Environmental Product Content Specification Rev 2007

8/12/2019 Environmental Product Content Specification Rev 2007

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TITLE: ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED

MANUFACTURERS

RESPONSIBLE GROUP/OPERATION: Materials

DISTRIBUTION:

ISSUED: February 21, 2007

APPROVAL NAME: TITLE:

SPEC OWNER: Joni Hansen ATGM PSMT Mgr

WORKING GROUP LEADER: Linda Young CPRS, CMC SC Chair

SPONSOR: Dave Musso SMO, CMC SC Sponsor

FUNCTIONAL MANAGER(S):

Yi-Wen Chan CMPO/CSO

Hector Carlo SM

Rick East SMO

Luyin Zhao ATGM

Jim Jewett GFM

Terry Richesin SM Q&R Regulatory Mgr.

Steven W. Brown Chemical Use Policy Forum

Kevin Dehmer Packaging MRC ChairTodd Rallison EHS Legal

EXPIRATION: July 21, 2008

TABLE OF CONTENTS

1.0 PURPOSE & SCOPE:.....................................................................................................................................22.0 REQUIREMENTS:.........................................................................................................................................23.0 RESTRICTIONS: ...........................................................................................................................................2

3.1 MANUFACTURING RESTRICTIONS............................................................................................................23.2 PRODUCT CONTENT RESTRICTIONS:.........................................................................................................3

3.2.1 GENERAL RESTRICTIONS ......................................................................................................................33.2.2 RESTRICTIONS IN SPECIFIC APPLICATIONS .....................................................................................5

3.3 PACKAGING REQUIREMENTS .................................................................................................................63.3.1 PACKAGING CONTENT RESTRICTIONS:......................................................................................63.3.1 PACKAGING SUPPLIER DECLARATION FORM:..........................................................................6

3.4 BATTERY CONTENT RESTRICTIONS:.....................................................................................................63.5 FUTURE MATERIAL RESTRICTIONS: .....................................................................................................73.6 POTENTIAL FUTURE MATERIAL RESTRICTION WATCH LISTS...................................................73.7 FUTURE MATERIAL DECLARATION REQUIREMENTS.......................................................................7

4.0 ROLES & RESPONSIBILITIES....................................................................................................................75.0 REFERENCE DOCUMENTS: .......................................................................................................................86.0 DEFINITIONS:...............................................................................................................................................87.0 REVISION HISTORY....................................................................................................................................9

ATTACHMENT A: CHEMICAL LIST ............................................................................................................10Attachment B Intel EPC Spec Conformance Form ..........................................................................................13Attachment C Packaging Environmental Regulatory Compliance Form .........................................................14Attachment D: RoHS Supplier Declaration Form...............................................................................................15Attachment D-2: IPC 1752 Supplier Declaration Form ......................................................................................16Attachment E - EU RoHS Exemptions (Examples) ............................................................................................17

DOCUMENT NUMBER: BS-MTN-0001 REV.6 1 of 17

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1.0PURPOSE & SCOPE:

1.1. PURPOSE: The purpose of this specification is to define environmental requirements for Intel suppliersand outsourced manufacturers. Intel sets high environmental standards for its products and requires that

its suppliers and outsource manufacturers enable similar environmental performance.

1.2. SCOPE: The scope of this specification includes all raw materials, parts, components or products that are

ultimately incorporated into the product that Intel sells. For outsourced manufacturers, this includesproducts produced by the manufacturer on behalf of Intel. This specification also covers packaging

materials.

2.0 REQUIREMENTS:

2.1 Environmental Requirements: In this specification, environmental requirements are defined in section 3

below for the following:

3.1 Manufacturing restrictions

3.2 Product content restrictions

3.3 Packaging requirements

3.4 Battery content restrictions

3.5 Future material restrictions

3.6 Potential future material restriction watch lists

2.2 This document shall be referenced in the contract & the purchasing agreement document.2.3 All part and/or material suppliers must review this specification & sign the compliance form in Appendix

B. Intel will begin piloting the IPC 1752 industry standard form with selected suppliers during 2007.

Suppliers not selected for the IPC 1752 pilot will be requested to fill out the Intel SDoC form. The signed

form must be returned to the Intel Commodity Manager for submission into the data base.

2.4 All shipping packaging suppliers must review this specification & sign the compliance form in AppendixC. The signed form must be returned to the Intel Packaging Engineer for submission into the data base.

3.0 RESTRICTIONS:

3.1 MANUFACTURING RESTRICTIONS

The following materials are prohibited for use in the manufacturing of raw materials, parts or products

supplied to Intel.

Material Potential Industry Uses Threshold Reason for Inclusion

Ozone Depleting

Substances Class I

Not expected due to industry

phase-out, but rare cleaning

applications may be found.

0 2037/2000/EC,,

Montreal Protocol; US: Clean Air Act

Amendments Title VI (40 CFR Part 82.106);


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The following materials are prohibited for use in the manufacturing of parts or products on behalf of Intel

(e.g. outsourced manufacturing).


Ozone Depleting

Substances Class I


phase-out, but rare cleaning

applications may be found.

0 2037/2000/EC,



Ozone Depleting

Substances Class II

Not expected, but use of HCFCs

as substitute for CFCs in cleaning

operations may be found.

0 Clean Air Act Amendments Title VI (40 CFR

Part 82)

2037/2000/EC

Certain Glycol Ethers Certain ethylene glycol ethers

were traditionally used as solvent

in semiconductor manufacture.

0 Semiconductor industry voluntarily banned th

use of certain ethylene glycol ethers in

manufacture of semiconductors.

3.2 PRODUCT CONTENT RESTRICTIONS:

The following materials are prohibited for use in raw materials, parts, components, or products above the thresholds

defined below. Restrictions are divided into two categories: General Restrictions and Specific Applications. For thecategory of Specific Applications, materials are only restricted for use in those applications list in the table.

3.2.1 GENERAL RESTRICTIONS

The following materials are prohibited in all raw materials, parts, components or products provided to Intel.


Asbestos, Asbestos

Materials

Not expected 100 ppm

(total)

76/769/EEC, Marketing and Use of Dangerou

Substances, and amendments (83/478/EEC;

85/610/EEC; 91/659/EEC); United States

Toxic Substances Control Act (restricts new

uses). Occupational Safety and Health Act (2CFR 1910.1001-1051)

Lead Solder, alloy in metal 1000 ppm

(0.1%wt)

per

homogenous

material*

(Note 1)

EU Directive 2002/95/EC Restriction of

Hazardous Substances (RoHS) (2003)

China Management Methods on the Preventio

and Control of Pollution Caused by Electroni

Information Products (2006)

Cadmium Stabilizer in plastics, cables and

cords.

Dyes, pigments, paints, enamels

100 ppm

(0.01%wt)

per

homogenous

material*

91/338/EEC. Restrictions in Austria,

Switzerland, Denmark, Netherlands, and

Sweden

2002/95/EC Restriction of Hazardous

Substances (RoHS) (2003), China Manageme

Methods on the Prevention and Control ofPollution Caused by Electronic Information

Products (2006)Hexavalent

Chromium

Plating, metal finishes 1000 ppm

(0.1%wt)

per

homogenous

material*

2002/95/EC Restriction of Hazardous


Methods on the Prevention and Control of

Pollution Caused by Electronic Information

Products (2006)

Mercury Relays, switches, contacts, guards 1000 ppm 2002/95/EC Restriction of Hazardous


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(0.1%wt)

per

homogenous

material*


Methods on the Prevention and Control of

Pollution Caused by Electronic Information

Products (2006)

Mercury "Fabricated mercury-added

product" means a product thatconsists of a combination of

individual components that

combine to make a single unit,

including, but not limited to,

mercury-added measuring devices,

lamps and switches to which

mercury or a mercury compound is

intentionally added in order to

provide a specific characteristic,

appearance, or quality, or to

perform a specific function or for

any other reason.

"Formulated mercury-added

product" means a product that

includes, but is not limited to,

laboratory chemicals, cleaning

products, cosmetics,

pharmaceuticals and coating

materials that are sold as a

consistent mixture of chemicals to

which mercury or a mercury

compound is intentionally added in

order to provide a specific

characteristic, appearance, or

quality, or to perform a specificfunction or for any other reason.

Phase out

schedule:1/1/2006

Fabricated

1,000

milligrams

Formulated

250 ppm

7/1/2007

Fabricated

100

milligrams

Formulated

50 ppm

7/1/2009

Fabricated

10

milligrams

Formulated

10 ppm

Rhode Island Chapter 268, Mercury Reductio

and Education Act (2005)

Ozone Depleting

Substances Class I


phase-out.

may not be

intentionally

added

3093/94/EEC, Implementing Montreal Protoc

Germany: FCKW Halon Verbots and

CFC/Halon P.O.



Class I Substances currently banned for impo

and manufacture. Users must comply with

labeling requirements.

Ozone Depleting

Substances Class II

Not expected, but use of HCFCs as

substitute for CFCs in cleaning

operations may be found.

may not be

intentionally

added

Clean Air Act Amendments Title VI (40 CFR

Part 82)

Class II Substances will be banned for import

and manufacture by 2015.3093/94/EEC, Implementing Montreal Protoc

Polychlorinated

Biphenyls (PCB)/

Terphenyls (PCT)

Not expected, but historically used

in transformers, capacitors

50 ppm

(total)

76/769/EEC, Marketing and Use of Dangerou

Substances, and amendments (82/828/EEC;

85/467/EEC; 89/677/EEC); United States

TSCA (1977)

Polybrominated

Biphenyls (PBB) and

their ethers/oxides

(PBDE)

Not expected. Some PBDE

compounds may be in use as flame

retardants. OBDPO may be used in

ABS and other thermoplastics.

1000 ppm

(0.1%wt)

per

homogenous

* 2002/95/EC Restriction of Hazardous

Substances (RoHS) (2003),

* China Management Methods on the

Prevention and Control of Pollution Caused b


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DBDPO may be used in HIPS and

other thermoplastics. PeBDPO is

currently used almost exclusively

to enhance the ignition resistance

of flexible polyurethane foams.

material* Electronic Information Products (2006)

* Procurement activities of some government

and large corporations also prohibit use of PB

and PBDE in electronic products.

* California - Flame Retardants Restrictions:

Cal. Health & Safety Code 108920-10982

* Maine Revised Statues Title 38, Section 16* NYS Envtl. Cons. Law 37-0111(1)(A).

Polychlorinated

Naphthalene (PCN)

Historically used as an additive to

rubber, lubricants and paints

may not be

intentionally

added

Japan Law Concerning the Examination and

Regulation of the Manufacture of Chemical

Substances (Class 1)

Radioactive

Substances

optical properties (thorium) may not be

intentionally

added

Laws for the Regulation of Nuclear Source

Material, Nuclear Fuel Material, and Reactor

1986 (Japanese law)

Short Chain

Chlorinated Paraffins

(C10-13, Cl >50%)

Historically used as flame

retardants in PWBs and plastics

may not be

intentionally

added

Oslo and Paris Conventions for the Preventio

of Marine Pollution (Decision 95/1)

Use prohibited by eco-labels (Blue Angel, etc

Tributyl tin (TBT)

and, Triphenyl tin

(TPT) compounds

Historically used in inks, paints,

preservatives and fungicides

may not be

intentionally

added

Japan Law Concerning the Examination and

Regulation of the Manufacture of Chemical

Substances (Class 1, Class 2)

* See definition 6.1 for homogenous material. Restrictions apply unless an approved, valid exemption exists.

See Appendix D for exemption examples. Please refer to the official EU Commission web site for the latest

list of exemptions.

Note 1. Lead limitation does not apply to suppliers of pure lead for use in exempt manufacturing processes

(eg. Flip Chip).

3.2.2 RESTRICTIONS IN SPECIFIC APPLICATIONS

The following materials may not be used in the SPECIFIC APPLICATION listed below.

Material Restricted Application Threshold Reason for InclusionAzo colorants Pigments in parts or products that

have direct contact with human

skin (e.g. headsets, straps, belts)

30 ppm 76/769/EEC, Marketing and Use of Dangerou

Substances and amendments: (2002/61/EC;

2003/03/EEC).

Brominated Flame

Retardants (Other

than PBB and PBDE

compounds in section

3.2.1)

Individual plastic parts > 25 g.

Examples include: bezels, ducts,

fans, and covers.

This restriction does not apply to

printed circuit boards, substrates,

epoxies, mold compounds,

underfill materials or cables.

1000 ppm,

may not be

intentionally

added

Customer requirements, eco-labeling

requirements including Germanys Blue Ang

and Swedens TCO label.

Lead and its

compounds

Paints may not be

intentionally

added

89/677/EEC, adds lead to 76/769/EEC,

Marketing and Use of Dangerous Substances

Lead and its

compounds

Cables, cords and wires 300 ppm California Proposition 65 Settlement

Mercury Relays & Switches (unless

Vermont exemption obtained).

Applies to products sold in

Vermont only.

Banned-not

present

USA Vermont, Comprehensive Mercury

Management 10 Vt. Stat. Ann. 7101-7115


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Nickel and its

compounds

Metallic nickel or nickel alloy

exempt in all

applications except external

chassis/case parts likely to

result in prolonged skin exposure.

No exemptions for

organo-nickel compounds.

1000 ppm 94/27/EEC; Joint Industry Guide (JIG) Level

substance

Poly Vinyl Chloride

Polymer (PVC)

Plastic parts except cables,

connectors, electronic components,

magnetic tape, chassis plastic parts

less than 25 grams

1000 ppm

(reporting

threshold

only)

Joint Industry Guide (JIG) Level B substance

3.3 PACKAGING REQUIREMENTS3.3.1 PACKAGING CONTENT RESTRICTIONS:

The following materials are prohibited for use in product packaging materials used for transport, etc. (e.g.

trays, reels, tubes, boxes, foam materials, etc)

Material Restricted Application Threshold Reason for Inclusion

Lead, Mercury,Cadmium, Chromium

(VI), Noxious and

other Hazardous

substances

Packaging/PackagingLabels/Packaging Inks

100 ppm(total)

94/62/EEC, Packaging and Packaging Waste

3.3.1 PACKAGING SUPPLIER DECLARATION FORM:Refer to Attachment C for Packaging specific Supplier Declaration of Conformance Form. Note that an

actual signature is required. Please send an electronic copy of the completed and signed form to the

responsible Intel Packaging Engineer.

3.4 BATTERY CONTENT RESTRICTIONS:

The following materials are prohibited for use in batteries:

Material Applicable Batteries Threshold Reason for Inclusion

Mercury All except button cell

Button cell

5 ppm

2% (by weight)

EU Battery Directive 91/157/EEC and

98/101/EEC amendments

Cadmium Alkaline-manganese and zinc-

carbon

0.001 % (by

weight) (10

ppm)



Lead This requirement does not apply to

sealed lead acid batteries such as

those used in Uninterruptible

Power Supply (UPS) systems

0.4% wt (4,000

ppm)




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3.5 FUTURE MATERIAL RESTRICTIONS:

The following materials will eventually be phased out of all raw materials, parts, components, and

subassemblies supplied to Intel.

Material Applications Threshold Reason for InclusionHalogen Flame retardants Not intentionally

added; not

present

Customer Requirements

3.6 POTENTIAL FUTURE MATERIAL RESTRICTION WATCH LISTS

Intel has also developed a Screen Tool that identifies chemicals that are considered by Intel to be High Risk of

regulatory action at some point in the future. These chemicals are not restricted for use today, but may be restricted

in the future. Intel encourages its suppliers to look for alternatives to these chemicals.

The screen tool is available for download at: http://supplier2.intel.com/ehs/environmental.htm

3.7 FUTURE MATERIAL DECLARATION REQUIREMENTS

To encourage industry alignment with the Joint Industry Guide: Material Composition Declaration for Electronic

Products (JIG-101), suppliers can be requested to disclose JIG Level B list of substances (shown below). It is

important to note that these substances are not currently banned or restricted in any application, however, disclosure

on their use will enable companies to meet future demands for product content disclosure requirements.

Material Examples of Use Reporting

Threshold

Reason for Inclusion

Antimony and its

compounds

Pigment, paint, catalyst, lead free solder,

stabilizer, n-type dopant, flame retardant

1000 ppm Joint Industry Guide (JIG) Level B

substance

Beryllium and its

compounds

Ceramics, metal alloy, copper-beryllium

alloy, catalyst, precipitation hardening

alloy, copper-beryllium alloy for spring,

solder


substance

Bismuth and its

compounds

Lead free solder, solder 1000 ppm Joint Industry Guide (JIG) Level B

substance

Phthalates Plasticizer, dye, pigment, paint, ink,

adhesive, lubricant


substance

Selenium and its

compounds

Photoreceptor, pigment, ink, catalyst,

oxidizer, semiconductor material, light

receiving element, photocell


substance

4.0ROLES & RESPONSIBILITIES

4.1 It is the role of the supplier and contract manufacturer to review this specification and sign and returnthe form in Attachment B for conformance to this specification.

4.2 It is the role of the supplier and contract manufacturer to review this specification and sign and returnthe form in Attachment D for compliance with the EU RoHS Directive for materials/parts supplied to

or on behalf of Intel.

4.3 It is the role of the commodity manager to ensure that the suppliers & contract manufacturers havebeen provided this information & responded with a signature on the appropriate form(s) in Attachment

B & D. In 2007, Intel will pilot the IPC 1752 material declaration form with selected suppliers.
http://supplier2.intel.com/ehs/environmental.htmhttp://supplier2.intel.com/ehs/environmental.htm


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4.4 It is the role of the Packaging Engineer to ensure that the Intel AML (Approved Manufacturers List)suppliers have been provided with this information & responded with a signature on the form in

Attachment C.

4.5 It is the role of the Corporate Products Regulations & Standards (CPRS) group to provide therestricted materials information to the specification owner.

5.0 REFERENCE DOCUMENTS:5.1 Chemical Restrictions Screen Tool: https://supplier2.intel.com/ehs/environmental.htm 5.2 Chemical Selection Guidelines: https://supplier2.intel.com/ehs/environmental.htm 5.3 CAS #s of specific chemicals covered: http://supplier2.intel.com/ehs/chemlistposted.xls

6.0DEFINITIONS:6.1 Homogeneous Material : Per European Union Frequently Asked Question (FAQ) Guidance

Document on RoHS and WEEE,homogenous material means a material that can not be mechanically

disjointed into different materials. The term "homogeneous" means "of uniform composition

throughout". Examples of "homogeneous materials" are individual types of: plastics, ceramics, glass,

metals, alloys, paper, board, resins, coatings. The term mechanically disjointed: means that materials

can, in principle, be separated by mechanical actions such as: unscrewing, cutting, crushing, grinding

and abrasive processes.

Further clarification from the EU guidance document includes the following examples:

A plastic cover is a "homogeneous material" if it consists of one type of plastic that is not coatedwith or has attached to it or inside it any other kinds of materials. In this case the limit values of

the directive would apply to the plastic.

An electric cable that consists of metal wires surrounded by non-metallic insulation materials is anexample of a "non homogeneous material" because the different materials could be separated by

mechanical processes. In this case the limit values of the directive would apply to each of the

separated materials individually.

A semi-conductor package contains many homogeneous materials which include; plasticmoulding material, tin-electroplating coatings on the lead frame, the lead frame alloy and gold-

bonding wires.

Appendix E contains a list of example EU RoHS exemptions that are currently approved by the EU Technical

Advisory Committee (TAC).
https://supplier2.intel.com/ehs/environmental.htmhttps://supplier2.intel.com/ehs/environmental.htmhttp://supplier2.intel.com/ehs/chemlistposted.xlshttp://supplier2.intel.com/ehs/chemlistposted.xlshttps://supplier2.intel.com/ehs/environmental.htmhttps://supplier2.intel.com/ehs/environmental.htm


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7.0REVISION HISTORY

Rev Date Description Initiator

1 7/12/03 Spec Written Joni Hansen & Todd

Brady2 8/25/04 Additional restricted materials added; general edits Todd Brady

3 10/4/04 Additional RoHS restrictions and exemptions added Bobby Britton

4 2/11/05 Added Supplier DoC and RoHS definitions Bobby Britton

5 2/13/06 Additional restricted materials added per Joint Industry Guide

(JIG); Added JIG B list of reporting substances. EU RoHS

Materials/Parts Supplier SDoC exemptions and certification

language updated; added EU Packaging Directive SdoC;

general edits

Linda Young

6 2/21/07 Added US State Mercury & US State flame retardant

restrictions to section 3.2.1, Separated Intel Environmental

Product Content Spec (EPC) affirmation statement from EU

RoHS SDoC form; updated Intel EU ROHS SDOC form to

include new exemptions and moved to Appendix D, updatedPackaging Directive SDOC form, added IPC 1752 material

data exchange form (pilot) to Appendix D; moved EU RoHS

exemption list to Appendix E.

Linda Young


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ATTACHMENT A: CHEMICAL LIST

Asbestos/Asbestos Materials CAS NumbersAsbestos and Asbestos Materials 1332-21-4

Actinolite 77536-66-4

Amosite (Grunerite) 12172-73-5

Anthophyllite 77536-67-5

Chrysotile 12001-29-5

Crocidolite 12001-28-4

Tremolite 77536-68-6

Polychlorinated Biphenyls (PCBs)

and Terphenyls (PCTs) CAS

NumberPolychlorinated Biphenyls 1336-36-3

Aroclor 12767-79-2Chlorodiphenyl (Aroclor 1260) 11096-82-5

Kanechlor 500 27323-18-8

Aroclor 1254 11097-69-1

Terphenyls 26140-60-3

Azo Colorants CAS Numbers4-Aminobiphenyl 92-67-1

Benzidine 92-87-5

4-Chloro-o-toluidine 95-69-2

2-Naphthylamine 91-59-8

o-Aminoazotoluene 97-56-3

5-Nitro-o-toluidine 99-55-8

p-Chloroaniline 106-47-8

4-Methoxy-m-phenylenediamine 615-05-4

4,4-Methylenedianiline 101-77-9

3,3-Dichlorobenzidine 91-94-13,3-Dimethoxybenzidine 119-90-4

4,4Methylenedi-o-toluidine 838-88-0

6-Methoxy-m-toluidine 120-71-8

4,4-Methylenebis(2-chloroaniline 101-14-4

4,4-Oxydianiline 101-80-4

4,4-Thiodianiline 139-65-1

o-Toluidine 95-53-4

4-Methyl-m-phenylenediamine 95-80-7

2,4,5-Trimethylaniline 137-17-7

o-anisidine 90-04-0

4-amino azobenzene 60-09-3

3,3-dimethylbenzidine 119-93-7

Pigment Red 8 6410-30-6



Polychlorinated CAS

Naphthalene (PCN) NumbersTrichloronaphthalene 1321-65-9

Tetrachloronaphthalene 1335-88-2

Pentachloronaphthalene 1321-64-8

Octachloronaphthalene 2234-13-1

Certain Glycol Ethers CAS Numbers2-Ethoxyethanol 110-80-5

2-Ethoxyethyl acetate 111-15-92-Methoxyethanol 109-86-4

2-Methoxyethyl acetate 110-49-6

Diethylene glycol dimethyl ether 111-96-6

Cadmium and CAS

its Compounds NumbersCadmium 7440-43-9

Examples of Common Cadmium Compounds

Cadmium oxide 1306-19-0

Cadmium sulfide 1306-23-6

Chromium VI CAS

and its Compounds NumbersChromium 7440-47-3

Examples of Common Chromium Compounds

Barium chromate 10294-40-3

Calcium chromate 13765-19-0

Chromic acetate 1066-30-4

Chromium trioxide 1333-82-0

Lead chromate 7758-97-6

Sodium chromate 7775-11-3

Sodium dichromate 10588-01-9

Strontium chromate 7789-06-2

Zinc chromate 13530-65-9

Tributyl tin (TBT) and

Triphenyl tin (TPT) CAS

Compounds NumberExamples of Common TBT and TPT compounds

Tributyl tin bromide 1461-23-0

Tributyl tin oxide 56-35-9

Tributyl tin acetate 56-36-0

Tributyl tin laurate 3090-36-6

Tributyl tin fluoride 1983-10-4

Triphenyl tin 668-34-8

Triphenyl tin chloride 639-58-7

Triphenyl tin hydroxide 76-87-9

Triphenyl tin acetate 900-95-8

Triphenyl tin fluoride 1983-10-4


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Lead and CAS

its Compounds NumbersLead 7439-92-1

Examples of Common Lead Compounds

Lead sulfate 7446-14-2

Lead carbonate 598-63-0

Lead hydrocarbonate 1319-46-6Lead acetate 301-04-2

Lead (II) acetate, trihydrate 6080-56-4

Lead phosphate 7446-27-7

Lead selenide 12069-00-0

Mercury CAS

and its Compounds NumbersMercury 7439-97-6

Examples of Common Mercury Compounds

Mercuric chloride 33631-63-9

Mercury bichloride 7487-94-7

Mercuric sulfate 7783-35-9Mercuric nitrate 10045-94-0

Mercuric oxide 21908-53-2

Mercuric sulfide 1344-48-5

Class I

Ozone Depleting Substances CAS

/Isomers* NumbersTrichlorofluoromethane (CFC 11) 75-69-4

Dichlorodifluoromethane (CFC12) 75-71-8

Chlorotrifluoromethane (CFC 13) 75-72-9

Pentachlorofluoroethane (CFC 111) 354-56-3

Tetrachlorodifluoroethane (CFC 112) 76-12-0Trichlorotrifluoroethane (CFC 113)

1,1,2 Trichlorotrifluoroethane

354-58-5

76-13-1

Dichlorotetrafluoroethane (CFC 114) 76-14-2

Monochloropentafluoroethane (CFC 115) 76-15-3

Heptachlorofluoropropane (CFC 211) 422-78-6

135401-87-5

Hexachlorodifluoropropane (CFC 212) 3182-26-1

Pentachlorotrifluoropropane (CFC 213) 2354-06-5

134237-31-3

Tetrachlorotetrafluoropropane (CFC 214)

1,1,1,3-Tetrachlorotetrafluoropropane

29255-31-0

2268-46-4

Trichloropentafluoropropane (CFC 215)

1,1,1-Trichloropentafluoropropane

1,2,3-Trichloropentafluoropropane

1599-41-3

4259-43-2

76-17-5

Dichlorohexafluoropropane (CFC 216) 661-97-2

Monochloroheptafluoropropane (CFC 217) 422-86-6Bromochlorodifluoromethane (Halon 1211) 353-59-3

Bromotrifluoromethane (Halon 1301) 75-63-8

Dibromotetrafluoroethane (Halon 2402) 124-73-2

Carbon Tetrachloride (Tetrachloromethane) 56-23-5

1,1,1, - Trichloroethane (methyl chloroform)

and its isomers except 1,1,2-trichloroethane

71-55-6

Bromomethane (Methyl Bromide) 74-83-9

Bromodifluoromethane and isomers (HBFCs) 1511-62-2

*Please note: These materials may contain isomers that are not

listed here. Isomers with CAS numbers have been included

when available.

Polybrominated Biphenyls (PBBs)

and their Ethers/Oxides CAS NumbersBromobiphenyl and its ethers 2052-07-5 (2-

Bromobiphenyl)

2113-57-7 (3-

Bromobiphenyl

92-66-0 (4-

Bromobiphenyl)101-55-3 (ether)

Decabromobiphenyl and its ethers 13654-09-6

1163-19-5 (ether)

Dibromobiphenyl and its ethers 92-86-4

2050-47-7 (ether)

Heptabromobiphenylether 68928-80-3

Hexabromobiphenyl and its ethers 59080-40-9

36355-01-8

(hexabromo-1,1-

biphenyl)

67774-32-7

(Firemaster FF-1)

36483-60-0 (ether)

Nonabromobiphenylether 63936-56-1

Octabromobiphenyl and its ethers 61288-13-9

32536-52-0 (ether)

Pentabromobidphenyl ether (note:

Commercially available PeBDPO is a

complex reaction mixture containing a

variety of brominated diphenyloxides.

32534-81-9 (CAS

number used for

commercial grades of

PeBDPO)

Polybrominated Biphenyls 59536-65-1

Tetrabromobiphenyl and its ethers 40088-45-7

40088-47-9 (ether)

Tribromobiphenyl ether 49690-94-0


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Class II

Hydrochlorofluorocarbons CAS

/Isomers* NumbersDichlorofluoromethane (HCFC 21) 75-43-4

Chlorodifluoromethane (HCFC 22) 75-45-6

Chlorofluoromethane (HCFC 31) 593-70-4

Tetrachlorofluoroethane (HCFC 121)1,1,1,2-tetrachloro-2-fluoroethane

(HCFC 121a)

1,1,2,2-tetracloro-1-fluoroethane

134237-32-4354-11-0

354-14-3

Trichlorodifluoroethane (HCFC 122)

1,2,2-trichloro-1,1-difluoroethane

41834-16-6

354-21-2

Dichlorotrifluoroethane(HCFC 123)

Dichloro-1,1,2-trifluoroethane

2,2-dichloro-1,1,1-trifluroethane

1,2-dichloro-1,1,2-trifluroethane (HCFC-123a)

1,1-dichloro-1,2,2-trifluroethane (HCFC-123b)

2,2-dichloro-1,1,2-trifluroethane (HCFC-123b)

34077-87-7

90454-18-5

306-83-2

354-23-4

812-04-4

812-04-4

Chlorotetrafluoroethane (HCFC 124)

2-chloro-1,1,1,2-tetrafluoroethane

1-chloro-1,1,2,2-tetrafluoroethane (HCFC 124a)

63938-10-3

2837-89-0

354-25-6

Trichlorofluoroethane (HCFC 131)

1-Fluoro-1,2,2-trichloroethane

1,1,1-trichloro-2-fluoroethane (HCFC131b)

27154-33-2

(134237-34-6)359-28-4

811-95-0

Dichlorodifluoroethane (HCFC 132)

1,2-dichloro-1,1-difluoroethane (HCFC 132b)

1,1-dichloro-1,2-difluoroethane (HFCF 132c)

1,1-dichloro-2,2-difluoroethane

1,2-dichloro-1,2-difluoroethane

25915-78-0

1649-08-7

1842-05-3

471-43-2

431-06-1

Chlorotrifluoroethane (HCFC 133)

1-chloro-1,2,2-trifluoroethane

2-chloro-1,1,1-trifluoroethane (HCFC-133a)

1330-45-6

1330-45-6

75-88-7

Dichlorofluoroethane(HCFC 141)

1,1-dichloro-1-fluoroethane (HCFC-141b)

1,2-dichloro-1-fluoroethane

1717-00-6;

(25167-88-8)

1717-00-6

430-57-9

Chlorodifluoroethane (HCFC 142)

1-chloro-1,1-difluoroethane (HCFC142b)1-chloro-1,2-difluoroethane (HCFC142a)

25497-29-4

75-68-325497-29-4

Hexachlorofluoropropane (HCFC 221) 134237-35-7

Pentachlorodifluoropropane (HCFC 222) 134237-36-8

Tetrachlorotrifluropropane (HCFC 223) 134237-37-9

Trichlorotetrafluoropropane (HCFC 224) 134237-38-0

Class II (Continuted)

Hydrochlorofluorocarbons CAS

/Isomers* NumbersDichloropentafluoropropane, (Ethyne, fluoro-)

(HCFC 225)

2,2-Dichloro-1,1,1,3,3-pentafluoropropane

(HCFC 225aa)2,3-Dichloro-1,1,1,2,3-pentafluoropropane

(HCFC 225ba)


(HCFC 225bb)


(HCFC 225ca)


(HCFC 225cb)


(HCFC 225cc)


(HCFC 225da)


(HCFC 225ea)


(HCFC 225eb)

127564-92-5;

(2713-09-9)

128903-21-9

422-48-0

422-44-6

422-56-0

507-55-1

13474-88-9

431-86-7

136013-79-1

111512-56-2

Chlorohexafluoropropane (HCFC 226) 134308-72-8

Pentachlorofluoropropane (HCFC 231) 134190-48-0

Tetrachlorodifluoropropane (HCFC 232) 134237-39-1

Trichlorotrifluoropropane (HCFC 233)

1,1,1-Trichloro-3,3,3-trifluoropropane

134237-40-4

7125-83-9

Dichlorotetrafluoropropane (HCFC 234) 127564-83-4

Chloropentafluoropropane (HCFC 235)

1-Chloro-1,1,3,3,3-pentafluoropropane

134237-41-5

460-92-4

Tetrachlorofluoropropane (HCFC 241) 134190-49-1

Trichlorodifluoropropane (HCFC 242) 134237-42-6

Dichlorotrifluoropropane (HCFC 243)

1,1-dichloro-1,2,2-trifluoropropane

2,3-dichloro-1,1,1-trifluoropropane

3,3-Dichloro-1,1,1-trifluoropropane

134237-43-7

7125-99-7

338-75-0

460-69-5

Chlorotetrafluoropropane (HCFC 244)

3-chloro-1,1,2,2-tetrafluoropropane

134190-50-4

679-85-6Trichlorofluoropropane (HCFC 251)

1,1,3-trichloro-1-fluoropropane

134190-51-5

818-99-5

Dichlorodifluoropropane (HCFC 252) 134190-52-6

Chlorotrifluoropropane (HCFC 253)

3-chloro-1,1,1-trifluoropropane (HCFC 253fb)

134237-44-8

460-35-5

Dichlorofluoropropane (HCFC 261)

1,1-dichloro-1-fluoropropane

134237-45-9

7799-56-6

Chlorodifluoropropane (HCFC 262)

2-chloro-1,3-difluoropropane

134190-53-7

102738-79-4

Chlorofluoropropane (HCFC 271)

2-chloro-2-fluoropropane

134190-54-8

420-44-0

*Please note: These materials may contain isomers that are not listed here.

Isomers with CAS numbers have been included when available


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Attachment B Intel EPC Spec Conformance Form -EXAMPLE

STATEMENT of CONFORMANCE TO

ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR INTEL

SUPPLIERS & OUTSOURCED MANUFACTURERS

An authorized signature below confirms the supplier mentioned has read, understands and is in conformance to

Intel's ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED

MANUFACTURERS, including conformance to the European Union Directive on the Restriction on the Use of

Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS), 2002/95/EC.

SUPPLIER Information

Supplier Name

Contact Name 1

Title

Contact Phone

Contact Email

1Company Representative responsible for EHS Compliance

Compliance to Environmental Product Content Specification

All raw materials, parts or products supplied to Intel meet the Intel Environmental Product Content

Specification for Suppliers and Outsourced Manufacturers.

Yes/No

If "No", list substance(s) which violate the Intel Environmental Product Content Specification below and contact

Intel Commodity Management.

Substance Location in Product Phase Out Date

The person signing below certifies that the above-named Supplier duly authorized them to sign on behalf of the

above-named Supplier.

Signature

Printed Name

Title

Date

Intel Document BS-MTN-001 Revision 2-21-07


14/17

Attachment C Packaging Environmental Regulatory Compliance Form

Manufacturing Site (if applicable)

1Company Representative responsible for EHS Compliance

Intel's Packaging Workmanship Standards, Item 3

The Packaging Essential Requirements are:

Signature:

Title:

Date:

Rev. 02_2007

Packaging must be recoverable by recycling, energy recovery or biodegradation. (Refer to EU Directive on Packaging and

Packaging Waste [94/62/EC]

Fields in GREEN are required EXAMPLE - YOUR ANSWER/INFORMATION

Compliance has been verified via internal design controls, supplier declarations, and/or analytical test data. Intel considers this

declaration a modification to any and all purchase agreement(s) and contracts between the above-named supplier and Intel.

All supplier-provided warranties and indemnities otherwise applicable to products listed in this declaration supplied under such

agreement(s) shall also apply to this declaration of conformance.

The person undersigned above certifies that: (1) they are duly-authorized to sign on behalf of the above-named supplier, (2) all

information provided in this declaration is true and correct to the best of their knowledge, and (3) they possess and will

maintain the complete technical documentation relating to this declaration of compliance and are willing and able to furnish this

documentation to Intel upon request within 14 days of Intel requesting it.

Printed Name:

If "No", list packaging part numbers which violate the Packaging Essential Requirements

Substance or Requirement Packaging Part number Phase-Out Date

Contact Email:

All packaging parts or complete packaging items supplied to

Intel meet Intel's Packaging Workmanship Standards Item 3 for

Suppliers and Outsourced Manufacturers. (Answer Yes/No)

Packaging materials (including printing inks on packaging) must not contain heavy metals (Lead, Cadmium, Mercury,

Hexavalent Chromium) where the sum of the concentration levels exceed 100 ppm (parts per million) by weight.

(Click here to view EU Directive on Packaging and Packaging Waste [94/62/EC]

The use of Noxious and other Hazardous substances must be minimized. If present in packaging, these substances must be

identified when concentration levels exceed 1000 ppm. (Methodology is explained in CEN/TR 13695-2:2004).

Title:

Contact Phone:

Supplier Name:

Contact Name :

PACKAGING ENVIRONMENTAL REGULATORY COMPLIANCE FORM FOR INTEL

SUPPLIERS & OUTSOURCED MANUFACTURERS

The purpose of this document is to assess supplier conformance to Item 3 of Intel's Packaging Workmanship Standards,

relating to the European Union Packaging and Packaging Waste (Essential Requirements) Directive (94/62/EC)

The scope of this specification includes all packaging provided to Intel or on behalf of Intel. For outsourced manufacturers, this

includes packaging around products produced by the manufacturer on behalf of Intel.

Supplier Information


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Attachment D: RoHS Supplier Declaration Form


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16/17

Attachment D-2: IPC 1752 Supplier Declaration Form(PILOT ONLY in 2007 with Selected Suppliers)


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Attachment E - EU RoHS Exemptions (Examples)

RoHS Compliance: Intel defines RoHS compliant as follows: Lead and other materials banned in RoHS Directive

are either (1) below all applicable substance thresholds as proposed by the EU or (2) an approved exemption

applies.

The following exemptions have been granted by the EU in the RoHS directive and are allowed by Intel under thisspecification;

1. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.

2. Lead as an alloying element in steel containing up to 0.35 % lead by weight.

3. Lead as an alloying element in aluminum containing up to 0.4 % lead by weight. .

4. Lead as an alloying element in copper containing up to 4 % lead by weight.

5. Lead in high melting temperature type solders (i.e. lead based alloys containing 85 % by weight or more lead).

6. Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching,

signaling, transmission as well as network management for telecommunications.

7. Lead in electronic ceramic parts (e.g. piezoelectronic devices).

8. Lead used in compliant pin connector systems.

9. Lead as a coating material for the thermal conduction module c-ring.

10. Lead in optical and filter glass.

11. Lead in solders consisting of more than two parts for the connection between the pins and the package ofmicroprocessors with a lead content of more than 80% and less than 85% by weight.

12. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within

integrated circuit Flip Chip packages.

13. Cadmium in optical and filter glass.

14. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under

Directive 91/338/EEC (*) amending Directive 76/769/EEC (**) relating to restrictions on the marketing and use

of certain dangerous substances and preparations.

15. Lead in bronze bearing shells and bushes.

16. Lead and cadmium in printing inks for application of enamels on borosilicate glass

17. Lead in Finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead

frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with

copper lead frames

18. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic capacitors19. Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in

structural elements: notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the

address electrode, the barrier ribs, the seal frit, and frit ring as well as in print pastes.

END OF DOCUMENT

Documents

Environmental Product Content Specification Rev 2007