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Product Design Specification Report
Air Movement Device – “Flat Fan”
Winter 2009
Prepared for
Intel Corporation Group
Prepared by
Brass SearsForrest HublerRobert GassoScott Clark
With assistance from
Portland State University AdvisorDr. Chien Wern
Intel Corporation AdvisorJered Wikander, with the Mobile Platforms Group
IntroductionIntel Corporation is the world’s largest semiconductor manufacturer and the inventor of
the x86 microprocessor which is found in most of the world’s personal computers. Within Intel, the Mobile Platforms Group is responsible for investigating and developing promising new technologies specifically for implementation in mobile electronic devices such as laptop computers and handheld electronic devices which encompass an ever increasing role in world-wide computer sales.
As manufacturers seek to decrease the size of electronic devices without decreasing their performance, the need for smaller components grows. Especially important is any technology that facilitates the cooling of these components within the device. Desktop PC’s and many larger electronic devices use relatively large axial fans that can sit vertically due to few size constraints. As computers decrease in size, and specifically thickness, radial fans or blowers that have been flattened are used to move air and cool through convection. Currently, some of these miniature blowers have a footprint of less than a dime and operate in a space 6mm thick. Blowers can be made increasingly smaller (see Figures 1 and 2), but the technology is primitive and the efficiency is static.
Figures 2, 3: Examples of current small scale blowers used in electronic devices.
Intel is actively exploring new methods of air movement on an even smaller scale. The goal of this project is to produce an air moving device that that fits into a space 3mm thick space, with limited decrease in air volume transport, air speed, and pressure with respect to current technology.
Explanation of This DocumentThis product design specification report defines the criteria and the considerations given
to design of an air movement device. This document represents the customer base for this fan technology and the teams overall objectives.
Mission StatementOur mission is to design and manufacture a miniature air-moving device that produces
maximum airflow and satisfies all size and pressure requirements set forth by Intel.
Completion Date
Our team is expected to deliver and present a fully functional prototype on or before June 1, 2009. The prototype shall be presented with accompanying documentation, including cost analysis, detailed design process/analysis, and appropriate drawings. The prototype and documentation shall be presented to both PSU and the teams contact engineer with Intel, Jered Wikander.
Project Plan
The process is as follows: Write PDS, Research, Brainstorm, Evaluate, Detail Design, Prototype, and Document. Major milestones and completion dates for the project are:
February 9, 2009 - Concept Evaluation
March 2, 2009 - Progress Report
April 27, 2009 - Prototype Completion
June 8, 2009 – Presentation to PSU and Sponsors
A detailed Gantt Chart is presented in Appendix A.
Customer IdentificationThe external customers for this project are Intel and the buyers and consumers of Intel’s products. The following is a list of the customers within Intel:
Accounting Purchasing Manufacturing Maintenance Quality Control-Quality Assurance Legal
The internal customers of this project are Intel’s Mobile Platform Research and Development division, Intel’s Sponsor Jered Wikander, PSU’s capstone faculty advisor Dr. Chien Wern, and PSU’s capstone instructor/director Dr. Faryar Etesami as well as the Flat Fan Capstone team.
Customer Interviews and FeedbackThe team has had two interviews and a tour of the Mobile Platform Group’s lab with
Intel Engineer and project sponsor Jered Wikander. During the meetings Jered emphasized that Intel was interested in exploring new or creative methods of air movement. The meetings clarified the intended use of the device as a stand-alone technology with direct application and manufacturing details to be determined by Intel at a later time. The absence of specific implementation led to the division of parameters into flexible and inflexible categories. The bulk of both meetings concentrated on this flexibility and determined targets for this project. Inflexible specifications, which were set by Intel through benchmarking tests on existing technologies, include the 3mm thickness requirement and air flow parameters. Flexible specifications, such as available and required power, footprint area, service life, and nominal operating conditions were assigned values for the purpose of this project, however, it was agreed that these targets might be adjusted in the event of a promising design that was limited by a parameter not associated with thickness or air flow. In addition, it was determined that certain aspects of the design could be ignored such as magnetic and electric fields which would be addressed in packaging methods by Intel or other manufacturers.
In the lab, the team was able to inspect many blowers of comparable size and scale. At the testing facility, Jered demonstrated the equipment and benchmarking methods used by Intel which would be available to the team for production and testing. The team also shared some of the early brainstorming ideas, in which Jered expressed interest and provided some possible direction and insight.
Product Design SpecificationsThis project has four main design goals to achieve. These goals are as follows: air
volume transport, air speed, air pressure, and housing space. Each of these requirements is of the highest priority to our customers. Lower priority goals represent the flexible specifications assigned by Intel and the team.
Figure 3: PDS Chart
•••• Highest Priority in design
•••
••
• Lowest Priority in design
Category Requirement Priority * Metric Target Customer Verification
Performance
Air volume transport ••••
actual cubic feet per minute
(acfm)
0.01-0.1 acfm INTEL Testing
Air speed ••••meters / second (m/s)
0.1-1 m/s INTEL Testing
Air pressure ••••inches of
water (IWG)
0.01-0.05 IWG INTEL Testing
Thickness •••• mm 3mm INTEL Prototype
Power supply ••• volts less than or equal to 20V (laptop battery) INTEL Prototype
Service life ••• years 7 yrs INTEL Design
Nominal operating conditions
•••Degrees Celsius
and humidity
Indoor ambient conditions INTEL Testing
Footprint area ••• mm within 200 x 300 mm INTEL Design
Figure 3: PDS continued
Category Requirement Priority * Metric Target Custome
rVerificatio
nEnvironment
Extreme operating conditions
•• Degrees Celsius Up to 95° C INTEL Testing
Durability •• shock able to withstand 3 foot drop INTEL Testing
Safety •Safety during
Installation/ Service
No sharp points or edges. All electrical meets UL and safety
codes.
Installer/ INTEL Prototype
Adaptability
ability to use in a variety of form functions
••• Yes/No able to adapt without significant redesign INTEL Design
Maintenance
Ability to repair or replace mechanical parts
•ease of
access to mechanica
l parts
Must be able to access if service life is
determined to be less than 7 years
INTEL Design
Manufacturing/ Installation
Cost •• Dollars between 2-5 for 20,000 units INTEL Design
installation •• time Time to install falls within cost requirements INTEL Design
manufacturing •• time Manufacturing falls within cost requirements INTEL Design
Materials
nothig toxic or exotic •• expense
and safetyMust meet design cost
requirements INTEL Design
House of Quality:
A House of Quality table lists engineering metrics listed in the PDS section of this document with measurable values. Once the design is completed, a prototype will be tested against the House of Quality. In this way, the project team may verify the success of the design.
Engineering Parameters
acfm m/s IWG mm V ° C years $/20,000 units
Requirements Customer Air volume transport INTEL
0.01 - 0.1
Air velocity INTEL 0.1 - 1.0
Air pressure INTEL 0.01 - 0.05
Thickness INTEL 3
Power supply INTEL ≤ 20
Footprint area INTEL ≤ 200x300 Operating conditions INTEL
20 - 95
Service life INTEL 7
Cost INTEL $2-5
Priority LegendHigh priority
Lower priority
Conclusions:The project team’s objective is to design and prototype an air moving device that
provides air flow comparable to currently available devices and fits within a space 3mm high. The projects challenge will be to prototype a device that meets the inflexible parameters identified in the PDS while achieving or exceeding the more flexible parameters assigned as targets for the team. Intel’s challenge for the team is to meet these requirements with the development of new and creative technology. A successfully designed miniature device could result in smaller PDA’s, thinner notebook computers and televisions.
Appendix A: Gantt Chart