T-top800Ultra-Soft High Thermal Conductive Gap Filler

Applications-• Between CPU and heat sink.• Between a component and heat sink• Flat-panel displays• Power supplies• High speed mass storage drives• Telecommunication hardware

Typical Properties-PROPERTY TESTMETHOD UNIT

Color Purple Visual -

Surface tack 2-side/1-side 2-side weak - -

Thickness 0.5~3.0 ASTM D374 mm

Density 3.3 ASTM D792 g/cm3

Application temperature -60~150 - ℃

COMPRESSION

Deflection @10 psi 3 - %

Deflection @20 psi 15 - %

Deflection @30 psi 33 - %

Deflection @40 psi 47 - %

Deflection @50 psi 60 - %

ELECTRICAL

Dielectric breakdown 10 ASTM D149 KV/mm

Surface resistivity >1011 ASTM D257 Ohm

Volume resistivity >1010 ASTM D257 Ohm-m

THERMAL

Thermal Conductivity 8 ASTM D5470 W/m*K

Thermal impedance@10 psi 0.295 ASTM D5470 ℃-in2/W

Thermal impedance@20 psi 0.251 ASTM D5470 ℃-in2/W

Thermal impedance@30 psi 0.213 ASTM D5470 ℃-in2/W

Thermal impedance@40 psi 0.165 ASTM D5470 ℃-in2/W

Thermal impedance@50 psi 0.134 ASTM D5470 ℃-in2/W

FLAME RATING

UL Flammability class V-0 UL94 -

LiPOLY T-top800 is a high deflection gap pad, with outstanding thermal conductivity and low thermal resistance in form shape. T-top800 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consis-tent transfer of heat. T-top800 was designed for thermal modules with limited gap sizes and low compression force.

Features-• Thermal conductivity: 8.0 W/m*K • High compression rate • Low thermal impedance• Silicone compound• UL 94V-0 qualified

Specifications-• Sheet form • Die-cut parts

T-pad900Ultra-Soft High Thermal Conductive Gap Filler

Typical Properties-PROPERTY TEST METHOD UNIT Color Gray Visual -

Reinforced layer Fiberglass - -

Surface tack 2-side/1-side 2-side weak - -

Thickness 0.5~2.5 ASTM D374 mm

Density 3.4 ASTM D792 g/cm3

Hardness @ without fiberglass 5 ASTM D2240 00

Application temperature -60~150 - ℃ COMPRESSION Deflection @10 psi 12 - % Deflection @30 psi 42 - % Deflection @50 psi 65 - % ELECTRICAL Dielectric breakdown >12 ASTM D149 KV/mm Surface resistivity >1011 ASTM D257 Ohm Volume resistivity >1010 ASTM D257 Ohm-m THERMAL Thermal Conductivity 9 ASTM D5470 W/m*K Thermal impedance@10 psi 0.282 ASTM D5470 ℃-in2/W Thermal impedance@30 psi 0.194 ASTM D5470 ℃-in2/W Thermal impedance@50 psi 0.129 ASTM D5470 ℃-in2/W

Applications-• Between CPU and heat sink.• Between a component and heat sink• Flat-panel displays• Power supplies• High speed mass storage drives• Telecommunication hardware

Features-• Thermal conductivity: 9.0 W/m*K • High compression rate • Low thermal impedance• Fiberglass reinforced

Specifications-• Sheet form • Die-cut parts

LiPOLY T-pad900 is an ultra soft and highly conformable thermally conductive interface pad. With a thermal conductivity of 9.0 W/m*K and a low thermal resistance under minimal pressure, T-pad900 offers excellent performance at an extremely competitive price. A fiberglass layer in the middle provides excellent cut-throughresistance.

Reliability-

Thermal Impedance & Compression- Test method: ASTM D5470

Compression

Force(psi)

Thermal Impedance (℃-in2/W) Compression (%)

0.5mm 1.0 mm 2.0 mm 0.5mm 1.0 mm 2.0 mm

10 0.154 0.282 0.498 10 12 14

30 0.145 0.194 0.342 12 42 52

50 0.117 0.129 0.140 29 65 79

Test Property Compression

Force (psi)

70℃

Initial 100hrs 250hrs 500hrs 1000hrs

Thermal Resistance 10 0.282 0.280 0.281 0.280 0.280

30 0.194 0.192 0.193 0.194 0.193

50 0.129 0.128 0.127 0.128 0.127

Test Property Compression

Force (psi)

150℃

Initial 100hrs 250hrs 500hrs 1000hrs

Thermal Resistance 10 0.282 0.281 0.281 0.280 0.281

30 0.194 0.192 0.192 0.193 0.193

50 0.129 0.128 0.129 0.128 0.128

Test Property Compression

Force (psi)

60℃ / 90 % RH

Initial 100hrs 250hrs 500hrs 1000hrs

Thermal Resistance 10 0.282 0.281 0.282 0.282 0.280

30 0.194 0.194 0.192 0.192 0.193

50 0.129 0.129 0.128 0.128 0.127

Test Property Compression

Force (psi)

Ultra Low Temp (-60℃)

Initial 100hrs 200hrs 300hrs 400hrs 400hrs

Thermal Resistance 10 0.282 0.282 0.281 0.282 0.280 0.281

30 0.194 0.194 0.193 0.193 0.194 0.193

50 0.129 0.128 0.129 0.128 0.129 0.129

Test Property Compression

Force (psi)

-40℃ (30min) +125℃ (30min)

0 cycles 100 cycles 200 cycles 300 cycles 400 cycles 500 cycles

Thermal Resistance 10 0.282 0.280 0.281 0.281 0.282 0.281

30 0.194 0.193 0.193 0.194 0.193 0.193

50 0.129 0.129 0.128 0.128 0.129 0.128

T-work7000

Applications-• Between CPU and heat sink.• Between a component and heat sink.• Flat-panel displays• Power supplies• High speed mass storage drives• Telecommunication hardware

LiPOLY T-work7000 is a high performance thermally conductive interface pad. T-work7000 offers outstanding thermal conductivity at11.0 W/m*K and extremely low thermal resistance under minimal force. T-work7000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an efficient and consistent transfer of heat. T-work7000 is designed for the most demanding of applications.

Thermal Impedance & Compression-

Test method: ASTM D5470

Compression

Force(psi)

Thermal Impedance (K-in2/W) Compression (%)

1.0mm T 2.0 mm T 3.0 mm T 1.0mm T 2.0 mm T 3.0 mm T

10 0.22 0.39 0.58 14 15 16

20 0.20 0.33 0.34 24 34 57

30 0.14 0.20 0.22 47 60 71

40 0.12 0.15 0.17 55 69 77

50 0.11 0.13 0.14 59 73 81

Features-• Thermal conductivity: 11.0 W/m*K • High compression rate • Extremely low thermal impedance

Ultra soft highly thermally conductive gap filler

PCB

Heat Sink

CHIP CHIP

Construction-Series Characteristics Configurations

T-work7000 Silicone compound with weak sticky surfaces.

Sheets form, Die-cuts parts

Ultra-Soft High Thermal Conductive Gap Filler

Typical Properties-

Property TEST METHOD UNIT

Color Gray Green Visual -

Surface tack 2-side/1-side 2-side weak - -

Thickness 1.0~3.0 ASTM D374 mm

Density 3.4 ASTM D792 g/cm3

Application temperature -60~150 - ℃ COMPRESSION

Deflection @10 psi 14 - %

Deflection @20 psi 24 - %

Deflection @30 psi 47 - %

Deflection @40 psi 55 - %

Deflection @50 psi 59 - %

ELECTRICAL

Dielectric breakdown >12 ASTM D149 KV/mm

Surface resistivity >1011 ASTM D257 Ohm

Volume resistivity >1010 ASTM D257 Ohm-m

THERMAL

Thermal Conductivity 11 ASTM D5470 W/m*K

Thermal Conductivity 6.3 ISO 22007-2 W/m*K

Thermal impedance@10 psi 0.223 ASTM D5470 ℃-in2/W

Thermal impedance@20 psi 0.202 ASTM D5470 ℃-in2/W

Thermal impedance@30 psi 0.140 ASTM D5470 ℃-in2/W

Thermal impedance@40 psi 0.119 ASTM D5470 ℃-in2/W

Thermal impedance@50 psi 0.108 ASTM D5470 ℃-in2/W

FLAME RATING

UL Flammability class V-0 UL94 -

Test Property Compression Force (psi)

-40℃ (30min) +125℃ (30min) 0 cycles

100 cycles

200 cycles

300 cycles

400 cycles

500 cycles

Thermal Resistance

10 0.223 0.223 0.224 0.223 0.224 0.223

30 0.140 0.142 0.141 0.142 0.143 0.143

50 0.108 0.109 0.110 0.110 0.109 0.110

Reliability-

Test Property Compression Force (psi)

70℃ Initial 100hrs 250hrs 500hrs 1000hrs

Thermal Resistance

10 0.223 0.224 0.223 0.224 0.225

30 0.140 0.141 0.141 0.141 0.142

50 0.108 0.110 0.109 0.109 0.111

Test Property Compression Force (psi)

150℃ Initial 100hrs 250hrs 500hrs 1000hrs

Thermal Resistance

10 0.223 0.224 0.225 0.224 0.225

30 0.140 0.142 0.143 0.142 0.143

50 0.108 0.110 0.111 0.109 0.108

Test Property Compression Force (psi)

60℃ / 90 % RH Initial 100hrs 250hrs 500hrs 1000hrs

Thermal Resistance

10 0.223 0.222 0.223 0.222 0.221

30 0.140 0.141 0.142 0.142 0.141

50 0.108 0.109 0.108 0.108 0.107

Test Property Compression Force (psi)

Ultra Low Temp (-60℃) Initial 100hrs 200hrs 300hrs 400hrs 400hrs

Thermal Resistance

10 0.223 0.222 0.223 0.223 0.224 0.223

30 0.140 0.141 0.142 0.142 0.143 0.141

50 0.108 0.111 0.109 0.110 0.109 0.110

T-work8000

Applications-• Between CPU and heat sink.• Between a component and heat sink.• Flat-panel displays• Power supplies• High speed mass storage drives• Telecommunication hardware

LiPOLY T-work8000 is a high performance thermally conductive interface pad. T-work8000 offers outstanding thermal conductivity at15.0 W/m*K and extremely low thermal resistance under minimal force. T-work8000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an efficient and consistent transfer of heat. T-work8000 is designed for the most demanding of applications.

Thermal Impedance & Compression-

Test method: ASTM D5470

Compression

Force(psi)

Thermal Impedance (K-in2/W) Compression (%)

1.0mm T 2.0 mm T 3.0 mm T 1.0mm T 2.0 mm T 3.0 mm T

10 0.185 0.293 0.335

10

20 41

20 0.122 0.167 0.174 60 72

30 0.074 0.106 0.115 74 82

40 0.054 0.076 0.083 82 87

50 0.046 0.059 0.064 86 90

10

42

64

71

79

Features-• Thermal conductivity: 15.0 W/m*K • High compression rate • Extremely low thermal impedance

Ultra soft highly thermally conductive gap filler

PCB

Heat Sink

CHIP CHIP

Construction-Series Characteristics Configurations

T-work8000 Silicone compound with weak sticky surfaces.

Sheets form, Die-cuts parts

Ultra-Soft High Thermal Conductive Gap Filler

PROPERTY TEST METHOD UNIT

Color Purple Visual -

Surface tack 2-side/1-side 2-side weak - -

Thickness 1.0~3.0 ASTM D374 mm

Density 3.3 ASTM D792 g/cm3

Application temperature -60~150 - ℃

COMPRESSION

Deflection @10 psi 10 - %

Deflection @20 psi 42 - %

Deflection @30 psi 64 - %

Deflection @40 psi 71 - %

Deflection @50 psi 79 - %

ELECTRICAL

Dielectric breakdown >12 ASTM D149 KV/mm

Surface resistivity >1011 ASTM D257 Ohm

Volume resistivity >1010 ASTM D257 Ohm-m

THERMAL

Thermal Conductivity 15 ASTM D5470 W/m*K

Thermal Conductivity 8.5 ISO 22007-2 W/m*K

Thermal impedance@10 psi 0.185 ASTM D5470 ℃-in2/W

Thermal impedance@20 psi 0.122 ASTM D5470 ℃-in2/W

Thermal impedance@30 psi 0.074 ASTM D5470 ℃-in2/W

Thermal impedance@40 psi 0.054 ASTM D5470 ℃-in2/W

Thermal impedance@50 psi 0.046 ASTM D5470 ℃-in2/W

FLAME RATING

UL Flammability class V-0 UL94 -

Typical Properties-

Reliability-

Test Property Compression

Force (psi)

70℃

Initial 100hrs 250hrs 500hrs 1000hrs

Thermal

Resistance

10 0.185 0.183 0.184 0.185 0.187

30 0.074 0.076 0.076 0.075 0.077

50 0.046 0.048 0.047 0.046 0.048

Test Property Compression

Force (psi)

150℃

Initial 100hrs 250hrs 500hrs 1000hrs

Thermal

Resistance

10 0.185 0.186 0.187 0.186 0.187

30 0.074 0.076 0.077 0.077 0.078

50 0.046 0.048 0.047 0.047 0.048

Test Property Compression

Force (psi)

60℃/90%RH

Initial 100hrs 250hrs 500hrs 1000hrs

Thermal

Resistance

10 0.185 0.186 0.185 0.184 0.183

30 0.074 0.076 0.077 0.076 0.075

50 0.046 0.047 0.046 0.045 0.045

Test Property Compression

Force (psi)

Ultra Low Temp (-60℃)

Initial 100hrs 200hrs 300hrs 400hrs 400hrs

Thermal

Resistance

10 0.185 0.186 0.185 0.184 0.185 0.186

30 0.074 0.075 0.075 0.073 0.074 0.075

50 0.046 0.047 0.046 0.045 0.047 0.047

Test Property Compression

Force (psi)

-40℃(30min) +125℃(30min)

0 cycles 100 cycles 200 cycles 300 cycles 400 cycles 500 cycles

Thermal

Resistance

10 0.185 0.183 0.184 0.186 0.185 0.186

30 0.074 0.073 0.074 0.077 0.076 0.076

50 0.046 0.047 0.045 0.048 0.047 0.047