubbers are operated continuously. Hence the air emission concentration of Lead from this source is calculated to be negligible, and confirmed by mass balance of other outputs.
Lead Input:
Lead Solution, which is known as Pb300 make up (2Og of Pbllitre)
arrives to the site in 275gallon totes. It is then requested upon
demand by the Fab tool (EEJA). In 2003,760 litres of Pb300 make up was consumed by C4 with a concentration of 2Ogll.
Another significant source of Lead Input to the Fab, are the Lead Anodes (weighing approximately I.&kg each). Lead Anodes are used in the bath in the EEJA tools and act as a source of Lead. Lead is deposited on the wafer and the anode’ replenishes the Lead make-up solution with additional Lead. The Lead solution acts as an electrolyte. Records are kept by the Fab on how many Anodes have been used (608 Anodes were used in 2003) as well as the weight of the Anode (I .45kg approx.), before and after usage (0.43 kg after usage approx.). Spent anodes are send offsite for recovery. From the delta anode usage, the lead input attributed to the Anodes was determined. In addition to the Pb300 make up and lead anodes, top up bottles are also used in C4 to ensure the lead concentration is kept constant at 20911. Eight gallon top up bottles were consumed in 2003 with a lead concentration of 6Ogll.
Lead Output: Product: As mentioned previously, lead forms small dots on the back of the wafer. 140,855 wafers passed through C4 in 2003. Approximately 4.Og of lead are deposited on each wafer.
Liquid Effluent:
DLW comprises of the rinse water from the C4 Wet Stations. This liquid is routed through an Ion exchange system consisting of a carbon and zeolite system. The Lead removal resin is highly selective for soluble lead in aqueous waste streams. There is a flow totaliser on the effluent side of the Ion Exchange Skid; this gives an indication of total flows on daily, weekly, monthly, yearly basis. Samples of liquid are taken on the Influent, Effluent and intermediate sample points and analysed for lead, records of Lead concentrations are kept onsite. The effluent from the Ion Exchange System
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is routed to the East Shell AWN where it is combined with other effluent
from site and discharged to the KCC wastewater treatment plant in Leixlip
via site effluent balance tank. The lead concentration in the process
effluent is monitored as a 24- hour composite sample, which is taken
weekly, at the site effluent balance tank. The limit set by the IPCL for lead
is 0.4mg/l, the lead concentration from site in 2001 has consistently been
below the detection limit of O.O02mg/l.
From the analysis carried out on the Ion Exchange influent and effluent,
the total amount of Lead removed by the Ion Exchange resin and amount
of lead entering the AWN plant was able to be determined. In 2003, the Ion Exchange resin removed 10.17kg of Lead and 13.80kg of lead passed
through the Ion Exchange into the East Shell AWN plant.
Waste:
CLW: This is shipped off in road tankers for recycling in the UK. Records of
volume shipped off and concentrations are recorded. This allowed the kg
of lead leaving site via CLW to be calculated. This contributes to one of the
outputs from the C4. In 2003, 1.74kg of lead left site as CLW.
LRW: This is maintained in the Fab at a concentration of -14.5 g/l. This
liquid is constantly being replenished. In 2003, taking into account the lead
concentration of 14.5g/l, 49kg of lead left site as LRW.
Gross Usage: = (PB300 Make up Solution) + (Weight of Anode as new *
No. of Anodes Used) + (Lead top up bottles).
Recovery: = (Weight of Anodes as new - weight of spent Anodes) * No. of
Anodes used.
Liquid Effluent: = Total Pb emitted in DLW Ion Exchange effluent
Waste: = CLW + LRW+ Lead removed by Ion Exchange resin.
Product: = Wafers through C4 * 4.5 g
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Eco - Productivity lhdices
Index of Gross Eco- Efficiency (IGEE):
IGEE = Gross Process Waste x 100 Gross Usage
IGEE = 37.43%
Gross usage is defined as the total usage of a given pollutant in a facilities product line(s). Gross Process Waste is defined as the amount of pollutant that is emitted from the process via air, effluent and waste emissions. It does not include materials incorporated into the product and is gross of any amount recovered. IGEE of 30.8% was calculated for Lead. Gross process waste includes amount of lead emitted as a waste, liquid effluent and recovered material.
Index of Nett Eco-Efficiency (INEE)
INEE = Nett Process Waste x 100 Gross Usage
INEE= 8.34%
Nett Process waste is defined as the amount of pollutant that is emitted from the process minus the amount of that pollutant that is recovered on or off-site. INEE allows for recycling/reuse to be included in the Eco- Efficiency Index determination. INEE of 8.34% was calculated for lead. Nett Process Waste for lead includes the amount of lead emitted as a waste and Liquid effluent minus the amount recovered from the lead anodes. It can be seen from both indexes that INEE >> IGEE which suggests responsible management of lead as efforts have been made to recover the Lead anodes.
Lead PER Calculations
A summary sheet detailing the lead calculations is given on the next section. The amount of lead inputted from the lead anodes comprises .of 97% of the total lead input. The remainder is made up of the Pb300 make up solution and the lead top up bottles. The figures presented on both the Pb300 make up and top up bottles are recorded figures. The lead input from the anodes is an engineering estimate based on random weights taken from new and spent anodes.
Lead outputs comprises of the product wafers, two waste streams and effluent. Similarly to the lead input, there is one dominant output; Product. 97% of Lead output from site is made up by Product. The data presented for the waste and effluent streams is based on regular sampling of waste loads and effluent streams. The weight of lead deposited on the wafer is
:
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an average and taken as 4.06g per wafer. Less than 1% of lead is routed
through the East Shell AWN plant and eventually passed through EBT with
associated IPCL effluent monitoring. On average throughout 2003, the
lead analysis at the EBT has been 1.32% of our IPCL licence limit of
0.4mgIl.
Lead PER Calculations
Lead Inputs
Pb300 Make Up Soln
Anodes
Lead Top up bottles
Wafer Starts thru C4 140.855
Assumptions 4.06
Lead Inputs
Pb300 Makeup Soln
Pb300 makeup
Pb cont.
168 Gal
760 Litre
20 g/l
15200 9
15 kg
Anodes
Weight of New Anodes
Weight of Spent Anodes
Number of Anodes used
Delta Anode Usage
I .45
0.43
608
1.02
Weight of lead Anodes used 620
Lead Too uo Bottles
MF Pb300 lead cont. 3X 8
Pb Cont. 60
Weight of Lead 2
kg
kg
kg
kg
Gal
bottles
g/l
kg
Lead Outputs
Product
Used Anodes
LRW
CLW
DLW
Lead Outputs
Product
Wafers thru C4 140,855
Avg weight of Pb per wafer 4 cl
Total Pb in Product 563 kg
CLw
Volume of CLW
Avg Pb Cont.
Total Pb in CLW
j&&
Volume of LRW
Avg. Pb cont.
Total Pb in LRW
517390 I
3.4 mg/l
1.7 kg
3400 I
14.5 g/l
49 kg
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Total Lead inputs
Lead Input
Recovery
Gross Usage
638 kg
261 kg
899 kg
Liquid Effluent
Waste
Product
13.80 ks
61 kg
563 kg
IGEE Gross Process Waste x 100
Gross Usage
INEE Net Process Waste xl00
Gross Usage
IGEE
IGEE
INEE
INEE
336 x 100
899
(37.43
75 x 100
899
18.94
Avg Flow rate
Avg. Pb cont.
Total Pb removed in DLW
Total Pb in AWN
Total Lead Outputs
470.25 m3/week
0.42 kg/week
10.17 kg
13.80 kg
(638Ikg
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Fluoride
Intel Ireland uses compounds containing fluoride in a number of process
steps in the manufacture of semiconductors. During the process the wafers
pass through each of the functional areas a number of times to build up a
complex 3-D device on the surface of the wafer. Fluoride is used in its
different forms in the following steps.
Difhsion
Diffusion is a method of introducing layers to a semiconductor wafer under
high temperature conditions. There are two main processes that occur in
diffusion: oxidation of layers in which oxide is grown on the surface of the
wafer and diffusion of layers in which implanted material is dispersed into
the substrate of the wafer. Both of these processes occur in a thermal
quartz tube in an electrical furnace known as a vertical diffusion furnace
(VDF).
Principal
Fluoride
containing
Chemicals Used in Diffusion
HF (Gaseous ).
Potential Emissions with
Environmental
Significance
Fluoride
containing
compound discharges to air.
Treatment of Emissions
Fluoride is scrubbed out at the Point
of Use(POU) scrubbers before
being scrubbed by the acid gas
scrubbers. POU Scrubber liquor
drains to HF waste treatment plant.
HF Acid solutions
Acid solution to
effluent
HF Acid drains to HF waste
treatment plant prior to treatment in
AWN.
Etch
In the etch area, the patterns created in lithography are transferred into the underlying layer of material on the wafer’s surface. There are two types of
etch processes used, wet etch and dry etch. Wet etch is typically performed by immersing the wafers in an acid solution in wet benches. The
resist prevents the etch from removing material underneath, but where the
resist has been developed off, the etch forms a pattern by removing the
exposed unprotected layer. The wafers are then rinsed in deionised water and dried in a spin rinser dryer or vapour jet dryer. Dry etch is done in a
vacuum chamber called a plasma etcher that partially ionises gases which
carry out the etching process. Various gaseous mixtures are used to selectively etch each particular material type.
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Principal
Fluoride
Chemicals
Used in Dry
and Wet Etch
Dry etch: PFC
gases,
Potential
Emissions with Environmental
Significance
Per fluoro
compounds
(PFC) emissions to air
Treatment of Emissions
Gaseous emissions from dry
etch are extracted to the scrubbed exhaust with most
tools having point of use
scrubbers. Liquor of scrubbers drains to HF treatment plant
Wet etch: HF Acids and
of various corrosives to
concentrations effluent
HF acid sent to the HF waste
treatment plant and
subsequent/y to the AWN with
air extracted to scrubbed
exhaust
Thin Films
In the thin films functional area, thin films are deposited onto the wafer
surface and are used to create conductive interconnects between layers,
electrical isolation between components or protection from the environment. There are several types of processes: Ion Implantation,
Chemical Vapour Deposition, and Physical Vapour Deposition (or
sputtering).
/on implantation is used to introduce impurities or ‘dope’ the silicon with
materials such as phosphorous, boron or arsenic. The implant is done
under vacuum where a dopant or source material is ionised, accelerated through a voltage and shot into selectively exposed regions of the wafer.
Implantation changes the electrical characteristics of specific areas of the
wafer.
Chemical vapour deposition consists of reacting two or more gases in a
chamber to form a solid film on the wafer surface. This layer can be either
an insulating or conducting layer depending on the process.
In Physical Vapour Deposition or sputtering, material - usually a metal - is
physically dislodged from one location, a source electrode and deposited
on to the wafer’s surface, which is placed on the other electrode.
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Principal
Fluoride
Chemicals
Used in
Thin Films
SiF4, WF6,
5F3, NF3,
Geh PFC’s,
Potential Emissions
with Environmental
Significance
Per fluoro
compounds (PFC)
and fluoride
containing
compound
emissions to air
Treatment of Emissions
All emissions extracted to acid
gas scrubbers.
Planarisation
Planarisation or Chemical Mechanical Polish as it is otherwise referred to,
involves polishing back the surface of the wafer to achieve a uniform flat
layer. The wafer is polished both chemically and mechanically by the rotation of the polish head in contact with the wafer using an abrasive
slurry solution. No Fluoride is used in this process step.
The following potential inputs/outputs are considered in the Fluoride mass
balance analysis. The period for the following analysis is 2003.
Inputs Fluoride Containing Gases
Fluoride Containing Chemicals
outputs Fluoride in Air Emissions
Fluoride in Water Emissions
Fluoride in the Solid Waste
Accumulation of Fluoride in
Systems
The streams contributing to each class of emission are summed to give a
total for each class according to:
Input Fluoride in Process Chemicals and Gases.
output n Liquid Emissions
All Liquid HF waste from the etch process is treated in the HF treatment plant. The liquid material from the POU scrubbers used to
scrub the emissions from diffusion and etch process also goes to the HF treatment Plant.
Fluoride removed in water by the action of the Acid Gas Scrubbers
is directed to the AWN system.
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Annual Environmental Report 2003 1 73
l Air Emissions
Fluoride is scrubbed out by the action of the Acid Gas Scrubbers, the majority of fluoride is removed by the action of water is sent to the
AWN and the remainder is emitted to atmosphere. This is 0.1% of total
fluoride used.
l Solid Waste
Fluoride in the calcium fluoride cake is sent for disposal off-site. Approximately 90% of total fluoride used on site.
l Accumulation
Fluoride also accumulates to a minimal degree in systems as a salt of
various compounds.
Fluoride Input: Fluoride is inputted into the process in both a gaseous and liquid state. In
the liquid phase fluoride comes from ammonium fluoride and hydrofluoric acid at different concentrations.
In the gaseous phase’ fluoride comes in various form e.g. nitrogen
trifluoride, sulphur hexafluoride and PFCs e.g. trifluoromethane.
Fluoride Output:
Product: The amount of fluoride that is incorporated into the product is miniscule.
The etch process uses fluoride to remove layers so no fluoride is added to the chip. In Diffusionand Thin Films tiny amounts are added to the chips in
nano gram (1 O-‘) quantities.
Liquid Effluent:
Liquid containing fluoride from the etch process and the effluent from the
POU scrubbers is sent to the HF treatment plant. In this process the waste liquid containing fluoride is reacted with anhydrous calcium hydroxide i.e.
lime. The lime and the fluoride react together to form an insoluble calcium
fluoride solid called a calcium fluoride cake. The liquid proportion of the
waste is water with a small amount of fluoride still in solution. The reaction
is as follows:
2HF (waste) + Ca(Ol$ (Lime) ---) CaF2 (Cake) + 2H20 (liquid)
The liquid effluent from the HF treatment is sent to the relevant AWN for
neutralization and from there it is discharged to the site Effluent Balance
Tank (EBT) prior.to being sent to the KCC Waste Water Treatment Plant at Leixlip. The fluoride concentration in the process effluent is monitored as a
24- hour composite sample, which is taken weekly, at the outlet of the
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EBT. The limit set by the IPCL for fluoride is 20mg/l, the fluoride
concentration is consistently well below this level and the average
concentration for 2003 was 2.99 mg/l.
The blowdown from the main acid gas scrubbers would also have low
concentration of fluoride as well as some other dissolved acid and this
material would also be sent to the AWN and subsequently monitored at the
EBT.
Air Emissions:
Because fluoride gases are used in the Thin Films and Diffusion fluoride
air emissions are produced. In the Wet Etch process hydrofluoric acid is heated and vapours are produced. These emissions are scrubbed by using
the POU scrubbers and/or by using the acid gas scrubbers. Flow in the
scrubbed exhaust is directed to one of the vertical countercurrent type scrubbers, which uses water as the scrubbing media.
Waste: The solid waste from the HF treatment is called calcium fluoride filter cake.
It is a non hazardous by product of the precipitation of fluoride by reacting it with lime. The waste is currently being disposed of in a licensed landfill.
Accumulation:
Fluoride salts are easily formed with almost all elements. These
accumulate in systems where they are used, in pipe work, scrubber media
and sumps. This accumulated material will eventually end up as waste material and would be tracked as the waste is removed.
Gross Usage: = (fluoride containing gases) + (fluoride containing
chemicals).
Liquid Effluent: = Total fluoride measured in the EBT effluent
Air Emissions: = Total fluoride measured in the acid stacks
Waste: = Calcium fluoride filter cake and other waste material
Eco - Productivity Indices
Index of Gross Eco- Efficiency (IGEE):
IGEE = Gross Process Waste x 100
Gross Usage
IGEE = 100%
Gross usage is defined as the total usage of a given pollutant in a facilities product line(s). Gross Process Waste is defined as the amount of pollutant
that is emitted from the process via air, effluent and waste emissions. It does not include materials incorporated into the product and is gross of
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: ‘Andal Environmental Report 2003 1 75
any amount recovered. IGEE of 100% was calculated for Fluoride. Gross process waste includes amount of fluoride emitted as a waste, liquid effluent and air emissions
Index of Nett Eco-Efficiency (INEE)
INEE = Nett Process Waste x 100 Gross Usage
INEE= 91.57%
Net Process waste is defined as the amount of pollutant that is emitted from the process minus the amount of that pollutant that is recovered on or off-site. INEE allows for recycling/reuse to be included in the Eco- Efficiency Index determination. INEE of 91.75% was calculated for fluoride, 10% of the gas cylinders are recovered. With further efforts on going to recycle the calcium fluoride cake this will allow some of the waste to be recovered and therefore reduce the INEE figure further below the IGEE figure.
Fluoride PER Calculations
A summary sheet detailing the fluoride calculations is give on the next section. The amount of fluoride inputted. from the chemicals and gases comprises of 94% of the total fluoride input. The Gross Usage differs from the Input because not all the cylinders of gases are used to completion because there is usually a “heel” of about 10% left in the cylinder after it is changed out.
Fluoride outputs comprises of the waste, water and air emissions. The data presented for the water and air emissions is based on weekly and quarterly sampling respectively. The quantity of waste in fluoride was calculated by use analysis of the calcium fluoride filter cake and analysis of waste loads.
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Fluoride Inputs
Gases containing Fluoride
Chemicals containing Fluoride
Fluoride Inputs Fluoride Outputs
Gases containing fluoride 29.6 Tonnes
Chemicals containing fluoride 19.8 Tonnes
a 10% of the “Heel” in Gases
Total fluoride Gross Usage
Less “Heel” in Gas Cylinders
( returned to suppliers )
Fluoride Input
Fluoride PER Calculations
4.55
53.95
4.55
49.4
Tonnes
Water Emissions 7.6 Tonnes
Air Emission 0.04 Tonnes
Waste (Non Hazardous) 41.7 Tonnes
(as inert calcium fluoride
to landfill)
Tonnes
Tonnes
Tonnes Fluoride output 49.4 Tonnes
Fluoride Outputs
Waste Water
Waste
Air Emissions
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Atinual’EnvironmentaI Report 2003 1 77
3.3.2 Pollution Emission Register (PER) Proposal for 2004
As detailed within section 24.2 of Intel Ireland’s IPC licence number 589
an agreed list of substances to be included in the PER for 2003 should be documented within the AER in 2002.
2.4.2 The licensee shall as part of the AER, agree with the Agency the list of substances to be included in the PER, and the methodology to be used in their determination.
From the master list of materisls, and through this annual environmental
report, three substances are now been proposed to the Agency for full PER for the year ahead 2002.
* Total Fluoride * Lead * Copper
On the 16/05/00, a request was received from the EPA to include Total
Fluoride in the PER for 2000. 2002 was Intel’s third year to develop a PER on total Fluoride and the Intel would anticipate completing a total Fluoride
pollution emissions register for several years to ensure a robust mass
balance system is in place.
Lead is used to create bumps on the processor for electrical
interconnection connectivity to the mother board or other applications.
Lead is a list II “grey list” substance under the directive 76/464/EEC and is also one of the substances mentioned in Water Quality (Dangerous
Substances) Regulations, 2001, SI 12/2001. Consequently Lead has also been selected for PER due to its material classification. Intel have
completed lead PER’s in the past and will continue to do this in 2003.
In 2004 it is proposed that a PER will also be completed for Copper.
Copper was selected for inclusion in the PER process as it is included in
the PERL, Copper will be used in Fab 24, copper treatment and collection
system have been constructed to manage the copper waste streams from
the new facility and it is planned that the site will continue to operate well below the IPCL-limit of 0.3mg/l copper for wastewater.
However while the average concentration of copper discharged to KCC
wastewater treatment works in 2003 was only 10.3% of the IPCL limit, the
quantity of copper in Intel’s wastewater has increased since 2002 due to
ramping of tools in Fab 24. The mass of copper discharged to wastewater in 2003 was <76kg, while this is 5% of the IPCL annual mass emission limit,
it is over the PERL Threshold Limit of 50kg/year.
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A copper PER will provide a useful tool in the management of the new
copper collection and treatment systems on-site.
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3.4 EMS Activities for 2003 The team of dedicated environmental engineers, along with employees across the site maintained the focus on EMS during 2003.
The first item looked at tias the Site Environmental Policy and this was updated, reviewed, ratified and signed by the Site Committee (Senior Business Unit Managers on site). The updated copy was then posted at specified locations on the site and uploaded on our internal and external web pages.
During 2003 a focus activity remained the compilation and submission of reports as part of the new environmental licence issued by the EPA in 2002.
Regular environmental updates were presented to the Site Committee and these covered various topics including compliance performance, media programme updates (air, water, waste noise etc.) legislative updates, system improvements reviews etc.
On the training front all new employees coming on site undergo orientation training, which includes an environmental section. For employees working in specific areas of the site there is also a requirement to complete other environmental related classes e.g. Environmental Awareness, Hazardous Waste Management, Decontamination. In relation to these classes 62 sessions in total were conducted with 532 employees attending. All of this training is tracked as part of employees certification training. In addition Corporate Service Technicians have environmental training included as part of their system training and this is also tracked. The training materials for the technicians training packages were reviewed and updated. For the team of environmental engineers continuing professional development and environmental training continued in order to ensure that they remain abreast of current developments.
In order to ensure that the systems and the EMS in general are operating successfully audits take place on a regular basis. Two IS0 14001 audits were conducted by an external registrar in 2003 in May & Nov) and there were no major findings as a result of the audits. Suggestions for further improvements were given and these were completed. Team members who are certified Environmental Auditors, following completion of a 3 day externally certified course - IEMA approved, conduct internal audits. The certified auditors completed over 36 internal audits in 2003. Accompanying the auditors on all audits would be employees who either own the location, the system or the equipment being audited. This ensures greater awareness of the environmental requirements and clear understanding of any developments recommended.
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In addition to training, communications to employees on the environment is
primarily through updates at regular dept / group meetings, an environmental newsletter and through posters and the internal web site.
Any significant changes to the site EMS have to be approved by the Site
Committee.
Some of the key projects that have taken place internally include:
Environmental Newsletter
The publication of Internal newsletters, titled ‘Environmental News @ Intel’,
continued and two were published during the year. The intent of these
publications is to keep employees abreast of the main environmental developments across the site and also increase their site and general
environmental awareness. The 2003 publications included articles on such
items as an overview of F24 from an environmental perspective, article on a
community award that Intel Ireland received, review of our progress against environmental goals, The ‘Intel Wild’ collection (part of an internal
awareness campaign). An insert was also compiled detailing environmental
events completed with local schools and within the local community.
Environmental Web Sites
Intel Ireland also has an internal environmental web site and this continued
to be maintained throughout 2003. The site outlines our mission statement,
policies and environmental programmes from Awareness and
Decontamination to IPCL and EMS and beyond. Each of these areas in turn
is divided into smaller more manageable elements of environmental
programmes.
The external web site was also maintained and this provides the public with
an overview of Environmental matters at Intel Ireland. The web site can be
viewed at: http://www.intel.com/ireland/about/environment/index.htm
The key environmental projects with an external/community focus undertaken
for 2003 were as follows.
Young Scientist Competition 2003
In January 2003, the first Intel Environmental Award was granted at the national
Young Scientist of the Year competition. The Award was given to the students Sam
Kit-wan, Jack Fleetwood and Oliver Galbraith from East Glendalough School, Co.
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