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Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse13 | A-8700 Leoben
Tel +43 (0) 3842 200-0 | E-mail [email protected] www.ats.net
SEMI Networking Day
Packaging – Key for System Integration
Nanium, Porto
June 27, 2013
Embedded Component
The European Acceleration Factor
AT&S – A Global Electronics Company
Leoben-Hinterberg
HDI PCB and ECP®
~750 people
Fehring
Flex and PTH
~380 people
Klagenfurt
Single-sided PWB
~100 people
Shanghai, China
High End HDI
~4.400 people
Ansan, S.Korea
Flex and Rigid Flex
~240 people
Nanjangud, India
Volume PTH
~1.000 people
Manufacturing: 6 plants
Employees: 7.300
Turnover: 542 Mio EUR
Design: Austria and Germany
Sales: 16 offices worldwide
2 SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Agenda
3
Market and Direction
Europe and Vision
Standardization
Summary
Technology, Supply Chain
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Agenda
4
Market and Direction
Europe and Vision
Standardization
Summary
Technology, Supply Chain
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Embedded Die Package Unit Shipment by Application Area
0
1.000
2.000
3.000
4.000
5.000
6.000
7.000
2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020
Automotive 0 0 0 0 2 6 11 21 35 64 91
Medical 0,00 0,00 0,00 0,02 0,03 0,05 0,09 0,15 0,22 0,30 0,38
Consumer 6 16 19 60 92 164 281 478 752 1.108 1.469
Mobile - Wireless 25 75 95 278 431 798 1.410 2.116 2.952 3.898 4.582
Devic
e c
ount
(Munits)
Embedded die package unit shipment forecast Breakdown by application area (Munits)
Yole Developpement © October 2012
TOT 31 91 114 337 525 968 1 702 2 616 3 739 5 069 6 142
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Technology: Miniaturised Systems
Yesterday Today Tomorrow
6
Electronic component assemblies are moving to highly
integrated modules
Big challenges regarding design, technology, standardisation,
supply chain, business model …
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Embedded Component
ECP
Sense. Power. Connect.
Integrated Electronics Packaging solutions from AT&S
Applications focus
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Agenda
8
Market and Direction
Europe and Vision
Standardization
Summary
Technology, Supply Chain
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Europe
> 730 million people
> 200 languages (depending on your definition!)
47 countries
27 currencies
Incredible Industrial heritage
Leading Semiconductor
institutes and companies
Focus on Technology
Union + diversity
= Opportunity
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Data thanks to Wikipedia
HERMES
10
AT&S consortium leader
Images HERMES consortium
Largest EU funded project focussed on INDUSTRIALISATION
11 partners driving Embedded Component Packaging technology
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Vision!
11
We will improve mobility in all
segments by providing the best electronic
packaging solutions
„No Mobility without ECP“
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Agenda
12
Market and Direction
Europe and Vision
Standardization
Summary
Technology, Supply Chain
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
13
The Technology behind AT&S embedded component package
Embedded Component – What is it?
ECP® uses the space within a substrate for active and
passive components
Benefits of ECP = dramatic miniaturisation, performance
improvement and „ease-of-use“
Leveraging thirty years of PCB expertise with a dedication of
15 years R&D in the field of component embedding combined
with Production Readiness
#1 Position in the Market
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Supply chain
14
Incoming Wafer
Wafer Thinning
Chip Tape & Reel
Wafer Dicing
Cu-Bumping or RDL
SMT assembly
ECP® - Technology
Overmolding
Solderballing
Singulation and Packaging
Testing
Passives
Semicon or
foundry
Customer or
outsourced
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Turnkey Production Solutions
15
Mass Production running at AT&S and Nanium
Volume application in Ultra Mobile segment
Key attributes = Miniaturisation + Ease-of-Use
Run rate = 2M pieces per month
Full turnkey solution
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
16
Incoming Wafer
Wafer Thinning
Chip Tape & Reel
Wafer Dicing
Cu-Bumping or RDL
SMT assembly
ECP® - Technology
Overmolding
Solderballing
Singulation and Packaging
Testing
Passives
Turnkey Production Solutions
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Agenda
17
Market and Direction
Europe and Vision
Standardization
Summary
Technology, Supply Chain
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Standardization
18
AT&S is actively cooperating with partners throughout the Supply
Chain and together we drive Standardization and Readiness for
embedded component technology
Marketing and Technical agreements are in place with Industry
leaders
Design Automation is already available having been proactively
developed to satisfy the continuing trends of higher integration
and miniaturisation
ECP has already been selected as one of the technologies to
drive next generation products with „best-in-class“ performance
and form factor – focussed on Power, Sensor and Connectivity
applications
Cooperation and Partnership
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Example: Design automation
19
Release for mainline PCB-design platforms
Mentor Expedition – high-profile launch at
DAC 2012 in San Francisco
Cadence Allegro 16.5 (and above) with
direct support of PCB layout with
embedded components
BENEFITS – design automation,
integrated design rules, thermal modelling,
other simulation benefits
c Contact AT&S to line up information from
your system provider
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Agenda
20
Market and Direction
Europe and Vision
Standardization
Summary
Technology, Supply Chain
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Here in Europe we have world-leading Institutes, Semiconductor and
Component companies, Module makers and PCB/Substrate providers
The combination of our R&D, Engineering and Manufacturing expertise is
a globally respected strength
We work in Union, in cooperation, enjoying and not limited by lingual and
cultural diversity
Design, Technology standardization, supply chain and business model
are the core topics – European companies have solved these complex
issues!
AT&S and our Partners are accelerating, driving our assets, bringing
together cooperation throughout the Product and Supply Chain, and
rising to the Market-set challenges of extreme integration, supporting
rapid Product life cycling
It is my belief, that Europe is absolutely the best place in the world to
ramp this technology … looking forward!
21
The European Acceleration Factor
Summary
SEMI Networking Day | Packaging - Key for System Integration | Mark Beesley, AT&S
Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse13 | A-8700 Leoben
Tel +43 (0) 3842 200-0 | E-mail [email protected] www.ats.net
AT&S Company Presentation
Thank you for your attention!
Mark Beesley - COO Advanced Packaging, AT&S
3D Laminate Component Packaging
@ATS_ECP
e-mail [email protected]
cell +43 676 8955 5669
web www.ats.net
AT&S – Well Positioned for the Future
Many thanks for your attention
