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AN12792End of life TDA80xx migration path to active portfolioRev. 1.0 — 18 March 2020 Application note
Document informationInformation Content
Keywords TDA, TDA8007, TDA8020, TDA8023, TDA8026, TDA8029, TDA8034,TDA8035, TDA8037, PN7412
Abstract This document describes the path to migrate from an end of life TDA80xx to aTDA80xx or PN7412 from the active portfolio.
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Application note Rev. 1.0 — 18 March 20202 / 42
Revision HistoryRevision historyRev Date Description
1.0 20200318 Initial version
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Application note Rev. 1.0 — 18 March 20203 / 42
1 Introduction
The 2nd generations of TDAs are end-of-life by April 2021 (last time supply). This document helps to migrate to a new, active, TDA product by listing possibleconfigurations to replace a 2nd generation device.
Not all TDAs can be replaced with a drop-in replacement and might need software and/or hardware changes. The most crucial differences and advice aredescribed within this document.
1.1 LinecardFollowing table is a list of all TDA products with some of their key functionalities. For their full functionality have a look on the datasheets available at NXP.com.
Table 1. TDA linecard and short overviewProduct Features TDA8020 TDA8023 TDA8024 TDA8026 TDA8034 TDA8035 TDA8037 TDA8007 TDA8029 PN7412
End Of Life EOL EOL EOL Active Active Active Active EOL EOL Active
Analog interfaces 2 1 1 5 1 1 1 2 1 1
ISO 7816 UART - - - - - - - yes yes yes
µC-core - - - - - - - - 80C51RB+ Cortex-M0
ROM(byte) /RAM(byte)
- - - - - - - - 16k / 768 160k / 12k
EMVCo compliance yes yes - yes yes yes yes yes yes yes
NDS compliance - - yes - yes yes - - yes -
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Application note Rev. 1.0 — 18 March 20204 / 42
2 Replacements
Following table lists various NXP proposed replacement configurations. Other configurations are possible but are not handled within this document.
If no drop-in replacement is available the software and hardware effort to switch can vary depending on the chosen products. Following chapters describe thenecessary software and hardware changes.
Table 2. Replacement overviewPN7412 TDA8034 TDA8035 TDA8037 TDA8026 PN7412 & TDA8034 2xTDA8035 parallel
TDA8007 • Software andhardware adaptationnecessary
See Section 7.3
• Software and hardwareadaptation necessary
See Section 5.5
TDA8020 • Softwarecompatible
• Hardwareadaptationnecessary
See Section 3
• Software and hardwareadaptation necessary
See Section 5.5
TDA8023 • Software andhardware adaptationnecessary
See Section 4
• Software andhardwareadaptationnecessary
See Section 5
• Softwarecompatible
• Hardwareadaptationnecessary
See Section 3
TDA8024 • Software compatible• Hardware adaptation
necessarySee Section 4
• Softwarecompatible
• Hardwareadaptationnecessary
See Section 5
• Softwarecompatible
• Hardwareadaptationnecessary
See Section 6
TDA8029 • Software examplefor ALPARprotocol available
• Hardwareadaptationnecessary
See Section 7
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Application note Rev. 1.0 — 18 March 20205 / 42
3 TDA8026
The TDA8026 is a cost-effective, analog interface for addressing multiple smartcard slots in a Point of Sales (POS) terminal. It can address up to two main cards(synchronous or asynchronous smart cards supported) and up to four Security AccessModules (SAMs). The electrical characteristics of the TDA8026 are in accordance withEMV 4.3 requirements and also comply with ISO7816-3 for class A, B, and C cards.
Its packaging supports the latest payment terminal security requirements.
See product data sheet for more information: [DS-TDA8026]
001aal083
STAP5
D1
H7INHIB
A3TESTMODE
H1SPRES
B3CLKIN2
C3CLKIN1
C5I/OUC2
C4I/OUC1
D2INTAUXN
E1A0
E2IRQN
C2SDA
B2SCL
B8DCDC_OFF
A5
A4
A4
SDWNN
A8PORADJ
VDD(INTF)
VDD(INTF)
STAP4
C1
STAP3
B1
TST2
A1
I/O(5)
C7
CLK(5)
B7
RST(5)
B6
VCC(5)
B5
I/O(4)
D7
VCC(2)
GNDC(2)
PRES(2)
I/O(2)
CLK(2)
RST(2)
CLK(4)
C6
RST(4)
D6
VCC(4)
D8
B4 A7 A6
VDD(INTREGD)VDD
I/O(3)
E7
CLK(3)
E6
RST(3)
F6
VCC(3)
E8
G8
GNDSC8
F8
GNDC(1)
PRES(1)H3
H2
F7
G7
G6
G5
VCC(1)
I/O(1)
CLK(1)
RST(1)
E3
F2
G2
G3
C4(1)G1
C8(1)F1
TST1
A2
INTERFACEAND
CONTROLUNIT
SEQUENCER
PRESDETECTION
VCCGENERATOR
RST BUFFER
CLK BUFFER
I/O BUFFER
I/O BUFFER
I/O BUFFER
POWERMANAGEMENT
UNIT STEP UPCONVERTER
SEQUENCER
PRESDETECTION
VCCGENERATOR
RST BUFFER
CLK BUFFER
I/O BUFFER
SEQUENCER
VCCGENERATOR
RST BUFFER
CLK BUFFER
I/O BUFFER
SEQUENCER
VCCGENERATOR
RST BUFFER
CLK BUFFER
I/O BUFFER
SEQUENCER
VCCGENERATOR
RST BUFFER
CLK BUFFER
I/O BUFFER
G4 D3 to D5,E4,E5,F3 to F5, H8
H4 H5
GND2 to GND10GNDPLX VUP
TDA8026
Figure 1. TDA8026 Block diagram
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Application note Rev. 1.0 — 18 March 20206 / 42
3.1 Feature Comparison
Table 3. Product feature comparison TDA8026, TDA8020, TDA8023, TDA8024Product Features TDA8026 TDA8020 TDA8023
Analog interfaces 5 2 1
ISO 7816 UART - - -
ISO 7816 dedicated timers - - -
µC-core - - -
ROM[kbyte] / RAM[byte] - - -
Host interface I2C I2C I2C
ESD protection on ISO pads [kV] 7 6 6
Auxiliary protected lines for C4 and C8 2 0 2
VCC card power supply [V] 1.8 & 3 & 5 3 & 5 1.8 & 3 & 5
Card supply current @ 5 V VCC [mA] 55 60 55
Card supply current @ 3 V VCC [mA] 55 55 55
Card supply current @ 1.8 V VCC [mA] 35 - 35
Card supply current @ 1.2 V VCC [mA] - - -
Card clock frequency max. [MHz] 20 10 10
Card activation time max. [µs] 135 135 135
Card deactivation time max. [µs] 100 110 100
Protocol Support
Synchronous card management yes - yes
Asynchronous protocl T=0 and T=1 yes yes yes
Security Features
Voltage supervisor and over currentdetection
yes yes yes
Additional product information
Power supply interface VDDI [V] - 1.5 - VDD 1.5 - 6.5
Power supply [V] 2.7 - 5.5 2.5 - 6.5 2.7 - 6.5
Power down current max [µA] 40 150 200
Temperature range [°C] -25 / 85 -25 / 85 -25 / 85
Package TFBGA64 LQFP32 TSSOP28
EVMCo compliance yes yes yes
NDS compliance - - -
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Application note Rev. 1.0 — 18 March 20207 / 42
3.2 Differences TDA8020 - TDA8026
3.2.1 Summary
Table 4. TDA8020 - TDA8026 differences summaryItem TDA8020 TDA8026 Comments
Package LQFP32 TFBGA64 -
Low-power modes power downinactive mode
shutdown modestandby modeclock-stop mode
TDA8026 has an exclusivepin to enter shut-down mode(SDWNN).
DC-to-DC converter Switched-capacitor Inductor-based switching -
Card class support Classes A and B (5 V and 3V)
Classes A, B, and C (5 V, 3V, and 1.8 V)
-
Supply voltage range 2.7 V to 6.5 V 2.7 V to 5.5 V -
Card clock generation 10 MHz 20 MHz -
Card clock divider 1, 2, 4 and 8 1, 2, 4 and 5 -
I2C Address selection pins 2 1 The TDA8020 has to I2CAddress pins which enablesto address 4 differentTDA8020. Such is not offeredfor the TDA8026.
Presence pin active High active High or active Low Configurable via pin SPRES.
Synchronous cardmanagement
No Yes -
3.2.2 Low-power modes
The TDA8020 only offers one power-down mode, which is similar to the Clock-stop modeof the TDA8026. The TDA8026 in addition as two more low-power modes to increasepower saving.
3.2.2.1 Standby
The TDA8020 does not offer such an option. At the TDA8026 supply voltages are appliedand the DC-to-DC converter is not running and card slots are not activated.
3.2.2.2 Clock-stop
This mode of the TDA8026 is similar to the 'Power down mode' of the TDA8020 whenCLK = STOP LOW or CLK = STOP HIGH. This mode is triggered when a card isactivated without any communication.
3.2.2.3 Shutdown
The shutdown mode is exclusive for the TDA8026 and is the very low powerconsumption mode, typically 25 µA. The TDA8026 enters this mode when the SDWNNpin (exclusive for the TDA8026) is driven LOW.
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Application note Rev. 1.0 — 18 March 20208 / 42
Only presence monitoring on card slot 1 remains enabled.
3.2.3 DC-to-DC converter
The DC-DC converter is changed from switched-capacitor DC-to-DC on the TDA8020 toinductor-based switching DC-to-DC on the TDA8026. Due to that change, a dedicatedinductance of 10 µH must be placed between VDD and LX. The capacitor between SAMand SAP as well as the pins are removed due to the changed DC-to-DC concept.
See [AN10724 3.2 Using the DC-DC converter] for detailed information.
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Application note Rev. 1.0 — 18 March 20209 / 42
3.3 Differences TDA8023 - TDA8026
3.3.1 Summary
Table 5. TDA8023 - TDA8026 differences summaryItem TDA8023 TDA8026 Comments
Package TSSOP28 TFBGA64 -
DC-to-DC converter Capacitive or inductive inductive
Card Slots 1 5 (2 independent) -
Card clock up to 10 MHz 20 MHz Both dividable by 1, 2, 4 or 5with synchronous frequencychanges
Low-power modes Shutdown modeInactive modePower-down mode
Shutdown modeStandby modeClock-stop mode
-
3.3.2 Low-power modes
3.3.2.1 Shutdown Mode
The shutdown modes of both devices, the TDA8023 and TDA8026, are comparable thesame. The TDA8026 has a slightly higher power consumption while being in shutdownmode.
Table 6. Max current on IDD in shutdown modeItem TDA8023 TDA8026
IDD 10 µA 40 µA
3.3.2.2 Inactive Mode
The inactive mode of the TDA8023 is comparable to the standby mode of the TDA8026.The power consumption of the TDA8026 is slightly higher.
Table 7. Maximum current on IDD in inactive mode.Item TDA8023 TDA8026
Power consumption max. 200 µA 450 µA
3.3.2.3 Power-down mode
At both devices in power-down, or clock-stop, mode clocks on card slots are stopped. Atthe TDA8026, supporting several card slots, at maximum two slots can be active at thesame time, the rest is in clock-stop mode.
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Application note Rev. 1.0 — 18 March 202010 / 42
3.3.3 DC-to-DC converter
The TDA8023 supporting inductive and capacitive DC-to-DC converter while theTDA8026 only supports an inductive DC-to-DC converter.
Coming from an inductive DC-to-DC converter setup the inductor has to be changedfrom 6.8 µH to 10 µH.
Table 8. Inductive TDA8026 DC-to-DC compared to inductive TDA8026 DC-to-DC
Figure 2. TDA8023 inductive DC-to-DC converter Figure 3. TDA8026 inductive DC-to-DC converter
Coming from a capacitive DC-to-DC converter setup a 10 µH inductor has to be placedbetween pin VDD and pin LX. The capacitors on SBP to SBM and SAM to SAP areremoved as well as the pins.
Table 9. Capacitive TDA8023 DC-to-DC compared to inductive TDA8026 DC-to-DC
Figure 4. TDA8023 capacitive DC-to-DC converter Figure 5. TDA8026 inductive DC-to-DC converter
See [AN10724 3.2 Using the DC-DC converter] for detailed information.
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Application note Rev. 1.0 — 18 March 202011 / 42
3.4 Application Information
PORADJA8B4 A7 H5H4G4A6
B8
A5
A4
B2
C2
E2
E1
D2
C4
C5
C3
B3
H1
D3 to D5, E4, E5,F3 to F5, H8A3
H7
A2
A1C1D7
C6
D6D8
B1
E7
E6F6
E8
F8
G8
F7
G7
G6G5
H2
G2
E3
F1
G1F2
H3G3
C8 D1 B5B6B7C7
GN
D1
L1C1
C3
VDD
VDD(INTF)
C2
10 µF10 µH
10 µF1 µF
100 nF
100 nF
100 nF
100 nF
100 nF
100 nF
100 nF
100 nF
100 nF
100 nF
100 nF
100 nF
C4
D1
V DD
V DD
(INTR
EGD
)
GN
DP
LX V UP
GNDC(1)
DCDC_OFFVCC(1)
VDD(INTF)
SDWNNRST(1)
C5C1
CARDCONNECTOR
2
C6C2C7
C6(2)
C8(2)
C5(1)
C7(1)
C9(1)
C13(1)
R5
R2
C3C8C4
VDD(INTF)
C11
R1 100 kΩ
Rpu 3.3 kΩ
Rpu 3.3 kΩ
0 Ω
0 Ω
0 Ω
0 Ω
0 Ω
100 kΩ
100 kΩ
CLK(1)
SCLMICROCONTROLLER
TDA8026
C4(1)
SDA
C8(1)
IRQN
I/O(1)
A0
PRES(1)
INTAUX
GNDC(2)
I/OUC1
VCC(2)
I/OUC2
RST(2)
CLKIN1
CLK(2)
CLKIN2
I/O(2)
SPRES
PRES(2)
RST(3)
CLK(3)
I/O(3)
STAP3
RST(4)
VCC(4)
CLK(4)
I/O(4)
STAP4
GND2 to GND10
VCC(3)
TESTMODE
INHIB
TST1
TST2
GN
DS
STAP
5I/O
(5)
CLK
(5)
RST
(5)
V CC
(5)
R3
R4
C5C6C7
C1
SAM 2C2C3
VDD(INTF)
C10(2)
C5C6C7
C1
SAM 3C2C3
VDD(INTF)
C11(1)
R6
C12(2)
R7
100 kΩ
C5C6C7
C1
SAM 4C2C3
VDD(INTF)
VDD(INTF)
R8
R9
C14(2)
C5
C6
C7
C1
SAM
5C
2C
3
001aal093
Figure 6. TDA8026 Application diagram
3.5 Product Support PackageWebsite: https://www.nxp.com/products/security-and-authentication/contact-readers/multiple-smart-card-slot-interface:TDA8026ET
Product data sheet: [PS_TDA8026]
User Manual: [UM10319]
• This user manual describes how to use the Cake8026_02_D, a demo board used toevaluate the TDA8026 device, a 5 slots smart cardreader.
User Manual: [UM10349]
• This document describes the way to use the Cake80xx_MBA motherboard: powersupply, protocols, plug of the daughter boards, firmware.
Application Note: [AN10724]
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Application note Rev. 1.0 — 18 March 202012 / 42
• This application note describes the smart card interface integrated circuit TDA8026ET.This document helps to design the TDA8026 in an application. The generalcharacteristics are presented and different application examples are described.
Application Note: [AN11079]
• This product gives a summary of all available product support packages for the contactreader ICs, the TDA family.
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Application note Rev. 1.0 — 18 March 202013 / 42
4 TDA8034
The TDA8034HN is a cost-effective analog interface for asynchronous and synchronoussmart cards operating at 5 V, 3 V, and 1.8 V. Using few external components, theTDA8034HN provides all supply, protection, and control functions between a smart cardand the microcontroller.
See product data sheet for more information: [DS-TDA8034]
001aal136
100 nF100 nF
100 nF
470 nF 220 nF
10 µF
INTERNALOSCILLATOR
THERMALPROTECTION
CRYSTALOSCILLATOR
RESETGENERATOR
VCCLDO
CLOCKGENERATOR
I/OTRANSCEIVER
I/OTRANSCEIVER
I/OTRANSCEIVER
CLOCKCIRCUITLEVEL
SHIFTER
C5
CARDCONNECTOR
C1
C6 C2
C7 C3
C8 C4
SEQUENCER
SUPPLY
INTERNALREFERENCE
VOLTAGESENSE
12GND
EN1ALARMN
PRESN 8
PORADJ 18
RSTIN3
CMDVCCN5
OFFN19
CLKDIV1 6
CLKDIV2 7
VCC_SEL2 2
VCC_SEL14
I/OUC20
21
22
CLKUP
EN4
1 2423
XTAL2
AUX2UC
AUX1UC
XTAL1
VDD(INTF)
EN3
EN2CLK
PVCC
I/O9
CLK13
RST14
VCC15
AUX110
AUX211
17VDD
16VDDP
R2
R1
VDD(INTF)
(1)
TDA8034HN
Figure 7. TDA8034 Block diagram
4.1 Feature Comparison
Table 10. Product feature comparison TDA8034, TDA8023, TDA8024Product Features TDA8034 TDA8023 TDA8024
Analog interfaces 1 1 1
ISO 7816 UART - - -
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Application note Rev. 1.0 — 18 March 202014 / 42
Product Features TDA8034 TDA8023 TDA8024
ISO 7816 dedicated timers - - -
µC-core - - -
ROM[kbyte] / RAM[byte] - - -
Host interface I/O lines I2C I/O lines
ESD protection on ISO pads[kV]
8 6 6
Auxiliary protected lines forC4 and C8
2 2 2
VCC card power supply [V] 1.8 & 3 & 5 1.8 & 3 & 5 3 & 5
Card supply current @ 5 VVCC [mA]
65 55 80
Card supply current @ 3 VVCC [mA]
65 55 65
Card supply current @ 1.8 VVCC [mA]
65 35 -
Card clock frequency max.[MHz]
20 10 26
Card activation time max.[µs]
4160 135 220
Card deactivation time max.[µs]
250 100 100
Protocol Support
Synchronous cardmanagement
yes yes -
Asynchronous protocl T=0and T=1
yes yes yes
Security Features
Voltage supervisor and overcurrent detection
yes yes yes
Current protection on VCC, I/O, RST, CLK
yes yes yes
Additional product information
Power supply interface VDDI[V]
1.6 - 3.6 1.5 - 6.5 -
Power supply [V] 3 - 5.5 2.7 - 6.5 2.7 - 6.5
Power down current max [µA] 12 2 -
Temperature range [°C] -25 / 85 -25 / 85 -25 / 85
Package HVQFN24 & SO16 &TSSOP16
TSSOP28 SO28 & TSSOP28
EVMCo compliance yes yes -
NDS compliance yes - yes
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Application note Rev. 1.0 — 18 March 202015 / 42
4.2 Differences TDA8023 - TDA8034
4.2.1 Summary
Table 11. TDA8023 - TDA8034 differences summaryItem TDA8023 TDA8034 Comments
Package TSSOP28 HVQFN32 -
Supply voltage min. 2.7 V 3 V For class A cards (5 V),the supply voltage at theTDA8034 must be at least4.85 V.
DC-to-DC converter Capacitive or inductivefollower, doubler, tripler
Low Drop-Off voltageregulator
-
Clock input max. 20 MHz 26 MHz -
ESD protection 6 kV 8 kV -
Card clock generation up to 10 MHzDivider: 1, 2, 4 or 5
up to 20 MHzDivider: 1, 2, 4 or 8
-
I2C configuration interface Yes No The TDA8034 is notconfigurable by any interface.
Low-power modes Shutdown modeInactive modePower-down mode
Shutdown modeDeep shutdown mode
4.2.2 Low-power modes
The shutdown mode of the TDA8023 is comparable the same as the shutdown modeof the TDA8034. Also the inactive mode of the TDA8023, with a slightly higher powerconsumption, is comparable to the deep shutdown mode of the TDA8034.
4.2.3 PRES
The presence pin connection of TDA8034 designs must be switched. Depending on thesmart card connector type: normally open or normally closed. The difference coming froma TDA8023 and going to a TDA8034 is displayed below.
Table 12. Presence pin change - Card connector normally open
Card connector
Presence switch(normally open)
TDA8023
PRES
VDD
Figure 8. TDA8023 PRES normally open
Card connector
Presence switch(normally open)
TDA8034
PRESN
Figure 9. TDA8034 PRESN normally open
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Application note Rev. 1.0 — 18 March 202016 / 42
Table 13. Presence pin change - Card connector normally closed
Card connector
Presence switch(normally closed)
TDA8023
PRES
10k
VDD
Figure 10. TDA8023 PRES normally closed
Card connector
Presence switch(normally close)
TDA8034
PRESN
VDD(INTF)
R
Figure 11. TDA8034 PRESN normally closed
4.2.4 DC-to-DC to LDO
The TDA8023 card power supply is either a capacitive or inductive DC-to-DC converter.The TDA8034 has an LDO for the card supply. Two capacitors, 10 µF and 100 nF, mustbe placed close to the LDO of the TDA8034. All other components for the supply of VDDPhave to be removed.
Table 14. TDA8023 DC-to-DC to TDA8034 LDO
Figure 12. TDA8023 capacitive DC-to-DC Figure 13. TDA8034 LDO
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Application note Rev. 1.0 — 18 March 202017 / 42
4.3 Application Information
001aal142
100 nF
C1
VDD(INTF)
VDD(INTF) MICROCONTROLLER
PORADJ
XTAL
2
181VDD
XTAL
1AU
X2U
C
172VDDP
VDD(INTF)
163VCC
VCC_SEL2
1514
13
4RST
RSTIN
5CLK
VCC_SEL1
67
GND
8 9 10 11 12
24 23 22 21 20 19
TDA8034HN100 nF
C2
C3100 nF
C410 µF
R40 Ω
R1
R2
VDD
VDD
C5470 nF
C6220 nF
VDDPCMDVCCN
CLKDIV1
AUX1
UC
I/OU
CO
FFN
CLK
DIV
2
PRES
N I/O
AUX1
AUX2
GN
D
C5
CARDCONNECTOR
C1
C6 C2
C7 C3
C8 C4
Figure 14. TDA8034 Application diagram
4.4 Product Support PackageWebsite: https://www.nxp.com/products/security-and-authentication/contact-readers/low-power-smart-card-interface:TDA8034
Product Data Sheet: [TDA8034HN]
Application Note: [AN10792]
• This application note describes the smart card interface integrated circuit TDA8034HN.This document helps to design the TDA8034HN in an application. The generalcharacteristics are presented and different application examples are described.
Application Note: [AN11079]
• This product gives a summary of all available product support packages for the contactreader ICs, the TDA family.
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
AN12792 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Application note Rev. 1.0 — 18 March 202018 / 42
Application Note: [AN10807]
• This application note describes the smart card interface integrated circuit TDA8034T/AT/BT. This document helps to design the TDA8034T, TDA8034AT, or TDA8034BTin an application. The general characteristics are presented and different applicationexamples are described.
Application Note: [AN10794]
• The application note describes the Cake8034_01_D Cake8034_02_D demo boards forTDA8034: schematics, layout, and use of this board.
User Manual: [UM10349]
• This document describes the way to use the Cake80xx_MBA mother board: powersupply, protocols, plug of the daughter boards, firmware.
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
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Application note Rev. 1.0 — 18 March 202019 / 42
5 TDA8035
The TDA8035 is the cost efficient successor of the established integrated contact smartcard reader IC TDA8024. It offers a high level of security for the card by performingcurrent limitation, short-circuit detection, ESD protection as well as supply supervision.
The current consumption during the standby mode of the contact reader is very low as itoperates in the 3 V supply domain. The TDA8035 is therefore the ideal component for apower efficient contact reader.
See product data sheet for more information: [DS-TDA8035]
001aan745
10 F
1 F
2 ×220 nF
100 nF
100 nF
100 nF330 nF
CMDVCCN
EN_5V/3VNEN_1.8VN
RSTINCLKDIV1CLKDIV2
I/OUCAUX1UCAUX2UC
OFFN
INTERNALREGULATOR
SUPERVISORINPUT SENSE
DEEP SHUTDOWN
deepshutdown DEEP
SHUTDOWN
BANDGAP
HOSTINTERFACE
LATCH
CS
configurationsbus for smartcardreader interface
interuption
reset andsupalarm
HZ
HZ
VDD(INTF)
INTERNALOSCILLATOR
THERMALPROTECTION
DIGITALSEQUENCER
TDA8035
DCDCCONVERTER
GNDPGND VDDPVREGPORADJVDD(INTF)
VDD(INTF) VDDP
SAM
VCC
GNDC
RSTCLKAUX1AUX2
XTAL1
XTAL2
PRESN
I/O
SAP
330 nF
SBM
VUP
C1
SBP
ISO7816READER
INTERFACE
CRYSTALOSCILLATOR
UCC5
C2C6
C3C7
C4C8
Figure 15. TDA8035 Block diagram
5.1 Feature Comparison
Table 15. Product feature comparison TDA8035, TDA8023, TDA8024Product Features TDA8035 TDA8023 TDA8024
Analog interfaces 1 1 1
ISO 7816 UART - - -
ISO 7816 dedicated timers - - -
µC-core - - -
ROM[kbyte] / RAM[byte] - - -
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Product Features TDA8035 TDA8023 TDA8024
Host interface I/O lines I2C I/O lines
ESD protection on ISO pads[kV]
8 6 6
Auxiliary protected lines forC4 and C8
2 2 2
VCC card power supply [V] 1.8 & 3 & 5 1.8 & 3 & 5 3 & 5
Card supply current @ 5 VVCC [mA]
65 55 80
Card supply current @ 3 VVCC [mA]
65 55 65
Card supply current @ 1.8 VVCC [mA]
35 35 -
Card supply current @ 1.2 VVCC [mA]
- - -
Card clock frequency max.[MHz]
20 10 26
Card activation time max.[µs]
3400 135 220
Card deactivation time max.[µs]
250 110 100
Protocol Support
Synchronous cardmanagement
yes yes -
Asynchronous protocl T=0and T=1
yes yes yes
Security Features
Voltage supervisor and overcurrent detection
yes yes yes
Current protection on VCC, I/O, RST, CLK
yes yes yes
Additional product information
Power supply interface VDDI[V]
1.6 - 3.6 1.5 - 6.5 -
Power supply [V] 2.7 - 5.5 2.7 - 6.5 2.7 - 6.5
Power down current max [µA] 3 2 -
Temperature range [°C] -25 / 85 -25 / 85 -25 / 85
Package HVQFN32 TSSOP28 SO28 & TSSOP28
EVMCo compliance yes yes -
NDS compliance yes - yes
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5.2 Differences TDA8023 - TDA8035
5.2.1 Summary
Table 16. TDA8023 - TDA8035 difference summaryItem TDA8023 TDA8035 Comment
Package TSSOP28 HVQFN24 -
DC-to-DC Converter capacitive doubler,tripler, follower, orinductive
capacitive doubler,tripler, or follower
-
I²C-bus controlled ICcard interface
Yes No The TDA8035 does notoffer any configurationinterface.
Low-power modes Shutdown modeInactive modePower-down mode
Deep shutdown modeShutdown mode
-
5.2.2 Low-power modes
5.2.2.1 Deep Shutdown Mode
The TDA8035 deep shutdown mode can be compared to the shutdown mode of theTDA8023. The smart card reader is inactive and the supervisors are turned off, but thepresence detection is still available: The OFFN pin follows the status of presence.
To enter, or leave, the deep shutdown mode the host microcontroller has to change thestate of the control pins.
Table 17. Deep shutdown mode current consumption comparisonItem TDA8023 TDA8035
Power supply current 10 µA 3 µA
5.2.2.2 Shutdown mode
The TDA8035 shutdown mode can be compared to the inactive mode of the TDA8023.This mode is the default mode when no card is active. Supervisors are active, cardpresence detection is available.
Table 18. Shutdown mode current consumption comparisonItem TDA8023 TDA8035
Power supply current 200 µA 500 µA
5.2.3 PRES
The PRESN pin on the TDA8035 is active low and the circuitry around it must bechanged coming from TDA8023.
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Table 19. Presence pin change - Card connector normally open
Card connector
Presence switch(normally open)
TDA8023
PRES
VDD
Figure 16. TDA8023 PRES normally open
Card connector
Presence switch(normally open)
TDA8035
PRESN
R
VDD(INTF)
Figure 17. TDA8035 PRESN normally open
Table 20. Presence pin change - Card connector normally closed
Card connector
Presence switch(normally closed)
TDA8023
PRES
10k
VDD
Figure 18. TDA8023 PRES normally closed
Card connector
Presence switch(normally closed)
TDA8035
PRESN
VDD(INTF)
Figure 19. TDA8035 PRESN normally closed
5.2.4 DC-to-DC converter
While the TDA8023 offices the choice between a capacitive or inductive driven DC-to-DC converter the TDA8035 only can be driven capacitive. Coming from the TDA8023with a capacitive DC-to-DC converter only the capacitor values have to be changed.Changing from an inductive DC-to-DC converter to a capacitive DC-to-DC converterinvolves slightly more effort in redesign.
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Table 21.
Figure 20. TDA8023 capacitive DC-to-DC Figure 21. TDA8035 capacitive DC-to-DC
5.3 Differences TDA8024 - TDA8035For this transition, consult following Application Note [AN11058 - Design migration fromTDA8024 to TDA8035].
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5.4 Application Information
001aan759
0
C2100 nF(1)
C9(4)220 nFC8
220 nF(3)
R2(5)
R1(5)
C10
56 pF
C1
100 nF(1)
C4
330 nF
C5
R
1 F(2)
C3
330 nF
C6(2)100 nF
C7(2)10 F
I/OUC1 24
CLK
PORADJ2 23
RST
CMDVCCN3 22
VCC
VDD(INTF)
VDD(INTF)
VDD(INTF)
4 21VUP
C5 C1
CARDCONNECTOR
C6 C2
C7 C3
C8 C4
CLKDIV15 20
SAP
CLKDIV26 19
SBP
EN_5V/3VN7 18
VDDPVDD
EN_1.8VN8 17
SBM
RS
TIN
MIC
RO
CO
NTR
OLL
ER
932
AUX2
UC
OFF
N10
31AU
X1U
C
GN
D11
30PR
ESN
XTAL
112
29C
S
XTAL
213
28I/O
V REG
1427
AUX2
SAM
1526
AUX1
GN
DP
1625
GN
DC
TDA8035
VDD(INTF)
VDD(INTF)
VDD(INTF)
Figure 22. TDA8035 Application diagram
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5.5 Two TDA8035 parallelIt is possible to cascade several devices using the same connection pins by driving itschip select (CS) pin. For further information check following application note [AN10997]chapter [4. Chip select].
Following schematic is an example on how to connect 2 TDA8035 to a single host.
019aac072
I/OUC
AUX2
UC
AUX1
UC
PRES
N
CS
I/O AUX2
AUX1
GN
DC
PORADJ
TDA8035
CMDVCCN
VDD(INTF)
CLKDIV1CLKDIV2
EN5V_3VN
EN_1.8V
I/OUC
CMDVCCN
CLKDIV1CLKDIV2
EN5V_3VN
EN_1.8V
132 31 30 29 28 27 26 25
9 10 11 12 13 14 15 16
2
3
45
6
78
2423
22
2120
19
1817
CLK
RSTVCC
VUP
SAPSBP
VDDP
SBM
RST
IN
OFF
N
RSTIN
OFFN
AUX1UC
AUX2UC
GN
D
XTAL
1
XTAL
2VR
EG
SAM
GN
DP
I/OUC
AUX2
UC
AUX1
UC
PRES
N
CS
I/O AUX2
AUX1
GN
DC
PORADJ
TDA8035
CMDVCCN
VDD(INTF)
CLKDIV1CLKDIV2
EN5V_3VN
EN_1.8V
I/OUC
CMDVCCN
CLKDIV1CLKDIV2
EN5V_3VN
EN_1.8V
132 31 30 29 28 27 26 25
9 10 11 12 13 14 15 16
2
3
45
6
78
2423
22
2120
19
1817
CLK
RSTVCC
VUP
SAPSBP
VDDP
SBM
RST
IN
OFF
N
RSTIN
OFFN
AUX1UCIOUC
MICROCONTROLLER
AUX1UC
CS1
CS2
AUX2UC
CMDVCCNCLKDIV1
CLKDIV2
EN5V/3VNEN1V8N
RSTIN
OFFN
AUX2UC
GN
D
XTAL
1
XTAL
2VR
EG
SAM
GN
DP
Figure 23. Two cascaded TDA8035 devices
5.6 Product Support PackageWebsite: https://www.nxp.com/products/security-and-authentication/contact-readers/high-integrated-and-low-power-smart-card-interface:TDA8035HN
Product data sheet: [TDA8035]
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Application Note: [AN10997]
• This application note describes the smart card interface integrated circuit TDA8035HN.This document helps to design the TDA8035HN in an application. The generalcharacteristics are presented and different application examples are described.
Application Note: [AN11079]
• This product gives a summary of all available product support packages for the contactreader ICs, the TDA family.
Application Note: [AN10999]
• The application note describes the Cake8035 demo board for TDA8035: schematics,layout, and use of this board.
Application Note: [AN11058]
• This application note describes how to migrate a design from TDA8024 toTDA8035: SW updates, HW differences, and an example based on a double layoutimplementation.
User Manual: [UM10349]
• This document describes the way to use the Cake80xx_MBA mother board: powersupply, protocols, plug of the daughter boards, firmware.
NXP Semiconductors AN12792End of life TDA80xx migration path to active portfolio
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Application note Rev. 1.0 — 18 March 202027 / 42
6 TDA8037
The TDA8037 is the cost efficient successor of the established integrated contact smartcard reader IC TDA8035. Operating only in the 3 V supply domain and supporting onlyClass B cards it reduces complexity and costs. If the target system operates only withClass B cards. Due to the very low power consumption in shutdown mode, it is the idealcomponent for a power efficient contact reader.
aaa-011372
UC HZ
CMDVCCN
CLKDIV
RSTIN
LATCH
INTERNALREGULATOR
ISO7816READER
INTERFACE
CARDCONNECTOR
SUPERVISOR
BANDGAP
inputsense
reset andsupalarm
HOSTINTERFACE
CS
VDD
VDDhost
GNDPORADJ
TDA8037
VDD
VDD
10 µF 100 nF
TEST
HZ
I/OUC
AUX1UC
AUX2UC
OFFN
CLKIN
I/O
AUX2
AUX1
CLK
RST
2 x220 nF
VCC
VDD
PRESN
INTERNAL OSCILLATOR
THERMAL PROTECTION
DIGITALSEQUENCER
configurationsbus for smartcardreader interface
interruption
CLOCK CIRCUITRY
c5 c1
c6 c2
c7 c3
c8 c4
Figure 24. Block diagram
6.1 Feature Comparison
Table 22. Product feature comparison TDA8035, TDA8023, TDA8024Product Features TDA8023 TDA8024 TDA8035 TDA8037
Analog interfaces 1 1 1 1
ISO 7816 UART - - - -
ISO 7816 dedicatedtimers
- - - -
µC-core - - - -
ROM[kbyte] /RAM[byte]
- - - -
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Product Features TDA8023 TDA8024 TDA8035 TDA8037
Host interface I2C I/O lines I/O lines I/O Lines
ESD protection on ISOpads [kV]
6 6 10 8
Auxiliary protectedlines for C4 and C8
2 2 2 3 (C8)
VCC card powersupply [V]
1.8 & 3 & 5 3 & 5 1.8 & 3 & 5 3
Card supply current @5 V VCC [mA]
55 80 65 -
Card supply current @3 V VCC [mA]
55 65 65 65
Card supply current @1.8 V VCC [mA]
35 - 35 -
Card supply current @1.2 V VCC [mA]
- - - -
Card clock frequencymax. [MHz]
10 26 20 10
Card activation timemax. [µs]
135 220 3400 554
Card deactivation timemax. [µs]
100 100 250 250
Protocol Support
Synchronous cardmanagement
yes - yes yes
Asynchronous protoclT=0 and T=1
yes yes yes yes
Security Features
Voltage supervisor andover current detection
yes yes yes yes
Current protection onVCC, I/O, RST, CLK
yes yes yes yes
Additional product information
Power supply interfaceVDDI [V]
1.5 - 6.5 - 1.6 - 3.6 -
Power supply [V] 2.7 - 6.5 2.7 - 6.5 2.7 - 5.5 3 - 3.6
Power down currentmax [µA]
2 - 1 400
Temperature range[°C]
-25 / 85 -25 / 85 -25 / 85 -25 / 85
Package TSSOP28 SO28 & TSSOP28 HVQFN32 SO28 & TSSOP16
EVMCo compliance yes - yes yes
NDS compliance - yes yes -
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6.2 Differences TDA8024 - TDA8037For the transition from TDA8024 to TDA8037, consult following application noteAN11460.
6.3 Product Support Package
Website: https://www.nxp.com/products/security-and-authentication/contact-readers/low-power-3v-smart-card-interface:TDA8037
Product data sheet: [TDA8037]
Application Note: [AN11458] Design guideline for TDA8037
• This document helps to design the TDA8037 in an application. The generalcharacteristics are presented and different application examples are described.
Application Note: [AN11460] Design migration from TDA8024 to TDA8037T
• This application note describes how to migrate a design from TDA8024 toTDA8037: SW updates, HW differences, and an example based on a double layoutimplementation.
Application Note: [AN11459] Application with TDA8037 - Demonstration boarddescription
• The application note describes the Cake8037 demo boards for TDA8037T andTDA8037TT: schematics, layout, and use of this board.
User Manual: [UM10349]
• This document describes the way to use the Cake80xx_MBA mother board: powersupply, protocols, plug of the daughter boards, firmware.
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7 PN7412
The PN7412 is part of the PN7462 family having a 32-bit Cortex-M0-basedmicrocontroller, offering high performance, and low power consumption. The contactinterfaces offer a high level of security for the card by performing current limiting, short-circuit detection, ESD protection as well as supply supervision. An additional UARToutput is also implemented to address applications where more than one contact cardslot is needed. It enables an easy connection to multiple smart card slot interfaces likeTDA8026, TDA8034, and others.
It provides thermal and short-circuit protection on all card contacts. It also providesautomatic activation and deactivation sequences initiated by software or hardware.
See product data sheet for more information: [DS-PN7412]
aaa-030118
ARM-CORTEX M0
systembus
slave slave
slavemastermaster
slave
SRAM12 kB
EEPROM4 kB
AHB LITE
FLASH160 kB
ROM40 kB
CODE PATCH
AHB
TOAP
B
HOST INTERFACES
USB
HSU
SPI
I2C
SPI MASTER
I2C MASTER
RNG
POWER, CLOCKAND RESET GPIO
XTAL
TIMERSTIME 0, 1, 2, 3WATCHDOG
PMU
CRCI/O AUX
CTIF ISO7816 UART
MAIN LDO PVDD LDO
TX LDO VCC LDO
SC LDO
TEMPERATURE SENSOR
CLOCK GENERATORS
HFO LFO
USB PLL
DC-DC
AHB
LITE
BUFF
ERM
ANAG
EMEN
T
SWD
Figure 25. PN7412 Block diagram
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7.1 Feature Comparison
Table 23. Product feature comparison PN7412, TDA8007, TDA8020, TDA8029Product Features PN7412 TDA8029
Analog interfaces 1 1
ISO 7816 UART yes yes
ISO 7816 dedicated timers yes yes
µC-core Cortex-M0 80C51RB+
ROM[kbyte] / RAM[byte] 160 / 12000 16 / 768
Host interface SPI, UART, I2C, USB serial or I2C
ESD protection on ISO pads [kV] 8 6
Auxiliary protected lines for C4 and C8 2 0
VCC card power supply [V] 1.8 & 3 & 5 1.8 & 3 & 5
Card supply current @ 5 V VCC [mA] 60 65
Card supply current @ 3 V VCC [mA] 55 50
Card supply current @ 1.8 V VCC [mA] 35 30
Card supply current @ 1.2 V VCC [mA] - -
Card clock frequency max. [MHz] 13.56 20
Card activation time max. [µs] 2200 225
Card deactivation time max. [µs] 250 100
Synchronous card management yes yes
Asynchronous protocl T=0 and T=1 yes yes
Voltage supervisor and over currentdetection
yes yes
Current protection on VCC, I/O, RST,CLK
yes yes
Power supply [V] 2.3 - 5.5 2.7 - 6.0
Power down current max [µA] 20
Temperature range [°C] -40 / +85 -25 / +85
Package HVQFN64 LQFP32
EVMCo compliance yes yes
NDS compliance - yes
7.2 Differences TDA8029 - PN7412
7.2.1 Summary
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Table 24. TDA8029 - PN7412 differences summaryItem TDA8029 PN7412 Comments
Package LQFP32 HVQFN64 -
DC-to-DC converter doubler, tripler, or follower doubler or follower -
Inactive Modes 4 modes available:Stop clock, Shut-down,Power-down, and Sleepmode
2 modes available:Standby and Hard PowerDown
-
ALPAR Protocol Fully implemented Demo example -
Activation time 130 µs up to 22 ms -
Maximum card clock 20 MHz 13.56 MHz -
WakeUpSlave INT1_N Configurable The PN7412 wake-up sourcecan be configured to nearlyevery pin.
SlaveI2CMute P27 Configurable Any GPIO of the PN7412 canbe utilized for this matter.
Power-On Reset delay CDEL pin configurable percapacitor value.
Not offered -
7.2.2 Low-power modes
7.2.2.1 Hard Power Down
This hard power-down mode is the deepest power-down mode and consumes the leastamount possible. The PN7412 hard power-down mode is similar to the Shut-down modeof the TDA8029. The card is deactivated, all clocks are stopped, all LDOs are turned off,except the MLDO which is set to low-power mode.
The behavior of RST_N and SDW_N in this case is the same. If the supply voltage issufficient and RST_N gets high the PN7412 exits the Hard Power-down mode.
7.2.2.2 Standby
The PN7412 deactivates a contact card before entering standby. This mode is in contrastof the TDA8029 sleep mode which holds the card active via clock-stop. While being instandby, several wake-up sources can be set. Such as the insertion of a contacted cardor activity on the host interface.
7.2.3 ALPAR protocol
As host communication protocol the TDA8029 implements 'ALPAR'. For the PN7412, asoftware example with a few mandatory commands implemented is available on request.The PN7412 with Cortex-M0 and 160 kByte flash opens up the possibility to implementadditional commands and logic.
The ALPAR protocol is explained in AN [AN10207].
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Table 25. PN7412 implemented commandsCommand Code Expected command [hex]
power_up_5V 6Eh 60 00 01 6E 01 0E
power_off 4Dh 60 00 00 4D 2D
check_pres_card 09h 60 00 00 09 69
card_command (APDU) 00h 60 xx xx 00 xx xx .
Table 26. PN7412 implemented error codesStatus code Meaning Complete Frame [hex]
55h Unknown command E0 00 00 55 B5
80h Card mutes E0 00 01 6E 80 0F
00h Activation failed E0 00 01 6E 00 8F
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7.3 PN7412 and TDA80XXThe PN7412 family can handle more than one smart card by controlling an extra contactinterface front-end (TDA). Consolidate User Manual [UM10858] chapter [13.5 Connect anexternal TDA] for further information.
For one additional slot, the TDA8034 or TDA8035 can be used.
ISO7816T = 0, T = 1 protocols
Cortex-M0 CPU
PN7412
ISO7816DigitalUART
ISO7816Electricalinterface
TDA80xxISO7816 AUX line
ISO7816 pins
GPIO or I2C
ISO7816Electricalinterface
Smart Card 1
Smart Card 2
Smart Card 3
Figure 26. PN7412 with TDA80xx
Are several interfaces required the TDA8026 would be the correct choice.
ISO7816T = 0, T = 1 protocols
Cortex-M0 CPU
PN7412
ISO7816DigitalUART
TDA8026
IO_AUX
I2CM_SDA SDA
Smart Card 2
Smart Card 3
PVDD_IN
PVDD
IOUC1
IOUC2
I2CM_SCL SCL
INT_AUX IRQN
GPIOx SDWNN
VDDI
PVDD
GND
GND
GND
GND
CLK_AUX CLKIN1
CLKIN2
Figure 27. PN7412 with TDA8026
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7.4 Application Information
aaa-021148
PN7412
PRES
AUX1
CLK
RST
GNDC
C1 C2 C3 C4
C5 C6 C7 C8
VPVDD_IN
PRES
C = 470 nF(2)
R = 0 Ω
C = 100 nF(1)
VCC
IO
AUX2
Figure 28. PN7412 Application diagram
7.5 Product Support PackageWebsite: https://www.nxp.com/products/rfid-nfc/nfc-hf/nfc-readers/nfc-cortex-m0-all-in-one-microcontroller-with-optional-contact-interface-for-access-control:PN7462
Product data sheet: [PN7412]
Application Note: [AN11738]
• How to use contact smart card interface on PN7462AU.
Application Note: [AN11784]
• The following document describes steps required for integration of RTOS withPN7462AU Firmware.
User Manual: [UM10883]
• This document describes PN7462 Controller Development Kits. It also describesPN7462 software stack, gives directions to run example application using theMCUXpresso IDE. Document provides PN7462 customer board configurationinstructions, board hardware overview, and provides basic steps how to use NFCCockpit application.
User Manual: [UM10915]
• This document briefs the setup environment required for PC CCID Reader use casedemo on PN7462 Board.
User Manual: [UM10858]
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• This document describes how to use the PN7462 family.
User Manual: [UM10948]
• This document describes how to manage EEPROM of PN7462 family.
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8 References
[1] Product data sheet - TDA8026 - Multiple smart card slot interface IChttp://www.nxp.com
[2] Product data sheet - TDA8034HN - Low-power smart card interfacehttps://www.nxp.com/docs/en/data-sheet/TDA8034HN.pdf
[3] Product data sheet - TDA8035 - High integrated and low-power smart card interfacehttps://www.nxp.com/docs/en/data-sheet/TDA8035.pdf
[4] Product data sheet - PN7462 family - NFC Cortex-M0 microcontrollerhttp://www.nxp.com
[5] AN10724 - TDA8026ET - 5 slots smart card interfacehttps://www.nxp.com/docs/en/application-note/AN10724.pdf
[6] AN11079 - Contact reader ICs - TDA product support packageshttps://www.nxp.com/docs/en/application-note/AN11079.pdf
[7] UM10319 - Cake8026_02_Dhttps://www.nxp.com/docs/en/user-guide/UM10319.pdf
[8] UM10349 - Contact smart card reader chips evaluation with CAKE80xx_MBAhttps://www.nxp.com/docs/en/user-guide/UM10349.pdf
[9] AN10792 - TDA8034HN - Smart Card reader interfacehttps://www.nxp.com/docs/en/application-note/AN10792.pdf
[10] AN10807 - TDA8034T/AT/BT - Smart Card reader interfacehttps://www.nxp.com/docs/en/application-note/AN10807.pdf
[11] AN10794 - Application with TDA8034 - Demonstration boards descriptionhttps://www.nxp.com/docs/en/application-note/AN10794.pdf
[12] AN10997 - TDA8035 Smart Card Readerhttps://www.nxp.com/docs/en/application-note/AN10997.pdf
[13] AN10999 - Application with TDA8035 - Demonstration board descriptionhttps://www.nxp.com/docs/en/application-note/AN10999.pdf
[14] AN11058 - Design migration from TDA8024 to TDA8035https://www.nxp.com/docs/en/application-note/AN11058.pdf
[15] AN11738 - PN7462AU - Contact Smart Card applicationhttps://www.nxp.com/docs/en/application-note/AN11738.pdf
[16] AN11784 - PN7462AU How to integrate RTOShttps://www.nxp.com/docs/en/application-note/AN11784.pdf
[17] UM10883 - PN7462 family Quick Start Guide - Development Kithttps://www.nxp.com/docs/en/user-guide/UM10883.pdf
[18] UM10915 - PN7462AU PC CCID Reader User Manualhttps://www.nxp.com/docs/en/user-guide/UM10915.pdf
[19] UM10858 - PN7462 family HW user manualhttps://www.nxp.com/docs/en/user-guide/UM10858.pdf
[20] UM10948 - EEPROM Management of PN746X and PN736Xhttps://www.nxp.com/docs/en/user-guide/UM10948.pdf
[21] AN10207 - Smart Card reader application with TDA8029 Mask 06 and Mask 07https://www.nxp.com/docs/en/application-note/AN10207.pdf
[22] AN11460 - Design migration from TDA8024 to TDA8037Thttps://www.nxp.com/docs/en/application-note/AN11460.pdf
[23] Product data sheet - TDA8037 - Low-power 3 V smart card interfacehttps://www.nxp.com/docs/en/data-sheet/TDA8037.pdf
[24] AN11458 - Design guideline for TDA8037
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Application note Rev. 1.0 — 18 March 202038 / 42
https://www.nxp.com/docs/en/application-note/AN11458.pdf[25] AN11459 - Application with TDA8037 - Demonstration board description
https://www.nxp.com/docs/en/application-note/AN11459.pdf
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9 Legal information
9.1 DefinitionsDraft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodifications or additions. NXP Semiconductors does not give anyrepresentations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequencesof use of such information.
9.2 DisclaimersLimited warranty and liability — Information in this document is believedto be accurate and reliable. However, NXP Semiconductors does notgive any representations or warranties, expressed or implied, as to theaccuracy or completeness of such information and shall have no liabilityfor the consequences of use of such information. NXP Semiconductorstakes no responsibility for the content in this document if provided by aninformation source outside of NXP Semiconductors. In no event shall NXPSemiconductors be liable for any indirect, incidental, punitive, special orconsequential damages (including - without limitation - lost profits, lostsavings, business interruption, costs related to the removal or replacementof any products or rework charges) whether or not such damages are basedon tort (including negligence), warranty, breach of contract or any otherlegal theory. Notwithstanding any damages that customer might incur forany reason whatsoever, NXP Semiconductors’ aggregate and cumulativeliability towards customer for the products described herein shall be limitedin accordance with the Terms and conditions of commercial sale of NXPSemiconductors.
Right to make changes — NXP Semiconductors reserves the right tomake changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and withoutnotice. This document supersedes and replaces all information supplied priorto the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,authorized or warranted to be suitable for use in life support, life-critical orsafety-critical systems or equipment, nor in applications where failure ormalfunction of an NXP Semiconductors product can reasonably be expectedto result in personal injury, death or severe property or environmentaldamage. NXP Semiconductors and its suppliers accept no liability forinclusion and/or use of NXP Semiconductors products in such equipment orapplications and therefore such inclusion and/or use is at the customer’s ownrisk.
Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. NXP Semiconductors makesno representation or warranty that such applications will be suitablefor the specified use without further testing or modification. Customersare responsible for the design and operation of their applications andproducts using NXP Semiconductors products, and NXP Semiconductorsaccepts no liability for any assistance with applications or customer productdesign. It is customer’s sole responsibility to determine whether the NXPSemiconductors product is suitable and fit for the customer’s applicationsand products planned, as well as for the planned application and use ofcustomer’s third party customer(s). Customers should provide appropriatedesign and operating safeguards to minimize the risks associated withtheir applications and products. NXP Semiconductors does not accept anyliability related to any default, damage, costs or problem which is basedon any weakness or default in the customer’s applications or products, orthe application or use by customer’s third party customer(s). Customer isresponsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid adefault of the applications and the products or of the application or use bycustomer’s third party customer(s). NXP does not accept any liability in thisrespect.
Export control — This document as well as the item(s) described hereinmay be subject to export control regulations. Export might require a priorauthorization from competent authorities.
Evaluation products — This product is provided on an “as is” and “with allfaults” basis for evaluation purposes only. NXP Semiconductors, its affiliatesand their suppliers expressly disclaim all warranties, whether express,implied or statutory, including but not limited to the implied warranties ofnon-infringement, merchantability and fitness for a particular purpose. Theentire risk as to the quality, or arising out of the use or performance, of thisproduct remains with customer. In no event shall NXP Semiconductors, itsaffiliates or their suppliers be liable to customer for any special, indirect,consequential, punitive or incidental damages (including without limitationdamages for loss of business, business interruption, loss of use, loss ofdata or information, and the like) arising out the use of or inability to usethe product, whether or not based on tort (including negligence), strictliability, breach of contract, breach of warranty or any other theory, even ifadvised of the possibility of such damages. Notwithstanding any damagesthat customer might incur for any reason whatsoever (including withoutlimitation, all damages referenced above and all direct or general damages),the entire liability of NXP Semiconductors, its affiliates and their suppliersand customer’s exclusive remedy for all of the foregoing shall be limited toactual damages incurred by customer based on reasonable reliance up tothe greater of the amount actually paid by customer for the product or fivedollars (US$5.00). The foregoing limitations, exclusions and disclaimersshall apply to the maximum extent permitted by applicable law, even if anyremedy fails of its essential purpose.
Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancybetween the translated and English versions.
Security — While NXP Semiconductors has implemented advancedsecurity features, all products may be subject to unidentified vulnerabilities.Customers are responsible for the design and operation of their applicationsand products to reduce the effect of these vulnerabilities on customer’sapplications and products, and NXP Semiconductors accepts no liability forany vulnerability that is discovered. Customers should implement appropriatedesign and operating safeguards to minimize the risks associated with theirapplications and products.
9.3 Licenses
Purchase of NXP ICs with NFC technology
Purchase of an NXP Semiconductors IC that complies with one of theNear Field Communication (NFC) standards ISO/IEC 18092 and ISO/IEC 21481 does not convey an implied license under any patent rightinfringed by implementation of any of those standards. Purchase of NXPSemiconductors IC does not include a license to any NXP patent (or otherIP right) covering combinations of those products with other products,whether hardware or software.
9.4 TrademarksNotice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.
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TablesTab. 1. TDA linecard and short overview ...................... 3Tab. 2. Replacement overview ...................................... 4Tab. 3. Product feature comparison TDA8026,
TDA8020, TDA8023, TDA8024 .........................6Tab. 4. TDA8020 - TDA8026 differences summary .......7Tab. 5. TDA8023 - TDA8026 differences summary .......9Tab. 6. Max current on IDD in shutdown mode ............. 9Tab. 7. Maximum current on IDD in inactive mode. .......9Tab. 8. Inductive TDA8026 DC-to-DC compared to
inductive TDA8026 DC-to-DC ......................... 10Tab. 9. Capacitive TDA8023 DC-to-DC compared to
inductive TDA8026 DC-to-DC ......................... 10Tab. 10. Product feature comparison TDA8034,
TDA8023, TDA8024 ........................................13Tab. 11. TDA8023 - TDA8034 differences summary .....15Tab. 12. Presence pin change - Card connector
normally open ..................................................15Tab. 13. Presence pin change - Card connector
normally closed ............................................... 16Tab. 14. TDA8023 DC-to-DC to TDA8034 LDO ............16
Tab. 15. Product feature comparison TDA8035,TDA8023, TDA8024 ........................................19
Tab. 16. TDA8023 - TDA8035 difference summary .......21Tab. 17. Deep shutdown mode current consumption
comparison ......................................................21Tab. 18. Shutdown mode current consumption
comparison ......................................................21Tab. 19. Presence pin change - Card connector
normally open ..................................................22Tab. 20. Presence pin change - Card connector
normally closed ............................................... 22Tab. 21. .......................................................................... 23Tab. 22. Product feature comparison TDA8035,
TDA8023, TDA8024 ........................................27Tab. 23. Product feature comparison PN7412,
TDA8007, TDA8020, TDA8029 .......................31Tab. 24. TDA8029 - PN7412 differences summary .......32Tab. 25. PN7412 implemented commands ................... 33Tab. 26. PN7412 implemented error codes ...................33
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FiguresFig. 1. TDA8026 Block diagram ................................... 5Fig. 2. TDA8023 inductive DC-to-DC converter ......... 10Fig. 3. TDA8026 inductive DC-to-DC converter ......... 10Fig. 4. TDA8023 capacitive DC-to-DC converter ........10Fig. 5. TDA8026 inductive DC-to-DC converter ......... 10Fig. 6. TDA8026 Application diagram .........................11Fig. 7. TDA8034 Block diagram ................................. 13Fig. 8. TDA8023 PRES normally open .......................15Fig. 9. TDA8034 PRESN normally open .................... 15Fig. 10. TDA8023 PRES normally closed .................... 16Fig. 11. TDA8034 PRESN normally closed ..................16Fig. 12. TDA8023 capacitive DC-to-DC ....................... 16Fig. 13. TDA8034 LDO .................................................16Fig. 14. TDA8034 Application diagram .........................17
Fig. 15. TDA8035 Block diagram ................................. 19Fig. 16. TDA8023 PRES normally open .......................22Fig. 17. TDA8035 PRESN normally open .................... 22Fig. 18. TDA8023 PRES normally closed .................... 22Fig. 19. TDA8035 PRESN normally closed ..................22Fig. 20. TDA8023 capacitive DC-to-DC ....................... 23Fig. 21. TDA8035 capacitive DC-to-DC ....................... 23Fig. 22. TDA8035 Application diagram .........................24Fig. 23. Two cascaded TDA8035 devices ....................25Fig. 24. Block diagram ................................................. 27Fig. 25. PN7412 Block diagram ................................... 30Fig. 26. PN7412 with TDA80xx .................................... 34Fig. 27. PN7412 with TDA8026 ....................................34Fig. 28. PN7412 Application diagram ...........................35
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Please be aware that important notices concerning this document and the product(s)described herein, have been included in section 'Legal information'.
© NXP B.V. 2020. All rights reserved.For more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: [email protected]
Date of release: 18 March 2020Document identifier: AN12792
Contents1 Introduction ......................................................... 31.1 Linecard ............................................................. 32 Replacements ...................................................... 43 TDA8026 ...............................................................53.1 Feature Comparison ..........................................63.2 Differences TDA8020 - TDA8026 ......................73.2.1 Summary ............................................................73.2.2 Low-power modes ............................................. 73.2.2.1 Standby ..............................................................73.2.2.2 Clock-stop ..........................................................73.2.2.3 Shutdown ...........................................................73.2.3 DC-to-DC converter ...........................................83.3 Differences TDA8023 - TDA8026 ......................93.3.1 Summary ............................................................93.3.2 Low-power modes ............................................. 93.3.2.1 Shutdown Mode .................................................93.3.2.2 Inactive Mode .................................................... 93.3.2.3 Power-down mode .............................................93.3.3 DC-to-DC converter ......................................... 103.4 Application Information .................................... 113.5 Product Support Package ................................114 TDA8034 .............................................................134.1 Feature Comparison ........................................ 134.2 Differences TDA8023 - TDA8034 .................... 154.2.1 Summary ..........................................................154.2.2 Low-power modes ........................................... 154.2.3 PRES ............................................................... 154.2.4 DC-to-DC to LDO ............................................ 164.3 Application Information .................................... 174.4 Product Support Package ................................175 TDA8035 .............................................................195.1 Feature Comparison ........................................ 195.2 Differences TDA8023 - TDA8035 .................... 215.2.1 Summary ..........................................................215.2.2 Low-power modes ........................................... 215.2.2.1 Deep Shutdown Mode .....................................215.2.2.2 Shutdown mode ...............................................215.2.3 PRES ............................................................... 215.2.4 DC-to-DC converter ......................................... 225.3 Differences TDA8024 - TDA8035 .................... 235.4 Application Information .................................... 245.5 Two TDA8035 parallel ..................................... 255.6 Product Support Package ................................256 TDA8037 .............................................................276.1 Feature Comparison ........................................ 276.2 Differences TDA8024 - TDA8037 .................... 296.3 Product Support Package ................................297 PN7412 ............................................................... 307.1 Feature Comparison ........................................ 317.2 Differences TDA8029 - PN7412 ...................... 317.2.1 Summary ..........................................................317.2.2 Low-power modes ........................................... 327.2.2.1 Hard Power Down ........................................... 32
7.2.2.2 Standby ............................................................327.2.3 ALPAR protocol ............................................... 327.3 PN7412 and TDA80XX ....................................347.4 Application Information .................................... 357.5 Product Support Package ................................358 References ......................................................... 379 Legal information ..............................................39