JU Electronic Components and Systems for European Leadership (ECSEL)

Johann Massoner Infineon Technologies Austria AG

Electronics everywhere and indispensible

Page 2 10.6.2013 Copyright © Infineon Technologies AG 2013. All rights reserved.

… It's a strategy with a very clear goal. To reverse the declining market share of the European semiconductor industry. To double our chip production by 2020, to around one fifth of the global total, overtaking the United States. …

… In short, there are three goals: to make chips faster, smarter, and cheaper. We need to do all three …

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Neelie Kroes

Vice-President of the European Commission responsible for the Digital Agenda

Speech on May 29. 2013 in Brussels

Speech: Electronics for Europe: faster, smarter, cheaper

ECSEL - JU Electronic Components and Systems for European Leadership

The scope of work for the ECSEL Joint Undertaking should include the following main areas:

―design technologies, process and integration, equipment, materials and manufacturing for micro- and nanoelectronics while targeting miniaturisation, diversification and differentiation, heterogeneous integration;

―processes, methods, tools and platforms, reference designs and architectures, for software and/or control-intensive embedded/cyber-physical systems, addressing seamless connectivity and interoperability, functional safety, high availability, and security for professional and consumer type applications, and connected services;

―multi-disciplinary approaches for smart systems, supported by developments in holistic design and advanced manufacturing to realise self-reliant and adaptable smart systems having sophisticated interfaces and offering complex functionalities based on e.g. the seamless integration of sensing, actuating, processing, energy provision and networking.

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Proposal for a COUNCIL REGULATION on the ECSEL Joint Undertaking - 5/2013

ENIAC

ARTEMIS

EPOSS

Joint Undertaking - research, collaboration and pilot activities on European level

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EU e.g.electronics strategy

KET’s e.g. µ-n-Electronics

Manufacturing Pilot Activities

Public Autorities (National)

ECSEL JU Electronic Components and

Systems for European Leadership

AENEAS µ-n-Electronics

Industry

ARTEMISIA Systems SW Industry

TP - EPOSS Systems HW Industry

PRELIMINARY - as known to date 6/2013

Pilot activities: Important step to strengthen European semiconductor manufacturing

Page 6 April 25, 2013 Copyright © Infineon Technologies AG 2013. All rights reserved.

+

Semiconductor manufacturing is among the most capital intense industry segments

Infineon is a globally acting enterprise and is facing regional funding behaviours (Asia, US…) which mostly lead to competitive disadvantage of European companies

The ENIAC project EPT300 researches basic capabilities to produce power technologies based on

300mm wafers along the full value chain

The ENAIC project EPPL will establish a realistic environment to develop and manufacture world

leading technologies for advanced power devices based on large 300mm silicon wafers.

EPT300 EPPL# of partners in the consortia 23 32

# of applications 2 4

Total Person Months 3445 5580

Total eligible Cost ~43'0 € ~74' €

Total funding, all partners ~16'2 € ~23'7 €