Cellaxy EmbossingF O R H I G H - P R E C I S I O N , C O S T- E F F I C I E N T E M B O S S I N G

Cellaxy Embossing

There is a clear trend in packaging printing toward products

with increasingly elaborate finishing. The demands relating

to fineness and detail are particularly high for embossing

techniques. Cellaxy for embossing meets these require-

ments, combining precise embossing forms with superlative

cost-efficiency.

The optional embossing module gives Cellaxy all the features

it needs to produce impressive embossing forms. A machine

equipped for embossing performs fully automated multipass

engraving with an engraving depth of up to 800 µm. Both 2D

and 3D embossing forms are produced in the highest possible

quality. The print results achieved with Cellaxy embossing

processes are highly impressive thanks to long-lasting tactile

qualities and optimum attention to detail. This applies equally

to micro-embossing over large areas and background textures.

Cellaxy for embossing far outperforms all established milling

and laser technologies in terms of quality, availability, and

production speed.

HELL Gravure Systems GmbH & Co. KG Philipp-Reis-Weg 5 24148 Kiel / Germany

Tel. +49 431 2377 0 Fax +49 431 2377 1235

info@hell-gravure-systems.com www.hell-gravure-systems.com

Technical and functional details All the benefits at a glance

Subject to design modifications. Errors excepted.

Version: A5

Multipass engraving

The depth achieved by Cellaxy per engraving pass depends

on the material. With copper, for example, it is 20 µm. The

multipass process incorporates several engraving passes to

achieve the engraving depths of 150 to 800 µm commonly

encountered in embossing. The special feature of this process

is the reversal of both the feed direction and the cylinder’s

direction of rotation between the individual engraving passes.

The position of the focal point is automatically adjusted to suit

the relevant engraving depth.

3D engraving

Cellaxy is controlled by 8-bit grayscale TIFF data. The engrav-

ing depth tracks the gray scales in the image signal with

exceptional precision, generating three-dimensional con-

tours in each individual engraving pass.

Wet chamber

Cellaxy Embossing is equipped with a wet chamber that stops

burn-off adhering to the cylinder surface by applying a release

agent to this surface throughout the laser process.

Embossing Disk software

The Embossing Disk software that comes with Cellaxy

Embossing configures the embossing job and calculates

the data layers required for the individual engraving passes.

It is normally installed on a separate computer and ensures

efficient preparation of embossing engraving work.

Materials

Cellaxy is used to laser all kinds of materials, including copper,

zinc, nickel, steel, aluminum, and brass.

MaterialDepth per

engraving pass 180 µm total depth 360 µm total depth 600 µm total depth

1 x 600 W 2 x 600 W 1 x 600 W 2 x 600 W 1 x 600 W 2 x 600 W

Zinc 30 µm 186 min. 102 min. 372 min. 204 min. 620 min. 340 min.

Copper 20 µm 333 min. 180 min. 666 min. 360 min. 1110 min. 600 min.

Steel 10 µm 810 min. 432 min. 1620 min. 864 min. 2700 min. 1440 min.

Sample cylinder 0.7 m2

Maximum performance with Cellaxy Embossing.

The optional embossing module gives Cellaxy a wider range of applications.

Image • Vignette Text • Graphics

Image • Vignette Text • Graphics

Embossing