FNDE-30-01-0E · collaborative performances with rock musicians, Kyogen performers, or the like. Mr. Takeda explains his own driving force as a calligraphy artist is this:“ From

FUJITSU SEMICONDUCTOR MAGAZINE

Vol.30 No.1FIND 2012［NEW PRODUCTS］

6MHz Synchronous Rectification Buck BoostDC/DC Converter ICMB39C326

4M-bit Parallel FRAMMB85R4001A/MB85R4002A

Embedded RFID development kitMB9BF506RA-EVB-RF-01

FR81S family of 32-bit microcontrollers MB91520 Series

Transcoders, H.264 Transrating FunctionMB86M01/MB86M02/MB86M03

［TECHNICAL INFORMATION］Enhancement specifications of FRAM productswith standard SPI interface or standard I2C interface

［INTERVIEW］KIZUNA - The Human Bond Bonding and Bonded ①Japanese calligraphy artist　Souun Takeda

Souun TakedaJapanese calligraphy artist

02 FIND Vol.30 No.1 03FIND Vol.30 No.1

A style of calligraphy born out of the yearning to convey has gained popularity

　There is a calligraphy school in

a residential area of Fujisawa city,

Kanagawa Prefecture, close to the

Enoshima coast. The classroom has a

capacity of 250 students and is almost

always packed to the brim with boys,

girls, men, and women of all ages, from

various walks of life, eager to learn the

art of Japanese calligraphy. The teaching

in these classes is conducted four times

a week and is very different from the

teaching in the usual calligraphy schools.

　Here people put their happy or sad

experiences into words. They write those

words in calligraphy, or write the Kanji

characters almost like pictures so that

the meanings of those characters can

be understood even by foreigners. In

some classes they do ‘relay calligraphy'

in which a few people form a team and

each member of the team writes one

stroke of a letter. Several teams compete

against each other as to which team has

written the most beautiful letter. In other

classes the students leave the classroom

to feel the wind or sunshine, and then

express their emotions on the spot using

calligraphy.

　The head master of that calligraphy

school is Mr. Souun Takeda, who is a

popular and well-known calligrapher.

He is known for many of his artistic

creations among which is the logo mark

“K”, of the supercomputer K, which

made headlines for achieving the world's

fastest computing speed.

　His ingenious method of teaching

calligraphy completely discards the

traditional methods that train the

students to sit in front of the writing

paper with a quiet mind, write neat

letters according to a writing model, and

acquire titles. His original method has

been praised even on the TV program

“the most wanted lesson in the world”

which top personalities from different

fields give lectures that can be enjoyed

even by adults. These days, not a day

goes by without us seeing one of his

creations in the titles of movies or TV

dramas, on logos of products, or in

collaborative performances with rock

musicians, Kyogen performers, or the

like. Mr. Takeda explains his own driving

force as a calligraphy artist is this: “From

long ago, I have been far more easily

thrilled than other people. For example,

if I found a shop selling very tasty

ramen noodles I was so overwhelmingly

excited that I desperately wanted to go

around telling everybody that the ramen

noodles in that shop were great and that

they should certainly go there and try

them. I have found that the best way

of conveying my message to people is

S o u u d an T a k e

I N T E R V I E W

Making somebody happy is also happiness itself.Being thanked for making somebody's heart move becomes a drivingforce for one's own growth. The happiness of communication with the hearts of the viewers iswhat supports the calligraphy of a popular calligraphy artist.

The Great Power of Just a Single Letter WrittenTriggered by the Thoughts of the Joy of MovingPeople's Hearts

KIZUNA – The Human Bond Bonding and Bonded　1

through calligraphy.”

　“Even the ‘K’logo was born out of my

eagerness to convey my feeling that a

large number of scientists and engineers

had worked very hard to become

number one in the world. Although I

do not understand anything technical

about computers, behind achieving the

number one performance in the world is

the culture and history of Japan as well

as the nature of the Japanese people. I

put my eagerness into conveying these

factors of greatness into my creation of

this logo.”

　The cheerful words coming from

this husky man standing over 180

centimeters tall are full of what he

calls his easily thrilled nature and his

extraordinary eagerness to convey this

thrill to others. But he feels that his

calligraphy expresses his feelings more

No human can live alone.Every individual is supported by many other people and everyindividual supports many others. We are all intertwined by humanbonds and we live our lives laughing at times, and crying at times.What is it that is born out of these many human bonds that arenurtured by the people raising us?

It is very easy if one only wants to write neat letters and get a title. But the process of reaching there is in itself interesting, says Mr. Takeda. The happy lessons that do not necessarily follow the preset model are a means of conveying this fact to the students. There is never ending laughter in the classroom every day.

Text:Akira YokotaPhotograph:Yukio Yoshinari


strongly and more deeply than the words

themselves. Even his singularly unique

lessons at the calligraphy school are

mediums for conveying to the students his

feeling that calligraphy is for conveying

one's own feelings to others.

　However, he says that this success has

not been achieved by his strength alone.

　He says, “I did not become what I

am by thinking I want to be this or that.

While I was struggling hard to find out

what I can do and what only I can do, the

present Souun Takeda is what he is now

thanks to a large number of people.”

His original style of calligraphy was pursued because he wanted to see the people surrounding him happy

　During his childhood Mr. Takeda

had been trained thoroughly in the

fundamentals of Japanese calligraphy by

his mother. But he did not actually think

of a life as a calligrapher right from the

beginning. After learning information

science in the university he joined a large

telecommunications company.

　“When I was very young I had taken

various individual enhancement lessons

including calligraphy. I did not even select

my first job with any serious intentions,

but just happened to join that job by

chance,” he says. But in that place of

work one day he met with a very fateful

incident that led to the blossoming of his

own latent talent.

　“By chance my boss happened to

see my calligraphic writing and liked it

so much that he asked me to write his

name because he wanted to use it on

his personal business card. Saying that it

is an easy thing to do, I wrote it and gave

it to him. Very much to my surprise he

was extremely happy and immediately

my calligraphy became so popular that

one by one all the people there started

asking me to write their names.”

　At that point, Mr. Takeda took a bold

step. After working there for three years,

he suddenly left his job and started a

shop on the internet making business

cards. People around him were shocked

at the boldness of throwing away his

stable and secure life in a big company.

Some of his colleagues and superiors

tried to stop him from making such a

risky decision.

　Yet he smilingly looks back, “I was

happy because everybody else was

happy to see my calligraphy, and I

wanted more and more people to feel

that same happiness. At that time, I

imagined in my head all people in the

world feeling happy about the business

cards I had written.” That was just what

an easily thrilled person would do.

　Not that he had any big grouse against

his life in that job at the large company.

He did not even have any confidence that

he could make a living as a calligrapher.

But he says once the thought came to

him, he could not help acting accordingly.

“Looking back, perhaps at that time

I had selected my own way of life for

the first time in my life. It was possible

because I was young. While I had gone

to many individual development classes

long ago, I had been making selections

according to what my mother and other

people surrounding me said. When there

was something that I was interested in I

could not see anything else once I made

up my mind.”

　As other people had worried, the

internet shop selling business cards did not

take off for some time. He then started a

calligraphy school at home and distributed

pamphlets about it, but it was not possible

for an unknown young man to attract any

students.

　On one of those days, Mr. Takeda had a

chance meeting that would later prove to

be another turning point in his life. He was

enchanted by a street musician playing

his music in the street, and he thought

of writing calligraphy on the street and

wanted to make people happy.

　“In the beginning I was very shy, and

would pack up and run away when

people walked past while I was spreading

my tools on the footpath. I may appear

different but I am extremely timid and

full of various complexes.”

　While being resolute in definitely doing

things that he has decided to do, being

shy and afraid when actually doing it is

perhaps common to all young people.

I N T E R V I E W

However, that timidity was also one of Mr.

Takeda's weapons.

　“Actually, even my present method of

teaching calligraphy classes was born out

of the apprehension that I would not be

able to compete with other calligraphy

schools if I followed the conventional

methods of teaching, and the result of

my thinking was to search for something

that only I could do. I had this strange

conviction that I would definitely not

succeed if I followed the method of

teaching that everybody else was using.

My decision to go ahead with a teaching

method that only I can do is the another

side of my complexes.”

　Anyway, the street performance of

calligraphy that he courageously started

made him rediscover the great power

that calligraphy can have.

　“A young boy who was looking from

afar came forward to buy a calligraphic

rendering of “Hitamuki' (meaning

‘dedicated’ or “single-minded’) clasping

a tiny coin in his hand. A young lady who

asked me to write “Ai” (meaning ‘Love’),

burst into tears when I finished writing

it. Through such experiences I realized

that my calligraphy could move people's

hearts, and that in turn made me happy.

I was struck to know what great power

calligraphy had.”

　Even now he says he feels great

happiness when he receives letters or

emails from fans saying his calligraphy gave

them courage, or that a person decided

against suicide because of one of his

writings. It means more than a creation

of his getting a prize or being praised in

the mass media. It is a great feeling of

happiness for him to know that he has

contributed to someone through his

thinking or actions.

　And finally, the young man who pursued

his own way was in the limelight.

It would be great if calligraphybrings world peace

06 FIND Vol.30 No.1

　“One day a magazine reporter wrote

an article saying that there is a unique

internet shop selling calligraphic business

cards produced by a young ex-employee

of a large telecommunications company.

That triggered a number of media people

to come and write articles about me.”

　As desired, something only he could do

had attracted people to him. His unique

calligraphy lessons were shown on TV

programs and his popularity soared,

putting him in a permanent position as a

calligraphy artist. The overflowing energy

he was born with touched the hearts of

people through his calligraphy.

The power of feelings embedded in calligraphy now spreads ‘the human bond’ throughout the world

　Mr. Takeda who has become a popular

calligrapher of the times insists that he is

still a pack of complexes.

　“Even now when I appear on a TV

program, I feel dejected because I feel that

I can never beat the talents or speaking

skills of the TV artists on the program. After

all, my thought processes are negative.

I can never equal these people. Then

again I feel that they let me make them

happy through the calligraphy that only I

can do.”

　His words are strongly forward-looking,

but he says that they are the result of

his conscious effort to push himself

away from his natural tendency to look

backwards.

　“Because I am a person who tends to

think negatively, I am always trying to

correct myself into living positively.”

　However, that is probably why he can

understand the feelings of people who

have lost hope or who are in the depths of

darkness. Surely, that is why his calligraphy

can give courage to people, can save

them, and can soothe them.

　He is able today to wield his brush only

because of his ex-colleagues who made

him aware of that power, because of the

support he received from the people he

met on the streets and from the fans that

send him letters or emails. He says, “That

is why I am what I am now is thanks to

the feelings of a large number of people

and the human bond with them.”

　Even the plan for “World thankfulness

day 69” being promoted by him now

is a project that started rolling because

of chance meetings with a number of

people and their support.

　“Peace and thankfulness are things

that do not create a mental image when

merely said with words. Therefore, I feel

things may change if one day the world

celebrates a thankfulness festival even if

it not real. I wish to make June 9th 2020 a

thankfulness day. Even wars should stop

for at least that day. Initially I was talking

about this jokingly with my friends, and

one day this reached the ears of people

in the government, and now this concept

is being taken to the United Nations.”

Many a truth said in humor.

　“To realize such a day, the harmonic

force uniquely present in the Japanese

people is necessary and is something

I think that only Japanese can do.

Calligraphy is also one of those forces.

I think it can be a tool for conveying a

strong message of harmony.”

　In this context, it appears that

talk is under way to have his solo

exhibitions abroad. The bond that has

spread through his calligraphy, is now

attempting to cross borders. It would

be a wonderful thing if Mr. Takeda's

calligraphy of “Thankfulness” is hung in

the UN Headquarters on June 9, 2020.

P R O F I L E

He has published more than 20 books including collections of his art, and guidelines on the way of life that makes one's heart lighter. There are many fans of the contents that make people happy by just looking at them.

Mr. Takeda wrote this year's theme “Kizuna” (the human bond) during his lecture in the head office of FUJITSU SEMICONDUCTORS. When he faced the writing paper with a quiet heart, he wrote it with a sudden burst of energy.

Souun Takeda was born in Kumamoto city in 1975. He was trained in calligraphy by his mother, Souyou Takeda, from the age 3. He worked at NTT after graduating from the faculty of science and engineering of the Tokyo University of Science, and left his job in 2001 and started his activities as a calligraphy artist. He received the Longhuacui Art Award from the Shanghai Museum of Art and the Costanza Medicci Family Art Award in Florence, Italy. He has written the titles of TV dramas and movies such as the NHK serial drama “Tenchijin”, the movie “Kita no reinen”, and the logos of many products. He writes regular essays and columns in many magazines about living every day in a forward looking manner.

I N T E R V I E W

KIZUNA – The Human Bond Bonding and Bonded　1

KIZUNA - The Human Bond Bonding and Bonded ①Japanese calligraphy artist Souun TakedaThe Great Power of Just a Single Letter Written Triggeredby the Thoughts of the Joy of Moving People's Hearts

Power Management IC for Portable Instruments6MHz Synchronous Rectification Buck BoostDC/DC Converter ICMB39C326

4M-bit Parallel(×8-/×16-bit bus) FRAMMB85R4001A / MB85R4002A

Embedded RFID development kit withFM3 Family MicrocontrollerMB9BF506RA-EVB-RF-01

FR81S family of 32-bit microcontrollers for automotive body-control platformsMB91520 Series

Transcoders with Built-in Memory,H.264 Transrating FunctionMB86M01 / MB86M02 / MB86M03

Enhancement specifications of FRAM products withstandard SPI interface or standard I2C interfaceMore than 10 years of data retention (at 85℃)More than 1E12 (1 trillion) read/write cyclesMB85RC16 / MB85RC64 / MB85RC128 / MB85RC16V /MB85RC64V / MB85RS16 / MB85RS64

Two Employees Recognized for ”International Standardization”FY 2011 The Ministry of Economy, Trade and Industry (METI) Contribution Award for International Standardization

SCOPE

Specifications are subject to change without notice. For further information please contact each office. All Rights Reserved.

The contents of this document are subject to change without notice.Customers are advised to consult with sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU SEMICONDUCTOR device; FUJITSU SEMICONDUCTOR does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information.FUJITSU SEMICONDUCTOR assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU SEMICONDUCTOR or any third party or does FUJITSU SEMICONDUCTOR warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU SEMICONDUCTOR assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein.The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).Please note that FUJITSU SEMICONDUCTOR will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products.Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of overcurrent levels and other abnormal operating conditions.Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws. The company names and brand names herein are the trademarks or registered trademarks of their respective owners.

C O N T E N T S

［INTERVIEW］

［TECHNICAL INFORMATION］

［TOPICS］

Vol.30 No.1FIND 2012

［NEW PRODUCTS］

02

08

13

15

18

24

28

30

36

08 FIND Vol.30 No.1

NEW

PRODUCTS

09FIND Vol.30 No.1

MB39C326

This product is a power management IC for portable instruments that has a highly effective buck boost DC/DC converter, which expands the available input voltage range. It can be loaded on a small 2.15mm×1.94mm package, and can configure a power system with a small footprint at low BOM cost, with its built-in switching FET.By inputting signals such as DAC, it can control the output voltage value dynamically.

MB39C326

Introduction

　This product is a highly effective

and low-noise 6MHz buck boost

DC/DC converter IC that has been

developed for mobile instruments

using a one-cell lithium-ion battery.

With its high operating frequency

(6MHz), the inductor size can be

significantly reduced compared with

existing 2 to 3MHz products, and the

board area of the power part can be

downsized by half (Figure 1). Since

our unique buck boost circuit switches

automatically between the voltage

increasing operation and the voltage

decreasing operation against input

voltage, power is supplied stably even

when the inputting battery voltage

decreases, and the system driving

time can be expanded through the

effective utilization of the remaining

power in the battery.

Feature

・ Input voltage range: 2.5 to 5.5V

・ Output voltage: 0.4 to 5.0V

(adjustable)

　Additional resistance to the feedback

resistance inputs signals from DAC,

and the output level can be flexibly

changed (Figure 5).

・ Maximum output current: 1,200mA

(with buck topology )

　Table 1 shows the maximum output

current.

・ Operating frequency range: 6MHz

・ High efficiency with the PFM/PWM

auto-switching mode

　The DC/DC circuit features the PFM/

PWM auto-switching mode (power-save

mode) to enhance efficiency when the

load is small. The PWM fixed mode

can be operated in by setting the XPS

terminal to the H level (Table 2).

・ A full range of protection functions

　Overcurrent protection (OCP), over

temperature protection (OTP), under

voltage lockout protection (UVLO),

and a soft start function are loaded.

・ Small package

　WL-C SP（Wafer Level-Chip Size

Package）

　20-pin: 0.4mm pitch

　Size: 2.15mm×1.94mm×0.625mm

・ Lead-free/Compliant with the

RoHS directive

・ Maximum efficiency: 93%

　Figure 2 shows the conversion

efficiency at the DC/DC part of the

product.

Functions

DC/DC control method

　The internal oscillator (square-

wave oscillating circuit) operates the

synchronous rectification of the built-

in P-ch MOSFET and the N-ch MOSFET

at the predetermined frequency

(6MHz). Our unique circuit technology

allows seamless switching between

the voltage increasing mode and the

voltage decreasing mode, thereby

realizing high-efficiency operation.

PFM function

　In the PFM/PWM auto-switching

mode, the current mode switches

between the PFM mode and the PWM

mode dynamically depending on the

load current. The PFM mode enables

intermittent operation according

to load current when the load is

Power Management IC for Portable Instruments6MHz Synchronous Rectification Buck BoostDC/DC Converter IC

Photo 1　Appearance Table 1　Maximum Output Current (in the PWM Mode)

Topology Output voltage Maximum output current

Buck 3.3V 1200mA

Boost 3.3V 800mA

Table 2　Function Settings with XPS Terminal and ILIMSE Terminal

Mode XPS ILIMSELInput voltage

range (V)Output voltage

range (V) Current limit (A)

Minimum Maximum Minimum Maximum

PWM mode HH 3.1 4.8 0.4 4.2

2L

2.5 5.5 0.8 5.0Auto-switching mode between PFM/PWM

LH 1

L 0.5

Figure 2　Conversion Efficiency of MB39 C326

VIN＝2.5V（PWM）

100%

90%

80%

70%

60%

50%

40%

30%

20%

10%

0%1 10

PFM

100 1000Load current（mA）

Conversion efficiency（Vout = 3.3V，PFM/PWM）

VIN＝3.1V（PWM）

VIN＝3.7V（PWM）

VIN＝4.8V（PWM）

VIN＝5.5V（PWM）

Conv

ersi

on e

ffic

ienc

y η（

％）

Figure 1　Layout of Power Part

L

VIN

GND

GND

CIN

COU

TR1

R2

7.2m

m

6.4mm

VOUT

10.7mm

8.0m

m

R2

R1

CIN

COU

T

COU

T

VOUT

VIN

GND

GND GN

D

L

Packaging area: 1/2

MB39C3266MHz

2.4MHz

0.5μHSize: 2×2mm

2.2μHSize: 4×4mm


　・ VSEL = H

VOUT VFB R2

R1 R2＝ × ＋

VOUT VFB＝ ×

VOUT VFBR1 R2 R3＝ × ＋（）｜｜

R2 R3｜｜

VDAC VFB 1R1＝－ × ×R3

R1

R3

R1

R2＋＋＋（）VOUT

R2

R1 R2＋

・ Output voltage setting by signal

input (output is arbitrarily variable)

　By inputting DAC signals, the output

voltage can be changed arbitrarily

according to the setting formula

(Figure 5).

VOUT VFB R2

R1 R2＝ × ＋

VOUT VFB＝ ×


R2 R3｜｜


R1

R3

R1


R2

R1 R2＋

Relation between output and DAC

　Figure 6 shows the relation between

the output and the DAC when the

settings are R1＝620kΩ, R2＝110kΩ,

and R3＝330kΩ.

Application

　This product is ideal for the following

applications:

・ Mobile phones, smart phones,

digital book terminals, and PDAs　

・ Products with one-cell lithium ion

batteries (Figure 7)

・ RF power amps (PAs)

・ RF-PC cards

Operation example ofRF power amp (PA) （Figure 8）

　When a PA has low transmitting

and output power, and a conventional

battery is directly connected to it,

excessive energy is supplied to the

PA. By inserting the DC/DC between

the PA and the battery, the voltage

supplied to the PA (Vout) can be

changed and adjusted according to

the transmitting and output power,

and the power efficiency can be

improved accordingly.

High-density packaging

　Photo 2 shows an actual sample of

the high-density power part with the

product.

Evaluation board

　An evaluation board (Photo 3) that

enables easy evaluation of the product

unit is available.

small, and improves the converting

efficiency by reducing the switching

loss. The PFM/PWM auto-switching

mode and the PWM fixed mode can

be set by selecting the H level or the

L level of the XPS terminal (Table 2).

Soft start function

　The soft start function prevents

inrush current when the output

voltage starts up. The soft start time is

just 100μs (Vin＝3.7V and Vout＝3.3V).

Overcurrent protection function

　This function controls the current

to prevent higher output current than

the setting from flowing. Also, when

the output current reaches the current

limit value, the output voltage starts

dropping. The overcurrent protection

function detects current flowing from

the built-in P-ch MOSFET (overcurrent

protection function) that connects the

VDD terminal to the external inductor.

The current limit value can be selected

from three values, according to the XPS

terminal and the ILIMSEL terminal

theory, as shown in Table 2.

Over temperature protection function

　When a contact part becomes

hotter than 125℃, the over temperature

protection circuit turns off all N-ch

and P-ch MOSFETs. When the contact

part is cooled to 110℃ , the soft start

function starts outputting voltage.

Under voltage lockout protection function

　When the voltage of the VDD terminal

becomes 1.9V or lower, all circuits are

shut down. Also, when the voltage of

the VDD terminal becomes 2.0V or

higher, the soft start function starts

outputting voltage.

　Figure 3 shows a block diagram of

the product.

Output voltage setting function

・ Output voltage setting by FB splitting

resistance (constant output)

VOUT VFB R2

R1 R2＝ × ＋

VOUT VFB＝ ×


R2 R3｜｜


R1

R3

R1


R2

R1 R2＋

・ Output voltage setting by the VSELSW

terminal (selecting an output from

two values)

　Two output setting voltages can be

switched between by inputting the

VSEL terminal signal (Figure 4).

　・ VSEL = L

　 VOUT VFB R2

R1 R2＝ × ＋

VOUT VFB＝ ×


R2 R3｜｜


R1

R3

R1


R2

R1 R2＋

MB39C326

CINVDDVCCENXPSVSELILIMSELGND

VOUT

FB

VSELSW

DGND

SWOUT SWIN

COUT

DAC VDAC

VOUTVBATT

R1

L1

R2

R3

CINVDDVCCENXPSVSELILIMSELGND

VOUT

FB

VSELSW

DGND

SWOUT SWIN

COUT

VOUTVBATT

R1

L1

L or H

R2R3

Figure 4 Connection Diagram Illustrating the Selection of an Output from Two Values

Figure 5 Connection Diagram Illustrating Arbitrary Change at Output

PA

PA output

PA power voltage

Pin

VBATT

PoutPA

Pin

VBATT

VBATT

PA output

PA power voltage

Vout

VoutVDAC

Pout

MB39C326

Excessive power (blue area) is supplied. Power in the red area can be reduced.

Figure 8　Application Example (RF-PA)

10 μF VDD VOUT

DGND

GND

FB

VSELSW

VSEL

R3 R2

R1

ErrorAmp

SW1

SW2 SW3

SW4 2.2 μF

0.5 μH

L1

VCC

EN

SWOUT

ILIMSELXPS

CIN COUT

VBATT

Currentsensor

Devicecontrol

Overheatprotection Oscillator

Gate control

BGRUVLO

Figure 3　Block Diagram

5V

5V 3.3V

2.5V to 4.2V

MB39C326 MCU

RTC

RAM

Buzzer

LEDs

Button

AC/DC

USB I/F

Li-ion battery

Even when changing its voltage, the Li-ion battery can stably supply 3.3V to the microcontroller.

Figure 7　Application Example (Portable Instrument with One-cell Li-ion Battery)

Figure 6　Relation between Output and DAC(in the case where: 620kΩ, R2 = 110kΩ, and R3 = 330kΩ)

VOU

T (V)

DAC voltage (V)

VOUT - DAC4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.00.0 0.5 1.0 1.5 2.0 2.5

12 FIND Vol.30 No.1

MB39C326

Future outlook

　FUJITSU will continue to develop and

explore higher switching frequency

DC /DC converters to enable our

customers to downsize their systems.

We will also develop total RF systems,

including transceivers and PAs, in order

to reduce the power consumption of

RF-PA parts. ■

Photo 3　Evaluation Board

Photo 2　Sample of High-density Packaging on the Power Part of the Product

13 FIND Vol.30 No.1

NEW

PRODUCTS

14FIND Vol.30 No.1

MB85R4001A / MB85R4002A

saved immediately before power-off.

Thanks to its pseudo-SRAM interface,

FRAM can replace SRAM on the existing

board products without requiring

significant system design changes.

The new product can support a wide

range of applications such as smart

meters and industrial instruments

(which handle measurement data),

communication equipment, office

automation equipment, medical

equipment, portable appliances

(which collect logs frequently), and

consumer products such as computers

and games.

Future Outlook

　FUJITSU is focusing on various types

of general-purpose FRAM memory

products, and is developing products

that support various parallel and serial

interfaces. In the future, we will expand

the memory capacity lineup, and

upgrade range of operating voltage

and operating speed, and will supply a

full lineup of customer-friendly general-

purpose FRAM products.

　Figure 1 depicts the general-purpose

FRAM memory lineup. ■

MB85RC1283V

MB85RC643V

MB85RC163V

MB85RC64V5V

MB85RC16V5V

I2C 4K-bit 5V

I2C-3V

4K

16K

64K

128K

256K

1M

2M

4M

8M

Interface

Capacity (bit)

I2C-5V

I2C 256K-bit 3V to 5V

MB85RS128A3V

MB85RS256A3V

MB85R256F3V

Parallel 3V

MB85R1001/2A3V

MB85R4001/2A3V

MB85RS643V

MB85RS163V

MB85RS64V5V

SPI 16K-bit 5V

SPI-3V Parallel 1.8VSPI-1.8V SPI-5V

SPI 256K-bit 5V

In planningIn developmentMassproduction

SPI 1M-bit 1.8V to 3V


Parallel 8M-bit3V

FUJITSU's new 4M-bit FRAM has a pseudo-SRAM interface, which is highly compatible with SRAM. This FRAM memory is available in × 8-bit bus and × 16-bit bus versions.

MB85R4001A / MB85R4002A

4M-bit Parallel(× 8-/×16-bit bus) FRAM

Introduction

　To date, FUJITSU has provided

nonvolatile FRAM products featuring

high-speed writing, high endurance,

and low power consumption, with

three types of interfaces (parallel,

serial SPI bus, and serial I2C bus). Now,

in addition to the existing 256K-bit

models (MB85R256H and MB85R256F)

and 1M-bit models (MB85R1001,

MB85R1002, MB85R1001A, and

MB85R1002A) of our FRAM series, we

are introducing a new, large-capacity

4M-bit memor y model with two

versions MB85R4001A (×8-bit) and

MB85R4002A (×16-bit), to expand

our parallel-interface FRAM memory

lineup.

Product Features

　This nonvolatile Random Access

Memory has features of both ROM

and RAM, and integrates the features

of E2PROM and SRAM. Unlike SRAM

products, these FRAM products can

retain data after power-off without

requiring a battery for data backup.

The ferroelectr ic memories can

withstand more than 1010 data read/

write times, making them appropriate

for applications that need high-

frequency data recording, which

existing Flash memories and E2PROM

cannot support.

　Table 1 lists the product specifications.

Ecology(environmentally friendly)

　Since the product uses a pseudo-

SRAM interface based on asynchronous

SRAM, it can replace conventional

SRAM systems with battery backup.

There is no need for a battery and,

therefore, no troublesome battery

maintenance. The product 's small

size, fewer parts, and lack of battery

exchange or discarded batteries reduce

costs and lessen the environmental

burden.

Operation Mode

　The pin allocation of the product

complies with the industry standard

for SRAM products. Since it is upwardly

compatible with the pin allocation of

the existing FUJITSU 1M-bit model,

the capacity can be quadrupled by

allocating two NC pins of the 1M-bit

product to the address signal (pin

upgrade).

　A control terminal of the ×16-bit

bus model (MB85R4002A) allows I/O

selection between LB (Low Byte) and

UB (Upper Byte), providing a connection

to both the 16-bit and 8-bit buses.

　Since FRAM products feature a

higher writing speed than E2PROM and

Flash memories, they do not require

a wait time during writing. When a

chip-enabled terminal is disabled,

the data-writing process is already

completed. In this way, the number of

system malfunctions due to data loss

during the data-writing process can

be reduced. Also, data that is being

written at the time of interruption is

saved, even after power-off.

Application

　Also, the FRAM memory supports

applications that need frequent

data re-writing, which conventional

E2PROM cannot support. Its high-speed

re-writing feature allows data to be

Figure 1　FUJITSU General-purpose FRAM Memory Lineup

Table 1　Product Specifications

Model Memory capacity Power-supply voltage

Write cycletime

Operating temperature

rangeRead/Write

cycles Data retention

guarantee Package

MB85R4001A 4M-bit (512K × 8-bit) 3.0 to 3.6V 150ns −40 to ＋85℃ 1010 times 10 years TSOP-48

MB85R4002 A 4M-bit (256K × 16-bit) 3.0 to 3.6V 150ns −40 to ＋85℃ 1010 times 10 years TSOP-48

Photo 1　Appearance

15 FIND Vol.30 No.1

NEW

PRODUCTS

16FIND Vol.30 No.1

MB9BF506RA-EVB-RF-01

via I2C interface, and real-time clock

(RTC), and LCD are assembled. With this

combination, it is demonstrated that

the sensor data are displayed on the

LCD and they're stored into FRAM at the

programmed interval, then reader/writer

can take the logging data. The antenna

board is tuned for around 915MHz as

center frequency.

　In addition, the board can be

connected with PC via USB interface,

which enables to load MCU firmware or

demo/evaluation program.　And the ICE

interface makes customers to develop

firmware and customize application.

In addition, RS232C (TX, RX) and I2C/

SPI/UART (exclusively selected) are

provided as reserved interface, which

enable customers to connect additional

sensors and controllers for customized

evaluation.

　Figure 1 presents three usages that

the board can provide.

Demonstration

　The demonstration program is

installed as default firmware. As a

sensor data logger demo, sensor data

are stored into FRAM and taken from

reader/writer. And as a display demo,

the character displayed on LCD is

changed by reader/writer. The demo

program of reader/writer is developed

for Atid's handheld reader AT870.

　Because the demo program manual

Introduction

　FUJITSU SEMICONDUCTOR develops

and manufactures RFID LSI products

for RFID using FRAM (Ferroelectric

Random Access Memory). With the

unique feature of FRAM such as high

speed writing, large density memory,

and Gamma-ray/E-beam sterilization

resistance, FRAM RFID has been used

for added value applications and also

for embedded application as a new

approach. FUJITSU SEMICONDUCTOR

has now started selling an embedded

RFID development kit on which our FM3

family microcontroller and UHF-band

RFID LSI “MB97R804B” are connected via

serial interface.

Embedded RFIDsolutions by FM3 + RFID

　The features of embedded RFID

solutions enables to read and write

from RF reader/writer to FRAM as a RFID

feature, and enables to read and write

from Microcontroller (hereafter, MCU) to

FRAM as an external memory feature of

MCU in the same way.

One example of RFID features is data

logger. If it is assumed that sensor is

connected with MCU and sensor data

is taken based on certain conditions

such as time interval, threshold value,

and then the data is stored into FRAM

as an external data logger. Then the

logging information can be taken from

RF interface. On the other hand, if it is

assumed that FRAM is used as parameter

setting memory, the conditions of

sensor information can be changed

from RF interface and MCU refers the

data through serial interface when MCU

accesses FRAM. As a result, FRAM can be

used for both data logger and parameter

setting. This is a key feature of FRAM

RFID for embedded solution.

　This approach is commonly applied for

different application. If the information

such as operation setting conditions,

application parameters, and adjustment

of MCU firmware are stored in FRAM,

the information can be managed by RF

without connecting wire. As an example,

if the electronic paper is connected

with MCU, the display information and

parameters could be changed by RF.

　We had already introduced the same

approach as embedded RFID applications

that combine 32-bit FM3 Family equipped

with the ARM®CortexTM-M3 named

“MB9BF506R” and UHF-band FRAM RFID

LSI named “MB97R8030”＊1. Through the

inquiries from customers and the support

of evaluation and development, we've

improved the specifications and feature,

and embedded new RFID LSI named

“MB97R804B” as a successor model of

“MB97R8030”＊2 and connected with the

FM3 Family “MB9BF506RA.”

　The access arbitration feature of

“MB97R804B” improves the accessibility

to FRAM from RF and serial interface, and

the communication characteristics are

also improved when MCU is connected

with RFID LSI.

＊1：See Vol.29 No.1.　＊2：See Vol.29 No.2.

Specifications

　As shown in Photo 1, the product

consists of an MCU board assembled

with MB9BF506RA and an antenna

board assembled with MB97R804B,

connected with an SPI interface. On

the MCU board, temperature/humidity

sensor, illuminance sensor, and 3-axis

accelerometer are connected to the MCU

As the 1st approach of embedded RFID solutions, FUJITSU SEMICONDUCTOR has released an embedded RFID development kit consisting of FRAM based UHF RFID and FM3.

Embedded RFID development kitwith FM3 Family MicrocontrollerMB9BF506RA-EVB-RF-01

Figure 1　Three Usage of Development Kit

■ Demonstration

・Demonstration operation manual・Demonstration board command manual・Demonstration board hardware manual・Demonstration application (for FM3: binary data)・Demonstration application (for AT870: binary data)

A dedicated demonstration applicationis preinstalled.

Demonstration application installed

FM3 + RFID demonstration board

Deliverables

RFID reader/writer

■ Evaluation

・PC software (for PC: Execution file)・Evaluation application (for FM3: binary data)・Read/write access to FRAM・Access interval setting・Attribute and area setting・Repeat access setting・PC software operation manual

PC evaluation tool

PC application & Deliverables

RFID reader/writer

■ Development

・FM3 initialization source code・SPI driver for accessing RFID・I2C driver for accessing sensors・Driver for accessing external interfaces・Source code manual

FM3 and RFID application development

Sample source

Atid AT870

ICE

USB


パラメータ1 メモリ

パラメータ2

パラメータ3

パラメータ4

（Custome’s reader/writer）

（Custome’s reader/writer）


RFID reader/writer

Photo 1　Top view

17 FIND Vol.30 No.1

MB9BF506RA-EVB-RF-01

and the memory map information for

the program are provided, it is possible

for customers to develop the same

demo for their own reader/writers.

Evaluation

　In order to evaluate FRAM access

from serial interface and RF interface,

the evaluation tool is provided. The

evaluation program is executed from PC

via USB interface and can evaluate the

reading and writing operation to FRAM.

　Because the program can control the

address, data, number of access, and so

on, customer can evaluate how arbitration

feature works before the development of

customized software. Also the sample

source enables customers to develop

their own evaluation tool.

Development

　ICE interface enables customers to

connect FM3 with ARM MCU development

tool and develop own firmware for

customized application . The sample

source codes of I2C driver to access

sensors and the code of SPI driver

to access FRAM are provided for the

development.

Future Approach

　In order to penetrate embedded

FRAM RFID solutions into the market

and make customers evaluate this new

RFID approach, FUJITSU SEMICONDUCTOR

began to sell the evaluation kit introduced

above. Taking advantage of the unique

features of FRAM RFID such as high

speed and large density memory,

we plan to develop HF products for

embedded solutions as well as UHF

products in order to apply either of them

according to the market requirement.

　FUJITSU SEMICONDUCTOR intends

to work together with customers for

creating and developing new values

on RFID usage scene and embedded

RF solutions as an added value of MCU

products. ■

18 FIND Vol.30 No.1

NEW

PRODUCTS

19FIND Vol.30 No.1

MB91520 Series

Introduction

　In light of global warming, the

automotive industry needs to produce

ever more eco-friendly and fuel-

efficient cars. The demand for luxury

cars with improved safety and comfort

has increased in advanced countries,

while there is a strong demand for

compact cars in rapidly developing

countries such as China, India, and

Brazil.

　To respond to these demands,

many automotive manufacturers

are promoting platform designs for

body-control applications. Accordingly,

microcontrollers that can be easily

integrated into these platforms are

needed.

　To meet these needs, FUJITSU has

introduced the MB91520 Series to

complement our 32-bit microcontroller

FR81S family. The new series offers

various pin configurations and memory

sizes, numerous peripheral functions

for body-control applications, and built-

in cost-reduction functions as standard

features, thereby providing an optimal

platform solution. A dedicated timer

for brushless DC motors and safety

functions is also available to support

AUTOSAR.

Product Features

　 Figure 1 depict s the product

lineup of the series.

　To respond to the various demands

of the automotive industry, our 60

models include packages ranging

from 64 to 176 pins, Flash memories

from 320 to 1,088KB, and subclock

availabilit y. Var ious per ipheral

functions that enable the control

of automotive bodies are loaded,

mainly for body-control modules

(BCMs).

Full lineup supporting the development of a wide variety of applications

　The lineup is more enhanced

than that of the existing MB91460

Series of the FR60 family for body

control. This MB91520 Series provides

microcontrollers for body control

application platforms by means of a

combination of packages from 64 to

176 pins, Flash memories from 320

tov1,088KB, and subclock availability

(existence).

　The CPU performance of the new

product has been increased by 30% or

more compared to the conventional

FR60 family due to an improved

pipeline process and internal bus

operation. Furthermore, the new

MCUs can access the Flash memory

without a wait time, even at 80MHz

operation. Other high-performance

functions, such as an embedded unit

dedicated to floating-point operations

(FPU), support auto-creation codes in

the model base design phase.

　The full product lineup supports

the development of a wide variety of

applications.

Peripheral functions for body-control applications

　A wide array of peripheral functions

are suited for automotive body-control

applications, such as a multifunctional

serial interface that can flexibly

connect to various external devices, a

FUJITSU is introducing 60 new models as part of the MB91520 Series for automotive body- control in addition to our FR81S family lineup. This new automotive 32-bit microcontroller (MCU) product line provides an optimal body-control platform.

MB91520 Series

FR81S family of 32-bit microcontrollers forautomotive body-control platforms

Figure 1　FR81S family MB91520 Series Product Lineup

MB91F526B S/WRAM：128KB

Work Flash：64KB

MB91F526D S/WRAM：128KB

Work Flash：64KB

MB91F526F S/WRAM：128KB

Work Flash：64KB

MB91F526J S/WRAM：128KB

Work Flash：64KB

MB91F526K S/WRAM：128KB

Work Flash：64KB

MB91F526L S/WRAM：128KB

Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB


Work Flash：64KB

64 pins 80 pins 100 pins 120 pins 144 pins 176 pins

1088

Main Flash memory [KB]

＊“S” or “W” at the end of the model number means: S : No subclock W : Subclock available

832

576

448

320

Figure 2　Multifunctional Serial Interface Outline

Figure 3　A/D Converter Range Comparison Function Outline

The software can be used to switch the functions.UART / SPI / LIN / I2C

UART

- Maximum transfer rate: 4Mbps- Multi-bit transmission supported ・5- to 9-bit (Normal mode)・7- and 8-bit (Multiprocessor mode)

Clock synchronousserial interface

- Maximum transfer rate: 8Mbps- SPI support (master/slave)- Serial chip select function: 4-channel- Multi-bit transmission supported・5- to 16-, 20-, 24-, and 32-bit

LIN

- LIN 2.1 supported- Supporting master/slave function- Hardware assist function

I2C

- Maximum transfer rate: 400kHz- Supporting master/slave function

Multifunctional serial

- 5V tolerant input supported (4-channel)- 64-byte transmission FIFO buffer loaded

Pattern

Highestthreshold

V

t

Lowestthreshold

1

2

3

4

Highestvalue

4.00V

3.30V

5.00V

0.90V

Lowestvalue

1.25V

1.00V

3.00V

0.00V

Analog input channel

Highest/lowest threshold and channelselection example

(a) Range comparison function

For sensor control applications To reduce external comparators

ch0,1

ch4,6

ch2,3

ch5,7

・You can set up to four patterns.・You can select a pattern for every channel.

The diagnosis function for various sensorinputs detects an error in the input analog signal.

The built-in comparator function eliminatesthe need for external comparators.

Without interruption,the functionautomaticallydetects a range forevery A/D conversion.

Built-in

(b) Continuous detecting function

◇Case where the function detects a level out of the range, and the setting number of continuous detection times = 4:

Number of continuousdetection times 0 0 0 0 0 0 1 2 3 4

Flag showing that a valueexceeds the highest value - 0 0 0 0 0 1 1 1 1

Range comparisoninterruption factor flag 0

：

：

： 0 0 0 0 0 0 0 0 1

Out of range[Over thehighest value]

Within range

Out of range[Under thelowest value]

Highest valuesetting

：A/D conversion result

Lowest valuesetting

Generation of interruptionby detection of the numberof continuous detection times

By monitoring the flag,a level outside the rangecan be detected.


■ Hardware watchdog timer operated by the built-in CR oscillating circuit

　The built-in CR oscillating circuit, a

system independent of the main clock,

operates the hardware watchdog

timer. No external watchdog timer IC is

needed.

■ Low-voltage-detection function with various voltage-level settings

　Since the product has a low-voltage

function to monitor an external power

source, there is no need to load an

external reset IC on the board. Eleven

voltage levels can be selected from the

software.

Waveform generator for easy control of the brushless DC motor

　A waveform generator acts as

a dedicated timer to control the

brushless DC motor, which can output

a three-phase waveform. To support

the operation of the brushless motor,

a dead-time-setting function and

an emergency-stop function are

available.

Microcontroller functional safety

　Figure 4 depicts the diagnostic

functions of the product, such as a

CPU self-diagnostic program, bus-

error-detection function, RAM self-

diagnostic function, memory-error

detection and correction (ECC), and

port I/O protection function.

Application Example

　A BCM controls the interior illumination,

turn-signal, windshield wiper, door lock,

side mirror, and other items according to

switches, sensors loaded on the car,

and information from other ECUs.

　The product has up to 12 channels

of multifunctional serial interfaces

and up to three channels of CAN,

which can flexibly connect multiple

devices and ECUs. An A/D converter

provides up to 48 channels, which can

support the processing of diversified

input from the sensors.

　Figure 5 depicts BCM application

examples.

　An example of a BCM application,

electromotive compressors have

recent ly been used for car air-

conditioners. To keep the car interior

comfortable, it is necessary to control

the temperature precisely. That control

is achieved with a waveform generator

that controls the brushless DC motor

that, in turn, runs the electromotive

compressor for the air-conditioner.

　Figure 6 depicts examples of applications

of electromotive compressors.

Product Specifications

　Table 1 presents the major specifications

of the product.

Development Environment

　The single-wire, on-chip debugging

interface system is based on the

JPwire designed by the standards

12-bit A/D converter that allows input

to advanced sensors, and a Controller

Area Network (CAN) that supports up

to 128 messages.

■ Multifunctional serial interface that can connect to various external devices flexibly

　A broad range of communication

methods are used for body control. To

flexibly support these communication

systems, the product provides a

multifunctional serial interface, as

depicted in Figure 2. UART, SPI, LIN,

and I2C are software selectable for

every channel. Up to 12 channels can

be loaded, largest class in the industry.

■ 12-bit A/D converter that allows input to advanced sensors

　The high-resolution 12-bit A /D

converter loaded on the product can

support sensors and peripheral parts,

which of fer improved technical

advantages. Since two units of the A/D

converter are loaded, simultaneous

conversion is available.

　As depicted in Figure 3(a), the range-

comparison function, which can detect

a level in a given range, is integrated

as a hardware function. The highest

and lowest thresholds for comparison

with A/D conversion values are set in

advance. The function automatically

detects when a level is inside or outside

of the predetermined range, reducing

the software load. Also, as shown in

Figure 3(b), continuous comparisons

are available.

■ Buffer storage up to 128 messages CAN controller

　Many new cars are equipped with

Electronic Control Units (ECUs) connected

by a CAN. The networks are growing

larger because of the increased

number of nodes and other factors. Our

previous 32-bit microcontrollers usually

provided buffers for 32 messages. The

buffers of the new products can save up

to 128 messages, making it possible

to support systems with more nodes.

The supported CAN protocol is Version

2.0A/B.

Built-in functions for system cost reduction

　Built-in E2PROM, watchdog timer

IC, reset IC, and other external parts

reduce the number of parts and board

installation space, lowering the total

system cost.

■ “Work Flash,” a data-Flash memory that eliminates the need for E2PROM

　Since the product has a 64KB data-

Flash memory (“Work Flash”) in addition

to the program Flash memory, an

external E2PROM is not needed. Also,

the data-Flash memory embedded

inside the microcontroller prevents

information leaks.

MB91520 Series

Figure 4　Diagnostic Function of MB91520 Series

CPU self-diagnosticprogram

CPU

CPU

Peripheral

RAMCheck circuit

Decoder

Decoder

Diagnosis beforestartup

At the time of overdrive

Shorelineprotection

Diagnosis beforestartupPeriodical diagnosis

Full-time diagnosisand correction

Full-time diagnosisand correction

Diagnosis before startupFull-time diagnosis

OCDUNIT

Trace information

Bus

MCUPower ON

BusAddition of parity bit

「0」Write and read “0”「1」Write and read “1”

RAM

Safety

CPU self-diagnostic programDetection of error in Programcounter/Store address/Store data/Load address/Access type

Bus-error-detection functionA parity decoder installed in the bus controllerdetects bus errors by dummy register access.

RAM self-diagnostic functionDetects writing and reading errors in thetotal or specified area of the data RAM.Port I/O protection function

Protects port-function switching and I/Odirection switching and prevents abnormaloutput caused by overdrive.

Memory error detection andcorrection function (Flash)

Detects single-bit errors on the programmemory and corrects them.

Memory-error-detection andcorrection function (RAM)

Detects single-bit errors on the data RAM andcorrects them. Detects double-bit errors.

Figure 5　Application Example: BCM Figure 6　Application Example: Electromotive Compressor

Switch

Regulator

Sensor MB91520SeriesADC

MFSGPIOPWM

CAN

MFS(LIN)GPIO

※ MFS:Multi function serial

Interior illuminationTurn-signal

Windshield wiperSide mirror

WasherTPMS

Keyless entry systemOthers

CANtransceiver

Vehicle Com

LINtransceiver

VBAT

Node1

Node2

Node3

Node4

Vehicle Com

Node1

Node2

Node3

Node4

Watchdog timer

Low-voltage-detection function

Work Flash memory

Regulator

IPM

Sensor

Car air-conditioner

MB91520Series

MFS Waveform generatorInput of

emergencystop

ADC

ADC

※ MFS:Multi function serial

VBAT

R

M

Watchdog timer

Low-voltage-detection function

Work Flash memory


organization JASPAR. Its compact

emulator, which supports all models of

our 32-bit microcontroller FR81S family,

allows communication to the target

board using a multipurpose coaxial cable

up to 10m long. Previously, an ICE unit

and evaluation chip were needed to

debug and install an evaluation device

on a car. With the current product, the

system can be evaluated independently

under actual-use conditions. Also, the

internal Flash memory on board can be

re-written using this interface.

　Figure 7 depicts the development

environment image and Table 2 presents

the structure of the development

environment. ■

MB91520 Series

Table 1　Major Product Specifications

Function MB91520B MB91520D MB91520F MB91520J MB91520K MB91520L

Main Flash memory [KB]

See Figure 1 .RAM［KB］

Work Flash [KB]

ECC (Flash memory/RAM) Yes Yes Yes Yes Yes Yes

Multifunctional serial interface 8 channels 9 channels 12 channels 12 channels 12 channels 12 channels

CAN 2 channels（64,128msg）

2 channels（64,128msg）

3 channels（64x2,128msg）




12-bit A/D converter 13+13 channels（2 units）

16+16 channels（2 units）





8 -bit D/A converter 1 channel 1 channel 2 channels 2 channels 2 channels 2 channels

Reload timer 7 channels 7 channels 8 channels 8 channels 8 channels 8 channels

16 -bit free-run timer 3 channels 3 channels 3 channels 3 channels 3 channels 3 channels

16 -bit input capture 4 channels 4 channels 4 channels 4 channels 4 channels 4 channels

16 -bit output compare 6 channels 6 channels 6 channels 6 channels 6 channels 6 channels

Waveform generator 6 channels（1 unit ）

6 channels（1 unit ）





32-bit free-run timer 1 channel 2 channels 3 channels 3 channels 3 channels 3 channels

32-bit input capture 5 channels 5 channels 6 channels 6 channels 6 channels 6 channels

32-bit output compare 4 channels 4 channels 6 channels 6 channels 6 channels 6 channels

16 -bit PPG 21 channels 27 channels 34 channels 38 channels 44 channels 48 channels

Base timer - 1 channel 1 channels 2 channels 2 channels 2 channels

Up-down counter 2 channels 2 channels 2 channels 2 channels 2 channels 2 channels

GPIO 44 56 76 96 120 152

DMA 16 channels 16 channels 16 channels 16 channels 16 channels 16 channels

External interruption 8+8 channels（2 units）






NMI Yes Yes Yes Yes Yes Yes

Subclock Yes Yes Yes Yes Yes Yes

Internal RC oscillating circuit Yes Yes Yes Yes Yes Yes

Real-time clock Yes Yes Yes Yes Yes Yes

Clock supervisor Yes Yes Yes Yes Yes Yes

Hardware watchdog timer Yes Yes Yes Yes Yes Yes

Low-voltage-detection circuit Yes Yes Yes Yes Yes Yes

On-chip debugger Yes Yes Yes Yes Yes Yes

MPU Yes Yes Yes Yes Yes Yes

FPU Yes Yes Yes Yes Yes Yes

Flash security Yes Yes Yes Yes Yes Yes

Maximum operating frequency 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz

Operating temperature range -40℃ to +125℃ -40℃ to +125℃ -40℃ to +125℃ -40℃ to +125℃ -40℃ to +125℃ -40℃ to +125℃

Operating voltage 2.7 to 5.5V 2.7 to 5.5V 2.7 to 5.5V 2.7 to 5.5V 2.7 to 5.5V 2.7 to 5.5V

Package 64 pins 80 pins 100 pins 120 pins 144 pins 176 pins

USB cable

MB2100-01-EMultipurpose coaxial

cable (up to 10m per singleline is acceptable)

Total developmentenvironmentSOFTUNE V6

ECU

Flash MCU

Figure 7　Image of Development Environment

Table 2　Development Environment Structure

Item Detail

Hardware for development environment Emulator MB2100 -01-E

Software for development environment Total development environment SOFTUNE V6 Professional Pack

Writer for Flash microcontrollerSerial writer ・FUJITSU MCU Programmer (writing with RS232C I/F)

・Yokogawa Digital Computer Corporation product

Adapter for parallel writer Flash Support Group, Inc. product

24 FIND Vol.30 No.1

NEW

PRODUCTS

25FIND Vol.30 No.1

MB86M01 / MB86M02 / MB86M03

　Furthermore, the product integrates

audio transcoding functions, the

security functions needed to protect

digital broadcast content, and various

connection interfaces all in one chip

package, including built-in memory.

　MB86M01 and MB86M03, with small

packages measuring 13mm square, are

ideal for mobile related products, such

as accessories for laptops, smartphones

and tablet PCs.

　The MB86M02, with a 21mm square

package, is better suited for stationary

equipment.

　The release schedule of samples is

shown in Table 1.

Introduction

　FUJITSU's bi-directional H.264/MPEG-

2 transcoder LSI can convert both video

and audio data, and can also perform

full HD conversions while delivering

very low power consumption. The

products are also equipped with a

transrating function that enables H.264

video data to be converted into even

higher-compression H.264 video data,

making them ideal transcoders to be

installed in products for broadcast

markets around the world which

employ H.264, such as Europe, South

America, and Asia. Additionally, as

smaller packages are available, the

LSI can be used in a wide range of

products, including mobile products

such as smartphones and tablet PCs,

as well as home digital broadcast

recording equipment such as TVs, hard

disk PVRs, and PCs.

Overview

　These days, transcoders enabling

extended H.264 video recording have

become a standard feature on hard

disk PVRs, TVs with video recording

functions and many types of equipment

that are equipped with transcoder

LSI. Moreover, as there are increasing

opportunities to view HD content on

mobile products such as smartphones

and tablet PCs, transcoding functionality

has been increased as well to enable

high-compression of the heavy, data-

intensive HD content for the purpose

of transmitting it over the narrow

bandwidths of wireless networks.

　In addition to the full HD transcoding

functions for converting MPEG-2 to

H.264 that were in the first-generation

MB86H57 and MB86H58, the new

products have a H.264 transrating

function for converting H.264 video

data into even higher-compression

H.264 video data. FUJUTSU developed

the second generation transcoder

LSI with build-in memory with even

smaller packages, so that FUJITSU's

new transcoder LSI can be employed in

products around the world.

　The products combine FUJITSU

SEMICONDUCTOR's low power consumption

technology with a proprietary algorithm

that enables higher image quality

while reducing the processing burden,

resulting in industry-leading levels of

low power consumption, consuming just

1.2W when using the H.264 transrating

function, even considering memory

power consumption.

FUJITSU's bi-directional H.264 /MPEG-2 transcoders can convert both video and audio data, and can also perform full HD conversions with low power consumption. Additionally, as smaller packages are available, LSI can be used in a wide range of products, including mobile products such as smartphones and tablet PCs, as well as stationary equipment.

MB86M01 / MB86M02 / MB86M03

Transcoders with Built-in Memory,H.264 Transrating Function

Table 2　Key Specifications

Function

Transcode

VideoMPEG-2 HD/SD ⇒ H.264 HD/SD + H.264 SD or lowerH.264 HD/SD ⇒ H.264 HD/SD + H.264 SD or lowerMPEG-2 HD/SD ⇒ MPEG-2 SDH.264 HD/SD ⇒ MPEG-2 SD

Audio Re-multiplex, Audio Transcode

PSI / Private PES re-multiplexing

EncodeVideo VBS＊1 ⇒ H.264HD/SD + H.264 SD or lower

VBS ⇒ MPEG-2 SD

Audio ABS＊2 ⇒ MPEG-1 Audio Layer2, etc.

Thumbnail JPEG encode

VideoProfile

H.264 High profileH.264 Main profileH.264 Baseline profileMPEG-2 Video Main profile

Interface SMPTE274 M/SMPTE296M-2001, ITU-R BT.656

Audio

Format Dolby®Digital (AC-3)＊3 , MPEG-2 /4 AAC-LC/HE-AAC, MPEG-1 Audio Layer2

Channels Max. 5.1ch＊4

Interface I2 S

JPEG Resolution QVGA

Stream

Format MPEG-2 TS, MP4

Interface USB2.0， PCI Express＊5

8 -bit parallel, Serial [2input, 3output]

Host Interface USB2.0， PCI Express

Security AES, MULTI2(Decrypt only)

Peripheral I/O I2 C, SPI, B-CAS Card

Input Clock Frequency 27MHz

Operating Frequency 243MHz (internal memory: 216MHz)

Power Consumption (including memory) 1.2 W (target) (typ., 1.2 V, H.264 HD to H.264 HD Transrating)

PackageMB86M01 : FBGA 490pin 13mm square SiP (Ball pitch 0.5 mm)MB86M02 : FBGA 490pin 21mm square SiP (Ball pitch 0.8 mm)MB86M03 : FBGA 289pin 13mm square SiP (Ball pitch 0.65mm)

Memory 1G-bit FCRAM×1

＊1： Video Baseband Signal. Refers to uncompressed video data.　　　　　　＊2: Audio Baseband Signal. Refers to uncompressed audio data.　＊3: Dolby is a registered trademark of Dolby Laboratories.＊4: Number of channels depend on audio format.＊5: For the MB86M03, PCI Express interface is not supported.

Photo 1　External view of MB86M01/MB86M02

Table 1　Sample Shipping Schedule

Product Package Size Sample release schedule

MB86M01 FBGA-490, 13mm×13mm(ball pitch 0 .5 mm) End of March, 2012

MB86M02 FBGA-490, 21mm×21mm(ball pitch 0 .8 mm) End of March, 2012

MB86M03 FBGA-289, 13mm×13mm(ball pitch 0 .65 mm) End of April, 2012


MB86M01 / MB86M02 / MB86M03

System Configuration Example

　Figure 2 and 3 show the application

examples of the product. ■

Product Features

Built-in H.264 transrating function, audio transcoding functions

　In addition to the full HD transcoding

functions for converting MPEG-2 to

H.264 that were in the first-generation

MB86H57 and MB86H58, the new

products have a H.264 transrating

function for converting H.264 video

data into even higher-compression

H.264 video data.

　FUJITSU's transcoder LSI can therefore

be used in products for markets in

every region of the world, not only

in products for Japan and US that

broadcast using MPEG-2, but also

European, South American, and Asian

markets that broadcast using H.264.

The product also supports various

formats of audio transcode, enabling

conversions to meet the specifications

of the user's playback equipment.

Industry-leading low power consumption, with small form-factors for compact products

　FUJITSU's proprietarily-developed

transcoding technology delivers industry-

leading levels of low power consumption

for H.264/MPEG-2 full HD transcoders.

The products are equipped with 1 Gbits

of memory (FCRAM). Through built-in

memory technologies and fine process

technologies, power consumption is held to

just 1.2W when using the H.264 transrating

function in full HD, even considering the

memory power consumption.

　Additionally, with two of the products

having a 13mm square small package

size, these transcoders can be used in a

wide variety of products, including laptops

and accessories for smartphones and

tablet PCs as well as home electronics

equipment.

Functions for controllingsimultaneous viewing andrecording programs

　Connecting two tuner modules to

two tuner input terminals enables

simultaneous control of the viewing

program and another recoding

program.

Shorter delay time whiletranscoding

　In order to shorten the delay time

when distributing content over a

network, the delay time generated

while transcoding is much shorter

when compared to the first-generation

transcoders.

　The key specifications are shown

in Table 2 and the block diagram is

shown in Figure 1.

Figure 2　USB Dongle TV Tuner

Figure 3　Wi-Fi TV Tuner

Tunermodule MB86M03

transcoder

USB

Tunermodule

Tunermodule

Host CPU

USB/PCIe

Wi-Fi

HDD

MB86M02transcoder

Figure 1　Block Diagram

Stream input(8-bit parallel/serial)

Stream Host CPU ，Stream/JPEG Stream/JPEG

PCIe USB

Audio transcoder/encoder

I2S×3

Digital audio input

SMPTE 274M/296M-2001

ITU-R BT.656

HD digital video input

Interface

I2C SPI B-CAS

Stream output(8-bit parallel/serial)

FCRAMcontroller

MULTI2/AESdecryption

System Demux

AESencryption

System Mux

JPEG encoderH.264/MPEG-2

transcoder/encoder

Scaler

PLL

1G-bit FCRAM

28 FIND Vol.30 No.1

TECHNICAL

INFORMATION

29FIND Vol.30 No.1

Enhancement of retention temperature condition and reading/writing endurance

　Since we released FRAM products

that use SPI bus or I2C bus, many

customers asked that the company

develop a product that offers data

retention at more than 70℃ and that

could support more than 1010 read/write

times. In response, we extended the

time of our accelerated tests and

confirmed that our products meet

these data-retention and read/write

requirements. With this re-evaluation

result, we have enhanced our seven

FRAM products that use SPI bus or I2C bus

(MB85RC16, MB85RC64, MB85RC128,

MB85RC16V, MB85RC64V, MB85RS16,

and MB85RS64). In the specifications of

these products, the 10-year guarantee

for data-retention at “＋55℃” has been

changed to “＋85℃,” and read/write

support has been changed from “more

than 1010 times” to “more than 1012

times.” Our FRAM products are now

available for tougher performance

required.

　Table 1 presents the product

specifications.

Future Outlook

　In addition to these products with

serial communication interface SPI bus

or I2C bus released this time, we will

continue to develop general-purpose

FRAM products that support various

interfaces, and will supply a full lineup

of customer-friendly general-purpose

FRAM products.

　Figure 1 presents the lineup of general-

purpose FRAM memory products. ■

MB85RC16 / MB85RC64 / MB85RC128 / MB85RC16V /MB85RC64V / MB85RS16 / MB85RS64

The specification-enhanced products (such as MB85RC16, MB85RC64, MB85 RC128 , MB85 RC16V, MB85 RS64 , MB85 RS64 etc.) can support those applications like FA (Factory Automation), which require higher performance in data retention temperature and endurance (read/write cycles)

MB85RC16 / MB85RC64 / MB85RC128 / MB85RC16V /MB85RC64V / MB85RS16 / MB85RS64

Enhancement specifications of FRAM products with standard SPI interface or standardI2C interface

Introduction

　FUJITSU's new general-purpose FRAM

products feature high-speed writing,

high read/write endurance, and low

power consumption, with three types

of interfaces (parallel, serial SPI bus,

and serial I2C bus). The products using

the serial communication interface SPI

bus and the I2C bus have pins that are

compatible with general E2PROM pins

and can therefore be replaced easily.

　Taking advantage of FRAM's high

read/write endurance, our products

have a longer life cycle than E2PROM,

helping save resources and reduce costs.

The high-speed writing feature of these

FRAM products allows data backup in

the case of instantaneous voltage drop.

　The products are suitable for applications

that require high-speed data writing and

frequent reading/writing operations.

Potential applications include navigation

systems, amusement facilities, automatic

teller machines (ATMs), programmable

logic controllers (PLCs), communication

devices, OA (Off ice Automation)

equipment, car event recorders, log

management and data backup of

measuring devices. The products are

also suitable for applications that require

sequential logging for status changes or

frequent data wiring (such as meters),

and by the enhancement that support

applications under severe temperature

conditions, such as FA.

■I2 C interface

Model Memory capacity

Power-supply voltage

Operating frequency (Max.)

Operating temperature range

Read/write cycles

Data retention guarantee Package

MB85RC16 16K-bit 2 .7 to 3.6V 1MHz

-40 to +85℃ 1012 times 10 years(at +85°C) SOP-8

MB85RC16V 16K-bit 3.0 to 5.5V 400KHz

MB85RC64 64K-bit 2 .7 to 3.6V 400KHz

MB85RC64V 64K-bit 3.0 to 5.5V 400KHz

MB85RC128 128K-bit 2 .7 to 3.6V 400KHz

■SPI interface

Model Memory capacity

Power-supply voltage

Operating frequency (Max.)

Operating temperature range

Read/write cycles

Data retention guarantee Package

MB85RS16 16K-bit 2 .7 to 3.6V 20 MHz-40 to +85℃ 1012 times 10 years

(at +85°C) SOP-8MB85RS64 64K-bit 2 .7 to 3.6V 20 MHz

Table 1　Product Specifications

MB85RC1283V

MB85RC643V

MB85RC163V

MB85RC64V5V

MB85RC16V5V

I2C 4K-bit 5V

I2C-3V

4K

16K

64K

128K

256K

1M

2M

4M

8M

Interface

Capacity (bit)

I2C-5V

I2C 256K-bit 3V to 5V

MB85RS128A3V

MB85RS256A3V

MB85R256F3V

Parallel 3V

MB85R1001/2A3V

MB85R4001/2A3V

MB85RS643V

MB85RS163V

MB85RS64V5V

SPI 16K-bit 5V

SPI-3V Parallel 1.8VSPI-1.8V SPI-5V

SPI 256K-bit 5V

In planningIn developmentMassproduction



Parallel 8M-bit3V

Figure 1　Lineup of General-purpose FRAM Memory

More than 10 years of data retention (at 85°C)More than 1E12 (1 trillion) read/write cycles


Honoring individuals and organizations for their contributions to the development and promotion of international standards

　The Industrial Standardization

Award is a program that recognizes

individuals and organizations for

their exceptional contributions to

the development and promotion of

international standards and Japanese

Industrial Standards. This program is

intended to enhance pursuance and

promotion of industrial standardization,

with an aim to contribute to Japan's

economic development and the

improvement of the lives of its citizens.

This award program was established

in 1953. In response to “International

that establishes international standards

on terminology and measurement

methods used in Microwave discrete

semiconductors. Since joining the IEC

in 1995, as a project leader in charge

of draft standards, he has worked

on development, consolidation and

documentation of international

standards.

International Standardization as a National Policyin the Global Era

　Securing international standards is

one of the industry's key challenges

in the global era. Processes including

design, manufacture, and assembly

have appropriate standards based on

unique technology and know-how.

When a proposed standard is approved

as an international standard, this

not only leads to the growth of the

domestic industry, but also gives it an

edge over other countries that have to

use the standard.

　In the field of electrical and electronic

engineering, the IEC and ISO (the

Internat ional Organiz at ion f or

Standardization) are responsible for the

development of international standards.

In Japan, industry organizations such as

JEITA take the initiative to participate

in international standardization

organizations by proposing draft

standards and sending delegates to

Standardization Strategy Objectives”

announced by the Ministry of Economy,

Trade and Industry (METI) in 2006, it is

now expanded to include individuals

and organizations that have made

significant impact on international

standardization activities.

　 The aw ard g i v en t o FUJ IT S U

SEMICONDUCTOR employees is the

“Industrial Science and Technology Policy

and Environment Bureau Director-

General 's Award for Outstanding

C o nt r ib ut i o n t o In t e r n at i o n al

Standardization” to honor individuals

who have made contributions as

chairs/leaders/experts in international

standardization organization's technical

committees. Twenty-three individuals

from a wide range of technology

international conferences.

　With an aim to enhance standardization

activities, METI held the “International

S t andardiz at ion Public-Pr i v ate

Partnership Strategy Conference”

in 2006 - a meeting hosted by the

minister and attended by industry

leaders. In order to strategically pursue

international standards by 2015,

METI announced its “International

Standardization Strategy Objectives”,

with a target to double the number of

proposals for international standards.

In short, strengthening international

standardization is upheld as one of

METI's national policies.

companies were selected for this

award, and among them were two

FUJITSU SEMICONDUCTOR employees.

Matsuyama and Sasaki - Experts in Semiconductorand Microwave Semiconductor

　The award was given to Hideya

Matsuyama, Director of the Quality

Assurance Unit, and Takao Sasaki,

Manager of the Advanced Products

Business Unit. In addition to their

regular job duties, both Matsuyama

and Sasaki have served as committee

members for the Internat ional

Electrotechnical Commission (IEC),

and their activities over the years

were recently recognized by METI.

　As an expert in reliability engineering

of semiconductor devices, Matsuyama

has worked with the IEC Technical

Committee to establish international

standards on testing methods in

the field of quality assurance. He has

taken a leadership position as an

International Expert and Acting Convener

at international conferences, and achieved

development of seven international

standards, in cooperation with JEITA

(the Japan Electronics and Information

Technology Industries Association).

　 A s an e x p e r t in mi c r o w a v e

semiconductor technology and

it s applicat ion systems, Sasaki

participates in an IEC Sub Committee

　The Industrial Standardization

Award is part of a national strategy to

recognize contributions to international

standardization. Matsuyama and

Sasaki were awarded for their work

in international standardization

in a c k n o w l e d g em ent o f t h e i r

contributions to the development of

Japanese industry. In other words, the

country has recognized them as key

people who will lead the growth of the

Japanese electronics industry.

Two Employees Recognized for“International Standardization”

FY 2011 The Ministry of Economy, Trade and Industry (METI) Contribution Award for International Standardization

FY 2011 METI Contribution Award for International Standardization

F Y 2 0 1 1 I N D U S T R I A L S T A N D A R D I Z A T I O N A W A R D

Flow chart of IEC standardization process

New work item proposal (NP)

Vote

Circulation of Committee Draft (CD)

Level ofcompletion

Circulation of Committee Draft for Vote (CDV)

Circulation of Final Draft International Standard (FDIS)

Vote

Vote

Publication of International Standard (IS)

Approval requirements:

・A minimum of 4 countries must participate in the conference・A simple majority of the committee members

・Chairman’s decision to determine the consensus

・A 2/3 majority vote in favor

・A 2/3 majority vote in favor

NO

NO

NO

NO


As a member of IEC TC47

　 Int e r n at i o n a l s t an d ard s f o r

electrical/electronic technology are

mainly created by the International

Electrotechnical Commission (IEC).

The organization is divided into more

than 100 Technical Committees (TC)

where participating delegates from

different countries hold meetings to

decide international standards. I've

been working as an International

Expert in the committee called TC47

to standardize quality assurance

testing of semiconductor devices.

　I participate in the IEC through the

Japan Electronics and Information

Technology Industries Association

(JEITA). Similarly, delegates from

other countries also take part in the

IEC through their national industry

organizations. So we get together to

discuss and iron out the differences in

order to finalize international standards.

This process is called “Harmonization.”

But in reality, JEDEC (JEDEC Solid

State Technology Association), which

represents the US, has the biggest say

with the IEC, and if other countries are

making a proposal they would decline

to come to the conference.

　Even with those obstacles, I still

made seven proposals based on

Japanese drafts. By having direct talks

with the JEDEC chairman to ask for their

support and by forming an alliance

with Holland and other countries, I was

able to get these proposals published

one by one. In recent years, JEDEC also

changed their attitude to recognize

our track record and sit at the table

more often. As a result of achieving

direct negotiations with influential

organizations such as JEDEC, it has

created a positive impact on Japan's

future bargaining power.

Chairman a no-show at the international conference!

　International standards are decided

under the guidance of the convener

at international conferences which

require the attendance of at least four

national delegates. In this meeting, a

draft standard, which already has been

harmonized in collaboration with other

countries, is reviewed and adjusted

to be finalized as an international

standard. The conference is hosted in

rotation among participating countries.

　The following is a story that happened

at the international conference held

in Korea. I attended this meeting

as a Japanese delegate, but to my

surprise, a convener did not show

up! We cannot even start a meeting

without a chairman, and this means

that no international standard will be

decided in this meeting. I came here all

the way from Japan, and I just couldn't

accept the idea that I would have to

go home without any outcome. So I

announced that I would stand in as Acting

Convener and talked to other members,

including JEDEC, on the spot. One way or

another, we finally managed to get this

meeting going. But when the meeting

actually started, we found several things

missing from the draft so as to become

a standard. Eventually, after several

harmonization efforts by filling in the

gaps with JEITA proposals and so forth,

we were able to finalize an international

standard.

　It's been 11 years since I first participated

in IEC activities, but that was the most

memorable event in my tenure.

Long and steady roadto success

　Only after a long and steady effort

is made can standardization activities

produce an outcome. Through these

IEC activities, I sometimes have a drink

with other national members after

the meetings. If you can warm up the

We take pride and responsibility as“Japanese delegates.”

Hideya Matsuyama

Director, RELIABILITY ENGINEERING DEPT., QUALITY ASSURANCE DIV.QUALITY ASSURANCE UNIT

　The award ceremony was held at a hotel in Akasaka, Tokyo

on October 17, 2011. Upon receiving this award, Matsuyama

and Sasaki made the following comments: “International

standardization requires collaboration with many participating

countries. I have made continuous efforts to convince delegates

from the US, Holland, Germany, Korea and so forth. It 's a

great pleasure to accept this award in acknowledgement of

my preceding efforts. Winning this award is an enormous

encouragement for me to pursue standardization strategy.”

(Hideya Matsuyama)

　“I'm incredibly privileged to receive this Contribution

Award from the Ministry of Economy, Trade and Industry in

acknowledgement of the contributions through the years

of my standardization activities. I am honored to receive

this and grateful to all those who showed their support and

understanding in my work. For 16 years, as a national delegate

to the IEC, I have worked on proposing and establishing

international standards for terminology and measurement

methods used in high frequency semiconductor devices. Through

standardization activities, I will continue my efforts to contribute

to the international community, as well as to facilitate and

ensure Fujitsu Semiconductor's business operations and its

growth.” (Takao Sasaki)

Matsuyama waiting off-stage at the ceremony

Sasaki receiving the award at the ceremony

(1) IEC62373ed 1.0: Bias-Temperature Stability Test for MOSFET,

published on 2006-07-18.

(2) IIEC62374ed1.0: Time Dependent Dielectric Breakdown Test,


(3) IIEC62415ed1.0: Constant Current Electro migration Test,


(4) IIEC62416ed1.0: Hot Carrier test on MOS transistor, published

on 2010-04-26.

(5) IIEC62417ed1.0: Mobile ion tests -Bias temperature stress

(BTS) Triangular voltage sweep (TVS) test, published on

2010-04-22.

(6) IIEC62418ed1.0: Metallization stress void, published on

2010-04-22.

(7) IIEC62374-1 Ed.1: Time Dependent Dielectric Breakdown Test

(TDDB) for Inter-metal layers, published on 2010-09-29.

Hideya Matsuyama's accomplishments in international standardization

(1) IEC 60747-16-2: Microwave integrated circuits -Frequency

prescalers; domestic project launched in 1993, published in

2001, amended in 2007.

(2) IEC 60747-16-3: Microwave integrated circuits-Frequency

converters; domestic project launched in 1993, published in


(3) IEC 60747-16-1: Microwave integrated circuits-Frequency

Amplifiers; domestic project launched in 1996, published in


(4) IEC 60747-16-4: Microwave integrated circuits -Frequency

Switches; domestic project launched in 1998, published in


(5) IEC 60747-16-5: Microwave integrated circuits -Oscillators;

domestic project launched in 2004, work in progress for

publication, CDV approved in 2011.

(6) IEC 60747-4：Microwave diodes and transistors; regrouped

domestic project launched in 2001, revised in 2007.

Takao Sasaki's accomplishments in international standardization

Interview with Award WinnersWhere and how are international standards established? We took this rare opportunity to ask the award winners to learn about what goes on in international negotiations, both at the table and behind the scenes.

F Y 2 0 1 1 I N D U S T R I A L S T A N D A R D I Z A T I O N A W A R DFY 2011 METI Contribution Award for International Standardization


conversation and make them think

“you are an interesting guy”, then

you'll get the upper hand. So I always

have a stock of funny jokes (laughs). As

mentioned, the JEDEC chairman has the

biggest say among IEC members, and he

is also the chairman of TC47 that I belong

to so we meet and talk on a regular basis.

He also gave me a big thank you for my

impromptu decision to take over the

absent convener's seat at the Korean

conference.

Japan's area of expertise

　I have been in charge of the

standardization of terminology and

measurements used in microwave

semiconductors. In the IEC, I participate in

SC47E, one of the sub committees of TC47

that Matsuyama belongs to.

　This committee is responsible for

defining terminology and establishing

things like “use of symbols for

parameters” and “methods for measuring

parameters,” primarily for wireless-related

devices. Japan has strong expertise

in this area, and many companies

including major players like Fujitsu, as

well as mid-small sized companies are

in the business. Therefore, on the one

hand Japan has the experience to be

Turning knowledge into work

　For example, if you are going to

standardize a measurement method

for parameters, it has to be a method

that is user-friendly, simple and low-cost.

Specialized, complex methods or methods

that require expensive measuring

instruments will not be approved by other

countries. So developing a general and

cost effective method is the key to the

international standard. For this, I have to

have knowledge in the measurement

principle. I go back to books to look for

answers to questions arising in my head. I

also create all the mathematical formulas

myself, so I can present them to other

committee members with confidence.

In other words, I have to be a specialist

in the field.

　Every word that I write and revise

in collaboration with other committee

members is going to be approved and

registered as an international standard.

That is the best part of these activities.

　Plus, the acquired knowledge can be

applied to my work. For example, I can

use this knowledge to create technical

documents which will be shared with

junior employees and colleagues, used

　In this way, when people start to

recognize your steady relationship-

building, it will be your reputation that will

help to ultimately lead to the outcome.

Because of this trust you build among

people, rivals from other countries and

companies can still discuss and resolve

the differences. There are many national

delegates in my position, who are sent

from other companies to the IEC, so it's

no surprise that they work in the same

way I do. That's why we can't always get

able to take the lead in international

standardization, but on the other hand

there are so many other opinions. “Let's

just make this international standard”

and “Ours is better than yours” are all

too familiar in the committee meetings

where those opinions and desires bump

into each other. While we run through

raucous discussions, we eventually

compile a single international standard.

　There is no point in standardizing

technology if there are only a few

manufacturers and users, so a reason

behind is because there are enough

products and users. In that sense,

standardization indicates the potential

for the development of a new market.

That's why many countries including

Japan, the US, Europe and Korea

as reference for measurement and

design, and made into presentations to

customers. Since these use standardized

technology and knowledge, they

have a wide range of applications.

While creating international standards,

I develop my own skills and the

knowledge gained can be applied to my

work in the company. I have to admit

that I'm in the right environment.

Promotion toEast Asian countries

　Although I have dedicated myself into

international standardization all these

years, I have recently started promotion

activities to expand the user base

in other countries and regions. First

and foremost, I hope that East Asian

countries such as Malaysia, Thailand,

Indonesia and Vietnam will make use

of the international standards. Adopting

international standards will improve

production efficiency and make exports

to other countries hassle-free. Since METI

has introduced me to government offices

and organizations in these countries,

I have visited them to explain the IEC's

activities and international standards.

On top of that, I also talk to engineers in

favorable results

　Even in conflict-of-interest situations,

however, I still want to get the best result.

That's exactly why, when accidents like the

convener's absence happen, I make every

possible effort to turn them into opportunities.

Otherwise, it will be a disgrace to the company

that has sent me there. Moreover, I'm not only

representing Fujitsu Semiconductor, but also

representing Japan. I will continue to do

everything in my power to act on behalf

of the industry as well as for Japan.

participate in the IEC and put their

energy into proposing international

standards.

　Speaking of my field, since standardization

unifies symbols and measurements,

it is also beneficial for customers. For

example, if companies advertise

the performance of products using

different measurements, we can't

really judge which product is superior

to others unless the measured value

is converted into a single common

unit. But if it is measured using the

same standard, the difference in

performance becomes much more

obvious.

those countries to hear their requests,

and ask them to join the IEC. This kind of

activity may not produce any visible effect,

but I think in the long run it will contribute

to the steady development of the entire

industry. The Japanese government has

also recognized that, and they have

given me their support by being a point

of contact and paying for business travel

expenses.

　Looking back at sixteen years of

activity, as Matsuyama said, without

steady continuous effort, this activity

could not produce the outcome. A lot

of our senior associates still engage

in the standardization activities after

their retirement on a volunteer basis.

Compared to them, I'm still an apprentice,

and I was rather hesitant about receiving

this award. On the other hand, I also

started to have this idea that it's about

time for me to find a young successor who

will take over the activities. Luckily, I found

the right person for this job. So I should

give serious training to the candidate

sometime soon. Young people today have

extensive international experience and

they are less shy about new challenges,

so I expect there should be more people

that come forward.

Gratifying experience of having every wordto become international standards

Takao Sasaki

MANAGER, WIRELESS SOLUTION ENGINEERING DEPT. WIRELESS SOLUTION DIV.ADVANCED PRODUCTS BUSINESS UNIT

F Y 2 0 1 1 I N D U S T R I A L S T A N D A R D I Z A T I O N A W A R DFY 2011 METI Contribution Award for International Standardization

IEC International Electrotechnical Commission

TC 1 Technical Committee TC 47 Technical Committee

SC47E Subcommittee TC 114 Technical Committee

JEDEC, Solid StateTechnology Association

JEITA , Japan Electronicsand Information

Technology IndustriesAssociation

Deutsche Kommission Elektrotechnik Elektronik Informationstechnik im

DIN & VDE

Comite Brasileiro de Eletricidade, Eletronica,

Iluminacao e Telecomunicacoes (Cobei)

StandardizationAdministration of

China (SAC)

USA Japan Germany Brazil China

Among the total 114 TCs, divided according to topics, Matsuyama is active in TC47

TC47 sets up the subcommittee SC47E. Sasaki is active in this committee

Both TC47 and SC47E make JEITA Headquarters their home base

Relationship between IEC and TC47

Employees from JEITA affiliated companies are delegated

130 countriesaround theworld aremembers

　Goma is a cul inar y c reat ion unit established in 1998 which consists of Ms. Mika Araki, Ms. Junko Endo, and Ms. Ryoko Nakamura.Themed on foods, day after day they create fun and gratifying things of everyday life into various forms. 　Aimed at free and new culinary activities that overcome genre and categorization, everything is managed by themselves from food proposals to the manufacture of sundry goods and artwork.　Currently their goods are introduced in magazines, books and on TV. They also give advice to enterprises about their merchandise, hold craftsman workshops and are involved in various diverse fields.　From the time they took charge in the dietary education part of an NHK education program in 2006, they have also been involved in a lot of work with themes on children and have been expanding their activities with workshops.　They have written “Goma to kodomo no monozukuri,” published by Kodansha, and

“Goma no tezukuri saijiki,” and many more.　Their latest publication is “SWEETS POPS! Goma no boutuki okashi to zakka,” from Marks.

Goma’s official web sitehttp://www.gommette.com/

FIND is redesigned in this issue. We have asked Mr. Souun Takeda, the famous Japanese

Calligrapher to write the opening article. It was our great pleasure to receive his brush

painting of the Kanji character 「絆」 or “Kizuna”, which means bonds between people.

The word “Kizuna” is filled with wishes to revive Japan from the damage caused

by the Great East Japan Earthquake, and deepen the relationship between FUJITSU

SEMICONDUCTOR Group and our customers so that they can rely on our products even

more. All of the production staff of FIND will make their utmost efforts to deliver that

passion to you. (Y.O.)

FIND Published in February, 2012 Volume 30 No.1 Consecutive number of volumes 141

Publication: FUJITSU SEMICONDUCTOR LIMITED

Planner & Editor: FIND Editorial Committee

Contact: FIND Editorial Office FUJITSU SEMICONDUCTOR LIMITED Shin-Yokohama Chuo Building 2-100-45 Shin-Yokohama, Kouhoku-ku Yokohama, 222-8508

Printing: EDUPRESS Inc.

Snowing Candy Town

G o m a , s F a n t a s t i c W o r l d & T a l k

GomaP R O F I L E o f

　The scenery of a snowy candy town. We chose the character for “house”

as the key concept of this artwork. On a cold winter day, people feel

relieved to see a lighted house because they feel the warmth of those who

are inside. People may feel secure just knowing that somebody is there.

　The houses various shapes represent the lives of each of us. Each house

contains the act of life of each of us, and FUJITSU SEMICONDUCTOR Ltd.’s

supports that life in the form of home appliances, mobile phones and car

parts. We put these thoughts into our artwork. We used brownies to make

the bases of the houses, cookies for the windows and doors, and icing to

express snow piled on the roofs. The misshapen houses may increase the

warmth all the more.

　Different from neither the painting nor the photo, food possesses a

wonderful charm that attracts people. That may be because food is the

item that is directly linked to our daily lives and so anyone can easily feel

the bond.

　Although Goma is involved in production activities themed on food

everyday, we are always amazed by the commonness of food, its universal

character and its power to reach people’s hearts regardless of age.

　We are happy to have this opportunity to design the cover of FIND. For

a yearlong period we hope to deliver to the readers pleasure, warmth

and amusement through the scenery and artwork using food. Please look

forward to it.

E d i t o r i a l N o t e

© 2012 FUJITSU SEMICONDUCTOR LIMITED

http://edevice.fujitsu.com/en-find/

FIND

FUJITSU SEMICONDUCTOR LIMITEDNomura Fudosan Shin-yokohama Bldg. 10-23,Shin-yokohama 2-Chome, Kohoku-ku Yokohama Kanagawa 222-0033, Japantel. +81-45-415-5858http://jp.fujitsu.com/fsl/en/

FNDE-30-01-1E

Documents

FNDE-30-01-0E · collaborative performances with rock musicians, Kyogen performers, or the like. Mr. Takeda explains his own driving force as a calligraphy artist is this:“ From