Excellence in Connectivity Solutions · 2019. 5. 15. · Excellence in Connectivity Solutions . IMS June 2014 / S.Jarno . Facts … The big “data boom” 5 Exabyte . of data is

Excellence in Connectivity Solutions

IMS June 2014 / S.Jarno

MXP The Ultimate 50GHz Multicoax Solution



Facts … The big “data boom”



Facts … The big “data boom”

5 Exabyte of data is created every

2 days

the dawn of civilization & 2003

The same amount that was created between

1 Exabyte = ~ 245 Millions DVDs



…

The world now holds as twice as many bytes of data as there are

liters of water in all its oceans



Speed matters



Everyone wants speed

There are 2 billions active mobile-broadband subscriptions in the world [3G or 4G connection] That is 29.5 percent of the global population Mobile-broadband subscriptions have grown 40 percent annually over the last three years


Increasing speed causes signal integrity issues

• Fast digital stream should be treated as an RF signal

• Digital customers started using RF connectors

• Threaded RF connectors are cumbersome in their applications


More data, higher speed drives chip development and requires bleeding edge measurement technology

Closed eye – bad signal integrity Clean and open eye


What “High Speed Digital Testing” demands

• Lowest loss from the DUT to the test equipment

• Best signal integrity performance - Electrically “transparent”

• Dense and space saving PCB connectivity solutions

• Proven and tested solutions and components

• Multicoax interconnectivity between systems and modules with customized solutions

• RF cabling solutions optimized for highest data rates and frequencies, lowest loss, best phase matching and highest flexibility


Excellence in Connectivity Solutions IMS June 2014 / S.Jarno

Features

• Operating range up to 50GHz

• High density – low loss

• Extensive technical support

• 3D-files, modeling data and footprints

Benefits

• Space saving

• Shorter lines between chip and PCB connector

• Reliable push on mating

• Easy channel management

• Overall cost savings and service benefits

MXP – The reliable multicoax solution


MXP portfolio – PCB connectors Features

• 1x8 and 2x8 ganged versions

• Pitch 4mm (0.16”)

• Via-in-pad capable

• 0.7mm (0.028”) pin size allows easy matching to smallest trace width

• SMD technology – ground pins for more mechanical stability of solder joint

• MXP 40GHz and MXP 50GHz versions.

• Keyed and non keyed connectors available

Non-coded Coded


MXP portfolio – Assemblies Features

• Broad range of standard break-out assemblies : MXP-to-SK (PC 2.92) [40Ghz], SMA [18GHz] or PC2.4 [50GHz] and jumper assemblies MXP-to-MXP available

• 1x8 and 2x8 ganged versions

• Insertion loss lower than 2 dB up to 22.5 GHz for a 30 cm (12”) assembly

• Assemblies exclusively delivered with thin and high flexible MULTIFLEX_53-02 microwave cable

• Absolute phase matched +/-2ps

• Customized assemblies on request

• Standard lengths are typically 152 mm (6”), 229 mm (9”), 305 mm (12”), 610 mm (24”)


MXP portfolio – Assemblies

MXP18 MXP40 MXP50

18GHZ 40GHz 50GHz

SMA (female) SK (male or female) PC2.4 (female)

1x8 and 2x8 Compatible with MXP40

1x8 and 2x8

1x8 and 2x8 Compatible with MXP40


MXP adaptor

• Same performance as a MXP to MXP jumper assembly, 40GHz

• Board to Board distance: 40mm


MXP Board to Board concept


Features

• Short MXP break-out assemblies minimize loss

• Simple and reliable coupling between QuickMate nut on SUCOFLEX test lead and ergonomic handle on MXP cable

• No torque wrench required

Benefits

• Low loss system solution

• Still high density on board space saving

• Time saving cost saving

MXP – Low loss break-out system with SUCOFLEX test leads

Ergo-SK: fast and reliable screwed connection


MXP – Typical electrical data

Typical return loss for mated condition (PCB connector with MF53 assembly, gated measurement)


Assembly

• MXP break-out assembly to SK (PC 2.92)

• Cable: HUBER+SUHNER MULTIFLEX_53

PCB

• MXP PCB connector

• Fan-out to MMPX (adaptors to SK included)

• Material: Rogers RO3003

• Substrate thickness: 5 mil (0.127 mm)

• Dielectric constant εr: 3

• Stack-up: Microstrip configuration

MXP – Evaluation kit


• Only by using an optimized footprint, the performance of the connectors can be unleashed

• Layout must be matched to the specific stackup as material, thickness .. Impacts the design.

• PCB information and stack-up information is crucial

• Using 3D field simulation

• Review of footprint implementation if desired

MXP - Customer specific footprint optimization


Huber + Suhner will support you in this task!


Field simulations in action: Via-in-pad to stripline



• Operating range up to 50GHz

• Reliable push-on mating, up to 16 channels with one mating

• Shorter lines between chip and PCB connector

• Space saving

• Easy channel management

• Overall cost savings

• PCB connector and standard assemblies on stock

• Footprint optimization service

Summary MXP customer benefits

Excellence in Connectivity Solutions Excellence in Connectivity Solutions

Many thanks Questions?


Stephanie Jarno NA Market Manager Instrumention [email protected]

mailto:[email protected]�


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Excellence in Connectivity Solutions · 2019. 5. 15. · Excellence in Connectivity Solutions . IMS June 2014 / S.Jarno . Facts … The big “data boom” 5 Exabyte . of data is