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Electronic Nose Development
for
Various Applications
by
Dr. Ravishankar Dudhe
Ph.D (IIT Bombay)
What is an Electronic Nose?
An Electronic Nose is a system that uses the
pattern of responses from an array of gas
sensors to examine and identify a gaseous
sample.
Motivation
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Limitations with Dogs To achieve optimal performance, each dog requires an assigned handler, which increases costs because the canine detector is really a dog–handler team. Dogs also show behavioral variations and changing moods, which are difficult to monitor in a quantifiable way. When performing a search task, dogs become tired after 30–120 min, which suggests the need for two or more dogs at each location
Emerging Interdisciplinary Challenges
Olfactory Physiology
Organic
Chemistry Signal Processing
Pattern Recognition Computational Learning
Electronic
Nose
Chemical Sensors /
Analytical Chemistry
.
.
.
.
.
Motivation for Enose
Electronic Nose Systems
Poly Coated Sensor
Sensor Processor
Signal Processor
Pattern Recognition Knowledge
Base
Odorant Molecules
Identification
Raw electrical signal
Processed Electrical signal
Denoised Electrical signal
Training &
Testing
Chemical Information
Feature Extractor
Relevant features
Various Electronic Noses
Amplifying chromophore quenching
Fiber optics and beads
Polymeric thin films
Gold nanoclusters
SAW
MEMS
Polymer amplification mechanism.
(a) Traditional chemosensor. (b) Receptors wired in series. Green is the
emissive polymer, blue the quenched, and red is the analyte; h is the light
at the excitation wavelength, h´ at the emission wavelength [20].
The light emitted by the LED passes through a lens and a filter, allowing only a narrow-wavelength band of light centered at 430 nm to impinge on the polymer film, which is coated on two thin glass sheets.
A pump pulls in air samples across the coated glass sheets. If the air sample contains explosive vapors, the photomultiplier detector will sense a decrease in light intensity and trigger an alarm.
Figure: Schematic of sensor design.
OC14H29
C14H29O
n
Pentiptycene Polymer
ADB
ADB
+ MNT
ADB
+ TNT
MEMS
microelectromechanical
systems It is the integration of mechanical elements, sensors,
actuators, and electronics on a common silicon
substrate by microfabrication.
It is based on microfabricated nanomechanical
cantilever sensors.
The cantilevers are silicon beams, a few hundred
micrometers long and 1 µm thick.
Each cantilever sensor in an array is coated with a
different sensor layer.
MEMS Contd…
When the sensor is exposed to an analyte, the analyte molecules adsorb on the cantilever’s surface, which leads to interfacial stress between the sensor and adsorbing layer that bends the cantilever.
Each cantilever bends in a characteristic way typical for each analyte.
From the magnitude of the cantilever’s bending response function of time, a fingerprint pattern for each analyte can be obtained.
It showed detection sensitivities in the parts-per-billion range
During the sampling, the molecules of explosive vapor adsorb on the cantilever surface, which is heated to a high temperature by a piezoresistive track implanted in the cantilever. As the cantilever is heated, the adsorbed explosive molecules undergo combustion, producing a large and sudden deflection of the cantilever.
Resonance curves of the cantilever before and after
loading with TNT. With TNT loading, the resonance
frequency shifted to a lower value due to the increased
mass. After deflagration, the resonance frequency
returned to the original value [7].
Organic Field Effect
Transistor Fabrication
18
Fabrication of OFETs
RCA
• RCA1(organic impurity removal) • DI H2O + NH4OH @ 348k for 5min
• Add H2O2 & wait for bubbles
• Place wafer in sol. & heat for 6-8 min
• RCA2 (ionic impurity removal) • DI H2O + HCl
• Add H2O2 & wait for bubbles
• Place wafer in sol. & heat for 3-6 min
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Oxidation
• Temperature of chamber set to 1323k (1050C)
• Oxygen passed in inner tube for 1hr 20min
• SiO2 layer of 100nm thickness grown
n+ Si
SiO2
Oxidized Si wafer
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Lithography
• Dehydration at 393k for 10 min
• Rinse with N2(g)
• Spin PPR at 1500 rpm for 30 sec (2µm)
• Bake at 343k for 15 min
• UV exposure for 90 sec
• Place in 0.01% NaOH sol. To remove developed
PPR
• Dry with N2(g)
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PPR UV Light
MASK
n+ Si
SiO2
n+ Si
n+ Si
PPR
PPR
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Fig 4. Structure of shadow mask
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RF Sputtering
• 60sec Ti deposition (5nm)
• 90sec Au deposition (80nm)
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n+ Si
Ti/Au
SiO2
PPR
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Liftoff
Sonicate wafer in acetone in order
to remove unwanted Au and PPR
Removal of Back Si02 Clean back side of wafer with buffered HF
Ti/Au SiO2
n+ Si
Ti/Au SiO2
n+ Si
n+ Si
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Spinning of polymer
N+ Si
N+ Si
P type polymer Au/Ti
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Length : 30µm to 70 µm
Width : 17,050µm to
24,850µm
OFET device OFET device after
spinning
For Sensor Application
Basic Key requirements for any Sensor
Selectivity
(To avoid false positive)
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• Sensitivity
(To avoid false negative)
Array based approach to improve selectivity
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Sensitivity to a wider range of analytes.
Better selectivity.
Multi component analysis and
Analyte recognition—rather than mere detection.
Sensor arrays are more analogous to olfaction systems containing multiple receptors.
The main advantage of array sensors resides in the fact that there is no need to design chemical specificity.
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System for OFET Array Characterization
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OFET Characterization for P3HT/SXFA
composite TNT Vapor
RDX Vapor
DNB Vapor
TNT
Vapor
RDX
Vapor
DNB
Vapor
Water
Vapor
OFET Characterization for P3HT/SXFA
composite
11/18/2011 38
TNT
Vapor
RDX
Vapor
DNB
Vapor
Water
Vapor
%ION , %IOFF , %gm and % ratio all
parameters
For Application works
To use analyses of
freshness of
product
e.g. Beverage,
food
product
-Environment
monitoring :
e.g Aqueous sensor
Network
-Movable robot,
Bomb detector,
rescue robot
,etc…
Mobile Robot Noses
QUESTIONS??????