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NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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Engineering Simulation:
The Road(s) Ahead
Dr. Dennis A. Nagy
Principal
BeyondCAE
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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Engineering Simulation:
The Road(s) Ahead
• There are multiple major themes being pursued in CAE
in the foreseeable future — I will highlight just a few
• I may be a “CAE expert” but “predictions are hard,
especially about the future”
• Everyone at this NWC 2015, from the biggest gurus to
the most recent neophytes, can play a role in
determining the actual roads taken
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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MCAE Encompasses Many Themes
• The very large list of sub-topics under
(M)CAE (and the massive number of
presentation topics here at the NWC)
needs some structure
• My three ways of classifying the many
themes/subjects of MCAE are
– Along the MCAE Food Chain
– Around the MCAE Total Solution Pinwheel
– In the 4-D “Multi” space
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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*i.e., realistically, how long does it take a development to
move from initial research idea through to end-user use and
significant perceived/measured business benefit?
BENEFICIAL
INNOVATION
How fast do key
developments
flow along this
food chain?*
NWC 2015 Presentations and Exhibitors: Where Do They Fit Along the MCAE Food Chain?
X
60
= ~Number of
NWC 2015
Presentations
91
23
82
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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NWC 2015 Presentations: Where Do They Fit
Around the MCAE Total solutions “Pinwheel”?
Four main components and four connectors
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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NWC 2015 Presentations: Where Do They
Fit in the MCAE 4-D “Multi-” Space?
Co-simulation
MBSE (Model-Based
System Engineering)
Software tools and
product development data
available on global clouds
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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Multi-Geographical: Globally-Distributed
Design Teams and Suppliers
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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(My) Leading* Themes on the Roads Ahead (numbers are for reference, not priority!)
1. User Environments
2. Dramatic Expansion of Useful CAE
3. The “Appification” of CAE
4. Computing: HPC, Cloud and New Hardware
Architectures/Devices and Programming
Paradigms
5. New Materials: Simulation Design
6. Synergy of Topology Optimization and 3D
Printing (Additive Manufacturing)
7. Traditional CAE Meets System Engineering
(MBSE) *There are many more—I’ve chosen just a few
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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1. CAE User Environments:
A Fork in the Road?
Broad General-purpose
CAE environments, e.g.,
Ansys AIM, MSC Apex,
Abaqus CAE, Siemens
PLM NX CAE,…
Domain/problem-specific
“vertical” applications,
templates, and application-
builder tools (“SimApps”) e.g.,
Ansys ACT, COMSOL
Application Builder, Comet,
EASA,… Enhancing ease-of-use and
productivity for
continuously-growing
community of CAE
specialists and CAE-
knowledgeable product
development engineers
Opening the “CAE
Door” to engineers,
designers, and even
non-engineers to
leverage useful CAE
(sometimes “under the
covers”)
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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2. Dramatic Expansion of Useful CAE
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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3. The “Appification” of CAE:
Key Enabler in Dramatic Expansion
• Gap will not be proactively
closed anywhere near fast
enough by only continuing
to train engineers on today’s
general-purpose CAE
tools/systems
• Vertical Apps/Templates,
capturing/embodying
domain/problem-specific
expertise, and hiding the
details of general-purpose
CAE “under the covers,” will
be essential to accelerate
effective use of CAE
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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3. The “Appification” of CAE:
Key Enabler in Dramatic Expansion
• Desktop Engineering relevant articles:– Managing Simulation Democratization, Jamie Gooch, April 1,
2015
– The “Appification” of Simulation, Kenneth Wong, April 1, 2015
• Dedicated Session (within SPDM Conference) – 7K - “Democratizing CAE with SPDM” (362)
– G. Valine (GKN Driveline), M. Panthaki (Comet Solutions), M. Tiller (Xogeny)
• Front End Analytics (FEA), NWC Sponsor
– J. F. Betts presentation (411) (1K, Monday,13:30)
– Front End Analytics session (5K, Tuesday, 16:20)
• Other presentations: 78, 188
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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4. Computing: Hardware,
Programming, and Accessibility• Major trends affecting CAE’s future:
• Massively-parallel architectures
– Non-Von Neuman
– New programming languages leveraging massively parallel
• Rapid penetration of practical HPC-based Cloud Computing
• Immersive visualization
• Cognitive computing, quantum computing,…
– Open issue: If/when current-generation CAE software will
need to be re-written?
• See in particular:– Prof. Ahmed Noor’s Keynote (Tuesday 8:55)
– Louis Komzsik’s invited presentation (Wednesday 9:45)
– Exhibitors:
• Penguin Computing, Eon Reality, Frauenhofer, NAG, zSpace
– Other presentations: 35, 123, 308, 339, 341, 422, 427, 362
– My chaired session: 6C HPC4 – Cloud, Tuesday, 17:40
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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5. New Materials: Simulation Design
• The move to composites replacing metals was the first
step
• More realistic simulation of composites and other more
complex materials has led to “virtual testing” (simulation)
to compute material properties and use them as additional
design parameters, which can then also be optimized
• Major CAE vendors have acquired corresponding
expertise: – MSC: eXstream
– Siemens PLM:
– DS/Simulia:
• Talk to them in Exhibit area, as well as Granta, HBM
nCode,
• Presentations: 15, 29, 45, 54, 73, 90, 108, 127, 137, 173,
187,197, 218, 232, 286, 353, 375, 377, 401, 413
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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6. Synergy of Topology Optimization and
3D Printing (Additive Manufacturing)• Topology optimization started as a small niche tool because the
resulting weight-optimized free-form (almost organic) shapes were
usually not cost-practical to manufacture
• 3-D printing (additive manufacturing) of production
parts/components using variety of structurally suitable materials has
now emerged as practical for “exotic” organic shapes
• WatchDE/Microsoft Webinar:
Optimization and 3D Printing Revolutionize Design
Thursday, June 25, 2015 | 2:00 p.m. ET
• Presentations: 101, 133, 154, 238
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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7. Traditional CAE Meets System
Engineering (MBSE)
• NAFEMS-INCOSE partnership just a first step, just
starting to produce results
• Key role in cascading requirements, systemsub-
systemcomponent multi-fidelity simulation
• Leading 3-D CAE vendors now have MBSE tools:
– Ansys:
– Siemens PLM: Imagine
– DS: Dymola
• Talk to Ansys, Siemens, Simulia, INCOSE in the
Exhibition area
• Presentations: 63, 196, 300, 336, 368
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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Sessions Relevant to My Leading Themes1. User Environments
– 7E, 8F, 8J
2. Dramatic Expansion of Useful CAE
– 3G, 4G, 6J
3. The “Appification” of CAE
– 5K, 7K
4. Computing: HPC, Cloud and New Hardware Architectures/Devices
and Programming Paradigms
– 3F, 4F, 5G, 6C
5. New Materials: Simulation Design
– 1C, 1D, 2C, 3C, 4C, 5C
6. Synergy of Topology Optimization and 3D Printing (Additive
Manufacturing)
– 1D, 1J, 3J, 4J, 5E, 5J, 8C
7. Traditional CAE Meets System Engineering (MBSE)
– 1F, 2F, 5B, 6F, 7J
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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The Exhibiting Vendors are Very Active:
Go Out and Talk to ThemExhibitors (see Exhibition Plan) Specializations Themes
Altair CAE envoronment (Hyperworks), cluster mgmt. 1,3,4,6
Ansys MCAE, ECAE, EDA, CAE environment 1,2,3
Autodesk PLM, MCAD, MCAE 1,4
Beta CAE Systems MCAE pre/post 1
CD-adapco broad CFD offering 1,2,3
ChiasTek system integration, co-simulation 7
Convergent Science CFD for IC engines 1,3
Dassault Systemes Simulia FEA, pre/post, PIDO, composites, optimization 1,2,5,7
Dynardo Robust design optimization 6
Electro Magnetic Works electromagnetic simulation 1
Engys open-source CFD, optimization 1,6
Eon Reality virtual and augmented reality 4
ESI MCAE, manufacturing, crash/impact 1
Esteco optimization, MCAE environment 1
e-Technostar pre/post, MCAE for automotive 1
Fraunhofer SCAI algorithms, methods in Computational Science 4
Front End Analytics (FEA) vertical MCAE apps, process automation 3
Granta Design materials database 5
HBM-nCode fatigue and durability software 5
INCOSE system modeling 7
Intes FEA, pre/post 1
ITI TranscenData CAD, CAM, CAE, PLM data exchange interfaces 2
Mentor Graphics EDA, CFD, electronic cooling 1
MSC Software FEA, pre/post, MBD, materials, composites 1
NAFEMS everything! 1-7
Numerical Algorithms Group (NAG) math subroutines, HPC 4
Penguin Computing cloud services 4
Phoenix Integration optimization, PIDO 6
Plan International promote and protect children's rights
Rand 3D PLM services, re-seller 2
Sharc meshing for CFD (Harpoon) 1
Siemens PLM Software PLM, MCAE, FEA, pre-post, mech. testing, MBSE 1,2,5
System@tic open-source cloud 4
Transvalor Americas materials-forming software 5
Weidlinger Associates Inc. engineering consulting 2
zSpace 3D virtual reality glasses 4
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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The Heart of NAFEMS
As an international, non-profit association,
NAFEMS wants to look further than our own
membership, and actively contribute to
society at large. Starting at the NAFEMS
World Congress 2015 in San Diego this
year, NAFEMS will be raising funds for Plan
International, a charitable organization
which aims to help deprived children
throughout the world.
Please make sure to visit their stand
#24 in the NWC 2015 Exhibition area
NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA
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