Electronic Costing & Technology Experts...• The FXTH87 is the 4th generation TPMS from Freescale. It features the smallest footprint with It features the smallest footprint with

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

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Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

January 2015 – Version 1 – Written by Romain Fraux

http://www.systemplus.fr/index.php?lang=ge&page=home.php

http://www.systemplus.fr/index.php?lang=ge&page=home.php

mailto:[email protected]

mailto:[email protected]

Freescale FXTH87 TPMS

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1. Overview / Introduction 4– Executive Summary– Reverse Costing Methodology

2. Company Profile 7– Freescale Semiconductor– FXTH87 Characteristics

3. Physical Analysis 13– Synthesis of the Physical Analysis– Physical Analysis Methodology– Package 15

– Package Views, Dimensions & Pin Out– Package Opening & Wire Bonding Process– Package Cross-Section

– ASIC 28– View, Dimensions & Marking– Delayering– Main Blocks Identification– Process Identification– Cross-Section – Process Characteristics

– MEMS Pressure Sensor 41– View, Dimensions & Marking– Sensing Area Details– Cross-Section– Process Characteristics

– MEMS Accelerometer 58– View, Dimensions & Marking– Bond Pad Opening & Bond Pad– Cap Removed & Cap Details– Sensing Area Details– Cross-Section– Process Characteristics

4. Physical Comparison with Infineon SP37 88

5. Manufacturing Process Flow 91– Global Overview– ASIC Front-End Process– ASIC Wafer Fabrication Unit– MEMS Pressure Sensor Process Flow– MEMS Accelerometer Process Flow– MEMS Wafer Fabrication Unit– Packaging Process Flow & Assembly Unit

6. Cost Analysis 113– Synthesis of the cost analysis– Main steps of economic analysis– Yields Hypotheses– ASIC 118

– ASIC Front-End Cost– ASIC Probe Test & Dicing Cost– ASIC Wafer & Die Cost

– MEMS Pressure Sensor 124– MEMS Pressure Sensor Front-End Cost– MEMS Pressure Sensor Cost per process steps– MEMS Pressure Sensor Probe Test & Dicing Cost– MEMS Pressure Sensor Wafer & Die Cost

– MEMS Accelerometer 131– MEMS Accelerometer Front-End Cost– MEMS Accelerometer Cost per process steps– MEMS Accelerometer Probe Test & Dicing Cost– MEMS Accelerometer Wafer & Die Cost

– Back-End : Final Test & Calibration Cost– FXTH87 Component Cost

7. Estimated Price Analysis 147– Manufacturer Financial Ratios– Estimated Selling Price

8. Cost Comparison with Infineon SP37 152


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• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of the Freescale FXTH87 Tire Pressure Monitoring Sensor

(TPMS).

• The FXTH87 is the 4th generation TPMS from Freescale. It features the smallest footprint with

7x7mm², the smallest RF power consumption with 7mA Idd and the largest customer memory size

with 8kB flash.

• This system in package includes a dual-axis accelerometer (XZ), pressure and temperature sensors,

an integrated MCU, a RF transmitter and a low frequency receiver.

It is 40% smaller than Freescale’s previous-generation QFN 9x9mm package and 50% smaller

than Infineon SP37 TPMS solution.

• The pressure sensor is based on Freescale’s MEMS capacitive pressure cell without signal

conditioning. The accelerometer included in the FXTH87 can be a single axis (Z) or a dual axis (XZ)

and is manufactured with Freescale’s surface micromachining poly-Si MEMS process.

• Assembled in a Film-Assisted Molding (FAM) 7x7mm QFN package with gel fill, the FXTH87 is

certified AEC-Q100 and qualified for operating temperature range from -40°C to +125°C.

• The report is including a detailed technical and cost comparison with Infineon SP37 TPMS.


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The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price


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• Package: Film-Assisted Molding QFN 24-pin

• Dimensions: 7.0 x 7.0 x 2.2mm

• Pin Pitch: 1mm

Package top view Package bottom view

Package Side View

7.0mm

2.2mm

7.0mm

• Marking: <logo Freescale>

F874C11

XABLA


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• The die marking includes the logo of Freescale and:

N60J

2013

ARAMISTOP

ASIC Die Marking


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N63J

2013

47r - 87

MEMS Die Marking


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N84A

2010

MEMS Die Marking


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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

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Electronic Costing & Technology Experts...• The FXTH87 is the 4th generation TPMS from Freescale. It features the smallest footprint with It features the smallest footprint with