Upload
others
View
1
Download
0
Embed Size (px)
Citation preview
JAXA MEWS23 JAXA 23rd Microelectronics Workshop
Electroless Ni/Pd/Au Plating Electroless Ni/Pd/Au Plating ect o ess / d/ u at gfor High Reliable Gold Wire Bonding with Electronic Devices for Space Applications
ect o ess / d/ u at gfor High Reliable Gold Wire Bonding with Electronic Devices for Space Applications p ppp pp
(1) Au Plating Combinations and Reliability(2) Au Grain Size and Crystal Growth(2) Au Grain Size and Crystal Growth(3) Diffusion of Under-plated Metal onto Au surface(4) Wire Bonding Reliability Ranking of Au Plating
Yukihisa Hiroyama
(4) Wire Bonding Reliability Ranking of Au Plating
Hitachi Chemical Co., Ltd.
JAXA MEWS23 11
Structure of BGA AssemblyStructure of BGA Assembly
Gold WireDie Bonding
MaterialSemiconductor
Chip
Molding
Gold Wire Chip
WireWire MoldingMaterial
P k S b t t
WireWireBondingBonding
Solder Ball
Solder Solder JointJoint
Package Substrate
BallPrinted Circuit Board
JointJoint
JAXA MEWS23 Wire BondingWire Bonding
22Wire BondingWire Bonding
Gold WireAluminum ElectrodeCopper
Line
LSILine Resist
LSI
Die Bonding Material G ld Pl t dDie Bonding Material Gold PlatedTerminalPackage Substrate
JAXA MEWS23
Solder Ball JointSolder Ball Joint33
Solder Ball JointSolder Ball Joint
Package SubstrateCopper Pad Package SubstrateCopper Pad
Solder Ball Gold Plated Terminal
Solder BallResist
JAXA MEWS23 44
Characterization of Gold PlatingCharacterization of Gold PlatingE’less Ni/Au(ENIGEG)(5/0 5µm)
E’lyticNi/Au(5/0 5µm)
ItemE’less Ni/Pd/Au(ENEPIGEG)(5/0 5/0 5µm)
Wire Bondability OK OK OK(5/0.5µm)(5/0.5µm) (5/0.5/0.5µm)
Wire Bondabilityafter Aging*Wi B d bilit
OK NG OKWire Bondabilityafter Aging*and Plasma**
OK OK OK
Solder Joint Reliability OK NG OK
* Aging : 150ºC, 50 hours ** Plasma : O2 plasma
JAXA MEWS23
G ld Pl i C bi i i hG ld Pl i C bi i i h55
Gold Plating Combination withE’less and E’lytic Processes
Gold Plating Combination withE’less and E’lytic Processesyy
Gold Plating Process Thickness (µm)ENEPIGEG (Ni/Pd/Au)ENEPIG (Ni/Pd/IG)
5/0.5/0.55/0.5/0.05
Gold Plating Process Thickness (µm)
ENEPIG (Ni/Pd/IG)ENIGEG (Ni/Au)Ni(SB-Watt)/E’lytic Au
5/0.5 5/0.5
Ni(B-Watt)/E’lytic Au Ni(B-Sulf)/E’lytic AuNi(SB Watt)/IGEG
5/0.5 5/0.5 5/0 5Ni(SB-Watt)/IGEG
EN/E’lytic AuCu/E’lytic Au
5/0.5 5/0.5 0.5 Cu/ yt c u
JAXA MEWS23 66
Wire Bonding Reliabilityof Gold Plating Combinations
Wire Bonding Reliabilityof Gold Plating Combinations
14
of Gold Plating Combinationsof Gold Plating Combinations
10
12
th (g
f)
As Gold PlatingHeat Treatment
6
8
l Str
engt Heat-Treatment
(150oC, 3h)
2
4
Pull
0
EPIG
EGPd
/Au)
NEP
IGPd
/IG)
NIG
EGN
i/Au)
B-W
att)
ic A
u
B-W
att)
ytic
Au
B-S
ulf.)
ytic
Au
B-W
att)
G ytic
Au
ytic
Au
ENE
(Ni/P EN (Ni/ EN (N
Ni(S
B/E
’lyt
Ni( B
/E’ly
Ni(B
/E’ly
Ni(S
B/IG
EG
EN/E
'ly
Cu/
E'ly
JAXA MEWS23
Surface Morphology andSurface Morphology and77
Surface Morphology andFIB/SIM Cross Section
Surface Morphology andFIB/SIM Cross Section
ENIGEG (Ni/Au)ENEPIG (Ni/Pd/IG)ENEPIGEG (Ni/Pd/Au)
rfac
eho
logy
Sur
Mor
phM tio
n AuAu AuAuPdPdAuAu
FIB
/SIM
oss
Sect PdPd
PdPd
Cro NiNi NiNiNiNi 1 µm1 µm 1 µm1 µm1 µm1 µm
JAXA MEWS23
Surface Morphology andSurface Morphology and88
Surface Morphology andFIB/SIM Cross Section
Surface Morphology andFIB/SIM Cross Section
Ni(B-Sulf.)/AuNi(B-Watt)/AuNi(SB-Watt)/Au
rfac
eho
logy
Sur
Mor
phM tio
n AuAu AuAuAuAu
FIB
/SIM
oss
Sect
Cro NiNi NiNiNiNi 1 µm1 µm 1 µ m1 µ m1 µm1 µm
JAXA MEWS23
Surface Morphology andSurface Morphology and99
Surface Morphology andFIB/SIM Cross Section
Surface Morphology andFIB/SIM Cross Section
Cu/E’lytic AuEN/E’lytic AuNi(SB-Watt)/IGEG
rfac
eho
logy
Sur
Mor
phM tio
n
AuAuAuAuAuAu
FIB
/SIM
oss
Sect
Cro NiNi CuCuNiNi 1 µm1 µm 1 µm1 µm1 µm1 µm
JAXA MEWS23 1010
EBSP Mapping of GoldEBSP Mapping of GoldENIGEG(Ni/Au)
ENEPIGEG(Ni/Pd/Au) Ni(B-Watt)/E’lytic AuNi(SB-Watt)/E’lytic Au
0.18 m2※
0.06 m2※ 0 03 m2※ 0.03 m2※
Cu/E’lytic AuNi(SB-Watt)/IGEG EN/E’lytic AuNi(B-Sulf.)/E’lytic Au
0.06 m 0.03 m2※ 0.03 m
111 0 50 35 2※2※001 101
0.5 m0.23 m2※ 0.35 m2※0.03 m2※
0.03 m2※
※ : Average cross-sectional area of gold grain
EBSP: Electron Back Scattering Pattern
JAXA MEWS23 EBSP MappingEBSP Mapping
1111EBSP Mapping
Ni(SB-Watt)/IGEGEBSP Mapping
Ni(SB-Watt)/IGEGNi AuAu
Au
NiNi
Cu
CuCu 1 m
All Au Ni Cu EDXAll Au Ni CuEnergy Dispersion X-ray Spectrometry
E’lytic Ni(SB-Watt)/IGEGEBSP: Electron Back Scattering Profile
EDX
JAXA MEWS23
EBSP MappingEBSP Mapping1212
EBSP MappingENEPIGEG (Ni/Pd/Au)
EBSP MappingENEPIGEG (Ni/Pd/Au)
Electroless Ni/Electroless Pd/ Immersion Au/Electroless Au
Pd AuAu
AuPdPd
0.5 m
All Au Pd EDXEnergy Dispersion X-ray Spectrometry
ENEPIGEGEBSP: Electron Back Scattering Profile
JAXA MEWS23 1313
EBSP MappingCu/E’lytic Au
EBSP MappingCu/E’lytic AuCu/E lytic AuCu/E lytic Au
Copper/Electrolytic Au
CuA
Copper/Electrolytic Au
Au
Au
Au
CuCu 0.5 m
Au
All Au CuEnergy Dispersion X ray Spectrometry
Cu/E’lytic Au
EDX
X-ray SpectrometryEBSP: Electron Back Scattering Profile
JAXA MEWS23
Thermal Diffusion BehaviorThermal Diffusion Behavior1414
Thermal Diffusion Behaviorof Under-plated Metal
Thermal Diffusion Behaviorof Under-plated Metal
By XPS Analysis(X-ray Photoelectron Spectrometry)
Gold PlatingProcess Cu PdNi Cu PdNiCu PdNi
3 hours 25 hours 50 hours
ENEPIGEG (Ni/Pd/Au)
ENEPIG (Ni/Pd/IG)
ENIGEG (Ni/Au)
---
-1.5-
--
5.8
---
-3.0-
--
12.2
---
-1.0-
--
2.6ENIGEG (Ni/Au)
Ni(SB-Watt)/Au Ni(B-Watt)/Au Ni(B S lf)/A
---
--
5.83.45.3
--
--
12.25.4
11.9--
--
2.61.83.8
Ni(B-Sulf)/AuNi(SB-Watt)/IGEGEN/E’lytic Au
---
---
5.72.37.4
---
---
11.64.1
11.8
---
---
5.01.66.1y
Cu/E’lytic Au 14.5 -- 15.7 --14.2 --Heat Treatment: 150ºCHeat Treatment: 150ºCAtomic%Atomic%Atomic%Atomic%
JAXA MEWS23
Nickel DistributionNickel Distribution1515
Nickel Distribution over Gold Plating Surface
Nickel Distribution over Gold Plating Surface
By AES Analysis(Auger Electron Spectrometry)
ENIGEG (Electroless Ni/Au) : 5µm/0.5µm Heat Treatment: 150ºC, 50hHeat Treatment: 150ºC, 50h
Ni
Au
JAXA MEWS23
G i B d Diff i dG i B d Diff i d1616
Grain Boundary Diffusion andBulk Diffusion (Interdiffusion)Grain Boundary Diffusion andBulk Diffusion (Interdiffusion)( )( )
Contamination on Gold Surface
GoldGold Grain
Gold
Grain BoundaryGrain BoundaryGrain BoundaryGrain Boundary
Grain BoundaryGrain BoundaryDiffusionDiffusion
Bulk DiffusionBulk Diffusion(Interdiffusion)(Interdiffusion)
Under Plated MetalUnder PlatedMetal Grain
(Interdiffusion)(Interdiffusion)
JAXA MEWS23
Model of Grain Structure andModel of Grain Structure and1717
Model of Grain Structure and Diffusion on ENEPIGEG
Model of Grain Structure and Diffusion on ENEPIGEG
IGEG
ENEPIGEG
IGEGIGEG
ENEPIGEG(Electroless Ni/Pd/Au)
IGEGIGEG
EPEP EP
ENEN ENFIB/SIM Analytical Result
Grain Boundary DiffusionGrain Boundary Diffusion
FIB/SIM Analytical Result
JAXA MEWS23 1818
Model of Grain Structure andModel of Grain Structure andModel of Grain Structure and Diffusion on Ni(SB-Watt)/AuModel of Grain Structure and Diffusion on Ni(SB-Watt)/Au
E’lytic Au or IGEGE’lytic AuE’lytic Au NiO
Ni(SB-Watt)Ni(SB-Watt)IGEG (E’less Au)IGEG (E’less Au)
Ni(SB W tt)
Ni(SB-Watt)Ni(SB-Watt)
Ni(SB-Watt)
( )( )
Grain Boundary DiffusionGrain Boundary DiffusionFIB/SIM Analytical Result
JAXA MEWS23
Model of Grain Structure andModel of Grain Structure and1919
Model of Grain Structure and Diffusion on B-Ni/Au and EN/Au
Model of Grain Structure and Diffusion on B-Ni/Au and EN/Au
IGEGIGEGIGEG or E’lytic AuNiOE’less Ni/AuE’less Ni/Au
ENEN
ENENE’lytic AuE’lytic AuENEN
E’lytic AuE’lytic Au Bright Ni and EN
Ni(B-Watt)Ni(B-Watt) E’lytic Bright Ni Plating
Grain Boundary DiffusionGrain Boundary Diffusion
(1) Bright Watt(2) Bright SulfamateFIB/SIM Analytical Result
JAXA MEWS23
Model of Grain Structure andModel of Grain Structure and2020
Model of Grain Structure and Diffusion on ENEPIG
Model of Grain Structure and Diffusion on ENEPIG
PdIG
OrganicContaminationENEPIG
Pd
IGIG
(Electroless Ni/Pd/IG)
EPEPEPIGIG
ENENEN
FIB/SIM Analytical ResultFIB/SIM Analytical Result
Grain Boundary DiffusionGrain Boundary Diffusion
JAXA MEWS23
Model of Grain Structure andModel of Grain Structure and2121
Model of Grain Structure and Diffusion on Cu/E’lytic Au
Model of Grain Structure and Diffusion on Cu/E’lytic Au
E’lytic AuCuO (Bulk)CuO (Grain boundary)
E’lytic AuE’lytic Au
CuCuCuCu
Interdiffusion (Bulk Diffusion)Grain Boundary DiffusionInterdiffusion (Bulk Diffusion)Grain Boundary Diffusion
FIB/SIM Analytical Result
JAXA MEWS23
Estimated Ranking ofEstimated Ranking of2222
Estimated Ranking ofWire Bonding Reliability
Estimated Ranking ofWire Bonding Reliability
ENEPIGEG, Ni(SB-Watt)/IGEGGood
ng y
and Ni(SB-Watt)/E’lytic Au
Bon
din
abili
ty
ENEPIG, Ni(B-Watt)/E’lytic AuAnd Ni(B-Sulf.)/E’lytic Au
Wire
BR
elia And Ni(B Sulf.)/E lytic Au
ENIGEG, EN/E’lytic Au
W
Poor Cu/E’lytic Au
JAXA MEWS23
SS2323
SummarySummary(1) Th li bilit f ENEPIGEG (E’l(1) The reliability of ENEPIGEG (E’less
Ni/Pd/Au) and E’lytic Ni (SB-Watt)/IGEGi l t t th t f E’l ti Ni (SBwas equivalent to that of E’lytic Ni (SB-
Watt)/E’lytic Au after the heat treatment.(2) Th li bilit d d d th diff i(2) The reliability depended on the diffusion
behavior of the under-plated metals andth i i f th ld d itthe grain size of the gold deposit.
(3) The grain size of Au plating coordinatedith th i i f th d l t dwith the grain size of the under-plated
metals as the epitaxial crystal growth.