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This flyer gives a brief overview of the Centre , our partners, our technical programme and a summary of what large-area electronics is.
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Partner Universities
This EPSRC Centre for Innovative Manufacturing brings
together four centres of excellence:
• Cambridge Innovation and Knowledge Centre at the
University of Cambridge
• Centre for Plastic Electronics at Imperial College
London
• Welsh Centre for Printing and Coating at Swansea
University
• Organic Materials Innovation Centre at the University
of Manchester
Sponsor
Getting Involved
• our research programme is strongly influenced by
industry input and we welcome discussions with any
company interested in working with us
• we are looking for industry partners to participate in
collaborative projects leveraging our expertise
• we invite proposals for short feasibility projects in our
annual Pathfinder Call
• the EPSRC Centre acts as a national hub for the LAE
community and organises networking events for
industry and academia
ContactLuigi G. Occhipinti, PhD
National Outreach [email protected]
+44 (0)1223 332838
www.largeareaelectronics.org
www.largeareaelectronics.org
About Large-Area Electronics
Large-Area Electronics (including printable, flexible or
organic electronics) is a new way of making electronics
using novel electronic materials, often formulated as
inks, deposited by low-temperature processes such as
printing and coating. This approach offers advantages of
lower-cost manufacturing plants producing systems in
high volume with new form factors and features. Large-
area electronics (LAE) elements may be combined with
bare silicon dice to form complete electronic systems
that retain form factor benefits of thinness, flexibility and
light-weight.
About the EPSRC Centre
The EPSRC Centre for Innovative Manufacturing in
Large-Area Electronics addresses key manufacturing
research challenges aimed at meeting end-user needs
for multifunctional large-area electronic systems.
The objectives of the EPSRC Centre are to:
• address the technical challenges of manufacturing
multifunctional LAE systems
• develop a long-term research programme in
advanced manufacturing processes aimed at
ongoing reduction in manufacturing cost and
improvement in system performance
• support the scale-up of technologies and processes
by UK manufacturing industry; and
• promote the adoption of LAE technologies by the
wider UK electronics manufacturing industry
Technical Programme
Theme 1: Advanced Manufacturing Processes
Concepts for high-resolution high-yielding, high-volume
methods to increase functional device performance and
reduce cost.
• developing high resolution patterning processes for
higher device and system performance
• developing novel multi-functional materials
systems and patterning processes for improved
manufacturability
Theme 2: System Integration
Addressing the need for multifunctional systems in
applications where printing-based manufacturing makes
economic sense.
• developing innovative approaches to multifunctional
system manufacture of large-area electronics using
processes that minimise cost
• developing novel approaches to high-throughput
functional testing
Displays, lighting and smart windows
(emissive or reflective)
Pho
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it: B
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Sensors (optical, physical, chemical, biological)
Electronic circuits (analogue and
digital)
Thin and flexible photovoltaics, energy harvesting and storage devices
Multi-functional integrated smart
systems on foil
Photo credit: EC project FP7 247710 Interflex
Adhesion lithography
Printedre-chargeable
batteries
Printed antennas
Printed FETgas sensors
Transparent electrodes
High-speed testing
Printed capacitors
Energy harvesting
sub-system
Contact-printed
High-speed printed diodes
Multi-sensor sub-system
Customisable
Solution processed analogue
electronics
Neuromorphic computing
circuitsLAE + Silicon
Topology defi ned
patterning
Advanced rheology
Laser annealing
Manufacturing Processes & Supporting
Science Sub-Systems
System Integration
Demonstrators
Device Processes and Components
Testing Methods
Advanced Manufacturing Processes
System Integration
