Fluid Head Technology

© John Glenning 2015© John Glenning 2015

Fluid Head TechnologyFluid Head Technology

John Glenning & Jim VeasawJohn Glenning & Jim VeasawTechnology DevelopmentTechnology DevelopmentDeveloped 1987 Developed 1987


Fluid Head Rinsing Technology was Fluid Head Rinsing Technology was Developed at IBM by Jim Veasaw and Developed at IBM by Jim Veasaw and John GlenningJohn Glenning

US Patent 5063951: Fluid treatment US Patent 5063951: Fluid treatment Device May 1990 Device May 1990

Idea Developed March 1987Idea Developed March 1987

Fluid Head Technology Development


Electronic circuit production employs:

1. Coating a photoresist on the metal surface 2. Exposing the photoresist with light of the proper wavelength for the correct time3. Developing the image4. Etching the metal pattern 5. Stripping the photoresist



Electronic Circuit Production:

1. The traditional process produced waste and scrap caused by "drag-out" of chemicals from one tank to the next 2. Large volumes of evaporative waste were also produced from the open tank design used for, etching, rinsing and drying the circuit components.



Electronic Circuit Production:

3. This more efficient and less polluting process supplanted the older technology for many of IBM's circuited products.



Environmental Benefits

1. Completely enclosed process 2. Smaller chemical tanks 3. Less rinse water usage4. Reduced levels of drag-out5. Reduced rinse water requirements 6. Reduced evaporative losses.




7. Rinse waters reduced by 75 percent or 30,000 tons per year 8. Use of "fluid head" consumes only one-half gallon per minute versus the 3 to 5 gallon per minute consumption



Benefits

9. Plating bath efficiency improved by 20 percent, primarily as a result of eliminating vertical racks and associate rack stripping steps. The result is less drag out and reduced plating on fixtures.




10. Efficiency is gained across each chemical process including cleaners microetch, sulfuric acid predip, activator baths, reducer bath, electroless copper bath, acid dip, and acid copper baths.




10. The total waste reduction was estimated to be 60 tons per year.

11. Plating bath efficiency improved by 20 percent




12. Reuse of spent micro etch bath for maintenance reduced waste by 55 tons per year. 13. The spent persulfate solution from the microetch station is saved for reuse




14. Toxicity reductions achieved by converting a hazardous/corrosive activator bath to a neutral activator chemistry by electrifying a plating allowing use of lower concentrations of chemicals




15. Energy savings of more than 500,000 kilowatt hours were realized as a result of conveyer efficiency compared to the old hoist system and

reduced process ventilation for the enclosed process design




16. Overall process efficiency was improved by using chemical totes instead of 55-gallon drums, realizing

a savings of more than $20,000 annually



Summary

1. As Electronic circuitry density increases, DI Water Rinsing needs to increase by 2 orders of magnitude to meet product reliability requirements.



Summary

2. Developed DI water rinsing head (fluid head) which improved rinsing quality by one order of magnitude and reduced DI water consumption by two orders of magnitude resulting in a US Patent.



Summary

3. This was a brain-storm by myself, Jim

Veasaw and an operator. We changed the rinsing from spraying to cross-product.4. This significantly improved rinsing and product reliability.



Summary

5. This resulted in a US Patent (US Patent 5063951)



Fluid Technology Development

http://www.dec.ny.gov/public/21702.html

http://www.dec.ny.gov/public/21702.html


Process Development-Manufacturing Process Development-Manufacturing StrategyStrategy

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Fluid Head Technology