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22-23 November 2016
Heriot Watt University Conference Centre Edinburgh
Event Programme
Photonics & Opto-Electronics Packaging
“Giving Light to Your System Design ....”
An International Conference & Exhibition
www.imaps.org.uk www.jemiuk.com
www.epic-assoc.com
www.semi.org
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Contents
Welcome 5
About IMAPS-UK 6
About EPIC 8
About JEMI 10
About SEMI 13
Conference Agenda 14-15
Technical Presentations 17
About the Speakers 29
Exhibitor Information 39
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As Director of the EPSRC Centre for Innovative Manufacturing in Laser-based Production Processes (CIM-Laser) I am very pleased to welcome you to Heriot-Watt.
CIM-Laser is a 5-university consortium supported by £5.6m of funding from the Engineering and Physical Sciences Research Council. Our research covers laser micro-machining and micro-bonding processes; fusion-based processes (welding and additive manufacturing); sensing and process control; and laser development and engineering. We will be pleased to showcase a selection of our activity during this conference.
I wish you all an informative and thought-provoking conference and also hope that you have a pleasant stay at Heriot-Watt and hope that you have the opportunity to see a little bit of Edinburgh in your time here.
Prof Duncan Hand
Director of CIM-Laser
Welcome ...
About IMAPS-UK ...
The International Microelectronics, Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and advanced electronics packaging. Our Society offers chapters around the globe, creating a global network with more than 6,000 worldwide members. The United Kingdom Chapter of IMAPS was the first international Chapter and continues to maintain strong links with other European countries, the USA and Asia.
IMAPS-UK is a registered Charity and plays a leading role in the UK’s advanced electronics industry. We work closely with other governing bodies, societies, industrial and academic institutions, to ensure that members are kept up to date with the latest developments and innovations. We continue to provide a leading forum for the industry to meet and shape its future.
The Society's objectives are achieved through regional seminars, workshops, major international conferences and exhibitions, the publication of newsletters and technical papers as well as other activities relevant to promoting knowledge within the industry.
Further Information
If you have any other enquiries please visit:
www.imaps.org.uk/
or contact us at:
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Altogether Better Connected!
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IMAPS-UK welcome you to the first Photonics and Opto-Electronic Packaging Conference, a joint event organised by IMAPS-UK, EPIC, JEMI UK and SEMI, which will give you a broad perspective of the latest developments in packaging and assembly technologies in applications that will have an ever increasing impact in a wide range of industrial and consumer sectors. We hope that you will find the event both interesting and informative.
We would like to thank Heriot Watt University, our hosts, for their support in arranging the access to their conference facilities and the tour of the research laboratories. We also offer a special thanks to the presenters, who have all given their time freely.
At IMAPS-UK we are always interested in your feedback and ideas for future events. The organising team will welcome your
comments. If you find this conference to be useful and enjoyable, please tell your friends and colleagues, if not, then please tell us.
We shall look forward to seeing you again at our future events.
Sincerely,
Dr Suzanne Costello
Chair - IMAPS-UK
2015-2017
As an advocate of the know-how of our 300 members along the entire value chain, EPIC plays a central role in guiding our members and potential users in all aspects related to packaging.
This includes:
1. Choosing the right package type (eg. 7 or 14-Pin Butterfly with RF and DC connectors; support for large optical fibre arrays…)
2. Addressing issues in fiber to chip packaging (ie. recommending standard fiber pitches of 127, 250 or 500 µm, or non standard 50 µm for higher integration, as well as laser welding or epoxy attachment of the fiber arrays)
3. Packaging of micro-optics, including single micro optic as well as micro optical arrays
4. Packaging of DC electrical contacts (ie. wirebond pitch, pin or ribbon connector types…)
5. Packaging of RF contacts (ie. bondbap size, metallization type and SMA, MSMP, V- or K- connector types)
6. Addressing thermal issues (ie. passive or peltier type cooling)
7. And last but not least, choosing the right materials and equipment for the packaging (ie. pick&place machinery, solders)
In the field of optoelectronic packaging, EPIC’s technology team has the know-how to promote the packaging technologies of its members to a wider audience, design standards and ultimately increase user awareness of the benefits of integrated photonic technologies.
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About EPIC ...
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Jose Pozo, Director of Technology and Innovation at EPIC, +31 6 26 978 312 Carmen Ferrari, Events and Marketing Manager at EPIC, +31 6 14 544 255
Dear Participants,
Welcome to Edinburgh and to the first ever Photonics & Opto-Electronics Packaging Conference, organised joinltly by IMAPS-UK, SEMI, JEMI and EPIC. We are proud to be partners and look forward to meeting you here at the state of the art premises of the Heriot Watt University.
EPIC heavily promotes the sustainable development of organisations working in the field of photonics in Europe and we are very active in the field of packaging of optoelectronic devices, as we consider it one of the main bottlenecks in bringing innovative photonic-enabled products to the market.
We look forward to welcoming you in person and encourage you to reach out to us.
The EPIC team
About ....
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JEMI UK: SUPPORTING THE EUROPEAN MICRO AND NANOTECHNOLOGIES SECTORS
JEMI is the Joint Equipment and Materials Initiative and is the association of manufacturers and suppliers of equipment, materials and services for the Semiconductor and associated manufacturing industries such as Plastic Electronics and Nanotechnology in the UK and Ireland.
THE JEMI MISSION is to promote the development of a strong infrastructure to support the growth of companies wishing to design, develop and manufacture Semiconductor, and associated technologies, devices within the UK and Ireland. We also aim to foster and develop relationships between member companies in the Equipment and Materials supply sector as well as with end user companies and academic institutions.
JEMI enables companies to fully develop business in this exciting sector which enjoys good growth and significant Government backing and to enjoy enduring relationships that simply cannot be fostered in normal supplier/customer meetings where time is short and subjects are focussed on a few topics. JEMI’s ‘evening with’ dinners bring together suppliers with prospective customers and business partners in a convivial and open forum at which many long lasting and fruitful relationships have been forged, and are held regularly throughout the year alongside technical visits and workshops.
Networking is dynamic through JEMI's strong network which extends throughout the UK and Ireland across mainland Europe and beyond which is leveraged effectively to create business opportunities for our membership. Each year amongst other activities, we organise a regular program of hosted and themed networking events designed to put our membership in touch with prospective customers and to highlight areas of new technology. We run a regular series of events throughout the year to organisations throughout Europe.
On behalf of JEMI I’d like to welcome everyone to the POP event. It’s an exciting time for Photonics and in particular Photonics Packaging as the field continues to grow and adapt, remaining always open to new technological advances. Our organization is confronting a time of many changes and meeting these changes during a time of larger nation-wide and global change. The world of nanotechnology is an exciting area in which to work, and we’ll continue to meet and bring committed people together in forums like this, to ensure photonics remains at the cutting edge.
During the POP conference, a comprehensive review from user perspectives will take place. Packaging design and software papers from Huawei amongst others will be given, and latest services, equipment and testing information shared. Additionally, a strong line up of Integrators and User cases will be outlined.
Transforming the way we operate to continuously improve our ability to maintain technical standards and make new discoveries is continually required. We should all be very proud of achievements to date. To make sure this moves forward into the future, throughout this conference, let's stay engaged, keep proactive and help us shape the future of photonics packaging.
In JEMI we create business opportunities for members through our networking and lobying activities. Our Offices are based near Bath, from where we co-ordinate a wide range of activities to further the interests of the industry and our membership. Please feel free to browse our site www.jemiuk.com and contact us if you would like to learn more about the benefits of membership.
Ian Burnett
Chairman
JEMI
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About.... SEMI is the global industry association serving the manufacturing supply chain for the micro- and nano-electronics industries, including:
•Semiconductors
•Photovoltaics (PV)
•High-Brightness LED
•Flat Panel Display (FPD)
•Micro-electromechanical systems (MEMS)
•Printed and flexible electronics
•Related micro- and nano-electronics
The industries, companies, and people SEMI represents are the architects of the electronics revolution. SEMI members are responsible for the innovations and technologies that enable smarter, faster, more powerful, and more affordable electronic products and devices that bring the power of the digital age to more people every day.
For more than 40 years, SEMI has served its members and the industries it represents through programs, initiatives, and actions designed to advance business and market growth worldwide. SEMI supports its members through a global network of offices, activities, and events in every major electronics manufacturing region around the world.
SEMI facilitates the development and growth of our industries and manufacturing regions by organizing regional trade events (expositions), trade missions, and conferences; by engaging local and national governments and policy makers; through fostering collaboration; by conducting industry research and reporting market data; and by supporting other initiatives that encourage investment, trade, and technology innovation.
In addition to supporting access to regional markets, SEMI helps its members explore diversified business opportunities and contributes to the growth and advance of emerging and adjacent technology markets.
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Conference Agenda – Day 1
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12:00 Registration & Exhibition
13:00 Opening Welcome and introduction from HWU
13:10 Sponsor Welcome & Introduction
13:15 Exhibitor Elevator Pitches
13:30 ** Session 1 ** Setting the Scene – User Perspectives
• KEYNOTE 1: Peter O’Brien, Head of Photonics Packaging Research, Tyndall National Institute. - "Packaging for integrated photonics – technologies, design rules and volume manufacture“
• Nicola Pavarelli, Senior Process Engineer (Photonics Packaging), Huawei Technologies - "Optoelectronic Assembly Challenges from the Telecommunications Industry“
• Andy Sellars, Lead Technologist, Manufacturing & Materials, Innovate UK - "Innovate UK support for Photonics and Electronics Packaging"
• Ewit Roos, Managing Director, Photon Delta - "Open innovation in end-to-end ecosystem"
15:00 BREAK
15:30 ** Session 2 ** Packaging Design & Software
• Hossein Moeini, Applications Engineer - PIC design Solutions, PhoeniX B.V. "Introduction to Assembly Design Kits (ADKs) for Photonic Packaging“
• Adrian Wonfor, Senior research Fellow, University of Cambridge. " European Application Support centres“
• Karl-Otto Velthaus, Senior Researcher & Project Manager, Fraunhofer HHI, " Co-designed high-speed and low power modulatro/driver assembly and its impact on Packaging”
16:30 BREAK
17:15 ** Session 3 ** Packaging Services, Equipment and Testing – I
• Martin Van Acht, Director, Tegema/MA3 - "Fiber Optics – Projects and applications“
• Antonello Vannucci, Chief Technology Officer, Linkra - "Photonic Integrated Package Design“
• Andrew Thompson, Technical Sales Manager, Optocap - "Fibre-coupled PICs: streamlining the packaging experience"
18:15 End day 1
18:30 Drinks Reception and Buffet Dinner
Conference Agenda – Day 2
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08:30 Registration & Exhibition
09:00 ** Session 4 ** Packaging Services, Equipment & Testing – II
• Keynote 2: Eric Mounier, Senior Analyst MEMS Devices & Technologies, Yole Developpement - "Silicon Photonics Markets Outlook“
• Ignazio Piacentini, Director Business Development, ficonTEC Service GmbH - "Trends of Assembly & Testing of PICs with increasing volume numbers“
• Guénaël Ribette, General Manager, Microtest - "Different sketches in relation with current thermal applications“
• Joost van Kerkhof, CEO, LioniX International - "PIC packaging needs; from PIC characterization to PIC production“
• Alessio Corazza, Business Development Manager, Saes Getters - "Advanced solutions to prevent degradation of LED systems and photonic devices related to gaseous contaminants“
10:50 BREAK
11:30 ** Session 5 ** Integrators and User Case Studies - I
• Mikko Karppinen, Research Team Leader, Silicon Photonics, VTT - "Advances in photonics integration for miniaturized modules and for harsh environments“
• Antonio La Porta, Research Staff Member, IBM - "Scalable Optical Coupling between Polymer Waveguides and a Silicon Photonics Chip“
• Michael Robertson, VP Research Programmes, Huawei-CIP - "Low Cost packaging solutions in Photonic Integrated Circuits with large port counts“
• Ramsey Selim, Senior Design Engineer, Kaiam - “Embracing Diversity:Hybrid Integration for Data Centre Optics”
12:50 LUNCH
Table Top Exhibits, Networking
14:20 ** Session 6 ** Integrators and User Case Studies - II
• Pim Kat, President, Technobis Group - "From a Naked Die to a Working System“
• Jose Pozo, Dissemination Manager, MIRPHAB & CTO of EPIC - "MIRPHAB: A Pilot Line for Mid-Infrared Sensors and Spectrometers“
• Dmitrij Siskin, Development Engineer, Oxsensis - "Design Requirements for Opto-Electronic Sensing Systems in Harsh Environments"
15:20 Summary and Wrap up session
15:30 Visit/Lab Tour Heriot-Watt University
Conference Sessions
– SESSION 1: Setting the Scene – User Perspectives
– SESSION 2: Packaging Design & Software
– SESSION 3: Packaging Services, Equipment and Testing - I
– SESSION 4: Packaging Services, Equipment and Testing – II
– SESSION 5: Integrators and User Case Studies - I
– SESSION 6: Integrators and User Case Studies - II
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The presentations will be made
available on line after the event.
SESSION 1: Setting the Scene – User Perspectives
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2: Optoelectronic Assembly Challenges from the Telecommunications Industry As one of the strongest players in the field of telecommunications, Huawei faces constant challenges in order to maintain its status. It is a pleasure to share some of these with the optoelectronic packaging community. The presentation will start with a general overview of the requirements (and associated challenges) in field of electronic and photonic packaging and will proceed on to the more interesting aspects for this audience: optical components and modules. The talk will also cover some of the strategies on material innovation and cutting-edge automated assembly techniques, which need to be pursued in the immediate and near future in order to enable the breakthrough of silicon photonics for mass production of low-cost, high-bandwidth optical systems.
1: Packaging for integrated photonics – technologies, design rules and volume manufacture. Integrated photonics presents an opportunity to address future market needs in areas such as high speed optical communications, bio-medical diagnostics, and sensors (eg. internet of things). This talk will give an overview of key packaging challenges for integrated photonics, currently available packaging foundry capabilities, packaging design rules and standards, and recent initiatives to address the need for scale-up to volume manufacture. Application examples will also be presented to highlight how packaging can influence system performance and cost of manufacture.
3: Innovate UK support for Photonics and Electronics Packaging In January 2016, the then Chancellor George Osborne announced the Compound Semiconductor Applications Catapult – to be located in South Wales. This will be the eleventh Catapult, complementing the UK’s growing Catapult network. The Compound Semiconductor Applications Catapult complements other investments in the region, including the Institute for Compound Semiconductors at Cardiff University and the Centre for Compound Semiconductors. Together, these facilities create a critical mass of equipment, technical expertise and market knowhow, establishing Europe’s largest cluster for compound semiconductor activities. This paper discusses the role of the Catapult network in driving economic growth through translational research and business scale-up. It describes how the Compound Semiconductor Applications Catapult will support key enabling technologies of the future, which could impact on health, infrastructure and transport – to name a few. The paper highlights recent investments in packaging and interconnect technology, and how they support growth in the UK electronics and photonics sector.”
4: Open innovation in end-to-end ecosystem Companies and researchers in the PhotonDelta ecosystem have developed procedures to ensure that they are able to scale production. So that if you make 1000 chips, a sufficient number of chips will be within a tight specification demanded by the client. But it turns out that making the first run of chips is actually the easiest part. The chip needs to be packaged - connected to the outside world in some way. This required nanotechnology expertise. The reliability engineering that follows that is also expensive and takes time. But it needs to be done. Standards are high - it is similar to the reliability demanded by spacecraft, with an expected lifespan of 30 years. There are very clear cycles in chip production. The first cycle produces chips that the customer wants but only has an 80% reliability. The next stage is "beta"; there comes a point where the reliability has been ramped up where large scale production makes commercial sense and the failure rate has been brought down as low as possible. We believe that the open innovation PhotonDelta ecosystem could also play a role in helping companies accelerate in these very important packaging and reliability-engineering phases.
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SESSION 2: Packaging Design & Software
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5: Introduction into Assembly Design Kits (ADKs) for Photonic Packaging In this presentation PhoeniX Software will show how Assembly Design Kits (ADKs) can be used in the design of packaging for photonics. Assembly Design Kits are like libraries of the different parts used within packaging. These libraries can be connected to design and simulation tools like e.g. PhoeniX Software's OptoDesigner. The library contains information about the different Building Blocks. This Building Block information can contain information about geometry, connection points, and models for optical, electrical and thermal behaviour. The information on the building blocks in the ADK are supplied by the different suppliers. On top of this, the ADK contains information about the different assembly steps. Using this information assembly flows for the final design can be created. For the whole package design system simulation can be performed and assembly constraints can be flagged directly in the design phase. The ADK will greatly reduce the design complexity of optical packages by using a modular Building Block approach, with all information directly available provided from the different suppliers.
7: Co-designed high-speed and low power modulator/driver assembly and its impact on packaging The next transceiver generation is aiming towards higher bit-rate, lower power consumption and smaller package size. Co-design of Photonic-IC (PIC) and Electronic-IC (IC) can bridge the gap between higher bitrate and lower power consumption. It offers the possibility to make use of low power technologies like BiCMOS and even more opens up for low power designs like open-collector drivers. An overview on co-design approaches developed at HHI and its impact on the packaging technology will be given.
6: European Application Support Centers offering PIC services The PICS4ALL project aims to ease access to photonic integration by establishing a number of European application support centres whose purpose is to provide a first port of contact for anyone who has a potential application for photonic integrated circuits (PICs). These application support centres are supported by people with extensive experience in designing PICs and so can help potential users through the whole process of translating ideas into designs and layouts which are compatible with the most appropriate available foundry technology.
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SESSION 3: Packaging Services, Equipment and Testing I
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8: Fiber Optics – Projects and applications’ The next couple of years humanity will be confronted with an exponential growth of technological advancedness. More and more often new technologies arise, changing our world dramatically. Computing, sensor networks, 3D printing and robotics will irrevocably result in an immense increase of data traffic. Dealing with this enormous increase of data will require new devices and systems, resulting in new technologies. One of these new technologies is the use of photonics and associated fiber networks. Data traffic using light. MA3 Solutions is focusing on fiber optics assembly technologies and equipment. MA3 specialises in a multidisciplinary systematic approach to solving your technical, micro-assembly related challenges. We offer you more than just a tool or a process description. We provide solutions, which have been rigorously tested, embedded in an integrated process and come with proof of performance. Instead of looking for an existing solution that can be tweaked to solve your challenge though trial and error, we rapidly analyse your problems, find the gaps, and define a solution without preference for any existing products or technologies.
10: Fibre-coupled PICs: streamlining the packaging experience Developers are working hard to simplify the assembly of integrated photonic devices so that chips can enter a broad range of markets at more attractive price-points. Andrew Thompson, Technical Sales Manager at Optocap, shares the firm's strategy for bringing down the cost and complexity of PIC packaging.
9: Photonic integrated package design Packaging of photonic and electronic devices in very high density multifunctional optoelectronics modules is becoming of strategic importance for the next generation of optical components at lower costs and compatible with high-volume manufacturing. In order to penetrate the markets, a packaging design flow must be developed taking into account the main areas of interest (mechanical, optical, electrical, and thermal). Regarding the optical coupling, two distinct approaches are discussed: edge- and vertical-coupling. Edge-coupling can offer lower insertion-losses and more broadband operation, but has significantly stringent alignment tolerances. Vertical-coupling offers relaxed-alignment tolerances, allow for optical access at any point on the PIC surface and remove the need for PIC polishing or surface preparation. The packaging of electrical interconnects on a photonics chip can be just as challenging as the optical one, especially for high-speed electrical signals (even greater than 40 GHz). Common approaches are hybrid integration, either flip-chipping an electronic-IC onto the PIC, or simply connecting the PIC directly to a PCB through wire-bonds.Due to the presence of thermal gradients induced by on-chip lasers, heaters and electronic components, the behavior of the photonic chip may be altered and performances of the overall system compromised. Further, strong thermal gradients induce also mechanical stresses that can be a critical issue for example thinking of fiber coupling. It is therefore mandatory to develop tools able to study and manage these issues in a multi-physical environment. An overview of the main photonic packaging challenges and solutions implemented in Linkra’s packaging platform for Silicon Photonic (SiPh) and InP PICs will be shown.
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SESSION 4: Packaging Services, Equipment and Testing II
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11: Silicon Photonics Markets Outlook The Si Photonics technology has reached a tipping point where applications are well defined and market promise is large. Yole talk will review the current and future status of Si Photonics applications and market forecast.
13: Smart & Easy Way To Work With Pick & Place Machine MICROTEST introduces the different bonding processes available on pick&place machine, available for Chip to Chip ( C2C) or Chip to Wafer ( C2W). For each bonding process, we will explain you the technic and what is necessary to do it easily. At the end, we will present you one accurate and very flexible bonding machine, able to succeed with all these bonding processes. The PP6 is now well known Worldwide as the best compromise on the market for R/D and small production.
12: Trends of assembly and testing of PICs with increasing volume numbers The cost of packaging of PICs (Photonic Integrated Circuit) and more in general that of opto-electronics micro-assembly has been discussed many times before and it is amply recognized that advanced automation is the key to keep this cost at bay, thus helping the widespread adoption of photonics-based solutions in a number of different market segments. Recognition of this need has also led to government-level initiatives in Europe and USA. ficonTEC is a machine manufacturer that has been focusing entirely on photonics and micro-assembly technologies and has directly witnessed the growth of the photonics market place in recent years. ficonTEC has also witnessed a very large variety of assembly / packaging processes and worked closely with a number of customers to streamline the industrialisation of packaging methods and techniques. There is an ongoing debate – also within our company – on issues such as machine flexibility and/or speed, requirements that are often conflicting. The talk will briefly illustrate the main ‘ingredients’ and configuration of our machines and discuss / share with the audience how this will be influenced by production volume numbers. Moving on with photonics design rules and standards that take into account packaging processes (and automate testing too!) from the very beginning will also help in targeting the next generation machines with a general increase in speed and efficiency, that equates to a lower cost-per-part.
15: Advanced solutions to prevent degradation of LED systems and photonic devices related to gaseous contaminants LED packages and LED based products have been adopted in a wide variety of applications. Generally their robustness and durability are well appreciated features, but it is known that if they are exposed to harsh environmental conditions, to moisture, to Volatile Organic Compounds (VOCs) or to aggressive gaseous contaminants a premature degradation of their performances can occur. In particular Sulfur-compounds, Chlorine-compounds or VOCs can be detrimental to LED systems, LED luminaires, Laser Diodes inducing blackening, premature light emission decay and possible corrosion. In addition, it is well-known that the presence of VOCs within sealed LED bulbs can cause lumen output degradation during the device life. Our work describes these undesirable mechanisms and presents advanced getter solutions recently developed to efficiently remove the detrimental contaminants in the devices and to prevent the degradation of the luminous performances.
14: PIC packaging needs; from PIC characterization to PIC production PIC packaging is seen as a major challenge for implementing PICs in mid and high volume applications. The definition of standardized packages is often seen as an enabler to address this challenge. However, the number of interface parameters and the wide range of variation of these parameters make it difficult to identify a standard which fits all PIC packaging needs. In this presentation we will review the packaging needs for the characterization and validation needs of PICs and how this relates to the packaging requirements in PIC production. We present a characterization packaging service which is being offered by LioniX International as well as PIC production packaging examples.
PRESS 12000N
ALD
MICROMANIPULATORS
PROBERS DC-HF – CRYO - VACUUM ELECTRIC SAW
VPO - RSO – RTP - RSS PICK & PLACE
MINI - PLACER
HOT CHUCK
Thermal chuck - 65 / +300°C
CLUSTERS
LITHOGRAPHY
SUBSTRATE BONDER
EVAPORATORS
THERMAL CONDITIONNER -85°C up to +225°C OVENS – FURNACES – INCUBATORS….
CVD - PECVD
SCRIBER 100 & 200 mm
PROBE SHIELD -65 / +300 °C
SPIN COTATER –DEVELOPER WET PROCESS…
TOOLS AND CONSUMABLES
TURBO PUMP
SESSION 5: Integrators and User Case Studies - I
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16: Advances in photonics integration for miniaturized modules and for harsh environments VTT develops advanced miniature components and modules for photonics systems. High performance, high reliability, and miniaturisation of modules are achieved by combining novel photonics hybrid-integration and packaging methods with already mature processes. For instance, the robust multilayer ceramic platform enables multidisciplinary integration of optoelectronics and micro-optics with various MEMS devices and microwave electronics, and towards the system-on-package. Key technical approaches and challenges are reviewed with application examples on interconnects and sensors.
18: Low Cost packaging solutions in Photonic Integrated Circuits with large port counts Usually, packaging is treated as an afterthought by photonic device designers. As device packaging and testing represent about 80% of device cost, this is a serious mistake. In this talk, we will discuss some of the issues to be addressed and illustrate how these are being tackled in a number of different approaches. CIP Technologies develops optoelectronic technology for ICT applications. The company has evolved from the photonics research department of BT Labs at Martlesham Heath, Ipswich, which was for many years at the forefront of development of optical fibre communications. Since January 2012, CIP has been a wholly owned subsidiary of Huawei Technologies Ltd. The company designs and fabricates advanced optoelectronic devices based on Indium Phosphide. www.ciphotonics.com www.huawei.com
19: Superpowers; Scaling Up Hybrid Integration for Data Centres In a world of automated cars, mass user-generated material from YouTube to Instagram and driverless ubers on the horizon; Web 2.0 and the Internet of Things (IoT) continue to search for ways to increase internet speeds. From shorter links, to more densely packed signals; we, the optics community, are at the forefront of it all. What if one super power is not enough?
17: Scalable Optical Coupling between Polymer Waveguides and a Silicon Photonics Chip IBM present a scalable optical coupling solution for silicon photonics packaging using polymer waveguides. The optical I/O interface is based on adiabatic optical coupling between silicon waveguides in a silicon photonics chip and polymer waveguides. Different assembly methods were investigated for the evaluation of the coupling loss. A coupling loss as low as 0.9 dB was found at 1310 nm with a back-reflection below -45 dB.
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SESSION 6: Integrators and User Case Studies - II
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22: Design requirements for opto-electronics sensing systems in harsh environments In the industrial world, it is important to know formal and practical design requirements associated with an application. Even within the same industry, different applications may have different requirements. This is especially true when talking about highly regulated areas like turbo-machinery, aerospace, oil and gas, etc. This presentation is an overview of some practical examples based on Oxsensis Ltd. company’s experience. First of all, we will give a broad picture of the company’s background and the industries involved. Secondly, we will discuss the importance of understanding application risks and how it is possible to manage risks within the system. We will also give a broad overview on some industry standards (ATEX, DO-160). Thirdly, we will present some current technical solutions, allowing the use of standard components in non-standard applications; and how this helps to integrate new systems in existing control instrumentation and design cheaper modular systems with high potential for anytime expansion. Finally, as an innovative company we are looking at tomorrow’s world and further. We know that our clients see their future systems as fully integrated solutions with highly distributed networks of sensors for control and monitoring. This means we will need to overcome fresh challenges to allow our systems to become highly integrated at the heart of new systems.
20: From a naked die to a working system - “Who Wants to be a Naked Die?” Integrated Photonics becomes a more and more mature industry. Foundry services have been set up, several design houses have been founded and development of commercial applications has started. But a bare photonic chip will not work in an application. An important missing step in the supply chain becomes clear as soon as you need to link your chip with the rest of the world. For many components and sub-systems the way they are packaged is imperative with regard to system reliability and costs. Projects where reliability is key, i.e. harsh environments like aerospace, high-tech industry, space, etc. tend to opt for targets as semi- or full hermetic sealed packaging, large temperature range management, low-loss fibre array coupling, hybrid integration etc. Although this generally leads to compliant system reliability, it also tends to drastically increase costs. The presentation will depict on the strong influence on chip performance resulting from temperature variations and variations over the chip, caused i.e. by switching lasers on and off, environmental changes, and many more as most miniaturized packaging requires a dedicated design for temperature stabilization. Additionally, a roadmap will be presented on how our current and future packaging experience and designs will be made available for third parties.
21: MIRPHAB: A Pilot Line for Mid-Infrared sensors and spectrometers MIRPHAB (MidInfraRed Photonics devices fAbrication for Chemical sensing and spectroscopic applications) is an EC funded project, in a public-private partnership with Photonics21, with the ambitious goal of creating a commercially viable pilot line for the fabrication of Mid-IR sensors that is ready for business by 2020. This result will be achieved by setting up and operating a fabrication platform with open access for fast Mid-IR device prototyping to European industry. This initiative supports the emergence of laser-based spectroscopic chemical sensing in the Mid-IR wavelength band, providing services for device design and fabrication from chip processing on wafer level to packaging and testing. Based on a massive use of IC/MEMS technologies, the pilot line will enable a variety of new key functionalities for next generation chemical sensing and spectroscopy, allowing cost, power consumption and size reduction.
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The Speakers ....
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2: Nicola Pavarelli was born in Modena (Italy). He received the Bachelor’s degree in physics and the Master’s degree in applied physics from the University of Modena and Reggio Emilia (Italy), and the Ph.D. degree in applied physics and instrumentation from the Cork Institute of Technology (Ireland). After the Ph.D., he joined the Photonics Packaging Group at Tyndall National Institute (Cork, Ireland), where he was involved in the management of a wide range of both academic and industry research projects, mainly focused on telecoms and sensing sectors. In 2015, he joined the Advanced Assembly Technology Center within the European Research Center of Huawei Technologies (Munich, Germany), where is currently working as a Senior Process Engineer in the field of photonics packaging, integration and automated assembly.
1: Prof. Peter O’Brien received his PhD in physics from University College Cork (Ireland) in 1999. He was a postdoctoral scholar at the California Institute of Technology and NASA’s Jet Propulsion Laboratory. He previously founded two photonic companies, and established the Photonics Packaging Group at Tyndall in 2009. Since its foundation, the group has developed a range of advanced packaging capabilities (optical, electronic, thermal, mechanical) which are now provided to industry as part of packaging foundry services. Prof. O’Brien is also deputy director of the Irish Photonics Integration Centre (IPIC), a 30M Euro investment by the Irish government in the area of integrated photonics. Prof. O’Brien’s performs research mostly in the area of integrated photonics, in particular, the development of scalable packaging processes for volume manufacturing.
3: Andy Sellars is Lead Technologist, Manufacturing and Materials at INNOVATE UK. After studying laser physics at St Andrews University, Andy completed an industrially sponsored PhD in power engineering at Strathclyde University. This work was spun-out through Diagnostic Monitoring Systems, which was later acquired by US-based Qualitrol. Following university, Andy developed high voltage transmission for Rolls Royce, high-definition RADAR for the MoD and advanced test systems for Spirent PLC – one product generating sales for over 15 years. He then joined a venture-capital backed start-up developing financial transaction software, followed by work with Abbott Diagnostics in Dallas developing photon sensors for health analytics.
4: Ewit Roos, is managing director of PhotonDelta. Prior to this, he was responsible for business development for the Technical University Eindhoven and managing director of BrightMove, an early stage fund for the high tech industry, particularly in Brainport region. Roos started his career in with Waste Management Inc. where he became responsible for corporate affairs and business development in The Netherlands. After 6 years of corporate work, he started a new IT recycling activity in the Waste Management group. By both organic growth and acquisitions, a venture was build with sites throughout Europe. Next position was European director for an ICT rental company for another 7 years. In 2007 he started his own business in and was assigned to restructure and sell a chemical company. In 2009 – just after the sale - Roos was asked to become part-time CEO of InSolutions BV, a small start-up in chemical processing technology in the region of Eindhoven. Because of this move, the relationship with the Technical University Eindhoven was born. Ewit Roos is married and has two children and has a degree in Public Business Administration.
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6: Adrian Wonfor has worked for 20 years in the field of integrated photonics, with particular research interests in integrated optical switches. He has been involved in a number of EU projects aimed at improving ease of access to integrated photonics for the non-specialist. He is a Senior Researcher in the Engineering Dept. at the University of Cambridge, U.K.
5. Hossein Moeini received his MSc degree in Applied Physics in Iran and is a physics PhD graduate (2010) from the University of Groningen, The Netherlands. He has worked as a researcher and post-doc in particle physics at KVI-Cart in Groningen before he joined PhoeniX Software in 2015. He has 5 journal papers and 16 conference contributions. He is currently employed as application engineer and library developer by PhoeniX B.V, The Netherlands. At PhoeniX Software, he has been involved in activities including: analysis of the foundry-provided data prior to implementation into the OptoDesigner; building up library definitions for the layout of various building blocks, based on the foundry specifications; working on extending a new feature of the OptoDesigner that allows the photonic and micro-fluidic chip designers to stack up dies within each other and within packages; working on the library development of the 3D visualizations of various building blocks, especially in connection with the latter task.
7: Karl-Otto Velthaus received his Dipl. Ing. degree in electrical engineering from the Technische Universität Stuttgart (Germany) in 1989 and the Dr. Ing. in electrical engineering from the Technische Universität Carolo-Wilhelmina zu Braunschweig (Germany) in 2000. He holds more than 20 patents and has authored and co-authored more than 60 publications including journal papers and conference submissions. From 1989 – 2000 he conducted research in the field of inorganic electroluminescence displays. In 1992 he joined the Heinrich-Hertz-Institute in Berlin. In 2000 he moved to the InP photonics group and headed the development on high speed modulators, especially MZI modulators based on InP with a travelling wave electrode. Since 2013 he is involved in optimized PIC to electronic RF-interface approaches, 3D packaging and co-design of PIC´s and driver electronics for improved performance, low power consumption and small form factor.
8: Martin van Acht is an entrepreneur pur sang. Always looking for opportunities and connections. Truly believes people can only be creative when working on things they love to do, what they’re good at. And believes working on projects with a societal relevancy is a necessary condition to survive these exponential times.
9: Antonello Vannucci (CTO Linkra) received the M.Sc. in Physics from the University of Rome “La Sapienza”- Italy in 1985. He joined Linkra in 2011 and took in charge the activities of R&D and Product Development of Microwave, Photonics and Microwave Photonics modules and Photonic packaging foundry service for ASPICs and optoelectronic devices. Since 1986 he is involved in the development of Integrated Optic technology (IO), Microtecnologies and Thin film optical coating for telecom, sensing and defense applications for several companies (Selex ES, Pirelli Optical Technologies, Satisloh,..) where he held various positions in management of R&D and Engineering teams. He published more than 50 scientific papers in journals and in proceedings from scientific conferences and holds more than 8 patents on different subjects.
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12: Ignazio Piacentini has taken up the position of Director of Business Development at ficonTEC in Achim, Germany, in August 2015. He has a B.Sc. in Nuclear Engineering (Milan, Italy, 1975) and a M.Sc. degree in Digital Systems and Instrumentation (Polytechnic of Central London, UK, 1987). In earlier times he he has spent many years working for the European Commission (Euratom) designing control and data acquisition systems for the thermonuclear fusion research community. He has an extensive background also on machine vision and robotics accumulated both in small design-bureau like and integration companies (Italy) and large enterprises like National Instruments (USA).
10: Andrew Thompson - Technical Sales Manager, has worked in the Optoelectronic & Microelectronic industries for nearly 20 years and has extensive Optoelectronic design experience, that covering the entire development cycle from the concept evaluation, through to high volume off shore production. With experience of high speed packaging layout, Thermal modelling, 3D CAD, EMI design, on top of his knowledge of general Optical product assembly knowledge, Andrew provides Engineering support to the customer at the first point of contact. Prior to joining Optocap 11 years ago, Andrew worked at Hewlett Packard, Agilent Technologies & E2V Technologies. Andrew holds a BSc Hons in Physics with Optoelectronics
11: Dr. Eric Mounier has a PhD in microelectronics from the INPG in Grenoble. He previously worked at CEA LETI R&D lab in Grenoble, France in marketing dept. Since 1998 he is a cofounder of Yole Développement, a market research company based in France. At Yole Développement, Dr. Eric Mounier is in charge of market analysis for MEMS & Sensors, visible and IR imagers (CIS, microbolometers), semiconductors, printed electronics and photonics (e.g. Silicon photonics). He has contributed to more than 200 marketing & technological analysis and 100 reports. Eric is also an expert at the OMNT ("Observatoire des Micro & Nanotechnologies") for Optics.
13: Guénaël joined Microtest in 2016 after a long career in the Technology departments of the French Air forces, followed by a strong international technical sales manager experience. With Microtest, where he is in charge of the Marketing and Sales Departments, he contributes through his knowledge to the local and international expansion challenges of the company. Guénaël is focusing today his presentation on his perfect knowledge of Pick&Place technologies, in order for us to better understand the various processes depending on requirements.
14: Joost van Kerkhof is the CEO of XiO Photonics since August 2013 and the COO of LioniX International since XiO was acquired by LioniX International in April 2016. He has 20 years experience in the micro-nano technology industry. Before joining XiO, Joost worked with Sensata Technologies as Director Business Integration where he was responsible for business due diligence of acquisition candidates followed by integration of the business in the Sensata organization. In this role he built a significant experience in business case analysis and development. Before his role in business management, Joost has had positions within Texas Instruments (which became Sensata Technologies in 2006) as Director R&D and Director Operations. In these positions he has brought several products to the market. Joost also worked for 6 years as R&D manager at HortiMax. Joost holds a masters and PhD degree in electrical engineering specialized in micro-nano technology and (bio)sensors.
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16: Dr. Mikko Karppinen has M.Sc. degree in Engineering Physics and D.Sc. Tech. in Optoelectronics. Since 1998, he has been with VTT Technical Research Centre of Finland, where he has carried out and led research and development on photonics technologies in scientist, project manager and team leader positions. Currently, he is a Senior Scientist on Photonics Integration at VTT. Year 2001 he spent as a visiting researcher at the University of Ottawa. His R&D activities are focused on the fabrication, integration and packaging of photonics devices, for applications including optical interconnects, sensors and lighting.
18: Michael Robertson (Research and Collaboration Manager) has more than 30 years experience in semiconductor optoelectronics for telecommunications. Over this time, he has studied many types of device including lasers, modulators, optical switches and detectors. He has covered all aspects of their development including device design, epitaxy, fabrication, characterization and reliability testing. He has published more than 75 papers and submitted more than 10 patent applications. He is currently Research and Collaboration Manager for CIP.
15: Alessio Corazza graduated in Physics and specialized in Material Science at Milano University. He joined SAES Group in 1995 and worked as researcher for 5 years in the SAES Metallurgical Laboratory, developing new materials and alloys for vacuum applications and sealed-off electronic devices. From 2000 to 2013 he headed the SAES Lighting Applications and Materials Laboratory, coordinating R&D activities in the field of light sources. Project leader in many projects worked with international key players for development of innovative solutions and components for light sources. Since 2014 he is Business Development Manager for the G&D Industrial Applications Business Unit, involved in Lighting, Photonics, Opto-electronics and Energy Storage Applications. He published and presented more than 25 papers on scientific journals and to International Conferences and is author/co-author of several international patents.
17: Antonio La Porta joined IBM Research - Zurich as a Research Staff Member in 2010. His research focuses on the electro-optical integration of photonic devices with particular emphasis on the scalable packaging of silicon photonics at the chip and system level. Before joining IBM, Antonio was an R&D engineer at Linkra srl, where he was responsible for developing an electro-optical DPSK transceiver at 40 Gb/s. He holds a degree in Electrical Engineering from the Università di Catania and obtained his Ph.D. in Electrical and Communication Engineering from Politecnico di Torino, where he studied optoelectronic subsystems for optical packet-switched networks.
19: Ramsey Selim, has over 10 years’ experience in hybrid integration, and a PhD with distinction in photonics; he says; “Optics is so much fun, with limitless opportunities for innovation. It’s practically a playground for physicists and engineers”. Ramsey has extensive experience with multiple technology platforms, as he has worked on PLC glass, silicon photonics, and iii-v material; investigating monolithic integration and innovating hybrid solutions for telecom and Datacom applications. He is currently based in Edinburgh, Scotland; where he is the lead micro-lens designer at Kaiam Corporation, with its company headquarters is in Silicon Valley. He has authored & co-authored over 20 publications and patents, and specialises in innovative design.
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21: Dr. Jose Pozo is director of technology and innovation at EPIC (European Photonics Industry Consortium). He has 15 years’ background in photonics technology, market knowledge, and a large network within the industrial and academic photonics landscape. Pozo is a member of the board of the IEEE Photonics Society, Benelux. He holds a Ph.D. in electrical engineering from the University of Bristol, U.K., and a M.Sc. and B.Eng. in telecom engineering from Spain (UPNA) /Belgium (VUB). In addition, he has worked as a researcher at TU Eindhoven and TNO, and as Senior EU Consultant at PNO Consultants.
20: Pim Kat has a background in mechanical engineering. He worked as researcher at Hoogovens in the field of computer controlled motion (what is now mechatronics). He started his own company Technobis in 1996. Technobis Group in 2014 consists of three companies Technobis Mechatronics (development and supply of OEM instruments), Technobis Fibre Technologies (sensing systems based on Integrated Optics) and Technobis IPPS (packaging services for integrated optical chips). Besides being the CEO of the Group, Pim is involved in most of the R&D work for integrated photonics.
22: Dmitrij Siskin background spans the fields of electronics system design, fibre optics components and device manufacturing and optical sensing systems design and development. He graduated from Vilnius Gediminas technical university in 2013 as Master of Science in electronics field (embedded systems design). By this time, he also finished his career as electronics engineer in Fiber Optics Devices Ltd., where he gained exceptional background in electronics systems design, fibre optic components quality control and testing, manufacturing and manufacturing automation. Currently Dmitrij is working for Oxsensis Ltd. as development engineer where he applies his knowledge in systems design and fibre optics to a new field of interest – fibre optic sensing. He is responsible for principle designs of optical interrogators, design implementation and development, systems testing and calibration. His further objectives in the company include a design and development of card based interrogator and miniature high speed spectral interrogator with advanced processing implementation, as well as support of current aerospace and gas-turbines oriented projects.
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Exhibition
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• Entegris GmbH • Exception EMS • FiconTEC • Inseto (UK) Ltd • LEW Techniques • Microtest • Nanosystec GmbH • Optocap • OpTek Systems • SET • Technology Scotland
Plus information tables for: • IMAPS-UK • EPIC • JEMI-UK
The Table-Top Exhibitors are a key part of the event. pOp2016 is pleased to have the support of:
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ficonTEC designs and produces high precision production equipment for micro assembly or testing of components. We are the market leader when it comes to automated micro assembly or testing of micro-optics or opto-electronics such as laser diode manufacture, medical technology, security and defense engineering, as well as telecommunication. We develop off the shelf and individual automation solutions in microsystems engineering that increase the efficiency and precision of your production processes. Thomas Danger ficonTEC Service GmbH Rehland 8, 28832 Achim, Germany T +49 4202 511 60-0, F +49 4202 511 60-090 Email: [email protected]
Exception EMS- Fabrinet Exception's ability in the full turnkey manufacture of reliable test boards (or reference designs) to accompany the initial supply of prototype packaged silicon is a key element of the bigger picture. Without the promise of the improved silicon and the board to analyse and test its performance, the chip will never go on to large scale production, where the real profits are recouped when their production runs rise to tens of thousands if not millions. Exception currently support many fab and fab-less global semiconductor companies with its On Demand service of rapid prototype assembly and high temperature over life testing Garry Myatt - Sales & Marketing Director Exception EMS-Fabrinet 32 Harris Road, Porte Marsh Industrial Estate Calne, Wiltshire, SN11 9PT UK Work Telephone: 01249 814081 Mobile Phone: 07824 413729 [email protected]
Entegris is the global leader in materials integrity management. The company delivers technology, product and service solutions that purify, protect and transport critical materials used in the semiconductor and other high-technology industries. These solutions are manufactured and serviced around the globe, with support in the United States, China, France, Germany, Japan, Malaysia, Singapore, South Korea and Taiwan. Entegris is ISO 9001 certified. Jorgen Lundgren Field Application Engineer, Sr Advanced Materials Handling - Europe T +44 1274 872052 M +44 7711 261 543
Exhibitors
Exhibitors
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Inseto provides advanced manufacturing equipment, assembly materials and related consumable products for electronic production, including Semiconductor, Micro & Nanoelectronic Assembly, as well as products for general industrial manufacturing." We will be displaying thermal management materials and other related products. Inseto (UK) Ltd. Unit 25, Focus 303 Business Centre, Focus Way, Andover, Hampshire SP10 5NY. Contact : Eamonn Redmond TEL: 07880 726070. [email protected] www.inseto.co.uk
LEW Techniques is a well-established specialist manufacturer of metallised ceramic and metal components and assemblies for a wide range of high-tech electronics applications. Working in partnership with all of our customers on design, production, quality, delivery and cost, each product is created to meet each customer’s need. Andrew Walker LEW Techniques Ltd Cook Way, Taunton, Somerset TA2 6BG, United Kingdom Telephone: +44 (0) 1823 286698 Fax: +44 (0) 1823 333697 Email: [email protected]
MICROTEST distributes equipment, tools and consumables for the semiconductor industry. We also provide assistance, support and maintenance for the equipment we supply. Amongst others, we distribute the following manufacturers: Advanced Engineering, Ideal-Tek, Itest, JFP Microtechnic, Micro Control Company, Perfection Products, Picosun, Solarsemi, Sun, Thermonics, Trio-Tech, VariTech, Virtual. Sté MICROTEST ZA La Garrigue Du Rameyron 84830 SERIGNAN Tél. : + 33 (0)4.90.40.60.90 Fax : + 33 (0)4.90.40.61.05 Mail : [email protected]
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Optocap provides contract package design and assembly services for microelectronic and optoelectronic devices. Optocap's turn-key packaging services enable our customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with new product developments. Our expertise in packaging solutions spans the full product life-cycle: from design through prototyping, process optimisation, product qualification, failure analysis, volume manufacturing and transfer to low-cost volume manufacture. This provides customers adopting an outsourced manufacturing model with a much simplified and efficient supply chain. Optocap Ltd. Bain Square, Livingston, West Lothian EH54 7DQ [email protected] 01506 403550 www.optocap.com
nanosystec GmbH offers customized systems for high-precision micro assembly and micro production technology. Our aim is to provide systems which perform exactly as it is required by our customers. All key functions of our systems are developed in house, including the process programming as well as the electrical and mechanical design. Our process engineers and qualified mechanical and electrical technicians form a team to provide you with excellent support. Ms. Christiane Hummelt - Director of Sales nanosystec GmbH Marie-Curie-Strasse 6 64823 Gross-Umstadt, Germany Phone: +49-6078-78254-0 Fax: +49-6078-78254-10 e-mail: [email protected]
Exhibitors
OpTek is a privately owned and fully independent company and as a result our business is wholly focused on our customers and the delivery of the right solution to address your production needs. Working in partnership with our customers, our highly qualified and experienced team develop and deliver precision laser processing tools by bringing together core skills in lasers, optics, laser/materials interaction, automation, vision, control and software. With a long history of supplying robust and reliable production line equipment to a diverse range of requirements, OpTek will deliver the right solution for your production challenges. Chris Randon OpTek Systems Unit 12/14 Blacklands Way, Abingdon Business Park Abingdon, Oxford, OX14 1DY, UK Tel: +44 1235 539182 Fax: +44 1235 539183 [email protected]
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Technology Scotland is the leading cluster organisation for industry, academia, and other institutes engaged in the Key Enabling Technology (KET) sectors in Scotland, including advanced materials, electronics, nanotechnology, photonics, and advanced manufacturing. Formed by the Scottish Optoelectronics Association (SOA) and the NMI in response to industry demands, Technology Scotland is the representative body for KET organisations in Scotland, blending diverse technology interests, and providing the community with an independent voice. Ms Emma Dixon - Programme Manager Technology Scotland Geddes House, Kirkton North, LIVINGSTON EH54 6GU United Kingdom Telephone: 07736289986 Email: [email protected]
Exhibitors
SET develops and manufactures advanced assembly equipments and Nanoimprint Lithography solutions for the semiconductor market. Since 1975, we have pioneered in the development of flip chip bonders adapted to Infrared sensors & optoelectronics applications. . SET offers a complete range of accurate Device Bonders – manual, automated and production – that cover every high end bonding needs and requirements. Caroline AVRILLIER - Sales Engineer SET Corporation SA - Smart Equipment Technology 131, impasse Barteudet, 74490 Saint Jeoire - France Tel.: +33 (0)450 35 83 92 Fax: +33 (0)450 35 88 01 Email: [email protected]
This conference has been organised and managed by:
IMAPS-UK Supported by
EPIC JEMI-UK
SEMI
