Equipment Engineering System Data collection Capability ... · the case of being required to implement EES in early stage for Prototype evaluation. These interfaces mentioned in this

Equipment Engineering System Data collection Capability Requirement Document

(DCRD)

Version 2.0

[2003/03/30]

Semiconductor Leading Edge Technologies Inc.Semiconductor Leading Edge Technologies Inc.Semiconductor Leading Edge Technologies Inc.Semiconductor Leading Edge Technologies Inc.

Equipment Engineering System Data Collection Requirement Document (DCRD)Equipment Engineering System Data Collection Requirement Document (DCRD)Equipment Engineering System Data Collection Requirement Document (DCRD)Equipment Engineering System Data Collection Requirement Document (DCRD)

© 2002/2003 Selete i

Table of Contents 1. Introduction.................................................................................................................................1

1.1. Purpose of this specification ...............................................................................................1 1.1.1. Scope .............................................................................................................................1 1.1.2. Overview of Capability ................................................................................................1 1.1.3. Base Document.............................................................................................................3 1.1.4. Related Document........................................................................................................3 1.1.5. Referenced Document ..................................................................................................4

1.2. Purpose of Equipment Engineering System(EES)............................................................5 1.3. The Data and the Open of Equipment Engineering System............................................6 1.4. Essentiality of EES .............................................................................................................8

1.4.1. Examine Equipment Capability..................................................................................8 1.4.2. Utilizing EES before installing Equipment ...............................................................8 1.4.3. Utilizing EES after installing Equipment .................................................................9 1.4.4. Utilizing EES after delivered equipment...................................................................9 1.4.5. After equipment maintenance, repair, remodeling, adjustment and manual operation......................................................................................................................................9 1.4.6. Tracking fault defect of the equipment.......................................................................9 1.4.7. Digitalize equipment behaviors process...................................................................10 1.4.8. Connecting with External Sensor .............................................................................10

2. Collection Equipment Data...................................................................................................... 11 2.1. Data Operation .................................................................................................................. 11

2.1.1. Definition of Equipment Interface............................................................................ 11 2.1.2. Data Lifecycle .............................................................................................................12 2.1.3. Data retention period.................................................................................................12 2.1.4. Scope of Data Disclosure ...........................................................................................13

2.2. Type of Equipment Engineering data..............................................................................14 2.2.1. Event Data..................................................................................................................14 2.2.2. Trace Data ..................................................................................................................16 2.2.3. Context Data (Equipment Configuration , Setting information) ...........................17 2.2.4. Conclusion of Kind of Equipment Engineering Data ..............................................19

2.3. The communication system of Equipment Engineering Data .......................................20 2.3.1. Equipment to TDI ......................................................................................................20 2.3.2. From the TDI to F-EES DB and the applications ...................................................21

2.4. Equipment Structure Information ...................................................................................24 2.4.1. Equipment Structure Model......................................................................................24

2.5. Job Layer and Historical Record. .....................................................................................25 2.6. Relevance with SEMI Standard.......................................................................................26

3. Needed Application for Equipment Engineering work ..........................................................27 3.1. Application related to Data handling ..............................................................................27 3.2. EE Application...................................................................................................................28

3.2.1. Equipment Operation Management Capability ......................................................28 3.2.2. Maintenance support function ..................................................................................28 3.2.3. Recipe management...................................................................................................29

3.3. Relation of SEMI Standards.............................................................................................30 4. Information Security ................................................................................................................31

4.1. Security Countermeasure of IC Maker’s side..................................................................31 4.1.1. Non Disclosure Agreement ........................................................................................31 4.1.2. Access Control ............................................................................................................31 4.1.3. Authentication............................................................................................................32 4.1.4. Encryption ..................................................................................................................32

4.2. Request security countermeasure of equipment suppliers ............................................32


© 2002/2003 Selete

ii

4.2.1. Security countermeasures in FAB............................................................................ 32 4.2.2. Security countermeasure against remote access through firewall ........................ 33

4.3. Relevance with SEMI standard ....................................................................................... 33 5. Conformance table of the Specification.......................................................................................... 34 6. Selete proposal specification ................................................................................................... 35 7. Appendix ................................................................................................................................... 36

7.1. Benefit of EES Data Opening .......................................................................................... 36 7.1.1. Availability of Equipment Engineering Data.......................................................... 36

7.2. Example of data lifecycle.................................................................................................. 37 7.2.1. Data lifecycle at TDI ................................................................................................. 37

7.3. Example of Equipment Engineering data....................................................................... 37 7.3.1. Example of composition of multi chamber vacuum equipment ............................. 37 7.3.2. Example of process unit composition of multi chamber vacuum equipment........ 38 7.3.3. Example of collection data for vacuum equipment ................................................. 39 7.3.4. Another detailed equipment status data ................................................................. 40

7.4. Data communication method ........................................................................................... 41 7.4.1. Compliance with the Selete proposal ....................................................................... 41 7.4.2. Compliance with the SEMI standard (PR8) ............................................................ 45

7.5. Similar／Practical examples of EES............................................................................... 47 7.5.1. Practical examples on Cluster type PVD equipment.............................................. 47 7.5.2. Practical examples on CMP equipment ................................................................... 48

List of Tables

Table 2-1．Definition of Interface ...................................................................................................11 Table 2-2．Behavior of EE data in Data Lifecycle ........................................................................... 12 Table 2-3．Data retention period .................................................................................................... 13 Table 2-4．Equipment Engineering Data ........................................................................................ 19 Table 4-1．Relevance with SEMI standard .............................................................................. 33

List of Figures

Fig 1-1 Separately Collecting Data in view of Production Control and Equipment Data....................... 2 Fig 1-2 Position of this specification ................................................................................................ 3 Fig 1-3 Operating ratio within facility of Fab in general .................................................................... 5 Fig 1-4 the concept difference from existing MES system ................................................................. 6 Fig 1-5 Openness of data structure and interface ............................................................................... 7 Fig 2-1 Pattern diagram for definition of interface............................................................................11 Fig 2-2 Data Lifecycle .................................................................................................................. 12 Fig 2-3 Scope of the utilizing data within EES................................................................................ 13 Fig 2-4 Event data(including DEE)................................................................................................ 14 Fig 2-5 Work flow and Event ........................................................................................................ 15 Fig 2-6 Correlation mode of DEE data ........................................................................................... 16 Fig 2-7 Trace Data........................................................................................................................ 17 Fig 2-8 Example of context data generated according to processing step of Context Job .................... 18 Fig 2-9 Difference in equipment engineering data sending interface ................................................. 20 Fig 2-10 Logical Model of Equipment Structure ............................................................................. 24 Fig 2-11 Logical Model of Job Elements ........................................................................................ 25 Fig 4-1Image of access control by routing function and filtering function ......................................... 31 Fig 4-2 Image of remote access via firewall.................................................................................... 33 Fig 6-1 Selete proposal system ...................................................................................................... 35


© 2002/2003 Selete

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ReviReviReviRevision Historysion Historysion Historysion History

Author of this document

VersionVersionVersionVersion Data Author First First First First Edition (tentative Edition (tentative Edition (tentative Edition (tentative

version version version version for ASPLA)for ASPLA)for ASPLA)for ASPLA) 6/13/2002 Fujita

Version 1.1 (Selete Version 1.1 (Selete Version 1.1 (Selete Version 1.1 (Selete formal formal formal formal versionversionversionversion))))

10/31/2002 Fujita

Version 2.0Version 2.0Version 2.0Version 2.0 9/30/2003 Fujita Number of PagesNumber of PagesNumber of PagesNumber of Pages

This document consists of 2 title pages, front matter, body text and appendix. The total number of pages of this document is 60 pages.


© 2002 Selete 1

1. Introduction This specification is about a summary of minimum essential requirements to collect EES data, considering

the case of being required to implement EES in early stage for Prototype evaluation. These interfaces mentioned in this document are under standardization, therefore these have not been

defined yet. 1.1. Purpose of this specification The purposes of this specification are to request suppliers to develop this equipment according to EES specification covering two items below. ① Function of EE Data Transmission / Collection / Storage ② EE application according to the scope mentioned in Chapter 3 of this document. (Option) In addition to above, ① Data transmission / collection / storage / are essential capability, 3 kind of categories are including the scope mentioned in chapter 2.2 for EE data. And about EE application of 2, its method and contents will be different depends on category or application of any equipment, therefore we request equipment suppliers to propose a contract specification of EES that is covered contents mentioned in chapter3 in this specification. If you need more detailed information, please have contact with Selete clients. This specification is deeply linked with these specifications, manuals and guidelines mentioned in Chapter 1.1.3 Base Document of this specification. Especially, Equipment Engineering System User Requirements Document (EES-URD) is quite important, therefore we recommend you to refer it. And Tool Data Interface (TDI) that follows this specification and the specification of Database Structure are under development are recommended you to refer as well.

1.1.1. Scope

This specification is applicable for all diameter size of Semiconductor Manufacturing Equipment. 1.1.2. Overview of Capability

Functions Requirements are described in this specification are based on EEC guideline. 1.1.2.1. Requirement Item

①Overview At present, various data are collected from the equipment though, actually at the view of EES, workings as

system are just tracking production capability of equipment and management for maintenance. Equipment engineering data is supposed to be collected separated from MES data.

Concern about the data port (EDA port) that send data of the Equipment Engineering out, in EEC guideline it request to be separated logically. The case of implementation, it is possible data to be huge and heavy to deal with, therefore physically separated port will be required not to give damage process control of MES system as following picture shows.


© 2002 Selete 2

Fig 1-1 Separately Collecting Data in view of Production Control and Equipment Data

EEC data has been collecting on some level with existing MES system though, the data was very rough fineness because of restriction of specification of interface, protocol and Band width, and has been used in restriction only as calculating operating ratio etc, because the data was able to collect while the equipment is on line.

Having the port for collecting EE Data that we propose and request to implement separately from MES system port, it gives results such as collecting data without concerning on-line or off-line, and to have wider band, it will be able to deal with accurate, fineness and huge data in larger scope than existing MES system.

The data sending out of the equipment would need 3 kinds of data such as event data, trace data and

context data that were written in Chapter 2.2. From EDA port, various data is sending out with a different fineness, for instance unprocessed data such as

I/O port status and processed data such as statistic. The function needed on the equipment side to collect these data from the equipment and to offer it in the

shape that can be used and the implementation method are described as follows.

②Data Provisions Equipment supplier will provide us details of the data item because kind / category /format etc of data

depends on supplier’s design policy or Equipment Operation Model. As an example of Data Item, in appendix an example of vacuum devices has been attached. Please refer it.

Equipment Supplier will choose items below for definition of Data Collection and determine detail. １)Data Item ２)Protocol ３)Data Collection Plan (DCP) ４)Data Definition ５)Data Format

However, DCP is a function would be needed depends on installed applications. Installing DCP on the

equipment is not prescribed in this specification, therefore it is out of request. In the case of that supplier install DCP after examine DCP on supplier’s side, it is required to specify its

specification in the contract specification document.

③ Data Security

The IC Maker does not have any request items to the Equipment Supplier as safety precaution in the interface

EquipmentEquipmentEquipmentEquipment

LegacyLegacyLegacyLegacyFactoryFactoryFactoryFactory

HostHostHostHost

EE EE EE EE SystemSystemSystemSystem


Coexistence of Coexistence of Coexistence of Coexistence of MES information MES information MES information MES information and information and information and information and information of device of device of device of device engineeringengineeringengineeringengineering

Separation of Separation of Separation of Separation of MES information MES information MES information MES information and information and information and information and information of device of device of device of device engineeringengineeringengineeringengineering< < past >past > < < future >future >

EquipmentEquipmentEquipmentEquipment

LegacyLegacyLegacyLegacyFactoryFactoryFactoryFactory

HostHostHostHost



Coexistence of Coexistence of Coexistence of Coexistence of MES information MES information MES information MES information and information and information and information and information of device of device of device of device engineeringengineeringengineeringengineering

Separation of Separation of Separation of Separation of MES information MES information MES information MES information and information and information and information and information of device of device of device of device engineeringengineeringengineeringengineering< < past >past > < < future >future >


© 2002 Selete 3

of equipment data collection. (However, in the case of remote access via IC Maker’s firewall, its security would be required to examine: Refer to Chapter 4.2.2) Security of confidential information by system (ex; access control, authentication, encryption)may be needed, but it is depends on each IC Maker’s security policy or operational management, therefore we can not identify the definition. On operation of concrete security measure, it is required to be discuss and decide between Equipment Supplier and IC Maker. Basic security of IC Maker is mentioned in Chapter 4.c 1.1.3. Base Document

Following 4 documents have been referenced as base document of this specification. １） Equipment Engineering Capability EEC guideline(Phase 2.5)

URL; Japanese version：http://www.selete.co.jp/SeleteHPJ1/Data/0209a01.pdf English version ：http://www.selete.co.jp/SeleteHPJ1/Data/0207b01.pdf

２） EES Implementation Requirement Document (IRD) Version 1.7 At present only Japanese version is available. Japanese version：http://www.selete.co.jp/SeleteHPJ1/Data/0210e01.pdf

３） EES User System Analysis Document (USAD) Version 1.5 operational management Japanese Version：http://www.selete.co.jp/SeleteHPJ1/Data/?????(TBD)

４) Equipment Engineering System EES User Requirement Document (URD) 1.0 At present only Japanese version is available. Japanese Version：http://www.selete.co.jp/SeleteHPJ1/Data/?????(TBD)

※Please check the Selete’s web site to find up-dated specification。

Fig 1-2 Position of this specification

1.1.4. Related Document Related document as follows; １) Equipment Engineering System TDI(Tool Data Interface)Functional Specification Document

Reference relation between specifications of openingto the public related to EES

User System Analysis Document（USAD）

Implementation Requirement Document（IRD）

User Requirement Document（URD）

User System Requirement Document（USRD）

Data collection Capability Requirement Document（DCRD）

Tool Data Interface Capability Requirement Document（TDI）

others

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User System Analysis Document（USAD）

Implementation Requirement Document（IRD）

User Requirement Document（URD）

User System Requirement Document（USRD）

Data collection Capability Requirement Document（DCRD）

Tool Data Interface Capability Requirement Document（TDI）

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© 2002 Selete 4

２ ) Equipment Engineering System Factory EES(F-EES)Database Functional Specification Document(working title)(※)

(※This has not been opened yet, therefore to acquire this document, you are needed to contact Selete client.) 1.1.5. Referenced Document

Refer to SEMI Workshop document below; SEMI Workshop on e-Manufacturing and APC/FDC document Tokyo conference center February 23rd 2001 SEMI e-Manufacturing Workshop document Syufu Kaikan June 7th 2001 SEMI e-Manufacturing Workshop document(CD-ROM) Hotel Le Port Kojimachi December 4th 2001 SEAJ 「EES Business Model – Business Development toward e-Manufacturing age -」 SEAJ EES Committee Annual Report 2002 Start-up JEITA/SEAJ/Selete e-Manufacturing Business Seminar document (CD-ROM) Tokyo Chamber of Commerce and Industry International conference room June 13th 2003


© 2002 Selete 5

1.2. Purpose of Equipment Engineering System(EES) New development of Semiconductor manufacturing equipment was always done so that semiconductor

manufacturing equipment might satisfy the demand of device minutely and a large caliber of the wafer... But OEE (Overall Equipment Effectiveness) has not necessarily risen.

The figure below, it shows the chart of showing OEE in FAB equipment for actual condition, and it tells that equipment gives added value to wafer is only 40%.

And it also tells that the others are doing preparing with NPW(Non Product Wafer) or maintenance or unscheduled down or waiting product wafer.

Fig 1-3 Operating ratio within facility of Fab in general

The purpose for adding Equipment Engineering System (EES) to “Fab system” is that collecting EE Data and making use of the application use the data, thereby we would be able to have the results as follows which are like rejection or reduction of disincentives of product contribution.

①Optimization of Scheduled Down Time ②Minimization of Unscheduled Down Time ③Optimization of NPW Processing、Optimization of Scheming Time

With execution of three item above, it would enhance original Value Added Time of the equipment and OEE, then enhance Productivity of whole fab/cost-effectiveness/ cost-turnover.

As figure 1-4 shows, its scope of the utilizing data will be decided by Equipment Supplier and IC Maker’s agreement, and they utilize the system on each purpose as EES user. In this case, it may be different between the scope and level of data that IC Maker use and Equipment Supplier use. Therefore it will be quite different from existing MES automation system.

EquipmentAddingvalue is only 40%!

Non-product wafer processingArrangement business etc.


Unscheduleddowns

Unscheduleddowns

Scheduled downs

Scheduled downs

Idle/WaitingIdle/Waiting

Source - SEMATECH

Work breakdown in FAB

OEE(effect utilization rates of the entire equipment)OEE(effect utilization rates of the entire equipment)OEE(effect utilization rates of the entire equipment)OEE(effect utilization rates of the entire equipment)There are only 40% peel. There are only 40% peel. There are only 40% peel. There are only 40% peel.

It is not actually about the additional value. It is not actually about the additional value. It is not actually about the additional value. It is not actually about the additional value. There are a lot of work. There are a lot of work. There are a lot of work. There are a lot of work.

OEE:Overall Equipment Effectiveness

UP of OEE is a pressing need.




Unscheduleddowns

Unscheduleddowns

Scheduled downs

Scheduled downs


Source - SEMATECH






Unscheduleddowns

Unscheduleddowns

Scheduled downs

Scheduled downs


Source - SEMATECH




Unscheduleddowns

Unscheduleddowns

Scheduled downs

Scheduled downs


Source - SEMATECH


OEE(effect utilization rates of the entire equipment)OEE(effect utilization rates of the entire equipment)OEE(effect utilization rates of the entire equipment)OEE(effect utilization rates of the entire equipment)There are only 40% peel. There are only 40% peel. There are only 40% peel. There are only 40% peel.

It is not actually about the additional value. It is not actually about the additional value. It is not actually about the additional value. It is not actually about the additional value. There are a lot of work. There are a lot of work. There are a lot of work. There are a lot of work.

OEE:Overall Equipment Effectiveness

UP of OEE is a pressing need. UP of OEE is a pressing need.


© 2002 Selete 6

Fig 1-4 the concept difference from existing MES system

1.3. The Data and the Open of Equipment Engineering System As mentioned before, EE data is needed to be able to send out through standardized interface and process into/utilize at outside of the equipment, because EES is using by both IC Maker and Equipment Supplier side. Therefore, the interface which built up the environment for usage of the data and structure of the data is required to be standardized and opened(this is mentioned in chapter 2.1.1 in this document)

To open the interface and the data structure, it leads not only structural reform both IC Maker and Equipment Supplier, also access of third party and create paradigm-shift of industrial structure of Semiconductor Manufacture Industry. It gives us these possibilities such as follows;

①Changing work of IC Maker’s side IC Maker ‘s Essentiality／resolution of personal work －Equipment Operation Technology would not be monopolistic technology of IC Maker.

・As introduction of EES, share Operation Technology between IC Maker and Equipment Supplier and specify their responsibility, then enhance Equipment Operation.

－ As standardization of Data Structure, Equipment Operation Technology, Process Operation Technology such as APC etc it has a possibility to become commercially available technology.

Device maker

OEE improvementProduction efficiency

improvement

Device makerDevice perfection

improvement

Service quality improvement

EES

The range of indication by mutual consent

Data is aggressively used.

Outsourcing

････Introduction of technology on the market and application

････Division of responsibility

Device maker

OEE improvementProduction efficiency

improvement

Device makerDevice perfection

improvement

Service quality improvement

EESEES





OutsourcingOutsourcingOutsourcing

････Introduction of technology on the market and application

････Division of responsibility････Introduction of technology on the

market and application

････Division of responsibility

デバイスメーカデバイスメーカデバイスメーカデバイスメーカ

物流制御物流制御物流制御物流制御

プロセス制御プロセス制御プロセス制御プロセス制御

機密情報なので、機密情報なので、機密情報なので、機密情報なので、データは渡せないデータは渡せないデータは渡せないデータは渡せない

装置メーカ装置メーカ装置メーカ装置メーカ

ＭＥＳＭＥＳＭＥＳＭＥＳ

生産進捗管理生産進捗管理生産進捗管理生産進捗管理

品質管理品質管理品質管理品質管理







機密情報なので、機密情報なので、機密情報なので、機密情報なので、データは渡せないデータは渡せないデータは渡せないデータは渡せない機密情報なので、機密情報なので、機密情報なので、機密情報なので、データは渡せないデータは渡せないデータは渡せないデータは渡せない

装置メーカ装置メーカ装置メーカ装置メーカ

ＭＥＳＭＥＳＭＥＳＭＥＳＭＥＳＭＥＳＭＥＳＭＥＳ

生産進捗管理生産進捗管理生産進捗管理生産進捗管理

品質管理品質管理品質管理品質管理

Because it is a classified information

Data cannot be passed.

Because it is a classified information

Data cannot be passed. Device maker Device maker

Distribution control

Process control

Production progress management

Quality control

MES


© 2002 Selete 7

・Process Control Model, it is also possible to be completed if it has enough EE data, and it has a possibility to become commercially available technology.

・Equipment Operation Technology, it has possibilities as extensive use such as a preventive, maintain application that estimate the timing of maintenance, an application that estimate the timing of input NPW for monitoring operation condition and an application that analyze facts that cause inferior quality.

Ramp-up equipments at a stretch by equipment suppliers and IC Makers together.

－It would be able to ramp-up equipments efficiently by clarify its responsibility between equipment suppliers and IC Makers.(See chapter1.4)

②Changing work of Equipment Supplier’s side

The business that deal with equipment supplier’s operation know-how is expected to be shown up.(not only equipment supplier; also third party might be shown up → Third party’s enter this market.) －Collaboration between Supplier and Supplier would be easier. －improve the quality of the service and out-sourcing of the service would be possible. → Third

party’s enter this market ③Third party’s entering this market

Entering the market of software supplier or maintenance experts is expected to show up. Third party that only deals with package of know-how or software is expected to show up.

As out-source the service the business that focus on equipment category or process.

Fig 1-5 Openness of data structure and interface

Figure 1-5 shows the image of installing an application on opened interface. We can assume some cases, which is like EES application 1 to 3 in this figure, equipment supplier develop, IC Maker does, Third Vender develop and Equipment Supplier or IC Maker purchase, therefore for installing EES application, the interface and the data structure from the interface are needed to be opened and standardized.

EESアプリアプリアプリアプリ

ケーション１ケーション１ケーション１ケーション１



データ保存（ＥＥＳサーバ）データ保存（ＥＥＳサーバ）データ保存（ＥＥＳサーバ）データ保存（ＥＥＳサーバ）データ保存（ＥＥＳサーバ）データ保存（ＥＥＳサーバ）データ保存（ＥＥＳサーバ）データ保存（ＥＥＳサーバ）


ケーション２ケーション２ケーション２ケーション２




ケーション３ケーション３ケーション３ケーション３



装　置装　置装　置装　置装　置装　置装　置装　置

装置エンジニアリングデータインタフェース装置エンジニアリングデータインタフェース装置エンジニアリングデータインタフェース装置エンジニアリングデータインタフェース















装置エンジニアリングデータインタフェース装置エンジニアリングデータインタフェース装置エンジニアリングデータインタフェース装置エンジニアリングデータインタフェース















装置エンジニアリングデータインタフェース装置エンジニアリングデータインタフェース装置エンジニアリングデータインタフェース装置エンジニアリングデータインタフェース装置エンジニアリングデータインタフェース装置エンジニアリングデータインタフェース装置エンジニアリングデータインタフェース装置エンジニアリングデータインタフェース

EESApplicaton2

EESApplicaton1

EESApplicaton3

EES Data Interface

Data storage（EES Server）

Equipment


© 2002 Selete 8

However, there are possibilities such as “interface A” (fig 2-1) may be used as an application or built-in application that could use on “interface B” developed by Equipment supplier or third party.

And in this chapter, we distinguish between interface A which has ability of transfer data out of equipment and interface B which is for connecting with an application. 1.4. Essentiality of EES 1.4.1. Examine Equipment Capability

Mainly basic capability and equipment process function are in equipment capability. We don’t have specific discrimination though, in this specification we regard the capability that arranges and prepares the condition for generating processes such as placing a wafer on accurate position, then emitting gas at specified timing on specified profiles as basic capability. For further examples, in the case of vacuum device, to be able to have specified evacuation velocity and emit specified gas, in the case of heat-treatment, adjusting accurate temperature of heat-block to heat wafer up, and as general capability, controlling wafer handling and operation must be accurate etc.

About process function, it is able to control the processing duration to process wafers without particle , also in the case of Etching, it is able to acquire capabilities such as selection ratio, reaction distribution (film thickness distribution, etching rate distribution,), anisotropy of etching, coverage, contact resistance distribution, selectivity distribution.

By comparison equipment capability as it is mentioned above, basic capability is good enough to control arrangement function, but for process function, some problems come out such as unclear because of out of range of arrangement function and difficult to keep specified capability for long term. To make step forward to reaction that is generating on surface of wafer from arrangement function, trying to acquire its information directly from reaction of In-Situ monitoring is general way. However generally it is not easy that such direct monitoring react, and it is also rare that developing the technology like that. As developing In-Situ monitor, involuntary elements would be able to control as controllable parameter by the equipment. In this specification, we require information communication function which is relevant to process function to be the same level as the level that is required to existing process equipment or higher level. For equipments which was not required to have such functions, it will be necessity to have data dispatch function for monitoring basic function. 1.4.2. Utilizing EES before installing Equipment To confirm its operation of the equipment if it operates according to its design is major premise for implementation the equipment that operates accurately.

Especially, from the development machine to the first product enhancing efficiency of equipments is important, rational and accurate way of examine equipment operation is also important. Equipment suppliers are supposed to clarify designed value or normal value of the two equipment’s

capabilities that are mentioned above and then provide inspection function that should be enough to examine these values. The function to acquire DEE data that is required in this specification is an examine function of the simplest equipment basic performance.

It is effective to have EE data dispatch function and external EE function in a debug of development machine. Also it is useful for pre-shipment inspection.

It is important that installing after enough examination if there was nonconformity or not, however the way of examination is mostly un-scientific and experimental.

It is important to have operation test with 2,000 wafer before install, and during operation test is in execution, if it would be able to confirm equipment’s basic capability and re-productivity, find initial nonconformity, recognize each individualities of functional parts and scientifically confirm initial function as this specification demands as well, it will have effects on reducing failure rate and down time from failure.

It is rare that failure of equipments cause from some parts of equipment’s failure develop to failure of

whole equipments and has to stop the equipments to repair. Usually nonconformity of only one part would be enough faults to stop equipment. In other words, there are only these way that checking components inside equipments in large range and detecting nonconformity’s generation in the early level as much as possible to


© 2002 Selete 9

reduce repair time. Therefore, it is needed that not only the result of that 2,000 wafers are successfully transferred, but also we should confirm equipments basic function with database scientifically at least as it is demanded in this specification to fundamentally improve OEE.

This is important especially for installing first serial number to around 10 serial number, because we assume that production process of equipments are not enough skillful or producing with lots of improvements. 1.4.3. Utilizing EES after installing Equipment

After installing equipment, on site installing, adjustments and confirming functions, then hand-over is common scenario. During this confirming equipment function, we can acquire lots of basic function’s data, will utilize them as standard data after hand-over. In other word, with utilizing basic property at the time of hand-over as best value, we use the value to judge performance degradation. The point we have to be careful is that IC Makers and equipment suppliers does not have enough

experience to understand which degradation would be big deal for the time being. 1.4.4. Utilizing EES after delivered equipment

Most of basic functions of equipments are supposed to be regular monitoring. Degradations of equipment’s basic function usually grow slowly, therefore real-time monitoring is not required. For instance, we can assume a scenario like that sending equipment basic functional data once few second, batches processing for few second with EE function outside of the equipment and inspecting all the time.

It is important to adopt methods for diagnostics which can not be affected. Giving some concrete examples of wafer transfer, it is not inspection of basic function that comparison of the duration from a wafer enters load lock chamber to process chamber and reference data. The reason is a following. As duration of load lock exhaustion changes, it needs to separate duration for exhaustion and duration for transfer. Not all wafer goes “the first chamber”, paths are changed depends on process recipe. Therefore, it is good way to inspect wafer transfer’s basic functions that acquiring transfer duration on each unit behavior of wafer transfer within the equipment and comparing them. In this case, it is needed to divide behavior into the unit which is good for accurate comparison and acquire lots of data with considering the matters that require attention of data acquisition. 1.4.5. After equipment maintenance, repair, remodeling, adjustment and manual

operation We need to have enough check on the equipment’s performance after maintenance, repair, remodeling and

adjustment, and it often occurred nonconformity after updating software. For these reason, it is very important to check equipment basic performance as well as resetting process performance etc. Operators usually do this sort of check, but it is not easy for operators to check its performance. Therefore, it is strongly demanded to be prepared standardized and automatically measure of checking performances in order to make equipment resetting more assumed and speedy.

It is also important to have speedy numerical confirmation of operator’s equipment performance check. When we don’t quantitatively adjust equipments, we should keep adjustment within the range of process

function. It is important to use quantitative methods to adjust relevant functions with equipments basic function for realizing accurate maintenance. We demand the functions which are able to use such quantitatively methods and the effective data dispatch function for the equipments in this specification.

It has been thought that we could not have the result of operators with system was impossible, but we would be able to have it with DEE data and the other measure of equipment basic function. It would be automatically logging as record of manual operation. This has possibility of develop operator’s moral too. This is one of important functions of EES. 1.4.6. Tracking fault defect of the equipment

Various fault defects of the equipments cause from various reasons. The equipments that compliant with EES is reporting detailed operation data of the equipments, therefore in case of faults generated, it should be much easier to identify fault defects than it existing . On the other hand, operation of equipment For


© 2002 Selete 10

examples, we would be able to know like this situation that the behavior looked like fault was not fault in its part, it was caused from the other part of the equipment.

The function like this is quite different from alarm, but efficiency to shorten time cost for resetting from fault.

Also, it is possible to replace software to identify faults into convenience software or up grade because detailed operation records output outside of equipment.

Accumulating know-how enhances EES to be an application that has complicated diagnostic function. 1.4.7. Digitalize equipment behaviors process

The simplest and important process is history of how many wafer has been processed with process equipment. It is observed that becoming non-processing time longer, the outcome of wafer after the time becomes difference it from after consecutive processing on many of equipments. There are lots of factors to make difference between process after non-processing time and consecutive processing such as difference of wafer’s temperature or partial pressure in process chamber. As the countermeasure for the variation of process function, we can correct the equipment condition or just extend or shorten etching time etc. The case of it that mentioned above, duration of non-processing time and number of processed wafer after non-processing time would be important reference index for it. For example, in case of CMP, the application software, which simulate how much influence based on duration of the non-processing time, processing dummy wafer or product wafer, polishing thickness or number of processed wafer etc. EES demands to acquire history data outside, if needed the application software can refer the data and simulate the process recipe that is mentioned just before this sentence. As just described, APC works based on equipments condition, therefore EES contributes to stabilize process. 1.4.8. Connecting with External Sensor

It is assumed that EES can acquire detailed data of status from equipments. Add to this, using the data from added monitor sensor to the equipment, we would be able to know the timing of dispatch of effective signal by variation of status.

Also, it is possible to identify what kind of process and process condition cutting out the data and the cutout data have been monitored on by external applications. We can utilize external equipments as using it like mentioned above.


© 2002 Selete 11

2. Collection Equipment Data 2.1. Data Operation 2.1.1. Definition of Equipment Interface

We define following three interfaces as Equipment Interface. Fig2-1 pattern diagram (scheme) shows the three interface.

Fig 2-1 Pattern diagram for definition of interface

Table 2-1．．．．Definition of Interface

Interface Description Demand Level in this specification

Interface A Communication I/F for sending the data out at any time from equipment, and storage data as well.

EDA interface is equivalent to interface A. It is out of scope in this specification. However, it is required to specify its existence for the structure.

Interface B I/F that has capability of data storage, and

searching highly arranged data when you use EE

Data.

Essentiality for connection between database.

Interface C I/F that is needed to be via internet for realizing

e-Diagnostics from Equipment Supplier side.

Security system is required.

It is out of scope in this specification. Suggestion

from Equipment supplier would be acceptable.

Need arrangement about the way of connecting.

GEM:Generic Equipment ModelGEM:Generic Equipment ModelGEM:Generic Equipment ModelGEM:Generic Equipment Model

EDA:Equipment Data AcquisitionEDA:Equipment Data AcquisitionEDA:Equipment Data AcquisitionEDA:Equipment Data Acquisition

EE business applicationEE business applicationEE business applicationEE business applicationEE business applicationEE business applicationEE business applicationEE business application

EES system network

MES system network

EES terminal

Host System

The Internet

EES server

DB

GEMGEM

EDAEDAEDAEDA

GEM:Generic Equipment ModelGEM:Generic Equipment ModelGEM:Generic Equipment ModelGEM:Generic Equipment Model

EDA:Equipment Data AcquisitionEDA:Equipment Data AcquisitionEDA:Equipment Data AcquisitionEDA:Equipment Data Acquisition

EE business applicationEE business applicationEE business applicationEE business applicationEE business applicationEE business applicationEE business applicationEE business application

EES system network

MES system network

EES terminal

Host System

The Internet

EES server

DB

GEMGEMGEMGEM

EDAEDAEDAEDAEDAEDAEDAEDA


© 2002 Selete 12

2.1.2. Data Lifecycle We define that we call the period that the data generates to consume by end user, “data lifecycle”. We

roughly divide Data lifecycle into ”Data Provider” and ”Data User”, and following figures show some patterns (figure 2-2).

Please refer to table 2-2 for definitions of generation, rearranging1/2, preservation and report in figure 2-2.

Fig 2-2 Data Lifecycle

Table 2-2．．．．Behavior of EE data in Data Lifecycle

Section Explanation Generation To generate reportable data such as event, analog trace by the equipment. Summary1 Add additional basic information (ex; name of data, index and timestamp) in order to handle generated data as

EE data. Summary2 Connecting collected data to be easily retrieved by the other applications.

Add added value information(maximum／minimum／section average etc) Preservation Preserving EE data for a while, it can transfer result data by request of upper tier application.

Included information data that was heightened by rearrangement 2.

Report An application intervenes and it output conclusive pictures to viewer and files.

Figure 2-2, it shows just common “equipment body parts” though, equipment sub systems such as pump and external power supply, thermoregulator and gas transfer unit are the same directions as well. However, there is no requirement for EDA port about equipment sub systems in SEMI Standard, we assume that it has the same DB to relay in TDI as same as scenario 3 or 4 in Fig 2-2.

In this case, we recommend standard sensor actuator bus such as DeviceNet, Profibus and CC Link etc for the interface for giving and receiving data, although each equipment supplier’s original interface would not be obstructions. 2.1.3. Data retention period

It is difficult to define data retention period uniformly, because it depends on equipment supplier ‘s design policy or operation. Therefore, it is needed to discuss about appropriate retention period between equipment supplier and IC Maker to decide it.

Scenario 1

Scenario 2

Scenario 3

Scenario 4

Data handling relationApplication

EE businessApplication

Preservation

Preservation

Report

Report

Arrangemen

t 2

Arrangemen

t 2

Generati

on

Generati

on

Generati

on

Generati

on

Generati

on

Generati

on

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t 1

Arrangemen

t 1

Arrangemen

t 1

Arrangemen

t 1

Arrangemen

t 1

Arrangemen

t 1

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t 2

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t 2

Preservation

Preservation

Report

Report

Report

Report

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Report

Report

Report

Preservation

Preservation

Preservation

Preservation

Preservation

Preservation

Arrangemen

t 2

Arrangemen

t 2

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t 2

Arrangemen

t 2

Generati

on

Generati

on

Arrangemen

t 1

Arrangemen

t 1

Interface AInterface A

1

2

Arrangemen

t 2

Arrangemen

t 2

Arrangemen

t 2

Arrangemen

t 2

0

The data collected by interface A is used, and it is a state diagnosis of the device and an interface defective analyzed.

Interface B(higher-

order)Interface B

(higher-order)

Scenario 1

Scenario 2

Scenario 3

Scenario 4



Preservation

Preservation

Report

Report

Arrangemen

t 2

Arrangemen

t 2

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on

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on

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on

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on

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t 2

Preservation

Preservation

Report

Report

Report

Report

Report

Report

Report

Report

Preservation

Preservation

Preservation

Preservation

Preservation

Preservation

Arrangemen

t 2

Arrangemen

t 2

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t 2

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t 2

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on

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on

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Arrangemen

t 1


1

2

Arrangemen

t 2

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t 2

Arrangemen

t 2

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t 2

0

Scenario 1

Scenario 2

Scenario 3

Scenario 4



Preservation

Preservation

Preservation

Preservation

Report

ReportReport

Report

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t 2

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on

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on

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Preservation

Preservation

Preservation

Preservation

Report

ReportReport

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Report

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Preservation

Preservation

Preservation

Preservation

Preservation

Preservation

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Preservation

Preservation

Preservation

Preservation

Preservation

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t 2

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1

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t 2

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t 2

0



Interface B(higher-

order)Interface B

(higher-order)


© 2002 Selete 13

Following table shows rough standard of its retention period.

Table 2-3．．．．Data retention period

Equipment function for retention Equipment

datafunction

Minimum retention period Interface

No Enough buffer size to recover when communication error occurs.

Interface A(EDA)

Yes Maximum approximately 3 months Interface B 2.1.4. Scope of Data Disclosure The data that the IC Maker preserves exists in TDI. The IC Maker selects necessary data from all the data open to the public on TDI. Therefore, the relation of the overall data is shown in the figure below.

Fig 2-3 Scope of the utilizing data within EES

Scope of all data within equipment

Scope of released data on TDI to ICMakers

Scope of selected andcollected data by IC Makers


© 2002 Selete 14

2.2. Type of Equipment Engineering data

We assume EE data that would be outputted from the equipment are following three type. 1. Event Data(including DEE) 2. Trace Data 3. Context Data(equipment configuration, setting information)

Please refer to TDI Requirement Specification and F-EES Database Requirement Specification. ※F-EES Database Requirement Specification will not disclosure to public. Please have it from Selete Clients. 2.2.1. Event Data

Following shows the example of event data including DEE. Some of these data may be deal with remote I/O etc.

1. Sequence Start／End Event (Not only equipment itself, but also including sequence of lord port or equipment sub systems)

2. Alarm Generate／Converge Event 3. Job Start／End Event 4. Execution of recipe step Start／End Event 5. Event that is generated by operators.

※These data can be the same thing as Host event’s of SEMI Standard compliance though, it is better to have enough resolution to express events.

6. Sensor Actuator Status Alter Event ※The event to 1-5 might be able to be substituted by this.

Fig 2-4 Event data (including DEE)

As above figure shows, it is better to send start/stop information of sequence level out as DEE data. This makes it easier that interpreting DEE data outside of the equipment. It can work the same role as the job related information that describes later.

EventEventEventEvent

---- All from the event generated by the program sequence to the contAll from the event generated by the program sequence to the contAll from the event generated by the program sequence to the contAll from the event generated by the program sequence to the control event of sensor I/O are objects. rol event of sensor I/O are objects. rol event of sensor I/O are objects. rol event of sensor I/O are objects.

In deviceIn deviceIn deviceIn device

SequenceSequenceSequenceSequence

SensorSensorSensorSensor

I/OI/OI/OI/O

OUTOUTOUTOUT

ININININ

Production Production Production Production progress systemprogress systemprogress systemprogress system

VacuumVacuumVacuumVacuum


ActuatorActuatorActuatorActuator

high V

acuum end.

Rough V

ac. EN

D

Close door

turning on

Sohicoming

P ON

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turning on

Rough V

ac. Pum

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Rough Vac.

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Rough V

ac. Pum

p OFF

High V

acuum

Pump O

N

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open

ABCD EB DC B DC DC B DC BA AB DC B DC E A

Rough vacuum pump ONRough vacuum pump ONRough vacuum pump ONRough vacuum pump ONRough vacuum pump ONRough vacuum pump ONRough vacuum pump ONRough vacuum pump ON High Vacuum pump ONHigh Vacuum pump ONHigh Vacuum pump ONHigh Vacuum pump ONHigh Vacuum pump ONHigh Vacuum pump ONHigh Vacuum pump ONHigh Vacuum pump ON

Rough Rough Rough Rough VacVacVacVac. valve OPEN. valve OPEN. valve OPEN. valve OPENRough Rough Rough Rough VacVacVacVac. valve OPEN. valve OPEN. valve OPEN. valve OPEN High High High High VacVacVacVac. Valve OPEN. Valve OPEN. Valve OPEN. Valve OPENHigh High High High VacVacVacVac. Valve OPEN. Valve OPEN. Valve OPEN. Valve OPEN

Vacuum Vacuum Vacuum Vacuum attainmentattainmentattainmentattainment


Door closeDoor closeDoor closeDoor closeDoor closeDoor closeDoor closeDoor close

Process job(context data, career ID, and slot number, etc.)Process job(context data, career ID, and slot number, etc.)Process job(context data, career ID, and slot number, etc.)Process job(context data, career ID, and slot number, etc.)Process job(context data, career ID, and slot number, etc.)Process job(context data, career ID, and slot number, etc.)Process job(context data, career ID, and slot number, etc.)Process job(context data, career ID, and slot number, etc.)

Rough Vacuum ProcessRough Vacuum ProcessRough Vacuum ProcessRough Vacuum ProcessRough Vacuum ProcessRough Vacuum ProcessRough Vacuum ProcessRough Vacuum Process High Vacuum ProcessHigh Vacuum ProcessHigh Vacuum ProcessHigh Vacuum ProcessHigh Vacuum ProcessHigh Vacuum ProcessHigh Vacuum ProcessHigh Vacuum Process

Offer data in the

pastIn addition, the in-depth data

‥‥‥‥ Program sequence systemProgram sequence systemProgram sequence systemProgram sequence system

‥‥‥‥ Device control sequence Device control sequence Device control sequence Device control sequence systemsystemsystemsystem

‥‥‥‥ Actuator instructionActuator instructionActuator instructionActuator instruction

‥‥‥‥ I/O sensor responseI/O sensor responseI/O sensor responseI/O sensor response

‥‥‥‥ Vacuum sensor responseVacuum sensor responseVacuum sensor responseVacuum sensor response

AB

DC

E

Classification of Classification of Classification of Classification of eventeventeventevent

DEE dataDEE dataDEE data

DEE:Detailed Equipment EventDEE:Detailed Equipment EventDEE:Detailed Equipment EventDEE:Detailed Equipment Event

EventEventEventEventEventEventEventEvent

---- All from the event generated by the program sequence to the contAll from the event generated by the program sequence to the contAll from the event generated by the program sequence to the contAll from the event generated by the program sequence to the control event of sensor I/O are objects. rol event of sensor I/O are objects. rol event of sensor I/O are objects. rol event of sensor I/O are objects.




I/OI/OI/OI/O

OUTOUTOUTOUT

ININININ








I/OI/OI/OI/O

OUTOUTOUTOUT

ININININ


I/OI/OI/OI/O

OUTOUTOUTOUT

ININININ





high V

acuum end.

high V

acuum end.

Rough V

ac. EN

DR

ough Vac.

END

Close door

turning onC

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High V

ac. Pum

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ABCD EB DC B DC DC B DC BA AB DC B DC E A

Rough vacuum pump ONRough vacuum pump ONRough vacuum pump ONRough vacuum pump ONRough vacuum pump ONRough vacuum pump ONRough vacuum pump ONRough vacuum pump ON High Vacuum pump ONHigh Vacuum pump ONHigh Vacuum pump ONHigh Vacuum pump ONHigh Vacuum pump ONHigh Vacuum pump ONHigh Vacuum pump ONHigh Vacuum pump ON

Rough Rough Rough Rough VacVacVacVac. valve OPEN. valve OPEN. valve OPEN. valve OPENRough Rough Rough Rough VacVacVacVac. valve OPEN. valve OPEN. valve OPEN. valve OPEN High High High High VacVacVacVac. Valve OPEN. Valve OPEN. Valve OPEN. Valve OPENHigh High High High VacVacVacVac. Valve OPEN. Valve OPEN. Valve OPEN. Valve OPEN



Door closeDoor closeDoor closeDoor closeDoor closeDoor closeDoor closeDoor close

Process job(context data, career ID, and slot number, etc.)Process job(context data, career ID, and slot number, etc.)Process job(context data, career ID, and slot number, etc.)Process job(context data, career ID, and slot number, etc.)Process job(context data, career ID, and slot number, etc.)Process job(context data, career ID, and slot number, etc.)Process job(context data, career ID, and slot number, etc.)Process job(context data, career ID, and slot number, etc.)

Rough Vacuum ProcessRough Vacuum ProcessRough Vacuum ProcessRough Vacuum ProcessRough Vacuum ProcessRough Vacuum ProcessRough Vacuum ProcessRough Vacuum Process High Vacuum ProcessHigh Vacuum ProcessHigh Vacuum ProcessHigh Vacuum ProcessHigh Vacuum ProcessHigh Vacuum ProcessHigh Vacuum ProcessHigh Vacuum Process

Offer data in the

pastO

ffer data in the past

In addition, the in-depth dataIn addition, the in-depth data

‥‥‥‥ Program sequence systemProgram sequence systemProgram sequence systemProgram sequence system





AB

DC

E

Classification of Classification of Classification of Classification of eventeventeventevent‥‥‥‥ Program sequence systemProgram sequence systemProgram sequence systemProgram sequence system





AB

DC

E

Classification of Classification of Classification of Classification of eventeventeventevent

DEE dataDEE dataDEE data

DEE:Detailed Equipment EventDEE:Detailed Equipment EventDEE:Detailed Equipment EventDEE:Detailed Equipment Event


© 2002 Selete 15

Especially, as figure 2-4 shows, DEE data intends for all events that can be output and used as generic name. Adding appropriate information such as timestamp to DEE data, it makes DEE data to be possible to completely reproduce what the equipment behave and happen outside of the equipment. Fig 2-4 shows that assumption of the sequence to be vacuum chamber before the starting process, DEE deals with event data sensor I/O including its IN/OUT behavior.

Also, this “Event” is needed to cover all events as defined in E5(SECSⅡ) of SEMI Standard that are reported as EventReport(S6F11) to the host.

Fig 2-5 Work flow and Event

It is possible to output more detailed DEE data depends on its design though, basically it has enough fine resolution to capture the equipment’s behavior.

As figure 2-5 shows, everything from job at upper tier to device’s response at the end are DEE data, therefore considering analysis for the future, not only ID and Status, also Timestamp will be important.

From the Timestamp attached DEE data, it is possible to analyze responses for orders and for extended use such as behavior analysis.

DEE data includes all events from at actuator level to job level though, it is advisable to be the data structure like followings.

Included information in DEE(attribute) －１：Timestamp ←When －２：Event Reporter ID ←Who －３：Action Name ←What has been done －４：Related Resource －５：(Attendant information, Result)←Individual information、assurance of order of event generation

Common minimum configuration is described with “1.When”,“2.Who”, “3.What has been done”, and “4.Related Resource” is able to show ” what the event relates and relate events from top to down with” with time series from timestamp. Fig 2-6 shows this.

TTTTTTTTTTTTTTTTTTTTTTT

TT

TTTT

TTTT

TTTTTTTTT

Timestamp

10000101

11110111

1110010111110101

11000101

11010101

10110101

1101111110100101

11011101

101101111011011010110100

1011010110100101

101101111011011011010101

1101111111011101

11000101

10000101

11110111

1110010111110101

11000101

11010101

10110101

1101111110100101

11011101

101101111011011010110100

1011010110100101

101101111011011011010101

1101111111011101

11000101

True

TrueTrueTrueTrue

True

TrueTrueTrueTrue

True

FalseFalseTrueTrue

FalseFalseFalseFalse

FalseFalse

True

TrueTrueTrueTrue

True

TrueTrueTrueTrue

True

FalseFalseTrueTrue


FalseFalse

Event ID Status

Job Starrt Rough Vac.Process start

Door close

Rough Vac. Start

Vac. Pump ON

Vac. Valve open

Vac. Valve

Valve SensorVac. Gaugeset point

DEE Data

TimestampEvent ID Status

Job Level

DEE Data

RecipeLevel

ControlInstruction

ControlResponse

OperationResponse

Rough Vac Process. END

Vac. Valve close

Rough Vac. End

Door close

Vac. Valve open

Vac. Valve close

Vac. Pump OFF

Door close

Vac. Pump ON

Vac. Pump OFF

Valve Sensor

Vac. Valve

TTTTTTTTTTTTTTTTTTTTTTT

TT

TTTT

TTTT

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Timestamp

10000101

11110111

1110010111110101

11000101

11010101

10110101

1101111110100101

11011101

101101111011011010110100

1011010110100101

101101111011011011010101

1101111111011101

11000101

10000101

11110111

1110010111110101

11000101

11010101

10110101

1101111110100101

11011101

101101111011011010110100

1011010110100101

101101111011011011010101

1101111111011101

11000101

True

TrueTrueTrueTrue

True

TrueTrueTrueTrue

True

FalseFalseTrueTrue


FalseFalse

True

TrueTrueTrueTrue

True

TrueTrueTrueTrue

True

FalseFalseTrueTrue


FalseFalse

Event ID Status

Job Starrt Rough Vac.Process start

Door close

Rough Vac. Start

Vac. Pump ON

Vac. Valve open

Vac. Valve

Valve SensorVac. Gaugeset point

DEE Data

TimestampEvent ID Status

Job Level

DEE Data

RecipeLevel

ControlInstruction

ControlResponse

OperationResponse

Rough Vac Process. END

Vac. Valve close

Rough Vac. End

Door close

Vac. Valve open

Vac. Valve close

Vac. Pump OFF

Door close

Vac. Pump ON

Vac. Pump OFF

Valve Sensor

Vac. Valve

Equipment Engineering System Data Collection Requirement Document (DCRD)

© 2002 Selete 16

Fig 2-6 Correlation mode of DEE data

Except peculiar mechanism of the equipment’s own, further these event data have common parts such as

vacuum generation system limited within vacuum equipment, a driver of transportation system, therefore standardizing common parts will be good.

2.2.2. Trace Data

The trace data is the monitor data used for grasping equipment processing status and equipment capability status.

The Trace data can be categorized into two kind of data. One is the trace data for grasping equipment basic functions and equipment capability status, such as vacuum characteristic data, heat transition data, etc. This trace data is always collected from equipment. Another one is the trace data in order to grasp process related data, such as process pressure, process temperature, etc.

The followings are example of the trace data that should be collected from an equipment

1. Process-related data (In case of PVD equipment, Sputter Power, Plasma Intensity, etc.) 2. Non process-related data (Vacuum values, Temperature, Gas Flux, etc.)

This data shows the atmosphere of equipment or the setup state of equipment. The sampling rate is a low speed comparatively.

3. Environmental data (Atmospheric pressure of the circumference of equipment, Temperature, Humidity, etc.)

In Fig 2-7, the data of the vacuum exhaust characteristic is shown as trace data of the basic function in vacuum equipment, and the data of process gas flux is shown as process-related trace data.

In addition, since trace data is data which has the same meaning ("Pressure" such as Vacuum values, "Flux" such as gas and a chemical liquid, "Temperature" of a heating system or a cooling system, etc.) regardless of an equipment category in many cases, it is desirable to standardize a definition and the description method.

Timestamp = XX:XX:XX.aaaEvent Reporter = Value IDAction Name = OPEN_STARTRelated Resource = Actuator ID, Open Sensor IDAttendant Information = Null

Timestamp = XX:XX:XX.bbbEvent Reporter = Actuator IDAction Name = ONRelated Resource = NoneAttendant Information = Null

Timestamp = XX:XX:XX.cccEvent Reporter = Close Sensor IDAction Name = OFFRelated Resource = NoneAttendant Information = Null

Timestamp = XX:XX:XX.dddEvent Reporter = Open Sensor IDAction Name = ONRelated Resource = NoneAttendant Information = Null

Timestamp = XX:XX:XX.XXXEvent Reporter = Value IDAction Name = OPEN_ENDRelated Resource = Actuator ID, Close Sensor IDAttendant Information = Null


© 2002 Selete 17

Fig 2-7 Trace Data

In addition, since the example of detailed description of the trace data which should be acquired is

described in the appendix, refer to also there. 2.2.3. Context Data (Equipment Configuration , Setting information)

The context data has two kinds of categories. It is the dynamic one and is static one. The dynamic one is the one related to the process action, and changes dynamically. The static one doesn't change when no intentionally changing if set once.

Therefore, the context data differs from the event data and the trace data, and is feature dependency data of an individual device.

The content of the context data that belongs to these two-kind categories is shown as follows. ①Dynamic Context Data

－Recipe setting value: Value that exists in recipe before being customized with equipment. ・ Host sets data. And, The report to Host with the equipment is done between from

download from Host to the end of processing. －Recipe customizing value: Processing setting value customized on equipment ・ This is a value to which the equipment control system customized information from

A PC engine outside of the equipment. In the report, it is execution and it is simultaneous or if it is a report of each step, it is best. However, the report is enabled if it is between until after the setting and ending processing. The time stamp is necessary for the data sets.

－Execution value : Return value when recipe is executed ・ This is a value that the equipment actually uses for processing. When the step is

changed, the report can be reported if the next step starts. The time stamp is indispensable to this data.

Information related to jobs other than these is interpreted as follows. These are assumed to

be a category of the dynamic context.

1. Information directed from HOST

It always acquires it regardless of. (The process inside can be likely to raise the data resolution. )

Example) Vacuum characteristic

････Heating transition etc.

Only the process inside is acquired.

Example) Process pressure(vacuum degree)････Process temperature(heating system)- Though two above-mentioned items are always the

same systems as the monitor systemThe resolution is different. ････It is pressure during flowing quantity of the process

gas/minute. ････DC/RF power supply output etc.

Basic function trace dataBasic function trace data Data of trace related to processData of trace related to process















Basic function trace dataBasic function trace data Data of trace related to processData of trace related to process


© 2002 Selete 18

It is data directed from HOST necessary to process the wafer, and the LOT number, the slot number, and recipe, etc. correspond.

2. Relation to job

The job shows CONTROL JOB ID and PROCESS JOB ID.

Figure 2.8 shows the example of the context data along the flow of the wafer processing with cluster type Multi-chamber PVD equipment.

Fig 2-8 Example of context data generated according to processing step of Context Job

There is Lot/Wafer information such as Lot ID information and Slot Map when the career arrives, and are recipe information etc. on the processing program number etc. when recipe is downloaded. Moreover, there are recipe information etc. on the processing program number etc. when recipe is downloaded. In addition, there are information and real processing information related to JOB etc.

② Static Context Data －Equipment Constant

・ This is an initial value of device composition information and part information, and the equipment manager changes this. After executing processing, the equipment reports on data when a set value is changed. It is preferable that the data reported at that time adds recipe-customizing information.

－Equipment offset ・ This is an offset value in individual equipment. This has a manual setting by the equipment

manager. Or, there is an automatic setting with an intelligent mechanism such as A PC engine, too.

Because the processing details of the equipment are understood as well as the DEE data and the trace

data, these data is important. Therefore, the instruction value to process is a context data. Moreover, the equipment constant like the threshold of interlock is a context data.

Please refer to Chapter 7.3.3.3 of the appendix for the example of describing the thing that

Ch.2

Ch.3

Ch.1

L / L Ch.

Resources

EFEMWafer

Carriers

Load Ports

Lot/Wafer informationLot/Wafer informationLot/Wafer informationLot/Wafer information 1LotLotLotLot----ID and Slot Map, etc.ID and Slot Map, etc.ID and Slot Map, etc.ID and Slot Map, etc.

Recipe informationRecipe informationRecipe informationRecipe information 2

Processing program Processing program Processing program Processing program number etc.number etc.number etc.number etc.

Information related to JOBInformation related to JOBInformation related to JOBInformation related to JOB3

Execution recipe and use Execution recipe and use Execution recipe and use Execution recipe and use ChambaChambaChambaChamba, etc., etc., etc., etc.

Real processing informationReal processing informationReal processing informationReal processing information4

Device offsetDevice offsetDevice offsetDevice offsetChambaChambaChambaChamba offset etc.offset etc.offset etc.offset etc.

Wafer informationWafer informationWafer informationWafer information 5

Wafer tracking etc.Wafer tracking etc.Wafer tracking etc.Wafer tracking etc.

Context informationContext informationContext informationContext information

Recipe download

Career arrival

JOB generationJOB generationJOB generationJOB generation

Start of processing

It is processing it.

Processing end

Flow of processingFlow of processingFlow of processingFlow of processing

12 3

4

5

Ch.2

Ch.3

Ch.1

L / L Ch.

Resources

EFEMWafer

Carriers

Load Ports

Lot/Wafer informationLot/Wafer informationLot/Wafer informationLot/Wafer information 11LotLotLotLot----ID and Slot Map, etc.ID and Slot Map, etc.ID and Slot Map, etc.ID and Slot Map, etc.

Recipe informationRecipe informationRecipe informationRecipe information 22

Processing program Processing program Processing program Processing program number etc.number etc.number etc.number etc.

Information related to JOBInformation related to JOBInformation related to JOBInformation related to JOBInformation related to JOBInformation related to JOBInformation related to JOBInformation related to JOB33

Execution recipe and use Execution recipe and use Execution recipe and use Execution recipe and use ChambaChambaChambaChamba, etc., etc., etc., etc.

Real processing informationReal processing informationReal processing informationReal processing informationReal processing informationReal processing informationReal processing informationReal processing information44

Device offsetDevice offsetDevice offsetDevice offsetChambaChambaChambaChamba offset etc.offset etc.offset etc.offset etc.

Wafer informationWafer informationWafer informationWafer informationWafer informationWafer informationWafer informationWafer information 55

Wafer tracking etc.Wafer tracking etc.Wafer tracking etc.Wafer tracking etc.

Context informationContext informationContext informationContext information

Recipe download

Career arrival

JOB generationJOB generationJOB generationJOB generationJOB generationJOB generationJOB generationJOB generation

Start of processing

Start of processing

It is processing it. It is processing it.

Processing endProcessing end

Flow of processingFlow of processingFlow of processingFlow of processing

12 33

4

5


© 2002 Selete 19

should be acquired for this data concrete.

2.2.4. Conclusion of Kind of Equipment Engineering Data

Table 2.4 shows three kinds of equipment engineering data stated by 2.2.3 from Chapter 2.2.1. Three kinds of equipment engineering data(Event data including DEE, Analog trace data and

Dynamic/Static context data) is classified according to an equipment type. These classifications are useful at the time of development of data output / collection function.

Table 2-4．．．．Equipment Engineering Data

Data Equipment type dependency

Kind Example of Data Depend

Individual

The usage

Host View Event Data(GEM300) ○ Work in Process Load Prot Status Event ○ EPT、FOUP/Load Port monitoring Wafer flow ○ Process execution step timing ○

Process monitoring and Debug of Recipe Substrate Tracking

Actuator and Sensor timing ○ ○ Actuator and Sensor timing monitoring The event is not dependent on an equipment type, the operation is dependent on an equipment type.

DEE

Operation event ○ ○

The relation between maintenance and equipment history The event is not dependent on an equipment type, the operation is dependent on an equipment type.

Pressure characteristic data ○ Judgment after a maintenance the stability check at the time of a process

Gas flow data ○ the stability check at the time of a process Chamber / stage temperature ○ the stability check at the time of a process Trace Factory Environment (Power, Water flow, Compressed air pressure, Exhaust Pressure )

○ Health check by monitoring equipment operation environment

Process set up data (Recipe, Actual set data, Monitoring data)

○ Nominal The Comparison of recipe data ,Compensation data and monitoring data

Process data validation ○ The Response of Process data validation Interlock setup data ○ Interlock data for Recipe (PJ) validation

Context

Equipment composition data ○ Interlock data for Recipe (CJ) validation


© 2002 Selete 20

2.3. The communication system of Equipment Engineering Data In order to treat Equipment Engineering data, equipment needs 2nd communication port.(As you know 1’st Port is for MES)

This 2nd communication port is called <<EDA (Equipment Data Acquisition) port >>. The EDA port is an interface for sending EE data to TDI from equipment and must always transmit data independently with the online/offline state of a MES communication port.

2.3.1. Equipment to TDI 2.3.1.1. EDA port protocol

The EDA port is an interface that outputs data from the equipment, and data is received to use it by the data reference and the application and the passed interface is TDI. Therefore, the EDA port protocol is outside the demand range in this specifications.

In the SEMI Standard, it is assumed to be Interface A, and the method to output data by SOAP/XML is regulated as tentative standard (PR8). However, mounting the data output method by SOAP/XML frequently revised is large the risk at the present stage.

Moreover, the interface that outputs data from the equipment becomes outside the cover range of PR8 if it thinks high rank interface of TDI to be Interface A.

Therefore, the protocol and the data format of the EDA port are assumed to be unquestionable by an equipment supplier original specification in these specifications 2.3.1.2. Data transfer method in accordance with SEMI Standard (PR8) Refer to "Chapter 7.4.2 Conform to SEMI Standard (PR8)" of the appendix when the EDA port makes the protocol conform to SEMI Standard (PR8) (left of Figure 2-9). Information that has been described the reference ahead puts data on the tag of XML, and when meta information is offered, it is possible to lighten data by simplifying the description in XML.

Fig 2-9 Difference in equipment engineering data sending interface

2.3.1.3. For a supplier original specification (right of Figure 2-9)

The communication protocol and the data format of the above-mentioned require the supplier to decide it. This paper demands the presentation of the following data collection plans and meta information from the supplier with the equipment specification.

The necessity in the equipment operation is scarce though meta information is composed of the content and the format of output data. However, the supplier should offer it within the possible range so that the IC Maker may occasionally use meta information.

Moreover, deliberately between the supplier and the device manufacturer for the data collection plan and meta information to control the importance of the equipment data.

Generally, the method of the transmission after it accumulates by a constant cycle or a constant number for the DEE data is devised though the equipment is forwarded after the trace data is accumulated at a constant

Interface A Interface A

Interface A （EDA) Interface B

Supplier original specification(Existence is concealed.)

Supplier original specification(Existence is specified. If it is possible, it opens it to the public the specification. .)


© 2002 Selete 21

cycle. This paper is required to transmit the event data at any time, and when the load is reduced to the

transmission by the packet that accumulates DEE for data management, this method is recommended.

2.3.1.1. Data collection plan function Data collection plan (DCP) function, which can be dynamically edited from EES clients, is not demanded in this specification. The function can carry enough if each every particular item can be set from MMI on the equipment etc. whether to transmit the collected data. The method of selecting the group, which shows groups of the following data for a convenience of the change because the setting of individual data includes many things, is proposed now as the most reasonable method. It is also convenient that the equipment provide the function of judging the state and the function of switching DCP, which has set some patterns beforehand. If the function can be installed because the thing actually installed is not very difficult technically, it is the one positively recommended. < example > ①Data group for equipment start-up Data necessary to detect abnormality outside assumption． All data should be transmitted. High sampling rate is required ②Data group for FDC A certain analysis of the equipment operation and data where the cause can be detected by paying attention specifically and abnormally are transmitted. ③Data group for predictive maintenance Minimum data necessary for maintenance is transmitted. ④Data group for process processing management Sampling rate of the part specified only for a specific period is raised to detect the change in process and data is transmitted. 2.3.2. From the TDI to F-EES DB and the applications 2.3.2.1. Definition of EE data offer form

When the EE data is collected, it is necessary to define the offer form of the target (object?) EE data. It is described to the host communication specifications, and present the offer form of the target (object?) data from the equipment supplier beforehand in the collection of the equipment data by SECS/GEM. It is a demand to present the offer form of the target (object?) data from the equipment supplier as well as the case of SECS/GEM for (at?) the collection of the EE data. A consideration matter and other supplementation matter concerning the definition of the EE data offer form are shown as follows. 2.3.2.2. Selection of target (object?) data

It basically proposes the target (object?) data for the EE data from the equipment supplier. It is a demand to select data to which each equipment corresponds, and to present data as

Meta data because it has described the kind of the EE data to achieve the equipment engineering capabilities to Chapter 2.2. 2.3.2.3. Correspondence to Data Transfer System of Selete Recommendation

In the system configuration which Selete assumes as a recommendation proposal, the data


© 2002 Selete 22

outputted from equipment is once reported to TDI, and adds the minimum information that it is utilizable on TDI with application (it is not the limitation when possible on equipment). And or it accumulates again and reports data to the demand from the F-EES database of a factory level which generalizes the whole line, it assumes offering data based on the demand of various applications ("Chapter 6 Selete proposal specification" and "figure 6-1 Selete proposal system" refer to).

In this case, the protocol used for data transfer assumes the communication systems between general-purpose databases (ODBC, JDBC, etc.).

For this reason, the direction of the information needed in case View used for data use of the database and EE application of a report place is built, and the data structure of the relay database once accumulated becomes important from the communication format supposing delivering and receiving direct data by the Push system from equipment.

In addition, in order to describe details separately about this case on TDI demand specifications and F-EES database demand specifications (*), refer to there. *: In order not to carry out general public presentation, F-EES database demand specifications come on hand more nearly individually than each Selete client company, when required. 2.3.2.4.Sending data format in the sending and receiving interface of data. Supply a data format in case the data used as the object is sent from equipment in collection of EE data. The following cases are assumed about a data format. ・ The case of the direct communication between TDI and F-EES DB by ODBC/JDBC

through View. ※Not a data format but the storing structure in the database of F-EES and the solution by the side of TDI to it become important. ・ The case of an XML format. ・ The case of a CSV format. ・ The case of a peculiar format. The consideration matter in each case and other supplementary matters are shown below. ①The case of the direct communication between TDI and F-EES DB by ODBC/JDBC. Separately, refer to TDI function requirement document. Refer to "Chapter 7.4.1 the case where it is based on Selete recommendation specification" for the outline of data transfer of a TDI base. ②The case of an XML format As mentioned above, supply an XML schema fundamentally in the case of an XML format. The definition of XML is based also on supply of web service, and assumes the following definition methods. ・ XML Schema ・ WSDL(The case where Web service is supplied．) In this case, since it is the same as that of the case where data is outputted by XML format from an EDA port, refer to "Chapter 7.4.2 Case where it is based on a SEMI standard (PR8)" of an appendix, for details.


© 2002 Selete 23

③The case of a CSV format. Define a CSV format, when EE data is sent out or transmitted by CSV format. Specify each format, when two or more formats exist. Supply the information for the reception side of data decoding data for arrangement of each data, the format type distinction method, etc. which are described by the above-mentioned data definition correctly by the document. ④The case of a peculiar format. Supply information on a series of rule necessary for reading data in the composition and the grammar of the format with the document about the case where data is sent by a peculiar format. ⑤Relation with a communication protocol. "Chapter 7.4.1 Data communications method" of these specifications explains the relation between a data format and a communication protocol. When there is a matter that should be taken into consideration by the data transmission protocol, indicate supplementary explanation on a document.


© 2002 Selete 24

2.4. Equipment Structure Information Data Source must be specified in EE Data to do analysis work. So Equipment Structure Information should

be added to EE Data. Logical Equipment Structure Model is define as below to represent Equipement Structure Information.

Each Elements of this model is expected to define at Data Definitions mentioned in section 2.3.2.1. 2.4.1. Equipment Structure Model

Equipment Structure Model have 4 layers (Equipment／Module／Subsystem／IODevice) and It is represented as below. (Example of PVD is Shown Section 7.3.1 and 7.3.2).

Fig 2-10 Logical Model of Equipment Structure

2.4.1.1. Frexibility for OBEM(SEMI Std. E98) This model does not prohibit to adapt OBEM. if applicable.

2.4.1.2. Frexibility for CEM(SEMI Std. E120)

This model does not prohibit to adapt CEM. if applicable.


© 2002 Selete 25

2.5. Job Layer and Historical Record. Another point of view for data analysis, It is required to make relationship between EE Data and Job

Related Information. It is required to easy utilization of EE Data from the application which works at F-EES. Job related information will be sent from an equipment with EE Data, or The application find relationship

between EE data and Job Related Information after getting EE data if relationship between EE Data and Job Information is clear.

Job Layer Model to get Job related information is shown below. Many application is follow this job layer model to handle EE data.

Each elements of Job Layer Model is expected to define at Data Definitions mentioned in section 2.3.2.1. (refer to table 7-9 Event Message body.)

However, It is difficult to add Job Layer Information when many sensor’s information are reported in one group. Thus Equipment Supplier shall make Specification Document with Relationship between EE Data and Job Related Information prior to shipment to the IC Maker for User who want to analyze EE Data with Job History Data.

Fig 2-11 Logical Model of Job Elements


© 2002 Selete 26

2.6. Relevance with SEMI Standard A part of SEMI standard (under development is included) corresponds or relates to some

contents of each item specified by these specifications. It is a table about each application demand to the level (EDA, TDI) of the interface specified

in Chapter 2.1.1. It is shown in 2-5. Although these specifications do not require mounting about applicable standard, about what

is judged that mounting is possible, this is not barred by the equipment supplier. Table 2Table 2Table 2Table 2----5. SEMI Relevance with a standard5. SEMI Relevance with a standard5. SEMI Relevance with a standard5. SEMI Relevance with a standard

SEMI standard EDA higher rank interface

TDI higher rank interface

#3442 (RaP) Un-corresponding. Un-corresponding. #3507 (Authentication and Authorization) not used. It might refer #3509 (Data Collection Management) It might refer Un-corresponding. #3570 (XML Common Components) It might refer Un-corresponding. #3527A (PCS) Un-corresponding. It might refer #3571 (EDA Guide) It might refer Un-corresponding. #3731 (XML Schema for CEM) It might refer Un-corresponding. E10 (RAM)／E58 (ARAMS) Un-corresponding. Un-corresponding. E30 (GEM) Un-corresponding. Un-corresponding. E39 (OSS) Un-corresponding. Un-corresponding. E40 (Process Job) Un-corresponding. Un-corresponding. E53 (Event Reporting) Un-corresponding. Un-corresponding. E54 (Sensor/actuator Network) Un-corresponding(*). Un-corresponding. E88 (CMS) Un-corresponding. Un-corresponding. E90 (STS) Un-corresponding. Un-corresponding. E94 (Control Job) Un-corresponding. Un-corresponding. E98 (OBEM) It might refer It might refer E116 (EPT) Un-corresponding. Un-corresponding. E120 (Common Equipment Model) It might refer It might refer E121 (Guide for Style & Usage of XML) It might refer Un-corresponding. E125 (Equipment Self Description) It might refer It might refer E126 (EQIP) Un-corresponding. Un-corresponding. E128 (XML Message Structure) It might refer Un-corresponding. PR8 (EDA Solutions Proposed Standard) It might refer Un-corresponding.

In the case of the EDA port of PR8 conformity．You may refer to, when not based on PR8.


© 2002 Selete 27

3. Needed Application for Equipment Engineering work Applications to be resided in F-EES or TDI divide into 2 kinds of applications. One is the base application

for data handling such as data collection, arrangement, preservation, and the other one is the enhanced application for EE task execution.

We define the scope of that we describe in this specification from buffering output data from the equipment on TDI to handling the data output on demand from F-EES database at upper tier. Therefore , on TDI it is needed to implement these applications for data handling such as follows.

3.1. Application related to Data handling

The ideal data that is collected on interface A of the equipment should show clear matters of outgoing data, and be directly utilizable on EE operation application. However, most of the data are assumed that these would be just a enumeration data of ON/OFF sign and it would not be able to interpret without any change. It will be needed to interpret its contents with time information, determined data definition and supplementary information. Such applications that interpret the data is needed to handle DEE data.

Equipment’s meta-information ・ Data collection・arrangement

－Collect data and reform the data applicable for DB et, and then accumulate the data on TDI temporary. The application which associate with the data above is also included in this capability. ・ Data preservation・elimination ・－Storage the data into DB, and compression transfer or cull or eliminate the data according as

predetermined rule. －Dispatch the data according as EE application or the other component. It is proper for terminal

function such as e-Diagnostics. ・ Historical management

－Equipment／Macro historical management such as operation history of module or equipment.

Following capability is available in upper tier of F-EES level, but if possible, it would be able to implement.

・ Data collection －Take temporary statistics of the data to utilize them on EE application which will be mentioned later.

We assume this level is available for operation management of equipment. ・ Linkage with the other information

－Associate with MES system or YMS system

For detail of each capability, please refer to “EES User Requirement System Document(USRD)”.


© 2002 Selete 28

3.2. EE Application We assume that EES use these functions as follows with using defined data in this specification. For detail,

please refer to chapter3.1.2 to 3.1.12 in chapter 3.1 “Required capability” of “Equipment Engineering System User Requirement Document (EES-URD)”. The application written here will be needed to know operation status and assure process function which expands in an equipment.

Additionally, EE application written in this specification is not assumed to implement, we assume that the application is loaded upon EES for IC Maker’s use. However, there should be existing some applications to assure own equipment capability by equipment supplier, therefore it is natural to implement the applications onto TDI. We expect equipment suppliers to offer us positive approach to maintain equipment capability from different point of view.

The case of loading the other applications or capabilities out of required scope, and if it is possible to disclose to equipment user, we would like to have description or additional specification. 3.2.1. Equipment Operation Management Capability

The following business is put in view as a function that should be achieved so that the EES user concerning the device driving management may use it. Refer to a pertinent item in "Function demand" Chapter 3.1 of EES-URD for details of the function.

・ Daily Monitoring

－The state of the device is monitored, and it is assumed to report on the state of the device according to the demand of the EES user. (Refer to the application related to 3.1 data handling. ) It is also possible to use it as feedback information to the equipment remodeling in the future and the new model design because the reproduction data of detailed operation details of the device and the operation state data can be accumulated by this business.

・ Fault Detection(the first diagnostic)・Alarm －Fault detection (FDC) done on EES is shown. The business that puts out warning of the level that

cannot be detected by the alarm of the device is assumed from the tendency management for a short term etc. ・ Fault analysis(Second Diagnostic)・Alarm

－It is a business part where device information is analyzed based on the alarm and the cause is guessed by the first diagnosis.

・ Inspection execution judgment/request －When it is necessary to do some inspections as a result of watch in daily monitoring and abnormal

detection/analysis, EES proposes it. The business of the NPW issuance request etc. is put on view. ・ Management value edit function

－Function to do judgment logic of the above-mentioned function and edit of threshold/maintenance. ・ Interlock Management

－Function to detect whether to find abnormality in setting of interlock of device and record/to notify. The unexpected value is detected whether being set. If no logical adjustment (It is abnormal that the signal of a certain part is a state like turning on though there is no direct influence in driving the device etc.) can be detected as a regulating system for the device, it is better.

Functions such as "Machine difference absorption" and "Chamber difference absorption" in this chapter

in EES-URD besides the above-mentioned though it explains, it doesn't refer in this specifications because these are functions deeply related to the process control. However, because it is content the future that should be put in view, installing is not refused (Describe it clearly in specifications at the time of installing).

3.2.2. Maintenance support function The scope of maintenance support function is the following items. Refer to a pertinent item "Required Function" inside which exists in Chapter 3.1 of EES-URD for details of the function.


© 2002 Selete 29

The function concerning the maintenance support is an item which should receive the assistance of EES when the engineer of equipment maintenance and the engineer of equipment supplier's field services work based on the result of "Function of equipment management for operation" in the preceding clause. *Work support -In actual maintenance, execute the navigation and the proposed work of the locating fault and maintenance to a necessary part by an electronic manual etc. It is expected that this function is very big in function vs. effect as this function wants to ask for implementing by all means. This function is made the range of the support to be able to direct remote from the outside by originally mediating EES. Do not refuse to be implemented though this part does not refer in these specifications. *Diagnosis analysis support -Support diagnosis/analysis of the equipment when it undertakes an actual maintenance work, and the confirmation work of the cause etc. of the guess proposed from EES is done. Or, it is a function necessary to diagnose the equipment when the regular service etc. are done by the proposal from EES besides the predictive maintenance. In addition, it is a function which becomes indispensable to judge whether the work was effective when diagnosing it for the confirmation after it works maintaining. In this case, the function that EES should have it is a function same as abnormal detection and an abnormal analysis, and it needs it before and behind the maintenance. *Input support -Offer the input support interface so that the content of work and the result may leave the record by inputting it through EES as data linked with the history data base of EES. The behavior of the equipment is reproduced or can be analyzed by collecting the DEE data with EES. This is necessary though relates the record of the maintenance to these information. In how change of the behavior of the equipment by the maintenance or the ascertainment whether the maintenance was effective, it becomes an extremely important item. Therefore, it is necessary to implement this support function by all means. The function of "Proposal beforehand" besides the above-mentioned is described in this chapter for EES-USAD (User systems analysis document). This is a function related even to scheduler/dispatcher of the MES system, materials system, and human affairs DB. Therefore, it does not refer in these specifications because it seems that it is difficult to achieve this at once. 3.2.3. Recipe management The scope of recipe management is as follows. *Recipe career management of equipment (Time series management etc.) -The best each occasion setting is expected to be able to compare with the operation career and the maintenance career of the equipment, and to be proposed more. *Comparison watch function between equipments homogeneous and different model equipments -It is a watch function as for the individuality between equipment two or more homogeneous models. *The function of the recipe editor -It becomes advantageous for the edit of the recipe when the data of the individuality of the equipment is at hand. *Validity evaluation for Recipe -Function to judge whether to be able to use recipe which tries to be executed without trouble


© 2002 Selete 30

based on information on equipment state/composition, and to report on result. It is a different field on operation management/guarantee side of the equipment composed as EES intended purpose for the recipe management. However, it becomes a useful platform when working like the above-mentioned so that the recipe management may treat the data of an instruction value, a set value, and the execution value of the recipe as context information. The purpose of EES is the 1st keeping the operation of the equipment best and constant, and has implications for the recipe executed on the equipment. Therefore, it is thought that the recipe management on EES is the most efficient and effective because it is possible to confirm it concurrently with the state of the equipment. 3.3. Relation of SEMI Standards A part of SEMI Standards (include it while developing) corresponds partially of the content of the every particular item which provides with this specifications or it relates. Do not disturb this in these specifications for standard which can be applied for the one judged to be able to implement by the equipment supplier though it is not the one to demand implementation.

Table 3Table 3Table 3Table 3----1111 RelationsRelationsRelationsRelations of SEMI Standards of SEMI Standards of SEMI Standards of SEMI Standards

SEMI Standards Relation #3442 (RaP) It might refer #3507 (Authentication and Authorization) It might refer #3509 (Data Collection Management) It might refer #3527A (PCS) It might refer #3531 (XML Schema for CEM) It might refer #3570 (XML Common Components) It might refer #3571 (EDA Guide) It might refer E30 (GEM) It might refer E10 (RAM)／E58 (ARAMS) It might refer E39 (OSS) It might refer E40 (Process Job) It might refer E53 (Event Reporting) No use E88 (CMS) It might refer E90 (STS) It might refer E94 (Control Job) It might refer E98 (OBEM) It might refer E116 (EPT) It might refer E120 (Common Equipment Model) It might refer E121 (Guide for Style & Usage of XML) It might refer E125 (Equipment Services Description) It might refer E126 (EQIP) It might refer E128 (XML Message Structure) It might refer PR8 (EDA Proposed Standard) It might refer


© 2002 Selete 31

4. Information Security For the Information Security about the Interface from equipment to factory,

There is not the requirement that IC Maker require to Equipment Supplier. (Except as the Security about the remote access through the IC Maker’s fire wall, refer to 4.2) As protection of Secret Information, protection of data is needed by the System function that is different between each IC Maker’s security policy., so it does not define the same security structure in this specification. For the reason, the discussion between IC Maker and Equipment Supplier is needed when the concrete security function is applied.

The basic principle of IC Maker’s Information Security is below. 4.1. Security Countermeasure of IC Maker’s side

The basic principle of IC Maker’s Information Security is below. 4.1.1. Non Disclosure Agreement

EE data of EES are defined and protected by Non Disclosure Agreement that contract between IC Maker and Equipment Supplier (In some cases 3rd software vendor) Non Disclosure Agreement has concrete secret information that are treated by agreement during IC Maker and Equipment Supplier. 4.1.2. Access Control At the basic structure of EES, information transfer is defined from equipment to limited client,

not to the general public. So information security is kept by routing function and

Fig 4-1Image of access control by routing function and filtering function

Client-1Client-1 Client-2Client-2 Client-3Client-3

Device engineering server(EES server)

Device A#1 Device A#2 Device B#1 Device C#1

Client-1Client-1 Client-2Client-2 Client-3Client-3

Device engineering server(EES server)

Device A#1 Device A#2 Device B#1 Device C#1

:IP Lock:IP Lock

The client applicationIt is inaccessible to an unauthorized device.

The client applicationIt is inaccessible to an unauthorized device.

The device maker : the EES server. It manages. The device maker : the EES server. It manages.

The client applicationIt is EE data in the EES server if there is no permission. It is .... inaccessible.

The client applicationIt is EE data in the EES server if there is no permission. It is .... inaccessible.


© 2002 Selete 32

4.1.3. Authentication In closed network circumstance inside FAB, we suppose that security countermeasures such as followings

should be in effect. Therefore, considering including some problems such as operation cost, identifying authentication between individual equipments and clients (applications) on session level is under consideration though for the future, it wouldn’t be introduced at this specification.

• Contract Non Disclosure Agreement with equipment supplier or 3rd software vendor

(described) • Access control kept by routing and filtering of switching hub and Information security

during equipment supplier (described) • Strictly restricted admission to FAB (malicious hacker cannot entry to FAB) • Access control to network inside FAB (restricted join to FAB network by PC hand carried

from outside FAB.) Constantly inspect log and collection access log.. 4.1.4. Encryption

In closed network circumstance inside FAB, usually we don’t demand to encrypt anything assumed as encrypting information is not necessary. As above, access control by routine function or filtering function, to prevent unauthorized access and tip between equipment vendors have been considering, therefore, encrypting data or communication intelligence is not required all the time. And also, considering including lowering response cause from encryption and operation cost problem, in our plan we would not encrypt the communication intelligence between each equipments or retention. 4.2. Request security countermeasure of equipment suppliers

We show basic requirement about applied information security countermeasure in the view of equipment suppliers as follows. 4.2.1. Security countermeasures in FAB

As it is mentioned above, it is regarded as that the basic security countermeasure is access control such as by routing or filtering function, and the other security countermeasure such as authentication or encryption is not needed.

However, equipment supplier may implement information security countermeasure for observing confidential of its own data or IC Maker. Even in that case, so as not to the implementation have an impact to FAB information environment, detailed implementation document and agreement for implementation are needed.


© 2002 Selete 33

4.2.2. Security countermeasure against remote access through firewall

When equipment supplier will access through firewall or another way, it is different from described principle. In this case, information security method as strict as possible is needed. However, as remote access, protection of data is needed by the System function that is different between each IC Maker’s security policy. So as not to define the same security structure. If equipment supplier’s supplying service has remote access, detailed implementation document and agreement for implementation are needed.

Fig 4-2 Image of remote access via firewall

4.3. Relevance with SEMI standard

Part of contents of this specification document is corresponded or related to SEMI standard. (included under development) Even though this specification document is not needed application of SEMI standard, if equipment supplier think it will be able to apply SEMI standard, equipment supplier may apply.

Table 4-1．．．．RRRRelevanceelevanceelevanceelevance with SEMI standard with SEMI standard with SEMI standard with SEMI standard

SEMI Standard Relevance #3507(Authentication and Authorization) It may refer

The Internet

VPNVPN

Console of device

Among the device makersApplication server

In factoryApplication server

Among the device makersEES server

In factoryEES server

Virtual lease lineEES terminal EES terminal

Firewall Firewall

The Internet

VPNVPN VPNVPN

Console of device

Among the device makersApplication server

In factoryApplication server

Among the device makersEES server

In factoryEES server

Virtual lease lineVirtual lease lineVirtual lease lineEES terminal EES terminal

Firewall FirewallFirewall Firewall


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5. Conformance table of the Specification TBD


© 2002 Selete 35

6. Selete proposal specification In this chapter, we explain Selete proposal specification for a concrete example of the systems

mentioned so far. Figure 6-1 shows outline of Selete proposal specification. Features of the system in this proposal are;

1. To take the data out is done via the dedication computer that is called Tool Data Interface (TDI). TDI is recommended to reside into the equipment’s rack.

2. The data take out by the opened database access methods from TDI such as ODBC and JDBC at factory side’s database server.

3. Factory side’s database server is built up with commercially available DBMS. 4. Security capabilities that are prepared by suppliers such as access control are implemented in TDI.

Besides, it is better that application software to be implemented on TDI in principal. 5. Developing application software or the application software that is prepared by IC Makers will be

implemented to the application server and evaluate and operate it.

Fig 6-1 Selete proposal system

The system that has been built up in this proposal specification, it is needed to adjust detailed configuration depends on the scale management Fab or configurations. It is needed to have discussion about the method and scale for its adjustment.

MES NetworkMES Network

EES NetworkEES Network

EES Terminal

EES Data ServerEES Data Server

Factory Systems

EESAppl.

Eq. FDC

Competitive Technology?Competitive Technology?

•Implementation focus•Equipment Engineering data need to be exported onto network separately from MES•Applications reside external to the equipment

TDITool Data InterfaceTool Data Interface

ODBC，，，，JDBC

DB to DB data transferEES

Appl.M/M

matching

EESAppl.Maint.

support

EESAppl.Health

Monitor

Add equipment view data


© 2002 Selete 36

7. Appendix 7.1. Benefit of EES Data Opening 7.1.1. Availability of Equipment Engineering Data

TBD

Fig.7Fig.7Fig.7Fig.7----1 Example of events from curter to developer at photo litho operation1 Example of events from curter to developer at photo litho operation1 Example of events from curter to developer at photo litho operation1 Example of events from curter to developer at photo litho operation

Robot伸縮伸縮伸縮伸縮/回転回転回転回転Robot伸縮伸縮伸縮伸縮/回転回転回転回転

STP CLOCKSTP CLOCK

C/D(Coater/Developer)C/D(Coater/Developer) STP(Stepper)STP(Stepper)

C/D CLOCKC/D CLOCK

Buffer収納収納収納収納/取出取出取出取出Buffer収納収納収納収納/取出取出取出取出

STP -> CDBuffer

STP -> CDBuffer

CD -> STPBuffer

CD -> STPBuffer

C/DC/D STPSTP

TR Req TR Req

ARM Ex ONARM Ex ON

ARM Ex OFFARM Ex OFF

TR Ack TR Ack

Pin UP ON Pin UP ON

Pin UP OFF Pin UP OFF CompleteCompleteChuck OP/CLChuck OP/CL

PI/O HandshakePI/O HandshakeRobot伸縮伸縮伸縮伸縮/回転回転回転回転Robot伸縮伸縮伸縮伸縮/回転回転回転回転

STP CLOCKSTP CLOCK

C/D(Coater/Developer)C/D(Coater/Developer) STP(Stepper)STP(Stepper)

C/D CLOCKC/D CLOCK

Buffer収納収納収納収納/取出取出取出取出Buffer収納収納収納収納/取出取出取出取出

STP -> CDBuffer

STP -> CDBuffer

CD -> STPBuffer

CD -> STPBuffer

C/DC/D STPSTP

TR Req TR Req

ARM Ex ONARM Ex ON

ARM Ex OFFARM Ex OFF

TR Ack TR Ack

Pin UP ON Pin UP ON

Pin UP OFF Pin UP OFF CompleteCompleteChuck OP/CLChuck OP/CL

PI/O HandshakePI/O Handshake


© 2002 Selete 37

7.2. Example of data lifecycle We show example of implementation at the point of data lifecycle view as follows. Yellow arrow: show the stream of data Red arrow: request of data Refer to 2.1.2 about category that used example of data lifecycle as follows 7.2.1. Data lifecycle at TDI Equipment must send the arrangement data as well as the data that be searched, when data request will be happen by application software and all. There are two case that data arrangement2 and saving are executed looking as close as equipment inside or using actually TDI clearly. 7.3. Example of Equipment Engineering data 7.3.1. Example of composition of multi chamber vacuum equipment

Fig7Fig7Fig7Fig7----4 Construction Example for vacuum 4 Construction Example for vacuum 4 Construction Example for vacuum 4 Construction Example for vacuum equipment (equipment (equipment (equipment (PVD)PVD)PVD)PVD)


© 2002 Selete 38

Fig7Fig7Fig7Fig7----5 Equipment Model Example for Vacuum Equipment5 Equipment Model Example for Vacuum Equipment5 Equipment Model Example for Vacuum Equipment5 Equipment Model Example for Vacuum Equipment

7.3.2. Example of process unit composition of multi chamber vacuum equipment TBD

Fig 7-6 Construction Example for Process Unit


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Fig Fig Fig Fig 7777----7 Model 7 Model 7 Model 7 Model Example of ProcessExample of ProcessExample of ProcessExample of Process Unit Unit Unit Unit

7.3.3. Example of collection data for vacuum equipment TBD

Fig7Fig7Fig7Fig7----8 EE Data from EDA interface8 EE Data from EDA interface8 EE Data from EDA interface8 EE Data from EDA interface

Equi

pmen

t

Meta Data

Context Data

Trace Data

Event Data (DEE Data)

Data handlingAPL

TDI Scope


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7.3.3.1. Example of Detailed Equipment Event data TBD

Example of Data Item Object Explanation Job start／end event Equipment Event Example for Equipment Level Action Spatter Process Sequence start／end Process Unit Event Example for Process Unit Level Action Vacuum Exhaust Sequence start／end Subsystem Event Example for Subsystem Level Action belonged

to Process Unit Wafer Stage up／down I/O device

(Sensor/Actuator) Event Example for Sensor/Actuator Level

Vacuum Limit Error Process Unit Example of Alarm generate 7.3.3.2. Example of Trace data TBD Example of Data Item Explanation

Process Power Electric Power during process is traced. Triggers for acquisition are process unit sequence start/end Process Electric Current

Electric current during process is traced. Triggers for acquisition are process unit sequence start/end

Process Electric Voltage

Electric voltage during process is traced. Triggers for acquisition are process unit sequence start/end.

Gas Current Gas current during process is traced. Triggers for acquisition are process unit sequence start/end Process Chamber Pressure

Chamber Pressure during process is traced. Triggers for acquisition may synchronize process unit sequence start/end. It is necessary to acquire from enough time before gas entry to enough time after gas stop

Stage Temperature Stage temperature is traced all time. Triggers for acquisition may set all time It is necessary to acquire comparatively short interval during process time, and comparatively long interval except process time.

Vacuum Vacuum is traced all time. Triggers for acquisition may set all time It is necessary to acquire comparatively short interval during process time, and comparatively long interval except process time.

7.3.3.3. Example of Context data TBD

Example of Data Item Explanation Lot／Wafer information In the case of equipment acknowledgment for Lot information by assignment from Host,

It is informed correlate processing start event with carrier ID／slot ID(GEM300 level),Lot number／Wafer number(GEM200 level)

Recipe related information

In the case of equipment acknowledgment for Job information by assignment from Host(GEM300),It is informed Job information (both PJ and CJ). In the case of GEM200, It is informed recipe information by assignment from Host.

Recipe conversion information

Recipe conversion information converted by Job (GEM300) or Recipe information (GEM200) is informed correlate with processing start event or step informed event.

Wafer tracking information

In the case of equipment acknowledgment for wafer transfer information, It is preferable to add wafer ID to event information when wafer transfer is influenced by control sequence.

Equipment constant In the case of several equipment at same type for same use, It is preferable to inform setting value (offset value) of each equipment for achieving same condition.

7.3.4. Another detailed equipment status data

TBD


© 2002 Selete 41

Fig 7Fig 7Fig 7Fig 7----9 Inspection bulb behavior with Gas flow rate9 Inspection bulb behavior with Gas flow rate9 Inspection bulb behavior with Gas flow rate9 Inspection bulb behavior with Gas flow rate

7.4. Data communication method 7.4.1. Compliance with the Selete proposal Logical model of equipment in this specification document is base on fig.2-10 at 2.4.1. Data managed by TDI is based on this model, it has property as actual generate place. For example of cluster typed PVD, Individual device is shown as follow ① Whole equipment including Product Machine Loadport ② Transport unit ③ Process unit ④ Subsystem Controller ⑤ Sensor, Actuator 7.4.1.1. Protocol for collecting data This specification document dose not treat communication method between equipment and TDI. Refer to TDI specification document when you need to know communication between TDI and upper application software or database. 7.4.1.2. Data managed by TDI Data managed by TDI are showed as follow.

Data acquisition is possible.

Data acquisition is impossible.

Instruction signal


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Name

Contents

Event

when (timestamp) Location Object Action

Trace

when (timestamp) Location Trace data

Exception

when (timestamp) Location Object Action

Context (dynamic)

when (timestamp) Location Wafer identified Information and recipe Action Process Data

Context (static)

Location Object Setting data

7.4.1.3. Event data Event data is sent after data souse is identified. It is necessary to clear that the data is generated in which module of which level. There are event data depend on level of equipment as follows. (1) Equipment level

(a) Start/End of Lot(or Job) Note ① If intended equipment is batch process type, it is need to start/end of wafer career. ② If intended equipment is wafer by wafer process type, it is need to start/end of

wafer. (b) Start/End of sequence at equipment level

(2) Module level (a) Start/End of step sequence of module level

For example Start/End of vacuum evacuation sequence Start/End of process sequence on individual chamber

(3) Device level (a) Case of Actuator with Sensor

① Start event is generated just before moving Actuator ② Verify operating Sensor ③ If a timer for operational end is needed, wait for the time. ④ Generate event for operational end

(b) Case of Actuator without Sensor ① Start event is generated just before moving Actuator ② If a timer for operational end is needed, wait for the time. ③ Generate event for operational end

7.4.1.4. Trace data Accession of trace data is executed by unit module. It is necessary to clearly sampling cycle and term of data.


© 2002 Selete 43

7.4.1.5. Exception data It is necessary to clear that the data is generated in which module of which level. There are exception depend on level of equipment as follows. (1) Equipment level

(a) Generate/Release of error at equipment level sequence (2) Module level

(a) Generate/Release of step sequence of module level (3) Device level

(a) Case of Actuator with Sensor ① Error at interlock is generated just before moving Actuator ② Case without sensor input by operational error

(b) Case of Actuator without Sensor ① Error at interlock is generated just before moving Actuator

7.4.1.6. Context data (1) Dynamic Context data

Information is needed at start/end of rot(or job) as follow. ① Information for identified wafer

Career ID&Slot ID, Rot ID&Wafer ID It may be treated as parameter when event is reported.

② Recipe ID It may be treated as parameter when event is reported.

③ Recipe body It is Actual setting value so as not to hold in equipment as file. It may be stored as specific file.

7.4.1.7. Schema Example of schema for defining each data is showed as bellow. Context data (both static and dynamic) schema is under consideration, not defined now.


© 2002 Selete 44

Table 7-5．．．．Event Schema

Table ７７７７-6．．．．Schema of trace data

Item Index Explanation Example TDI SEQ Sequential number at TDI TDI Time ○ Time stamp at TDI SourceID ○ Data source ID

Recommendation of below complex key (１)EquipmentID (２)LocationObjectName

Assign data source Module or Sub System to Location Object Name

SourceSEQ Sequential No at data source SourceTime Time stamp at data source

Lot ID Lot ID Carrier ID Carrier ID Wafer ID Wafer ID Slot ID Slot ト ID

KeyInfo-1 Key information Assign data for using search condition within equipment supplier proposal data

KeyInfo-2 Key information ：

KeyInfo-n Key information Value-1 Collection value from data source Send data for trace Value-2 Collection value from data source

：：

Value-m Collection value from data source

Item Index Explanation Example TDI SEQ Sequential No. at TDI TDI Time ○ Time stamp at TDI SourceID ○ Data source ID

Recommendation of below complex key (１)Equipment ID (２)Location Object Name

Assign data source Module or Sub System to Location Object Name

SourceSEQ Sequential No at data source SourceTime Time stamp at data source

Event ID Event ID Unique ID for identify event Task ID Task ID Assign task for device or sequence

Action ID Action ID Describe action of event Ex.) START/END

Lot ID Lot ID Carrier ID Carrier ID Wafer ID Wafer ID Slot ID Slot ト ID

KeyInfo-1 Key information Assign data for using search condition within equipment supplier proposal data

KeyInfo-2 Key information ：

KeyInfo-n Key information Value-1 Collection value from data source Send data with event Value-2 Collection value from data source

：：

Value-m Collection value from data source


© 2002 Selete 45

7.4.2. Compliance with the SEMI standard (PR8) 7.4.2.1. Definition of XML (Definition of TAG) XML become common for standard document transmit method, and on SEMI standard, it is considered and established using XML. This specification document does not recommend engaged using XML/SOAP transmit method of SEMI standard PR8, but forbid using XML/SOAP. So, it is necessary for using XML/SOAP to propose defined information for TAG previously. Assumed definition of XML is bellow.

• XML Schema • WSDL(case of Web Service available) Examples are showed bellow. It is necessary for equipment supplier to propose the definition

of objective data and data item on actual specification.

Table 7-7．．．．Message structure

Tag Name Description XML Datatype Behavior Message Header Equipment Common Header Complex Required Message Body Equipment unique message body Complex 1 required, M optional

Table 7-8．Message Header

Tag Name Description XML Datatype Behavior Supplier Name of Equipment supplier String Required Model Type of Equipment String Required

ImmutableID Serial No. String Required

Table 7-9．．．．Event Message Body Tag Name Description XML Datatype Behavior MsgType Classification of Message: "Event" String Required

Time Time of event generation. ISO 8601 format DateTime Required ObjID Object of event generation String Required

SerialNo Event No. Unique No. Number needed SerialNo Required TaskID Executing (or will execute) task ID of event generated object NonNegativeInteger Required

ActionID Content of event. Ex) start/end, on/off etc. String Required Spec Information or data for control Ex) spec, parameter String Optional

ParentObjID Object ID for booting task of event generated object String Optional ParentTaskID Task ID of object for booting task of event generated object String ParentLinkID Unique ID of event identification within domain of object for event

generation String Optional

Parameter Collection of parameter Complex 0, M Optional

Table 7-10．．．．Exception Message Body Tag Name Description XML Datatype Behavior MsgType Classification of Message: "Exception" String Required

Time Time of event generation. ISO 8601 format DateTime Required ObjID Object of event generation String Required

SerialNo Event No. Unique Number needed SerialNo Required TaskID Executing (or will execute) task ID of event generated object NonNegativeInteger Required

ActionID Content of event. Ex) start/end, on/off etc. String Required Spec Information or data for control Ex) spec, parameter String Optional

ParentObjID Object ID for booting task of event generated object String Optional ParentTaskID Task ID of object for booting task of event generated object String


© 2002 Selete 46

ParentLinkID Unique ID of event identification within domain of object for event generation

String Optional

Parameter Collection of parameter Complex 0, M Optional

Table 7-11．．．．Parameter Elements Tag Name Description XML Datatype Behavior MeasTime Date of measurement dateTime Optional

ParamName Name of parameter StringMaxLength=128 Required ParamValue Value of parameter String Required

LowerWarningLimit Lower warning limit String Optional UpperWarning Limit Upper warning limit String Optional

LowerAlarmLimit Lower alarm limit String Optional UpperAlarm Limit Upper alarm limit String Optional

[Example of data transmission as data definition above(Event case)] <MessageHeader>

<Supplier>Some Supplier</Supplier> <Model>7300</Model> <ImmutableID>AA02-7305</ImmutableID>

</MessageHeader > <MessageBody>

<MsgType>Event</MsgType> <Time>1999-05-31T13:20:00</Time> <ObjID>cid</ObjID> <SerialNo>cs001</SerialNo> <TaskID>ct001</TaskID> <ActionID>TaskStart</ActionID> <Spec>ppara1</Spec> <ParentObjID>pid</ParentObjID> <ParentTaskID>ptd</ParentTaskID> <ParentLinkID>pld</ParentLinkID> <Parameter> <MeasTime>1999-05-31T13:20:02</MeasTime> <ParamName>Press1</ParamName> <ParamValue>5.5e-3</ParamValue> <LowerWarningLimit>5.5e-4</LowerWarningLimit> <UpperWarningLimit>5.5e-2</UpperWarningLimit> <LowerAlarmLimit>5.5e-5</LowerAlarmLimit> <UpperAlarmLimit>5.5e-2</UpperAlarm Limit> </Parameter> <Parameter> <MeasTime>1999-05-31T13:20:03</MeasTime> <ParamName>Press2</ParamName> <ParamValue>4.5e-3</ParamValue> </Parameter>

</MessageBody> 7.4.2.1. Definition with another format

Not as definition for XML above, another format proposal is considerable. For example, Case of equipment supplier proprietary format of event data or CSV format, it is necessary for document to define another format of data. 7.4.2.2. Describe item of data definition It is necessary for data definition to describe item bellow.

Table 7-12．．．．Describe item of data definition No Item Item Name Description 1 Name of data item DataName Name of proposal data for EE data 2 Data definition or Description Data definition or description


© 2002 Selete 47

description 3 TAG name TAGName TAG name for XML description 4 Data type DataType Assign data type for Complex、String、Non Negative Integer、date Time 5 Supplementary

explanation Remark Needed supplementary explanation (described later)

6 Others Others Others, if it is needed explanation, it will be described. 7.4.2.3. Supplemental document for detailed items

In the case of XML definition, it is necessary for document to describe supplementary explanation about data definition required special consideration, somewhere else data definition and data description of each TAG. For example, When DEE data is defined by a TAG for several sensors information, it is necessary for supplementary explanation to propose discriminating method. It is showed example for supplementary explanation bellow. <MessageHeader>

<Supplier>Some Supplier</Supplier> <Model>7300</Model> <ImmutableID >AA02-7305</ImmutableID >

</MessageHeader > <MessageBody>

<MsgType>Event</MsgType> <Time>1999-05-31T13:20:00</Time> <ObjID>cid</ObjID> <SerialNo>cs001</SerialNo> <TaskID>SEQ001</TaskID> <ActionID>CHANGED</ActionID> <Parameter>

<MeasTime>1999-05-31T13:20:02</MeasTime> <ParamName>DEE-PIO-RMT1</ParamName> <ParamValue>04 77 3F 22 04 57 88 44 33… 23 67 53 22 00 FF E6 5F…</ParamValue >

</Parameter> <Parameter>

<MeasTime>1999-05-31T13:20:02</MeasTime> <ParamName>DEE-PIO-RMT2</ParamName> <ParamValue>0B 73 3F 22 04 57 88 44 33… 23 67 53 22 00 FF E6 4F…</ParamValue >.

</Parameter> </MessageBody> ≪Supplementary explanation example for TAG<ParamValue>≫ It is showed example for transmit of PIO bitmap data as complex. Data is transmitted by hexadecimal ascii code as 1port of 8bit. PIO 7.5. Similar／／／／Practical examples of EES

We assume that EES’s future would handle all 3 kinds of data event, data(including DEE), trace data, context data, as described in chapter 7.3.3. though, some of the systems that have been developed in order to enhance equipment efficiency have the same ability as EES’s to realize functions using part of these data, execute improved EE task.. Examples are following.

7.5.1. Practical examples on Cluster type PVD equipment (July 2002 at SEMICON West, hold by SEMI e-Manufacturing Workshop／December 2002 at SEMICON Japan, hold by SEMI e-Manufacturing Workshop／June 13 2003 presented by Mr. Ohno of ULVAC)

It was introduced as the reformed action of service business through collecting data by EE’s


© 2002 Selete 48

practical example using the data server that has been developed as self-diagnosis system Some practical examples of EE function that utilize the data server, which has originally been developed as self-diagnostic system for equipments, were introduced as the activity that contains data collection function and innovation of service business. In the case of this equipment, we are able to gain process of high-level detailed equipment operating condition, although this equipment may not covered with all range of this specification. Although this equipment does not cover whole scope that is written in this specification, it is able to have detailed process of equipment operation condition from the function that collects equipments control command and behavior results as events. Also, ULVAC has unique method for connecting with analog trace data and its data has high quality resolution, therefore it can easily control process drift on single wafer processor. Equipment control is done by event driven, therefore it is quite easy to utilize control sign or correspondence as DEE, and control its size to be small compare with the number of data that is supposed to be collected. And, analog trace data judges the status of the equipment, and DCP is also installed in order to change designed parameter data collecting cycle. As practical examples, it is proved to be used as fine adjustment according to error value from measured data and present value pre shipment examination, equipment health report at acceptance inspection, equipment health monitor at producing and prediction of out of order / maintenance.

At present, this is the only equipment have ideal EES system on board.

7.5.2. Practical examples on CMP equipment “Starting e-manufacturing business”, which was held on June 13th 2003 by JEITA/SEAJ/Selete Presenter Mr. Ohishi of EBARA CORPORATION, Mr. Suzuki of MEIDENSHA CORPORATION This system is that scanning memory map by determinate interval to grasp condition of the equipment. It is different method from ULVAC’s. On this method, getting large the sign or part to collect, getting large the amount of data. Therefore it would remain some issues for data back up on practical operation. However, regarding instability processing CMP equipment, even though targeting specified part to collect data would be able to gain enough efficient, therefore it has been enough for practical use.

Documents

Equipment Engineering System Data collection Capability ... · the case of being required to implement EES in early stage for Prototype evaluation. These interfaces mentioned in this